Chip production attaching mechanism and attaching method

Abstract

The application belongs to the technical field of semiconductor packaging equipment, and particularly relates to a laminating head, especially to a laminating mechanism for chip production and a laminating method thereof. The laminating mechanism for chip production is characterized in that a shunt channel is formed in the docking module, so that the airflow in the material adsorption channel can be shunted into the shunt channel, the abutting module in the shunt channel extends into the abutting groove to abut the suction nozzle module, thereby realizing quick installation. Since the suction nozzle module and the docking groove are in clearance fit, and there is a gap between the top surface of the suction nozzle module and the top of the docking groove, when the material adsorption channel is intermittently ventilated, the suction nozzle module will be intermittently lifted, thereby causing the suction nozzle module to vibrate to shake off the water vapor between the suction nozzle module and the docking groove, avoiding the use of the top screw to facilitate the disassembly and assembly of the suction nozzle module, and ensuring that the installation area of the suction nozzle module will not rust and be stuck.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor packaging equipment technology, specifically relating to a bonding head, and more particularly to a bonding mechanism and bonding method for chip manufacturing. Background Technology

[0002] A die bonder, also known as a die attacher or wafer bonding machine, is a type of packaging machinery. The bonding head module of the die bonder is driven by other modules in the die bonder to perform its work. For example, it is driven by the linear motor and other drive structures in the die bonder's drive module, thereby playing the role of gripping and pressing for bonding.

[0003] In related technologies, bonding heads (such as the bonding head provided in publication number CN118076084B) typically install nozzles by matching the nozzle with the insertion position. After the nozzle is inserted into the insertion position, it is secured by set screws. However, this method can make it difficult to remove the nozzle if the set screws are damaged or if the set screws tighten inconsistently. Furthermore, due to the presence of the heating element, the nozzle temperature is high. After die bonding is stopped, the moisture in the gap between the nozzle and the insertion position will liquefy, further corroding the set screws and creating further resistance to nozzle removal.

[0004] Therefore, how to avoid the cumbersome installation of the nozzle and the difficulty in disassembling the nozzle due to moisture after the nozzle is shut down is a technical problem that urgently needs to be solved.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0006] This disclosure provides at least one bonding mechanism and bonding method for chip manufacturing.

[0007] In a first aspect, embodiments of this disclosure provide a bonding mechanism for chip manufacturing, comprising:

[0008] A docking module, wherein a docking groove is provided at the bottom of the docking module;

[0009] The nozzle module is fitted with a clearance within the mating groove;

[0010] A support module, which is radially retractable within the docking groove;

[0011] A material adsorption channel is provided through the nozzle module and the docking module, and the material adsorption channel is connected to an external negative pressure source.

[0012] The bottom of the docking module is also provided with several diversion channels;

[0013] The side wall of the suction module is provided with a support groove, and the support module abuts against the support groove;

[0014] The control module is configured to: control the external negative pressure source to adsorb material through the material adsorption channel, and at the same time, the external negative pressure source triggers the holding module to extend into the holding groove through the diversion channel to hold the suction nozzle module.

[0015] When the machine is stopped, the control module controls the external negative pressure source to ventilate intermittently, so that the suction module is intermittently lifted when it is held in place, and the water vapor between the suction module and the docking groove is shaken off.

[0016] In one optional embodiment, the docking module has a sliding inner cavity, and the diversion channel passes through the sliding inner cavity;

[0017] The docking module is also provided with several slide rails, which extend from the sliding inner cavity to the docking groove;

[0018] The supporting module includes: a ring body that is vertically and slidably disposed within the sliding inner cavity, and the ring body being slidably sealed to the side wall of the sliding inner cavity; and

[0019] A slider is horizontally slidably disposed within the slide rail, with its two sides abutting against the ring body and the abutment groove, respectively.

[0020] When the suction module adsorbs material, the control module controls the external negative pressure source to adsorb material through the material adsorption channel. At the same time, the external negative pressure source lifts the ring body along the sliding inner cavity through the diversion channel, so that the slider extends into the holding groove along the slide rail to hold the suction module.

[0021] In one optional embodiment, a first abutting inclined surface is provided on the inner side of the ring body, and a second abutting inclined surface that cooperates with the first abutting inclined surface is provided on one side of the slider.

[0022] The support groove is provided with a third abutting inclined surface, and the other side of the slider is provided with a fourth abutting inclined surface that cooperates with the third abutting inclined surface;

[0023] When the ring is lifted by an external negative pressure source, the ring pushes the slider into the holding groove, so that the slider pushes the nozzle module to rise. When the nozzle module is raised to abut the top of the holding groove, the slider abuts the nozzle module.

[0024] In one optional embodiment, an abutment spring is fixedly connected to the inner top wall of the sliding cavity, and the bottom of the abutment spring is fixedly connected to the ring body; wherein

[0025] When the suction module is inserted into the docking groove, the suction module pushes the slider into the sliding inner cavity, so that the ring slides downward and stretches the abutment spring;

[0026] When the suction module adsorbs material, the external negative pressure source lifts the ring and compresses the abutment spring.

[0027] When the control module controls the external negative pressure source to intermittently ventilate, the ring body is intermittently sucked up and then lowered by the abutment spring, so that the suction nozzle module is intermittently lifted and the water vapor between the suction nozzle module and the abutment groove is shaken off.

[0028] In one alternative embodiment, the slider is provided with a fifth abutting slope on the side near the docking groove;

[0029] When the suction module is inserted into the docking groove, the suction module pushes against the fifth abutment slope to make the slider slide into the sliding inner cavity.

[0030] In one optional embodiment, a sixth abutment slope is further provided on the top of the suction module;

[0031] The top of the suction nozzle module is also provided with a flow guide ring, and the flow guide ring extends into the material adsorption channel of the docking module area;

[0032] Cooling water from the inner wall of the material adsorption channel in the docking module area passes sequentially through the guide ring and the sixth abutment slope into the area between the suction nozzle module and the docking groove.

