IGBT module packaging apparatus based on fusion welding and bubble control method

Abstract

The application discloses a melting welding-based IGBT module packaging device and bubble control method, relates to the technical field of IGBT processing, and comprises a glue dispensing assembly installed on a machine body, the machine body is connected with a mounting cover, a guide plate is rotationally connected in the mounting cover, an upper limiting plate is arranged on the machine body, and side limiting plates are slidably connected with supporting rods. The application has the advantages that the two side limiting plates are used for limiting the side surface of the IGBT module, the upper limiting plate is arranged to limit the upper surface of the IGBT module, the IGBT module is limited before entering the glue dispensing assembly, the IGBT module is prevented from being turned over and tilted before entering the working range of the glue dispensing assembly, the phenomenon of glue dispensing failure caused by the turning over and tilting is avoided, the reliability of the device is improved, the angle of the guide plate is changed, the direction of the hot air sprayed from the air outlet pipe is changed, the phenomenon of partial overheating and then welding failure is avoided, and the reliability of the device is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of IGBT processing, in particular to an IGBT module packaging device based on fusion welding and a bubble control method. BACKGROUND

[0002] The IGBT based on fusion welding is obtained by heating solder (such as nano-silver paste, tin-lead alloy, etc.) to a molten state to realize metallurgical bonding between a chip and a substrate and other key components.

[0003] In the prior art, the applicant has found, through retrieval, a packaging device for nano-silver paste IGBT processing with the application number 202221839631.9, which specifically relates to the technical field of nano-silver paste IGBT processing and comprises a base frame, a feeding mechanism fixedly installed at the top end of the base frame, a plurality of IGBT module housings provided on the feeding mechanism, a dispensing assembly fixedly installed at one side of the top end of the feeding mechanism, a drying assembly fixedly installed at the side of the top end of the feeding mechanism away from the dispensing assembly, and the dispensing assembly comprising a dispensing support in an L-shaped structure, a linear electric cylinder fixedly clamped to the inner upper wall of the dispensing support, a lifting rod fixedly installed at the driving end of the linear electric cylinder, and a mounting seat fixedly installed at the driving end of the lifting rod. The present application improves the dispensing efficiency of the IGBT module housing by setting the dispensing assembly, cooperating with the feeding mechanism to automatically transport the plurality of IGBT module housings, and automatically dispensing the IGBT module housing, so as to facilitate the subsequent packaging of the IGBT module.

[0004] However, when the IGBT module is placed on the conveying mechanism, the IGBT module may be offset, turned over and tilted due to vibration, which may cause subsequent dispensing failure. Therefore, the application provides an IGBT module packaging device based on fusion welding. SUMMARY

[0005] The application aims to provide an IGBT module packaging device based on fusion welding and a bubble control method.

[0006] To achieve the above-mentioned purpose, the application provides the following technical scheme: an IGBT module packaging device based on fusion welding, comprising a dispensing assembly installed on a machine body, a mounting cover connected to the machine body, a guide plate rotatably connected in the mounting cover, and an air outlet pipe connected to the guide plate.

[0007] The body is provided with an upper limiting plate, a moving plate and a side limiting plate, the body is connected with a supporting rod and a limiting rod, the body is rotationally connected with a side rotating mechanism, the side rotating mechanism is threadedly connected with the upper limiting plate, the upper limiting plate is slidably connected with the limiting rod on the side, the upper limiting plate is rotationally connected with a worm, the worm is meshed with a worm wheel on the side, the worm wheel is connected with a screw rod on the side, and the screw rod is threadedly connected with the moving plate.

[0008] The side limiting plate is slidably connected with the supporting rod, a limiting groove is formed in the side of the side limiting plate, and a limiting block is arranged in the limiting groove.

[0009] As a further scheme of the present application, the mounting cover is provided with a connecting hose, the mounting cover is connected with a heat-conducting frame, a heating rod is arranged in the heat-conducting frame, and a fan is arranged on the heat-conducting frame.

[0010] As a further scheme of the present application, the mounting cover is provided with a connecting hose, the mounting cover is connected with a heat-conducting frame, a heating rod is arranged in the heat-conducting frame, and a fan is arranged on the heat-conducting frame.

