A laser exposure apparatus and a circuit board production process

By using the cleaning module and copper plate carrier component of the laser exposure equipment, the problem of re-contamination after cleaning of copper-clad laminates in the prior art has been solved, achieving high-precision pattern transfer and meeting the production requirements of high-density interconnect boards.

CN120993685BActive Publication Date: 2026-06-05HANGZHOU LINAN RONGLI ELECTRONICS CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HANGZHOU LINAN RONGLI ELECTRONICS CO LTD
Filing Date
2025-09-22
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Existing screen printing technology is difficult to achieve fine circuit patterns with line width/line spacing of less than 100μm, which cannot meet the technical requirements of high-density interconnect boards. Furthermore, it is prone to defects such as blurred edges, broken lines, or short circuits due to screen wear, deformation, or misalignment.

Method used

Using laser exposure equipment, combined with a cleaning module and copper plate support components, the copper-clad laminate is automatically cleaned by blowing through a shielding unit and a blowing unit. A lifting unit forms a unidirectional inclined air duct to clean the copper-clad laminate and prevent the back diffusion of contaminants. It is also used in conjunction with an ultraviolet light source generator for precise exposure.

Benefits of technology

It effectively reduces the risk of secondary contamination during the handling of copper-clad laminates, achieves high-precision pattern transfer, and is suitable for the production needs of high-density interconnect boards.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a kind of laser exposure equipment and circuit board production process, comprising: fixed frame, the upper surface of the fixed frame is fixed with laser exposure component, the fixed frame is also provided with cleaning module, the copper plate bearing assembly is made of moving base and bearing plate, to solve the prior art, ordinary exposure equipment in the process of irradiation exposure processing to copper-clad plate, since copper-clad plate is contaminated again after being cleaned, the process of being transported to exposure equipment, the application designs the exposure equipment with cleaning module, by the setting of copper plate bearing assembly, copper plate can be automatically moved to cleaning module, by shielding unit and spray unit, automatically spray and clean copper plate, and lifting unit is used, automatically form unidirectional inclined air duct, realize the directional movement of foreign matter when cleaning, unidirectional flow of clean air flow, prevent the reverse diffusion of pollutants.
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Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing equipment technology, and in particular to a laser exposure device. Background Technology

[0002] In the manufacturing process of printed circuit boards (PCBs), pattern transfer is one of the key steps. Traditionally, screen printing technology is widely used to transfer circuit patterns from a screen template to a copper-clad laminate. This technology uses a squeegee to force ink through the mesh and adhere it to the board surface, forming the circuit pattern.

[0003] Existing screen printing technology is limited by screen tension and ink characteristics, making it difficult to achieve fine circuit patterns with line width / line spacing of less than 100μm, which cannot meet the technical requirements of high-density interconnect boards.

[0004] At the same time, printing with direct contact between the screen and the printing plate is prone to defects such as blurred edges, broken lines, or short circuits due to screen wear, deformation, or misalignment.

[0005] In other words, the existing technology has the following technical problems: ordinary screen printing technology cannot meet the technical requirements of high-density interconnect boards. Summary of the Invention

[0006] In view of this, this embodiment provides a laser exposure device to solve the problem that ordinary screen printing technology in the prior art cannot meet the technical requirements of high-density interconnect boards.

[0007] According to one aspect of this application, a laser exposure device is provided, comprising: a fixed frame, wherein a laser exposure component is fixedly disposed on the upper surface of the fixed frame, the laser exposure component is used to irradiate and expose a copper-clad laminate, and a copper plate bearing component is disposed on the fixed frame;

[0008] A cleaning module is also provided at the fixed frame. The cleaning module includes a shielding unit and a blowing unit. The shielding unit includes a liftable and movable shield. The blowing unit is provided inside the shield. The blowing unit includes a fixed pipe, a suction hood, a nozzle, and an inclined plate.

[0009] The copper plate support assembly includes a movable base and a support plate. The movable base is provided with a rotatable support plate. A lifting unit is also provided between the movable base and the support plate. When the movable base is located below the shield, the lifting unit causes the support plate to be lifted and tilted.

[0010] Furthermore, a guide groove is provided on the side of the movable base, and a fixed guide rail is fixedly provided on the side wall of the fixed frame, and the movable base slides between the guide groove and the fixed guide rail.

[0011] Furthermore, a movable block is fixedly connected to the bottom surface of the movable base, and fixed plates are fixedly connected to the bottom surfaces of both sides of the fixed frame. A screw is rotatably connected between the two fixed plates. The screw passes through the movable block and is threadedly engaged with the movable block. A drive motor is fixedly installed on one side wall of the fixed plate, and one end of the drive motor is fixedly connected to one end of the screw.

