Spray cooling system and cooling method

Abstract

The application discloses a spray cooling system and a cooling method suitable for the spray cooling system. The spray cooling system comprises a liquid storage tank, a first suction pump, a spray chamber, a distributor and a condenser which are sequentially connected and form a cooling loop. Cooling liquid circulates in the cooling loop. The inner cavity of the spray chamber is used for arranging semiconductor devices. The spray chamber is connected with a vacuum pump. The vacuum pump is used for maintaining the air pressure in the spray chamber to be lower than the atmospheric pressure. The cooling liquid sprayed on the semiconductor devices is evaporated at a lower boiling point than the cooling liquid under the atmospheric pressure. The gaseous cooling liquid is discharged into the condenser through a steam discharge pipe. Under the same cooling requirement, the air pressure in the spray chamber is reduced by the vacuum pump, the heat absorption capacity and the heat absorption efficiency of the cooling liquid are improved, the operation power of the first suction pump and the condenser is reduced, and the energy consumption is reduced.

Description

Technical Field

[0001] This invention relates to the field of cooling and heat dissipation equipment technology, and particularly to spray cooling systems and cooling methods. Background Technology

[0002] Semiconductor devices, including chips, are experiencing increasingly higher power consumption as technology advances. For example, the giant chip WFER-Scle Engine 2, manufactured from a single wafer, integrates 2.6 trillion transistors and consumes up to 23 kW. This increased power consumption is accompanied by increased heat generation, and high temperatures severely impact the performance of semiconductor devices. Current thermal management methods for chips include air-cooled heat sinks (such as air conditioning units in computer rooms), fluorinated liquid immersion cooling, and water-cooled aisle plates. These methods have relatively low cooling efficiency and are often used to handle kilowatt-level heat loads, with heat flux densities generally below 100 W / cm². They are insufficient for the heat dissipation requirements of high-power, highly integrated chips, and often resort to increasing energy consumption to improve cooling efficiency. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a spray cooling system for cooling semiconductor devices, which is energy-saving and has high cooling efficiency.

[0004] The present invention also proposes a cooling method for cooling semiconductor devices.

[0005] According to a first aspect of the present invention, a spray cooling system includes a liquid storage tank, a spray chamber, a distributor, a condenser, a second return pipe, a steam pipe, and a pressure regulating branch. The liquid storage tank is used to store coolant. The inner cavity of the spray chamber is used to house a semiconductor device. The distributor includes a distribution inlet and multiple distribution outlets. The liquid storage tank is connected to the distribution inlet via a delivery pipe. The multiple distribution outlets are respectively connected to multiple spray nozzles extending into the spray chamber. The multiple spray nozzles are arranged in an array and the spray direction is towards the semiconductor device. A first suction pump is provided on the delivery pipe. The condenser includes a coolant inlet and a coolant outlet. The coolant outlet is connected to the liquid storage tank via the first return pipe. One end of the second return pipe is connected to the bottom of the spray chamber, and the other end of the second return pipe is connected to the coolant inlet to transport the liquid coolant in the spray chamber into the condenser. One end of the steam pipe is connected to the top of the spray chamber. The other end is connected to the coolant inlet to transport the vaporized coolant in the spray chamber into the condenser; the pressure regulating branch includes an extraction pipe and a vacuum pump. The two ends of the extraction pipe are connected to the spray chamber and the extraction end of the vacuum pump, respectively. The exhaust end of the vacuum pump is connected to the atmosphere. A first control valve and a water vapor separator are sequentially arranged on the extraction pipe along the direction from the spray chamber to the vacuum pump. The first control valve can close the extraction pipe to prevent outside air from flowing back into the spray chamber. The vacuum pump and the first control valve are used to maintain the air pressure in the spray chamber below atmospheric pressure so that the coolant sprayed on the semiconductor device evaporates at a boiling point below atmospheric pressure. The drain port of the water vapor separator is connected to the coolant inlet through a third return pipe, and a drain valve is provided in the drain port so that the coolant drawn by the vacuum pump to the water vapor separator flows back to the condenser.

[0006] It has at least the following beneficial effects: Opening the first control valve and the vacuum pump allows the vacuum pump to remove air from the spray chamber, reducing the air pressure and lowering the boiling point of the coolant entering the spray chamber. When the coolant comes into contact with the heat-generating semiconductor device, it rapidly evaporates, converting some of the liquid coolant into vapor. The vapor and the still-liquid coolant in the spray chamber are discharged into the condenser through the vapor supply pipe and the second return pipe, respectively. After releasing heat in the condenser, the coolant flows back to the storage tank. The vaporized coolant can absorb more heat with higher efficiency, improving the overall cooling effect and efficiency of the cooling system. The water vapor separator, the drain valve within the water vapor separator, and the third return pipe discharge any coolant accidentally drawn in by the vacuum pump into the condenser, achieving coolant recovery. Further reducing the air pressure in the spray chamber, further increasing the flow rate of the coolant sprayed onto the semiconductor device, and further increasing the temperature difference between the coolant sprayed onto the semiconductor device and the semiconductor device can all improve the cooling efficiency and cooling effect of the cooling system, improve the heat dissipation efficiency of the semiconductor device, prevent the semiconductor device from overheating, and thus ensure the normal operation of the semiconductor device. Under the same cooling requirements, after reducing the air pressure in the spray chamber by a vacuum pump, closing the vacuum pump and the first control valve increases the heat absorption capacity and efficiency of the coolant. At this time, the flow rate of the coolant sprayed onto the semiconductor device can be reduced, and the temperature difference between the coolant sprayed onto the semiconductor device and the semiconductor device can also be reduced. This means that the operating power of the first suction pump and the condenser can be reduced, thereby reducing energy consumption.

[0007] According to some embodiments of the present invention, a second control valve is provided on the third return pipe, the second control valve being used to close or open the third return pipe.

[0008] According to some embodiments of the present invention, the spray chamber is provided with an air extraction port in the middle, and one end of the air extraction pipe is connected to the air extraction port.

[0009] According to some embodiments of the present invention, a flow regulating branch is further included, the flow regulating branch including a branch pipe and a first regulating valve disposed on the branch pipe, a flow meter is disposed in the region between the first suction pump and the spray chamber, the liquid delivery pipe is connected to one end of the branch pipe in the region between the first suction pump and the flow meter, and the other end of the branch pipe is connected to the liquid storage tank.

