Air guide device of high-performance server

Abstract

The invention discloses an air guide device of a high-performance server. The air guide device comprises a machine shell, a machine cover is installed on the top of the machine shell through screws, a circuit board is arranged in the machine shell, a plurality of electric appliance elements are arranged on the circuit board, a controller panel and a rear panel are connected to the circuit board, and a plurality of temperature sensors are arranged on the circuit board; the multiple sets of negative pressure air guide mechanisms are all installed at the bottom of the machine cover, the multiple sets of negative pressure air guide mechanisms are connected with the same cooling cavity, the cooling cavity is installed at the bottom of the machine cover, multiple sets of fans are arranged in the cooling cavity, and the multiple sets of fans and the multiple sets of negative pressure air guide mechanisms are arranged in a one-to-one correspondence mode. According to the device, the Venturi negative pressure suction principle is combined with the self-adaptive air duct adjusting technology based on memory metal, the two technical bottlenecks of hot dead zone removal and dynamic heat load adaptation in traditional server air cooling are effectively solved, and a multi-stage collaborative intelligent cooling system is constructed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server air guide and heat dissipation, in particular to an air guide device for high-performance servers. BACKGROUND

[0002] Servers generate a large amount of heat during operation. Common heat dissipation methods include liquid cooling and air cooling. Air-cooled servers have good heat dissipation effect and are easy to maintain, so they account for a large share of the market.

[0003] In the field of heat dissipation for high-performance servers, existing technologies mainly rely on the following mainstream solutions: Forced air cooling system: This is the most common technology. By arranging multiple high-speed axial flow fans in the case, a directional air flow is formed to blow cold air through the heat dissipation fins on the surface of heat-generating components (such as CPUs and memories), thereby removing heat. Its effect depends on the continuous improvement of fan number, air pressure, and air volume.

[0004] Heat pipe heat conduction technology: commonly used for high-power chips such as CPUs. Through the phase change cycle of the working medium in the vacuum pipe, the heat generated by the chip is efficiently conducted to a larger heat dissipation fin array away from the chip, and then the heat on the fins is blown away by the fan.

[0005] Liquid cooling technology: For extremely high-power data center servers, liquid cooling solutions are used, including cold plate type (liquid flows directly through the cold plate attached to the chip) and immersion type (the entire server is immersed in insulating coolant), with much higher heat dissipation efficiency than air cooling.

[0006] Although the existing air cooling technology is widely used, it has inherent defects: first, there are "dead zones" in the air flow, such as areas under the chip that are difficult to cover with the main air duct, causing heat accumulation; second, uneven cooling, fixed air ducts cannot intelligently adapt to the dynamic heat load of different components, leading to local overheating or excessive cooling, and low energy efficiency. SUMMARY

[0007] To overcome the shortcomings of the prior art, the present application provides an air guide device for high-performance servers. The prior art has "dead zones" in the air flow, such as areas under the chip that are difficult to cover with the main air duct, causing heat accumulation; uneven cooling, fixed air ducts cannot intelligently adapt to the dynamic heat load of different components, leading to local overheating or excessive cooling, and low energy efficiency.

[0008] To solve the above technical problems, the present application provides the following technical solutions: An air guide device for high-performance servers, comprising: The shell is provided with a circuit board, a plurality of electrical elements, a controller panel, a rear panel, and a plurality of temperature sensors. A plurality of negative pressure air guide mechanisms are installed at the bottom of the cover, and a cooling cavity is connected to the plurality of negative pressure air guide mechanisms. A plurality of air guide and blowing mechanisms are fixedly connected to the plurality of negative pressure air guide mechanisms. A plurality of heat conduction structures are arranged on the inner wall of the bottom of the shell and correspond to the plurality of air guide and blowing mechanisms.

[0009] Preferably, a plurality of air inlet holes are arranged on the outer side of the shell and correspond to the cooling cavity.

[0010] Preferably, a plurality of memory metal air outlet pipes are embedded in the outer side of the shell, and the memory metal air outlet pipes are normally curved and can send the airflow in the shell upwards for recycling.