[0012] Furthermore, the laser exposure assembly includes a laser support, an ultraviolet light source generator, and a moving component. The ultraviolet light source generator is fixedly connected to the bottom surface of the laser support, and the moving component can drive the laser support to move linearly.

[0013] Furthermore, the shielding cover is moved up and down via a lifting component, the lifting component comprising:

[0014] A connecting seat is fixed to the upper surface of the shield, and connecting brackets are rotatably connected to both ends of the connecting seat.

[0015] A second support frame is fixed to both sides of the upper surface of the fixed frame. A second guide rod is fixedly connected between the two second support frames. A double helical screw is rotatably connected between the two second support frames. A second servo motor is fixedly installed on the side wall of the second support frame. The end of the output shaft of the second servo motor is fixedly connected to one end of the double helical screw.

[0016] The movable seat is provided in two parts, which are respectively located on both sides of the double helical screw and threadedly engaged with the double helical screw. The second guide rod passes through the movable seat and is slidably engaged with it. The top end of the connecting frame is rotatably connected to the bottom surface of the movable seat.

[0017] Furthermore, the fixing tube is fixedly installed on one side of the inner wall of the shield, and a nozzle is installed on the fixing tube. The nozzle is tilted downward. The suction cover is fixedly installed on the other side of the inner wall of the shield, and the suction cover is located at the blowing end of the nozzle.

[0018] Furthermore, one end of the fixed tube is fixedly connected to an air source connection pipe, which is used to connect to an external clean air source. The suction hood is connected to a suction pipe for connecting to an external industrial vacuum cleaner.

[0019] Furthermore, several inclined plates are provided, and the several inclined plates are fixed at equal intervals inside the shield. The front end of each inclined plate is provided with a folded part, and the bottom of each inclined plate has the same gap as the inclined support plate.

[0020] Furthermore, the lifting unit includes a movable slider, a support frame, and a contact guide rod. The support frame is rotatably connected to the bottom surface of the bearing plate. The movable base has an internal cavity. The movable slider is slidably connected to the internal cavity of the movable base. The bottom end of the support frame is rotatably connected to the movable slider. The contact guide rod is fixedly connected to the side wall of the movable slider. A connecting spring is fixedly connected to the side wall of the movable slider.

[0021] Furthermore, the circuit board manufacturing process includes the following steps:

[0022] A. Place the copper-clad laminate, which has been pretreated by cleaning and drying and coated with photosensitive emulsion, onto the support plate of the copper plate support assembly of the equipment; activate the vacuum adsorption or electrostatic adsorption function on the support plate to firmly fix the copper-clad laminate and prevent it from shifting during subsequent movement and tilting.

[0023] B. The drive motor starts, driving the screw to rotate and driving the moving base to slide along the fixed guide rail; the copper-clad laminate is accurately delivered to the initial exposure position below the laser exposure component, ready for exposure;

[0024] C. If the system detects or pre-sets the need for cleaning, the movable base will continue to move to directly below the shielding unit. The lifting unit will automatically start, and the top rod on the fixed frame side will insert into the through hole of the movable base, pushing the contact guide rod to move the movable slider. This, in turn, will lift one end of the support plate through the support frame, creating an inclined angle.

[0025] The second servo motor starts, driving the double helical screw to rotate, causing the moving base to move in the same direction, which in turn drives the connecting frame to rotate, lowering the shielding cover and closing it with the tilted moving base.

[0026] D. Operation of the blowing unit: The external filtered and ionized clean air source blows out unidirectional clean ion air through the fixed pipe and the inclined nozzle. At the same time, the suction hood is activated and connected to the external industrial vacuum cleaner, instantly removing the blown-up pollutants to form a unidirectional flow, thoroughly cleaning the panel surface and avoiding secondary pollution. After cleaning, the shielding hood rises, the top rod retracts, and the support plate returns to horizontal under the action of the connecting spring and is attracted and fixed by the magnetic plate.

[0027] E. After cleaning, if no cleaning is required, proceed directly from this step. The copper-clad board is precisely positioned to the exposure station by the moving base.

[0028] F. The first servo motor starts, driving the threaded rod to rotate, which in turn drives the laser support and the ultraviolet light source generator on it to perform a precise linear scanning motion along the first guide rod. The ultraviolet light source generator emits ultraviolet light of a specific wavelength and intensity according to the preset circuit diagram data, which scans and exposes the photosensitive adhesive on the copper-clad board to complete the pattern transfer.

