Water cooler heat storage
By introducing an energy transfer device into the cooling system, the heat of the cooling fluid is transferred to a third fluid to heat the building equipment, solving the problem of unused heat, improving system efficiency, and reducing energy consumption.
Patent Information
- Application Number
- CN202510649355.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-05-21
- Filing Date
- 2025-05-20
- Publication Date
- 2025-11-21
AI Technical Summary
In existing cooling systems, the emitted heat is not effectively utilized, resulting in low system efficiency.
An energy transfer device is installed at the condenser, using phase change materials or heat exchangers to transfer the heat of the cooling fluid to a third fluid for heating equipment in the building, such as water heaters, thus reducing reliance on external cooling towers.
It improves the overall efficiency of the cooler system, reduces heat emissions to the external cooling tower, and lowers energy consumption and operating costs.
Smart Images
Figure CN120991490A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Exemplary embodiments of the present disclosure relate to the field of condensers, and more particularly, to a water chiller system having various means for removing heat from the water of the water chiller system. BACKGROUND
[0002] Chiller refrigeration systems are known and include a heat exchanger in which refrigerant of the system is cooled and condensed by an external water flow. The heat removed from the refrigerant by the external water flow is then discharged at a cooling tower or dumped outside the system. The use of this heat by such systems is inefficient. Accordingly, it is desirable to re-use the heat removed at the condenser to increase the overall efficiency of the system. SUMMARY
[0003] According to an embodiment, a chiller system includes a compressor, a condenser, an expansion device, and an evaporator operably coupled to form a closed fluid circuit having a fluid circulating therethrough. A flow of cooling fluid is arranged in heat transfer relationship with the fluid at the condenser. An energy transfer device is located downstream of the condenser with respect to the flow of cooling fluid. The energy transfer device is arranged in fluid communication with a third fluid, and at least a portion of the heat from the fluid is transferred to the third fluid at the energy transfer device.
[0004] In addition to one or more of the features described above, or as an alternative. the energy transfer device is a thermal storage device containing a phase change material.
[0005] In addition to one or more of the features described above, or as an alternative to any of the preceding embodiments, the phase change material is selected from ice, wax, and salt.
[0006] In addition to one or more of the features described above, or as an alternative to any of the preceding embodiments, the energy transfer device is a heat exchanger, and the cooling fluid and the third fluid are arranged in heat transfer relationship at the heat exchanger.
[0007] In addition to one or more of the features described above, or as an alternative to any of the preceding embodiments, the bypass conduit is arranged in parallel with the energy transfer device.
[0008] In addition to one or more of the features described above, or as an alternative to any of the preceding embodiments.
[0009] In addition to one or more of the features described above, or as an alternative to any of the preceding embodiments, the valve is operable to control the flow of cooling fluid through the bypass conduit to achieve a desired temperature downstream of the energy transfer device.
[0010] In addition to one or more of the features described above, or as an alternative. the condenser and the energy transfer device are part of a second closed circuit, the cooling fluid is configured to circulate through the second closed circuit.
[0011] In addition to one or more of the features described above, or as an alternative. the pump is provided for moving the cooling fluid through the second closed circuit.
[0012] In addition to one or more of the features described above, or as an alternative. the cooling tower contains the cooling fluid. The cooling tower is arranged in fluid communication with the condenser and a fan operable to move another fluid across the cooling tower to remove heat from the cooling fluid.
[0013] In addition to one or more of the features described above, or as an alternative. the means for further heating the third fluid is arranged at a position downstream of the outlet of the energy transfer device.
[0014] In addition to one or more of the features described above, or as an alternative. the third fluid is water, and the downstream means is a water heater.
[0015] In addition to one or more of the features described above, or as an alternative. the chiller system is a water-cooled chiller system.
[0016] According to an embodiment, a method of operating a chiller system includes circulating a fluid through a closed circuit including a compressor, a condenser, an expansion device, and an evaporator, removing heat from the fluid within the closed circuit via a cooling fluid, and transferring at least a portion of the heat removed from the fluid to a third fluid at an energy transfer device.
[0017] In addition to one or more of the features described above, or as an alternative. the condenser and the energy transfer device are part of a second closed circuit, the cooling fluid is configured to circulate through the second closed circuit. The cooling fluid provided at the outlet of the energy transfer device is returned to the condenser.