[0011] Preferably, a plurality of semiconductor refrigerators are embedded in the top of the cover, the refrigerating surfaces of the semiconductor refrigerators are located inside the cooling cavity and in front of the fans, the heat dissipation surfaces of the semiconductor refrigerators are located on the top of the cover, a plurality of air holes are arranged on the side of the cooling cavity, and the negative pressure air guide mechanism is connected to the cooling cavity through the air holes.

[0012] Preferably, the negative pressure air guide mechanism includes three Venturi units, the Venturi units are arranged in series, the Venturi unit includes a converging section, a throat, and a diffuser section, the converging section, the throat, and the diffuser section are fixedly connected in sequence, two negative pressure pipes are connected to the bottom side of the throat, the two negative pressure pipes are made of flexible material, the Venturi units are connected in series, the diffuser section of each unit is fixed to the converging section of the next unit through a flange and a sealing ring, the airflow is smooth, and the negative pressure pipe of the throat is made of silica gel hose.

[0013] Preferably, a plurality of fixed plates are fixedly installed at the bottom of the cover, an arc-shaped socket is arranged on each fixed plate, and the throat is fixed to the bottom of the cover through the arc-shaped socket.

[0014] Preferably, the air guide and blowing mechanism includes a bent pipe, the bent pipe is fixedly connected to the negative pressure air guide mechanism, the bent pipe is curved, a flexible hose is connected to the tail end of the bent pipe, a duckbill blowing nozzle is connected to the flexible hose, and the duckbill blowing nozzle is arranged obliquely.

[0015] Preferably, the bottom side of the elbow pipe is fixedly communicated with a flexible hose, the inner side of the flexible hose is fixedly communicated with a memory metal spring, the top end of the memory metal spring is fixedly connected with the bottom side of the duckbill mouth, and the bottom side of the support is provided with a heat-conducting groove, which is located below the memory metal spring.

[0016] Preferably, the heat-conducting structure comprises a heat-conducting cavity fixedly installed on the bottom inner wall of the shell and located below the circuit board, a plurality of heat dissipation fins are fixedly arranged on the top of the heat-conducting cavity, a conductive core is arranged in each of the heat dissipation fins, a heat-conducting strip is fixedly arranged in the heat-conducting cavity, the plurality of conductive cores are connected with the heat-conducting strip, a heat-conducting core is connected with the heat-conducting strip, a support cylinder is fixedly installed on the top of the heat-conducting cavity and matched with the heat-conducting groove, and the heat-conducting core is located in the support cylinder.

[0017] Compared with the prior art, the application has the following beneficial effects: The application utilizes Bernoulli's principle to generate local negative pressure at the throat, forming passive and strong suction force, which can accurately and efficiently suck out hot air in the airflow stagnation area of the bottom of the circuit board chip and the gap between high-density elements that cannot be reached by traditional air cooling, and fundamentally solves the industry problem of overheating in the "dead zone". Compared with the traditional method of simply increasing fan pressure or air volume, the application realizes the transformation of the cooling mode from "blowing" to "suction and blowing", which is an innovation in cooling principle, and the heat dissipation efficiency is significantly improved.

[0018] The application realizes passive and adaptive adjustment of the outlet angle through the coupling design of the memory metal spring and the heat-conducting structure. When the local element temperature rises, the system can automatically switch the cooling air flow from the "long-distance scattering" mode to the "short-distance focusing" mode, realize on-demand allocation of cooling resources, effectively prevent local overheating, and ensure the temperature uniformity of the whole system. Without additional sensors and controller drivers, the response is rapid and the structure is reliable, solving the problem that the fixed air duct cannot adapt to dynamic heat load changes.

[0019] Through the design of the memory metal air outlet pipe, the system can automatically select heat recovery or direct discharge mode according to the exhaust temperature. At low load, part of the low-temperature exhaust gas is recovered to reduce refrigeration energy consumption; at high load, high-temperature exhaust gas is directly discharged to prevent heat backflow. The energy recovery concept is combined with intelligent temperature control materials to realize energy-saving operation under the premise of ensuring heat dissipation effect, meeting the current green computing and data center "double carbon" target requirements.

