Preparation system and preparation method of mouse foot patch

Abstract

The invention relates to a preparation system and a preparation method of a mouse foot sticker, the preparation system comprises an injection molding device, the injection molding device comprises an injection molding machine charging barrel provided with an electromagnetic induction preheating module, a glue inlet and a molding cavity, and raw materials flow into the molding cavity from the glue inlet for injection molding of the mouse foot sticker; the mold device comprises a front mold and a rear mold, the front mold and the rear mold are each provided with a temperature sensor and an electromagnetic induction heating module, and the demolding device, the ejector pin and the ejection point are connected and matched to enable the mouse foot patch to fall off from the forming cavity; the back glue attaching device comprises a back glue release film, a jig and a visual positioning system, and the visual positioning system adjusts the position of the jig to enable the back glue to be attached to the mouse foot sticker.

Description

Technical Field

[0001] This invention relates to the field of mouse technology, and in particular to a preparation system and method for mouse feet. Background Technology

[0002] In the use of computer and other terminal devices, the mouse is crucial as the primary command input device. Its operation includes clicking buttons, scrolling the wheel, and moving the cursor. The mouse's smoothness and cursor control during movement depend on the mouse's optical sensor sensitivity (DPI), the mouse pad's coefficient of friction, and the mouse feet's coefficient of friction. When the mouse sensitivity (DPI) and mouse pad are fixed, the mouse feet become a key factor affecting the ease of mouse control for the user, making them an indispensable accessory.

[0003] Currently, related technologies generally use Teflon as the raw material, producing mouse feet through die-cutting and stamping. The specific steps are as follows: First, glue is applied to the back of the entire roll of Teflon raw material so that the feet can adhere to the mouse's bottom shell surface after production; next, the shape of the feet is stamped using a die to fit the mouse's bottom shell design; finally, the entire foot is reversed, and a mold is used to stamp out rounded edges, eliminating the sharp edges produced during the second die-cutting step. This method results in the feet not completely adhering to the mouse's bottom shell, with the middle part easily protruding. Uneven feet can cause deviations in the sensor's light reflection angle, thus reducing mouse positioning accuracy. In severe cases, it can lead to dropped frames, uncontrollable pointers, and functional malfunctions. Furthermore, glue overflow at the edges of the feet affects aesthetics and performance, and after prolonged use, a ring of dust will stick, severely impacting appearance and making cleaning difficult. Summary of the Invention

[0004] This invention provides a system and method for preparing mouse feet, aiming to solve at least one of the technical problems existing in the prior art.

[0005] The technical solution of this invention is a mouse foot patch preparation system, which includes:

[0006] The injection molding device includes an injection molding machine barrel, a glue inlet, a molding cavity, and an electromagnetic induction preheating module. The glue inlet is connected to the outlet of the injection molding machine barrel and communicates with the molding cavity. The electromagnetic induction preheating module is installed on the injection molding machine barrel.

[0007] A mold assembly includes a front mold and a rear mold. The front mold is disposed at the top of the molding cavity and is equipped with a first temperature sensor and a first electromagnetic induction heating module. The rear mold is disposed at the bottom of the molding cavity and is equipped with a second temperature sensor and a second electromagnetic induction heating module.

[0008] The demolding device includes a first state and a second state, wherein the first state is in which the ejector pin and the ejector point are connected, and the second state is in which the ejector pin and the ejector point are separated.

[0009] An adhesive bonding device includes an adhesive release film, a fixture, and a vision positioning system. The adhesive release film includes an adhesive backing. The vision positioning system adjusts the position of the fixture by recognizing preset positioning marks on the fixture, mouse feet, and edge features of the adhesive backing, so that the adhesive backing adheres to the mouse feet.

[0010] According to some embodiments of the present invention, the adhesive bonding device further includes an infrared heating device disposed at the bottom of the adhesive release film.

[0011] According to some embodiments of the present invention, the fixture includes an upper fixture and a lower fixture, and the positioning marks preset on the fixture include a positioning groove provided on the upper fixture and a positioning post provided on the lower fixture.

[0012] According to some embodiments of the present invention, the adhesive release film further includes a release film, the surface of which is provided with a layer of micro-nano-scale release agent.

[0013] According to some embodiments of the present invention, the front mold is provided with a first resistance heating element, which is used to adjust the heating temperature of the front mold, and the rear mold is provided with a second resistance heating element, which is used to adjust the heating temperature of the rear mold.

