Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel, a manufacturing method thereof and a display device, and the display panel comprises a first substrate which comprises at least one first hole; the first metal layer comprises a plurality of first binding terminals; the circuit board comprises a plurality of second binding terminals; the first adhesive material is positioned between the circuit board and the first substrate; the second adhesive material comprises a plurality of conductive parts, and the second adhesive material is conductive adhesive; wherein the at least one first through hole and the at least one second through hole are arranged corresponding to a second binding terminal; the first through hole at least partially penetrates through the circuit board and the first adhesive material; the second through hole at least partially penetrates through the circuit board; the conductive part comprises a first sub-conductive part at least filled in the corresponding first through hole and a second sub-conductive part at least filled in the corresponding second through hole, the second binding terminal is electrically connected with the corresponding first binding terminal through the corresponding first sub-conductive part, and the conductive part is connected with the first adhesive material through the corresponding second sub-conductive part. The reliability is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0002] With the continuous development of display technology, the organic light-emitting diode (OLED) display device has been widely used in flat panel display, flexible display, vehicle display and solid-state lighting and other fields due to its wide color gamut, high contrast, energy saving, foldability and other advantages.

[0003] However, with the development of display technology, how to improve the reliability of the display panel when realizing the extreme narrow frame or frameless design of the display panel is a problem to be solved. SUMMARY

[0004] Therefore, it is necessary to provide a display panel, a manufacturing method thereof and a display device, aiming to solve the problem of how to improve the reliability when realizing the extreme narrow frame or frameless design of the display panel.

[0005] In a first aspect, an embodiment of the present application provides a display panel, comprising:

[0006] A first substrate comprising at least one first opening, the first substrate comprising a first surface and a second surface arranged opposite to each other;

[0007] A first metal layer located on a side of the first surface away from the second surface, the first metal layer comprising a plurality of first binding terminals;

[0008] A circuit board comprising a third surface and a fourth surface arranged opposite to each other, the third surface being arranged opposite to the second surface, the circuit board comprising a plurality of second binding terminals corresponding to the plurality of first binding terminals respectively;

[0009] A first adhesive material located between the circuit board and the first substrate;

[0010] A second adhesive material comprising a plurality of conductive parts, the conductive parts being arranged one-to-one corresponding to the first binding terminals and the second binding terminals, the second adhesive material being conductive adhesive;

[0011] The display panel further comprises a plurality of first through holes and a plurality of second through holes, at least one first through hole and at least one second through hole being arranged corresponding to one second binding terminal;

[0012] The first through hole at least partially penetrates the circuit board and the first adhesive material, and the first through hole and the corresponding first opening are collectively exposed to the corresponding first binding terminal on the fourth surface; and the second through hole at least partially penetrates the circuit board.

[0013] The conductive part includes a first sub-conductive part filled in the corresponding first through hole, and a second sub-conductive part filled in the corresponding second through hole, the second binding terminal is electrically connected to the corresponding first binding terminal through the corresponding first sub-conductive part, and the conductive part is connected to the first adhesive material through the corresponding second sub-conductive part.

[0014] In a second aspect, based on the same application concept, the application further provides a manufacturing method of a display panel, comprising:

[0015] A substrate is provided, the substrate includes a first base and a first metal layer; the first base includes a first surface and a second surface arranged opposite to each other; the first metal layer is located on a side of the first surface away from the second surface, and the first metal layer includes a plurality of first binding terminals;

[0016] A circuit board is provided, the circuit board includes a third surface and a fourth surface arranged opposite to each other, and the circuit board includes a plurality of second binding terminals;

[0017] The circuit board is bonded to one side of the first base through a first adhesive material, the third surface is arranged opposite to the second surface, and the second binding terminals are arranged corresponding to the first binding terminals;

[0018] A plurality of first through holes and a plurality of second through holes are formed on the circuit board, and at least one first opening is formed on the first base at the same time; at least one first through hole and at least one second through hole are arranged corresponding to one second binding terminal; the first through hole at least partially penetrates the circuit board and the first adhesive material, and the first through hole and the corresponding first opening are collectively exposed to the corresponding first binding terminal on the fourth surface; and the second through hole at least partially penetrates the circuit board.

[0019] The second adhesive material is filled in the first through hole and the second through hole, so that the second adhesive material includes a plurality of conductive parts, the conductive part includes a first sub-conductive part filled in the corresponding first through hole, and a second sub-conductive part filled in the corresponding second through hole, the second binding terminal is electrically connected to the corresponding first binding terminal through the corresponding first sub-conductive part, and the conductive part is connected to the first adhesive material through the corresponding second sub-conductive part.

[0020] In a third aspect, based on the same inventive concept, the present embodiment also provides a display device, which comprises any one of the display panels provided in the first aspect.

