A guide roller for a polishing cleaning apparatus and a polishing cleaning apparatus

Abstract

This utility model relates to the field of semiconductor technology and discloses a guide roller for a grinding and cleaning device, comprising: a rotating shaft, two bearings, and a receiving housing. The rotating shaft includes a first connecting section and a second connecting section that are detachably connected. The first connecting end has two mounting positions spaced apart along the axial direction. The two bearings are respectively sleeved on the two mounting positions of the first connecting end. The receiving housing is sleeved on the two bearings to rotate synchronously with the bearings. This utility model achieves good rotational performance through the rotating shaft and the bearing structure mounted on the rotating shaft. The housing that receives the wafer can effectively ensure the normal rotation of the rotating shaft through such a rotating structure. Combined with the dual bearing design, it effectively disperses mechanical stress, thereby improving the synchronization between the guide roller and the wafer rotation.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to guide rollers for grinding and cleaning devices. Specifically, it can be applied to logic elements, mixed-signal elements, embedded memory, BCD (bipolar-complementary metal-oxide-semiconductor-double-diffused metal-oxide-semiconductor), trench transistors (trench MOSFETs), and high-voltage components (such as power management integrated circuits) and related products and processes. Background Technology

[0002] In semiconductor manufacturing plants, after chemical polishing, wafers need to be cleaned to remove residual substances. The WCMP 7700 Cleaner is a cleaning unit used after chemical polishing. It consists of two units, one providing HF acid at a concentration of 100:1 and the other providing 0.6% ammonia water, to clean the polishing slurry and organic residues from the wafer surface.

[0003] During wafer processing, upper and lower brush heads clamp the wafer and rotate it counterclockwise for cleaning. Multiple guide rollers support the wafer around its circumference. The leftmost passive guide roller detects whether the wafer is rotating, enabling real-time monitoring of abnormalities such as improper wafer positioning, brush head malfunction, and unstable brush pressure. Current problems: Existing rotary rollers cannot adequately adapt to wafer rotation, have short lifespans, and cause significant friction, leading to machine malfunctions. Engineers need to frequently inspect and replace these components to provide more stable machine operation.

[0004] Therefore, there is a need in the prior art for improvements to the guide rollers used in grinding and cleaning devices. Utility Model Content

[0005] In view of this, the purpose of this utility model embodiment is to provide a guide roller for a grinding and cleaning device, which improves the sensitivity and stability of the device by improving the rotating shaft structure to better adapt to the rotation of the wafer.

[0006] Based on the above objectives, this utility model provides a guide roller and a rotating shaft for a grinding and cleaning device. The rotating shaft includes a first connecting section and a second connecting section that are detachably connected. The first connecting section has two mounting positions that are spaced apart along the axial direction.

[0007] Two bearings are respectively fitted onto two mounting positions on the first connecting section;

[0008] The housing is mounted on two bearings so that it rotates synchronously with the bearings.

[0009] In some embodiments, the bearing includes, radially from the outside in, an outer ring, a cage, and an inner ring, the cage having a plurality of slots circumferentially in which balls are placed.

[0010] In some embodiments, the cage slots have a U-shaped cross-section, the spacing between adjacent slots is 1.2-1.5 times the diameter of the ball, and the number of slots is 8-12, evenly distributed circumferentially.

[0011] In some embodiments, the bearing is a ceramic bearing, with the outer ring, inner ring, and balls all made of zirconium oxide, and the cage made of polyetheretherketone.

[0012] In some embodiments, the receiving housing includes an upper housing with a first diameter and a lower housing with a second diameter, the second diameter being larger than the first diameter, and the upper housing being tightly fitted with the bearing so that the receiving housing rotates synchronously with the bearing.

[0013] In some implementations, the receiving housing is a one-piece molded housing.

[0014] In some embodiments, the top surface of the lower housing is provided with raised anti-slip textures.

[0015] In some implementations, the first connecting segment and the second connecting end are detachably assembled via a threaded connection structure.

[0016] In some embodiments, a rubber buffer layer is provided between the outer ring of the ceramic bearing and the receiving housing.

[0017] In another aspect, this utility model also provides a grinding and cleaning device, including the aforementioned plurality of guide rollers distributed along the circumferential direction of the wafer epitaxy, wherein the wafer is supported by a receiving shell of the guide rollers.

[0018] This utility model has at least the following beneficial technical effects:

[0019] The guide roller provided by this utility model is designed with a rotating shaft and a bearing structure mounted on the rotating shaft to achieve good rotation performance. The housing that supports the wafer can effectively ensure the normal rotation of the rotating shaft through such a rotating structure. Combined with the dual bearing design, it effectively disperses mechanical stress, improves the synchronization between the guide roller and the wafer rotation by more than 30%, reduces the risk of wafer misalignment, and thus maintains the normal operation of the machine.

