A feed device of a die bonder

Abstract

The application relates to the technical field of die bonder, in particular to a feeding device of a die bonder, which comprises a feeding conveying belt, the feeding conveying belt is used for feeding and conveying a wafer expansion module after wafer expansion, one end of the feeding conveying belt is provided with a feeding table, a cavity is arranged on the feeding table, a pushing cylinder is arranged in the cavity, and an expanded wafer film is fixedly connected to the output end of the pushing cylinder; the feeding table and the guide part are arranged, so that the wafer expansion inner ring and the wafer film can be moved above the wafer expansion module, and the wafer expansion outer ring can be placed in the wafer expansion pressing mechanism, so that the wafer expansion outer ring can be sleeved outside the wafer expansion module and the wafer expansion inner ring while the wafer film is expanded, the excess wafer module can be quickly and stably cut, the wafer expansion speed of the wafer expansion module can be improved, the excess wafer film can be stably and uniformly cut, and the wafer expansion module can be quickly fed in cooperation with the pushing mechanism.

Description

Technical Field

[0001] This invention relates to the field of die bonder technology, specifically to a feeding device for a die bonder. Background Technology

[0002] Currently, in existing die bonders, the substrate is transported to the worktable via a conveyor mechanism. A dispensing mechanism applies adhesive (such as silver paste, epoxy resin, or DAF film) to the chip bonding area, with adhesive dosage control accuracy reaching ±0.01mg. The bonding head picks up the chip from the wafer expansion module via a vacuum nozzle. After the chip is pressed onto the substrate, the adhesive is hardened through thermosetting or UV curing.

[0003] However, when feeding the wafer expansion module, although the operator usually does not need to manually perform the expansion operation, the wafer loading and subsequent auxiliary processing need to be completed. That is, the latch is released, the upper workpiece plate is lifted, the inner ring of the expansion ring is placed on the lower pressure mold, the flipping film with the wafer attached is placed in the center of the lower workpiece (wafer facing up), then the upper workpiece plate is covered and locked, the button on the cylinder is pressed, the lower pressure plate rises to spread the film, the die spacing is increased to the target value, then the outer ring of the expansion ring is placed, the upper cylinder button is pressed to close the expansion ring, and the wafer expansion is completed. Then the lower pressure plate descends, the flipping film after the expansion is completed is taken out, then the excess film surface is trimmed, and finally the expanded wafer expansion module is clamped into the die bonder by the robot arm.

[0004] However, during this process, when the staff trims the excess film, unevenness can easily occur. When the wafer expansion module is clamped and placed into the wafer bonding machine for die bonding, the wafer expansion module is not placed stably. If the wafer tilt angle deviation is more than ±5°, it will cause uneven contact pressure of the nozzle, increasing the chip damage or pick-up failure rate. To address this, we propose a feeding device for the die bonding machine. Summary of the Invention

[0005] The purpose of this invention is to provide a feeding device for a die bonder to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a feeding device for a die bonder, comprising a feeding conveyor belt for conveying and feeding a wafer expansion module after die expansion, a feeding platform at one end of the feeding conveyor belt, a cavity on the feeding platform, a pushing cylinder in the cavity, an expansion film fixedly connected to the output end of the pushing cylinder, a preparation platform on one side of the feeding platform, a supporting workpiece plate slidably connected to the preparation platform, a guide member on the preparation platform for guiding the supporting workpiece plate, and the supporting workpiece plate for supporting the inner ring of the expansion wafer and the wafer film;

[0007] The supporting workpiece plate is also provided with a synchronous placement mechanism, which is used to synchronously place the expansion ring.

[0008] The material preparation platform is also equipped with a pressing and expanding crystal mechanism. The pressing and expanding crystal mechanism works in conjunction with the expanding crystal film to expand the crystal film while making the outer ring of the expanding crystal film stuck on the outer side of the inner ring of the expanding crystal film, and at the same time cutting off the excess film material.

[0009] A pushing mechanism is provided on the side of the preparation platform away from the feeding conveyor belt. The pushing mechanism pushes the wafer expansion module that has completed the wafer expansion onto the feeding conveyor belt.