[0033] When the machine is stopped, the control module controls the external negative pressure source to intermittently ventilate, so that the suction module is intermittently lifted and the water vapor between the suction module and the docking groove is shaken off.

[0034] In one optional embodiment, the bottom end face of the suction module is provided with a cross-shaped diversion groove, and the diversion groove is in communication with the material adsorption channel.

[0035] An external negative pressure source sequentially adsorbs materials through the material adsorption channel and the diversion tank.

[0036] In one optional embodiment, the bonding mechanism further includes a bonding module;

[0037] The docking module includes: an upper docking connector, a docking rod, and a lower docking connector;

[0038] The upper connector is a hollow sleeve structure, and the upper connector is used to mate with the bottom of the bonding module.

[0039] The top surface of the upper connector is also provided with a protruding ring, and the protruding ring is hollow inside;

[0040] The top of the lower connector is provided with a plug rod;

[0041] The docking rod is inserted into the protruding ring and fixedly connected to the plug rod;

[0042] The docking groove is formed at the bottom of the lower docking head, and the slide rail, sliding inner cavity and diversion channel are all formed on the lower docking head;

[0043] The material adsorption channel passes sequentially through the docking rod, the insertion rod, and the lower connector.

[0044] In one optional embodiment, the bonding mechanism further includes a heating module; the heating module includes a heating element, a heat sink, and a temperature sensor.

[0045] The heating element is fixedly connected to the lower mating head, and the heating element is used to heat the support groove to transfer heat to the nozzle module;

[0046] The heating element and the temperature sensor are electrically connected to the control module, respectively.

[0047] The heat sink is fixedly connected to the bottom outer ring of the upper connector;

[0048] The temperature sensor is fixedly connected to the bottom of the upper connector;

[0049] When the temperature sensor detects a temperature change in the heating element, the control module controls the heating element to adjust its temperature.

[0050] In one optional embodiment, the bonding module includes: a bonding sleeve, a bonding shaft, a bonding motor, and a bonding turntable;

[0051] The bonding shaft is rotatably connected to the bonding sleeve, and there is a gap between the bonding shaft and the bonding sleeve. The gap is divided by a partition to form a first cavity, a second cavity, and a third cavity.

[0052] The bonding motor is located above the bonding shaft, and the bonding motor is used to drive the bonding shaft to rotate;

[0053] The side wall of the fitting sleeve is provided with a first inlet, a second inlet, and a third inlet that are respectively connected to the first cavity, the second cavity, and the third cavity;

[0054] The bonding turntable is fixedly connected to the bottom of the bonding shaft, and the bottom of the bonding turntable is provided with a mounting groove;

[0055] The material adsorption channel passes sequentially through the bonding turntable and the bonding shaft and extends to the first cavity;

[0056] The fitting shaft is also provided with a docking adsorption channel, which extends from the top of the mounting groove to the second cavity;

[0057] The third cavity is used to support the rotation of the fitting shaft.

[0058] In one alternative embodiment, the bonding mechanism further includes: a bonding housing, a linear sliding pair, a track, and a pressure sensor;

[0059] The fitting sleeve is fixedly connected to the fitting shell, and the fitting shell is slidably connected to the track;

[0060] The pressure sensor is installed at the connection between the bonding motor and the bonding shaft;

[0061] The linear sliding joint is fixedly connected to the top of the track;

[0062] The pressure sensor and the linear motion pair are electrically connected to the control module, respectively.

[0063] When the pressure sensor detects that the pressure on the bonding shaft is too high, the control module controls the linear sliding pair to drive the bonding shell to slide along the track.

[0064] Secondly, this disclosure also provides a bonding method using a bonding mechanism for chip manufacturing as described above, the bonding method comprising:

[0065] Install the docking module onto the bottom of the fitting module;

[0066] Insert the nozzle module into the docking groove on the docking module;

[0067] After the support module is inserted into the support slot on the nozzle module, the installation of the nozzle module is completed;

[0068] Level the docking module to keep the nozzle module horizontal;

[0069] During operation, the control module controls the external air source to draw air into the material adsorption channel so that the material can be adsorbed through the nozzle module. At the same time, the air in the material adsorption channel triggers the support module to continue to extend into the support groove through the diversion channel to support the nozzle module.

[0070] When the machine is stopped, the control module controls the external air source to intermittently draw air into the material adsorption channel. The airflow in the diversion channel intermittently triggers the holding module to hold the suction nozzle module, so as to shake off the water vapor between the suction nozzle module and the docking tank.

[0071] The beneficial effects of this invention are that the bonding mechanism and bonding method for chip production, by opening a diversion channel on the docking module, allows the airflow in the material adsorption channel to be diverted into the diversion channel. The abutment module in the diversion channel extends into the abutment groove to abut the nozzle module, thereby achieving rapid installation. At the same time, due to the gap fit between the nozzle module and the docking groove, and the gap between the top surface of the nozzle module and the top of the docking groove, when the material adsorption channel is intermittently ventilated, the nozzle module will be intermittently lifted, causing the nozzle module to vibrate and shake off the moisture between the nozzle module and the docking groove. This avoids the need for set screws, which not only facilitates the disassembly and assembly of the nozzle module, but also ensures that the installation area of ​​the nozzle module will not rust and become stuck.

[0072] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and the drawings.

[0073] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0074] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0075] Figure 1 This is a schematic diagram of the bonding mechanism for chip manufacturing provided in an embodiment of the present disclosure;

[0076] Figure 2 This is an exploded view of the lower connector, suction nozzle module, and support module provided in an embodiment of this disclosure;

[0077] Figure 3 This is a schematic diagram of the structure of the suction module provided in an embodiment of the present disclosure;

[0078] Figure 4 A schematic diagram of the installation structure of the docking module and the suction module provided in the embodiments of this disclosure;

[0079] Figure 5 This is a schematic diagram of the bonding module provided in an embodiment of the present disclosure.