[0029] After exposure is complete, the mobile base automatically returns to the loading station, releases the vacuum adsorption, removes the copper-clad laminate with the pattern transferred, and transfers it to subsequent standard processes such as development, etching, and film removal.

[0030] In order to address the problem in the prior art where ordinary exposure equipment poses a risk of recontamination during the exposure process of copper-clad laminates after cleaning, this application designs an exposure device with a cleaning module. Through the copper plate carrying component, the copper plate can be automatically moved to the cleaning module. The copper plate is then automatically cleaned by a shielding unit and a blowing unit. Furthermore, a lifting unit is employed to automatically form a unidirectional inclined airflow, enabling directional movement of foreign objects during cleaning and a unidirectional flow of clean air to prevent backflow of contaminants. This ensures cleaning in a closed environment, greatly reducing the risk of secondary contamination. This device is particularly suitable for use in the exposure production of copper-clad laminates. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the overall structure of one embodiment of this application;

[0033] Figure 2 This is a front view structural diagram of one embodiment of this application;

[0034] Figure 3 This is a top view schematic diagram of one embodiment of the present application;

[0035] Figure 4 This is a schematic diagram of the structure of a shielding unit according to an embodiment of this application;

[0036] Figure 5 This is a side view of the shielding unit according to an embodiment of this application;

[0037] Figure 6 This is a three-dimensional structural diagram of a spray unit according to an embodiment of this application;

[0038] Figure 7 This is a frontal internal structure diagram of a spray unit according to an embodiment of this application;

[0039] Figure 8 This is a schematic diagram of the structure of a lifting unit according to an embodiment of this application;

[0040] Figure 9 This is one embodiment of the present application. Figure 8 A magnified structural diagram of point A;

[0041] Figure 10 This is a schematic diagram of the overall side structure of one embodiment of this application.

[0042] In the picture:

[0043] 1. Fixed frame; 101. Top rod; 102. Limiting rod;

[0044] 2. Copper plate support assembly; 201. Movable base; 2011. Guide groove; 202. Fixed guide rail; 203. Support plate; 204. Fixed plate base; 205. Screw; 206. Drive motor; 207. Movable block;

[0045] 3. Laser exposure assembly; 301. First support frame; 302. First guide rod; 303. Threaded rod; 304. First servo motor; 305. Laser support; 306. Ultraviolet light source generator;

[0046] 4. Shielding unit; 401. Second support frame; 402. Second guide rod; 403. Double helical screw; 404. Movable seat; 405. Connecting frame; 406. Connecting seat; 407. Shielding cover; 408. Second servo motor;

[0047] 5. Pulse unit; 501. Fixed pipe; 5011. Air source connection pipe; 502. Nozzle; 503. Inclined plate; 5031. Reverse fold; 504. Suction hood; 5041. Suction pipe;

[0048] 6. Lifting unit; 601. Moving slider; 602. Support frame; 603. Contact guide rod; 604. Limiting sleeve; 605. Connecting spring; 606. Magnetic suction plate;

[0049] 7. Sealing unit; 701. Sealing ring; 702. Fixing plate; 703. Fixing cylinder; 704. Moving piston; 705. Moving guide rod; 706. Return spring; 707. Contact plate. Detailed Implementation

[0050] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0051] This application provides laser exposure equipment and circuit board manufacturing processes, which can be applied to core electronic industries such as integrated circuit manufacturing and high-density interconnect printed circuit boards.

[0052] Please see Figure 1 As shown, a laser exposure device includes: a fixed frame 1, a laser exposure component 3 fixedly disposed on the upper surface of the fixed frame 1, the laser exposure component 3 being used to irradiate and expose copper-clad laminates, and a copper plate bearing component 2 disposed on the fixed frame 1.

[0053] A cleaning module is also provided at the fixed frame 1. The cleaning module includes a shielding unit 4 and a blowing unit 5. The shielding unit 4 includes a liftable and movable shielding cover 407. The blowing unit 5 is provided inside the shielding cover 407. The blowing unit 5 includes a fixed pipe 501, a suction cover 504, a nozzle 502 and an inclined plate 503.

[0054] The copper plate support assembly 2 includes a movable base 201 and a support plate 203. The movable base 201 is provided with a rotatable support plate 203. A lifting unit 6 is also provided between the movable base 201 and the support plate 203. When the movable base 201 is located below the shielding cover 407, the lifting unit 6 causes the support plate 203 to be lifted and tilted.

