Lamp panel, backlight module and display device

Abstract

The invention provides a lamp panel, a backlight module and a display device. The lamp panel comprises a circuit board; the at least one light source assembly is arranged on the circuit board, the light source assembly comprises at least one light emitting diode chip and at least one laser device, and the wavelength ranges of light emitted by the light emitting diode chip and the laser device in the same light source assembly are different. The lamp panel can meet the requirements of high color gamut and no crosstalk.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a lamp panel, a backlight module, and a display device. Background Technology

[0002] In backlight technology for display devices, mainstream solutions such as those based on RGB (Red, Green, Blue) chips or those supplemented with quantum dot (QD) / phosphor conversion technology generally suffer from bottlenecks in color gamut performance, and their coverage is difficult to exceed 96% of the BT2020 standard.

[0003] In addition, this type of solution has long faced the optical crosstalk problem inherent in the traditional RGB miniLED (Mini Light Emitting Diode) architecture, and when the dimming in this area is in the off state, there will be a significant decrease in color gamut coverage. These problems have not yet been effectively solved.

[0004] To improve color gamut performance, existing technologies have proposed using RGB three-color laser sources as backlight solutions. However, due to the large size of the monochromatic laser itself, it is difficult to reduce the spacing between the light-emitting units in the backlight module, resulting in excessively long color mixing distance and poor color mixing uniformity.

[0005] Therefore, the solutions provided by existing technologies cannot meet the requirements of high color gamut and no crosstalk. Summary of the Invention

[0006] This application provides a lamp board, a backlight module, and a display device. The lamp board can meet the requirements of high color gamut and no crosstalk.

[0007] This application provides a light panel, including: Circuit board; At least one light source assembly is disposed on a circuit board, the light source assembly including at least one light-emitting diode chip and at least one laser device, wherein the light emitted by the light-emitting diode chip and the laser device in the same light source assembly have different wavelength ranges.

[0008] In some embodiments, the side of the circuit board on which the light-emitting diode is disposed is the front side of the circuit board, and the other side is the back side of the circuit board; the laser device is disposed on the back side of the circuit board, and a first through hole is provided on the circuit board corresponding to the light-emitting window of the laser device, so that the light emitted by the laser device passes through the first through hole and is emitted from the front side of the circuit board.

[0009] In some embodiments, the lamp panel further includes an optical diffuser disposed at the light-emitting window of the laser device. In some embodiments, the lamp panel further includes a lens disposed on the light-emitting side of the optical diffuser, the first through-hole, and the light-emitting diode chip.

[0010] In some embodiments, the light source assembly further includes a carrier plate, on which the light-emitting diode chip is disposed; the carrier plate is disposed on the circuit board, and the carrier plate has a second through hole, which communicates with the first through hole.

[0011] In some embodiments, the laser device includes a device body and pins, with the bottom of the device body connected to the pins and the light emission window disposed on the top of the device body.

[0012] In some embodiments, the circuit board is a single-sided circuit board; the pins are bent and extended, and the pins pass through mounting holes on the circuit board, and the pins are electrically connected to the front side of the circuit board.

[0013] In some embodiments, the circuit board is a double-sided circuit board; the pins are electrically connected to the reverse side of the circuit board.

[0014] In some embodiments, the lamp panel further includes a fixing member connected to the reverse side of the circuit board; the fixing member is provided with an accommodating space, and the laser device is at least partially accommodated within the accommodating space.

[0015] In some embodiments, the fixing member includes a fixing sleeve, the inner wall of which encloses the accommodating space, and the fixing sleeve is fitted onto the outer periphery of the laser device.

[0016] In some embodiments, the wall of the fixing sleeve is provided with heat dissipation holes.

[0017] In some embodiments, the light-emitting diode chip and the laser device are disposed on the same side of the circuit board.

[0018] In some embodiments, the laser device includes a surface-mount laser.

[0019] In some embodiments, the number of light-emitting diode chips is two, and the laser device is located between the two light-emitting diode chips.

[0020] In some embodiments, one of the light-emitting diode chips is a red light source, the other light-emitting diode chip is a blue light source, and the laser device is a green light source.

[0021] This application embodiment also provides a backlight module, including: Back panel; The light panel is the aforementioned light panel, and the light panel is disposed on the back panel.

[0022] In some embodiments, when the light-emitting diode chip and the laser device are respectively disposed on both sides of the circuit board, the back plate is provided with a clearance groove on the side facing the lamp board, and the laser device is accommodated in the clearance groove.

[0023] In some embodiments, when the light-emitting diode chip and the laser device are respectively disposed on both sides of the circuit board, a clearance hole is provided on the back plate, the laser device corresponds to the clearance hole, and the laser device passes through the clearance hole.

[0024] This application embodiment also provides a display device, including: Backlight module, wherein the backlight module is the aforementioned backlight module; The display panel is disposed on the light-emitting side of the backlight module.

[0025] The lamp board, backlight module, and display device provided in this application embodiment include a circuit board and at least one light source component disposed thereon. The light source component includes at least one light-emitting diode (LED) chip and at least one laser device. The LED chip and laser device within the same light source component have different colors. Firstly, due to the narrow half-width and high spectral purity of the laser, spectral overlap with the LED chip can be significantly reduced, thereby effectively suppressing optical crosstalk. Secondly, the high directionality and intensity of the laser, combined with the LED chip, enhance local dimming accuracy and contrast, avoiding color gamut degradation during local dimming. Finally, the laser and LED chip work together to broaden spectral coverage, significantly improving color gamut performance. Therefore, this lamp board can meet the requirements of high color gamut and no crosstalk. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the first structure of the lamp panel provided in the embodiments of this application.

