Jig and method for screening detection distance of photoelectric sensor module
By designing a fixture for photoelectric sensor modules, automated testing is achieved, solving the problems of high risk of missed detection, low efficiency, and poor consistency in the detection distance of photoelectric sensor modules, thus reducing costs.
Patent Information
- Application Number
- CN202511068015.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-31
- Publication Date
- 2025-11-21
AI Technical Summary
Photoelectric sensor modules have a high risk of missed detections due to limited detection range, low efficiency, poor product consistency, and high cost.
Design a fixture including a test stage, a reflection reference stage, a support frame, and a positioning probe. The positioning probe is electrically connected to the PCB board. The test box is powered and triggers beam detection to judge the reflection signal. The fixture integrates driving, comparison, and audio-visual indication modules to achieve automated detection.
Reduce the risk of missed detections, improve testing efficiency, enhance product consistency, and reduce costs.
Smart Images
Figure CN120991932A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of photoelectric sensor technology, and specifically relates to a fixture and method for screening the detection distance of photoelectric sensor modules. Background Technology
[0002] Photoelectric sensors are widely used in industrial inspection. In the quality control of PCB boards for photoelectric sensors, the consistency of detection distance directly affects the product pass rate. In existing technologies, diffuse reflection photoelectric sensors typically use manual visual inspection or simple tooling to screen for detection distance. However, due to the large number of discrete components on the PCB board, the center distance between the transmitting and receiving chips inevitably fluctuates due to limitations in the precision of the surface mount equipment and individual differences between different batches of components. When this center distance exceeds the design dimensions, it directly leads to a significant reduction in the actual detection distance of the photoelectric sensor. In the manufacturing process, if optical components such as light guides or lenses have already been assembled in the previous process, and the PCB board is then assembled to the housing using a three-point fixing method with a dispensing machine, if the detection distance is found to be substandard, subsequent disassembly and rework will be extremely cumbersome, increasing labor costs and potentially damaging other assembled components. Furthermore, manual visual inspection carries a significant risk of missed detections, failing to effectively identify defective products near the detection distance threshold, resulting in poor product consistency, low pass rate, and low production efficiency.
[0003] Therefore, it is necessary to provide a new technical solution to solve the above-mentioned technical problems. Summary of the Invention
[0004] The technical problem to be solved by this invention is that in the process of screening by detection distance of photoelectric sensor modules, there is a high risk of missed detection, low efficiency, poor product consistency and high cost.
[0005] To address the aforementioned technical problems, this invention provides a fixture for screening the detection distance of photoelectric sensor modules. The fixture includes a fixture body, which comprises a test stage with a accommodating space for accommodating a photoelectric sensor module under test with an assembled light guide post or lens, a reflective reference stage with a detection reference surface, a support frame connected to both the test stage and the reflective reference stage, and multiple positioning probes disposed on the test stage and extending into the accommodating space. The reflective reference stage and the test stage are arranged at intervals, and the detection reference surface is perpendicular to the optical axis of the light guide post or lens of the photoelectric sensor module under test. The multiple positioning probes are used to elastically abut against corresponding pad holes on the PCB board of the photoelectric sensor module under test to electrically connect the positioning probes to the PCB board. The fixture also includes a test box connected to the multiple positioning probes. The test box supplies power to the photoelectric sensor module under test, triggers the photoelectric sensor module under test to emit a light beam onto the detection reference surface, and determines whether a detection signal is received from the photoelectric sensor module under test to trigger a prompt signal.
[0006] Optionally, the test box integrates a driving module, a comparison module, and an acoustic-optical indication module. The driving module supplies power to the photoelectric sensor module under test via the positioning probe and triggers the photoelectric sensor module under test to emit a light beam onto the detection reference surface. The comparison module determines whether a detection signal is received from the photoelectric sensor module under test. The acoustic-optical indication module responds to the output result of the comparison module and triggers a prompt signal.
[0007] Optionally, a plurality of positioning probes are detachably mounted on the test bench. The plurality of positioning probes include power probes, signal probes and ground probes. The power probes correspond to power pads on the PCB, the signal probes correspond to signal output pads on the PCB, and the ground probes correspond to ground pads on the PCB.
[0008] Optionally, the vertical distance between the detection reference surface and the light-emitting end face of the light guide or lens on the PCB board ranges from 24.5 mm to 25.5 mm.
[0009] Optionally, a white paper is attached to the detection reference surface, and the light beam emitted by the photoelectric sensor module under test is transmitted to the white paper and reflected by the white paper to be received by the photoelectric sensor module under test, so as to form the reflected signal of the photoelectric sensor module under test.