[0010] According to some embodiments of the present invention, the plurality of liquid outlets are respectively connected to the plurality of spray nozzles through the plurality of liquid distribution pipes, and each of the plurality of liquid distribution pipes is provided with a second regulating valve, which regulates the flow rate of the corresponding spray nozzle to individually regulate the temperature of the region on the semiconductor device corresponding to the spray nozzle.

[0011] According to some embodiments of the present invention, a second pressure sensor is provided on the liquid delivery pipe in a region near the distributor, the second pressure sensor detecting the pressure of the coolant entering the distributor.

[0012] According to some embodiments of the present invention, the plurality of spray nozzles are arranged in a rectangular or circular array so that the plurality of spray nozzles can cover all areas of the semiconductor device.

[0013] According to some embodiments of the present invention, a second suction pump is provided on the second return pipe to accelerate the flow of coolant in the spray chamber into the condenser.

[0014] According to some embodiments of the present invention, a shut-off valve is provided on the liquid delivery pipe in the area between the first suction pump and the liquid storage tank, the shut-off valve being used to prevent the coolant in the liquid delivery pipe from flowing back into the liquid storage tank.

[0015] According to a second aspect of the present invention, a cooling method applicable to the above-described spray cooling system includes the following steps: placing a semiconductor device in a sealed spray chamber; when the semiconductor device reaches a preset temperature value, starting the vacuum pump to remove air from the spray chamber to reduce the air pressure in the spray chamber to a preset air pressure value; starting the first suction pump and the condenser to circulate the coolant in a cooling circuit formed by sequentially connecting a storage tank, the first suction pump, a distributor, the spray chamber, and the condenser; adjusting the flow rate of the coolant sprayed onto the semiconductor device by controlling the operating power of the first suction pump; the coolant sprayed onto the semiconductor device evaporates at a boiling point lower than atmospheric pressure; the vaporized coolant is transported into the condenser through a steam pipe; the vaporized coolant releases heat and reverts to a liquid state in the condenser; the coolant drawn by the vacuum pump to the water vapor separator flows back to the condenser through a third return pipe; all the liquid coolant is cooled in the condenser; and adjusting the temperature of the coolant returning to the storage tank by controlling the operating power of the condenser.

[0016] It has at least the following beneficial effects: the vacuum pump reduces the air pressure in the spray chamber, which lowers the boiling point of the coolant in the spray chamber. When sprayed onto the semiconductor device, the coolant evaporates rapidly, improving the cooling efficiency and cooling capacity of the semiconductor device. It can significantly reduce the energy consumption of the first suction pump and the condenser, thereby reducing the energy consumption for cooling the semiconductor device.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the spray chamber and spray nozzle according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the spray chamber and spray nozzle according to another embodiment of the present invention;

[0022] Reference numerals in the attached diagram: 1. Liquid storage tank; 11. Liquid delivery pipe; 111. First suction pump; 112. Flow meter; 113. Second pressure sensor; 114. Second temperature sensor; 115. Filter; 116. Shut-off valve; 12. Branch pipe; 121. First regulating valve; 13. Suction pipe; 131. First control valve; 132. Water vapor separator; 133. Second control valve; 2. Spray chamber; 21. First pressure sensor; 3. Distributor; 31. Spray nozzle; 32. Second regulating valve; 4. Condenser; 5. Vacuum pump; 6. Second suction pump. Detailed Implementation

[0023] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0024] In the description of this invention, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0025] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0026] It should be understood that the pipe-to-pipe connections mentioned in this application generally include physical connections between pipe walls and communication between pipe cavities. The connection between a pipe and its inlet / outlet is generally understood as a physical connection between the pipe wall and the outer wall of the inlet / outlet, and communication between the pipe cavity and the inner cavity of the inlet / outlet. The coolant can be ultrapure water, or a general-purpose coolant, ensuring that the coolant contacts the semiconductor device to remove heat without damaging the device, and that the coolant does not interfere with the normal operation of the semiconductor device.

[0027] Reference Figure 1 This invention discloses a spray cooling system, including a liquid storage tank 1, a spray chamber 2, a distributor 3, a condenser 4, and a pressure regulating branch. The liquid storage tank 1 is used to store coolant. The inner cavity of the spray chamber 2 is used to house a semiconductor device. The semiconductor device is connected to a first temperature sensor, which is used to detect the temperature of the semiconductor device in real time. A first pressure sensor 21 is installed in the spray chamber 2 to detect the pressure inside the spray chamber 2. The distributor 3 includes a dispensing inlet and multiple dispensing outlets. The liquid storage tank 1 is connected to the dispensing inlet through a liquid delivery pipe 11. The multiple dispensing outlets are respectively connected to multiple spray nozzles 31 extending into the spray chamber 2. The multiple spray nozzles 31 are arranged in an array and the spray direction is towards the semiconductor device. The spray nozzles 31 are used to spray the coolant in a mist onto the semiconductor device. The liquid delivery pipe 11 is equipped with a first suction pump 111, a flow meter 112, and a second... Temperature sensor 114 and flow meter 112 are used to measure the flow rate of coolant entering spray chamber 2. Second temperature sensor 114 is used to detect the temperature of coolant entering spray chamber 2 in real time. Condenser 4 includes coolant inlet and coolant outlet. Coolant outlet is connected to storage tank 1 through first return pipe. One end of second return pipe is connected to the bottom of spray chamber 2, and the other end of second return pipe is connected to coolant inlet to transport liquid coolant in spray chamber 2 into condenser 4. One end of steam pipe is connected to the top of spray chamber 2, and the other end of steam pipe is connected to coolant inlet to transport vaporized coolant in spray chamber 2 into condenser 4. Condenser 4 is used to release heat to vaporized and liquid coolant entering condenser 4. Vaporized coolant entering condenser 4 is restored to liquid coolant and cooled down, and liquid coolant entering condenser 4 is also cooled down.

[0028] The coolant storage tank 1, the first suction pump 111, the distributor 3, the spray chamber 2, and the condenser 4 are connected in sequence to form a cooling circuit. The first suction pump 111 drives the coolant to circulate in the cooling circuit. Under the action of the first suction pump 111, the coolant in the storage tank 1 is sprayed through multiple spray nozzles 31 onto various areas of the semiconductor device set in the spray chamber 2. The coolant absorbs heat from the semiconductor device and heats up. Some of the liquid coolant absorbs heat and becomes vaporized coolant. Then, the heated liquid coolant and the vaporized coolant both flow into the condenser 4. The liquid and vaporized coolant release heat through the condenser 4, thereby cooling the coolant. The vaporized coolant returns to liquid state. The cooled coolant returns to the storage tank 1 for continued use. The circulation of the coolant can continuously cool or dissipate heat for the semiconductor device.

