Supporting device for bearing wafer and epitaxial growth equipment

Abstract

The utility model provides a supporting device for bearing a wafer and epitaxial growth equipment, and relates to the technical field of semiconductor manufacturing. Comprising a pedestal used for supporting a wafer in a reaction chamber, and the pedestal is provided with at least three through holes; the connecting shaft is used for supporting the base in the reaction chamber; the plurality of ejector pins are arranged in one-to-one correspondence with the through holes, each ejector pin comprises a connecting rod and a base which are connected in sequence, the connecting rods penetrate through the through holes, the tops of the connecting rods are used for bearing the wafer, the diameter of the bases is larger than that of the connecting rods, and the gap between the connecting rods and the through holes ranges from 1 mm to 3 mm; and the bearing assembly is movably arranged in the reaction chamber, and when the bearing assembly exerts acting force on the base, the connecting rod can be driven to extend out of the through hole. The problems of collision or adhesion between the ejector pin and the hole wall and wafer position deviation can be solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to support devices for supporting wafers and epitaxial growth equipment. Background Technology

[0002] Epitaxial Deposition (EPI) is a crucial thin-film growth process in semiconductor manufacturing, widely used to produce high-quality semiconductor devices. EPI processes deposit one or more layers of crystalline thin films on a wafer surface to form the desired semiconductor structure. EPI equipment typically employs a monolithic growth method, processing one wafer at a time to ensure precise control of growth conditions and high-quality thin-film deposition.

[0003] To automate wafer transfer and processing, EPI (Electronic Partition Imaging) machines are typically equipped with robotic arms for wafer pick-up and transfer operations. During pick-up, to detach the wafer from the substrate, ejector pins are usually used to lift it from below. The ejector pins move up and down through ejector pin holes on the substrate, stably lifting the wafer so that the robotic arm can pick it up from below and transfer it to the next processing position. In existing technologies, to ensure that the ejector pins can stand stably and accurately support the wafer, the size of the ejector pin holes is usually small. However, during EPI deposition, deposited material may accumulate in the ejector pin holes, causing the porosity to decrease. This not only increases the resistance during ejector pin lifting and lowering but may also cause collisions or adhesion between the ejector pin and the hole wall, exacerbating the risk of wafer misalignment. Utility Model Content

[0004] This application provides a support device and epitaxial growth equipment for supporting wafers, in order to solve the problems of collision or adhesion between the ejector pin and the hole wall, as well as wafer position displacement.

[0005] The technical solution adopted by this application to solve the above-mentioned technical problems is as follows:

[0006] This application provides a support device for supporting a wafer, comprising: a base for supporting the wafer within a reaction chamber, the base having at least three through holes; a connecting shaft for supporting the base within the reaction chamber; a plurality of ejector pins, each corresponding to one of the through holes, each ejector pin including a connecting rod and a base connected in sequence, the connecting rod passing through the through hole, the top of the connecting rod receiving the wafer, the diameter of the base being larger than the diameter of the connecting rod, and the gap between the connecting rod and the through hole ranging from 1mm to 3mm; and a receiving assembly movably disposed within the reaction chamber, which, when the receiving assembly applies a force to the base, can cause the connecting rod to extend out of the through hole.

[0007] Optionally, the bottom surface of the base is provided with an abutment groove. When the robot transfers the wafer to the top of the base, the receiving component moves into the abutment groove and applies force to the base.

[0008] Optionally, the ejector pin further includes a contact head connected to the top of the connecting rod, the diameter of the contact head being larger than the diameter of the connecting rod.

[0009] Optionally, the through hole is a stepped hole, the gap between the lower stepped hole and the connecting rod is in the range of 1mm to 3mm, the diameter of the upper stepped hole is larger than the diameter of the lower stepped hole, the diameter of the contact head is larger than the diameter of the lower stepped hole and smaller than the diameter of the upper stepped hole, and the thickness of the contact head is smaller than the depth of the upper stepped hole.