[0011] As a further scheme of the present application, the heat-conducting frame is connected with a connecting pipe on the side, and the connecting pipe is connected with the connecting hose in the mounting cover.

[0012] As a further scheme of the present application, the connecting hose is connected with the air outlet pipe on the other end.

[0013] As a further scheme of the present application, the screw rod is fixedly connected with a circular plate on the other end, and the circular plate is in a circular plate structure.

[0014] As a further scheme of the present application, the limiting block is in an "L" plate structure, the limiting block slides along the limiting groove, and the limiting groove is in an "L" groove structure.

[0015] As a further scheme of the present application, a IGBT module packaging bubble control method based on fusion welding comprises the following steps:

[0016] S1, preheating and degassing: the air in the heat-conducting frame is heated to 120-150 DEG C through the heating rod, the fan is started to make hot air sprayed out from the air outlet pipe through the connecting pipe and the connecting hose, the servo motor drives the guide plate to rotate to 45 DEG with the surface of the IGBT module, the module welding area is preheated for 30-60s, and the volatile gas remaining in the solder is discharged by using the hot air flow;

[0017] S2, glue dispensing temperature control: when the glue dispensing assembly is working, the hot air temperature of the air outlet pipe is kept at 180-200 DEG C, the air flow direction is covered through the guide plate to cover the glue dispensing area, so that the solder is kept in a molten state (viscosity 300-500 cP) during glue dispensing, and the bubble wrapping caused by sudden temperature drop is reduced.

[0018] S3, gradient curing: after glue dispensing is completed, the heating rod is controlled to gradually reduce the hot air temperature (temperature drop rate 5-10 DEG C / min), and the servo motor drives the guide plate to reciprocate (angle range 30-60 DEG), so that the hot air uniformly acts on the surface of the solder, promotes the bubble to float out, and the curing is completed until the temperature drops to below 80 DEG C.

[0019] As a further scheme of the application: in S1, the air speed of the hot air is controlled to be 2-3 m / s, the IGBT module is limited by the side limiting plate and the upper limiting plate, and the distance between the module and the air outlet pipe is kept at 50-80 mm, and the temperature difference on the surface of the module during preheating is ≤5 DEG C.

[0020] As a further scheme of the application: in S2, the glue outlet pressure of the glue dispensing assembly is 0.2-0.3 MPa, the glue outlet speed is linked with the hot air flow (flow ratio 1:1.5); when bubbles appear on the surface of the solder (through image recognition), the servo motor drives the guide plate to focus the hot air on the bubble area, and the local temperature is raised to 220-230 DEG C for 5-10 s, so as to promote the bubble to break and discharge.

[0021] Compared with the prior art, the application has the following advantages:

[0022] 1、The IGBT module is limited by the two side limiting plates, and the upper surface of the IGBT module is limited by the upper limiting plate, so that the IGBT module is prevented from tilting before entering the glue dispensing assembly, and the phenomenon of glue dispensing failure caused by tilting is avoided, and the reliability of the device is improved.

[0023] 2、The air in the heat conduction frame is heated by the heating rod, the air is discharged into the heat conduction frame by starting the fan, the hot air flows into the connecting hose through the connecting pipe, the hole is opened on the air outlet pipe, the servo motor is started to drive the guide plate to change the angle, the direction of the hot air sprayed by the air outlet pipe is changed, the IGBT module can be uniformly dried and heated, the phenomenon of local overheating and delamination is avoided, and the reliability of the device is improved.

[0024] Additional advantages, objects, and features of the application will be apparent from the following description, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the device in the embodiment of the application;

[0026] Figure 2 It is a schematic diagram of the partial structure of the device in the embodiment of the application;

[0027] Figure 3 It is a schematic diagram of the partial structure of the device in the embodiment of the application; Figure 2 It is a schematic diagram of the partial structure of the device in the embodiment of the application;

[0028] Figure 4 It is a schematic diagram of the partial structure of the device in the embodiment of the application; Figure 2 It is a schematic diagram of the partial structure of the device in the embodiment of the application;

[0029] Figure 5 It is a schematic diagram of the partial structure of the device in the embodiment of the application.