[0014] According to some embodiments of the present invention, a first heat insulation plate and a second heat insulation plate are further included, wherein the first heat insulation plate is disposed between the front mold and the machine base, and the second heat insulation plate is disposed between the rear mold and the machine base.

[0015] This invention also provides a method for preparing mouse feet, comprising:

[0016] Cleaning the feeding device and injection molding device;

[0017] The raw materials are poured into the injection molding machine barrel of the feeding device;

[0018] The power of the electromagnetic induction preheating module of the injection molding machine barrel is controlled so that the raw material flowing through the outlet of the injection molding machine barrel flows into the inlet in a molten state and is injected into the molding cavity.

[0019] Control the injection molding process parameters of the raw material in the molding cavity;

[0020] The power of the first electromagnetic induction heating module is adjusted according to the temperature of the first temperature sensor, and the power of the second electromagnetic induction heating module is adjusted according to the temperature of the second temperature sensor.

[0021] The ejector pin is connected to the ejection point and demolds the mouse feet from the molding cavity;

[0022] Adjust the position of the fixture according to the recognition results of the visual positioning system so that the adhesive backing is attached to the mouse feet.

[0023] According to some embodiments of the present invention, the adhesive is locally heated using an infrared heating device to raise the temperature of the adhesive to a preset bonding temperature to achieve optimal adhesion.

[0024] According to some embodiments of the present invention, the control module of the feeding device controls the injection molding process parameters of the raw material, including:

[0025] The injection speed of the raw material into the molding cavity is controlled to be a first preset speed;

[0026] The injection pressure of the raw material in the molding cavity is controlled to a first preset pressure;

[0027] The holding pressure of the raw material in the molding cavity is controlled to be 60% to 80% of the injection pressure, and the holding time is a first preset time;

[0028] The cooling time of the raw material in the molding cavity is controlled to be a second preset time.

[0029] According to some embodiments of the present invention, the method further includes:

[0030] The electromagnetic induction preheating module controls the temperature of the raw material flowing through the feed port of the injection molding machine barrel to the hot nozzle to the first preset temperature;

[0031] The electromagnetic induction preheating module controls the temperature of the raw material flowing through the injection molding device's inlet to be a second preset temperature, so that the raw material is in a molten state;

[0032] The power of the first electromagnetic induction heating module is adjusted according to the temperature of the first temperature sensor to bring the temperature of the front mold to a third preset temperature, and the power of the second electromagnetic induction heating module is adjusted according to the temperature of the second temperature sensor to bring the temperature of the rear mold to a fourth preset temperature.

[0033] The mouse feet preparation method and preparation system provided in this invention have at least one of the following advantages or beneficial effects: An electromagnetic induction preheating device is added to the injection molding machine barrel section, raising the temperature of the raw material to near the lower limit of the injection molding temperature before it enters the mold device, reducing the heating time within the mold device, improving injection efficiency, enhancing raw material flowability, and reducing defects such as internal porosity. The molding cavity is located between the front and rear molds. Temperature sensors and electromagnetic heating modules are installed in the front and rear molds. Temperature control technology, using multiple temperature sensors and electromagnetic heating modules working in tandem, ensures uniform temperature during the mouse feet molding process, improving flatness, reducing internal defects, and achieving perfect adhesion. Through the connection and cooperation of ejector pins and ejection points, after the mouse feet cool and solidify in the molding cavity, the ejector pins eject the mouse feet from the injection device by pushing upwards. The use of high-precision fixtures and a vision positioning system, along with the application of adhesive backing and release film, achieves precise adhesive backing bonding, avoiding glue overflow and impurity contamination, and improving the quality of the mouse feet.

[0034] Furthermore, additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of a mouse foot patch preparation system provided in an embodiment of the present invention;

[0036] Figure 2 This is a cross-sectional view of the first mouse foot preparation system provided in this embodiment of the invention;

[0037] Figure 3 This is a schematic diagram of the structure of an adhesive bonding device provided in an embodiment of the present invention;

[0038] Figure 4 This is a detailed structural schematic diagram of an adhesive bonding device provided in an embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram of the ejection point of the demolding device provided in an embodiment of the present invention;

[0040] Figure 6 This is a cross-sectional view of the second mouse foot preparation system provided in this embodiment of the invention;

[0041] Figure 7 This is a flowchart of a method for preparing mouse feet according to an embodiment of the present invention;

[0042] Figure 8 This is a detailed flowchart of step S300 in the method for preparing mouse feet provided in this embodiment of the invention;

[0043] Figure 9 This is a detailed flowchart of a method for preparing mouse feet provided in an embodiment of the present invention.