[0010] Optionally, the receiving assembly includes: a lifting member slidably connected to the connecting shaft; multiple support arms corresponding to the ejector pins, one end of each support arm being connected to the lifting member, and the other end of each support arm extending downward toward the corresponding base; multiple receiving plates corresponding to the multiple support arms and connected to the end of the corresponding support arm away from the lifting member, the receiving plates being located below the corresponding bases for receiving the corresponding bases; the receiving plates are provided with at least three limiting posts, which are accommodated in the abutment grooves when the receiving plate receives the base.

[0011] Optionally, the receiving plate is also provided with a plurality of stabilizing posts, each corresponding to a limiting post; one end of each stabilizing post is provided with a connecting buckle, and the top of each limiting post is provided with a connecting hole, the connecting buckle being engaged in the connecting hole to connect the stabilizing post and the limiting post, and the stabilizing post being able to tilt outward to abut against the side wall of the abutment groove.

[0012] Optionally, the top of the stabilizing column is hemispherical.

[0013] Optionally, the receiving assembly further includes: a plurality of constraint plates, each corresponding to one of the receiving plates, the constraint plates being connected to the corresponding support arms and located above the corresponding receiving plates, the constraint plates having constraint holes to allow the stabilizing column to retract, and when the receiving assembly receives the ejector pin, the constraint plates deform and bend toward the receiving plates to allow the stabilizing column to tilt outward.

[0014] Optionally, a limiting groove is provided around the constraint hole to limit the position of the base.

[0015] This application also provides an epitaxial growth apparatus, including the aforementioned support device for supporting wafers.

[0016] The beneficial effects of the support device and epitaxial growth equipment for carrying wafers provided in this application are as follows: by increasing the gap between the through hole and the connecting rod, the resistance, collision or sticking phenomenon during the lifting and lowering process of the ejector pin is reduced, and by increasing the base area of ​​the ejector pin, the stability of the ejector pin during the lifting and lowering process is improved, the possibility of ejector pin tilting is reduced, and the risk of wafer position displacement is reduced. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the support device for carrying wafers according to an embodiment of this application;

[0019] Figure 2 This is a cross-sectional view of the base and connecting shaft in an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the ejector pin structure in an embodiment of this application;

[0021] Figure 4 for Figure 1 Enlarged diagram of point A in the middle.

[0022] Icons: 10-Base; 11-Through hole; 20-Connecting shaft; 30-Ejector pin; 31-Connecting rod; 32-Base; 321-Abutment groove; 33-Contact head; 40-Supporting component; 41-Lifting component; 42-Supporting arm; 43-Supporting plate; 431-Limiting post; 432-Stabilizing post; 44-Constraint plate.

[0023] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in this application embodiment are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0026] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0028] In existing technologies, to ensure that the ejector pins can stand stably and accurately support the wafer, the size of the ejector pin holes is usually small. However, during the EPI deposition process, deposited material may accumulate in the ejector pin holes, causing the porosity to decrease. This not only increases the resistance during the ejector pin's lifting and lowering process but may also cause collisions or adhesion between the ejector pin and the hole wall, exacerbating the risk of wafer position displacement. To address the above problems, the embodiments of this application refer to... Figures 1 to 4 The following technical solutions are provided to overcome the above problems.

[0029] This application provides a support device for supporting a wafer, comprising: a base 10 for supporting the wafer within a reaction chamber, the base 10 having at least three through holes 11; a connecting shaft 20 for supporting the base 10 within the reaction chamber; a plurality of ejector pins 30, each corresponding to one of the through holes 11, each ejector pin 30 including a connecting rod 31 and a base 32 connected in sequence, the connecting rod 31 passing through the through hole 11, the top of the connecting rod 31 for receiving the wafer, the diameter of the base 32 being larger than the diameter of the connecting rod 31, the gap between the connecting rod 31 and the through hole 11 being in the range of 1mm to 3mm; and a receiving assembly 40, movably disposed within the reaction chamber, which, when the receiving assembly 40 applies a force to the base 32, can drive the connecting rod 31 to extend out of the through hole 11.