[0030] In the figure: 1, machine body; 2, dispensing assembly; 3, mounting cover; 4, heat conduction frame; 5, heating rod; 6, fan; 7, connecting pipe; 8, connecting hose; 9, air outlet pipe; 10, guide plate; 11, servo motor; 12, limiting rod; 13, side rotating mechanism; 14, upper limiting plate; 15, worm; 16, worm gear; 17, screw rod; 18, moving plate; 19, limiting block; 20, side limiting plate; 21, limiting groove; 22, support rod; 23, round plate. DETAILED DESCRIPTION

[0031] The specific embodiments of the application will be further described below with reference to the accompanying drawings, and it should be noted that the description of these embodiments is used to help understand the application, but does not constitute a limitation on the application.

[0032] In addition, the technical features involved in each of the embodiments of the application described below can be combined with each other as long as they do not conflict with each other.

[0033] Please refer to the accompanying drawings Figure 1 - the accompanying drawings Figure 5The application is based on a molten welding IGBT module packaging device, which comprises a dispensing assembly 2 installed on a body 1, a mounting cover 3 connected to the body 1, a guide plate 10 rotatably connected in the mounting cover 3, an air outlet pipe 9 connected to the guide plate 10, an upper limiting plate 14, a moving plate 18 and a side limiting plate 20 arranged on the body 1, a supporting rod 22 and a limiting rod 12 connected to the body 1, a side rotating mechanism 13 rotatably connected to the body 1, the side rotating mechanism 13 being threadedly connected with the upper limiting plate 14, the limiting rod 12 being slidably connected to the side surface of the upper limiting plate 14, a worm 15 rotatably connected to the upper limiting plate 14, the side surface of the worm 15 being engaged with a worm wheel 16, a screw rod 17 connected to the side surface of the worm wheel 16, the screw rod 17 being threadedly connected with the moving plate 18, the side limiting plate 20 being slidably connected with the supporting rod 22, a limiting groove 21 being formed in the side surface of the side limiting plate 20, a limiting block 19 arranged in the limiting groove 21, the other end of the limiting block 19 being connected to the side surface of the moving plate 18. In specific use, the worm 15 is rotated, the worm 15 is engaged with the worm wheel 16, the screw rods 17 fixedly connected to the two sides of the worm wheel 16 have opposite thread directions, the screw rod 17 is rotated along the thread hole formed in the moving plate 18 by rotating the worm wheel 16, the two side limiting plates 20 are moved closer to or farther away from each other along the supporting rod 22, the distance between the two side limiting plates 20 can be changed, the side surfaces of the IGBT modules are limited by the two side limiting plates 20, the side rotating mechanism 13 is rotated along the thread hole formed in the upper limiting plate 14 by rotating the side rotating mechanism 13, the upper limiting plate 14 is moved up and down along the limiting rod 12, the upper surface of the IGBT module is limited by the upper limiting plate 14, the IGBT module before entering the dispensing assembly 2 is limited, and the IGBT module can be prevented from being turned over or tilted before entering the working range of the dispensing assembly 2.

[0034] In example one, the other end of the screw rod 17 is fixedly connected with a circular plate 23, the circular plate 23 has a circular plate structure, and the moving position of the side limiting plate 20 is limited by the circular plate 23.

[0035] The limiting block 19 has an "L" shaped plate structure, the limiting block 19 is slid along the limiting groove 21, the limiting groove 21 has an "L" shaped groove structure, and the limiting block 19 is slid up and down along the limiting groove 21. The moving plate 18 is limited by the limiting block 19.

[0036] In example two, the mounting cover 3 is provided with a connecting hose 8, the mounting cover 3 is connected with a heat conduction frame 4, the heat conduction frame 4 is installed with a heating rod 5, the heat conduction frame 4 is installed with a fan 6, the air in the heat conduction frame 4 is heated by the heating rod 5, and the air is discharged into the heat conduction frame 4 by starting the fan 6.

[0037] The heat conduction frame 4 is connected with a connecting pipe 7, the other end of the connecting pipe 7 penetrates into the mounting cover 3 and is connected with the connecting hose 8, so that the hot air flows into the connecting hose 8 through the connecting pipe 7.

[0038] The other end of the connecting hose 8 is connected with the air outlet pipe 9, and the heating and curing of the glue-dropping part of the IGBT module is carried out through the holes formed on the air outlet pipe 9.