[0044] The above figures include the following reference numerals:

[0045] 100. Injection molding unit; 110. Injection molding machine barrel; 111. Electromagnetic induction preheating module; 120. Glue inlet; 130. Molding cavity; 140. Mouse feet; 200. Mold assembly; 210. Front mold; 211. First temperature sensor; 212. First electromagnetic induction heating module; 220. Rear mold; 221. Second temperature sensor; 222. Second electromagnetic induction heating module; 300. Demolding device; 310. 320. Ejector pin; 400. Adhesive bonding device; 410. Adhesive release film; 411. Adhesive; 412. Release film; 420. Fixture; 430. Visual positioning system; 440. Infrared heating device; 421. Upper fixture; 422. Lower fixture; 431. Positioning groove; 432. Positioning post; 213. First resistance heating element; 223. Second resistance heating element; 500. Heat insulation plate. Detailed Implementation

[0046] The following will provide a clear and complete description of the concept, specific structure, and technical effects of the present invention in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of the present invention. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0047] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," "right," "top," and "bottom" used in this invention are only relative to the relative positional relationships of the various components of the invention in the accompanying drawings.

[0048] Furthermore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this specification is for the purpose of describing particular embodiments only and not for limiting the invention. The term "and / or" as used herein includes any combination of one or more of the associated listed items.

[0049] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various elements, these elements should not be limited to these terms. These terms are only used to distinguish elements of the same type from one another. For example, without departing from the scope of this disclosure, a first element may also be referred to as a second element, and similarly, a second element may also be referred to as a first element.

[0050] Currently, related technologies generally use Teflon as the raw material, producing mouse feet through die-cutting and stamping. The specific steps are as follows: First, glue is applied to the back of the entire roll of Teflon raw material so that the feet can adhere to the mouse's bottom shell surface after production; next, the shape of the feet is stamped using a die to fit the mouse's bottom shell design; finally, the entire foot is reversed, and a mold is used to stamp out rounded edges, eliminating the sharp edges produced during the second die-cutting step. This method results in the feet not completely adhering to the mouse's bottom shell, with the middle part easily protruding. Uneven feet can cause deviations in the sensor's light reflection angle, thus reducing mouse positioning accuracy. In severe cases, it can lead to dropped frames, uncontrollable pointers, and functional malfunctions. Furthermore, glue overflow at the edges of the feet affects aesthetics and performance, and after prolonged use, a ring of dust will stick, severely impacting appearance and making cleaning difficult.

[0051] Based on this, embodiments of the present invention provide a mouse feet preparation system and method. This system leverages temperature control technology, utilizing multiple temperature sensors in the mold assembly and an electromagnetic heating module working in tandem, to ensure uniform temperature during the mouse feet molding process, improving flatness. The injection molding process, combining an electromagnetic induction preheating device in the injection molding machine barrel with multi-stage injection speed control, enhances injection efficiency and mouse feet quality, reducing internal defects. Furthermore, the use of high-precision fixtures and a vision positioning system, along with novel hot-melt pressure-sensitive adhesives and specially treated release films, achieves precise adhesive bonding, preventing glue overflow and contamination, thus improving the overall quality of the mouse feet.

[0052] Reference Figures 1 to 5As shown, the mouse feet preparation system includes an injection molding device 100, a mold device 200, a demolding device 300, and an adhesive bonding device 400. The injection molding device 100 includes an injection molding machine barrel 110, a sprue 120, a molding cavity 130, and an electromagnetic induction preheating module 111. The sprue 120 is connected to the outlet of the injection molding machine barrel 110 and is connected to the molding cavity 130. The electromagnetic induction preheating module 111 is installed on the injection molding machine barrel 110 and is used to heat the raw material flowing through the injection molding machine barrel 110 to a preset injection temperature, so that the raw material is in a molten state. The molten raw material flows into the molding cavity 130 through the sprue 120, and the mouse feet 140 are injection molded in the molding cavity 130. The mold assembly 200 includes a front mold 210 and a rear mold 220. The front mold 210 is disposed at the top of the molding cavity 130 and is equipped with a first temperature sensor 211 and a first electromagnetic induction heating module 212. The first electromagnetic induction heating module 212 is used to adjust its own heating power according to the temperature detected by the first temperature sensor 211. The rear mold 220 is disposed at the bottom of the molding cavity 130 and is equipped with a second temperature sensor 221 and a second electromagnetic induction heating module 222. The second electromagnetic induction heating module 222 is used to adjust its own heating power according to the temperature detected by the second temperature sensor 221. The demolding device 300 includes a first state and a second state. The device has two states: the first state is that the ejector pin 310 and the ejector point 320 are connected, and the second state is that the ejector pin 310 and the ejector point 320 are separated. The ejector pin 310 and the ejector point 320 are connected and cooperated to remove the mouse foot sticker 140 from the molding cavity 130 of the injection molding device 100. The adhesive bonding device 400 includes an adhesive release film 410, a fixture 420 and a vision positioning system 430. The adhesive release film 410 includes adhesive 411. The vision positioning system 430 adjusts the position of the fixture 420 by recognizing the preset positioning marks on the fixture 420, the edge features of the mouse foot sticker 140 and the adhesive 411, so that the adhesive 411 is bonded to the mouse foot sticker 140.