[0010] According to another aspect of the present invention, the present invention also provides a method for screening the detection distance of a photoelectric sensor module. The method is applied to the fixture for screening the detection distance of a photoelectric sensor module, and further includes placing a PCB board of the photoelectric sensor module to be tested, which is already equipped with a light guide post or lens, into an accommodating space so that the corresponding pad holes on the PCB board are electrically connected to the positioning probe in one step; placing white paper as a reflective surface on the detection reference surface, and setting the vertical distance between the white paper and the light-emitting end face of the light guide post or lens on the PCB board as a preset distance; supplying power to the photoelectric sensor module to be tested through the driving module of the test box, and triggering the photoelectric sensor module to emit a light beam onto the white paper; determining whether a detection signal is received from the photoelectric sensor module to be tested, through the comparison module of the test box, to determine whether the photoelectric sensor module to be tested detects the reflection signal of the detection reference surface at the preset distance; if a detection signal is received from the photoelectric sensor module to be tested, the PCB board is determined to be qualified, and a prompt signal is triggered through the audio-visual indication module of the test box.
[0011] Optionally, if no detection signal is received from the photoelectric sensor module under test, the PCB board is determined to be unqualified.
[0012] Optionally, the triggering of the prompt signal through the sound and light indicator module of the test box includes triggering an indicator light to illuminate and / or a buzzer to sound an alarm through the sound and light indicator module of the test box.
[0013] Optionally, the white paper is standard reflectance white paper, which is white diffuse reflectance paper.
[0014] Optionally, the preset distance is in the range of 24.5 mm to 25.5 mm.
[0015] Beneficial effects: This invention provides a fixture for screening the detection distance of photoelectric sensor modules. The fixture body contains a test stage with a pre-assembled light guide or lens to accommodate the photoelectric sensor module under test. A reflective reference stage and a test stage are arranged at intervals. The detection reference surface of the reflective reference stage is perpendicular to the optical axis of the light guide or lens of the photoelectric sensor module under test. A support frame is connected to both the test stage and the reflective reference stage. Multiple positioning probes are mounted on the test stage and extend into the accommodating space. These probes elastically abut against corresponding pad holes on the PCB board to electrically connect them. A test box is connected to the positioning probes and supplies power to the photoelectric sensor module under test. The test box also triggers the photoelectric sensor module to emit a light beam onto the detection reference surface and determines whether a detection signal is received from the photoelectric sensor module under test, thus triggering a prompt signal. In this process of screening the detection distance of the photoelectric sensor module, the vertical distance between the detection reference surface on the reflective reference stage and the light guide column or lens of the photoelectric sensor module under test located in the accommodating space is pre-set to the preset distance required for detection. Then, the photoelectric sensor module under test, with the light guide column or lens already assembled, is placed in the accommodating space of the test stage, so that the corresponding pad holes on the PCB board of the photoelectric sensor module under test elastically abut against multiple positioning probes. At the same time, the test box is connected to the photoelectric sensor module under test through the positioning probes, and then the test box supplies power to the photoelectric sensor module under test and triggers the photoelectric sensor module under test to emit. The light beam is directed to the detection reference surface. Based on whether the test box receives a detection signal from the photoelectric sensor module under test, the PCB board's qualification is determined, i.e., whether the corresponding photoelectric sensor module is qualified. This allows for the simultaneous detection and screening of a large batch of photoelectric sensor modules under test. During the process of placing each module in the testing station's storage space for testing, operators can intuitively and promptly understand the test results based on the prompts, improving testing efficiency, reducing the risk of missed detections, and enhancing product consistency, thus reducing costs. This achieves the technical effects of reducing the risk of missed detections, improving efficiency, enhancing product consistency, and reducing costs during the screening of photoelectric sensor modules based on their detection distance. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1This is a schematic diagram of a fixture for screening the detection distance of a photoelectric sensor module, provided in an embodiment of the present invention.
[0018] Figure 2 This is a schematic diagram of the test box in a fixture for screening the detection distance of a photoelectric sensor module, provided in an embodiment of the present invention.
[0019] Figure 3 This is a schematic diagram of the PCB board structure in a fixture for screening the detection distance of a photoelectric sensor module, provided in an embodiment of the present invention.
[0020] Figure 4 This is a schematic diagram of the fixture body in a fixture for screening the detection distance of a photoelectric sensor module, provided in an embodiment of the present invention.
[0021] Figure 5 This is a structural block diagram of a driving module, a comparison module, and an acoustic-optical indication module in a fixture for screening the detection distance of a photoelectric sensor module, provided in an embodiment of the present invention.