[0020] Specifically, this invention can be applied to logic elements, mixed-signal elements, embedded memories, BCD (bipolar-complementary metal-oxide-semiconductor-double-diffused metal-oxide-semiconductor), trench MOSFETs, and high-voltage components (such as power management integrated circuits) and related products and processes. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other embodiments can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of an embodiment of the guide roller structure provided by this utility model;

[0023] Figure 2 A schematic diagram of an embodiment of the bearing structure provided by this utility model;

[0024] Figure 3 This is a schematic diagram of an embodiment of the grinding and cleaning device provided by this utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] 10. Shaft; 11. First connecting section; 12. Second connecting section; 20. Bearing; 21. Cage; 22. Inner ring; 23. Ball; 24. Outer ring; 30. Housing; 31. Upper housing; 32. Lower housing; 40. Wafer. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be further described in detail below with reference to specific examples and accompanying drawings.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. For example, terms such as “length,” “width,” “upper,” “lower,” “left,” “right,” “front,” “rear,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” indicate orientations or positions based on the orientations or positions shown in the accompanying drawings and are merely for ease of description and should not be construed as limiting the invention.

[0029] The terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this utility model are intended to cover non-exclusive inclusion; the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. "A plurality of" means two or more, unless otherwise explicitly specified.

[0030] In the description, claims, and accompanying drawings of this utility model, when an element is referred to as "fixed to," "mounted to," "set on," or "connected to" another element, it can be directly or indirectly located on that other element. For example, when an element is referred to as "connected to" another element, it can be directly or indirectly connected to that other element.

[0031] Furthermore, the reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] like Figures 1-3 A schematic diagram of the guide roller structure for the grinding and cleaning device provided by this utility model includes:

[0033] The rotating shaft 10 includes a first connecting section 11 and a second connecting section 12 that are detachably connected. The first connecting section 11 has two mounting positions that are spaced apart along the axial direction.

[0034] Two bearings 20 are respectively fitted onto two mounting positions of the first connecting section 12;

[0035] The housing 30 is mounted on two bearings 20 so that it rotates synchronously with the bearings 20.

[0036] In some implementations, such as Figure 2 As shown, the bearing 20 includes, radially from the outside to the inside, an outer ring 24, a cage 21, and an inner ring 22. The cage 21 has multiple slots along the circumferential direction, in which balls 23 are placed. The slot layout ensures precise circumferential positioning of the balls during operation, effectively eliminating disordered displacement of the rolling elements and significantly improving the uniformity of load distribution. This structure reduces frictional losses by constraining the ball movement trajectory, while enhancing the dynamic stability of the bearing during high-speed rotation. The optimized mechanical transmission path can suppress abnormal vibrations and reduce potential damage to the wafer surface. In some embodiments, the slots of the cage 21 have a U-shaped cross-section, the spacing between adjacent slots is 1.2-1.5 times the diameter of the ball, and the number of slots is 8-12, evenly distributed circumferentially.

[0037] In some embodiments, bearing 20 is a ceramic bearing, outer ring 24, inner ring 22, and balls 23 are all made of zirconium oxide, and cage 21 is made of polyetheretherketone (PEEK). Because the grinding device is exposed to acidic and alkaline environments for extended periods, the rotating shaft of the guide roller is highly susceptible to corrosion, typically becoming unusable within two months, causing machine malfunctions and alarms. Frequent replacement and maintenance are wasteful of manpower and resources. Therefore, this invention employs an innovative material combination of zirconium oxide ceramic bearing components and a PEEK cage, significantly improving the overall performance of the bearing in chemically corrosive environments. The zirconium oxide material imparts excellent acid and alkali corrosion resistance and high hardness to the outer ring, inner ring, and balls, effectively resisting cleaning fluid erosion and reducing the generation of friction particles, thus preventing wafer surface contamination.

[0038] In some embodiments, the receiving housing 30 includes an upper housing 31 with a first diameter and a lower housing 32 with a second diameter, the second diameter being larger than the first diameter, and the upper housing 31 being tightly fitted with the bearing 20 so that the receiving housing rotates synchronously with the bearing 20.

[0039] In some embodiments, the receiving housing 30 is a one-piece molded housing, and the interior of the receiving housing has a mounting seat that matches the size of the bearing, which can be directly fitted onto the bearing.

[0040] In some embodiments, the top surface of the lower housing 32 is provided with raised anti-slip textures, which can increase the friction between the wafer and the receiving housing and prevent slippage.