[0028] Figure 2 for Figure 1 A magnified view of part A.

[0029] Figure 3 This is a schematic diagram of a second structure of the lamp panel provided in an embodiment of this application.

[0030] Figure 4This is a schematic diagram of a third structure of the lamp panel provided in an embodiment of this application.

[0031] Figure 5 This is a schematic diagram of a fourth structure of the lamp panel provided in an embodiment of this application.

[0032] Figure 6 This is an exploded view of the lamp panel provided in an embodiment of this application.

[0033] Figure 7 This is a schematic diagram of the fifth structure of the lamp panel provided in the embodiments of this application.

[0034] Figure 8 This is a schematic diagram of the sixth structure of the lamp panel provided in the embodiments of this application.

[0035] Figure 9 A schematic diagram of the spectrum of an RGB three-color light-emitting diode chip provided in an embodiment of this application.

[0036] Figure 10 This is a schematic diagram of the spectrum of the light source component provided in the embodiments of this application.

[0037] Figure 11 This is a schematic diagram of a first partial structure of a backlight module provided in an embodiment of this application.

[0038] Figure 12 for Figure 11 A magnified view of part B.

[0039] Figure 13 This is a schematic diagram of the structure of the backplate provided in an embodiment of this application.

[0040] Figure 14 This is a schematic diagram of a second partial structure of the backlight module provided in an embodiment of this application.

[0041] Figure 15 This is a schematic diagram of the structure of the display device provided in the embodiments of this application. Detailed Implementation

[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0043] This application provides a lamp board, a backlight module, and a display device. The lamp board can meet the requirements of high color gamut and no crosstalk. The following is a detailed description with reference to the accompanying drawings.

[0044] Please see Figure 1 as well as Figure 2 , Figure 1 This is a schematic diagram of a first structure of the lamp panel provided in an embodiment of this application. Figure 2 for Figure 1 A magnified view of part A.

[0045] This application provides a lamp board 10, which includes a circuit board 11 and at least one light source component 12 disposed on the circuit board 11.

[0046] The circuit board 11 can be a printed circuit board (PCB) or a flexible printed circuit (FPC) for electrical connection and mechanical support. The circuit board 11 has a front side 112 and a back side 113 along its thickness direction. The front side 112 can be configured as a light-emitting surface.

[0047] Please continue reading. Figure 1 The lamp panel 10 may include multiple light source components 12, which are distributed in an array on the circuit board 11. Through the orderly arrangement of the multiple light source components 12, a backlight with uniform brightness distribution can be formed on the entire light-emitting surface of the lamp panel 10, which is beneficial to improving the visual consistency of the display device.

[0048] Please see Figure 3 , Figure 3 This is a schematic diagram of a second structure of the lamp panel provided in an embodiment of this application.

[0049] The light source assembly 12 includes at least one light-emitting diode (LED) chip 121 and at least one laser device 122. The LED chip 121 and the laser device 122 within the same light source assembly 12 have different wavelength ranges. Different wavelength ranges of light correspond to different colors. By reasonably combining different wavelengths of light, the color range that the display system can display can be expanded, thereby achieving wide color gamut display.

[0050] For example, a combination of a red light-emitting diode chip 121, a blue light-emitting diode chip 121, and a green laser device can be used to form wide color gamut white light by mixing light of different wavelengths.

[0051] The side of the circuit board 11 on which the light-emitting diode chip 121 is disposed is called the front side of the circuit board 11, and the other side is called the back side of the circuit board 11. It should be noted that the definition of the front and back sides of the circuit board 11 here is only for the purpose of explaining the relative positional relationship of the components and the overall structure in the technical solution of this application, and does not constitute any substantial limitation on the technical solution of this application.

[0052] A light-emitting diode (LED) chip 121 is disposed on the front side of the circuit board 11 to form a light-emitting surface. The LED chip 121 can be disposed on the front side 112 of the circuit board 11 by die bonding process, and electrically connected to the circuit wiring of the front side 112 by gold wire bonding or flip-chip bonding. As a surface light source, the LED chip 121 has the characteristics of a large emission angle and uniform light intensity distribution.

[0053] The laser device 122 can be a TO-CAN (Transistor Outline CAN package) laser or an SMD (Surface Mounted Device) laser.

[0054] Because laser light has a narrow half-width and high spectral purity, its emission spectrum overlaps little with that of the LED chip 121, thus significantly reducing optical crosstalk caused by spectral crossover. Simultaneously, this spectral characteristic allows the combination of the laser light source and the LED chip 121 to significantly expand the overall spectral coverage of the light source, effectively improving the system's color gamut performance and providing a foundation for achieving high coverage of high-standard color gamuts such as BT2020.

[0055] The high directionality and high intensity of the laser light source, combined with the independently controllable LED chip 121, enhance the accuracy and contrast of local dimming, which helps to maintain excellent color consistency when displaying dark scenes and avoids the color gamut reduction phenomenon that occurs when traditional backlights are turned off in different areas.