[0022] Figure 6 This is a flowchart of a method for screening the detection distance of a photoelectric sensor module, provided as an embodiment of the present invention. Detailed Implementation
[0023] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0024] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0025] In the embodiments of this application, "at least one" refers to one or more; "multiple" refers to two or more. In the description of this application, the terms "first," "second," "third," etc., are used only for the purpose of distinguishing descriptions and should not be construed as indicating or implying relative importance, nor should they be construed as indicating or implying order.
[0026] In this specification, references such as "one embodiment" or "some embodiments" mean that one or more embodiments of this application include the specific features, structures, or characteristics described in connection with that embodiment. Therefore, the terms "comprising," "including," "having," and variations thereof in this specification all mean "including but not limited to," unless otherwise specifically emphasized. It should be noted that in the embodiments of this application, "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.
[0027] It should be noted that, in the embodiments of the present invention, when a component is referred to as being "fixed to" another component, it can be directly on the other component or an intervening component may be present. When a component is considered to be "connected to" another component, it can be directly connected to the other component or an intervening component may be present simultaneously. When a component is considered to be "set on" another component, it can be directly set on the other component or an intervening component may be present simultaneously. Furthermore, in the embodiments of this application, "connection" can also be understood as an electrical connection; the connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components. The terms "vertical," "horizontal," "left," "right," and similar expressions used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the present invention.
[0028] Embodiment 1 of the present invention provides a fixture for screening the detection distance of photoelectric sensor modules. Please refer to [link to relevant documentation]. Figures 1 to 5 As shown, Figure 1 This is a schematic diagram of the structure of a fixture for screening the detection distance of a photoelectric sensor module, provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of the test box 3 in a fixture for screening the detection distance of a photoelectric sensor module, provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of the PCB board 41 in a fixture for screening the detection distance of a photoelectric sensor module, provided in an embodiment of the present invention. Figure 3 For scenarios involving large-scale testing, Figure 4 This is a schematic diagram of the fixture body 1 in a fixture for screening the detection distance of a photoelectric sensor module provided in an embodiment of the present invention. Figure 5This is a structural block diagram of a drive module 31, comparison module 32, and acoustic-optical indication module 33 in a fixture for screening the detection distance of a photoelectric sensor module according to an embodiment of the present invention. The fixture for screening the detection distance of a photoelectric sensor module according to an embodiment of the present invention includes a fixture body 1 and a test box 3. The fixture body 1 includes a test stage 11, a reflective reference stage 12, and a support frame 13. The test stage 11 has a receiving space 111 for accommodating the photoelectric sensor module 4 to be tested, which has been fitted with a light guide post 42 or a lens 43. The reflective reference stage 12 has a detection reference surface 121. The reflective reference stage 12 and the test stage 11 are arranged at intervals, and the detection reference surface 121 is perpendicular to the optical axis of the light guide post 42 or lens 43 of the photoelectric sensor module 4 to be tested. The support frame 13 is connected to both the test stage 11 and the reflective reference stage 12. Multiple positioning probes 2 are disposed on the test stage 11 and extend into the receiving space 111. Multiple positioning probes 2 are used to elastically abut against corresponding pad holes on the PCB board 41 of the photoelectric sensor module 4 under test, so as to electrically connect the positioning probes 2 to the PCB board 41. The test box 3 is connected to the multiple positioning probes 2. The test box 3 is used to supply power to the photoelectric sensor module 4 under test, trigger the photoelectric sensor module 4 under test to emit a beam of light onto the detection reference surface 121, and determine whether a detection signal is received from the photoelectric sensor module 4 under test, thereby triggering an prompt signal. That is, the result is determined based on whether a detection signal is received from the photoelectric sensor module 4 under test, and then the corresponding prompt signal is triggered.
[0029] The accommodating space 111 has a space to accommodate the photoelectric sensor module 4 under test. The PCB board 41 of the photoelectric sensor module 4 under test is equipped with a light guide post 42 or a lens 43. The detection reference surface 121 and the light guide post 42 or lens 43 of the photoelectric sensor module 4 under test can be set according to the screening requirements. For example, if the detection reference surface 121 and the light guide post 42 or lens 43 of the photoelectric sensor module 4 under test are preset to a certain distance, it is possible to detect whether the photoelectric sensor module 4 under test located within this distance can receive the light beam reflected by the detection reference surface 121, thereby identifying whether the photoelectric sensor module 4 under test is qualified. For example, if the photoelectric sensor module 4 under test emits a light beam to the detection reference surface 121 through the light guide post 42 or lens 43, the light beam reflected by the detection reference surface 121 can be received by the photoelectric sensor module 4 under test.