[0021] In the present embodiment, the conductive part comprises a first sub-conductive part filled in the corresponding first through hole, and a second sub-conductive part filled in at least the corresponding second through hole, the second binding terminal is electrically connected to the corresponding first binding terminal through the corresponding first sub-conductive part, and the conductive part is connected to the first adhesive through the corresponding second sub-conductive part. In the first aspect, a new back binding technology is realized through the first through hole and the first sub-conductive part, which can greatly reduce the frame width of the display panel. In the second aspect, although the first adhesive is arranged between the circuit board and the first substrate to fix the circuit board and the first substrate, the first sub-conductive part is prone to abnormal contact / electrical connection with the first binding terminal, or the internal part of the first sub-conductive part is prone to damage, resulting in abnormal electrical connection between the second binding terminal and the first binding terminal; at this time, the second binding terminal is electrically connected to the first binding terminal through the first sub-conductive part, and the adhesion strength and stability of the circuit board and the substrate are enhanced through the second sub-conductive part; when the display panel is damaged by external impact or falling, the first sub-conductive part is stretched or compressed, and the second sub-conductive part is preferentially or synchronously stretched or compressed, the second sub-conductive part can absorb the energy of external impact or extrusion, thereby protecting the first sub-conductive part, and improving the electrical connection reliability of the second binding terminal and the first binding terminal. In the third aspect, compared with only arranging the first sub-conductive part, the second through hole and the second sub-conductive part are further arranged, the number of film layers that need to be penetrated by the second through hole and the second sub-conductive part is smaller, the film layer thickness is smaller, and the size change of the second through hole in the direction perpendicular to the plane of the circuit board is smaller, so that the second through hole can form a stronger bonding area with the first adhesive in a smaller area on the circuit board, greatly enhancing the electrical connection stability of the first sub-conductive part and the first binding terminal. In the fourth aspect, based on the third aspect, the area of the first through hole and the first sub-conductive part on the circuit board can be further reduced, while the electrical connection stability of the first sub-conductive part and the first binding terminal is maintained or enhanced (compared with only the first sub-conductive part) through the second through hole and the second sub-conductive part, so that the area of the binding connection part can be reduced, the size of the circuit board is reduced, and the use amount of the second adhesive and other materials is also reduced, thereby reducing the cost of the display panel and facilitating the lightness and thinness of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the accompanying drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0023] Figure 1 A back view schematic diagram of a display panel provided with a circuit board and before a second adhesive material is provided according to an embodiment of the present application.

[0024] Figure 2 A back view schematic diagram of a display panel provided with a circuit board and a second adhesive material according to an embodiment of the present application.

[0025] Figure 3 A first cross-sectional schematic diagram of a display panel provided with a circuit board according to an embodiment of the present application.

[0026] Figure 4 A second cross-sectional schematic diagram of a display panel provided with a circuit board according to an embodiment of the present application.

[0027] Figure 5 A third cross-sectional schematic diagram of a display panel provided with a circuit board according to an embodiment of the present application.

[0028] Figure 6 A fourth cross-sectional schematic diagram of a display panel provided with a circuit board according to an embodiment of the present application.

[0029] Figure 7 A fifth cross-sectional schematic diagram of a display panel provided with a circuit board according to an embodiment of the present application.

[0030] Figure 8 A sixth cross-sectional schematic diagram of a display panel provided with a circuit board according to an embodiment of the present application.

[0031] Figure 9 A flow step schematic diagram of a manufacturing method of a display panel according to an embodiment of the present application.

[0032] Figure 10 A schematic diagram of a display device according to an embodiment of the present application.

[0033] Reference signs: display device 200; display panel 100; first substrate 111; first metal layer 113; circuit board 20; first adhesive material 30; second adhesive material 40; first opening 111k; first surface 111a; second surface 111b; first bonding terminal 1131; third surface 201; fourth surface 202; second bonding terminal 22; conductive part 41; first through hole 40k1; second through hole 40k2; first sub-conductive part 411; second sub-conductive part 412; display panel body 10; circuit board body 21; first barrier layer 112; second barrier layer 114; second substrate 115; first buffer layer 16; second metal layer 17; first insulating layer 18; driving wire 171; second opening 115k; first distance d1; second distance d2; slot 40k3; third sub-conductive part 413. DETAILED DESCRIPTION

[0034] For the purposes of this application, reference will be made to the accompanying drawings in which the preferred embodiments of the application are illustrated. It should be understood that the application can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the application to those skilled in the art.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this description, the terms "may" and "can" include any one of, or all of, the possible equivalents.

[0036] In describing a position relationship, unless otherwise defined, when an element such as a layer, film or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In addition, when a layer is referred to as being "under" or "beneath" another layer, it can be directly under the other layer, or intervening elements can also be present. It will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers can also be present.

[0037] In the case of using "include", "have", and "contain" described herein, unless the explicit limiting term such as "only", "consisting of", etc. is used, another component can be added. Unless otherwise mentioned, the singular form of the term can include the plural form, and it cannot be understood as the number of one.

[0038] It should be understood that, although the terms "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present application.

[0039] It should also be understood that, in interpreting the elements, although not explicitly described, the elements are interpreted to include an acceptable range of error, which should be within a range of deviation acceptable to a person skilled in the art from a specific value. For example, "about", "approximately" or "substantially" can mean within one or more standard deviations, without limitation.

[0040] Furthermore, in the specification, the phrase "plan view schematic diagram" refers to a drawing when the target portion is viewed from above, and the phrase "cross-sectional schematic diagram" refers to a drawing when a section is taken by cutting the target portion vertically and viewed from the side.

[0041] In addition, the drawings are not drawn to scale 1:1, and the relative sizes of the elements are only drawn by way of example in the drawings, and are not necessarily drawn to true scale.

[0042] Various modifications and changes can be made to the present application in its implementation without departing from the spirit or scope of the present application, which will be apparent to those skilled in the art. Accordingly, the present application is intended to cover all modifications and changes that fall within the scope of the corresponding claims (claimed technical solutions) and their equivalents. It should be noted that the embodiments provided by the present application can be combined with each other as long as they do not contradict each other.

[0043] As described in the background section, with the development of display technology, how to improve the reliability of the display panel when realizing the extreme narrow frame or frameless design of the display panel is a problem that needs to be solved. For example, in the back binding technology, the reliability of the display panel is not enough; for example, the stability of the electrical connection between the display panel and the circuit board on the back side of the substrate is not enough, and contact failure such as open circuit is prone to occur when subjected to external impact or when the display panel falls; for example, after a long time of use, after corrosion by water vapor and oxygen, etc., open circuit and other electrical connection failures are prone to occur; for example, the bonding area of the first binding terminal on one side of the substrate and the second binding terminal in the circuit board is small, resulting in contact failure such as open circuit when subjected to external impact or when the display panel falls.