[0080] In the picture:

[0081] 100. Bonding module; 110. Bonding sleeve; 111. First inlet; 112. Second inlet; 113. Third inlet; 120. Bonding shaft; 121. Docking adsorption channel; 130. Bonding motor; 140. Bonding turntable; 141. Mounting slot; 150. Partition; 160. First cavity; 170. Second cavity; 180. Third cavity;

[0082] 200. Docking module; 210. Docking groove; 220. Diversion channel; 230. Sliding inner cavity; 240. Slide rail; 250. Abutment spring; 260. Upper connector; 261. Protruding ring; 270. Docking rod; 280. Lower connector; 281. Plug rod;

[0083] 300. Suction nozzle module; 310. Support groove; 311. Third abutment slope; 320. Sixth abutment slope; 330. Guide ring; 340. Diverter groove;

[0084] 400. Heating module; 410. Heating element; 420. Heat sink; 430. Temperature sensor;

[0085] 500. Material adsorption channel;

[0086] 600, Supporting module; 610, Ring body; 611, First abutting inclined surface; 620, Slider; 621, Second abutting inclined surface; 622, Fourth abutting inclined surface; 623, Fifth abutting inclined surface;

[0087] 710. Fitting housing; 720. Linear sliding pair; 730. Track; 740. Pressure sensor;

[0088] 800. Materials. Detailed Implementation

[0089] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0090] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0091] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0092] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0093] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise expressly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0094] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0095] Research has revealed that the installation of nozzles in related technologies typically involves matching the nozzle with a connector. After the nozzle is inserted into the connector, it is secured by set screws. However, this method can lead to difficulty in disassembling the nozzle if the set screws are damaged or tightened inconsistently. Furthermore, due to the presence of a heating element, the nozzle temperature is high. After die bonding is stopped, moisture in the gap between the nozzle and the connector will liquefy, further corroding the set screws and creating additional resistance to nozzle disassembly.

[0096] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0097] Based on the above research, this disclosure provides a bonding mechanism and its pressing method for chip manufacturing. By opening a diversion channel 220 on the docking module 200, the airflow in the material adsorption channel 500 can be diverted into the diversion channel 220. The abutment module 600 in the diversion channel 220 extends into the abutment groove 310 to abut the nozzle module 300, thereby achieving rapid installation. At the same time, since the nozzle module 300 and the docking groove 210 are in a clearance fit, and there is a gap between the top surface of the nozzle module 300 and the top of the docking groove 210, when the material adsorption channel 500 is intermittently ventilated, the nozzle module 300 will be intermittently lifted, thereby causing the nozzle module 300 to vibrate and shake off the moisture between the nozzle module 300 and the docking groove 210. This avoids the use of set screws, provides convenience for the disassembly and assembly of the nozzle module 300, and ensures that the installation area of ​​the nozzle module 300 will not rust and get stuck.

[0098] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0099] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0100] Please see Figure 1At least one embodiment provides a bonding mechanism for chip manufacturing, including: a bonding module 100, a docking module 200, a heating module 400, and a suction module 300 arranged sequentially from top to bottom. During installation, the docking module 200 is first installed at the bottom of the bonding module 100, and then the suction module 300 is installed at the bottom of the docking module 200. The suction module 300 is used to adsorb the bonding material 800. The heating module 400 on the docking module 200 heats the docking module 200, transferring heat to the suction module 300, thereby heating the adsorbed material 800 through the suction module 300, facilitating its removal. In this embodiment, the material 800 can be, but is not limited to, chips. During the wafer pick-up process, the die adheres to the blue film, and the heated suction module 300 facilitates its removal.

[0101] Most existing nozzle modules 300 are installed by directly clamping the nozzle module 300 to the docking module 200 using set screws on the side. However, using set screws has the following drawbacks. First, the nozzle module 300 is usually clamped by set screws on both sides. When it is necessary to replace different nozzle modules 300 to adapt to different materials 800, the set screws need to be loosened, which is difficult to do. At the same time, the set screws cannot guarantee the installation accuracy of the nozzle module 300. Also, due to the presence of the heating module 400, moisture will accumulate at the joint between the nozzle module 300 and the docking module 200. This moisture will liquefy in the gap and cause the set screws to lock.