[0030] The support frame 13 connects the test stage 11 and the reflective reference stage 12, maintaining a distance between them. The support frame 13 can also adjust the distance between the test stage 11 and the reflective reference stage 12. For example, the support frame 13 may include a slide rail, positioning blocks, and a scale, allowing operators to quickly and accurately set and lock the required detection distance between the reflective reference stage 12 and the test stage 11.
[0031] During operation, the assembled light guide post 42 (for reflective applications) or lens 43 (for through-beam applications) photoelectric sensor module can be placed into the receiving space 111 of the test bench 11. The positioning probe 2 can be a spring-loaded probe, whose retractable tip can accurately align with the preset and test pad holes on the PCB board 41 of the photoelectric sensor module 4 under test. When the photoelectric sensor module 4 under test is pressed into place, the probe tip will form a stable and low-resistance elastic contact with the pad hole due to spring compression, avoiding the cumbersome operation of soldering test lines or using clamps. After the photoelectric sensor module 4 under test is placed and positioned, the operator can start the test through the test box 3.
[0032] In this system, test box 3 supplies power to the PCB board 41 of the photoelectric sensor module 4 under test via positioning probe 2, and simultaneously sends a trigger signal to the control circuit on the PCB board 41. This control circuit can be configured to respond to this trigger signal by driving an internal photoelectric emitter, such as an infrared LED, to emit a light beam. The light beam, guided by the light guide post 42 of the photoelectric sensor module 4 under test or focused by the lens 43, is directed towards the detection reference surface 121 of the reflective reference stage 12. For reflective photoelectric sensors, the light beam reflected by the reflective reference stage 12 needs to be effectively received by the photoelectric receiver of the photoelectric sensor module 4 under test, meaning it should receive light of sufficient intensity within a preset distance. The received electrical signal, after being processed by the processing circuit on the PCB board 41, can feed back a detection signal to test box 3.
[0033] In this embodiment, the photoelectric sensor module 4 under test, which is equipped with light guide post 42 or lens 43, is accommodated in the accommodating space 111 of the test stage 11 in the fixture body 1. The reflective reference stage 12 and the test stage 11 are arranged at intervals. The detection reference surface 121 of the reflective reference stage 12 is perpendicular to the optical axis of the light guide post 42 or lens 43 of the photoelectric sensor module 4 under test. The support frame 13 is connected to the test stage 11 and the reflective reference stage 12 respectively. Multiple positioning probes 2 are set on the test stage 11 and extend into the accommodating space 111. The multiple positioning probes 2 are used to elastically abut against the corresponding pad holes on the PCB board 41 to electrically connect the positioning probes 2 to the PCB board 41. The test box 3 is connected to the multiple positioning probes 2. The test box 3 is used to supply power to the photoelectric sensor module 4 under test, trigger the photoelectric sensor module 4 under test to emit a light beam to the detection reference surface 121, and determine whether a detection signal is received from the photoelectric sensor module 4 under test to trigger a prompt signal. In the process of screening the detection distance of the photoelectric sensor module, the vertical distance between the detection reference surface 121 on the reflective reference stage 12 and the light guide post 42 or lens 43 of the photoelectric sensor module 4 under test located in the accommodating space 111 is set to the preset distance required for detection. Then, the photoelectric sensor module 4 under test, with the light guide post 42 or lens 43 already assembled, is placed in the accommodating space 111 on the test stage 11, so that the corresponding pad holes on the PCB board 41 of the photoelectric sensor module 4 under test elastically abut against multiple positioning probes 2. At the same time, the test box 3 is connected to the photoelectric sensor module 4 under test through the positioning probes 2, and then the test box 3 supplies power to the photoelectric sensor module 4 under test and triggers the photoelectric sensor module under test. The sensor module 4 emits a beam of light onto the detection reference surface 121. The test box 3 determines whether the PCB board 41 is qualified based on whether it receives a detection signal from the photoelectric sensor module 4 under test. This means the PCB board 41 corresponds to the qualified photoelectric sensor module 4. Furthermore, during the screening of a large batch of photoelectric sensor modules 4 by detection distance, the PCB board 41 of each module can be tested simultaneously. During the process of placing each module in the accommodating space 111 of the test stage 11 for testing, operators can intuitively and promptly understand the test results based on the prompts, improving testing efficiency and reducing the risk of missed detections. This also enhances product consistency and helps reduce costs. Therefore, the technical effects of reducing the risk of missed detections, improving efficiency, enhancing product consistency, and reducing costs are achieved during the screening of photoelectric sensor modules by detection distance.