[0056] There are multiple ways to connect the circuit board 11 to the light source assembly 12, including two cases: the light-emitting diode chip 121 and the laser device 122 are respectively arranged on opposite sides of the circuit board 11, or the light-emitting diode chip 121 and the laser device 122 are arranged on the same side of the circuit board 11.

[0057] The following embodiment describes how the light-emitting diode chip 121 and the laser device 122 are respectively disposed on opposite sides of the circuit board 11.

[0058] Please continue reading. Figure 3 The circuit board 11 has a first through hole 111 extending through its thickness direction, which can be used for light conduction. A light-emitting diode chip 121 is disposed on the front side 112 of the circuit board 11, and a laser device 122 is disposed on the back side 113 of the circuit board 11. The circuit board 11 has a first through hole 111 corresponding to the light emission window 1221 of the laser device 122, and the light emitted by the laser device 122 is emitted from the front side of the circuit board 11 through the first through hole 111.

[0059] Structurally, the laser device 122 and the light-emitting diode chip 121 are respectively arranged on both sides of the circuit board 11, and the laser emitted by the laser device 122 is optically coupled through the first through hole 111, which further avoids the situation where the light paths of the two light sources block each other.

[0060] Please continue reading. Figure 4 as well as Figure 5 , Figure 4 This is a schematic diagram of a third structure of the lamp panel provided in an embodiment of this application. Figure 5 This is a schematic diagram of the fourth structure of the lamp board provided in the embodiments of this application. The shape of the light outlet of the first through hole 111 can be square, circular, or oblong. A circular opening helps to form a symmetrical light spot, while an oblong opening can expand the light output range in a specific direction, thereby flexibly adjusting and optimizing the light output and light pattern distribution to meet the requirements of different application scenarios for light efficiency and uniformity.

[0061] In some embodiments, please continue reading Figure 3 The lamp panel 10 also includes an optical diffuser (denoted as the first optical diffuser 13), which is disposed on the light emission path of the laser device 122, that is, at the light emission window 1221 of the laser device 122. For example, the first optical diffuser 13 may be disposed within or cover the first through hole 111. For example, the first optical diffuser 13 may be attached to the front 112 or back 113 of the circuit board 11 in a sheet form, and completely cover the first through hole 111.

[0062] Specifically, the first optical diffuser 13 can be disposed in different locations to achieve its function: The first optical diffuser 13 is disposed inside the first through-hole 111. For example, the first optical diffuser 13 can be fixed to the inner wall of the first through-hole 111 by filling or attaching, so that it directly acts on the penetrating laser beam. Alternatively, the first optical diffuser 13 can be disposed on the side of the circuit board 11 closest to the laser device 122, i.e., the reverse side 113 of the circuit board 11, which can initially diffuse the laser beam before it enters the first through-hole 111, helping to improve the uniformity of subsequent light mixing and reduce optical losses within the through-hole. Alternatively, the first optical diffuser 13 can be disposed on the side of the circuit board 11 away from the laser device 122, i.e., the front side 112 of the circuit board 11, which can perform final optical shaping after the laser beam exits the first through-hole 111 and before it mixes with the light emitted by the LED chip 121, so that its light pattern better matches the Lambertian distribution of the LED chip 121.

[0063] The number of first optical diffusers 13 can be multiple, and they are set one-to-one with multiple light source components 12, so as to realize independent optical control of the light output of each laser device 122, avoid optical crosstalk, and further improve the uniformity and color consistency of the backlight.

[0064] The first optical diffuser 13 includes a base layer and scattering particles. The base layer can be a transparent optical adhesive or a polymer film. The scattering particles are dispersed in the base layer. The function of the first optical diffuser 13 is to scatter and shape the highly collimated beam emitted by the laser device 122, transforming its original Gaussian or collimated beam pattern into a spatially uniform Lambertian beam pattern.

[0065] Through the optical conversion function of the first optical diffuser 13, the laser, which originally had high directionality and low divergence angle, is converted into diffuse light with a larger divergence angle and more uniform spatial energy distribution. Its light pattern characteristics match the natural Lambertian light pattern emitted by the light-emitting diode chip 121, which greatly improves the compatibility and synergy between the two types of light sources, the laser device 122 and the light-emitting diode chip 121, in the secondary optical color mixing process. It effectively avoids problems such as spatial color shift, uneven brightness, or excessively long color mixing distance caused by differences in light patterns, thereby achieving higher uniformity white light synthesis in a limited color mixing space and improving the overall optical quality of the backlight module 100.

[0066] In some embodiments, please continue reading Figure 3 as well as Figure 6 , Figure 6 This is an exploded view of the lamp panel provided in an embodiment of this application. The lamp panel 10 also includes a lens 14, which is disposed on the light-emitting side of the first optical diffuser 13, the first through-hole 111, and the light-emitting side of the LED chip 121. For example, the lens 14 can cover the first through-hole 111 and be disposed on the light-emitting side of the LED chip 121. Its function is to integrate and optically modulate the light emitted by the LED chip 121 and the laser emitted through the through-hole to achieve uniform light emission.

[0067] The lens 14 may include an encapsulating adhesive layer or an optical lens.