[0044] Based on the above technical problems, the inventors have found that the first adhesive material is located between the circuit board and the first substrate; the second adhesive material includes a plurality of conductive parts, each of which is arranged in one-to-one correspondence with the first binding terminal and the second binding terminal, and the second adhesive material is conductive adhesive; wherein the display panel further includes a plurality of first through holes and a plurality of second through holes, at least one first through hole and at least one second through hole are arranged in correspondence with a second binding terminal; the first through hole at least partially penetrates the circuit board and the first adhesive material, and the first through hole and the corresponding first opening are exposed to the corresponding first binding terminal on the fourth surface; the second through hole at least partially penetrates the circuit board; the conductive part includes a first sub-conductive part filled in the corresponding first through hole, and a second sub-conductive part filled in the corresponding second through hole, the second binding terminal is electrically connected to the corresponding first binding terminal through the corresponding first sub-conductive part, and the conductive part is connected to the first adhesive material through the corresponding second sub-conductive part. In the first aspect, by arranging the first through hole and the first sub-conductive part, a new back binding technology is realized, which can greatly reduce the frame width of the display panel. In the second aspect, although the first adhesive material is arranged between the circuit board and the first substrate to fix the circuit board and the first substrate, due to the flexibility and certain stretchability of the first adhesive material, and / or the first substrate, and / or the circuit board, and / or the second adhesive material, the first sub-conductive part and the first binding terminal are prone to abnormal contact / electric connection, or the inside of the first sub-conductive part is prone to damage, resulting in abnormal electric connection between the second binding terminal and the first binding terminal; at this time, the first sub-conductive part can realize the electric connection between the second binding terminal and the first binding terminal, and the second sub-conductive part can enhance the adhesion strength and stability of the circuit board and the substrate, etc. When the display panel is damaged by external impact, or the display panel falls, etc., the first sub-conductive part is stretched or compressed, etc. Abnormal, the second sub-conductive part synchronously stretches or compresses, and the second sub-conductive part can absorb the energy of external impact or extrusion, etc. so as to protect the first sub-conductive part, thereby improving the reliability of the electric connection between the second binding terminal and the first binding terminal.In the third aspect, when only the first sub-conductive part is provided, a contact area of the first sub-conductive part with the first binding terminal needs to be large enough, that is, the first through hole needs to have a large enough area, to ensure that the contact area of the first sub-conductive part with the first binding terminal is large enough and that the first sub-conductive part has sufficient adhesion strength with the first substrate and the circuit board. However, due to the large thickness of the circuit board, the thick film layers and structures that the first sub-conductive part needs to penetrate, the hole opening process and other factors, the area of the end of the first through hole away from the first substrate is large, the area of the end of the first through hole close to the first binding terminal is small, the first through hole occupies a very large area of the second binding terminal on the circuit board, a very large area of the second binding terminal needs to be provided on the circuit board, the area of the binding connection part is increased, the size of the circuit board is increased, and the use amount of the second adhesive and other materials is also increased, which results in a large cost of the display panel and is not conducive to the lightness and thinness of the display panel. In the embodiments of the present application, the second through hole and the second sub-conductive part are further provided. Since the second through hole and the second sub-conductive part need to penetrate fewer film layers and have smaller thickness, the second through hole has a smaller size change in the direction perpendicular to the plane of the circuit board, so that the second through hole can form a stronger bonding area with the first adhesive in a smaller area on the circuit board, and the electrical connection stability of the first sub-conductive part and the first binding terminal is greatly improved.

[0045] The above is the core idea of the present application. The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the accompanying drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0046] Please refer to Figures 1 to 8 .

[0047] It should be noted that Figure 1 does not show the second adhesive, Figure 2 shows the second adhesive. Figures 3 to 8 is Figure 2 the cross-sectional view of the first dashed line C1-C1 or in the direction of the first dashed line C1-C1 in

[0048] The application provides a display panel 100, which comprises a first substrate 111, a first metal layer 113, a circuit board 20, a first adhesive material 30 and a second adhesive material 40. The first substrate 111 comprises at least one first opening 111k, and the first substrate 111 comprises a first surface 111a and a second surface 111b arranged oppositely. The first metal layer 113 is located on the side of the first surface 111a away from the second surface 111b, and the first metal layer 113 comprises a plurality of first binding terminals 1131. The circuit board 20 comprises a third surface 201 and a fourth surface 202 arranged oppositely, the third surface 201 is arranged opposite to the second surface 111b, and the circuit board 20 comprises a plurality of second binding terminals 22 corresponding to the plurality of first binding terminals 1131 respectively. The first adhesive material 30 is located between the circuit board 20 and the first substrate 111. The second adhesive material 40 comprises a plurality of conductive parts 41, the conductive parts 41 are arranged one by one corresponding to the first binding terminals 1131 and the second binding terminals 22, and the second adhesive material 40 is conductive adhesive. The display panel 100 further comprises a plurality of first through holes 40k1 and a plurality of second through holes 40k2, at least one first through hole 40k1 and at least one second through hole 40k2 are arranged corresponding to a second binding terminal 22. The first through hole 40k1 at least partially penetrates the circuit board 20 and the first adhesive material 30, and the first through hole 40k1 and the corresponding first opening 111k are exposed to the corresponding first binding terminal 1131 at the fourth surface 202; the second through hole 40k2 at least partially penetrates the circuit board 20. The conductive part 41 comprises a first sub-conductive part 411 at least filled in the corresponding first through hole 40k1 and the first opening 111k, and a second sub-conductive part 412 at least filled in the corresponding second through hole 40k2, the second binding terminal 22 is electrically connected to the corresponding first binding terminal 1131 through the corresponding first sub-conductive part 411, and the conductive part 41 is connected to the first adhesive material 30 through the corresponding second sub-conductive part 412.

[0049] For example, the display panel comprises a display panel body 10 or a substrate (array substrate), and a circuit board 20, and the first binding terminal 1131 on the display panel body 10 or the substrate is electrically connected to the second binding terminal 22 on the circuit board 20.

[0050] For example, the circuit board 20 can comprise a circuit board body 21 and the second binding terminal 22, the circuit board body 21 can comprise a base material and a wiring. The circuit board 20 can be a flexible printed circuit (FPC) or a chip on film (COF), which is not limited herein.