[0034] As one implementation, the test box 3 of the fixture for screening the detection distance of photoelectric sensor modules provided in Embodiment 1 of the present invention integrates a driving module 31, a comparison module 32, and an acoustic-optical indication module 33. The driving module 31 is used to supply power to the photoelectric sensor module 4 under test through the positioning probe 2 and trigger the photoelectric sensor module 4 under test to emit a light beam onto the detection reference surface 121. The comparison module 32 is used to determine whether a detection signal fed back by the photoelectric sensor module 4 under test is received. The acoustic-optical indication module 33 is used to respond to the output result of the comparison module 32 and trigger a prompt signal. The driving module 31 can be electrically connected to the PCB board 41 of the photoelectric sensor module 4 under test through multiple positioning probes 2 to supply power to the photoelectric sensor module 4 under test, that is, to provide the voltage required for operation, and to send a trigger signal, such as a specific level or pulse signal, to trigger the photoelectric sensor module 4 under test to emit a light beam. The light beam is emitted through the light guide post 42 or the lens 43 and illuminates the detection reference surface 121 of the reflective reference stage 12. The comparison module 32 can receive the detection signal fed back by the photoelectric sensor module 4 under test through a specific positioning probe 2, such as a signal probe, which may correspond to the level signal of the receiving tube state. The comparison module 32 will determine whether the detection signal has been received. The audible and visual indication module 33 responds to the output result of the comparison module 32. When the comparison module 32 determines that it is qualified, that is, when a correct and valid detection signal has been received, the audible and visual indication module 33 triggers a prompt signal representing qualification, such as lighting up a yellow LED and emitting a single short beep. When the comparison module 32 determines that it is unqualified, that is, when no detection signal has been received or the signal is invalid, the audible and visual indication module 33 triggers a prompt signal representing unqualified, lighting up a red LED, or leaving the LED off. Through automated detection and real-time feedback mechanism, errors in manual interpretation and operational delays can be avoided, significantly reducing the risk of missed detections, especially in large-scale continuous testing, and greatly improving the speed of single testing and overall screening efficiency.
[0035] In some embodiments, multiple positioning probes 2 are detachably mounted on the test bench 11. These positioning probes 2 include power probes, signal probes, and ground probes. The power probes correspond to power pads on the PCB board 41, the signal probes correspond to signal output pads on the PCB board 41, and the ground probes correspond to ground pads on the PCB board 41. The multiple positioning probes 2 are detachably mounted on the test bench 11, for example, via probe holders and locking screws. The power probes correspond to and elastically abut against the power pads on the PCB board 41 of the photoelectric sensor module under test 4, and are used to transmit the positive power supplied by the test box 3. The signal probes correspond to and elastically abut against the signal output pads on the PCB board 41 of the photoelectric sensor module under test 4, and are used to receive the detection signals fed back by the photoelectric sensor module under test 4 and transmit them to the test box 3. The grounding probe corresponds to and elastically abuts against the grounding pad on the PCB board 41 of the photoelectric sensor module 4 under test, providing a power return path and signal reference ground, enabling faster and more accurate alignment, and achieving the stable electrical connection required for the PCB board 41 to complete the test in one go.
[0036] In some embodiments, the vertical distance between the light guide post 42 or the light-emitting end face of the lens 43 on the PCB board 41 and the detection reference surface 121 is between 24.5mm and 25.5mm. Performing the detection at this distance ensures that only when the photoelectric emission, reception sensitivity, and signal processing circuit performance of the photoelectric sensor module 4 under test all meet the requirements of the aforementioned detection distance can the light beam emitted by the photoelectric sensor module 4 under test effectively detect and generate a standard-compliant detection signal output after passing through this preset detection distance and illuminating the detection reference surface 121 and being reflected. Only then can the test box 3 identify it as qualified. In other words, uniform screening is performed at a specific standard distance of 24.5mm to 25.5mm between the vertical distance between the light guide post 42 or the lens 43 on the PCB board 41 and the detection reference surface 121 ensures a high degree of consistency of the final product at this detection distance.