[0018] In addition to one or more of the features described above, or as an alternative. the cooling fluid provided at the outlet of the energy transfer device is cooled prior to being returned to the condenser.
[0019] In addition to one or more of the features described above, or as an alternative. the cooling fluid provided at the outlet of the energy transfer device includes moving an external gas across the cooling fluid via at least one fan at the cooling tower to remove heat from the cooling fluid.
[0020] In addition to one or more of the features described above, or as an alternative. the third fluid is further heated to a required temperature at the component.
[0021] In addition to one or more of the features described above, or as an alternative. the component is located downstream of the outlet of the energy transfer device.
[0022] In addition to one or more of the features described above, or as an alternative. the cooler system is a water-cooled cooler system. BRIEF DESCRIPTION OF DRAWINGS
[0023] The following description should not be considered limiting in any way. Referring to the drawings, like elements are numbered alike:
[0024] Figure 1 is a schematic diagram of an existing water-cooled cooler system;
[0025] Figure 2 is a schematic diagram of a water-cooled cooler system including an energy transfer device according to an embodiment; and
[0026] Figure 3 is a schematic diagram of a water-cooled cooler system including an energy transfer device according to another embodiment. DETAILED DESCRIPTION
[0027] With reference to the drawings, a detailed description of one or more embodiments of the disclosed apparatus and methods is presented herein by way of exemplification and not limitation.
[0028] Reference will now be made to Figure 1, providing an example of an existing vapor compression system 20, and more particularly, a chiller system having a closed fluid circuit within which a refrigerant R or other fluid circulates. As shown, the vapor compression system 20 includes a compressor 22 having a suction port (inlet) 24 and a discharge port (outlet) 26. The vapor compression system 20 also includes a first heat rejecting heat exchanger 28, such as a condenser. The vapor compression system 20 additionally includes a second heat absorbing heat exchanger 30, such as an evaporator, located downstream of the heat rejecting heat exchanger 28. Further, an expansion device 32 is located along the fluid flow path downstream of the compressor 22 and upstream of the evaporator heat absorbing heat exchanger. As shown, the expansion device 32 can be located at a location along the fluid circuit between the heat rejecting heat exchanger 28 and the heat absorbing heat exchanger 30.
[0029] At the heat rejecting heat exchanger 28, the refrigerant is arranged in thermal or heat transfer relationship with a cooling fluid W. In the non-limiting embodiment shown, the cooling fluid W is water. Thus, the heat rejecting heat exchanger 28 can be a refrigerant-water heat exchanger, in which the refrigerant is cooled by an external water flow. In such embodiments, Figure 1 The vapor compression system of
[0030] Referring now to Figure 2 and Figure 3 The heat removed from the vapor compression system 20 by the flow of cooling fluid W can be reused via an energy transfer device, as will be described in greater detail below. In Figure 2In the illustrated embodiment, the energy transfer device includes at least one thermal storage device 50 disposed along the closed loop defining the flow path of the cooling fluid W. While only a single thermal storage device 50 is illustrated and described herein, it should be recognized that in other embodiments, the vapor compression system 20 can include multiple thermal storage devices arranged in parallel or in series with respect to the flow of the cooling fluid W. In the illustrated non-limiting embodiment, the thermal storage device 50 is arranged downstream of the heat rejection heat exchanger 28 and upstream of the cooling tower 36, such as, for example, directly downstream of the heat rejection heat exchanger 28. However, embodiments are also contemplated herein in which the thermal storage device 50 is arranged at another location within the closed loop defining the flow path of the cooling fluid W.
[0031] In embodiments, the thermal storage device 50 is filled with a phase change material P, such as, for example, a wax, a salt, or water. However, any suitable phase change material P is contemplated herein. The phase change material P within the thermal storage device 50 can function as a heat sink. As previously noted, the cooling fluid W output from the heat rejection heat exchanger 28 is hot. In operation, all or at least a portion of the cooling fluid W from the outlet of the heat rejection heat exchanger 28 is provided to the thermal storage device 50. The cooling fluid W can be configured to pass over or flow across the thermal storage device 50, or alternatively, or in addition, can flow through one or more channels extending through the body of the phase change material P within the thermal storage device 50. In embodiments in which the phase change material P is a cold material, heat from the cooling fluid W is transferred to the phase change material. Over time, this heat can, but does not necessarily, cause the phase change material P to phase change, such as, for example, from a solid to a liquid, or from a liquid to a gas. As a result of this heat absorption, the cooling fluid W provided at the outlet 54 of the thermal storage device 50 is cooler than the cooling fluid W provided at the inlet 52 of the thermal storage device 50. The at least partially cooled cooling fluid W can then be provided to the cooling tower 36, where additional heat can be removed from the cooling fluid W, such as, for example, via the external air flow driven by the fan 40. The cooled cooling fluid W is then returned to the heat rejection heat exchanger for repeated cycling.