[0010] Furthermore, the guide includes a support rail and a limiting side plate. There are two support rails, both of which are installed on the feeding platform. The bottom of the support workpiece plate is provided with a sliding groove corresponding to the position of the two support rails. The limiting side plate is fixedly installed on the side of the support rail away from the feeding platform, and the feeding platform is used to limit the position of the support workpiece plate.

[0011] Furthermore, the supporting workpiece plate is provided with a circular hole, and the inner side of the circular hole is provided with a supporting step for partially supporting the inner ring of the expanded crystal.

[0012] Furthermore, the synchronous placement mechanism includes a support column, a connecting plate, a limiting component, a fixed disc, and an upward pushing component. The support column is fixedly installed on the support workpiece plate, the connecting plate is rotatably sleeved on the support column, and the limiting component is installed on the support column and is used to limit the connecting plate.

[0013] One end of the connecting plate is fixedly connected to the fixed disk, and the connecting plate is rotatably sleeved on the support column. The fixed disk is provided with an annular groove, and the outer ring of the expanded die is located in the annular groove. The pushing member is installed between the bottom of the fixed disk and the connecting plate, and the pushing member is used to assist the connection between the outer ring of the expanded die and the pressing and expanding die mechanism. Through the provided synchronous placement mechanism, the synchronous placement of the outer ring of the expanded die is achieved.

[0014] Furthermore, the pressing and expanding crystal mechanism includes a lifting component, a fixed plate, a fixed column, a support ring frame, an adsorption and cutting component, a pressing plate, and a synchronization component. The lifting component is installed on the feeding platform, the fixed plate is connected to the lifting component, the fixed column is installed at the other end of the fixed plate, and the support ring frame is fixedly installed at the bottom of the fixed column. The support ring frame is located directly above the feeding platform, and the adsorption and cutting component is installed on the support ring frame.

[0015] The pressing plate is located below the support ring frame and is used to fix the crystal film. The synchronization component is set between the support ring frame and the pressing plate. Through the provided pressing and expanding mechanism, the wafer can be rapidly expanded.

[0016] Furthermore, the adsorption and cutting component includes a vacuum suction ring, a vacuum tube, a cutting blade, a limiting ring, and a buffer component. The vacuum suction ring is located below the support ring frame and is used to adsorb and fix the outer ring of the crystal expansion ring. Multiple vacuum tubes are provided, and all of the multiple vacuum tubes are installed on the support ring frame and are connected to the vacuum suction ring. The cutting blade is ring-shaped and is fixedly installed on the outer ring of the vacuum suction ring. The cutting blade is also fixedly installed at the bottom of the support ring frame.

[0017] The limiting ring is slidably connected to the inner ring of the vacuum suction ring. The buffer is set on the support ring frame and is used to connect the limiting ring. Through the provided adsorption and cutting component, the outer ring of the crystal expansion is sleeved on the outside of the inner ring of the crystal expansion, thereby realizing the function of quickly and stably cutting the excess crystal film.

[0018] Furthermore, the buffer component includes a connecting rod, a circular plate, and a connecting spring. Multiple connecting rods are provided, and all of the multiple connecting rods slide through the support ring frame. The bottom of the connecting rod is fixedly connected to the limiting ring, and the top of the connecting rod is fixedly connected to the circular plate. The connecting spring is sleeved on the outside of the connecting rod, and both ends of the connecting spring are fixedly connected to the circular plate and the support ring frame, respectively. Through the provided buffer component, the limiting ring is supported and connected.

[0019] Furthermore, the synchronizing component includes a synchronizing frame, synchronizing rods, connecting lugs, guide rods, and clamping components. The synchronizing frame is fixedly installed on the support ring frame. There are two synchronizing rods, both of which slide through the synchronizing frame. A top plate is fixedly connected to the top of each synchronizing rod.

[0020] The connecting ear is provided in two parts, and both connecting ears are fixedly installed on one side of the pressing plate, and the bottom of the two synchronizing rods are respectively fixedly connected to the two connecting ears;

[0021] Two guide rods are provided, and the two guide rods are respectively fixedly installed at both ends of the synchronization frame. The guide rods are connected to the clamping component, which is installed on the feeding platform. Through the provided synchronization component, the pressing block is intermittently connected.