[0020] The application is not a single technology stack, but actively cools, Venturi effect, adaptive directional air supply and intelligent heat emission are organically integrated into a complete system, and the advantages of cooling technologies at all levels are complementary and synergistic. Provide a system-level heat dissipation solution, break through the performance bottleneck of single cooling technology, and better meet the growing thermal management needs of future high-performance servers.

[0021] The application combines the Venturi negative pressure suction principle with the adaptive air duct adjustment technology based on memory metal, effectively solves the two technical bottlenecks of heat dead zone removal and dynamic heat load adaptation in traditional server air cooling, and through the construction of a multi-level collaborative intelligent cooling system, the device can greatly improve the heat dissipation efficiency, operation stability and reliability of the server without significantly increasing energy consumption. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a front view structural schematic diagram of the application; Figure 2 It is a bottom view structural schematic diagram of the application; Figure 3 It is a structural schematic diagram of the separation of the machine shell and the machine cover of the application; Figure 4 It is a bottom view structural schematic diagram of the separation of the machine shell and the machine cover of the application; Figure 5 It is a structural schematic diagram of the machine cover, cooling cavity, negative pressure air guide mechanism, air guide blowing mechanism, heat conduction structure and related parts thereof of the application; Figure 6 It is a bottom view structural schematic diagram of the machine cover, cooling cavity, negative pressure air guide mechanism, air guide blowing mechanism, heat conduction structure and related parts thereof of the application; Figure 7 It is a structural schematic diagram of the machine cover, air guide blowing mechanism, heat conduction structure and related parts thereof of the application; Figure 8 It is a bottom view structural schematic diagram of the machine cover, air guide blowing mechanism, heat conduction structure and related parts thereof of the application; Figure 9 It is a structural schematic diagram of the negative pressure air guide mechanism and the air guide blowing mechanism of the application; Figure 10 It is a bottom view structural schematic diagram of the negative pressure air guide mechanism and the air guide blowing mechanism of the application; Figure 11 It is a perspective structural schematic diagram of the machine cover, cooling cavity, fixing plate and related parts thereof of the application; Figure 12 It is a structural schematic diagram of the heat conduction structure of the application; Figure 13 It is a sectional view structural schematic diagram of the heat conduction structure of the application.

[0023] The components include: 1. Housing; 11. Air inlet; 12. Controller panel; 13. Circuit board; 14. Temperature sensor; 15. Rear panel; 2. Cover; 21. Fixing plate; 22. Arc-shaped bayonet; 3. Memory metal exhaust pipe; 4. Semiconductor cooler; 5. Cooling chamber; 51. Air vent; 6. Negative pressure air guiding mechanism; 60. Venturi tube unit; 601. Converging section; 602. Throat; 603. Diffusion section; 604. Negative pressure pipe; 7. Air guiding and blowing mechanism; 71. Bend; 72. Flexible hose; 73. Duckbill nozzle; 74. Support component; 741. Heat conduction groove; 75. Memory metal spring; 8. Fan; 9. Heat conduction structure; 91. Heat conduction chamber; 92. Heat dissipation fins; 93. Support cylinder; 94. Heat conduction core; 95. Heat conduction strip; 96. Conductive core. Detailed Implementation

[0024] To make the technical means, creative features, and achieved objectives and effects of this invention easier to understand, the invention is further described below with reference to specific embodiments. However, the following embodiments are merely preferred embodiments of this invention and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described herein without creative effort are all within the protection scope of this invention. Unless otherwise specified, the experimental methods in the following embodiments are conventional methods, and the materials and reagents used in the following embodiments are commercially available unless otherwise specified. Example