[0037] In some embodiments, a white paper is attached to the detection reference surface 121. The light beam emitted by the photoelectric sensor module 4 under test is transmitted to the white paper and reflected back to the photoelectric sensor module 4, forming a reflected signal of the photoelectric sensor module 4. During the test, the light beam emitted by the photoelectric sensor module 4 is transmitted to and illuminates the white paper. The light beam undergoes diffuse reflection through the surface of the white paper, and part of the reflected light is transmitted back to the photoelectric receiver of the photoelectric sensor module 4, forming a reflected signal of the photoelectric sensor module 4, i.e., the light signal received by the photoelectric sensor module 4, which can be used to generate a detection signal. Attaching white paper to the detection reference surface 121 allows the diffuse reflection characteristics of the white paper to simulate common targets with weak reflectivity in practical applications, such as packaging paper and ordinary surfaces, to stably form a reflected signal.
[0038] To provide a detailed description of the method for screening the detection distance of photoelectric sensor modules provided by the present invention, the above embodiment 1 provides a detailed description of a fixture for screening the detection distance of photoelectric sensor modules. Based on the same inventive concept, this application also provides a method for screening the detection distance of photoelectric sensor modules, as detailed in embodiment 2.
[0039] Please see Figure 6 As shown, Figure 6 This is a flowchart of a method for screening the detection distance of a photoelectric sensor module according to an embodiment of the present invention. Embodiment two of the present invention provides a method for screening the detection distance of a photoelectric sensor module, applied to the aforementioned fixture for screening the detection distance of a photoelectric sensor module, and further includes the following steps: Step S100: Place the PCB board 41 of the photoelectric sensor module 4 under test, which is equipped with light guide post 42 or lens 43, into the accommodating space 111 so that the corresponding pad hole on the PCB board 41 is electrically connected to the positioning probe 2 in one go. Specifically, the PCB board 41 of the photoelectric sensor module 4 under test, which is equipped with light guide post 42 or lens 43, is placed in the accommodating space 111 of the test bench 11. This ensures that specific corresponding pad holes on the PCB board 41, such as power, signal output, and ground pad holes, are accurately aligned with multiple positioning probes 2 that are pre-set on the test bench 11 and extend into the accommodating space 111. Then, appropriate pressure is applied to cause the probes and the contacted pad holes to undergo elastic deformation, thereby establishing a stable and reliable physical connection and electrical conduction. This achieves a one-time electrical connection between the positioning probes 2 and the PCB board 41, shortening the test preparation time for a single photoelectric sensor module 4 under test. At the same time, reliable elastic contact reduces the risk of test failure or misjudgment due to poor contact, which helps to reduce the risk of missed detection.
[0040] In step S200, a piece of white paper is placed on the detection reference surface 121 as a reflective surface, and the vertical distance between the white paper and the light-emitting end face of the light guide post 42 or lens 43 on the PCB board 41 is set to a preset distance; wherein the value range of the preset distance is 24.5mm to 25.5mm.
[0041] Specifically, a piece of white paper is placed on the detection reference surface 121 as a reflective surface. The vertical distance between the light guide column 42 or lens 43 on the PCB board 41 of the photoelectric sensor module 4 under test in the test position and the detection reference surface 121 is 24.5mm to 25.5mm. This can reflect the standard detection distance requirements and construct a standard and repeatable test environment.
[0042] In step S300, power is supplied to the photoelectric sensor module 4 under test through the driving module 31 of the test box 3, and the photoelectric sensor module 4 under test is triggered to emit a beam onto the white paper; wherein the white paper is standard reflectivity white paper, and the standard reflectivity white paper is white diffuse reflective paper.
[0043] Specifically, the drive module 31 of the test box 3 triggers the photoelectric sensor module 4 under test to emit a light beam toward the standard reflective surface, i.e., white paper, under a specific preset distance condition, so that each photoelectric sensor module 4 under test is in the same working state during the test, i.e., the same triggering condition. The white diffuse reflective paper can provide specific and relatively stable diffuse reflective characteristics to simulate the surface characteristics of reflective targets commonly found in actual applications.
[0044] Step S400: The comparison module 32 of the test box 3 determines whether the detection signal fed back by the photoelectric sensor module 4 under test is received, so as to determine whether the photoelectric sensor module 4 under test detects the reflection signal of the detection reference surface 121 at the preset distance. Specifically, after the light beam emitted by the photoelectric sensor module 4 under test is reflected by the white paper, if the photoelectric receiving tube inside the photoelectric sensor module 4, such as a phototransistor or photodiode, effectively receives part of the reflected light energy, the signal processing circuit inside the photoelectric sensor module 4, such as an amplifier or comparator, will convert the light signal into an electrical signal, and then feed it back to the test box 3 through a signal probe. The comparison module 32 integrated in the test box 3 continuously monitors this feedback path, i.e., the signal probe. The comparison module 32 determines whether a valid detection signal has been received, thereby determining whether the photoelectric sensor module 4 under test has detected the detection reference surface 121, i.e., the signal reflected back from the white paper, at the preset distance set in step S200 above. This helps to shorten the detection cycle, eliminate human interpretation errors, and reduce the risk of missed detection. In addition, the above determination of whether a valid detection signal has been received can refer to comparing the electrical signal fed back by the photoelectric sensor module 4 under test with a certain voltage threshold. When it is lower than the voltage threshold, it is determined that no valid detection signal has been received; when it is higher than or equal to the voltage threshold, it is determined that a valid detection signal has been received.