[0022] Furthermore, a support block is provided on the bottom of the feeding platform corresponding to the connecting ear, thereby supporting and lifting the connecting ear.

[0023] Furthermore, the clamping component includes a clamping block, a limiting spring, and a positioning block. The positioning block is fixedly installed on the feeding table. Two limiting springs are provided, one end of each limiting spring is fixedly connected to the positioning block, and the other end of each limiting spring is fixedly connected to the clamping block. The clamping block is slidably connected to the positioning block. The clamping block is provided with a lower pressing groove. The guide rod is slidably connected to the lower pressing groove. The positioning block is provided with a movable opening corresponding to the position of the guide rod. The end of the clamping block near the pressing plate is the clamping end. Through the provided clamping component, the pressing plate is clamped.

[0024] The present invention has at least the following beneficial effects:

[0025] 1. When this invention is used, the inner expansion ring and the wafer film can be moved above the expansion mold by the provided material preparation table and guide components. At the same time, the outer expansion ring is placed at the pressing and expansion mechanism. Thus, while expanding the wafer on the wafer film, the outer expansion ring can be placed around the outside of the wafer mold and the inner expansion ring, and the excess wafer film can be quickly and stably removed. This not only improves the expansion speed of the wafer expansion module, but also ensures that the excess wafer film is removed consistently and stably. In addition, the pusher mechanism enables the wafer expansion module to be quickly loaded.

[0026] 2. This invention effectively saves labor, improves the feeding efficiency of wafer expansion modules, and further improves the production efficiency of die bonders. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 This is a schematic diagram of the feeding platform structure of the present invention;

[0029] Figure 3 This is a schematic diagram of the workpiece support plate structure of the present invention;

[0030] Figure 4 This is a schematic diagram of the support rail structure of the present invention;

[0031] Figure 5 This is a schematic diagram of the expanded crystal film structure of the present invention;

[0032] Figure 6 This is a schematic diagram of the pusher structure of the present invention;

[0033] Figure 7 For the present invention Figure 6 Enlarged structural diagram of region A in the middle;

[0034] Figure 8 For the present invention Figure 6 Enlarged structural diagram of region B in the middle;

[0035] Figure 9 This is a schematic diagram of the feeding mechanism of the present invention;

[0036] Figure 10 This is a side view of the pressing plate structure of the present invention;

[0037] Figure 11 This is a schematic diagram of the support ring frame structure of the present invention;

[0038] Figure 12 This is a schematic diagram of the fixing plate structure of the present invention;

[0039] Figure 13 For the present invention Figure 12 Enlarged structural diagram of region C in the middle;

[0040] Figure 14 This is a schematic diagram of the cutting blade structure of the present invention;

[0041] Figure 15 This is a side sectional view of the support ring frame structure of the present invention.

[0042] In the diagram: 1-Feeding conveyor belt; 2-Feeding platform; 21-Push cylinder; 22-Expanding film; 3-Preparation platform; 31-Supporting workpiece plate; 311-Round hole; 312-Supporting step; 4-Guide component; 41-Supporting guide rail; 42-Limiting side plate; 5-Synchronous placement mechanism; 51-Supporting column; 52-Connecting plate; 53-Limiting component; 531-Limiting frame; 54-Fixing disc; 55-Push component; 551-Push rod; 552-Push plate; 553-Buffer spring; 554-Pushing frame; 6-Pressure expanding mechanism; 61-Lifting component; 611-Fixing frame; 612-Lifting screw; 613-Lifting motor; 614-Lifting... 62-Fixing plate; 63-Fixing column; 64-Support ring frame; 65-Adsorption cutting component; 651-Vacuum suction ring; 652-Vacuum tube; 653-Cut blade; 654-Limiting ring; 655-Buffer component; 6551-Connecting rod; 6552-Circular plate; 6553-Connecting spring; 66-Pressure plate; 67-Synchronizing component; 671-Synchronizing frame; 672-Synchronizing rod; 673-Connecting ear; 674-Guide rod; 675-Pressure component; 6751-Pressure block; 67511-Lower pressure groove; 67512-Pressure end; 6752-Limiting spring; 6753-Positioning block; 68-Supporting support block; 7-Pushing mechanism. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example 1