[0055] To address the risk of recontamination during the exposure process of copper-clad laminates (CCLs) in existing conventional exposure equipment, this application designs an exposure device with a cleaning module. Through the copper plate carrying component 2, the copper plate can be automatically moved to the cleaning module. The shielding unit 4 and the blowing unit 5 automatically clean the copper plate by blowing air. Furthermore, a lifting unit 6 automatically forms a unidirectional inclined airflow, enabling directional movement of foreign objects during cleaning and a unidirectional flow of clean air to prevent backflow of contaminants. This ensures cleaning in a closed environment, significantly reducing the risk of secondary contamination. This device is particularly suitable for use in the exposure production of CCLs.

[0056] As for specific technical solutions, please participate. Figure 1 and Figure 2 As shown, a guide groove 2011 is provided on the side of the movable base 201, and a fixed guide rail 202 is fixedly provided on the side wall of the fixed frame 1. The movable base 201 slides between the guide groove 2011 and the fixed guide rail 202.

[0057] For further details, please refer to Figure 2 and Figure 3As shown, a movable block 207 is fixedly connected to the bottom surface of the movable base 201, and fixed plates 204 are fixedly connected to the bottom surfaces of both sides of the fixed frame 1. A screw 205 is rotatably connected between the two fixed plates 204. The screw 205 passes through the movable block 207 and is threadedly engaged with the movable block 207. A drive motor 206 is fixedly installed on one side wall of the fixed plate 204. One end of the drive motor 206 is fixedly connected to one end of the screw 205. Through this technical solution, the operation of the drive motor 206 can drive the screw 205 to rotate, thereby driving the movable block 207 to move, and then driving the movable base 201 to move, thus enabling the movement of the copper-clad laminate and realizing the function of movement adjustment.

[0058] Preferably, a lubricating coating or ball bearing is provided between the guide groove 2011 of the movable base 201 and the fixed guide rail 202 to reduce frictional resistance and improve the smoothness of movement.

[0059] For a better option, please refer to Figure 1 As shown, the movable base 201 and the support plate 203 are rotatably connected by a hinge. Preferably, the support plate 203 is also provided with a structure for fixing the copper-clad laminate, ensuring that the copper-clad laminate remains fixed when supported. Specifically, the copper-clad laminate fixing structure provided on the support plate 203 can be a vacuum adsorption array or an electrostatic adsorption plate. The diameter of the adsorption holes is preferably 0.5–1 mm, and the hole spacing is 5–10 mm. Adsorption and fixing are achieved by an external vacuum pump to prevent the copper plate from shifting during movement or tilting.

[0060] For specific technical solutions, please refer to Figure 1 and Figure 10 As shown, the laser exposure assembly 3 includes a laser support 305, an ultraviolet light source generator 306, and a moving component. The ultraviolet light source generator 306 is fixedly connected to the bottom surface of the laser support 305. The moving component is fixed to the upper surface of the fixed frame 1. The moving component can drive the laser support 305 to move linearly. Through this technical solution, the ultraviolet light source generator 306 can irradiate the copper-clad laminate. The linear movement of the laser support 305 can adjust the irradiation position. In conjunction with the movement of the copper plate bearing assembly 2, the position of the copper-clad laminate can be adjusted, and different positions of the copper-clad laminate can be fully irradiated and exposed.

[0061] For details, please refer to Figure 1 and Figure 10As shown, the moving component consists of a first support frame 301, a threaded rod 303, and a first servo motor 304. The threaded rod 303 is disposed between two first support frames 301 and rotatably connected to them. The first support frames 301 are fixedly disposed on both sides of the fixed frame 1. A first guide rod 302 is fixedly connected between the two first support frames 301. The first guide rod 302 passes through the laser support 305 and is slidably engaged with it. The threaded rod 303 passes through the laser support 305 and is threadedly engaged with it. A first servo motor 304 is also fixedly connected to the side wall of the first support frame 301. The output shaft end of the first servo motor 304 is fixedly connected to one end of the threaded rod 303. Through this technical solution, the operation of the first servo motor 304 can drive the threaded rod 303 to rotate, and the rotation of the threaded rod 303 can drive the laser support 305 to move, thereby realizing the linear movement function of the ultraviolet light source generator 306.

[0062] Preferably, the ultraviolet light source generator 306 has a wavelength range of 355–405 nm and a power of 100–500 mW / cm², and the exposure intensity can be adjusted according to the characteristics of the photosensitive layer of the copper plate.