[0051] For example, in some embodiments, as Figure 3As shown, the structure of the display panel body 10 or the substrate can include the first base 111, the first barrier layer 112, the first metal layer 113, the second barrier layer 114, the second base 115, the first buffer layer 16, the second metal layer 17, the first insulating layer 18 and other film layers and structures arranged in sequence. The material of the first base 111 and the second base 115 can be polyimide (PI), but is not limited thereto. The material of the first barrier layer 112 and the second barrier layer 114 can include silicon nitride, silicon oxide, silicon oxynitride and the like, and the first barrier layer 112 and the second barrier layer 114 can function to block water vapor and oxygen, but are not limited thereto. The first metal layer 113 includes the first binding terminal 1131, and the second metal layer 17 can include the driving wire 171 or the electrode. The second base 115 and / or the first insulating layer 18 can include the second opening 115k, and the driving wire 171 or the electrode can be electrically connected to the first binding terminal 1131 through the second opening 115k. The first insulating layer 18 can fill the second opening 115k, but is not limited thereto.

[0052] For example, in some other embodiments, in combination with Figure 3 As shown, the structure of the display panel 100 is not limited thereto, for example, the display panel body 10 or the substrate (array substrate) can not include the first barrier layer 112, the second barrier layer 114 and the second base 115, at this time, the substrate or the base only has the first base 111, and the first metal layer 113 can be a film layer in the array composite layer, and the array composite layer can include a plurality of thin film transistors. In some other embodiments, in combination with Figure 3 As shown, the structure of the display panel 100 is not limited thereto, for example, the display panel body 10 or the substrate (array substrate) does not include at least one of the first barrier layer 112 and the second barrier layer 114, i.e., only one barrier layer is arranged.

[0053] For example, when the display panel is an organic light-emitting diode (OLED) display panel, the structure of the display panel body 10 or the substrate can further include an array composite layer, a light-emitting functional layer arranged on the side of the array composite layer (the array composite layer includes the first buffer layer 16, the second metal layer 17, the first insulating layer 18 and the like) away from the first base 111, an encapsulation layer arranged on the side of the light-emitting functional layer away from the first base 111 and the like, but the structure of the display panel body 10 or the substrate is not limited thereto.

[0054] For example, the first opening 111k exposes the corresponding first bonding terminal 1131 on the second surface 111b. The circuit board 20 includes a plurality of second bonding terminals 22, which are arranged correspondingly to the first bonding terminals 1131. The first adhesive 30 is arranged to overlap the first opening 111k, the first bonding terminal 1131, and the second bonding terminal 22 in a direction perpendicular to the plane in which the first substrate 111 lies. The second bonding terminal 22 at least partially surrounds the corresponding first through-hole 40k1 and at least one second through-hole 40k2.

[0055] For example, the second through-hole 40k2 exposes the first adhesive 30 on the fourth surface 202.

[0056] In the embodiment of the present application, the conductive part 41 includes a first sub-conductive part 411 filled in the corresponding first through hole 40k1, and a second sub-conductive part 412 filled in the corresponding second through hole 40k2, the second binding terminal 22 is electrically connected to the corresponding first binding terminal 1131 through the corresponding first sub-conductive part 411, and the conductive part 41 is connected to the first adhesive 30 through the corresponding second sub-conductive part 412. First, by arranging the first through hole 40k1 and the first sub-conductive part 411, a new back binding technology is realized, which can greatly reduce the frame width of the display panel 100. Second, although the first adhesive 30 has been arranged between the circuit board 20 and the first substrate 111 to fix the circuit board 20 and the first substrate 111, because the first adhesive 30, and / or the first substrate 111, and / or the circuit board 20, and / or the second adhesive 40 have flexibility and certain stretchability, the first sub-conductive part 411 and the first binding terminal 1131 are prone to abnormal contact / electrical connection, or the inside of the first sub-conductive part 411 is prone to damage, resulting in abnormal electrical connection between the second binding terminal 22 and the first binding terminal 1131; at this time, the first sub-conductive part 411 can realize the electrical connection between the second binding terminal 22 and the first binding terminal 1131, and the second sub-conductive part 412 can enhance the adhesion strength and stability of the circuit board 20 and the first substrate 111, etc. When the display panel 100 is damaged by external impact, or the display panel 100 falls, etc., the first sub-conductive part 411 is stretched or compressed, etc. The second sub-conductive part 412 is stretched or compressed synchronously, the second sub-conductive part 412 can absorb the energy of external impact or extrusion, etc., so as to protect the first sub-conductive part 411, thereby improving the reliability of the electrical connection between the second binding terminal 22 and the first binding terminal 1131.In the third aspect, when only the first sub-conductive part 411 is provided, a surface of the first binding terminal 1131 needs to be provided with a contact area large enough for the first sub-conductive part 411, that is, a first through hole 40k1 needs to be provided with an area large enough to ensure that the contact area of the first sub-conductive part 411 and the first binding terminal 1131 is large enough and that the first sub-conductive part 411 has sufficient adhesion strength with the substrate and the circuit board 20 and the like. However, due to the large thickness of the circuit board 20, the thick film layers and structures that need to be penetrated by the first sub-conductive part 411, the hole opening process and other factors, the area of one end of the first through hole 40k1 away from the first substrate 111 is large, the area of one end of the first through hole 40k1 close to the first binding terminal 1131 is small, the first through hole 40k1 occupies a very large area of the second binding terminal 22 on the circuit board 20, and a very large area of the second binding terminal 22 needs to be provided on the circuit board 20, which increases the area of the binding connection part, increases the size of the circuit board 20, and also increases the amount of use of the second adhesive 40 and other materials, resulting in a large cost of the display panel 100, and is not conducive to the lightness and thinness of the display panel 100. In the embodiment of the present application, the second through hole 40k2 and the second sub-conductive part 412 are also provided. Since the second through hole 40k2 and the second sub-conductive part 412 need to penetrate fewer film layers and have smaller film layer thickness, the second through hole 40k2 has a smaller degree of size change in the direction perpendicular to the plane of the circuit board 20, which can make the second through hole 40k2 occupy a smaller area on the circuit board 20 to form a stronger bonding area with the first adhesive 30, greatly enhancing the electrical connection stability of the first sub-conductive part 411 and the first binding terminal 1131.