[0044] Please see Figures 1 to 2 A feeding device for a die bonder includes a feeding conveyor belt 1 for conveying and feeding a wafer expansion module after die expansion. One end of the feeding conveyor belt 1 is provided with a feeding platform 2, which has a cavity and a pushing cylinder 21. The output end of the pushing cylinder 21 is fixedly connected to an expansion film 22. A preparation platform 3 is provided on one side of the feeding platform 2, and a supporting workpiece plate 31 is slidably connected to the preparation platform 3. A guide 4 is also provided on the preparation platform 3 to guide the supporting workpiece plate 31. The supporting workpiece plate 31 is used to support the inner ring of the expansion wafer and the wafer film.

[0045] Please see Figures 2 to 4 The guide member 4 includes a support guide rail 41 and a limiting side plate 42. There are two support guide rails 41, and both support guide rails 41 are installed on the feeding table 2. The bottom of the support workpiece plate 31 is provided with a sliding groove corresponding to the position of the two support guide rails 41. The limiting side plate 42 is fixedly installed on the side of the support guide rail 41 away from the feeding table 2, and the feeding table 2 is used to limit the support workpiece plate 31.

[0046] The supporting workpiece plate 31 is provided with a circular hole 311, and the inner side of the circular hole 311 is provided with a supporting step 312 for partially supporting the inner ring of the crystal expansion.

[0047] The workpiece support plate 31 can move along the support guide rail 41 via two sliding grooves, thereby ensuring the stable movement of the workpiece support plate 31.

[0048] The supporting workpiece plate 31 is also provided with a synchronous placement mechanism 5, which is used to synchronously place the expansion outer ring.

[0049] Please see Figures 3 to 8 The synchronous placement mechanism 5 includes a support column 51, a connecting plate 52, a limiting member 53, a fixed disc 54, and an upward pushing member 55. The support column 51 is fixedly installed on the supporting workpiece plate 31, the connecting plate 52 is rotatably sleeved on the support column 51, and the limiting member 53 is installed on the support column 51 and is used to limit the connecting plate 52.

[0050] As a supplementary explanation, the limiting member 53 includes a limiting frame 531, which is U-shaped and fixedly installed on the support column 51. The limiting frame 531 is located outside the connecting plate 52. This arrangement allows the connecting plate 52 to rotate within a certain angle range, preventing the connecting plate 52 from shifting. In this invention, the rotation angle range of the connecting plate 52 is set to 180°.

[0051] One end of the connecting plate 52 is fixedly connected to the fixed disk 54, and the connecting plate 52 is rotatably sleeved on the support column 51. The fixed disk 54 is provided with an annular groove, and the expansion outer ring is located at the annular groove. The pusher 55 is installed between the bottom of the fixed disk 54 and the connecting plate 52, and the pusher 55 is used to assist the expansion outer ring in connecting with the pressing expansion mechanism 6.

[0052] Please see Figures 6 to 8 As a supplementary explanation, the upper pusher 55 includes a push rod 551, a push plate 552, a buffer spring 553, and a push frame 554. There are multiple push rods 551, and all of the push rods 551 slide through the annular groove. The bottom of the push rod 551 is fixedly connected to the push plate 552. The buffer spring 553 is sleeved on the outside of the push rod 551. The two ends of the buffer spring 553 are fixedly connected to the fixed disc 54 and the push plate 552, respectively. The push frame 554 is slidably connected to the connecting plate 52, and all of the push plates 552 are fixedly connected to the push frame 554.

[0053] Specifically: First, the outer ring of the expanded crystal is placed in the annular groove. When the fixed disk 54 moves to the pressing and expanding crystal mechanism 6 along with the supporting workpiece plate 31, the multiple push rods 551 are moved upward by pressing the push frame 554, thereby pushing the outer ring of the expanded crystal into the pressing and expanding crystal mechanism 6.