[0032] As illustrated, a bypass conduit 60 can extend from a location upstream of the inlet 52 of the thermal storage device 50 to a location downstream of the outlet 54 of the thermal storage device 50. A valve V can be arranged within the bypass conduit 60 to control flow therethrough. Rather than all of the cooling fluid being provided to the thermal storage device 50, a portion of the cooling fluid W can be allowed to flow through the bypass conduit 60 to achieve a warmer temperature downstream of the thermal storage device 50.
[0033] As shown, a third fluid C can be disposed in thermal communication with the thermal storage device 50. In embodiments, the third fluid C is another fluid associated with the building that is conditioned by the vapor compression system 20. For example, the third fluid C can be a flow of water that is provided from a water source and delivered to a downstream component 70, such as a water heater or boiler. However, it should be appreciated that any suitable third fluid that is typically heated prior to delivery to a load of the building is also within the scope of the present disclosure.
[0034] As shown, the third fluid C delivered to the thermal storage device 50 can be disposed in heat transfer relationship with the phase change material P at the thermal storage device 50. More specifically, the third fluid C is operable as a heat sink and removes heat from the phase change material P. Accordingly, the flow of the third fluid C output from the thermal storage device 50 is heated relative to the flow of the third fluid C provided to the thermal storage device 50. The heated third fluid C can be provided from the thermal storage device 50 to a downstream water heater, shown schematically at 70, prior to delivery to a load of the building. The temperature of the third fluid C provided from the thermal storage device 50 to the water heater 70 is warmer compared to if the third fluid C was provided directly from a water source to the water heater 70. Accordingly, when the third fluid is at least partially preheated via the thermal storage device 50, less heat and energy is required to heat the third fluid C to a required temperature at the water heater 70.
[0035] Reference is now made to Figure 3 In other embodiments, the energy transfer device includes a heat exchanger 80 disposed along the closed loop defining the flow path of the cooling fluid W such that the cooling fluid W can be cooled at the heat exchanger 80. In the illustrated non-limiting embodiment, the heat exchanger 80 is disposed downstream of the heat rejection heat exchanger 28 and upstream of the cooling tower 36, such as, for example, directly downstream of the heat rejection heat exchanger 28. However, embodiments are also contemplated herein in which the heat exchanger 80 is disposed at another location within the closed loop defining the flow path of the water. Moreover, it should be appreciated that heat exchangers having any suitable configuration are contemplated herein.
[0036] Similar to the previous embodiments, the bypass conduit 60 can extend from a location upstream of the inlet 82 of the heat exchanger 80 to a location downstream of the outlet 84 of the heat exchanger 80. A valve V can be disposed within the bypass conduit 60 to control the flow therethrough. Similar to if all of the cooling fluid W was provided to the heat exchanger 80, a portion of the flow of the cooling fluid W can be allowed to flow through the bypass conduit 60 to achieve a warmer temperature downstream of the heat exchanger 80.
[0037] The cooling fluid W is arranged in a thermally heat transfer relationship with a third fluid C at a heat exchanger 80. As previously described, the third fluid C can be another fluid associated with the building being conditioned by the vapor compression system 20, such as for example water. The heat exchanger 80 can be located downstream of a source of the third fluid C and upstream of a component that is operable to heat the third fluid C prior to delivery to a load of the building.
[0038] All or at least a portion of the heat removed from the refrigerant at the heat rejection heat exchanger 28 is provided to a first flow path of the heat exchanger 80 via a first inlet 82. At the same time, a flow of the third fluid C is provided to a second flow path of the heat exchanger 80 via a second inlet 86. As the two fluids W, C move through the heat exchanger 80, the third fluid C acts as a heat sink and absorbs heat from the cooling fluid W. As a result, the cooling fluid W provided at a first outlet 84 of the heat exchanger 80 is cooler than the cooling fluid provided to the first inlet 82 of the heat exchanger 80. The at least partially cooled cooling fluid W can then be provided to the cooling tower 36, where additional heat can be removed from the at least partially cooled cooling fluid W, such as for example via an external air flow driven by the fan 40. The cooled cooling fluid W is then returned to the heat rejection heat exchanger for repeated circulation.