[0029] The air pressure regulating branch includes an air extraction pipe 13 and a vacuum pump 5. The two ends of the air extraction pipe 13 are connected to the spray chamber 2 and the air extraction end of the vacuum pump 5, respectively. The exhaust end of the vacuum pump 5 is connected to the atmosphere. A first control valve 131 and a water vapor separator 132 are sequentially arranged on the air extraction pipe 13 along the direction from the spray chamber 2 to the vacuum pump 5. The first control valve 131 can close the air extraction pipe 13 to prevent outside air from flowing back into the spray chamber 2. The vacuum pump 5 and the first control valve 131 are used to maintain the air pressure in the spray chamber 2 below the atmospheric pressure so that the coolant sprayed on the semiconductor device evaporates at a boiling point below the atmospheric pressure. The drain port of the water vapor separator 132 is connected to the coolant inlet through a third return pipe, and a drain valve is provided in the drain port so that the coolant drawn by the vacuum pump 5 into the water vapor separator 132 flows back to the condenser 4.

[0030] When the first control valve 131 is opened and the vacuum pump 5 is started, the vacuum pump 5 draws the air in the spray chamber 2 into the atmosphere, thereby reducing the air pressure inside the spray chamber 2. When the air pressure inside the spray chamber 2 is lower than atmospheric pressure, the coolant sprayed on the semiconductor device evaporates at a temperature lower than the boiling point of the coolant at atmospheric pressure. When the liquid coolant evaporates into a vaporized coolant, it can quickly absorb a large amount of heat, improving the heat dissipation efficiency of the semiconductor device. When the air pressure inside the spray chamber 2 reaches the preset air pressure value, the first control valve 131 and the vacuum pump 5 can be closed, so that the spray chamber 2 remains at the preset air pressure value.

[0031] The water vapor separator 132 and the third return pipe allow the vacuum pump 5 to be activated while spraying coolant onto the semiconductor device. Any liquid coolant accidentally drawn from the spray chamber 2 by the vacuum pump 5 is intercepted by the water vapor separator 132 and its drain valve, preventing damage to the vacuum pump 5. The intercepted coolant is then discharged into the condenser 4 through the third return pipe, achieving coolant recovery. By simultaneously spraying coolant onto the semiconductor device and activating the vacuum pump 5, the air pressure within the spray chamber 2 can be adjusted at any time.

[0032] The lower the air pressure inside spray chamber 2, the lower the boiling temperature of the coolant within it. When the coolant, with its lower boiling point and temperature, comes into contact with the higher-temperature semiconductor device, it boils on the device, increasing its heat absorption efficiency and capacity. This results in better cooling and higher cooling efficiency for the semiconductor device. Lowering the air pressure inside spray chamber 2 is also called air pressure regulation; increasing air pressure regulation refers to further reducing the air pressure inside spray chamber 2.

[0033] The air pressure regulation branch is independent of the cooling circuit. When the air pressure in the spray chamber 2 reaches the preset air pressure value, the first control valve 131 and the vacuum pump 5 can be closed. This allows for cooling of the semiconductor device without continuously operating the vacuum pump 5, achieving energy savings. Furthermore, the first control valve 131 and the vacuum pump 5 can be opened at any time to reduce the air pressure in the spray chamber 2 to a suitable value. The vacuum pump 5 and the first control valve 131 maintain the air pressure in the spray chamber 2 below atmospheric pressure by first opening the vacuum pump 5 and the first control valve 131, allowing the vacuum pump 5 to bring the air pressure in the spray chamber 2 to the preset air pressure value, and then closing the vacuum pump 5 and the first control valve 131. When the air pressure in the spray chamber 2 rises and exceeds the preset air pressure value, the vacuum pump 5 and the first control valve 131 can be opened again, and so on, ensuring that the air pressure in the spray chamber 2 is always near the preset air pressure value or at a suitable air pressure value.

[0034] Adjusting the flow rate of the coolant sprayed onto the semiconductor device, also known as flow rate regulation, means that a larger flow rate of coolant sprayed onto the semiconductor device allows more coolant to remove more heat more quickly, resulting in better cooling and higher cooling efficiency for the semiconductor device. Increasing flow rate regulation refers to further increasing the flow rate of the coolant sprayed onto the semiconductor device. A larger coolant flow rate corresponds to a larger operating power of the first suction pump 111. Controlling the operating power of the first suction pump 111 is used to regulate the flow rate of the coolant sprayed onto the semiconductor device.

[0035] Adjusting the temperature of the coolant sprayed onto the semiconductor device, also known as condensation control, results in a higher condensation rate. A higher condensation rate leads to a lower temperature of the coolant returning to the storage tank 1, creating a greater temperature difference between the coolant and the semiconductor device. This allows the coolant to remove more heat, resulting in better cooling and higher efficiency for the semiconductor device. The operating power of the condenser 4 is controlled to regulate the temperature of the coolant sprayed onto the semiconductor device. Increasing the condensation rate further reduces the temperature of the coolant sprayed onto the semiconductor device, further increasing the temperature difference between the coolant and the semiconductor device.

[0036] Further reducing the air pressure in the spray chamber 2, further increasing the flow rate of the coolant sprayed onto the semiconductor device, and further increasing the temperature difference between the coolant sprayed onto the semiconductor device and the semiconductor device can immediately improve the cooling efficiency and cooling effect of the cooling system, improve the heat dissipation efficiency of the semiconductor device, avoid the semiconductor device temperature from being too high, and thus ensure the normal operation of the semiconductor device.

[0037] Understandably, the temperature of the semiconductor device can be monitored in real time by a first temperature sensor. When the first temperature sensor detects that the semiconductor device has reached a preset temperature value, the cooling system can be activated. A vacuum pump 5 is started to remove air from the spray chamber 2, ensuring the air pressure inside the spray chamber 2 is at a preset value. The first pressure sensor 21 monitors in real time whether the air pressure inside the spray chamber 2 is at the preset value. A flow meter 112 monitors the flow rate of the coolant entering the spray chamber 2, which means monitoring the flow rate of the coolant sprayed onto the semiconductor device in real time, ensuring that a set amount of coolant is sprayed onto the semiconductor device. A second temperature sensor 114 monitors in real time the temperature of the coolant sprayed into the spray chamber 2, which means monitoring the temperature of the coolant sprayed onto the semiconductor device in real time.