[0041] In some embodiments, the first connecting section 11 and the second connecting end 12 are detachably assembled via a threaded connection structure. This detachable threaded connection structure enables rapid disassembly and modular maintenance of the guide roller assembly, ensuring connection stability while reducing component replacement costs and enhancing the equipment's flexibility to adapt to different process requirements.

[0042] In some embodiments, a rubber buffer layer is provided between the outer ring of the ceramic bearing 20 and the receiving housing 30. This rubber buffer layer can increase friction, making the contact force between the housing and the bearing greater. On the other hand, the added rubber buffer layer forms a flexible interface between the ceramic bearing and the housing, effectively absorbing mechanical vibration and impact loads during operation, reducing the direct transmission of stress to the precision structure of the bearing, and enhancing the fatigue resistance of the system.

[0043] This utility model also provides a grinding and cleaning device, such as... Figure 3As shown, the system includes multiple guide rollers distributed along the circumferential direction of the wafer epitaxy. A threaded connection structure quickly locks the first connecting section and the second connecting end of each guide roller to the equipment base, ensuring that the support surface formed by the receiving housing is level. Bearings and the receiving housing are then assembled, and the wafer is supported by the receiving housing of the guide rollers. When the upper and lower brush heads are activated, they clamp the wafer and rotate counterclockwise, causing the guide rollers to rotate passively and synchronously with the wafer. The speed sensor on the leftmost guide roller provides real-time feedback on the wafer's movement status. If abnormal speed or excessive vibration is detected, the faulty guide roller can be quickly disassembled and replaced. The corrosion resistance of the ceramic bearings reduces the frequency of downtime for cleaning.

[0044] The above are exemplary embodiments disclosed in this utility model. However, it should be noted that various changes and modifications can be made without departing from the scope of the embodiments of this utility model as defined by the claims. The functions, steps, and / or actions of the methods according to the disclosed embodiments described herein do not need to be performed in any particular order. Furthermore, although the elements disclosed in the embodiments of this utility model may be described or claimed individually, they may be understood as multiple unless explicitly limited to a singular number.

[0045] It should be understood that, as used herein, the singular form “a” is intended to include the plural form as well, unless the context clearly supports an exception. It should also be understood that, as used herein, “and / or” refers to any and all possible combinations of one or more of the associated listed items.

[0046] The embodiment numbers disclosed in the above-described embodiments of the present utility model are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0047] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples. Within the framework of the present invention, technical features of the above embodiments or different embodiments can also be combined, and many other variations of different aspects of the present invention exist, which are not provided in the details for the sake of brevity. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A guide roller for a grinding and cleaning apparatus, characterized in that, include: A rotating shaft, comprising a detachably connected first connecting segment and a second connecting segment, wherein the first connecting segment has two mounting positions spaced apart along the axial direction; Two bearings are respectively fitted onto two mounting positions of the first connecting section; A receiving housing is fitted onto the two bearings to rotate synchronously with them.

2. The guide roller for the grinding and cleaning device according to claim 1, characterized in that, The bearing comprises, from the outside to the inside, an outer ring, a cage, and an inner ring in the radial direction. The cage has multiple slots in the circumferential direction, and balls are placed in the slots of the cage.

3. The guide roller for the grinding and cleaning device according to claim 2, characterized in that, The retainer has a U-shaped cross-section for its slots, with the spacing between adjacent slots being 1.2-1.5 times the diameter of the ball bearing. The number of slots is 8-12, evenly distributed circumferentially.

4. The guide roller for the grinding and cleaning device according to claim 2, characterized in that, The bearing is a ceramic bearing, the outer ring, inner ring and balls are all made of zirconium oxide, and the cage is made of polyetheretherketone.

5. The guide roller for a grinding and cleaning apparatus according to claim 1, characterized in that, The receiving housing includes an upper housing with a first diameter and a lower housing with a second diameter, the second diameter being larger than the first diameter. The upper housing is tightly fitted with the bearing so that the receiving housing rotates synchronously with the bearing.

6. The guide roller for a grinding and cleaning apparatus according to claim 1, characterized in that, The receiving shell is a one-piece molded shell.

7. The guide roller for a grinding and cleaning apparatus according to claim 5, characterized in that, The top surface of the lower housing is provided with raised anti-slip texture.

8. The guide roller for a grinding and cleaning apparatus according to claim 1, characterized in that, The first connecting segment and the second connecting end are detachable and can be assembled through a threaded connection structure.

9. The guide roller for a grinding and cleaning apparatus according to claim 4, characterized in that, A rubber buffer layer is provided between the outer ring of the ceramic bearing and the receiving housing.

10. A grinding and cleaning apparatus, characterized in that, The wafer includes a plurality of guide rollers as described in any one of claims 1 to 9 distributed along the circumferential direction of the wafer epitaxial layer, and the wafer is supported by a receiving housing of the guide rollers.

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