[0030] Specifically, the connecting rod 31 of the ejector pin 30 passes through the through hole 11 of the base 10. The gap between the through hole 11 and the connecting rod 31 is 1mm to 3mm, ensuring sufficient movement space for the connecting rod 31 during lifting. When it is necessary to lift the wafer on the base 10, the receiving assembly 40 applies an upward force to the base 32 of the ejector pin 30. Since the diameter of the base 32 is larger than the diameter of the connecting rod 31, the base 32 can stably withstand the force, preventing the connecting rod 31 from tilting, and lifting the wafer through the through hole 11 via the connecting rod 31. The lifting process of the ejector pin 30 is carried out within a large gap range, reducing friction and collision with the inner wall of the through hole 11. After the ejector pin 30 is raised, the wafer is stably supported on the top of the connecting rod 31 of the ejector pin 30. The robot can then pick up the wafer from below and transfer it to the next process position.

[0031] Understandably, increasing the gap (1mm~3mm) between the through hole 11 and the connecting rod 31 reduces the possibility of deposited material accumulating in the through hole 11. The larger gap ensures that even if a small amount of deposits accumulate, it will not significantly affect the lifting and lowering movement of the ejector pin 30, and reduces the friction between the ejector pin 30 and the inner wall of the through hole 11, thereby reducing the resistance during the lifting and lowering process of the ejector pin 30.

[0032] Furthermore, the diameter of the base 32 is larger than the diameter of the connecting rod 31, which increases the bottom area of ​​the base 32, improves the stability of the ejector pin 30 during the lifting process, and prevents the connecting rod 31 from tilting during the lifting process.

[0033] The support device for carrying wafers provided in the embodiments of this application reduces the resistance, bumping or sticking during the lifting and lowering of the ejector pin 30 by increasing the gap between the through hole 11 and the connecting rod 31. Furthermore, by increasing the area of ​​the base 32 of the ejector pin 30, the stability of the ejector pin 30 during the lifting and lowering process is improved, the possibility of the ejector pin 30 tilting is reduced, and the risk of wafer position displacement is reduced.

[0034] Please refer to Figure 1 and Figure 3 In some embodiments, the bottom end face of the base 32 is provided with an abutment groove 321. When the robot transfers the wafer to the top of the base 10, the receiving component 40 moves into the abutment groove 321 and applies force to the base 32.

[0035] Specifically, an abutment groove 321 is provided on the bottom surface of the base 32. This abutment groove 321 is used to cooperate with the receiving component 40. When the robot transfers the wafer above the base 10, the receiving component 40 moves into the abutment groove 321. The receiving component 40 applies an upward force to the base 32, and the force is transmitted to the base 32 through the abutment groove 321, thereby driving the ejector pin 30 to rise and lift the wafer.

[0036] Understandably, the bottom surface of the base 32 is provided with an abutment groove 321, which reduces the contact area between the base 32 and the receiving component 40 and avoids flatness problems that may be caused by large-area contact, because when there is a large-area contact, even a small unevenness will lead to uneven distribution of contact stress.

[0037] The base 32 provided in this embodiment reduces the contact area between the base 32 and the receiving component 40 by providing an abutment groove 321 on the bottom end surface of the base 32, thereby avoiding flatness problems caused by large-area contact, improving the flatness of the wafer during the lifting process, and reducing the risk of wafer position displacement.

[0038] In some embodiments, the ejector pin 30 further includes a contact head 33 connected to the top of the connecting rod 31, the diameter of the contact head 33 being larger than the diameter of the connecting rod 31.

[0039] Specifically, a contact head 33 is connected to the top of the connecting rod 31. The diameter of the contact head 33 is larger than the diameter of the connecting rod 31. The design of the contact head 33 allows the ejector pin 30 to provide a larger contact area and more stable support when it contacts the wafer. When the ejector pin 30 rises, the contact head 33 contacts the back side of the wafer, lifting the wafer. Because the diameter of the contact head 33 is larger than the diameter of the connecting rod 31, the contact head 33 can distribute the force more evenly, reducing local stress concentration on the wafer surface, thereby better protecting the wafer surface and avoiding damage caused by an insufficiently small contact point.