[0068] When an encapsulating adhesive layer is used, it can be applied and formed on the front side 112 of the circuit board 11 using a precision dispensing process, completely covering the area where the light-emitting diode chip 121 and the first via 111 are located. This encapsulating adhesive layer can be made of high-transmittance, aging-resistant silicone, epoxy resin, or other polymer materials with excellent optical properties. This encapsulating adhesive layer not only provides physical protection, mechanical support, and a barrier against moisture, oxygen, and contaminants in the environment for the light-emitting diode chip 121, but also promotes sufficient close-range mixing of the light emitted from the laser device 122 on the back side 113 and the light emitted from the light-emitting diode chip 121 on the front side 112 before the light is emitted, effectively eliminating local color spots or uneven brightness, thereby significantly improving the consistency of the emitted light, the purity of white light, and the overall color performance.

[0069] When lens 14 is in the form of a lens, it can be a convex lens, a Fresnel lens, or other freeform optical element, which can be made of glass or optical plastic through injection molding or compression molding. The lens is positioned in the light-emitting path between the laser device 122 and the light-emitting diode chip 121, and by refracting and redistributing the light, it also plays the role of uniform light and color mixing.

[0070] Furthermore, the light-emitting surface of the lens 14 can be intentionally designed as a curved surface, such as a convex sphere, an aspherical surface, or a free-form surface with a specific radius of curvature. This curved surface design can effectively increase the light-emitting angle, allowing the light to radiate outward at a wider angle, thereby expanding the illumination area, reducing glare, and further improving the brightness uniformity of the backlight module 100 without increasing the power of the light source.

[0071] In some embodiments, please continue reading Figure 3 as well as Figure 6 The light source assembly 12 also includes a carrier plate (referred to as the first carrier plate 15), which is disposed on the front side 112 of the circuit board 11. The first carrier plate 15 can be selected from a ceramic substrate, a metal-based printed circuit board 11 (MCPCB), or a composite material board with high thermal conductivity. It can be fixedly connected to the main circuit board 11 by thermally conductive adhesive or welding to enhance the mechanical strength of the structure and improve heat dissipation performance.

[0072] The light-emitting diode chip 121 in the same light source assembly 12 is disposed on the first carrier plate 15 to serve as a support for the light-emitting diode chip 121.

[0073] There can be multiple first carrier boards 15, each corresponding to a light source assembly 12. Therefore, the failure of a single module will not render the entire lamp board 10 unusable; only the failed light source assembly 12 along with the carrier board needs to be removed and replaced, simplifying the production, testing, and subsequent maintenance processes.

[0074] The first carrier board 15 is provided with a second through hole 151, which is connected to the first through hole 111 of the circuit board 11 in the vertical projection position, together forming a through optical channel, allowing the laser beam from the reverse side 113 to penetrate to the light-emitting area of ​​the front side 112.

[0075] The light-emitting diode chip 121 adopts a chip-on-board (COB) package, in which multiple light-emitting diode chips 121 are directly die-bonded and electrically connected to the first carrier board 15, and interconnected through wire bonding or metal circuitry, and finally encapsulated within the lens 14. This COB package structure has high integration, excellent thermal performance, and higher reliability.

[0076] Lens 14 can be disposed on the first carrier plate 15, covering the area of ​​light-emitting diode chip 121 and second through hole 151, to perform final homogenization and mixing of the Lambertian light pattern emitted by light-emitting diode chip 121 and the light pattern after laser conversion, so that light-emitting diode chip 121 forms a chip package on the board.

[0077] Please see Figure 3 as well as Figure 7 , Figure 7 This is a schematic diagram of the fifth structure of the lamp panel provided in the embodiments of this application.

[0078] The laser device 122 includes a device body 1222 and pins 1223, which may be metal pins extending from the device body 1222. The pins 1223 are connected to the bottom of the device body 1222, and the light emission window 1221 is located at the top of the device body 1222.

[0079] In some cases, such as Figure 3 The circuit board 11 is a single-sided circuit board, meaning that the front side 112 of the circuit board 11 has a conductive circuit layer. The circuit board 11 also has mounting holes for mounting the pins of the laser device 122. The pins 1223 are bent and extended, passing through the mounting holes 114 on the circuit board 11, and are electrically connected to the front side 112 of the circuit board 11. For example, the metal pins 1223 are first precision bent to achieve a specific three-dimensional shape, and then pass through the pre-drilled mounting holes 114 on the circuit board 11. Finally, the ends of the pins 1223 extend to the front side 112 of the circuit board 11 and form a stable electrical connection and mechanical anchor with the conductive lines on the front side 112 through wave soldering or manual soldering. This connection method is simple in structure, low in cost, and conducive to achieving high-density device layout in a compact space.

[0080] In other cases, such as Figure 7 The circuit board 11 is a double-sided circuit board, meaning that the circuit board 11 includes a substrate and conductive line layers disposed on both sides of the substrate, and the conductive line layers on both sides are electrically interconnected through metallized vias. Pin 1223 is electrically connected to the reverse side 113 of the circuit board 11.

[0081] The connection method can be to solder pin 1223 to a reserved pad on the reverse side 113 through processes such as reflow soldering. This pad is electrically connected to the conductive line layer on the reverse side 113 of the circuit board 11. Electrical signals are transmitted from the reverse side 113 of the circuit board 11 to the front side 112 of the circuit board 11 or other required circuit layers through metallized vias.