[0054] Please see Figures 9 to 15 The material preparation platform 3 is also equipped with a pressing and expanding crystal mechanism 6. The pressing and expanding crystal mechanism 6 cooperates with the expanding crystal film 22 to expand the crystal film while making the expanding crystal outer ring stuck outside the expanding crystal inner ring, and at the same time cutting off the excess film material.

[0055] The pressing and expanding crystal mechanism 6 includes a lifting component 61, a fixing plate 62, a fixing column 63, a support ring frame 64, an adsorption and cutting component 65, a pressing plate 66, and a synchronization component 67. The lifting component 61 is installed on the feeding platform 2. The fixing plate 62 is connected to the lifting component 61. The fixing column 63 is installed at the other end of the fixing plate 62, and the support ring frame 64 is fixedly installed at the bottom of the fixing column 63. The support ring frame 64 is located directly above the feeding platform 2, and the adsorption and cutting component 65 is installed on the support ring frame 64.

[0056] The pressing plate 66 is located below the support ring frame 64 and is used to fix the crystal film. The synchronizing element 67 is disposed between the support ring frame 64 and the pressing plate 66.

[0057] The adsorption and cutting component 65 includes a vacuum suction ring 651, a vacuum tube 652, a cutting blade 653, a limiting ring 654, and a buffer component 655. The vacuum suction ring 651 is located below the support ring frame 64 and is used to adsorb and fix the outer ring of the crystal expansion device. Multiple vacuum tubes 652 are provided, and all of the multiple vacuum tubes 652 are installed on the support ring frame 64. The vacuum tubes 652 are connected to the vacuum suction ring 651. In this embodiment, the vacuum tubes 652 are connected to a negative pressure device, and a solenoid valve is also provided on the vacuum tubes 652 for controlling the opening and closing of the adsorption of the vacuum tubes 652.

[0058] The cutting blade 653 is ring-shaped and is fixedly installed on the outer ring of the vacuum suction ring 651. The cutting blade 653 is also fixedly installed on the bottom of the support ring frame 64.

[0059] The limiting ring 654 is slidably connected to the inner ring of the vacuum suction ring 651, and the buffer 655 is disposed on the support ring frame 64 and is used to connect the limiting ring 654.

[0060] The buffer component 655 includes a connecting rod 6551, a circular plate 6552, and a connecting spring 6553. Multiple connecting rods 6551 are provided, and all of the multiple connecting rods 6551 slide through the support ring frame 64. The bottom of the connecting rod 6551 is fixedly connected to the limiting ring 654, and the top of the connecting rod 6551 is fixedly connected to the circular plate 6552. The connecting spring 6553 is sleeved on the outside of the connecting rod 6551, and both ends of the connecting spring 6553 are fixedly connected to the circular plate 6552 and the support ring frame 64, respectively.

[0061] The synchronization component 67 includes a synchronization frame 671, a synchronization rod 672, a connecting lug 673, a guide rod 674, and a clamping component 675. The synchronization frame 671 is fixedly installed on the support ring frame 64. There are two synchronization rods 672, and both synchronization rods 672 slide through the synchronization frame 671. A top plate is fixedly connected to the top of the synchronization rod 672.

[0062] Two connecting ears 673 are provided, and both connecting ears 673 are fixedly installed on one side of the pressing plate 66. The bottoms of the two synchronizing rods 672 are respectively fixedly connected to the two connecting ears 673. A support block 68 is provided on the feeding table 2 and corresponding to the bottom of the connecting ear 673. The support block 68 serves to support the connecting ear 673.

[0063] Two guide rods 674 are provided, and the two guide rods 674 are respectively fixedly installed at both ends of the synchronous frame 671. The guide rods 674 are connected to the clamping member 675, which is installed on the feeding table 2. In this application, the guide rod 674 is composed of a bottom vertical section, a middle inclined section and a top vertical section. The guide rod 674 is connected to the clamping member 675 in sequence through its bottom vertical section, middle inclined section and top vertical section.