[0102] To solve the above problems, the following solution is adopted: The bottom of the docking module 200 is provided with a docking groove 210, which is clearance-fitted with the suction nozzle module 300, and there is a gap between the top of the docking groove 210 and the top surface of the suction nozzle module 300; the bottom of the docking module 200 is also provided with several diversion channels 220, which are connected to the material adsorption channel 500. The material adsorption channel 500 is connected to an external negative pressure source, and negative pressure can be achieved within the material adsorption channel 500 through an external negative pressure source. The diversion channels 220, as branches of the material adsorption channel 500, also have negative pressure inside; the docking module 200 is also provided with a support module 6 on the diversion channel 220. The abutment module 600 extends into the docking groove 210. The abutment module 600 can repeatedly extend and retract in the direction of the docking groove 210. The triggering of the abutment module 600 depends on the on / off state of an external negative pressure source. Specifically, when the external negative pressure source is working, negative pressure is generated in the diversion channel 220, triggering the abutment module 600 to extend into the docking groove 210. When the external negative pressure source stops, the abutment module 600 resets and retracts. When the external negative pressure source is intermittently on / off, the abutment module 600 repeatedly extends and retracts in the direction of the docking groove 210. The side wall of the suction nozzle module 300 has an abutment groove 310, and the abutment module 600 abuts against the abutment groove 310. When the abutment module 600 extends into the docking groove 210... When extending into the docking groove 210, each supporting module 600 pushes and supports the nozzle module 300 from all sides. The nozzle module 300 is lifted by the supporting modules 600 until it abuts against the top of the docking groove 210. When the supporting modules 600 retract into the diversion channel 220, the nozzle module 300 is lowered to create a gap between it and the top of the docking groove 210. The control module, configured to control the on / off state of the external negative pressure source, stops the external negative pressure source during nozzle module 300 installation, inserting the nozzle module 300 into the docking groove 210. During insertion, the nozzle module 300 first contacts the supporting modules 600. After contact, the supporting modules 600... The nozzle module 300 retracts into the diversion channel 220. When the nozzle module 300 is inserted into the support groove 310 and is in the position of the support module 600, the support module 600 is inserted into the support groove 310. At this time, the insertion of the nozzle module 300 is stopped, and the installation of the nozzle module 300 is completed. Since there is a gap between the nozzle module 300 and the inner wall of the docking groove 210, the nozzle module 300 is in a relaxed state at this time. The support module 600 only serves to limit the nozzle module 300 at this time. This method facilitates the installation and removal of the nozzle module 300. At the same time, since the nozzle module 300 is in a relaxed state, the time when the nozzle module 300 is tightened is reduced, so as to avoid the nozzle module 300 getting stuck in the docking groove 210.When the suction module 300 adsorbs material 800, the control module controls an external negative pressure source to adsorb material 800 through the material adsorption channel 500. Simultaneously, the external negative pressure source triggers the supporting modules 600 to extend into the supporting grooves 310 through the diversion channel 220, so that each supporting module 600 simultaneously supports the suction module 300 from all sides. Compared to manually screwing in the set screws from both sides sequentially, this design can simultaneously tighten the suction module 300 from all sides, ensuring the centering effect of the suction module 300, improving the positional accuracy of the suction module 300 adsorbing material 800, and further preventing the suction module 300 from... In the event of jamming within the docking groove 210; during shutdown, the control module controls an external negative pressure source to intermittently ventilate, creating intermittent negative pressure within the diversion channel 220 through the material adsorption channel 500. This causes the suction nozzle module 300 to be intermittently held by the holding module 600, resulting in intermittent lifting of the suction nozzle module 300. This vibration dissipates moisture between the suction nozzle module 300 and the docking groove 210, preventing corrosion caused by moisture and further preventing the suction nozzle module 300 from jamming within the docking groove 210.

[0103] To enable the negative pressure triggering of the support module 600 within the diversion channel 220, a sliding inner cavity 230 is provided within the docking module 200. This sliding inner cavity 230 is an annular cavity, and the diversion channel 220 passes through it. The width of the sliding inner cavity 230 is greater than the diameter of the diversion channel 220. The docking module 200 also has several slide rails 240 extending from the sliding inner cavity 230 to the docking groove 210. The support module 600 slides within the slide rails 240, which serve as sliding limits for the support module 600. Thus, when an external negative pressure source is operating, the negative pressure within the diversion channel 220 triggers the support module 600 to slide and support the nozzle module 300.

[0104] In one optional embodiment, the specific structure of the abutment module 600 is as follows: the abutment module 600 includes a ring body 610 and a slider 620 that abut against each other. The ring body 610 is slidably disposed within the sliding inner cavity 230 and is capable of sliding up and down. The ring body 610 is slidably sealed to the side wall of the sliding inner cavity 230. When an external negative pressure source is working, the ring body 610 is lifted up along the sliding inner cavity 230 by negative pressure, and when the external negative pressure source stops, the ring body 610 automatically lowers. The slider 620 is slidably disposed within the slide rail 240 and is capable of sliding horizontally. The two sides of the slider 620 are respectively connected to the ring body 610. 10 and the supporting groove 310 abut against each other; when the suction module 300 adsorbs material 800, the control module controls the external negative pressure source to adsorb material 800 through the material adsorption channel 500. At the same time, the external negative pressure source sequentially triggers the ring body 610 to lift along the sliding inner cavity 230 through the material adsorption channel 500 and the diversion channel 220. During the lifting process of the ring body 610, it drives the slider 620 to extend into the supporting groove 310 along the slide rail 240. Then, the four sliders 620 simultaneously abut against the suction module 300 to complete the rapid centering of the suction module 300 and ensure the accuracy of the suction module 300 in adsorbing material 800.

[0105] Please see Figure 2 In one optional embodiment, to enable the ring 610 to lift and lower, thereby driving the slider 620 to slide horizontally, a first abutting inclined surface 611 is provided on the inner side of the ring 610, and a second abutting inclined surface 621 that cooperates with the first abutting inclined surface 611 is provided on one side of the slider 620. The first abutting inclined surface 611 and the second abutting inclined surface 621 have the same inclination direction. Thus, during the lifting process of the ring 610, the ring 610 will push the slider 620 to slide into the supporting groove 310. A third abutting inclined surface 311 is provided in the supporting groove 310, and a fourth abutting inclined surface 622 that cooperates with the third abutting inclined surface 311 is provided on the other side of the slider 620. The inclination directions of the third abutting inclined surface 311 and the fourth abutting inclined surface 622 are the same. With the same oblique direction, when the slider 620 slides into the abutment groove 310, the slider 620 pushes the suction module 300 up and abuts the suction module 300. When the external negative pressure source is working, the negative pressure in the sliding inner cavity 230 will suck up the ring 610. When the ring 610 is lifted, it pushes the slider 620 into the abutment groove 310, so that the slider 620 pushes the suction module 300 up. When the suction module 300 is lifted to abut the top of the abutment groove 310, the slider 620 abuts the suction module 300. In this way, the suction module 300 is pressed tightly and the centering effect of the suction module 300 is guaranteed, so as to ensure the accuracy of the suction module 300 in adsorbing the material 800.