[0063] Specifically, the first servo motor 304 can be a stepper motor or a servo motor, with a movement accuracy controlled within ±0.1 mm, to achieve precise positioning of the ultraviolet light source generator 306.

[0064] For specific technical solutions, please refer to Figure 4 As shown, the shielding cover 407 is moved up and down via a lifting component, which includes:

[0065] A connecting seat 406 is fixed to the upper surface of the shield 407, and connecting brackets 405 are rotatably connected to both ends of the connecting seat 406.

[0066] Second support frames 401 are fixed on both sides of the upper surface of the fixed frame 1. A second guide rod 402 is fixedly connected between the two second support frames 401. A double helical screw 403 is rotatably connected between the two second support frames 401. A second servo motor 408 is fixedly installed on the side wall of the second support frame 401. The end of the output shaft of the second servo motor 408 is fixedly connected to one end of the double helical screw 403.

[0067] The movable seat 404 is provided in two parts. The two movable seats 404 are respectively located on both sides of the double helical screw 403 and are threadedly engaged with the double helical screw 403. The second guide rod 402 passes through the movable seat 404 and is slidably engaged with the movable seat 404. The top end of the connecting frame 405 is rotatably connected to the bottom surface of the movable seat 404.

[0068] This technical solution utilizes the second servo motor 408 to drive the double helical screw 403 to rotate. The rotation of the double helical screw 403 drives the two movable seats 404 on both sides to move synchronously, achieving movement in the same or opposite directions. When the movable seats 404 move in the same direction, they drive the connecting frame 405 to rotate at an angle, causing the shielding cover 407 to move downwards. When the movable seats 404 move in the opposite direction, the shielding cover 407 moves upwards. This achieves the lifting and lowering movement function of the shielding cover 407.

[0069] For a preferred technical solution, please refer to Figure 7 and Figure 8 As shown, the fixing tube 501 is fixedly installed on one side of the inner wall of the shield 407, and a nozzle 502 is installed on the fixing tube 501. The nozzle 502 is tilted downward. The suction cover 504 is fixedly installed on the other side of the inner wall of the shield 407. The suction cover 504 is located at the blowing end of the nozzle 502.

[0070] For details, please refer to Figure 5 , Figure 6 and Figure 7 As shown, one end of the fixed tube 501 is fixedly connected to an air source connection tube 5011. The air source connection tube 5011 is used to connect to an external clean air source. The clean air source can be equipped with a high-efficiency filter and an ion generator, so that the filtered pure ionized air is delivered to the interior of the fixed tube 501 and then sprayed out through the nozzle 502, forming a clean ion wind from top to bottom, ensuring the cleaning effect on the copper-clad laminate. The suction hood 504 is connected to a suction tube 5041 for connecting to an external industrial vacuum cleaner. The airflow is unidirectional. Once the particles are blown off the board surface, they can be directly sucked in through the fixed tube 501, effectively avoiding the problem of secondary pollution.

[0071] Specifically, the nozzle 502 has an inclination angle of 30–45°, a nozzle diameter of 1–2 mm, an airflow velocity controlled at 10–20 m / s, and an airflow pressure of 0.2–0.5 MPa, ensuring that the airflow can effectively blow away particulate matter without damaging the copper plate surface. Specifically, the industrial vacuum cleaner connected to the suction pipe 5041 has an airflow of no less than 50 m³ / h and a suction port negative pressure of no less than -10 kPa, ensuring that particulate matter can be quickly removed.

[0072] For further technical solutions, please refer to Figure 8 As shown, several inclined plates 503 are provided, and the several inclined plates 503 are fixed at equal intervals inside the shielding cover 407. The front end of each inclined plate 503 is provided with a folded portion 5031. The bottom of each inclined plate 503 has the same gap as the inclined support plate 203. Through this technical solution, after the airflow is blown out obliquely downward, it can effectively blow the particles away from the plate surface. At the same time, the inclined plates 503 can play a shielding role, and the folded portions 5031 can block the particles when they fall again, thereby reducing the phenomenon of re-contamination due to the floating and falling particles during spray cleaning.