[0045] In step S500, if a detection signal is received from the photoelectric sensor module 4 under test, the PCB board 41 is determined to be qualified, and a prompt signal is triggered by the audible and visual indicator module 33 of the test box 3. The triggering of the prompt signal by the audible and visual indicator module 33 of the test box 3 includes triggering an indicator light to illuminate and / or emitting a buzzer alarm.
[0046] If no detection signal is received from the photoelectric sensor module 4 under test, the PCB board 41 is determined to be unqualified.
[0047] Specifically, if step S400 determines that a valid detection signal has been received, the comparison module 32 can output a valid indication, indicating that the photoelectric sensor module 4 under test corresponding to PCB board 41 is qualified, meaning that the photoelectric sensor module 4 under test can normally detect the reflective surface at a preset distance. Simultaneously, the audio-visual indication module 33 of the test box 3 receives the valid indication and is triggered, emitting a prompt signal indicating qualification. The prompt signal can be triggered by illuminating an indicator light or emitting a buzzer sound. If step S400 determines that a valid detection signal has not been received, an invalid indication is output, indicating that the photoelectric sensor module 4 under test corresponding to PCB board 41 is unqualified. In this case, simply remove the photoelectric sensor module 4 under test and filter out the unqualified products. Alternatively, no prompt can be triggered, or different unqualified prompts such as a red light can be triggered. Operators can react promptly based on the actual prompt signals, which helps improve batch screening efficiency.
[0048] This invention provides a method for screening the detection distance of a photoelectric sensor module. The method involves placing the PCB board 41 of the photoelectric sensor module 4 under test, which is already equipped with a light guide post 42 or a lens 43, into an accommodating space 111, so that the corresponding pad holes on the PCB board 41 are electrically connected to the positioning probe 2 in a single step. A piece of white paper is placed on the detection reference surface 121 as a reflective surface, and the vertical distance between the white paper and the light-emitting end face of the light guide post 42 or lens 43 on the PCB board 41 is set to a preset distance. Power is supplied to the photoelectric sensor module 41 under test through the driving module 31 of the test box 3. The photoelectric sensor module 4 is tested, and the photoelectric sensor module 4 under test is triggered to emit a beam onto the white paper; the comparison module 32 of the test box 3 determines whether a detection signal is received from the photoelectric sensor module 4 under test, so as to determine whether the photoelectric sensor module 4 under test detects the reflection signal of the detection reference surface 121 at the preset distance; if a detection signal is received from the photoelectric sensor module 4 under test, the PCB board 41 is determined to be qualified, and the sound and light indication module 33 of the test box 3 triggers a prompt signal. In the process of screening the detection distance of the photoelectric sensor module, the vertical distance between the detection reference surface 121 on the reflective reference stage 12 and the light guide post 42 or lens 43 of the photoelectric sensor module 4 under test located in the accommodating space 111 is set to the preset distance required for detection. Then, the photoelectric sensor module 4 under test, with the light guide post 42 or lens 43 already assembled, is placed in the accommodating space 111 on the test stage 11, so that the corresponding pad holes on the PCB board 41 of the photoelectric sensor module 4 under test elastically abut against multiple positioning probes 2. At the same time, the test box 3 is connected to the photoelectric sensor module 4 under test through the positioning probes 2, and then the test box 3 supplies power to the photoelectric sensor module 4 under test and triggers the photoelectric sensor module under test. The sensor module 4 emits a beam of light onto the detection reference surface 121. The test box 3 determines whether the PCB board 41 is qualified based on whether it receives a detection signal from the photoelectric sensor module 4 under test. This means the PCB board 41 corresponds to the qualified photoelectric sensor module 4. Furthermore, during the screening of a large batch of photoelectric sensor modules 4 by detection distance, the PCB board 41 of each module can be tested simultaneously. During the process of placing each module in the accommodating space 111 of the test stage 11 for testing, operators can intuitively and promptly understand the test results based on the prompts, improving testing efficiency and reducing the risk of missed detections. This also enhances product consistency and helps reduce costs. Therefore, the technical effects of reducing the risk of missed detections, improving efficiency, enhancing product consistency, and reducing costs are achieved during the screening of photoelectric sensor modules by detection distance.