[0106] In one optional embodiment, to achieve the recovery of the ring 610 after being adsorbed, an abutment spring 250 is fixedly connected to the inner top wall of the sliding inner cavity 230, and the bottom of the abutment spring 250 is fixedly connected to the ring 610; when the suction module 300 is inserted into the docking groove 210, the suction module 300 pushes the slider 620 to slide into the sliding inner cavity 230, so that the ring 610 slides downward and stretches the abutment spring 250. After the suction module 300 is installed into the abutment groove 310 corresponding to the slider 620, the slider 620 will extend into the abutment groove 310, and the abutment spring 250 will be engaged. Spring 250 rebounds, causing ring 610 to reset; when the suction module 300 adsorbs material 800, the external negative pressure source lifts ring 610 and compresses the abutment spring 250, and when the suction module 300 stops adsorbing material 800, the abutment spring 250 rebounds and pushes ring 610 back to its initial position; when the control module controls the external negative pressure source to ventilate intermittently, ring 610 is intermittently lifted and then lowered by the abutment spring 250, so that the suction module 300 is intermittently lifted and the moisture between the suction module 300 and the abutment groove 310 is shaken off, thereby achieving automatic reset of the whole.

[0107] In one optional embodiment, to facilitate the insertion of the nozzle module 300 into the docking groove 210, a fifth abutting slope 623 is provided on the side of the slider 620 near the docking groove 210. The inclination direction of the fifth abutting slope 623 is opposite to the inclination direction of the fourth abutting slope 622. When the nozzle module 300 is inserted into the docking groove 210, the nozzle module 300 pushes against the fifth abutting slope 623 to make the slider 620 slide into the sliding inner cavity 230, thereby limiting the nozzle module 300 after it is inserted into the docking groove 210 to prevent the nozzle module 300 from automatically falling off.

[0108] In an optional embodiment, to reduce moisture retention in the material adsorption channel 500 of the nozzle module 300 area, a sixth abutment slope 320 is provided on the top of the nozzle module 300. This sixth abutment slope 320 can guide moisture from the top of the nozzle module 300 outward, preventing moisture retention in the gap between the nozzle module 300 and the top of the docking groove 210. Simultaneously, the sixth abutment slope 320 and the fifth abutment slope 623 can cooperate to guide the slider 620 to retract, further facilitating the insertion of the nozzle module 300 into the docking groove 210. A guide ring 330 is also provided on the top of the nozzle module 300, and the guide ring 330 extends into the docking module 200 area. The cooling water from the inner wall of the material adsorption channel 500 in the docking module 200 area passes through the guide ring 330 and the sixth abutment slope 320 in sequence and enters the area between the suction module 300 and the docking groove 210. When the machine is stopped, the control module controls the external negative pressure source to intermittently ventilate, so that the suction module 300 is intermittently lifted and shaken. The gap between the suction module 300 and the top of the docking groove 210 continuously decreases and increases. Under the shaking of the suction module 300, the water vapor between the suction module 300 and the docking groove 210 is shaken off, further guiding the condensate and reducing the situation of condensate entering the suction module 300.

[0109] Please see Figure 3 In one optional embodiment, in order to improve the adsorption effect of the nozzle module 300 on the material 800, a cross-shaped diversion groove 340 is provided on the bottom end face of the nozzle module 300, and the diversion groove 340 is connected to the material adsorption channel 500; the external negative pressure source adsorbs the material 800 through the material adsorption channel 500 and the diversion groove 340 in sequence, thereby facilitating material suction.

[0110] In one alternative implementation, there are other shapes of diversion channels 340 corresponding to different suction modules 300, so different suction modules 300 can be replaced for the adsorption of different materials 800.

[0111] In one optional embodiment, the specific docking module 200 is as follows: the docking module 200 includes an upper docking connector 260, a docking insertion rod 270, and a lower docking connector 280; the upper docking connector 260 is a hollow sleeve structure at the bottom, and the upper docking connector 260 is used to dock with the bottom of the fitting module 100; the top surface of the upper docking connector 260 is also provided with a protruding ring 261, and the protruding ring 261 is hollow inside; the top of the lower docking connector 280 is provided with an insertion rod 281; the docking insertion rod... 270 is inserted into the protruding ring 261 and fixedly inserted into the insertion rod 281; the docking groove 210 is opened at the bottom of the lower docking joint 280, and the slide rail 240, the sliding inner cavity 230 and the diversion channel 220 are all opened on the lower docking joint 280; the material adsorption channel 500 passes through the docking insertion rod 270, the insertion rod 281 and the lower docking joint 280 in sequence, so as to facilitate the laying of the material adsorption channel 500 and the installation of the suction nozzle module 300.

[0112] Please see Figure 4 In one optional embodiment, the heating module 400 has the following structure: The heating module 400 includes a heating element 410, a heat sink 420, and a temperature sensor 430; wherein the heating element 410 is fixedly connected to the lower connector 280, and the heating element 410 is used to heat the support groove 310 to transfer heat to the nozzle module 300; the heating element 410 and the temperature sensor 430 are electrically connected to the control module; the heat sink 420 is fixedly connected to the bottom outer ring of the upper connector 260, and the heat sink 420 cools the upper connector 260; the temperature sensor 430 is fixedly connected to the upper connector 260. At the bottom of connector 260, the temperature sensor 430 is electrically connected to the control module. When the temperature sensor 430 detects a temperature change in the heating element 410, the control module controls the heating element 410 to adjust its temperature. Specifically, when the temperature sensor 430 detects that the temperature of the heating element 410 is too high, the control module controls the heating element 410 to cool down; when the temperature sensor 430 detects that the temperature of the heating element 410 is too low, the control module controls the heating element 410 to heat up, so that the lower connector 280 is kept at a constant temperature, and the nozzle module 300 is kept at a constant temperature, thereby facilitating crystal picking.