[0025] like Figures 1-13 As shown, this invention provides an airflow device for a high-performance server, including a housing 1, multiple sets of negative pressure airflow mechanisms 6, multiple sets of airflow blowing mechanisms 7, and multiple sets of heat-conducting structures 9. A cover 2 is screwed onto the top of the housing 1. A circuit board 13 is disposed inside the housing 1, and multiple electrical components are mounted on the circuit board 13. A controller panel 12 and a rear panel 15 are connected to the circuit board 13. Multiple temperature sensors 14 are mounted on the circuit board 13. The multiple sets of negative pressure airflow mechanisms 6 are all installed at the bottom of the cover 2, and the same... A cooling chamber 5 is installed at the bottom of the cover 2. Multiple sets of fans 8 are installed in the cooling chamber 5. The multiple sets of fans 8 are arranged one-to-one with multiple sets of negative pressure air guiding mechanisms 6. Multiple sets of air guiding and blowing mechanisms 7 are fixedly connected to the multiple sets of negative pressure air guiding mechanisms 6. Multiple sets of heat conduction structures 9 are all arranged on the bottom inner wall of the casing 1, and are arranged one-to-one with the multiple sets of air guiding and blowing mechanisms 7. Multiple air inlets 11 are opened on the outer side of the casing 1, and the multiple air inlets 11 are arranged corresponding to the cooling chamber 5. There are at least 3 sets of multiple sets of negative pressure air guiding mechanisms 6, multiple sets of air guiding and blowing mechanisms 7, and multiple sets of fans 8.

[0026] Specifically, the shell 1 and the cover 2 provide structural support and a sealed environment to protect the internal components. The cover facilitates maintenance access. The shell is made of aluminum alloy, 2-4 mm thick, with surface anodizing treatment; the cover is a stamped steel plate, 2-3 mm thick, fixed by M4 screws. The shell 1 bottom is increased with shock pad to reduce vibration; the cover inside is attached with EMI shielding layer to prevent electromagnetic interference.

[0027] The temperature sensor 14 adopts a DS18B20 digital sensor with an accuracy of ±0.5°C, installed near each chip with a sampling frequency of 1 Hz.

[0028] The controller panel 12 adopts an ARM Cortex-M4 microprocessor supporting the Modbus communication protocol; the rear panel includes a gigabit Ethernet port and a USB 3.0 interface, and the controller panel 12 is integrated with an LCD display screen to display the temperature curve and cooling status in real time.

[0029] As shown in Figures 1-3 In this embodiment, the outer side of the shell 1 is embedded with multiple memory metal air outlet pipes 3, which are normally curved and can send the airflow inside the shell 1 upwards for recycling. If the temperature is too high, the memory metal air outlet pipe 3 will stretch straight due to heat and discharge the hot air itself.

[0030] Specifically, the memory metal air outlet pipe 3 is made of nickel-titanium alloy thermal shape memory material, with a transition temperature set to 40°C. At low temperature <40°C, it remains in a curved state, and the airflow is directed to the top of the cover, and part of the recycled air is discharged through the auxiliary backflow hole designed on the cover; at high temperature ≥40°C, it stretches straight and is discharged horizontally to avoid hot air backflow.

[0031] In this embodiment, another implementation can also increase a guide baffle on the top of the cover 2 to guide the airflow in a curved state to flow towards the air inlet hole, enhancing the cooling air recycling efficiency.

[0032] As shown in Figures 1-5 In this embodiment, the top of the cover 2 is embedded with multiple semiconductor coolers 4, the cooling surfaces of which are located inside the cooling cavity 5 and in front of the fan 8, and the heat dissipation surfaces of which are located on the top of the cover 2. The side of the cooling cavity 5 is provided with multiple groups of air holes 51, and the negative pressure air guide mechanism 6 is connected with the cooling cavity 5 through the air holes 51. The semiconductor cooler 4 actively cools, and the cooling cavity 5 cools the inhaled air.

[0033] Specifically, the semiconductor cooler 4 is model TEC1-12706, with a maximum cooling power of 60W and a working voltage of 12V DC; the cooling cavity is made of aluminum profile, with a volume of 0.5L and nickel-plated inner wall to enhance heat conduction.

[0034] More specifically, the semiconductor refrigerator 4 heat dissipation surface can be connected with copper heat dissipation fins, and equipped with a small fan for forced air cooling.

[0035] As shown in Figures 8-10 the embodiment, the negative pressure air guide mechanism 6 includes three sets of Venturi units 60, which are spliced and arranged, and the Venturi units 60 include converging sections 601, throat sections 602, and diffusion sections 603, which are sequentially fixed and communicated, and the bottom side of the throat section 602 is communicated with two negative pressure pipes 604, both of which are made of flexible material.