[0057] In some embodiments, as Figure 3As shown, the area of the first through hole 40k1 is greater than the area of the second through hole 40k2 in the plane where the circuit board 20 is located; and / or, the area of the part of the first bonding terminal 1131 exposed by the first through hole 40k1 is greater than the area of the second through hole 40k2 in the plane where the circuit board 20 is located; and / or, the display panel 100 further comprises a second substrate 115, the second substrate 115 is located on the side of the first metal layer 113 away from the first substrate 111, and the second substrate 115 comprises a second opening 115k, the second opening 115k exposes the corresponding first bonding terminal 1131.

[0058] For example, as shown in FIG. 1, the display panel 100 comprises a first substrate 111, a first metal layer 113, a first conductive sub-department 411, a first bonding terminal 1131, a second conductive sub-department 412, a second bonding terminal 22, a circuit board 20, and a first adhesive material 30. Figure 3 As shown, the second opening 115k exposes the surface of the corresponding first bonding terminal 1131 away from the first substrate 111.

[0059] For example, as shown in FIG. 1, the display panel 100 comprises a first substrate 111, a first metal layer 113, a first conductive sub-department 411, a first bonding terminal 1131, a second conductive sub-department 412, a second bonding terminal 22, a circuit board 20, and a first adhesive material 30. Figure 3 As shown, the area of the first through hole 40k1 is greater than the area of the second through hole 40k2 in the plane where the circuit board 20 is located, that is, the first through hole 40k1 is set to be large enough to ensure that the contact area of the first conductive sub-department 411 and the first bonding terminal 1131 is large enough, and to ensure that the first conductive sub-department 411 has sufficient adhesion strength with the first substrate 111 and the circuit board 20, etc.

[0060] For example, as shown in FIG. 1, the display panel 100 comprises a first substrate 111, a first metal layer 113, a first conductive sub-department 411, a first bonding terminal 1131, a second conductive sub-department 412, a second bonding terminal 22, a circuit board 20, and a first adhesive material 30. Figure 3 As shown, the area of the part of the first bonding terminal 1131 exposed by the first through hole 40k1 is greater than the area of the second through hole 40k2 in the plane where the circuit board 20 is located. Since the second through hole 40k2 and the second conductive sub-department 412 need to penetrate fewer film layers and the film layers are thinner, the second through hole 40k2 changes in size in the direction perpendicular to the plane where the circuit board 20 is located to a lesser extent, which can make the second through hole 40k2 smaller in area on the circuit board 20 to form a stronger bonding area with the first adhesive material 30, greatly enhancing the electrical connection stability of the first conductive sub-department 411 and the first bonding terminal 1131. Through this arrangement, when the contact area of the first conductive sub-department 411 and the first bonding terminal 1131 is ensured to be large enough, the area of the second through hole 40k2 in the plane where the circuit board 20 is located is smaller, reducing the area occupied by the second through hole 40k2 on the circuit board 20.

[0061] For example, as shown in FIG. 1, the display panel 100 comprises a first substrate 111, a first metal layer 113, a first conductive sub-department 411, a first bonding terminal 1131, a second conductive sub-department 412, a second bonding terminal 22, a circuit board 20, and a first adhesive material 30. Figure 3 As shown, the display panel 100 further comprises a second substrate 115, the second substrate 115 is located on the side of the first metal layer 113 away from the first substrate 111, and the second substrate 115 comprises a second opening 115k, the second opening 115k exposes the corresponding first bonding terminal 1131. At this time, the driving wire 171 or the electrode is electrically connected to the corresponding first bonding terminal 1131 through the second opening 115k, and the first bonding terminal 1131 is electrically connected to the corresponding second bonding terminal 22.

[0062] In some implementations, such as Figure 5 As shown, at least two second through holes 40k2 and one first through hole 40k1 are correspondingly provided with a second bonding terminal 22; in a direction parallel to the plane of the first substrate 111, at least two second through holes 40k2 are located on both sides of the first through hole 40k1. At this time, the two second sub-conductive parts 412 can enhance the bonding strength and stability between the circuit board 20 and the first substrate 111 from both sides of the first sub-conductive part 411. When the display panel 100 is damaged by external impact or drop, and the first sub-conductive part 411 is stretched or compressed, the two second sub-conductive parts 412 can be stretched or compressed simultaneously from both sides of the first sub-conductive part 411. The second sub-conductive parts 412 can absorb the energy of external impact or compression, thereby protecting the first sub-conductive part 411 and improving the reliability of the electrical connection between the second bonding terminal 22 and the first bonding terminal 1131.

[0063] In some implementations, such as Figure 6 As shown, in a direction parallel to the plane of the first base 111, at least two second through holes 40k2 are located on the same side of the first through hole 40k1; among the at least two second through holes 40k2 located on the same side of the first through hole 40k1, the distance between two adjacent second through holes 40k2 is a first distance d1, and the distance from the second through hole 40k2 closest to the first through hole 40k1 to the first through hole 40k1 is a second distance d2, and the first distance d1 is less than half of the second distance d2.

[0064] For example, such as Figure 6 As shown, the first distance d1 is less than half of the second distance d2. The first distance d1 can be less than any value among half, one-third, and one-quarter of the second distance d2. This is to avoid the distance between the second sub-conductive part 412 and the first sub-conductive part 411 being too far, so as to avoid the second sub-conductive part 412 losing its protective and reinforcing effect on the first sub-conductive part 411.