[0038] The operating power of the first suction pump 111 is controlled based on the flow rate of the coolant entering the spray chamber 2 fed back by the flow meter 112, thereby adjusting the flow rate of the coolant sprayed on the semiconductor device. The operating power of the condenser 4 is controlled based on the temperature of the semiconductor device fed back by the first temperature sensor and the temperature of the coolant fed back by the second temperature sensor 114, thereby adjusting the temperature of the coolant sprayed on the semiconductor device and thus adjusting the temperature difference between the coolant sprayed on the semiconductor device and the semiconductor device. The operation of the vacuum pump 5 is controlled based on the air pressure in the spray chamber 2 fed back by the first pressure sensor 21, thereby reducing the air pressure in the spray chamber 2. Finally, the air pressure in the spray chamber 2 is brought to a preset air pressure value, thereby cooling the semiconductor device and ensuring that the temperature of the semiconductor device is less than or equal to the preset temperature value, thus ensuring the normal operation of the semiconductor device.

[0039] Flow rate regulation, condensation rate regulation, and air pressure regulation form a three-factor regulation. When cooling semiconductor devices, the three factors work together to meet the heat dissipation requirements of the semiconductor devices, and have the advantages of reducing energy consumption, rapid cooling, and high cooling capacity. When the air pressure regulation is activated, the coolant sprayed onto the semiconductor device evaporates at a temperature lower than the boiling point of the coolant at atmospheric pressure. When the heat generated by the semiconductor device is moderate or high, the flow rate regulation and condensation rate regulation can be reduced while meeting the cooling requirements, thus reducing the flow rate of the coolant sprayed into the spray chamber 2. This eliminates the need to excessively lower the temperature of the coolant returning to the storage tank 1, correspondingly reducing the power consumption of the first suction pump 111 and the condenser 4. Compared to the scheme of only activating the flow rate regulation and condensation rate regulation, the operating power of the first suction pump 111 and the condenser 4 can be greatly reduced, reducing the energy consumption of the entire cooling system and thus reducing the cost of cooling the semiconductor device. However, when the heat generated by the semiconductor device is very high or extremely high, the flow rate regulation, condensation rate regulation, and air pressure regulation are all increased, spraying a larger flow rate of coolant onto the semiconductor device in the spray chamber 2. The temperature of the coolant returning to the storage tank 1 is lower, and the air pressure in the spray chamber 2 is lower, resulting in a lower boiling point of the coolant. This gives the cooling system a very strong cooling capacity, enabling rapid heat dissipation and high heat dissipation effect for high-heat semiconductor devices.

[0040] When the flow rate regulation is at a low level, the flow rate of coolant injected into the spray chamber 2 is low, meaning the first suction pump 111 is operating at a low power. If the first suction pump 111 malfunctions, or if there is blockage in any pipes or components, the cooling efficiency and effect of the cooling system can be improved by increasing the condensation rate regulation and air pressure regulation. This results in a lower temperature of the coolant returning to the storage tank 1 and a lower temperature of the coolant sprayed onto the semiconductor devices. In other words, increasing the operating power of the condenser 4 further reduces the temperature of the coolant returning to the storage tank 1, thus lowering the temperature of the coolant in the spray chamber 2. The internal air pressure is lower, meaning the vacuum pump 5 further reduces the air pressure in the spray chamber 2, allowing the coolant to boil at a lower temperature. Lower-temperature coolant and / or coolant with a lower boiling point ensures the cooling efficiency and effect of the cooling system. When the air pressure regulation is low or ineffective, meaning the air pressure inside the spray chamber 2 is high or close to atmospheric pressure, if the air pressure inside the spray chamber 2 rises or leaks, the boiling point of the coolant in the spray chamber 2 can be adjusted by increasing the condensation rate and... Flow regulation improves the cooling efficiency and effect of the cooling system, resulting in a lower temperature of the coolant returning to the reservoir 1. This increases the operating power of the condenser 4, further reducing the temperature of the coolant returning to the reservoir 1. Consequently, it increases the flow rate of the coolant sprayed into the spray chamber 2, increasing the operating power of the first suction pump 111 and the flow rate of the coolant sprayed onto the semiconductor devices. Lower temperature coolant and / or higher flow rate both ensure the cooling efficiency and effect of the cooling system. When the condensation rate regulation is at a low level, the temperature of the coolant returning to the reservoir 1 cannot be reduced. When the temperature of the coolant returning to the reservoir 1 is relatively high (i.e., when the condenser 4 is operating at a lower power), the cooling efficiency of the cooling system can be improved by increasing the flow rate and air pressure. Increasing the flow rate of the coolant injected into the spray chamber 2 increases the flow rate of the coolant sprayed onto the semiconductor device. This further reduces the air pressure in the spray chamber 2, which is then further reduced by the vacuum pump 5. This allows the coolant to boil and evaporate at a lower temperature. Coolant with a lower boiling point and / or a larger flow rate ensures the cooling efficiency and effect of the cooling system. Therefore, the three-factor regulation can achieve mutual compensation, enabling the cooling system to cope with various unexpected situations.

[0041] The three-factor adjustment allows the spray system to achieve both the lowest energy consumption mode and the strongest cooling mode. In the lowest energy consumption mode, the air pressure regulation is set to the maximum, meaning the air pressure inside the spray chamber 2 is reduced as much as possible. The vacuum pump 5 and the first control valve 131 are shut off. The flow rate regulation ensures that the basic coolant is sprayed onto the semiconductor device, and the condensation rate regulation ensures that the basic coolant is cooled. At this time, the energy consumption of the entire cooling system is at its lowest. In the strongest cooling mode, the air pressure regulation is set to the maximum, meaning the air pressure inside the spray chamber 2 is reduced as much as possible. The vacuum pump 5 and the first control valve 131 are shut off, and the flow rate regulation and condensation rate regulation are set to the maximum. At this time, the cooling effect of the cooling system is the strongest, highest, or best.

[0042] It should be noted that the semiconductor device is divided into at least one region, and each region is connected to a corresponding first temperature sensor. When the semiconductor device is placed inside the spray chamber 2, at least one spray nozzle 31 faces one region of the semiconductor device. When any of the first temperature sensors detects a temperature that reaches a preset temperature value, the flow rate regulation, condensation rate regulation, and air pressure regulation are all activated, i.e., the cooling system is turned on. The spray chamber 2 can be equipped with multiple semiconductor devices, each divided into at least one region, and each region is connected to a corresponding first temperature sensor. When multiple semiconductor devices are placed inside the spray chamber 2, at least one spray nozzle 31 faces one region of each semiconductor device. When any of the first temperature sensors detects a temperature that reaches a preset temperature value, the flow rate regulation, condensation rate regulation, and air pressure regulation are activated.