[0049] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.
Claims
1. A jig for screening a photoelectric sensor module detecting distance, characterized by, The fixture includes a fixture body, which includes a test stage with a accommodating space for accommodating a photoelectric sensor module under test that has been assembled with a light guide post or lens, a reflective reference stage with a detection reference surface, a support frame connected to the test stage and the reflective reference stage respectively, and a plurality of positioning probes disposed on the test stage and extending into the accommodating space. The reflective reference stage and the test stage are arranged at intervals, and the detection reference surface is perpendicular to the optical axis of the light guide post or lens of the photoelectric sensor module under test. Multiple positioning probes are used to elastically abut against corresponding pad holes on the PCB board of the photoelectric sensor module under test, so as to electrically connect the positioning probes to the PCB board; the device also includes a test box connected to the multiple positioning probes, the test box is used to supply power to the photoelectric sensor module under test, trigger the photoelectric sensor module under test to emit a light beam onto the detection reference surface, and determine whether a detection signal is received from the photoelectric sensor module under test to trigger an alert signal.
2. The tool for screening the detection distance of the photosensor module according to claim 1, wherein, The test box integrates a driving module, a comparison module, and an acoustic-optical indication module. The driving module supplies power to the photoelectric sensor module under test via the positioning probe and triggers the photoelectric sensor module under test to emit a light beam onto the detection reference surface. The comparison module determines whether a detection signal is received from the photoelectric sensor module under test. The acoustic-optical indication module responds to the output result of the comparison module and triggers a prompt signal.
3. The tool for screening the detection distance of the photosensor module according to claim 1, wherein, Multiple positioning probes are detachably mounted on the test bench. The multiple positioning probes include power probes, signal probes and ground probes. The power probes correspond to the power pads on the PCB board, the signal probes correspond to the signal output pads on the PCB board, and the ground probes correspond to the ground pads on the PCB board.
4. The fixture for screening the detection distance of photoelectric sensor modules according to claim 1, characterized in that, The vertical distance between the detection reference surface and the light-emitting end face of the light guide or lens on the PCB board ranges from 24.5 mm to 25.5 mm.
5. The fixture for screening the detection distance of photoelectric sensor modules according to claim 1, characterized in that, A white paper is attached to the detection reference surface. The light beam emitted by the photoelectric sensor module under test is transmitted to the white paper and reflected by the white paper to be received by the photoelectric sensor module under test, so as to form the reflected signal of the photoelectric sensor module under test.
6. A method for screening the detection distance of a photoelectric sensor module, characterized in that, The method is applied to the fixture for screening the detection distance of photoelectric sensor modules as described in any one of claims 1 to 5, and further includes... The PCB board of the photoelectric sensor module under test, which is already equipped with light guides or lenses, is placed into the accommodating space so that the corresponding pad holes on the PCB board are electrically connected to the positioning probe in one go. Place a piece of white paper on the detection reference surface as a reflective surface, and set the vertical distance between the white paper and the light-emitting end face of the light guide column or lens on the PCB board as a preset distance. The test box's drive module supplies power to the photoelectric sensor module under test and triggers the photoelectric sensor module under test to emit a beam of light onto the white paper; The comparison module of the test box determines whether a detection signal is received from the photoelectric sensor module under test, so as to determine whether the photoelectric sensor module under test detects the reflection signal of the detection reference surface at the preset distance. If a detection signal is received from the photoelectric sensor module under test, the PCB board is determined to be qualified, and a prompt signal is triggered by the sound and light indication module of the test box.
7. The method for screening the detection distance of a photoelectric sensor module according to claim 6, characterized in that, If no detection signal is received from the photoelectric sensor module under test, the PCB board is deemed unqualified.
8. The method for screening the detection distance of a photoelectric sensor module according to claim 6, characterized in that, The triggering of the prompt signal through the sound and light indicator module of the test box includes triggering an indicator light to light up and / or a buzzer to sound an alarm through the sound and light indicator module of the test box.
9. The method for screening the detection distance of a photoelectric sensor module according to claim 6, characterized in that, The white paper is standard reflectance white paper, which is white diffuse reflectance paper.
10. The method for screening the detection distance of a photoelectric sensor module according to claim 6, characterized in that, The preset distance ranges from 24.5mm to 25.5mm.