[0065] In some implementations, such as Figure 8 As shown, at least a portion of the second bonding terminals 22 are located on the third surface 201; the circuit board 20 also includes at least one slot 40k3 located on the fourth surface 202, the slot 40k3 exposing the corresponding second bonding terminal 22 on the fourth surface 202, the slot 40k3 also exposing a first through hole 40k1 and a second through hole 40k2 corresponding to the same second bonding terminal 22.

[0066] For example, such as Figure 8As shown, in some embodiments, one slot 40k3 corresponds to one second binding terminal 22, and the structure of the circuit board 20 around the slot 40k3 (for example, the sidewall of the slot 40k3) can block the conductive part 41 from overflowing or spreading to the position of the adjacent second binding terminal 22, so as to avoid short circuit between the two adjacent second binding terminals 22. At the same time, the slot 40k3 can also accommodate part of the conductive part 41 (the third sub-conductive part 413), so as to avoid the conductive part 41 protruding from the fourth surface 202, and facilitate the thinning of the display panel 100.

[0067] It should be noted that, compared with Figure 4 and Figure 5 , Figure 4 , the conductive part 41 (the third sub-conductive part 413) fills the slot 40k3, Figure 5 , the conductive part 41 (the third sub-conductive part 413) fills part of the slot 40k3.

[0068] In some embodiments, as shown in Figures 4 to 7 , at least part of the second binding terminals 22 are located between the third surface 201 and the fourth surface 202 and inside the circuit board 20; the circuit board 20 further comprises at least one slot 40k3 on the fourth surface 202, the slot 40k3 exposes the corresponding second binding terminal 22 on the fourth surface 202, and the slot 40k3 also exposes the first through hole 40k1 and the second through hole 40k2 corresponding to the same second binding terminal 22. The slot 40k3 has Figure 8 the same effect as the example.

[0069] In some embodiments, as shown in Figures 4 to 7 , the first adhesive 30 is anisotropic conductive adhesive, and the second binding terminal 22 is also electrically connected to the corresponding first binding terminal 1131 through the first adhesive 30 and the corresponding second sub-conductive part 412. At this time, the first adhesive 30 can be arranged to correspond to multiple first binding terminals 1131 and multiple second binding terminals 22 (for example, the first adhesive 30 is an integral structure), and since the first adhesive 30 is anisotropic conductive adhesive, short circuit between different first binding terminals 1131 will not occur.

[0070] For example, as shown in Figures 4 to 7As shown, the first adhesive 30 is anisotropic conductive adhesive, and the second bonding terminal 22 is electrically connected to the corresponding first bonding terminal 1131 through the first adhesive 30 and the corresponding second sub-conductive part 412. At this time, the second bonding terminal 22 is electrically connected to the corresponding first bonding terminal 1131 through the corresponding first sub-conductive part 411, the corresponding second sub-conductive part 412, and the first adhesive 30. At this time, in the direction parallel to the plane on which the circuit board 20 is located, the first via hole 40k1 and / or the second via hole 40k2 with a smaller area can be arranged, and the area of the first via hole 40k1 and the second via hole 40k2 on the circuit board 20 can be further reduced, while the electrical connection stability of the second bonding terminal 22 and the first bonding terminal 1131 is maintained or enhanced, so that the area of the bonding connection part can be reduced, the size of the circuit board 20 is reduced, and the use amount of the second adhesive and other materials is also reduced, thereby reducing the cost of the display panel and facilitating the thinning of the display panel.

[0071] It should be noted that in some other embodiments, in the examples of any of the above, Figure 3 the first adhesive 30 is anisotropic conductive adhesive. Figure 8 the first adhesive 30 is anisotropic conductive adhesive.

[0072] It should be noted that in some other embodiments, in the examples of any of the above, the first adhesive 30 can be non-conductive adhesive, for example, the first adhesive 30 can be NCF adhesive (Non-Conductive Film).

[0073] In some embodiments, as Figure 7 shown, the slot 40k3 also exposes at least part of the edge of the second bonding terminal 22; and the at least one second via hole 40k2 is located outside the edge of the second bonding terminal 22 exposed by the slot 40k3.

[0074] For example, as Figure 7 shown, the at least one second via hole 40k2 is located outside the edge of the second bonding terminal 22 exposed by the slot 40k3. For example, when the number of second via holes 40k2 is large, or the at least one second via hole 40k2 is close to the edge of the second bonding terminal 22, or the area of the second bonding terminal 22 is small, the at least one second via hole 40k2 is arranged outside the edge of the second bonding terminal 22, at this time, this second via hole 40k2 does not occupy the area of the second bonding terminal 22, and the area of the second bonding terminal 22 occupied by the second via hole 40k2 can be reduced to a greater extent, thereby avoiding problems such as peeling off / falling off of the second bonding terminal 22 or poor contact between the second bonding terminal 22 and the first sub-conductive part 40k1.

[0075] It should be noted that in any of the above embodiments, the conductive part 41 can further include a third sub-conductive part 413 connecting the first sub-conductive part 411 and the second sub-conductive part 412 on the fourth surface 202 or the surface of the second binding terminal 22 away from the first adhesive material 30. On the one hand, the third sub-conductive part 413, the first sub-conductive part 411 and the second sub-conductive part 412 can increase the contact area of the conductive part 41 with the second binding terminal 22 and improve the conductivity; on the other hand, the first sub-conductive part 411 and the second sub-conductive part 412 can be fixedly connected to each other through the third sub-conductive part 413, which can prevent the second binding terminal, the first sub-conductive part 411 and the second sub-conductive part 412 from peeling off or falling off, thereby improving the reliability.

[0076] Referring to Figure 9 , Figure 9 A flow chart of a manufacturing method of a display panel provided by an embodiment of the present application is shown.