[0043] Understandably, the water vapor separator 132 has an inlet, an outlet, and a drain. The inlet is connected to the end of the extraction pipe 13 near the spray chamber 2, and the outlet is connected to the end of the extraction pipe 13 near the vacuum pump 5. The drain is connected to the coolant inlet of the condenser 4 via a third return pipe. The coolant intercepted by the water vapor separator 132 flows back to the coolant inlet of the condenser 4 through the drain and the third return pipe, thus achieving coolant recovery. The drain has a one-way function for discharging liquid coolant, preventing coolant from flowing back into the water vapor separator 132 and into the vacuum pump 5 when the vacuum pump 5 is turned on. Alternatively, a switch valve can be installed on the third return pipe to close the third return pipe and prevent coolant from flowing back into the water vapor separator 132 through the third return pipe and the drain. Of course, the third return pipe can be omitted, and the liquid coolant can be directly drained through the drain. Alternatively, a recovery tank can be connected to the drain for coolant recovery.

[0044] It should be noted that a continuous stream of liquid coolant absorbs heat from the semiconductor device and transforms into vaporized coolant. The vaporized coolant releases heat in the condenser 4 and then transforms back into liquid coolant. The pressure difference between the spray chamber 2 and the condenser 4 causes the vaporized coolant to automatically flow into the condenser 4.

[0045] Liquid coolant is sprayed onto the semiconductor device, and some of the liquid coolant is converted into vaporized coolant. The liquid coolant collects at the bottom of spray chamber 2, while the vaporized coolant collects at the top. To improve the efficiency of the vaporized coolant entering condenser 4, the steam pipe is a straight pipe, and the distance between spray chamber 2 and condenser 4 is minimized. This results in a shorter steam pipe length, which reduces the resistance to the flow of vaporized coolant within the pipe, thus improving the efficiency of draining the vaporized coolant from spray chamber 2 and enhancing the cooling efficiency and capacity of the cooling system.

[0046] In some embodiments, the first control valve 131 can close the suction pipe 13 to prevent outside air from flowing back into the spray chamber 2, thereby maintaining the low air pressure state of the spray chamber 2 without continuously starting the vacuum pump 5. When the air pressure in the spray chamber 2 increases again or increases to a preset air pressure value, the first control valve 131 can be opened to restart the vacuum pump 5, causing the spray chamber 2 to depressurize again, thereby ensuring that the air pressure in the spray chamber 2 remains below atmospheric pressure, keeping the coolant sprayed on the semiconductor device at a boiling point below atmospheric pressure.

[0047] In some embodiments, the spray chamber 2 is provided with an air extraction port in the middle, one end of the air extraction pipe 13 is connected to the air extraction port, and the other end of the air extraction pipe 13 is connected to the air extraction end of the vacuum pump 5. The air extraction port and the air extraction pipe 13 are located in the middle of the spray chamber 2, which can reduce the liquid coolant from being accidentally drawn away by the air pressure regulating branch.

[0048] It is understandable that the steam supply pipe and the extraction pipe 13 can partially overlap, or it can be understood that a tee is provided in the area of ​​the steam supply pipe near the spray chamber 2, and the third end of the tee is connected to the extraction pipe 13. The extraction pipe 13 is connected to the spray chamber 2 through the tee and part of the steam supply pipe. The end of the steam supply pipe near the condenser 4 is connected to the area of ​​the second return pipe near the condenser 4 through another tee.

[0049] It is conceivable that the top of the spray chamber 2 is provided with multiple evenly distributed steam outlets, and the multiple steam outlets are connected to one end of the steam pipe through multiple steam distribution pipes, and the other end of the steam pipe is connected to the coolant inlet.

[0050] Reference Figure 1In some embodiments, the coolant inlet is connected to the bottom of the spray chamber 2 via a second return pipe, so that the coolant collected at the bottom of the spray chamber 2 can flow into the second return pipe. The second return pipe is equipped with a second suction pump 6, which can draw away the coolant that is still in liquid state in the spray chamber 2 and pump it into the condenser 4. The coolant outlet of the condenser 4 is connected to the storage tank 1 via a first return pipe. The coolant is cooled in the condenser 4, and then the coolant can flow smoothly back to the storage tank 1 through the first return pipe.

[0051] Both the first suction pump 111 and the second suction pump 6 can be gear pumps. Of course, the first suction pump 111 and the second suction pump 6 can also be other types of pumps commonly found on the market.

[0052] It should be noted that multiple spray nozzles 31 are located at the top of the spray chamber 2, semiconductor devices are located at the bottom of the spray chamber 2, and a drain port is located at the bottom of the spray chamber 2. The coolant inlet is connected to the drain port of the spray chamber 2 through the second return pipe, so that the coolant in the spray chamber 2 can also enter the port of the second return pipe under the action of gravity.

[0053] In one embodiment, one end of the third return pipe is connected to the drain outlet of the water vapor separator 132, and the other end of the third return pipe is connected to the suction inlet of the second suction pump 6. The third return pipe is connected to the coolant inlet through the structure of part of the second return pipe. The second suction pump 6 can simultaneously suction the liquid coolant in the spray chamber 2 and the liquid coolant at the drain outlet of the water vapor separator 132.

[0054] In some embodiments, a second control valve 133 is provided on the third return pipe. The second control valve 133 is used to close or open the third return pipe. When the vacuum pump 5 is started, the first control valve 131 is opened and the second control valve 133 is closed at the same time. When the vacuum pump 5 is turned off, the first control valve 131 is closed and the second control valve 133 is opened at the same time. At this time, the liquid coolant separated by the water vapor separator 132 can be discharged into the condenser 4 through the third return pipe and the second suction pump 6. After the liquid coolant separated by the water vapor separator 132 is completely discharged, the second control valve 133 is closed.

[0055] Both the first control valve 131 and the second control valve 133 can be solenoid valves, enabling electric control. The first control valve 131 and the second control valve 133 can be common components available on the market.