[0039] The side surface of the mounting cover 3 is fixedly connected with a servo motor 11, the transmission shaft of the servo motor 11 is fixedly connected with the side surface of the guide plate 10, and the servo motor 11 can be started to drive the guide plate 10 to change the angle during the process, so that the direction of the hot air sprayed out of the air outlet pipe 9 is changed, the IGBT module can be uniformly dried and heated, and the phenomenon of local overheating and local overheating caused by local uneven heating is avoided, and the reliability of the device is improved.

[0040] The application also comprises an IGBT module packaging bubble control method based on fusion welding, comprising the following steps:

[0041] S1, preheating and degassing: the air in the heat conduction frame 4 is heated to 120-150 DEG C through the heating rod 5, the fan 6 is started to make the hot air sprayed out of the air outlet pipe 9 through the connecting pipe 7 and the connecting hose 8, the servo motor 11 drives the guide plate 10 to rotate to 45 DEG with the surface of the IGBT module, the welding area of the module is preheated for 30-60s, and the volatile gas remaining in the solder is discharged by using the hot air flow;

[0042] S2, glue-dropping temperature control: when the glue-dropping assembly 2 works, the hot air temperature of the air outlet pipe 9 is kept at 180-200 DEG C, the air flow direction is adjusted by the guide plate 10 to cover the glue-dropping area, so that the solder keeps a molten state (viscosity 300-500 cP) during the glue-dropping process, and the bubble wrapping caused by sudden temperature drop is reduced.

[0043] S3, gradient curing: after the glue-dropping is completed, the heating rod 5 is controlled to gradually reduce the hot air temperature (temperature reduction rate 5-10 DEG C / min), and at the same time, the servo motor 11 drives the guide plate 10 to reciprocate (angle range 30 DEG-60 DEG), so that the hot air uniformly acts on the surface of the solder, promotes the bubble to float and escape, and completes the curing until the temperature is reduced to below 80 DEG C.

[0044] In S1, the wind speed of the hot air is controlled to be 2-3 m / s, the IGBT module is limited by the side limiting plate 20 and the upper limiting plate 14, and the distance between the module and the air outlet pipe 9 is kept at 50-80 mm, and the temperature difference of the module surface during the preheating process is ≤5 DEG C.

[0045] In S2, the glue-dropping pressure of the glue-dropping assembly 2 is 0.2-0.3 MPa, the glue-dropping speed and the hot air flow are linked to adjust (flow ratio 1:1.5); when it is detected that bubbles appear on the surface of the solder (through image recognition), the servo motor 11 drives the guide plate 10 to focus the hot air to the bubble area, and the local temperature is raised to 220-230 DEG C for 5-10s, so as to promote the bubble to break and discharge.

[0046] Working principle:

[0047] Firstly, the IGBT module side is limited by two side limiting plates 20, the upper surface of the IGBT module is limited by setting the upper limiting plate 14, the IGBT module before entering the point gluing assembly 2 is limited, the above can prevent the IGBT module from turning over and tilting before entering the working range of the point gluing assembly 2, and the phenomenon of point gluing failure caused by the above, improve the reliability of the device, change the direction of the hot air sprayed by the air outlet pipe 9 by starting the servo motor 11 to drive the guide plate 10 to change the angle, can uniformly dry and heat the IGBT module, avoid the phenomenon of partial overheating caused by partial uneven heating, improve the reliability of the device, thus the whole working process is finished.

[0048] The above front, rear, left, right, upper, lower are based on the Figure 1 in the drawings.

[0049] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the scope of protection of the present application.

[0050] The embodiments of the present application are described in detail above in combination with the drawings, but the present application is not limited to the described embodiments.

[0051] For those skilled in the art, various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the present application, and still fall within the protection scope of the present application.