[0036] Specifically, the Venturi units are connected in series, the diffusion section 603 of each unit is fixed with the converging section 601 of the next unit through flanges and sealing rings to ensure smooth airflow, and the negative pressure pipe 604 of the throat section 602 is made of silica gel hose.

[0037] As shown in Figure 11 the embodiment, the bottom of the cover 2 is fixedly installed with a plurality of fixed plates 21, and the fixed plates 21 are all provided with arc-shaped sockets 22, and the throat section 602 is fixed at the bottom of the cover 2 through the arc-shaped sockets 22.

[0038] Specifically, the Venturi unit 60 is injection molded by ABS plastic, and negative pressure is generated in the throat section by the Venturi effect to suck hot air in the dead zone.

[0039] More specifically, the Venturi units are connected in series, and each unit is independently fixed on the fixed plate 21, and the fixed plate is made of stainless steel, and the radius of the arc-shaped socket 22 matches the outer diameter of the Venturi unit.

[0040] As shown in Figures 7-10 the embodiment, the air guide and blowing mechanism 7 includes a bent pipe 71, which is fixedly communicated with the negative pressure air guide mechanism 6, the bent pipe 71 is a curved structure, the tail end of the bent pipe 71 is communicated with a flexible hose 72, the flexible hose 72 is communicated with a duckbill blow nozzle 73, the duckbill blow nozzle 73 is inclined, the bottom side of the bent pipe 71 is fixedly communicated with the flexible hose 72, the inner side of the flexible hose 72 is fixedly communicated with a memory metal spring 75, the top end of the memory metal spring 75 is fixedly connected with the bottom side of the duckbill blow nozzle 73, the bottom side of the support 74 is provided with a heat conduction groove 741, and the heat conduction groove 741 is located below the memory metal spring 75.

[0041] Specifically, the memory metal spring is made of copper-zinc-aluminum memory alloy, and the transition temperature is 35°C. When the temperature is <35°C, the spring is in an elongated state, and the duckbill blow nozzle 73 is kept inclined upward; when the temperature is ≥35°C, the spring is shortened, and the duckbill blow nozzle is pulled to be inclined downward. This ensures targeted cooling of close-range elements.

[0042] Further, the air guide and blowing mechanism 7 guides the cooling air flow to the circuit board and automatically adjusts the blowing angle through the memory metal spring 75.

[0043] Specifically, the elbow pipe 71 is made of PVC material, the flexible hose 72 is a corrugated silica gel pipe, the duckbill blowpipe 73 has an initial inclination angle of 45°, and the duckbill blowpipe 73 is a flat seam or circular air pipe for concentrating air flow for long-distance.

[0044] More specifically, the support 74 is made of aluminum, and the heat conduction groove 741 has a depth of 5 mm and is in close contact with the heat conduction core 94.

[0045] As shown in Figure 12 , Figure 13 In this embodiment, the heat conduction structure 9 includes a heat conduction cavity 91 fixedly installed on the inner wall of the bottom of the casing 1 and located below the circuit board 13. The top of the heat conduction cavity 91 is fixedly provided with a plurality of heat dissipation fins 92, the inside of each of the plurality of heat dissipation fins 92 is provided with a conduction core 96, the inside of the heat conduction cavity 91 is fixedly provided with a heat conduction strip 95, each of the plurality of conduction cores 96 is connected with the heat conduction strip 95, the heat conduction strip 95 is connected with a heat conduction core 94, the top of the heat conduction cavity 91 is fixedly installed with a support cylinder 93 and is matched with the heat conduction groove 741, and the heat conduction core 94 is located inside the support cylinder 93.

[0046] Specifically, the heat dissipation fin 92 is connected with the heat conduction strip 95 by welding, the heat conduction strip 95 is made of copper and has a heat conduction coefficient of 385 W / mK. The heat conduction core 94 is directly embedded in the support cylinder 93 and is in contact with the heat conduction groove 741, so as to ensure that the heat is quickly transferred to the memory metal spring. The support cylinder 93 is made of ceramic material and is insulated and heat-resistant.