[0056] Reference Figure 1In some embodiments, the cooling system further includes a flow regulation branch, which includes a branch pipe 12 and a first regulating valve 121 disposed on the branch pipe 12. A first suction pump 111 and a flow meter 112 are arranged along the direction from the storage tank 1 to the distributor 3. A delivery pipe 11 is connected to one end of the branch pipe 12 in the area between the first suction pump 111 and the flow meter 112, and the other end of the branch pipe 12 is connected to the storage tank 1. Under the pumping of the first suction pump 111, the first regulating valve 121 is opened, and the coolant drawn from the storage tank 1 by the first suction pump 111 can directly flow back to the storage tank 1 through the branch pipe 12. By adjusting the opening of the first regulating valve 121, the flow rate of the coolant directly flowing back to the storage tank 1 can be controlled, thereby indirectly adjusting the flow rate of the coolant sprayed into the spray chamber 2. The flow regulation branch assists the first suction pump 111 in achieving flow regulation.

[0057] The flow regulation can directly adjust or control the operating power of the first suction pump 111 in real time, or simultaneously control the operating power of the first suction pump 111 and the opening of the first regulating valve 121 in real time, or fix the operating power of the first suction pump 111 and only control the opening of the first regulating valve 121 in real time. The control of the operating power of the first suction pump 111 has a time delay, slow response, and low accuracy, while the control of the opening of the first regulating valve 121 has a fast response and high accuracy. This overcomes the shortcomings of the first suction pump 111 operating power control. Combined with the real-time monitoring of the coolant flow rate entering the spray chamber 2 by the flow meter 112, the flow regulation can achieve the advantages of high accuracy and high response. Furthermore, in the event of blockage in other components of the cooling system, pressure relief can be achieved through the flow regulation branch. The flow regulation branch is also designed to protect the cooling circuit, avoid water hammer effects, and reduce the risk of damage to the cooling circuit.

[0058] It should be noted that the first regulating valve 121 is a solenoid valve, which can be electrically controlled. The first regulating valve 121 can be a common component on the market.

[0059] Reference Figure 1In some embodiments, multiple liquid outlets are connected to multiple spray nozzles 31 via multiple liquid distribution pipes. Each liquid distribution pipe is equipped with a second regulating valve 32. The second regulating valve 32 regulates the flow rate of the corresponding spray nozzle 31 to individually regulate the temperature of the area on the semiconductor device corresponding to the spray nozzle 31. One second regulating valve 32 controls the flow rate of one spray nozzle 31. The flow rate of the spray nozzle 31 corresponding to that second regulating valve 32 is adjusted by adjusting the opening degree of the second regulating valve 32. The larger the opening degree of the second regulating valve 32, the larger the flow rate of the spray nozzle 31. The multiple spray nozzles 31 correspond to different areas of the semiconductor device. When the temperature of a certain area of ​​the semiconductor device is high or low, the flow rate of the corresponding spray nozzle 31 can be increased or decreased by controlling the corresponding second regulating valve 32 to meet the cooling requirements of each area of ​​the semiconductor device and avoid coolant idling and energy waste caused by excessive flow rate of the spray nozzle 31.

[0060] It should be noted that the second regulating valve 32 is a high-speed solenoid valve, which has high opening accuracy and fast response speed.

[0061] In some of these embodiments, reference is made to Figure 2 Multiple spray nozzles 31 are arranged in a rectangular array, which can be applied to a single semiconductor device with a rectangular shape, or to multiple semiconductor devices arranged in a rectangular array in the spray chamber 2. The coolant sprayed by the multiple spray nozzles 31 can cover all areas of the semiconductor device, ensuring that all areas of all semiconductor devices can be sprayed by the coolant sprayed by the spray nozzles 31.

[0062] In another embodiment, refer to Figure 3 Multiple spray nozzles 31 are arranged in a circular array, which can be applied to a single semiconductor device with a circular shape, or to multiple semiconductor devices arranged in a circular array in the spray chamber 2. The coolant sprayed by the multiple spray nozzles 31 can cover all areas of the semiconductor device, ensuring that all areas of all semiconductor devices can be sprayed by the coolant sprayed by the spray nozzles 31.

[0063] The spray chamber 2 is cylindrical or prismatic, such as a square prism or a pentagonal prism. The spray chamber 2 is equipped with a door and a viewing window. The spray chamber 2 can be opened and closed through the door. When the spray chamber 2 is opened, the spray nozzle 31 and semiconductor devices can be inspected. The status of the spray nozzle 31 and semiconductor devices inside the spray chamber 2 can be directly viewed through the viewing window.

[0064] Reference Figure 1In some embodiments, a second pressure sensor 113 is provided on the liquid delivery pipe 11 in the area near the distributor 3. The second pressure sensor 113 can monitor the pressure of the coolant entering the distributor 3 and the spray nozzle 31 in real time, ensuring that the coolant has a sufficiently high pressure when entering the spray nozzle 31, further ensuring that the coolant sprayed from the spray nozzle 31 is in the form of a mist. Furthermore, by detecting the pressure of the coolant entering the spray nozzle 31, the operating status of the first suction pump 111 can be determined.

[0065] In some embodiments, the liquid delivery pipe 11 is also provided with a filter 115, and the filter 115 is located between the flow meter 112 and the distributor 3. The filter 115 can filter out impurities in the coolant, prevent impurities from clogging the distributor 3 and the spray nozzle 31, and ensure the smooth operation of the entire cooling system.

[0066] Reference Figure 1 In some embodiments, a shut-off valve 116 is provided on the delivery pipe 11 in the area between the first suction pump 111 and the storage tank 1. The shut-off valve 116 is used to prevent the coolant in the delivery pipe 11 from flowing back into the storage tank 1. The valve disc of the shut-off valve 116 can adjust the passage area of ​​the coolant, thereby regulating the flow rate. Furthermore, the shut-off valve has good back-sealing performance, effectively preventing coolant backflow and protecting the safe operation of the cooling system. It is understood that the shut-off valve 116 can be a manual shut-off valve or an electric shut-off valve.

[0067] In some embodiments, the cooling system further includes a control system, which includes a controller electrically connected to a first temperature sensor, a first pressure sensor 21, a first suction pump 111, a flow meter 112, a second temperature sensor 114, a condenser 4, and a vacuum pump 5. The first temperature sensor collects and processes temperature information of the semiconductor device, the second temperature sensor 114 collects and processes temperature information of the coolant before it enters the spray chamber 2, and the first pressure sensor 21 collects and processes information on the air pressure inside the spray chamber 2. The controller obtains the temperature information of the semiconductor device, the temperature information of the coolant before it enters the spray chamber 2, and the air pressure information inside the spray chamber 2 from the first temperature sensor, the second temperature sensor 114, and the first pressure sensor 21, respectively.