[0082] Another connection method is via connector 115. Connector 115 can be a standalone electronic connector, such as a socket connector or a board-to-board connector, which is fixed to the reverse side 113 of circuit board 11 using surface mount technology or through-hole mounting technology. The pins 1223 of laser device 122 can be directly inserted into and locked into connector 115, thereby achieving a quick and separable electrical connection. This method provides significant advantages in modularity and maintainability; if a single laser device 122 fails, it can be directly replaced without resoldering, reducing maintenance costs and complexity.

[0083] In some embodiments, please refer to Figure 3 , Figure 6 as well as Figure 7 The lamp board 10 also includes a fixing member 16, which is connected to the reverse side 113 of the circuit board 11. The fixing member 16 is provided with a receiving space 161, and the laser device 122 is at least partially received in the receiving space 161. The fixing member 16 can be used to fix the position of the laser device 122, so that the light emission window 1221 is aligned with the first through hole 111.

[0084] The number of fixing parts 16 can be multiple, corresponding one-to-one with multiple light source components 12, ensuring that each laser device 122 can be accurately aligned and emit light through the first through hole 111, while also improving assembly efficiency and module reliability.

[0085] The fastener 16 can be made of engineering plastic injection molding or metal stamping processes with good dimensional stability and insulation properties. For example, the material of the fastener 16 can be PBT (Polybutylene Terephthalate) or LCP (Liquid Crystal Polyme). The fastener 16 is provided with a receiving space 161 of a specific shape and size, corresponding to the laser device 122. The laser device 122 is at least partially accommodated and fixed within the receiving space 161, thereby achieving the alignment of the laser device 122 during assembly and the support and protection of the laser device 122 during use.

[0086] Furthermore, the fixing member 16 may include a fixing sleeve. The fixing sleeve is a hollow cylindrical structure, with its inner wall forming an accommodating space 161, and is fitted onto the outer periphery of the laser device 122 by a tight fit, snap-fit, or adhesive method. The fixing sleeve can be selected from a metal shielding shell, a plastic positioning ring, or a ceramic retaining sleeve, etc., and its inner diameter matches the outer diameter of the laser device 122 to provide reliable mechanical constraint, prevent displacement of the laser device 122 due to vibration or impact, and also play a certain role in heat dissipation or electromagnetic shielding.

[0087] The fixing component 16 provides a positioning function, ensuring that the light emission window 1221 of the laser device 122 is always accurately aligned with the first through hole 111 on the reverse side 113 of the circuit board 11, thereby ensuring that the laser beam can pass through the first through hole 111 efficiently and without damage. At the same time, the use of the fixing component 16 also facilitates automated assembly in the production process, improving production efficiency and product consistency.

[0088] To further enhance heat dissipation performance, several heat dissipation holes can be provided on the wall of the fixed sleeve. These heat dissipation holes increase the heat dissipation surface area of ​​the sleeve and promote air convection, thereby more efficiently dissipating the heat generated by the laser device 122 during operation to the surrounding environment and effectively reducing the operating junction temperature of the laser device 122.

[0089] The following embodiment describes how the light-emitting diode chip 121 and the laser device 122 are disposed on the same side of the circuit board 11.

[0090] Please see Figure 8 , Figure 8 This is a schematic diagram of a sixth structure of the lamp board provided in this application embodiment. Unlike the previous embodiment where the two are disposed on opposite sides of the circuit board 11, in this embodiment, the light-emitting diode chip 121 and the laser device 122 are disposed on the same side of the circuit board 11.

[0091] The light-emitting diode chip 121 and the laser device 122 can be integrally encapsulated and fixed on the same surface of the circuit board 11 through a common light-diffusing component (hereinafter referred to as the light-diffusing component). The light-diffusing component may include an encapsulating adhesive layer or an optical lens. The light-diffusing component can be made of high-transmittance, heat-resistant silicone or epoxy resin material, and is formed by a one-time dispensing, molding or compression molding process to integrally encapsulate the two light sources inside it.

[0092] The laser device 122 includes a surface-mount laser, which is mounted on the same side of the circuit board 11 together with the light-emitting diode chip 121. Since the light-emitting diode chip 121 and the laser device 122 are both located on the same plane, they can be assembled and reflowed using a single, efficient SMT (Surface Mount Technology) process, which simplifies the assembly steps and reduces process complexity and manufacturing costs.

[0093] In some cases, the laser device 122 also includes a carrier board (referred to as the second carrier board) disposed on the circuit board 11, on which both the light-emitting diode chip 121 and the laser device 122 are disposed. Specifically, the light-emitting diode chip 121 and the laser device 122 are disposed on the same surface of the second carrier board using SMT technology. Integrating the light-emitting diode chip 121 and the laser device 122 through the second carrier board facilitates maintenance and replacement.

[0094] In other cases, the laser device 122 and the light-emitting diode chip 121 are not fixed by a second carrier board, but their electrodes are directly soldered to the pads on the same side of the circuit board 11. Furthermore, the electrodes of both the laser device 122 and the light-emitting diode chip 121 are soldered to the conductive pads on the same side of the circuit board 11 using surface mount technology.

[0095] Specifically, the electrode pins 1223 or pads of the two types of devices form a strong electrical and mechanical connection with the corresponding pads pre-designed and fabricated on the surface of the circuit board 11 through standardized SMT processes such as solder paste printing, component mounting, and overall reflow soldering. Since all light source components can be automatically mounted and reflow soldered on the same side through a one-time SMT process, production efficiency is significantly improved, and process complexity and manufacturing costs are reduced.