[0039] The third fluid C provided at a second outlet 88 of the heat exchanger 80 is warmer than the third fluid C provided at the second inlet 86 of the heat exchanger 80. This heated third fluid C can be provided to a downstream water heater 70, shown schematically at 70. The temperature of the third fluid C provided from the heat exchanger 80 to the water heater 70 is warmer than if the third fluid C were provided directly from a water source to the water heater 70. As a result, when the third fluid is at least partially preheated via the heat exchanger 80, the heat and energy required to heat the third fluid C to a required temperature at the water heater 70 is reduced.
[0040] Redirecting heat removed from the refrigerant at the heat rejection heat exchanger to heat another fluid reduces the total energy associated with heating the fluid and thus reduces costs.
[0041] The term "about" is intended to encompass amounts that can vary from the stated value by an acceptable degree of error for the quantity measured by the equipment available at the time of filing the application.
[0042] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.
[0043] While the present disclosure has been described with reference to one or more exemplary embodiments, those skilled in the art will understand that various changes can be made and equivalents can be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications can be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the central scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.
Claims
1. A chiller system comprising: a compressor, a condenser, an expansion device, and an evaporator operably coupled to form a closed fluid circuit having a fluid circulating therethrough; a flow of cooling fluid arranged in heat transfer relationship with the fluid at the condenser; and an energy transfer device downstream of the condenser with respect to the flow of cooling fluid, the energy transfer device arranged in fluid communication with a third fluid, wherein at least a portion of the heat from the fluid is transferred to the third fluid at the energy transfer device.
2. The chiller system of claim 1, wherein, The energy transfer device is a thermal storage device comprising a phase change material.
3. The chiller system of claim 2, wherein, The phase change material is selected from ice, wax, and salt.
4. The chiller system of claim 1, wherein, The energy transfer device is a heat exchanger at which the cooling fluid and the third fluid are arranged in heat transfer relationship.
5. The chiller system of any of claims 1-4, further comprising a bypass conduit arranged in parallel with the energy transfer device.
6. The chiller system of claim 5, further comprising a valve operable to control the flow of the cooling fluid through the bypass conduit to achieve a desired temperature downstream of the energy transfer device.
7. The chiller system of any of claims 1-6, wherein, The condenser and the energy transfer device are part of a second closed circuit, the cooling fluid configured to circulate through the second closed circuit.
8. The chiller system of claim 7, further comprising a pump for moving the cooling fluid through the second closed circuit.
9. The chiller system of any of claims 1-8, further comprising a cooling tower containing the cooling fluid, the cooling tower arranged in fluid communication with the condenser and a fan operable to move another fluid across the cooling tower to remove heat from the cooling fluid.
10. The chiller system of any of claims 1-9, further comprising a means for further heating the third fluid, the means arranged at a location downstream of an outlet of the energy transfer device.
11. The chiller system of any of claims 1-10, wherein, The third fluid is water and the downstream means is a water heater.
12. The chiller system of any of claims 1-11, wherein, The chiller system is a water-cooled chiller system.
13. A method of operating a chiller system comprising: circulating a fluid through a closed circuit comprising a compressor, a condenser, an expansion device, and an evaporator; removing heat from the fluid within the closed circuit via a cooling fluid; and transferring at least a portion of the heat removed from the fluid to a third fluid at an energy transfer device.
14. The method of claim 13, wherein, The condenser and the energy transfer device are part of a second closed circuit, the cooling fluid configured to circulate through the second closed circuit, the method further comprising returning the cooling fluid provided at an outlet of the energy transfer device to the condenser.
15. The method of claim 14, further comprising further cooling the cooling fluid provided at the outlet of the energy transfer device prior to returning the cooling fluid to the condenser.
16. The method of claim 15, wherein, Further cooling the cooling fluid provided at the outlet of the energy transfer device includes flowing external gas across the cooling fluid via at least one fan at a cooling tower to remove heat from the cooling fluid.
17. The method of any one of claims 13-16, further comprising further heating the third fluid to a required temperature at a component.
18. The method of claim 17, wherein, The component is downstream of an outlet of the energy transfer device.
19. The method of any one of claims 13-18, wherein, The chiller system is a water-cooled chiller system.