[0040] In some embodiments, the through hole 11 is a stepped hole, the gap between the lower stepped hole and the connecting rod 31 is in the range of 1mm to 3mm, the diameter of the upper stepped hole is larger than the diameter of the lower stepped hole, the diameter of the contact head 33 is larger than the diameter of the lower stepped hole and smaller than the diameter of the upper stepped hole, and the thickness of the contact head 33 is smaller than the depth of the upper stepped hole.

[0041] Specifically, the through-hole 11 is designed as a stepped hole, consisting of an upper stepped hole and a lower stepped hole. The lower stepped hole is used to accommodate the connecting rod 31, and the upper stepped hole is used to accommodate the contact head 33. The gap between the lower stepped hole and the connecting rod 31 is designed to be 1mm~3mm to ensure that the connecting rod 31 has sufficient room to move during lifting and lowering, while preventing the connecting rod 31 from tilting due to excessive gap. The thickness of the contact head 33 is less than the depth of the upper stepped hole, ensuring that when the ejector pin 30 descends to place the wafer on the base 10, the contact head 33 can be accommodated in the upper stepped hole, preventing the wafer from shifting on the base 10.

[0042] Please refer to Figure 1 and Figure 4 In some embodiments, the receiving component 40 includes: a lifting member 41, slidably connected to the connecting shaft 20; a plurality of support arms 42, each corresponding to one of the ejector pins 30, one end of each support arm 42 being connected to the lifting member 41, and the other end of each support arm 42 extending downward toward the corresponding base 32; a plurality of receiving plates 43, each corresponding to one of the support arms 42, and connected to the end of the corresponding support arm 42 away from the lifting member 41, the receiving plate 43 being located below the corresponding base 32 for receiving the corresponding base 32; the receiving plate 43 is provided with at least three limiting posts 431, and when the receiving plate 43 receives the base 32, the limiting posts 431 are accommodated in the abutment groove 321.

[0043] Specifically, the lifting component 41 is slidably connected to the connecting shaft 20 and can move up and down along the connecting shaft 20. The function of the lifting component 41 is to drive the entire receiving assembly 40 to move up and down, thereby controlling the ejector pin 30. Multiple support arms 42 are arranged one-to-one with the ejector pin 30, with one end connected to the lifting component 41 and the other end extending downward toward the corresponding base 32. Multiple receiving plates 43 are arranged one-to-one with the support arms 42 and are connected to the end of the support arm 42 away from the lifting component 41. The receiving plate 43 is located below the base 32 and is used to support the base 32. The design of the receiving plate 43 allows the ejector pin 30 to rise stably and ensures that the wafer is accurately ejected. The receiving plate 43 is provided with at least three limiting posts 431. When the receiving plate 43 supports the base 32, the limiting posts 431 are accommodated in the abutment groove 321 of the base 32. The function of the limiting post 431 is to ensure a stable connection between the receiving plate 43 and the base 32, and to reduce the possibility of the ejector pin 30 tilting or shifting during the lifting process.

[0044] Understandably, the receiving plate 43 is located below the base 32, and a stable connection between the receiving plate 43 and the base 32 is ensured by the engagement of the limiting post 431 with the abutment groove 321 of the base 32. The limiting post 431 is accommodated within the abutment groove 321. This design allows the ejector pin 30 to remain stable during the lifting process, reducing the risk of wafer position displacement caused by ejector pin 30 offset. By precisely controlling the lifting and lowering of the ejector pin 30, the wafer can be accurately and stably supported during the wafer pick-up process.

[0045] In some embodiments, the receiving plate 43 is further provided with a plurality of stabilizing posts 432, which are provided one-to-one with the limiting posts 431; one end of the stabilizing post 432 is provided with a connecting buckle, and the top end of the limiting post 431 is provided with a connecting hole. The connecting buckle is engaged in the connecting hole to connect the stabilizing post 432 with the limiting post 431. The stabilizing post 432 can tilt outward to abut against the side wall of the abutment groove 321.