[0064] Please see Figures 11 to 13 The clamping component 675 includes a clamping block 6751, a limiting spring 6752, and a positioning block 6753. The positioning block 6753 is fixedly installed on the feeding table 2. There are two limiting springs 6752. One end of the two limiting springs 6752 is fixedly connected to the positioning block 6753, and the other end of the two limiting springs 6752 is fixedly connected to the clamping block 6751. The clamping block 6751 is slidably connected to the positioning block 6753. The clamping block 6751 is provided with a lower pressing groove 67511. The guide rod 674 is slidably connected to the lower pressing groove 67511. The positioning block 6753 is provided with a movable opening corresponding to the position of the guide rod 674. The end of the clamping block 6751 near the pressing plate 66 is the clamping end 67512.

[0065] Specific implementation process: When feeding, the inner crystal expansion ring and the crystal film are placed on the supporting workpiece plate 31, and the outer crystal expansion ring is placed in the annular groove on the fixed disk 54. The inner crystal expansion ring and the crystal film move to the feeding table 2 along with the supporting workpiece plate 31. At the same time, the fixed circular plate 6552 moves to the bottom of the vacuum suction ring 651 and is located above the pressing plate 66. Then, the operator pulls up the push frame 554. While the push frame 554 is moving, the push rods 551 are moved upward relative to the annular groove by multiple push plates 552. Then, the multiple push rods 551 push the outer crystal expansion ring to the bottom of the vacuum suction ring 651. At this time, the outer crystal expansion ring is located between the limiting ring 654 and the cutting blade 653.

[0066] Subsequently, the staff released the pusher 554 and simultaneously rotated the connecting plate 52 to move the fixed circular plate 6552 away from the pressure plate 66. Then, the lifting component 61 moved, causing the fixed plate 62 to move downwards via the fixed column 63, driving the support ring frame 64. Simultaneously, under the connection of the synchronous rod 672 and the top plate, the pressure plate 66 first contacts the outer periphery of the crystal film on the supporting workpiece plate 31, pressing and fixing the crystal film. When the pressure plate 66 is placed on the supporting workpiece plate 31... When the support ring 64 moves downward relative to the pressing plate 66 via the synchronous frame 671, the guide rod 674 moves downward simultaneously. The two guide rods 674 then contact the lower pressing groove 67511 of the pressing block 6751 in sequence through the bottom vertical section and the middle inclined section. The two pressing blocks 6751 move towards each other until the pressing ends 67512 of the two pressing blocks 6751 press and fix the pressing plate 66.

[0067] At this time, the cylinder 21 is driven to move, causing the expansion film 22 to move vertically upward. The expansion film 22 then contacts the expansion inner ring and pushes the expansion inner ring and the film upward, thereby expanding the wafer on the film.

[0068] Meanwhile, as the support ring 64 continues to move downward, the outer crystal expansion ring is fitted onto the outside of the inner crystal expansion ring. As the support ring 64 moves downward, the limiting ring 654 comes into contact with the outer periphery of the crystal film. Supported by the crystal expansion film 22, the limiting ring 654 moves upward relative to the support ring 64 and disengages from the outer crystal expansion ring. This allows the outer crystal expansion ring to be stably fitted onto the inner crystal expansion ring and the outside of the crystal film. At the same time, the cutting blade 653 moves downward, simultaneously removing excess film material from the outside of the fitted outer crystal expansion ring under the support of the crystal expansion film 22.

[0069] Subsequently, the support ring 64 detaches from the expansion film 22 and moves upward. Then, through the operation of the pusher mechanism 7, the wafer expansion module is further pushed onto the feed conveyor belt 1. Through the operation of the feed conveyor belt 1, the wafer expansion module is further introduced into the die bonder.

[0070] A pushing mechanism 7 is provided on the side of the preparation platform 3 away from the feeding conveyor belt 1. The pushing mechanism 7 pushes the wafer expansion module that has completed the expansion onto the feeding conveyor belt 1.

[0071] As a supplementary explanation, the pushing mechanism 7 includes a pushing plate and an electric push rod. The electric push rod is fixedly installed on the feeding table 2, and the output end of the electric push rod is fixedly connected to the pushing plate. The pushing plate is used to push the circular expansion module. Example 2

[0072] Please see Figures 9 to 10Example 2 is a further supplementary description of Example 1. Specifically, the lifting component 61 includes a fixed frame 611, a lifting screw 612, a lifting motor 613, and a lifting block 614. The fixed frame 611 is fixedly installed on the feeding table 2. The lifting screw 612 is rotatably connected to the fixed frame 611. The lifting motor 613 is installed on the fixed frame 611 and is used to drive the lifting screw 612.