[0047] Working mode: when in use, the power supply and the controller panel 12 are turned on, the multiple sets of temperature sensors 14, the multiple sets of semiconductor refrigerators 4, and the multiple sets of fans 8 are connected with the controller panel 12, the temperature of the circuit board 13 is monitored through the multiple sets of temperature sensors 14, the outside air is sucked into the inside of the cooling cavity 5 through the air inlet hole 11 by the working fan 8, the multiple semiconductor refrigerators 4 cool the inside of the cooling cavity 5 to form a cold cavity, the cooled air enters the negative pressure air guide mechanism 6 and flows through the multiple sets of Venturi units 60, first enters the converging section 601, then passes through the throat section 602, and finally passes through the diffusing section 603 to enter the next stage, when the cooling air flow passes through the Venturi unit 60, according to Bernoulli's principle, the flow rate is the largest and the static pressure is the lowest at the throat section 602, thereby a local negative pressure area is generated at the throat section, the hot air accumulated in the dead zone at the bottom of the chip is forcibly sucked out through the negative pressure pipe 604, and the hot air is sucked into the throat section 602 of the Venturi tube instantaneously, mixed with the high-speed main air flow, and taken away, since the temperature of the main air flow is relatively low, the heat exchange is also accelerated, the design of the multiple sets of Venturi units 60 can suck the electrical elements on the circuit board 13 in a large range, the air flow enters the inside of the elbow pipe 71, is turned through the elbow pipe 71, and then is sprayed to the circuit board 13 through the flexible hose 72 and the duckbill blow nozzle 73 for reverse blowing and temperature reduction, the duckbill blow nozzle 73 initially blows air to the distant elements; if the near-distance elements are overheated, the heat is conducted to the memory metal spring 75 through the heat conduction structure 9, absorbed by the heat dissipation fin 92, conducted to the heat conduction strip 95 through the heat conduction core 96, and then conducted to the heat conduction groove 741 through the heat conduction core 94, so that the memory metal spring 75 is heated and shrinks to deform, the memory metal spring 75 shrinks to pull the duckbill blow nozzle 73 to tilt downward, and the near-distance electrical elements on the circuit board 13 can be blown and cooled, until the temperature is reduced, the memory metal spring 75 cools to recover to the initial state, and the duckbill blow nozzle 73 resets to continue blowing air to the distant electrical elements for temperature reduction. The discharged gas is discharged through the multiple memory metal gas outlet pipes 3, if the temperature of the discharged gas is relatively low, the gas is conducted upward through the multiple memory metal gas outlet pipes 3, and the air suction through the air inlet hole 11 can be partially recycled, and if the temperature of the discharged gas is relatively high, the multiple sets of memory metal gas outlet pipes 3 will deform to be in a horizontal state, and the high-temperature gas can be discharged in a large amount. The temperature of the circuit board 13 is monitored and fed back through the multiple sets of temperature sensors 14 arranged, the power of the multiple sets of semiconductor refrigerators 4 and the multiple sets of fans 8 is adjusted through the controller panel 12, the air guide cooling effect is improved or reduced, the controller panel 12 integrates the transition temperature parameters of the memory metal element, and the behavior is predicted in the control algorithm. For example, when the temperature approaches 35°C, the fan power is increased in advance to delay the change of the duckbill blow nozzle angle and improve the response efficiency. Embodiment

[0048] The embodiment is further optimized on the basis of the embodiment one, and the same parts as the foregoing technical solutions will not be described herein again. Further, in order to better realize the present application, the following setting mode is particularly adopted: in the embodiment, the recovery effect of the memory metal air outlet pipe 3 depends on the external airflow, which can be unstable. A set of backflow fans can be selected at the top of the cover 2. When the memory metal air outlet pipe is bent, the backflow fans run at low speed, and part of the exhaust airflow is guided to the air inlet hole 11. When the air outlet pipe is straightened, the backflow fans are closed. At the same time, the controller panel 12 optimizes the backflow strategy according to the data of the temperature sensor 14.