[0073] For specific technical solutions, please refer to Figure 8 As shown, the lifting unit 6 includes a movable slider 601, a support frame 602, and a contact guide rod 603. The support frame 602 is rotatably connected to the bottom surface of the bearing plate 203. The movable base 201 has an internal cavity, and the movable slider 601 is slidably connected within the cavity of the movable base 201. The bottom end of the support frame 602 is rotatably connected to the movable slider 601. The contact guide rod 603 is fixedly connected to the side wall of the movable slider 601. A limiting sleeve 604 is fixedly connected within the cavity of the movable base 201. The contact guide rod 603 passes through the limiting sleeve 604 and slides with it. One end of a connecting spring 605 is fixedly connected to the side wall of the movable slider 601, and the other end of the connecting spring 605 is fixedly connected to the side wall of the limiting sleeve 604.

[0074] Furthermore, a top rod 101 is fixedly installed on the side wall of the fixed frame 1, and a through hole for inserting the top rod 101 is provided on the side wall of the movable base 201. A limit rod 102 is also fixedly connected to the side wall of the fixed frame 1. With this technical solution, when the movable base 201 moves to the position below the shield 407, the top rod 101 will enter the inner cavity of the movable base 201 through the through hole, thereby pushing the contact guide rod 603 to move, causing the movable slider 601 to move, causing the support frame 602 to rotate angularly, and driving the bearing plate 203 to move. The end is raised and tilted to form an angle, which can automatically cooperate with the blowing unit 5 to form a unidirectional tilted air duct, ensuring the cleaning effect. A magnetic plate 606 is also fixedly connected to the upper surface of the movable base 201. After the copper-clad plate is cleaned, the shielding cover 407 moves up and separates from the movable base 201. The movable base 201 moves and separates from the top rod 101. Since the positioning function of the top rod 101 is lost, the support plate 203 automatically flips over, and the magnetic plate 606 attracts the support plate 203, which plays a fixing role and ensures the horizontal fixing effect of the support plate 203.

[0075] Furthermore, in the lifting unit 6, the elastic coefficient of the connecting spring 605 is preferably 5–10 N / mm, which is used to ensure that after the top rod 101 is disengaged, the bearing plate 203 can quickly return to a horizontal state and fit with the magnetic plate 606.

[0076] For a preferred technical solution, please refer to Figure 9 As shown, a sealing unit 7 is also provided between the shielding cover 407 and the movable base 201. The sealing unit 7 includes a sealing ring 701, a fixing plate 702, and a contact plate 707. A groove for placing the sealing ring 701 is provided on the bottom side of the shielding cover 407. The sealing ring 701 is fixedly disposed in the groove of the shielding cover 407. The fixing plate 702 is fixedly connected to the side wall of the shielding cover 407. A fixing cylinder 703 is fixedly connected to the bottom surface of the fixing plate 702. A movable piston 704 is slidably connected in the inner cavity of the fixed cylinder 703. One end of a movable guide rod 705 is fixedly connected to the bottom surface of the movable piston 704. The other end of the movable guide rod 705 passes through the bottom wall of the inner cavity of the fixed cylinder 703 and extends to the outside of the wall. One end of a return spring 706 is also fixedly connected to the bottom surface of the movable piston 704. The other end of the return spring 706 is fixedly connected to the inner wall of the fixed cylinder 703. The contact plate 707 is fixed to the side wall of the movable base 201.

[0077] With this technical solution, when the shielding cover 407 is pressed down and fits against the movable base 201, the contact plate 707 will contact the movable guide rod 705, pushing the movable guide rod 705 to move upward. The movement of the movable guide rod 705 will then push the movable piston 704 to move upward, allowing the gas in the inner cavity of the fixed cylinder 703 to be transported to the inner cavity of the sealing ring 701 through the connecting pipe 708. This causes the sealing ring 701 to expand, sealing the gap between the shielding cover 407 and the movable base 201. This effectively isolates the outside during the cleaning process, reducing the problem of external particulate matter entering and causing contamination due to airflow.

[0078] Preferably, the device also includes a PLC or industrial computer control system, which integrates the linkage control of drive motor 206, first servo motor 304, second servo motor 408, air source switch, suction switch, etc.

[0079] The circuit board manufacturing process includes the following steps:

[0080] A. Place the copper-clad laminate that has been pretreated by cleaning and drying and coated with photosensitive emulsion on the support plate 203 of the copper plate support assembly 2 of the equipment; activate the vacuum adsorption or electrostatic adsorption function on the support plate to firmly fix the copper-clad laminate and prevent it from shifting during subsequent movement and tilting.