[0053] In some embodiments of the present invention, the injection molding apparatus 100 includes an injection molding machine barrel 110, which is the inlet of the raw materials of the entire preparation system and is used to provide a hot runner for the raw materials used to manufacture the mouse feet 140. An electromagnetic induction preheating module 111 is provided in the injection molding machine barrel 110, which uses the principle of electromagnetic induction to heat the raw materials.

[0054] When alternating current passes through the induction coil, an alternating magnetic field is generated around the raw material inside the injection molding machine barrel 110. Conductive substances in the raw material (such as additives in plastic granules or materials with inherent conductivity) will generate eddy currents under the influence of the magnetic field, thus converting electrical energy into heat energy and raising the temperature of the raw material. This heating method is fast, efficient, and can heat the raw material relatively evenly, bringing it to the preset injection molding temperature, preparing it for subsequent injection molding. Adding an electromagnetic induction preheating device to the injection molding machine barrel 110 raises the temperature of the raw material to near the lower limit of the injection molding temperature before it enters the mold assembly 200, reducing the heating time within the mold assembly 200, improving injection efficiency, enhancing raw material flowability, and reducing defects such as internal porosity.

[0055] The injection molding apparatus 100 also includes a sprue 120 and a molding cavity 130. The sprue 120 is connected to the outlet of the injection molding machine barrel 110, and the sprue 120 is connected to the molding cavity 130. The electromagnetic induction preheating device of the injection molding machine barrel 110 heats the raw material to a preset injection temperature, making the raw material molten. The molten raw material flows into the molding cavity 130 through the sprue 120. Compared with traditional cold runners, the molten raw material reduces material waste. In cold runners, the raw material gradually cools down in the runner, causing some raw material to be wasted because it cannot enter the molding cavity 130. In this application, the raw material is kept in a molten state by heating, allowing the raw material to flow smoothly into the molding cavity 130, where the mouse foot 140 is injection molded. The molding cavity 130 is where the shape of the mouse foot 140 is formed, and the shape and size of the molding cavity 130 match the preset design requirements of the mouse foot 140. When the molten material flows into the molding cavity 130 from the glue inlet 120, the material is cooled and solidified in the molding cavity 130 according to the preset shape of the mouse feet 140 to obtain the mouse feet 140.

[0056] The mold assembly 200 includes a front mold 210 and a rear mold 220. The front mold 210 is located at the top of the molding cavity 130, and the rear mold 220 is located at the bottom of the molding cavity 130, which is situated between the front mold 210 and the rear mold 220. The front mold 210 is equipped with a first temperature sensor 211 and a first electromagnetic induction heating module 212. The first temperature sensor 211 monitors the temperature of the front mold 210 in real time. Based on the data fed back from the first temperature sensor 211, the power of the first electromagnetic induction heating module 212 is precisely adjusted to make the temperature field of the front mold 210 more uniform. This temperature control method ensures that the front mold 210 maintains a suitable temperature throughout the injection molding process, which is beneficial for the flow and molding of the molten material.

[0057] The rear mold 220 is equipped with a second temperature sensor 221 and a second electromagnetic induction heating module 222. Their functions are similar to those of the temperature control device in the front mold 210. The second temperature sensor 221 monitors the temperature of the rear mold 220 in real time, and the second electromagnetic induction heating module 222 adjusts its heating power according to the temperature detected by the second temperature sensor 221, making the temperature field of the rear mold 220 more uniform. The temperature control of the rear mold 220 also has a significant impact on the cooling rate of the molten material in the molding cavity 130 and the molding quality. This temperature control method ensures that the rear mold 220 maintains a suitable temperature throughout the injection molding process, which is beneficial for the flow and molding of the molten material, thereby preventing defects such as warping of the mouse feet 140.