[0049] Although embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, replacements and changes can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-performance server airflow guide device, characterized in that: include: The housing (1) has a cover (2) installed on the top of the housing (1) by screws. The inside of the housing (1) is provided with a circuit board (13). Multiple electrical components are provided on the circuit board (13). A controller panel (12) and a rear panel (15) are connected to the circuit board (13). Multiple temperature sensors (14) are provided on the circuit board (13). Multiple sets of negative pressure air guiding mechanisms (6) are installed at the bottom of the cover (2). The multiple sets of negative pressure air guiding mechanisms (6) are connected to the same cooling chamber (5). The cooling chamber (5) is installed at the bottom of the cover (2). Multiple sets of fans (8) are installed in the cooling chamber (5). The multiple sets of fans (8) are arranged one-to-one with the multiple sets of negative pressure air guiding mechanisms (6). Multiple sets of air guiding and blowing mechanisms (7) are fixedly connected to multiple sets of negative pressure air guiding mechanisms (6); Multiple sets of heat conduction structures (9) are all set on the bottom inner wall of the casing (1), and are set one-to-one with multiple sets of air blowing mechanisms (7).

2. The airflow guide device for a high-performance server according to claim 1, characterized in that: The outer side of the housing (1) is provided with multiple air inlets (11), and the multiple air inlets (11) are correspondingly arranged with the cooling chamber (5).

3. The airflow guide device for a high-performance server according to claim 1, characterized in that: The outer side of the casing (1) is embedded with multiple memory metal vent pipes (3), and all of the memory metal vent pipes (3) have a curved structure.

4. The airflow guide device for a high-performance server according to claim 3, characterized in that: The top of the cover (2) is embedded with multiple semiconductor coolers (4). The cooling surfaces of the multiple semiconductor coolers (4) are all located inside the cooling cavity (5) and in front of the fan (8). The heat dissipation surfaces of the multiple semiconductor coolers (4) are all located on the top of the cover (2).

5. The airflow guide device for a high-performance server according to claim 1, characterized in that: The negative pressure air guiding mechanism (6) includes three sets of venturi units (60), which are spliced ​​together. Each venturi unit (60) includes a converging section (601), a throat (602), and a diffuser section (603). The converging section (601), throat (602), and diffuser section (603) are fixedly connected in sequence. The bottom side of the throat (602) is connected to two negative pressure pipes (604), both of which are made of flexible material.

6. The airflow guide device for a high-performance server according to claim 5, characterized in that: The bottom of the cover (2) is fixedly installed with multiple fixing plates (21), and each fixing plate (21) has an arc-shaped slot (22). The throat (602) is fixed to the bottom of the cover (2) through the arc-shaped slot (22).

7. The airflow guide device for a high-performance server according to claim 1, characterized in that: The air blowing mechanism (7) includes a bend (71), which is fixedly connected to the negative pressure air blowing mechanism (6). The bend (71) has a curved structure, and the tail end of the bend (71) is connected to a flexible hose (72). The flexible hose (72) is connected to a duckbill nozzle (73), which is inclined.

8. The airflow device for a high-performance server according to claim 7, characterized in that: The bottom side of the bent tube (71) is fixedly connected to a flexible hose (72), and the inner side of the flexible hose (72) is fixedly connected to a memory metal spring (75). The top end of the memory metal spring (75) is fixedly connected to the bottom side of the duckbill mouth (73). The bottom side of the support member (74) is provided with a heat conduction groove (741), and the heat conduction groove (741) is located below the memory metal spring (75).

9. The airflow guide device for a high-performance server according to claim 8, characterized in that: The heat-conducting structure (9) includes a heat-conducting cavity (91), which is fixedly installed on the bottom inner wall of the housing (1) and located below the circuit board (13). Multiple heat dissipation fins (92) are fixedly provided on the top of the heat-conducting cavity (91), and each of the multiple heat dissipation fins (92) is provided with a conductive core (96). A heat-conducting strip (95) is fixedly provided inside the heat-conducting cavity (91), and the multiple conductive cores (96) are connected to the heat-conducting strip (95). A heat-conducting core (94) is connected to the heat-conducting strip (95). A support cylinder (93) is fixedly installed on the top of the heat-conducting cavity (91) and is adapted to the heat-conducting groove (741). The heat-conducting core (94) is located inside the support cylinder (93).

10. The airflow guide device for a high-performance server according to claim 9, characterized in that: The cooling chamber (5) has multiple sets of air holes (51) on its side, and the negative pressure air guiding mechanism (6) is connected to the cooling chamber (5) through the air holes (51).

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