[0077] In a second aspect, based on the same application concept, the embodiment of the present application further provides a manufacturing method of a display panel. The manufacturing method of the display panel can be used to manufacture the display panel 100 of any of the above embodiments, and has the beneficial effects of the display panel 100 of any of the above embodiments, which will not be repeated here. The manufacturing method of the manufacturing method of the display panel includes steps S100, S200, S300, S400, and S500.

[0078] In step S100, a substrate is provided, which includes a first base and a first metal layer; the first base includes a first surface and a second surface arranged opposite to each other; the first metal layer is located on the side of the first surface away from the second surface, and the first metal layer includes a plurality of first binding terminals.

[0079] For example, a substrate is provided, which includes a first base 111 and a first metal layer 113; the first base 111 includes a first surface 111a and a second surface 111b arranged opposite to each other; the first metal layer 113 is located on the side of the first surface 111a away from the second surface 111b, and the first metal layer 113 includes a plurality of first binding terminals 1131.

[0080] In step S200, a circuit board is provided, which includes a third surface and a fourth surface arranged opposite to each other, and includes a plurality of second binding terminals.

[0081] For example, a circuit board 20 is provided, which includes a third surface 201 and a fourth surface 202 arranged opposite to each other, and includes a plurality of second binding terminals 22.

[0082] Step S300, bonding the circuit board to one side of the first substrate by the first adhesive material, the third surface is opposite to the second surface, and the second binding terminal is arranged corresponding to the first binding terminal.

[0083] For example, the circuit board 20 is bonded to one side of the first substrate 111 by the first adhesive material 30, the third surface 201 is opposite to the second surface 111b, and the second binding terminal 22 is arranged corresponding to the first binding terminal 1131.

[0084] Step S400, a plurality of first through holes and a plurality of second through holes are formed on the circuit board, and at least one first opening 111k is formed on the first substrate 111 at the same time, the first opening 111k exposes the corresponding first binding terminal 1131 on the second surface 111b; at least one of the first through holes and at least one of the second through holes are arranged corresponding to one of the second binding terminals; the first through hole at least partially penetrates the circuit board and the first adhesive material, and the first through hole and the corresponding first opening expose the corresponding first binding terminal on the fourth surface; the second through hole at least partially penetrates the circuit board.

[0085] For example, a plurality of first through holes 40k1 and a plurality of second through holes 40k2 are formed on the circuit board 20, at least one first through hole 40k1 and at least one second through hole 40k2 are arranged corresponding to one second binding terminal 22, and the second binding terminal 22 at least partially surrounds the corresponding first through hole 40k1 and the second through hole 40k2; the first through hole 40k1 at least partially penetrates the circuit board 20 and the first adhesive material 30, and the first through hole 40k1 and the corresponding first opening 111k expose the corresponding first binding terminal 1131 on the fourth surface 202; the second through hole 40k2 at least partially penetrates the circuit board 20, and the second through hole 40k2 exposes the first adhesive material 30 on the fourth surface 202.

[0086] Step S500, filling the second adhesive material in the first through hole and the second through hole, so that the second adhesive material includes a plurality of conductive parts, the conductive parts include at least a first sub-conductive part filled in the corresponding first through hole, and a second sub-conductive part filled in the corresponding second through hole, the second binding terminal is electrically connected to the corresponding first binding terminal through the corresponding first sub-conductive part, and the conductive part is connected to the first adhesive material through the corresponding second sub-conductive part.

[0087] For example, the second adhesive 40 is filled in the first through holes 40k1 and the second through holes 40k2, so that the second adhesive 40 includes a plurality of conductive portions 41, the conductive portions 41 include first sub-conductive portions 411 filled in the corresponding first through holes 40k1, and second sub-conductive portions 412 filled in the corresponding second through holes 40k2, the second binding terminals 22 are electrically connected to the corresponding first binding terminals 1131 through the corresponding first sub-conductive portions 411, and the conductive portions 41 are connected to the first adhesive 30 through the corresponding second sub-conductive portions 412.

[0088] It should be noted that, in some embodiments, in step S400, the first through holes 40k1 and the first openings 111k are formed by the same process, for example, the first through holes 40k1 and the first openings 111k are formed by the same laser slotting process. At this time, the first openings 111k can be part of the first through holes 40k1, or the first through holes 40k1 and the first openings 111k are an integral structure. Figures 4 to 7 For example (the second binding terminals 22 are located between the third surface 201 and the fourth surface 202), and Figure 8 For example (the second binding terminals are located on the third surface 201), in step S400, before the step of forming the plurality of first through holes 40k1 and the plurality of second through holes 40k2 on the circuit board 20, the manufacturing method of the display panel further includes: step S401, preparing at least one slot 40k3 on the fourth surface 202 (in some embodiments, one slot 40k3 is provided for one second binding terminal 22); then step S402, forming the plurality of first through holes 40k1 and the plurality of second through holes 40k2 on the circuit board 20 again, and the slot 40k3 also exposes the first through hole 40k1 and the second through hole 40k2 corresponding to the same second binding terminal 22 (i.e. the corresponding first through hole 40k1 and the corresponding second through hole 40k2 are formed in the corresponding slot 40k3).

[0089] It should be noted that, in some embodiments, in step S400, the first through holes 40k1 and the first openings 111k are formed by the same process, for example, the first through holes 40k1 and the first openings 111k are formed by the same laser slotting process. At this time, the first openings 111k can be part of the first through holes 40k1, or the first through holes 40k1 and the first openings 111k are an integral structure.

[0090] For example, the second adhesive 40 is filled in the first through holes 40k1 and the second through holes 40k2, so that the second adhesive 40 includes a plurality of conductive portions 41, the conductive portions 41 include first sub-conductive portions 411 filled in the corresponding first through holes 40k1, and second sub-conductive portions 412 filled in the corresponding second through holes 40k2, the second binding terminals 22 are electrically connected to the corresponding first binding terminals 1131 through the corresponding first sub-conductive portions 411, and the conductive portions 41 are connected to the first adhesive 30 through the corresponding second sub-conductive portions 412. Figure 10 , Figure 10 A schematic view of a display device provided by an embodiment of the present application.