[0096] The light emission direction of the laser device 122 is consistent with the light emission direction of the light-emitting diode chip 121. For example, the light emission direction of the laser device 122 is parallel to the light emission direction of the light-emitting diode chip 121. Parallel light emission means that the laser beam and the LED beam are emitted from the same reference plane, which greatly reduces the spatial position difference between the light sources. This is beneficial for achieving more complete and uniform light mixing at close range, and effectively avoids color separation or uneven brightness.

[0097] A diffuser (referred to as a second optical diffuser) is disposed along the light-emitting path of the laser device 122 to convert the emitted laser beam into a Lambertian distribution pattern, matching it with the light pattern of the light-emitting diode chip 121. This second optical diffuser is preferably made of transparent silicone, epoxy resin, or a polymer optical film doped with micro- or nano-sized scattering particles, such as titanium dioxide (TiO2) or silicon dioxide (SiO2), and is fixed in front of the light-emitting window 1221 of the laser device 122 by dispensing, pressing, or attaching. Its core function is to scatter and optically shape the highly directional Gaussian beam emitted by the laser device 122, converting its spatial intensity distribution into a Lambertian light field with a larger divergence angle and a more uniform spatial energy distribution. This conversion ensures that the laser's light pattern characteristics match the inherent Lambertian distribution pattern of the light-emitting diode chip 121, greatly improving their compatibility and synergy in subsequent optical mixing processes, and effectively avoiding problems such as uneven brightness of the mixed light spot, color separation, or excessively long mixing distance caused by differences in light patterns.

[0098] In the above embodiment, there are two light-emitting diode chips 121, and the laser device 122 is disposed between the two light-emitting diode chips 121. It can be understood that, from the reverse direction of light propagation, the laser is located between the light rays emitted from the two light-emitting diode chips 121.

[0099] In some embodiments, the plurality of light-emitting diode chips 121 includes a first light-emitting diode chip 1211 and a second light-emitting diode chip 1212, and the orthographic projection of the laser device 122 on the plane of the circuit board 11 is located between the orthographic projections of the first light-emitting diode chip 1211 and the second light-emitting diode chip 1212.

[0100] For example, when the first light-emitting diode chip 1211, the second light-emitting diode chip 1212, and the laser device 122 are distributed on opposite sides of the first circuit board 11, the first light-emitting diode chip 1211 and the second light-emitting diode chip 1212 are respectively disposed on both sides of the first through-hole 111, which is beneficial for light mixing. The first light-emitting diode chip 1211 and the second light-emitting diode chip 1212 can be symmetrically disposed on both sides of the first through-hole 111. This arrangement is beneficial for the spatial uniformity of the beam distribution and improves the consistency of light output.

[0101] The first light-emitting diode chip 1211, the second light-emitting diode chip 1212, and the laser device 122 each emit light of different colors, together forming a multi-color mixed backlight system. The following provides specific explanations for different scenarios.

[0102] In some cases, one LED chip serves as the red light source, another as the blue light source, and the laser device 122 as the green light source. This approach fully utilizes the extremely narrow half-width (WWHM) and high color purity of the green laser device 122, significantly improving the sharpness and saturation of the green spectrum. This effectively expands the system's color gamut coverage during color mixing, particularly beneficial for achieving coverage of the green vertex region in the BT2020 standard, with a coverage rate exceeding 98%. In contrast, traditional green phosphors or LED light sources have wider WWHMs, making color overlap and crosstalk more likely. The narrow linewidth of the laser light source physically reduces spectral crosstalk, improves color crosstalk, and enhances color reproduction accuracy.

[0103] Please see Figure 9 , Figure 9 This is a schematic diagram of the spectrum of an RGB three-color light-emitting diode (LED) chip provided in an embodiment of this application. L1 represents the spectral curve of the red LED chip, L2 represents the spectral curve of the blue LED chip, and L3 represents the spectral curve of the green LED chip. It can be clearly seen from the figure that the L3 curve corresponding to the green LED chip has a wide half-width, and its spectrum significantly overlaps with L1 and L2 on the wavelength axis. This overlap means that unnecessary light mixing occurs between different colors, leading to optical crosstalk, specifically manifested as decreased color purity, color shift, and reduced contrast, affecting the overall display quality.

[0104] Please see Figure 10 , Figure 10 This is a schematic diagram of the spectrum of the light source assembly provided in an embodiment of this application. In this embodiment, L4 represents the spectral curve of the introduced green laser device 122, L2 still represents the spectral curve of the blue light-emitting diode chip, and L3 is the spectral curve of the green light-emitting diode chip. The L4 curve emitted by the green laser device 122 has an extremely narrow half-width, typically controllable within a few nanometers, with a sharp spectral shape and no obvious side lobes, and minimal or no overlap with L2 and L3. This spectral characteristic fundamentally suppresses the optical crosstalk problem caused by spectral aliasing. In addition, the high directivity and high color saturation of the laser also help to achieve a wider color gamut coverage, such as meeting high standard color gamut specifications like Rec. 2020, while improving the brightness uniformity and local dimming accuracy of the screen, thereby significantly improving the overall optical performance of the display module.

[0105] In other cases, the first LED chip 1211 emits red light, the second LED chip 1212 emits green light, and the laser device 122 emits blue light. In this case, the laser device 122 can be a gallium nitride-based blue laser for blue light emission, which has the advantages of high photoelectric conversion efficiency and strong optical stability, making it particularly suitable for high-brightness backlighting scenarios. The blue laser light has higher output intensity and more precise beam control capabilities, which helps to improve overall backlight brightness and enhance local dimming performance.