Claims

1. A method for controlling bubbles in a molten solder based IGBT module package, the method comprising: The application relates to a molten welding-based IGBT module packaging device, which comprises a dispensing assembly (2) mounted on a machine body (1), wherein a mounting cover (3) is connected to the machine body (1), a guide plate (10) is rotatably connected in the mounting cover (3), and an air outlet pipe (9) is connected to the guide plate (10). ​ An upper limiting plate (14), a moving plate (18) and a side limiting plate (20) are arranged on the machine body (1), a supporting rod (22) and a limiting rod (12) are connected to the machine body (1), a side rotating mechanism (13) is rotatably connected to the machine body (1), the side rotating mechanism (13) is in threaded connection with the upper limiting plate (14), the limiting rod (12) is in sliding connection with the side surface of the upper limiting plate (14), a worm (15) is rotatably connected to the upper limiting plate (14), the side surface of the worm (15) is in meshing connection with a worm wheel (16), a screw rod (17) is connected to the side surface of the worm wheel (16), and the screw rod (17) is in threaded connection with the moving plate (18). The side limiting plate (20) is in sliding connection with the supporting rod (22), a limiting groove (21) is formed in the side surface of the side limiting plate (20), a limiting block (19) is arranged in the limiting groove (21), and the other end of the limiting block (19) is connected to the side surface of the moving plate (18). A heat conduction frame (4) is connected to the mounting cover (3), a heating rod (5) is arranged in the heat conduction frame (4), and a fan (6) is arranged on the heat conduction frame (4). A servo motor (11) is fixedly connected to the side surface of the mounting cover (3), and the transmission shaft of the servo motor (11) is fixedly connected to the side surface of the guide plate (10). The bubble control method comprises the following steps: S1, preheating and degassing: the air in the heat conduction frame (4) is heated to 120-150 DEG C through the heating rod (5), the fan (6) is started to make hot air be sprayed out from the air outlet pipe (9) through the connecting pipe (7) and the connecting hose (8), the servo motor (11) drives the guide plate (10) to rotate to 45 DEG with the surface of the IGBT module, the welding area of the module is preheated for 30-60s, and the volatile gas remaining in the solder is discharged by using the hot air flow; S2, dispensing temperature control: when the dispensing assembly (2) works, the hot air temperature of the air outlet pipe (9) is kept at 180-200 DEG C, the air flow direction is adjusted by the guide plate (10) to cover the dispensing area, the solder is kept in a molten state in the dispensing process, and the bubble wrapping caused by temperature drop is reduced; S3, gradient solidification: after the dispensing is completed, the heating rod (5) is controlled to gradually reduce the hot air temperature, the servo motor (11) drives the guide plate (10) to reciprocate, the hot air uniformly acts on the surface of the solder, the bubble is promoted to float and escape, and the solidification is completed until the temperature is reduced to below 80 DEG C.

2. The molten solder based IGBT module package bubble control method of claim 1, wherein: The mounting cover (3) is provided with the connecting hose (8).

3. A molten solder based IGBT module package bubble control method as claimed in claim 2, wherein: The side surface of the heat conduction frame (4) is connected with the connecting pipe (7), and the other end of the connecting pipe (7) penetrates through the mounting cover (3) and is connected with the connecting hose (8).

4. The molten solder based IGBT module package bubble control method of claim 3, wherein: The other end of the connecting hose (8) is connected with the air outlet pipe (9).

5. The molten solder based IGBT module package bubble control method of claim 1, wherein: The screw rod (17) is fixedly connected with a circular plate (23) at the other end, and the circular plate (23) is in a circular plate structure.

6. The molten solder based IGBT module package bubble control method of claim 1, wherein: The limiting block (19) is in an "L" shaped plate structure, and the limiting block (19) slides along the limiting groove (21) which is in an "L" shaped groove structure.

7. The molten solder based IGBT module package bubble control method of claim 1, wherein: In S1, the air speed of the hot air is controlled to be 2-3 m / s, the IGBT module is limited by the side limiting plate (20) and the upper limiting plate (14), the distance between the module and the air outlet pipe (9) is kept at 50-80 mm, and the temperature difference of the module surface during the preheating process is ≤5℃.

8. The molten solder based IGBT module package bubble control method of claim 1, wherein: In S2, the glue outlet pressure of the glue dispensing assembly (2) is 0.2-0.3 MPa, and the glue outlet speed is linked with the hot air flow to adjust; when the bubbles appear on the solder surface, the servo motor (11) drives the guide plate (10) to focus the hot air to the bubble area, and the local temperature is raised to 220-230℃ for 5-10s, so as to promote the bubbles to break and discharge.

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