[0113] Please see Figure 5In one optional embodiment, the bonding module 100 has the following structure: the bonding module 100 includes a bonding sleeve 110, a bonding rotating shaft 120, a bonding motor 130, and a bonding turntable 140; the bonding rotating shaft 120 is rotatably connected to the bonding sleeve 110, and there is a gap between the bonding rotating shaft 120 and the bonding sleeve 110, and the gap is divided by a partition 150 to form a first cavity 160, a second cavity 170, and a third cavity 180; the bonding motor... 130 is located above the bonding shaft 120, and the bonding motor 130 is used to drive the bonding shaft 120 to rotate; the side wall of the bonding sleeve 110 has a first inlet 111, a second inlet 112, and a third inlet 113 respectively communicating with the first cavity 160, the second cavity 170, and the third cavity 180, and the first inlet 111, the second inlet 112, and the third inlet 113 are respectively connected to an external negative pressure source; the bonding turntable 140 is fixedly connected to the bonding... The bottom of the bonding shaft 120 is provided with a mounting groove 141, and the bonding turntable 140 is used to mate with the upper connector 260. The bonding turntable 140 can be driven to rotate by the bonding shaft 120, so as to drive the suction nozzle module 300 to rotate through the upper connector 260. At the same time, the crystal picking direction can be adjusted to enrich the applicability. The material adsorption channel 500 passes through the bonding turntable 140 and the bonding shaft 120 in sequence and extends to the first cavity 160, that is, the first inlet 1. The external negative pressure source connected to 111 is used to adsorb material 800; the bonding shaft 120 also has a docking adsorption channel 121, which extends from the top of the mounting groove 141 to the second cavity 170, that is, the external negative pressure source connected to the second inlet 112 is used to install the upper connector 260; the third cavity 180 is used to support the rotation of the bonding shaft 120, that is, the external air source connected to the third inlet 113 makes the third cavity 180 act as an air bearing. The material adsorption channel 500, the docking adsorption channel 121 and the third cavity 180 correspond to the first inlet 111, the second inlet 112 and the third inlet 113 respectively to achieve airflow distribution.

[0114] In one optional implementation, it should be noted that since the material 800 is a chip, if the suction module 300 applies excessive pressure to the material 800, the chip will be damaged. To solve this problem, the following solution is required: the bonding mechanism further includes a bonding housing 710, a linear sliding pair 720, a track 730, and a pressure sensor 740; the bonding sleeve 110 is fixedly connected to the bonding housing 710, and the bonding housing 710 is slidably connected to the track 730, which is fixed to the machine frame; the pressure sensor 740 is mounted on the bonding... The motor 130 is connected to the bonding shaft 120; the linear sliding joint 720 is fixedly connected to the top of the track 730, and the bonding shell 710 is fixedly connected to the movable end of the linear sliding joint 720; the pressure sensor 740 and the linear sliding joint 720 are electrically connected to the control module respectively; when the pressure sensor 740 detects that the pressure on the bonding shaft 120 is too high, the control module controls the linear sliding joint 720 to drive the bonding shell 710 to slide along the track 730, thereby avoiding damage to the crystals through pressure control.

[0115] In one optional embodiment, the fitting sleeve 110 and the fitting shell 710 are fixed by a floating type. Specifically, the fitting sleeve 110 and the fitting shell 710 can be fixed by bolts and spherical washers to keep the fitting sleeve 110 horizontal, thereby ensuring the level of the suction module 300 and avoiding excessive stress when the material 800 comes into contact with the suction module 300, which could cause damage to the material 800.

[0116] Secondly, this disclosure also provides a bonding method using a bonding mechanism for chip manufacturing as described above. The bonding method includes: installing a docking module 200 onto the bottom of a bonding module 100; inserting a nozzle module 300 into a docking groove 210 on the docking module 200; completing the installation of the nozzle module 300 after the supporting module 600 is inserted into the supporting groove 310 on the nozzle module 300; leveling the docking module to keep the nozzle module horizontal; and during operation, a control module controls an external air source to supply air to the material... Air is drawn into the material adsorption channel 500 to adsorb material 800 through the suction nozzle module 300. At the same time, the air in the material adsorption channel 500 triggers the holding module 600 to continue extending into the holding groove 310 through the diversion channel 220 to hold the suction nozzle module 300. When the machine stops, the control module controls the external air source to intermittently draw air into the material adsorption channel 500. The airflow in the diversion channel 220 intermittently triggers the holding module 600 to hold the suction nozzle module 300 to shake off the water vapor between the suction nozzle module 300 and the docking groove 210.