[0081] B. The drive motor 206 starts, driving the screw 205 to rotate, and driving the moving base 201 to slide along the fixed guide rail 202; the copper-clad laminate is accurately transported to the initial exposure position below the laser exposure assembly 3, ready for exposure;

[0082] C. If the system detects or pre-sets the need for cleaning, the movable base 201 will continue to move to directly below the shielding unit 4. The lifting unit 6 will automatically start, and the top rod 101 on the fixed frame side will be inserted into the through hole of the movable base, pushing the contact guide rod 603 to move the movable slider 601. This, in turn, will lift one end of the support plate 203 through the support frame 602, forming an inclined angle.

[0083] The second servo motor 408 starts, driving the double helical screw 403 to rotate, causing the moving base 404 to move in the same direction, driving the connecting frame 405 to rotate, lowering the shield 407 and closing it with the inclined moving base.

[0084] D. Operation of the blowing unit 5: The external filtered and ionized clean air source blows out unidirectional clean ion air through the fixed pipe 501 and the inclined nozzle 502. At the same time, the suction hood 504 is activated and connected to the external industrial vacuum cleaner, instantly removing the blown contaminants to form a unidirectional flow, thoroughly cleaning the panel surface and avoiding secondary pollution. After cleaning, the shielding hood rises, the top rod retracts, and the support plate returns to horizontal under the action of the connecting spring 605 and is attracted and fixed by the magnetic plate 606.

[0085] E. After cleaning, if no cleaning is required, proceed directly from this step. The copper-clad laminate is precisely positioned to the exposure station by the moving base 201.

[0086] F. The first servo motor 304 starts, driving the threaded rod 303 to rotate, which in turn drives the laser support 305 and the ultraviolet light source generator 306 on it to perform a precise linear scanning motion along the first guide rod 302. The ultraviolet light source generator 306 emits ultraviolet light of a specific wavelength and intensity according to the preset circuit diagram data, which scans and exposes the photosensitive adhesive on the copper-clad board to complete the pattern transfer.

[0087] After exposure is complete, the mobile base 201 automatically returns to the loading station, releases the vacuum adsorption, removes the copper-clad laminate with the pattern transferred, and transfers it to subsequent standard processes such as development, etching, and film removal.

[0088] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser exposure apparatus, comprising: A fixed frame (1) is provided with a laser exposure component (3) fixed on the upper surface of the fixed frame (1). The laser exposure component (3) is used to expose the copper-clad laminate. A copper plate bearing component (2) is provided on the fixed frame (1). The feature is that a cleaning module is also provided at the fixed frame (1), the cleaning module includes a shielding unit (4) and a blowing unit (5), the shielding unit (4) includes a liftable shield (407), the blowing unit (5) is provided inside the shield (407), the blowing unit (5) includes a fixed pipe (501), a suction hood (504), a nozzle (502) and an inclined plate (503); The copper plate support assembly (2) includes a movable base (201) and a support plate (203). The movable base (201) is provided with a rotatable support plate (203). A lifting unit (6) is also provided between the movable base (201) and the support plate (203). When the movable base (201) is below the shield (407), the lifting unit (6) causes the support plate (203) to be lifted and tilted. The shield (407) is moved up and down via a lifting component, the lifting component comprising: A connecting seat (406) is fixed on the upper surface of the shield (407), and a connecting bracket (405) is rotatably connected to both ends of the connecting seat (406). A second support frame (401) is fixed on both sides of the upper surface of the fixed frame (1). A second guide rod (402) is fixedly connected between the two second support frames (401). A double helical screw (403) is rotatably connected between the two second support frames (401). A second servo motor (408) is fixedly installed on the side wall of the second support frame (401). The end of the output shaft of the second servo motor (408) is fixedly connected to one end of the double helical screw (403). The movable seat (404) is provided in two parts. The two movable seats (404) are respectively disposed on both sides of the double helical screw (403) and threadedly engaged with the double helical screw (403). The second guide rod (402) passes through the movable seat (404) and is slidably engaged with the movable seat (404). The top end of the connecting frame (405) is rotatably connected to the bottom surface of the movable seat (404). The inclined plate (503) is provided in a plurality of such plates, and the plurality of inclined plates (503) are fixed at equal intervals inside the shield (407). The front end of the inclined plate (503) is provided with a folded part (5031), and the bottom of the plurality of inclined plates (503) is at the same gap with the inclined support plate (203). The lifting unit (6) includes a movable slider (601), a support frame (602), and a contact guide rod (603). The support frame (602) is rotatably connected to the bottom surface of the bearing plate (203). The movable base (201) has an inner cavity. The movable slider (601) is slidably connected in the inner cavity of the movable base (201). The bottom end of the support frame (602) is rotatably connected to the movable slider (601). The contact guide rod (603) is fixedly connected to the side wall of the movable slider (601). A connecting spring (605) is fixedly connected to the side wall of the movable slider (601).