[0091] In a third aspect, based on the same application concept, the present application also provides a display device 200, the display device 200 includes any one of the display panels 100 described above, or the display device 200 includes the display panel 100 combined with any one of the features described above, or the display device 200 includes the display panel 100 manufactured by the manufacturing method of any one of the display panels described above.

[0092] For example, the display device 200 also has the beneficial effects of the display panel 100 in the above embodiments, and the same can be understood with reference to the above description of the display panel 100, and will not be repeated here.

[0093] For example, the display device 200 provided by the embodiments of the present application can be a mobile phone as shown in the figure, or any electronic product with display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, vehicle-mounted display, industrial control equipment, medical display screen, touch interaction terminal, etc., and the embodiments of the present application do not make special limitations on this. Figure 10

[0094] The technical features of the above embodiments can be combined in any way. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the description.

[0095] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, some modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.​

Claims

1. A display panel, characterized by, The display panel comprises: a first substrate comprising at least one first opening, the first substrate comprising a first surface and a second surface arranged oppositely; a first metal layer located on a side of the first surface away from the second surface, the first metal layer comprising a plurality of first binding terminals; a circuit board comprising a third surface and a fourth surface arranged oppositely, the third surface being arranged oppositely to the second surface, the circuit board comprising a plurality of second binding terminals corresponding to the plurality of first binding terminals respectively; a first adhesive material located between the circuit board and the first substrate; a second adhesive material comprising a plurality of conductive portions, the conductive portions being arranged one-to-one with the first binding terminals and the second binding terminals, the second adhesive material being conductive adhesive; wherein the display panel further comprises a plurality of first through holes and a plurality of second through holes, at least one first through hole and at least one second through hole being arranged corresponding to one second binding terminal; the first through hole at least partially penetrating the circuit board and the first adhesive material, the first through hole and the corresponding first opening being exposed to the corresponding first binding terminal at the fourth surface; the second through hole at least partially penetrating the circuit board; the conductive portion comprising a first sub-conductive portion at least filled in the corresponding first through hole, and a second sub-conductive portion at least filled in the corresponding second through hole, the second binding terminal being electrically connected to the corresponding first binding terminal through the corresponding first sub-conductive portion, and the conductive portion being connected to the first adhesive material through the corresponding second sub-conductive portion.

2. The display panel of claim 1, wherein, in a plane in which the circuit board is located, an area of the first through hole is greater than an area of the second through hole; and / or an area of a portion of the first binding terminal exposed by the first through hole is greater than an area of the second through hole in the plane in which the circuit board is located; and / or the display panel further comprises a second substrate located on a side of the first metal layer away from the first substrate, the second substrate comprising a second opening exposing the corresponding first binding terminal.

3. The display panel of claim 1, wherein, at least two second through holes and one first through hole are arranged corresponding to one second binding terminal; in a direction parallel to a plane in which the first substrate is located, the at least two second through holes are located on two sides of the first through hole.

4. The display panel of claim 1, wherein, in a direction parallel to the plane in which the first substrate is located, the at least two second through holes are located on the same side of the first through hole. in the at least two second through holes located on the same side of the first through hole, a distance between two adjacent second through holes is a first distance, and a distance from the second through hole closest to the first through hole to the first through hole is a second distance, the first distance being less than one half of the second distance.

5. The display panel of claim 1, wherein, at least a part of the second binding terminals are located on the third surface; the circuit board further comprises at least one slot located on the fourth surface, the slot exposing the corresponding second binding terminal on the fourth surface, and the slot further exposing the first through hole and the second through hole corresponding to the same second binding terminal.

6. The display panel of claim 1, wherein, At least part of the second binding terminals is located between the third surface and the fourth surface and inside the circuit board; The circuit board further comprises at least one slot on the fourth surface, the slot exposing the corresponding second binding terminal on the fourth surface, and the slot further exposing the first via and the second via corresponding to the same second binding terminal.

7. The display panel of claim 6, wherein, The first adhesive material is an anisotropic conductive adhesive, and the second binding terminal is electrically connected to the corresponding first binding terminal through the first adhesive material and the corresponding second sub-conductive part.

8. The display panel of any of claims 5-7, wherein, The slot further exposes at least part of the edge of the second binding terminal; At least one of the second vias is located outside the edge of the second binding terminal exposed by the slot.

9. A manufacturing method of a display panel, characterized by, Comprising: A substrate is provided, which comprises a first base and a first metal layer; the first base comprises a first surface and a second surface arranged opposite to each other; the first metal layer is located on the side of the first surface away from the second surface, and the first metal layer comprises a plurality of first binding terminals; A circuit board is provided, which comprises a third surface and a fourth surface arranged opposite to each other, and the circuit board comprises a plurality of second binding terminals; The circuit board is bonded to one side of the first base through a first adhesive material, the third surface is arranged opposite to the second surface, and the second binding terminals are arranged corresponding to the first binding terminals; A plurality of first vias and a plurality of second vias are formed on the circuit board, and at least one first opening is formed on the first base at the same time; at least one of the first vias and at least one of the second vias are arranged corresponding to one of the second binding terminals; the first via at least partially penetrates the circuit board and the first adhesive material, and the first via and the corresponding first opening expose the corresponding first binding terminal on the fourth surface; The second via at least partially penetrates the circuit board; The second adhesive material is filled in the first via and the second via, so that the second adhesive material comprises a plurality of conductive parts, the conductive parts comprising a first sub-conductive part filled in the corresponding first via and a second sub-conductive part filled in the corresponding second via, the second binding terminal being electrically connected to the corresponding first binding terminal through the corresponding first sub-conductive part, and the conductive part being connected to the first adhesive material through the corresponding second sub-conductive part.

10. A display device, characterized by comprising: The display panel comprises any one of claims 1 to 8. The display panel comprises any one of claims 1 to 8.

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