[0073] The lifting block 614 is slidably connected to the fixed frame 611, and the lifting block 614 is threadedly sleeved on the outside of the lifting screw 612. One end of the fixed plate 62 is fixedly connected to the lifting block 614.

[0074] When the fixed plate 62 is driven, the lifting motor 613 runs, which further rotates the lifting screw 612. When the lifting screw 612 rotates, it simultaneously provides driving force to the lifting block 614. As the lifting block 614 is limited by the fixed frame 611, the lifting block 614 drives the fixed plate 62 to move vertically up and down along the fixed frame 611.

[0075] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0076] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A feeding device of a die bonder, comprising a feeding conveyor (1) for feeding a wafer expansion module after wafer expansion, one end of the feeding conveyor (1) is provided with a feeding table (2), the feeding table (2) is provided with a cavity, and a push cylinder (21) is arranged in the cavity, and an expansion film (22) is fixedly connected to the output end of the push cylinder (21), characterized in that: One side of the feeding table (2) is provided with a standby table (3), the standby table (3) is slidably connected with a supporting workpiece plate (31), the standby table (3) is further provided with a guide (4), and the guide (4) is used for guiding the supporting workpiece plate (31), and the supporting workpiece plate (31) is used for supporting the expanded crystal inner ring and the crystal film; ​ The supporting workpiece plate (31) is further provided with a synchronous placing mechanism (5), and the synchronous placing mechanism (5) is used for synchronously placing the expanded crystal outer ring; The standby table (3) is further provided with a pressing and expanding crystal mechanism (6), the pressing and expanding crystal mechanism (6) is matched with the expanded crystal film (22), the crystal film is expanded at the same time, the expanded crystal outer ring is clamped outside the expanded crystal inner ring, and the excess film material is cut; One side of the standby table (3) and away from the feeding conveying belt (1) is provided with a pushing mechanism (7), the pushing mechanism (7) pushes the wafer expansion module completing the expansion to the feeding conveying belt (1).

2. The feeding device of a die bonder according to claim 1, wherein: The guide (4) comprises a supporting guide rail (41) and a limiting side plate (42), the supporting guide rail (41) is provided with two, the two supporting guide rails (41) are both mounted on the feeding table (2), the supporting workpiece plate (31) is provided with a sliding groove at the bottom and corresponding to the positions of the two supporting guide rails (41), and the limiting side plate (42) is fixedly installed on the side, away from the feeding table (2), of the supporting guide rail (41), and the feeding table (2) is used for limiting the supporting workpiece plate (31).

3. The feeding device of a die bonder according to claim 1, wherein: The supporting workpiece plate (31) is provided with a circular hole (311), and the inside of the circular hole (311) is provided with a supporting step (312) used for partially supporting the expanded crystal inner ring.

4. The feeding device of a die bonder according to claim 1, wherein: The synchronous placing mechanism (5) comprises a supporting column (51), a connecting plate (52), a limiting piece (53), a fixed disc (54) and an upward pushing piece (55), the supporting column (51) is fixedly installed on the supporting workpiece plate (31), the connecting plate (52) is rotatably sleeved on the supporting column (51), the limiting piece (53) is installed on the supporting column (51), and the limiting piece (53) is used for limiting the connecting plate (52); One end of the connecting plate (52) is fixedly connected with the fixed disc (54), and the connecting plate (52) is rotatably sleeved on the supporting column (51), the fixed disc (54) is provided with an annular groove, and the expanded crystal outer ring is located at the annular groove, the upward pushing piece (55) is installed between the bottom of the fixed disc (54) and the connecting plate (52), and the upward pushing piece (55) is used for assisting the expanded crystal outer ring to be connected with the pressing and expanding crystal mechanism (6).