[0068] When the first temperature sensor detects that the temperature of the semiconductor device has reached the preset temperature value, the controller starts the first suction pump 111, the condenser 4, and the vacuum pump 5 to perform three-factor regulation. The first suction pump 111 draws coolant from the storage tank 1 and drives the coolant to flow sequentially through the distributor 3, the spray nozzle 31, the spray chamber 2, and the condenser 4, and finally drives the coolant back to the storage tank 1. The coolant absorbs the heat from the semiconductor device in the spray chamber 2, and then the coolant releases heat in the condenser 4 to achieve cooling. The vacuum pump 5 removes the air from the spray chamber 2. When pressure sensor 21 detects that the air pressure inside spray chamber 2 has dropped to a preset air pressure value, the controller stops vacuum pump 5, ensuring that the air pressure in spray chamber 2 remains at the preset air pressure value, either continuously or for a considerable period. This means the boiling point of the coolant corresponding to the air pressure inside spray chamber 2 is lower than the boiling point of the coolant at atmospheric pressure, causing the coolant to evaporate on the surface of the semiconductor device. This significantly improves the efficiency and effectiveness of cooling or heat dissipation for the semiconductor device, ensuring it operates within its normal temperature range and thus guaranteeing its normal operation. Whenever the first pressure sensor 21 detects that the air pressure inside spray chamber 2 is greater than the preset air pressure value, the controller starts vacuum pump 5 until the air pressure inside spray chamber 2 drops to the preset air pressure value, at which point the controller stops vacuum pump 5, ensuring the air pressure in spray chamber 2 remains at the preset air pressure value. During the operation of vacuum pump 5, the first suction pump 111 and condenser 4 operate synchronously.

[0069] The controller controls the operating power of the condenser 4 and the first suction pump 111, ensuring that the coolant can effectively remove heat from the semiconductor device and prevent the semiconductor device temperature from exceeding or falling below the preset value. The operating power of the condenser 4 and the first suction pump 111 does not need to be excessively high, but it also cannot be too low, ensuring sufficient coolant to remove heat from the semiconductor device and discharge it to the outside environment, which can be the atmosphere, other heat dissipation equipment, or other heat absorption equipment.

[0070] When the first temperature sensor detects that the temperature of the semiconductor device is too low, such as below the normal operating temperature of the semiconductor device, the operating power of the condenser 4 and / or the operating power of the first suction pump 111 can be stopped or appropriately reduced to avoid energy waste. If, under the current operating power of the condenser 4 and the first suction pump 111, the temperature of the semiconductor device is still higher than the preset temperature value, the operating power of the condenser 4 and / or the first suction pump 111 can be increased. The second temperature sensor 114 can detect the temperature of the coolant in real time, and the operating status of the condenser 4 can be determined based on the temperature information fed back by the second temperature sensor 114. The flow meter 112 can detect the flow rate of the coolant injected into the spray chamber 2 in real time, and the operating status of the first suction pump 111 can be determined based on the flow rate information fed back by the flow meter 112. Ultimately, the operating status of the entire cooling system can be determined, and based on the coolant temperature and flow rate information, the controller can more accurately control the operating power of the first suction pump 111 and the condenser 4.

[0071] The controller is also electrically connected to the first regulating valve 121, the second regulating valve 32, the second control valve 133, the second pressure sensor 113, the first control valve 131, and the second suction pump 6. The first regulating valve 121, the second regulating valve 32, the second control valve 133, and the first control valve 131 are all electronic valves. The controller can simultaneously control the opening of the first regulating valve 121 and the operating power of the first suction pump 111, enabling more precise and faster flow regulation. The controller controls the opening of each second regulating valve 32 to control the flow rate of coolant sprayed from each spray nozzle 31, ultimately ensuring a more uniform temperature of the semiconductor device and preventing overheating in certain areas. The second pressure sensor 113 feeds back the coolant pressure information before it enters the spray chamber 2 to the controller. When the coolant pressure is too low, the operating power of the first suction pump 111 is increased, and the opening of the second regulating valve 32 is reduced, ensuring that the coolant sprayed into the spray chamber 2 by the spray nozzles 31 is in a mist form. When vacuum pump 5 needs to be turned on, that is, when the first pressure sensor 21 detects that the air pressure in spray chamber 2 is greater than the preset air pressure value, the controller controls the first control valve 131 and vacuum pump 5 to open, and the second control valve 133 to close. When vacuum pump 5 needs to be turned off, that is, when the first pressure sensor 21 detects that the air pressure in spray chamber 2 is less than the preset air pressure value, the controller controls the first control valve 131 and vacuum pump 5 to close, so that the air pressure in spray chamber 2 is always below the preset air pressure value. The second control valve 133 is then opened, and closed after the liquid coolant separated by water vapor separator 132 has been completely drained or after a certain period of time. The controller synchronously controls the first suction pump 111 and the second suction pump 6 to work or run synchronously. The preset air pressure value is less than atmospheric pressure, and the preset temperature value is a larger value within the normal operating temperature range of the semiconductor device.

[0072] This invention also discloses a cooling method applicable to the aforementioned spray cooling system, comprising the following steps: placing a semiconductor device in a sealed spray chamber 2; when the semiconductor device reaches a preset temperature value, starting a vacuum pump 5 to remove air from the spray chamber 2, thereby reducing the air pressure in the spray chamber 2 to a preset air pressure value; starting a first suction pump 111 and a condenser 4, thereby causing the coolant to circulate within a cooling circuit formed by the sequential connection of a storage tank 1, the first suction pump 111, a distributor 3, the spray chamber 2, and the condenser 4; and controlling the first suction pump... The operating power of 111 regulates the flow rate of the coolant sprayed onto the semiconductor device. The coolant sprayed onto the semiconductor device evaporates at a boiling point lower than that of the coolant at atmospheric pressure. The vaporized coolant is transported into the condenser 4 through the vapor pipe. The vaporized coolant releases heat in the condenser 4 and returns to the liquid state. The coolant drawn by the vacuum pump 5 to the water vapor separator 132 flows back to the condenser 4 through the third return pipe. All the liquid coolant is cooled in the condenser 4. The temperature of the coolant returning to the storage tank 1 is regulated by controlling the operating power of the condenser 4.