[0046] Specifically, stabilizing columns 432 and limiting columns 431 are arranged in a one-to-one correspondence. Each stabilizing column 432 has a connecting buckle at one end, and the limiting column 431 has a connecting hole at its top. By engaging the connecting buckle into the connecting hole, the stabilizing column 432 and the limiting column 431 are connected, ensuring the stable fixation of the stabilizing column 432 on the receiving plate 43. The stabilizing column 432 is designed to tilt outward. When the receiving plate 43 supports the base 32, the stabilizing column 432 can tilt outward and abut against the side wall of the abutment groove 321. This design allows the stabilizing column 432 to provide additional lateral support when supporting the base 32, reducing the swaying or tilting of the base 32 during lifting and lowering.

[0047] Understandably, the connection design between the stabilizing post 432 and the limiting post 431 allows the receiving plate 43 to provide more stable support when receiving the base 32. The snap-fit ​​structure of the connecting buckle and the connecting hole ensures a firm connection between the stabilizing post 432 and the limiting post 431, reducing loosening or detachment caused by external forces. The stabilizing post 432 can tilt outward and abut against the side wall of the abutment groove 321. This design provides additional lateral support when the base 32 is raised, reducing the possibility of the base 32 tilting or wobbling during lifting. The tilting function of the stabilizing post 432 further enhances the stability between the receiving assembly 40 and the base 32, ensuring that the ejector pin 30 can stably lift the wafer.

[0048] In some embodiments, the top of the stabilizing column 432 is hemispherical.

[0049] Specifically, the hemispherical top of the stabilizing post 432 allows for a more even distribution of contact force when it contacts the sidewall of the contact groove 321. The hemispherical top automatically adjusts the contact point position during contact, reducing stress concentration caused by uneven contact surfaces. When the stabilizing post 432 tilts outward and abuts the sidewall of the contact groove 321, the hemispherical top provides a more stable contact point, reducing wobbling or tilting caused by uneven contact surfaces. The hemispherical top design allows the stabilizing post 432 to better adapt to the shape of the contact groove 321 during contact, improving contact stability and reliability.

[0050] In some embodiments, the receiving assembly 40 further includes: a plurality of constraint plates 44, which are arranged one-to-one with the receiving plate 43. The constraint plate 44 is connected to the corresponding support arm 42 and is located above the corresponding receiving plate 43. The constraint plate 44 has constraint holes to allow the stabilizing column 432 to retract. When the receiving assembly 40 receives the ejector pin 30, the constraint plate 44 deforms and bends toward the receiving plate 43 to allow the stabilizing column 432 to tilt outward.

[0051] Specifically, the constraint plate 44 is positioned one-to-one with the receiving plate 43, located above the receiving plate 43, and connected to the support arm 42. The main function of the constraint plate 44 is to control the tilt state of the stabilizing column 432. The constraint plate 44 has constraint holes to accommodate the stabilizing column 432. When the constraint plate 44 is in its initial position, the constraint holes restrict the position of the stabilizing column 432, keeping it in a retracted state. When the receiving assembly 40 needs to receive the ejector pin 30, the constraint plate 44 deforms and bends towards the receiving plate 43. This deformation causes the position of the constraint holes to change, thereby allowing the stabilizing column 432 to tilt outward, abutting against the side wall of the abutment groove 321, providing additional lateral support.

[0052] Under normal conditions, the constraint plate 44 restricts the position of the stabilizing post 432 through the constraint holes, keeping it in a retracted state and preventing disordered movement of the stabilizing post 432 when not in operation. When the ejector pin 30 needs to be received, the deformation and bending action of the constraint plate 44 releases the stabilizing post 432, allowing it to tilt outward and form a stable contact with the sidewall of the abutment groove 321. The deformation and bending design of the constraint plate 44 allows for dynamic adjustment of the state of the stabilizing post 432 at different operational stages. This design enables the receiving assembly 40 to flexibly adjust the tilt angle of the stabilizing post 432 as needed, ensuring stable lateral support during the lifting of the ejector pin 30. By controlling the tilt of the stabilizing post 432 through the deformation of the constraint plate 44, the potential wobbling or tilting of the ejector pin 30 during lifting is reduced, thereby improving the stability of the wafer during the wafer pick-up process.

[0053] In some embodiments, a limiting groove is formed around the constraint hole to limit the base 32.