[0117] In summary, this invention provides a bonding mechanism and bonding method for chip manufacturing. The bottom of the docking module 200 is provided with a docking groove 210, which is clearance-fitted with the nozzle module 300, and a gap exists between the top of the docking groove 210 and the top surface of the nozzle module 300. The bottom of the docking module 200 also has several diversion channels 220, which communicate with the material adsorption channel 500. The material adsorption channel 500 is connected to an external negative pressure source, and negative pressure can be achieved within the material adsorption channel 500 through this external negative pressure source. The diversion channels 220, as branches of the material adsorption channel 500, also have negative pressure inside. The docking module 200 is located within the diversion channels 220. The upper part is also provided with a supporting module 600, which extends into the docking groove 210. The supporting module 600 can repeatedly extend and retract in the direction of docking groove 210. The triggering of the supporting module 600 depends on the on and off of an external negative pressure source. Specifically, when the external negative pressure source is working, a negative pressure is generated in the diversion channel 220, triggering the supporting module 600 to extend into the docking groove 210. When the external negative pressure source stops, the supporting module 600 resets and retracts. When the external negative pressure source is intermittently on and off, the supporting module 600 repeatedly extends and retracts in the direction of docking groove 210. The side wall of the suction nozzle module 300 is provided with a supporting groove 310, and the supporting module 600 abuts against the supporting groove 310. When module 600 extends into the docking groove 210, each supporting module 600 pushes and supports the nozzle module 300 from all sides. The nozzle module 300 is lifted by the supporting modules 600 until it abuts against the top of the docking groove 210. When the supporting modules 600 retract into the diversion channel 220, the nozzle module 300 is lowered to create a gap between it and the top of the docking groove 210. The control module, configured to control the on / off state of the external negative pressure source, stops the external negative pressure source during nozzle module 300 installation, inserting the nozzle module 300 into the docking groove 210. During insertion, the nozzle module 300 first contacts the supporting modules 600. After contact, the supporting modules 600... The nozzle module 300 will retract into the diversion channel 220. When the nozzle module 300 is inserted into the support groove 310 and is in the position of the support module 600, the support module 600 is inserted into the support groove 310. At this time, the insertion of the nozzle module 300 is stopped, and the installation of the nozzle module 300 is completed. Since there is a gap between the nozzle module 300 and the inner wall of the docking groove 210, the nozzle module 300 is in a relaxed state at this time. The support module 600 only serves to limit the nozzle module 300 at this time. This method facilitates the installation and removal of the nozzle module 300. At the same time, since the nozzle module 300 is in a relaxed state, the time when the nozzle module 300 is tightened is reduced, so as to avoid the nozzle module 300 getting stuck in the docking groove 210.When the suction module 300 adsorbs material 800, the control module controls an external negative pressure source to adsorb material 800 through the material adsorption channel 500. Simultaneously, the external negative pressure source triggers the supporting modules 600 to extend into the supporting grooves 310 through the diversion channel 220, so that each supporting module 600 simultaneously supports the suction module 300 from all sides. Compared to manually screwing in the set screws from both sides sequentially, this design can simultaneously tighten the suction module 300 from all sides, ensuring the centering effect of the suction module 300, improving the positional accuracy of the suction module 300 adsorbing material 800, and further preventing the suction module 300 from... In the event of jamming within the docking groove 210; during shutdown, the control module controls an external negative pressure source to intermittently ventilate, creating intermittent negative pressure within the diversion channel 220 through the material adsorption channel 500. This causes the suction nozzle module 300 to be intermittently held by the holding module 600, resulting in intermittent lifting of the suction nozzle module 300. This vibration dissipates moisture between the suction nozzle module 300 and the docking groove 210, preventing corrosion caused by moisture and further preventing the suction nozzle module 300 from jamming within the docking groove 210.

[0118] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0119] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as a second element, component, region, layer, or segment.

[0120] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0121] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0122] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A bonding mechanism for chip manufacturing, characterized in that, include: A docking module (200) is provided with a docking groove (210) at its bottom; The nozzle module (300) is fitted with a clearance within the mating groove (210); A support module (600) is radially retractable within the docking groove (210); A material adsorption channel (500) is provided through the nozzle module (300) and the docking module (200), and the material adsorption channel (500) is connected to an external negative pressure source; The bottom of the docking module (200) is also provided with several diversion channels (220). The suction module (300) has a support groove (310) on its side wall, and the support module (600) abuts against the support groove (310); The control module is configured to: control an external negative pressure source to adsorb material (800) through the material adsorption channel (500), and at the same time, the external negative pressure source triggers the holding module (600) to extend into the holding groove (310) through the diversion channel (220) to hold the suction nozzle module (300). When the machine is stopped, the control module controls the external negative pressure source to ventilate intermittently, so that the suction module (300) is lifted intermittently when it is held, and shakes off the water vapor between the suction module (300) and the docking groove (210); The docking module (200) has a sliding inner cavity (230), and the diversion channel (220) passes through the sliding inner cavity (230). The docking module (200) is also provided with a plurality of slide rails (240), which extend from the sliding inner cavity (230) to the docking groove (210).

2. The bonding mechanism for chip manufacturing as described in claim 1, characterized in that, The supporting module (600) includes: an annular body (610) that is slidably disposed within the sliding inner cavity (230), and the annular body (610) slidably seals against the side wall of the sliding inner cavity (230); and A slider (620) is horizontally slidably disposed within the slide rail (240), and the two sides of the slider (620) abut against the ring (610) and the abutment groove (310) respectively. When the suction module (300) adsorbs material (800), the control module controls the external negative pressure source to adsorb material (800) through the material adsorption channel (500). At the same time, the external negative pressure source lifts the ring (610) through the diversion channel (220) and raises it along the sliding inner cavity (230) so that the slider (620) extends into the holding groove (310) along the slide rail (240) to hold the suction module (300).

3. The bonding mechanism for chip manufacturing as described in claim 2, characterized in that, The inner side of the ring (610) is provided with a first abutting inclined surface (611), and one side of the slider (620) is provided with a second abutting inclined surface (621) that cooperates with the first abutting inclined surface (611). The abutting groove (310) is provided with a third abutting inclined surface (311), and the other side of the slider (620) is provided with a fourth abutting inclined surface (622) that cooperates with the third abutting inclined surface (311). When the ring (610) is lifted by an external negative pressure source, the ring (610) pushes the slider (620) into the holding groove (310) so that the slider (620) pushes the nozzle module (300) to rise, and when the nozzle module (300) is lifted to abut against the top of the holding groove (310), the slider (620) abuts against the nozzle module (300).

4. A bonding mechanism for chip manufacturing as described in claim 3, characterized in that... ； An abutment spring (250) is fixedly connected to the inner top wall of the sliding inner cavity (230), and the bottom of the abutment spring (250) is fixedly connected to the ring body (610); wherein When the suction module (300) is inserted into the docking groove (210), the suction module (300) pushes the slider (620) to slide into the sliding inner cavity (230), so that the ring (610) slides downward and stretches the abutment spring (250). When the suction module (300) adsorbs material (800), the external negative pressure source lifts the ring (610) and compresses the abutment spring (250). When the control module controls the external negative pressure source to ventilate intermittently, the ring body (610) is intermittently sucked up and then lowered by the abutment spring (250), so that the suction module (300) is intermittently lifted and the water vapor between the suction module (300) and the abutment groove (310) is shaken off.