[0106] In some cases, the first light-emitting diode chip 1211 emits green light, the second light-emitting diode chip 1212 emits blue light, and the laser device 122 emits red light. In this case, the laser device 122 can be an indium phosphide (InP) based red laser for red light emission. It has the advantages of high luminous efficiency and stable temperature characteristics, and can maintain a consistent red output over a wide temperature range, avoiding wavelength drift or brightness reduction due to temperature rise, thus improving the color consistency and reliability of the display device 1000.

[0107] This embodiment offers flexibility in light source selection and spectral allocation, and the various situations described above should not be considered as limitations on the embodiments of this application. Specific embodiments can also select the optimal combination based on color gamut requirements, energy efficiency targets, and cost constraints, thereby improving display performance while also considering overall system performance.

[0108] In other embodiments, the number of light-emitting diode chips 121 may be configured to be greater than or equal to two.

[0109] For example, by adding a third or more light-emitting diode (LED) chips 121, an RGBW (Red, Green, Blue, White) or other multi-color mixed backlight system can be formed. In this type of solution, the added white LED chip 121 can be used to improve the overall backlight brightness and reduce system power consumption, or to provide auxiliary lighting when displaying high-brightness images, thereby further enhancing display performance and energy efficiency while ensuring high color gamut coverage.

[0110] In some embodiments, the number of laser devices 122 may be greater than or equal to two. For example, two laser devices 122 and at least one light-emitting diode chip 121 may be used together to form a backlight source. For instance, a blue laser device 122 and a green laser device 122 may be used in conjunction with a red light-emitting diode chip 121 to achieve a high color gamut RGB backlight; or, two laser devices 122 of different wavelengths may be combined with light-emitting diode chips 121 to form a four-color or even multi-color light source system. By introducing multiple laser devices 122, the advantages of high color purity and high brightness of the laser light source can be further utilized, significantly enhancing the color performance and optical efficiency of the system in key spectral regions (such as the green and blue light bands), while improving the brightness uniformity and color consistency of the backlight module 100. In the embodiments of this application, the laser device 122 may be a surface-mount laser. This is because surface-mount lasers are smaller in size, and when combined with light-emitting diode chips 121, they are easier to integrate and have better color mixing effects.

[0111] Please see Figure 11 , Figure 11 This is a schematic diagram of a first partial structure of a backlight module provided in an embodiment of this application.

[0112] This application embodiment also provides a backlight module 100, which can provide a surface light source with high color gamut, high brightness, low optical crosstalk and excellent local dimming performance.

[0113] Please see Figure 12 , Figure 12 for Figure 11 A magnified view of part B.

[0114] The backlight module 100 includes a lamp panel 10 and a back panel 20, with the lamp panel 10 disposed on the back panel 20.

[0115] The lamp board 10 is the lamp board 10 described in the above embodiments, which integrates a light-emitting diode chip 121, a laser device 122 and corresponding optical structures.

[0116] The backplate 20 can be disposed on the reverse side 113 of the circuit board 11. The backplate 20 can be formed by stamping or die casting from aluminum alloy, steel or other metal materials with high rigidity and good heat dissipation characteristics, and is used to provide mechanical support, electromagnetic shielding and heat dissipation management for the backlight module 100.

[0117] The circuit board 11 has a first through hole 111 extending along its thickness direction, which can be used for light transmission. A light-emitting diode chip 121 is disposed on the front side 112 of the circuit board 11, and a laser device 122 is disposed on the back side 113 of the circuit board 11. The light-emitting window 1221 of the laser device 122 corresponds to the first through hole 111. The back plate 20 and the lamp board 10 are fixed in different ways.

[0118] In one implementation, please refer to Figure 13 , Figure 13 This is a schematic diagram of the backplate structure provided in an embodiment of this application. When the LED chip 121 and the laser device 122 are respectively disposed on both sides of the circuit board 11, that is, when the LED chip 121 is disposed on the front side 112 of the circuit board 11 and the laser device 122 is disposed on the back side 113 of the circuit board 11, the backplate 20 has a relief groove 21 on the side facing the lamp board 10. The relief groove 21 can be formed by stamping or machining, and its shape and size are adapted to the laser device 122. The laser device 122 is accommodated in the relief groove 21, which can avoid increasing the overall thickness of the module due to its protrusion, which is conducive to realizing the thin and light design of the backlight module 100.

[0119] In addition, the clearance groove 21 also serves to precisely position and physically protect the laser device 122, preventing it from shifting or being damaged during assembly or in a vibrating environment. At the same time, the contact between the inner wall of the clearance groove 21 and the laser device 122 can enhance heat conduction, further improve heat dissipation efficiency, and ensure the reliability of the laser device 122 under high temperature and high vibration conditions.

[0120] In another implementation, please refer to Figure 14 , Figure 14 This is a schematic diagram of a second partial structure of the backlight module provided in an embodiment of this application. When the light-emitting diode chip 121 and the laser device 122 are respectively disposed on both sides of the circuit board 11, a clearance hole 22 is provided on the back plate 20. The clearance hole 22 is an opening that passes through the back plate 20. The laser device 122 is positioned corresponding to the clearance hole 22 and can pass through the clearance hole 22, which also helps to reduce the thickness of the backlight module 100.