[0054] Specifically, a limiting groove is formed around the constraint hole. This limiting groove is used to limit the base 32. The position and size design of the limiting groove ensures that the base 32 can be stably restricted to a predetermined position during lifting and lowering, reducing swaying or displacement. When the base 32 is raised, the limiting groove restricts the range of motion of the base 32, ensuring that the base 32 moves stably within the predetermined position. The design of the limiting groove ensures that the base 32 will not exceed the predetermined range during lifting and lowering, thereby improving the stability of the entire supporting assembly 40.

[0055] This application also provides an epitaxial growth apparatus, including the aforementioned support device for supporting wafers.

[0056] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A support device for supporting a wafer, characterized in that, include: A base for supporting a wafer within a reaction chamber, the base having at least three through holes; A connecting shaft is used to support the base within the reaction chamber; Multiple ejector pins are provided, each corresponding to a through hole. Each ejector pin includes a connecting rod and a base connected in sequence. The connecting rod passes through the through hole, and the top of the connecting rod is used to support the wafer. The diameter of the base is larger than the diameter of the connecting rod, and the gap between the connecting rod and the through hole is in the range of 1mm to 3mm. The receiving component is movably disposed within the reaction chamber. When the receiving component applies a force to the base, it can cause the connecting rod to extend out of the through hole.

2. The support device for supporting a wafer according to claim 1, characterized in that, The bottom surface of the base is provided with an abutment groove. When the robot transfers the wafer to the top of the base, the receiving component moves into the abutment groove and applies force to the base.

3. The support device for supporting a wafer according to claim 2, characterized in that, The ejector pin also includes: A contact head is attached to the top of the connecting rod, and the diameter of the contact head is larger than the diameter of the connecting rod.

4. The support device for supporting a wafer according to claim 3, characterized in that, The through hole is a stepped hole, and the gap between the lower stepped hole and the connecting rod is in the range of 1mm to 3mm. The diameter of the upper stepped hole is larger than the diameter of the lower stepped hole. The diameter of the contact head is larger than the diameter of the lower stepped hole and smaller than the diameter of the upper stepped hole. The thickness of the contact head is smaller than the depth of the upper stepped hole.

5. The support device for carrying a wafer according to claim 2, characterized in that, The receiving component includes: The lifting component is slidably connected to the connecting shaft; Multiple support arms are provided, each corresponding to a pin. One end of each support arm is connected to the lifting component, and the other end of each support arm extends downward toward the corresponding base. Multiple receiving plates are provided in a corresponding manner to the multiple support arms, and are connected to the end of the corresponding support arm away from the lifting component. The receiving plates are located below the corresponding base and are used to support the corresponding base. The receiving plate is provided with at least three limiting posts. When the receiving plate receives the base, the limiting posts are accommodated in the abutment groove.

6. The support device for carrying a wafer according to claim 5, characterized in that, The receiving plate is also provided with a plurality of stabilizing columns, and the stabilizing columns are provided one-to-one with the limiting columns; One end of the stabilizing column is provided with a connecting buckle, and the top of the limiting column is provided with a connecting hole. The connecting buckle is engaged in the connecting hole to connect the stabilizing column and the limiting column. The stabilizing column can tilt outward to abut against the side wall of the abutment groove.

7. The support device for carrying a wafer according to claim 6, characterized in that, The top of the stabilizing column is hemispherical.

8. The support device for carrying a wafer according to claim 7, characterized in that, The receiving component also includes: Multiple constraint plates are provided, each corresponding to a receiving plate. The constraint plate is connected to the corresponding support arm and is located above the corresponding receiving plate. The constraint plate has constraint holes to allow the stabilizing column to retract. When the receiving assembly receives the ejector pin, the constraint plate deforms and bends toward the receiving plate to allow the stabilizing column to tilt outward.

9. The support device for carrying a wafer according to claim 8, characterized in that, A limiting groove is provided around the constraint hole to limit the position of the base.

10. An epitaxial growth apparatus, characterized in that, Includes the support device for carrying wafers as described in any one of claims 1-9.

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