[0073] Vacuum pump 5 reduces the air pressure inside spray chamber 2, thereby lowering the boiling point of the coolant within spray chamber 2. This improves the cooling efficiency and capacity for cooling semiconductor devices. Reducing the air pressure inside spray chamber 2 is called air pressure regulation, adjusting the flow rate of the coolant sprayed onto the semiconductor device is called flow rate regulation, and adjusting the temperature of the coolant sprayed onto the semiconductor device is called condensation rate regulation. Increasing air pressure regulation, increasing flow rate regulation, and increasing condensation rate regulation further reduce the air pressure inside spray chamber 2, further increase the flow rate of the coolant sprayed onto the semiconductor device, and further increase the temperature difference between the coolant sprayed onto the semiconductor device and the semiconductor device. All of these factors can improve the heat dissipation capacity and efficiency of the semiconductor device. Under the same heat dissipation requirements of the semiconductor device, increasing air pressure regulation can reduce flow rate regulation and condensation rate regulation, thereby reducing the energy consumption for cooling the semiconductor device.

[0074] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] Of course, the present invention is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A spray cooling system, characterized in that, include: A reservoir for storing coolant; The spray chamber has an inner cavity for housing a semiconductor device. The semiconductor device is connected to a first temperature sensor, which is used to detect the temperature of the semiconductor device in real time. The spray chamber is also equipped with a first pressure sensor, which is used to detect the air pressure inside the spray chamber. The liquid separator includes a liquid inlet and multiple liquid outlets. The liquid storage tank is connected to the liquid inlet via a liquid delivery pipe. The multiple liquid outlets are respectively connected to multiple spray nozzles that extend into the spray chamber. The multiple spray nozzles are arranged in an array and the spray direction is towards the semiconductor device. The liquid delivery pipe is equipped with a first suction pump, a flow meter, and a second temperature sensor. The flow meter is used to measure the flow rate of the coolant entering the spray chamber, and the second temperature sensor is used to detect the temperature of the coolant entering the spray chamber in real time. The condenser includes a coolant inlet and a coolant outlet, wherein the coolant outlet is connected to the liquid storage tank via a first return pipe; The second return pipe is connected at one end to the bottom of the spray chamber and at the other end to the coolant inlet, so as to transport the liquid coolant in the spray chamber into the condenser. A steam pipe is connected at one end to the top of the spray chamber and at the other end to the coolant inlet, so as to deliver the coolant vaporized in the spray chamber into the condenser. The pressure regulating branch includes an extraction pipe and a vacuum pump. The two ends of the extraction pipe are connected to the spray chamber and the extraction end of the vacuum pump, respectively. The exhaust end of the vacuum pump is open to the atmosphere. A first control valve and a water vapor separator are sequentially arranged on the extraction pipe along the direction from the spray chamber to the vacuum pump. The first control valve can close the extraction pipe to prevent outside air from flowing back into the spray chamber. The vacuum pump and the first control valve are used to maintain the air pressure in the spray chamber below atmospheric pressure so that the coolant sprayed on the semiconductor device evaporates at a boiling point below atmospheric pressure. The drain outlet of the water vapor separator is connected to the coolant inlet through a third return pipe, and a drain valve is provided in the drain outlet so that the coolant drawn by the vacuum pump to the water vapor separator flows back to the condenser. The operating power of the first suction pump is controlled based on the flow rate of the coolant entering the spray chamber, as fed back from the flow meter, to adjust the flow rate of the coolant sprayed on the semiconductor device. The operating power of the condenser is controlled based on the temperature of the semiconductor device fed back from the first temperature sensor and the temperature of the coolant fed back from the second temperature sensor, to adjust the temperature of the coolant sprayed on the semiconductor device, thereby adjusting the temperature difference between the coolant sprayed on the semiconductor device and the semiconductor device. The operation of the vacuum pump is controlled based on the air pressure in the spray chamber fed back from the first pressure sensor, to reduce the air pressure in the spray chamber and bring it to a preset air pressure value.

2. The spray cooling system according to claim 1, characterized in that, The third return pipe is equipped with a second control valve, which is used to close or open the third return pipe.

3. The spray cooling system according to claim 1 or 2, characterized in that, The spray chamber has an air extraction port in the middle, and one end of the air extraction pipe is connected to the air extraction port.

4. The spray cooling system according to claim 1, characterized in that, It also includes a flow regulation branch, which includes a branch pipe and a first regulating valve disposed on the branch pipe. A flow meter is disposed in the area between the first suction pump and the spray chamber. The liquid delivery pipe is connected to one end of the branch pipe in the area between the first suction pump and the flow meter, and the other end of the branch pipe is connected to the liquid storage tank.

5. The spray cooling system according to claim 1, characterized in that, The multiple liquid outlets are connected to multiple spray nozzles via multiple liquid distribution pipes. Each of the multiple liquid distribution pipes is equipped with a second regulating valve, which regulates the flow rate of the corresponding spray nozzle to individually regulate the temperature of the area on the semiconductor device corresponding to the spray nozzle.

6. The spray cooling system according to claim 1 or 5, characterized in that, A second pressure sensor is provided on the liquid delivery pipe in the area near the distributor, and the second pressure sensor detects the pressure of the coolant entering the distributor.

7. The spray cooling system according to claim 1, characterized in that, The multiple spray nozzles are arranged in a rectangular or circular array so that the multiple spray nozzles can cover all areas of the semiconductor device.

8. The spray cooling system according to claim 1, characterized in that, A second suction pump is provided on the second return pipe to accelerate the flow of coolant from the spray chamber into the condenser.

9. The spray cooling system according to claim 1, characterized in that, A shut-off valve is provided on the liquid delivery pipe in the area between the first suction pump and the liquid storage tank. The shut-off valve is used to prevent the coolant in the liquid delivery pipe from flowing back into the liquid storage tank.

10. A cooling method, characterized in that, The spray cooling system according to any one of claims 1 to 9 comprises the following steps: A semiconductor device is placed in the sealed spray chamber. When the semiconductor device reaches a preset temperature value, the vacuum pump is activated to remove the air from the spray chamber, reducing the air pressure in the spray chamber to the preset air pressure value. The first suction pump and the condenser are then activated, causing the coolant to circulate in a cooling circuit formed by the sequential connection of the storage tank, the first suction pump, the distributor, the spray chamber, and the condenser. The flow rate of the coolant sprayed onto the semiconductor device is adjusted by controlling the operating power of the first suction pump. The coolant sprayed onto the semiconductor device evaporates at a boiling point lower than that of the coolant at atmospheric pressure. The vaporized coolant is transported into the condenser through a vapor pipe. The vaporized coolant releases heat and reverts to a liquid state in the condenser. The coolant drawn by the vacuum pump to the water vapor separator flows back to the condenser through a third return pipe. All the liquid coolant is cooled in the condenser. The temperature of the coolant returning to the storage tank is adjusted by controlling the operating power of the condenser.

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