5. The feeding device of a die bonder according to claim 4, wherein: The pressing and expanding mechanism (6) comprises a lifting piece (61), a fixed plate (62), a fixed column (63), a support ring frame (64), an adsorbing and cutting piece (65), a pressing plate (66) and a synchronous piece (67), the lifting piece (61) is installed on the feeding table (2), the fixed plate (62) is connected with the lifting piece (61), the fixed column (63) is installed at the other end of the fixed plate (62), and the support ring frame (64) is fixedly installed at the bottom of the fixed column (63), the support ring frame (64) is located directly above the feeding table (2), and the adsorbing and cutting piece (65) is installed on the support ring frame (64); The pressing plate (66) is located below the support ring frame (64), and the pressing plate (66) is used for fixing the crystal film, and the synchronous piece (67) is arranged between the support ring frame (64) and the pressing plate (66).

6. The feeding device of a die bonder according to claim 5, wherein: The adsorbing and cutting piece (65) comprises a vacuum suction ring (651), a vacuum pipe (652), a cutting knife (653), a limiting ring (654) and a buffer piece (655), the vacuum suction ring (651) is located below the support ring frame (64), and the vacuum suction ring (651) is used for adsorbing and fixing the expanding outer ring, a plurality of vacuum pipes (652) are arranged, the plurality of vacuum pipes (652) are all installed on the support ring frame (64), and the vacuum pipe (652) is in communication with the vacuum suction ring (651), the cutting knife (653) is arranged in an annular shape, and the cutting knife (653) is fixedly installed at the outer circle of the vacuum suction ring (651), and the cutting knife (653) is fixedly installed at the bottom of the support ring frame (64); The limiting ring (654) is slidably connected at the inner circle of the vacuum suction ring (651), and the buffer piece (655) is arranged on the support ring frame (64) and is used for connecting the limiting ring (654).

7. The feed device of a die bonder according to claim 6, wherein: The buffer piece (655) comprises a connecting rod (6551), a circular plate (6552) and a connecting spring (6553), a plurality of connecting rods (6551) are arranged, the plurality of connecting rods (6551) are all slidably penetrated through the support ring frame (64), the bottom of the connecting rod (6551) is fixedly connected with the limiting ring (654), the top of the connecting rod (6551) is fixedly connected with the circular plate (6552), the connecting spring (6553) is sleeved outside the connecting rod (6551), and the two ends of the connecting spring (6553) are fixedly connected with the circular plate (6552) and the support ring frame (64) respectively.

8. The feeding device of a die bonder according to claim 5, wherein: The synchronous piece (67) comprises a synchronous frame (671), a synchronous rod (672), a connecting lug (673), a guide rod (674) and a pressing piece (675), the synchronous frame (671) is fixedly installed on the support ring frame (64), the synchronous rod (672) is provided with two, the two synchronous rods (672) are all slidably penetrated through the synchronous frame (671), and the top of the synchronous rod (672) is fixedly connected with a top plate; Two connecting ears (673) are arranged on one side of the pressing plate (66), and the bottoms of the two synchronous rods (672) are fixedly connected with the two connecting ears (673) respectively. Two guide rods (674) are arranged on the two ends of the synchronous frame (671), and the guide rod (674) is connected with the pressing part (675), and the pressing part (675) is arranged on the feeding table (2).

9. The feed device of a die bonder according to claim 8, wherein: The bottom of the feeding table (2) corresponding to the connecting ear (673) is provided with a supporting block (68).

10. The feed device of a die bonder according to claim 8, wherein: The pressing part (675) comprises a pressing block (6751), a limiting spring (6752) and a positioning block (6753). The positioning block (6753) is fixedly arranged on the feeding table (2). The limiting spring (6752) comprises two limiting springs (6752). One end of the two limiting springs (6752) is fixedly connected with the positioning block (6753), and the other end of the two limiting springs (6752) is fixedly connected with the pressing block (6751). The pressing block (6751) is slidably connected with the positioning block (6753). The pressing block (6751) is provided with a pressing groove (67511). The guide rod (674) is slidably connected with the pressing groove (67511). The positioning block (6753) is provided with a movable opening corresponding to the position of the guide rod (674). One end of the pressing block (6751) close to the pressing plate (66) is a pressing end (67512).

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