2. The laser exposure apparatus according to claim 1, characterized in that: The movable base (201) has a guide groove (2011) on its side, and a fixed guide rail (202) is fixedly installed on the side wall of the fixed frame (1). The movable base (201) slides between the guide groove (2011) and the fixed guide rail (202).

3. The laser exposure apparatus according to claim 1, characterized in that: A movable block (207) is fixedly connected to the bottom surface of the movable base (201). Fixed plates (204) are fixedly connected to the bottom surfaces of both sides of the fixed frame (1). A screw (205) is rotatably connected between the two fixed plates (204). The screw (205) passes through the movable block (207) and is threadedly engaged with the movable block (207). A drive motor (206) is fixedly installed on one side wall of the fixed plate (204). One end of the drive motor (206) is fixedly connected to one end of the screw (205).

4. The laser exposure apparatus according to claim 1, characterized in that: The laser exposure assembly (3) includes a laser support (305), an ultraviolet light source generator (306), and a moving component. The ultraviolet light source generator (306) is fixedly connected to the bottom surface of the laser support (305), and the moving component can drive the laser support (305) to move linearly.

5. The laser exposure apparatus according to claim 1, characterized in that: The fixed tube (501) is fixedly installed on one side of the inner wall of the shield (407). A nozzle (502) is installed on the fixed tube (501). The nozzle (502) is tilted downward. The suction cover (504) is fixedly installed on the other side of the inner wall of the shield (407). The suction cover (504) is located at the blowing end of the nozzle (502).

6. The laser exposure apparatus according to claim 1, characterized in that: One end of the fixed tube (501) is fixedly connected to an air source connection tube (5011), which is used to connect to an external clean air source. The suction hood (504) is connected to a suction tube (5041) for connecting to an external industrial vacuum cleaner.

7. The laser exposure apparatus according to any one of claims 1-6 provides a circuit board manufacturing process, characterized in that: The circuit board manufacturing process includes the following steps: A. Place the copper-clad laminate that has been pretreated by cleaning and drying and coated with photosensitive emulsion on the support plate (203) of the copper plate support assembly (2) of the equipment; activate the vacuum adsorption or electrostatic adsorption function on the support plate to firmly fix the copper-clad laminate and prevent it from shifting during subsequent movement and tilting. B. The drive motor (206) starts, driving the screw (205) to rotate, driving the moving base (201) to slide along the fixed guide rail (202); the copper-clad board is accurately transported to the initial exposure station below the laser exposure assembly (3) to prepare for exposure; C. If the system detects or pre-sets the need for cleaning, the movable base (201) will continue to move to directly below the shielding unit (4), the lifting unit (6) will automatically start, the top rod (101) on the fixed frame side will be inserted into the through hole of the movable base, pushing the contact guide rod (603) to move the movable slider (601), and then the support frame (602) will lift one end of the bearing plate (203) to form an inclined angle. The second servo motor (408) starts, drives the double helical screw (403) to rotate, causes the moving base (404) to move in the same direction, drives the connecting frame (405) to rotate, lowers the shield (407) and closes with the inclined moving base; D. Operation of the blowing unit (5): The external filtered and ionized clean air source blows out unidirectional clean ion air through the fixed pipe (501) and the inclined nozzle (502). At the same time, the suction hood (504) is activated and connected to the external industrial vacuum cleaner. It instantly removes the pollutants blown up, forming a unidirectional flow, thoroughly cleaning the panel surface and avoiding secondary pollution. After cleaning, the shielding hood rises, the top rod retracts, and the support plate returns to horizontal under the action of the connecting spring (605) and is attracted and fixed by the magnetic plate (606). E. After cleaning, if no cleaning is required, proceed directly from this step. The copper-clad laminate is precisely positioned to the exposure station by the moving base (201). F. The first servo motor (304) starts, drives the threaded rod (303) to rotate, and drives the laser support (305) and the ultraviolet light source generator (306) on it to perform linear scanning motion along the first guide rod (302). The ultraviolet light source generator (306) emits ultraviolet light of a specific wavelength and intensity according to the preset circuit diagram data, scans and exposes the photosensitive adhesive on the copper-clad board, and completes the pattern transfer. After exposure is completed, the mobile base (201) automatically returns to the loading station, releases the vacuum adsorption, removes the copper-clad laminate with the completed pattern transfer, and transfers it to the subsequent standard processes such as development, etching, and film removal for processing.