5. A bonding mechanism for chip manufacturing as described in claim 4, characterized in that... ； The slider (620) is provided with a fifth abutting inclined surface (623) on the side near the docking groove (210). When the suction module (300) is inserted into the docking groove (210), the suction module (300) pushes against the fifth abutting inclined surface (623) to make the slider (620) slide into the sliding inner cavity (230).

6. A bonding mechanism for chip manufacturing as described in claim 5, characterized in that... ； The top of the suction module (300) is also provided with a sixth abutting slope (320). The top of the suction module (300) is also provided with a flow guide ring (330), and the flow guide ring (330) extends into the material adsorption channel (500) of the docking module (200) area; Cooling water from the inner wall of the material adsorption channel (500) in the docking module (200) area passes through the guide ring (330) and the sixth abutment slope (320) in sequence and enters the area between the suction nozzle module (300) and the docking groove (210); When the machine is stopped, the control module controls the external negative pressure source to intermittently ventilate, so that the suction module (300) is intermittently lifted and the water vapor between the suction module (300) and the docking groove (210) is shaken off.

7. A bonding mechanism for chip manufacturing as described in claim 1, characterized in that... ； The bottom end face of the suction module (300) is provided with a cross-shaped diversion groove (340), and the diversion groove (340) is connected to the material adsorption channel (500). An external negative pressure source sequentially adsorbs material (800) through the material adsorption channel (500) and the diversion tank (340).

8. A bonding mechanism for chip manufacturing as described in claim 2, characterized in that... ； The bonding mechanism also includes a bonding module (100). The docking module (200) includes: an upper docking connector (260), a docking rod (270), and a lower docking connector (280). The upper connector (260) is a hollow sleeve structure, and the upper connector (260) is used to dock with the bottom of the bonding module (100); The top surface of the upper connector (260) is also provided with a protruding ring (261), and the protruding ring (261) is hollow inside; The top of the lower connector (280) is provided with a plug rod (281). The docking rod (270) is inserted into the protruding ring (261) and is fixedly inserted into the plug rod (281); The docking groove (210) is formed at the bottom of the lower docking joint (280), and the slide rail (240), the sliding inner cavity (230) and the diversion channel (220) are all formed on the lower docking joint (280); The material adsorption channel (500) passes through the docking rod (270), the plug rod (281) and the lower docking joint (280) in sequence.

9. A bonding mechanism for chip manufacturing as described in claim 8, characterized in that... ； The bonding mechanism also includes a heating module (400). The heating module (400) includes: a heating element (410), a heat sink (420), and a temperature sensor (430). The heating element (410) is fixedly connected to the lower connector (280), and the heating element (410) is used to heat the support groove (310) to transfer heat to the nozzle module (300). The heating element (410) and the temperature sensor (430) are electrically connected to the control module, respectively; The heat sink (420) is fixedly connected to the bottom outer ring of the upper connector (260); The temperature sensor (430) is fixedly connected to the bottom of the upper connector (260); When the temperature sensor (430) detects a temperature change in the heating element (410), the control module controls the heating element (410) to adjust its temperature.

10. A bonding mechanism for chip manufacturing as described in claim 9, characterized in that... ； The bonding module (100) includes: a bonding sleeve (110), a bonding shaft (120), a bonding motor (130), and a bonding turntable (140). The bonding shaft (120) is rotatably connected to the bonding sleeve (110), and there is a gap between the bonding shaft (120) and the bonding sleeve (110), and the gap is separated by a partition (150) to form a first cavity (160), a second cavity (170) and a third cavity (180). The bonding motor (130) is located above the bonding shaft (120), and the bonding motor (130) is used to drive the bonding shaft (120) to rotate; The sidewall of the fitting sleeve (110) is provided with a first inlet (111), a second inlet (112) and a third inlet (113) respectively communicating with the first cavity (160), the second cavity (170) and the third cavity (180). The bonding turntable (140) is fixedly connected to the bottom of the bonding shaft (120), and the bottom of the bonding turntable (140) is provided with a mounting groove (141). The material adsorption channel (500) passes through the bonding turntable (140) and the bonding shaft (120) in sequence and extends to the first cavity (160). The fitting shaft (120) is also provided with a docking adsorption channel (121), which extends from the top of the mounting groove (141) to the second cavity (170). The third cavity (180) is used to support the rotation of the fitting shaft (120).

11. A bonding mechanism for chip manufacturing as described in claim 10, characterized in that... ； The bonding mechanism further includes: a bonding housing (710), a linear motion pair (720), a track (730), and a pressure sensor (740); The fitting sleeve (110) is fixedly connected to the fitting shell (710), and the fitting shell (710) is slidably connected to the track (730); The pressure sensor (740) is installed at the connection between the bonding motor (130) and the bonding shaft (120); The linear sliding pair (720) is fixedly connected to the top of the track (730); The pressure sensor (740) and the linear motion pair (720) are electrically connected to the control module, respectively; When the pressure sensor (740) detects that the pressure of the bonding shaft (120) is too high, the control module controls the linear sliding pair (720) to drive the bonding shell (710) to slide along the track (730).

12. A bonding method using the bonding mechanism as described in claim 1, characterized in that, include: Install the docking module (200) onto the bottom of the bonding module (100); Insert the nozzle module (300) into the docking groove (210) on the docking module (200); After the support module (600) is inserted into the support slot (310) on the nozzle module (300), the installation of the nozzle module (300) is completed; Level the docking module (200) to keep the nozzle module (300) horizontal; During operation, the control module controls the external air source to draw air into the material adsorption channel (500) so that the material (800) can be adsorbed through the nozzle module (300). At the same time, the air in the material adsorption channel (500) triggers the holding module (600) to continue to extend into the holding groove (310) through the diversion channel (220) to hold the nozzle module (300). When the machine is stopped, the control module controls the external air source to intermittently draw air into the material adsorption channel (500). The airflow in the diversion channel (220) intermittently triggers the holding module (600) to hold the suction nozzle module (300) to shake off the water vapor between the vibration of the suction nozzle module (300) and the docking groove (210).

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