[0121] Please see Figure 15 , Figure 15 This is a schematic diagram of the structure of the display device provided in the embodiments of this application.

[0122] This application provides a display device 1000. The display device 1000 includes, but is not limited to, high-end LCD TVs, desktop monitors, laptops, tablets, in-vehicle display systems, and commercial advertising machines.

[0123] The display device 1000 includes a backlight module 100 and a display panel 200. The display panel 200 is disposed on the light-emitting side of the backlight module 100. Due to the thin and light characteristics of the backlight module 100, the display device 1000 can be a terminal product with stringent requirements for thickness, image quality and energy efficiency.

[0124] The display panel 200 is disposed on the light-emitting side of the backlight module 100 and receives light from the backlight module 100 to complete image display. The display panel 200 can be a liquid crystal display panel (LCD), which typically includes a TFT (Thin-Film Transistor) array substrate, a color filter substrate, and a liquid crystal layer located between them. The display principle of the display device 1000 can be as follows: light from the lamp plate 10 passes through a series of optical films (such as diffusion films, brightness enhancement films / prism sheets) and then uniformly illuminates the display panel 200. By adjusting the deflection state of the liquid crystal molecules, the transmittance of the light is controlled, thereby displaying the desired image on the screen.

[0125] The display device 1000 possesses all the technical advantages of the aforementioned backlight module 100, achieving a color gamut coverage far exceeding that of traditional LED backlights, while also exhibiting high contrast, high uniformity, and crosstalk-free display effects.

[0126] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0127] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0128] The lamp board, backlight module, and display device provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application, and the descriptions of the embodiments above are only for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A light panel, characterized in that, include: Circuit board; At least one light source assembly is disposed on a circuit board, the light source assembly including at least one light-emitting diode chip and at least one laser device, wherein the light emitted by the light-emitting diode chip and the laser device in the same light source assembly have different wavelength ranges.

2. The lamp panel according to claim 1, characterized in that, The side of the circuit board on which the light-emitting diode is disposed is the front side of the circuit board, and the other side is the back side of the circuit board; the laser device is disposed on the back side of the circuit board, and a first through hole is provided on the circuit board corresponding to the light-emitting window of the laser device, and the light emitted by the laser device passes through the first through hole and is emitted from the front side of the circuit board.

3. The lamp panel according to claim 2, characterized in that, It also includes an optical diffuser, which is disposed at the light-emitting window of the laser device.

4. The lamp panel according to claim 3, characterized in that, It also includes a lens, which is disposed on the light-emitting side of the optical diffuser, the first through hole, and the light-emitting diode chip.

5. The lamp panel according to claim 2, characterized in that, The light source assembly also includes a carrier plate, on which the light-emitting diode chip is disposed; the carrier plate is disposed on the circuit board, and the carrier plate is provided with a second through hole, which communicates with the first through hole.

6. The lamp panel according to claim 2, characterized in that, The laser device includes a device body and pins, with the bottom of the device body connected to the pins and the light emission window located at the top of the device body.

7. The lamp panel according to claim 6, characterized in that, The circuit board is a single-sided circuit board; the pins are bent and extended, and the pins pass through mounting holes on the circuit board, and the pins are electrically connected to the front side of the circuit board.

8. The lamp panel according to claim 6, characterized in that, The circuit board is a double-sided circuit board; the pins are electrically connected to the reverse side of the circuit board.

9. The lamp panel according to claim 2, characterized in that, It also includes a fixing member connected to the reverse side of the circuit board; the fixing member is provided with an accommodating space, and the laser device is at least partially accommodated within the accommodating space.

10. The lamp panel according to claim 9, characterized in that, The fixing component includes a fixing sleeve, the inner wall of which encloses the accommodating space, and the fixing sleeve is fitted onto the outer periphery of the laser device.

11. The lamp panel according to claim 10, characterized in that, The wall of the fixed sleeve is provided with heat dissipation holes.

12. The lamp panel according to claim 1, characterized in that, The light-emitting diode chip and the laser device are located on the same side of the circuit board.

13. The lamp panel according to claim 12, characterized in that, The laser device includes a surface-mount laser.

14. The lamp panel according to any one of claims 1 to 13, characterized in that, The number of light-emitting diode chips is two, and the laser device is located between the two light-emitting diode chips.

15. The lamp panel according to claim 14, characterized in that, One of the LED chips is a red light source, the other LED chip is a blue light source, and the laser device is a green light source.

16. A backlight module, characterized in that, include: Back panel; A light panel, wherein the light panel is the light panel according to any one of claims 1 to 15, and the light panel is disposed on the back panel.

17. The backlight module according to claim 16, characterized in that, When the light-emitting diode chip and the laser device are respectively disposed on both sides of the circuit board, the back plate is provided with a clearance groove on the side facing the lamp board, and the laser device is accommodated in the clearance groove.

18. The backlight module according to claim 16, characterized in that, When the light-emitting diode chip and the laser device are respectively disposed on both sides of the circuit board, a clearance hole is provided on the back plate, the laser device corresponds to the clearance hole, and the laser device passes through the clearance hole.

19. A display device, characterized in that, include: A backlight module, wherein the backlight module is the backlight module according to any one of claims 16 to 18; The display panel is disposed on the light-emitting side of the backlight module.

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