[0058] The demolding device 300 includes a first state and a second state. In the first state, the ejector pin 310 and the ejector point 320 are connected. In the second state, the ejector pin 310 and the ejector point 320 are separated. The ejector pin 310 is a key component of the demolding device 300. It is installed inside the demolding device 300 and cooperates with the ejector point 320. The ejector point 320 is the part where the ejector pin 310 acts. After the mouse feet 140 cools and solidifies in the molding cavity 130, the ejector pin 310 ejects the mouse feet 140 from the injection molding device 100 by pushing upward. The size and position of the ejector pin 310 are precisely designed according to the shape and structure of the mouse feet 140 to ensure smooth demolding, a stable demolding process, and to avoid damage to the mouse feet 140.

[0059] The adhesive bonding device 400 includes an adhesive release film 410, which includes adhesive 411. Adhesive 411 is an adhesive layer used to adhere the mouse feet 140 to the bottom of the mouse. Release film 412 is a protective film to prevent adhesive 411 from adhering to the surface of other objects during storage and transportation. Fixture 420 is a device used to fix the mouse feet 140 and the adhesive release film 410. Fixture 420 ensures that the position of the mouse feet 140 and the adhesive release film 410 is stable during the bonding process. The visual positioning system 430 automatically adjusts the position of the fixture 420 by recognizing preset positioning marks on the fixture 420, the edge features of the mouse feet 140 and the adhesive backing 411. For example, the visual positioning system 430 recognizes the shape and outline of the mouse feet 140 and the edge of the adhesive backing 411. When a deviation is detected between the two, the system automatically adjusts the position of the fixture 420 so that the adhesive backing 411 can accurately adhere to the mouse feet 140, thereby obtaining a complete mouse feet 140. This automated bonding method can improve production efficiency and the consistency of the product quality of the mouse feet 140.

[0060] The manufacturing system for mouse feet 140 also includes a controller. The controller is responsible for controlling the injection molding process parameters of the raw materials, including but not limited to injection pressure, injection speed, and holding time. By precisely controlling these injection molding process parameters, the controller can ensure the quality of the mouse feet 140. The injection molding process, which combines the electromagnetic induction preheating module 111 of the injection molding machine barrel 110 with the controller's control of multi-stage injection speeds, improves injection efficiency and foot quality, and reduces internal defects in the mouse feet 140.

[0061] In this application, electromagnetic induction heating modules and temperature sensors are installed in both the front mold 210 and the rear mold 220. The temperature sensors monitor the temperature of various parts of the mold assembly 200 (front mold 210 and rear mold 220) in real time, ensuring that the heating temperature uniformity error is controlled within ±2℃. Based on the data fed back from the temperature sensors, the power of the electromagnetic heating modules in the front mold 210 and rear mold 220 is precisely adjusted, making the temperature field of the mold assembly 200 more uniform. For example, temperature sensors are arranged at the edges and center of the mold assembly 200, and the heating power of the electromagnetic induction heating modules is adjusted according to the temperature differences in different areas, avoiding molding defects in the mouse feet 140 due to uneven temperature. Through the temperature control technology that utilizes multiple temperature sensors in the mold assembly 200 in conjunction with the electromagnetic induction heating modules, uniform temperature is ensured during the molding process of the mouse feet 140, improving flatness.

[0062] In some embodiments of the present invention, the raw material is Teflon (PTFE), and hot runner technology is used to ensure that the Teflon material remains in a molten state in the runner of the injection molding device 100, and that the temperature, pressure and density are uniform after injection into the molding cavity 130.

[0063] The preparation method of Teflon material is as follows:

[0064] The first step is to set the friction coefficient to 0.05-0.1, and add high-temperature colorants, plasticizers and other additives in a specific ratio to prepare plastic raw materials for production. After being thoroughly mixed by a high-speed mixer, the raw materials are cut into uniform granules with a length of 2mm to 4mm by a twin-screw extruder.

[0065] The second step is material drying. According to the injection molding process requirements, the plastic raw material must be fully dry and free of moisture. Therefore, before injection molding, the raw material is dried in a dryer at 120 degrees Celsius for 8 hours until the moisture content is below 0.02%.

[0066] The third step is injection molding. After pretreatment of the plastic raw materials, the injection molding machine 100 is used for processing and production. Before molding, the injection molding machine 100 is tested to check its quality and adjust the appropriate process parameters. According to the characteristics of Teflon material, the melting temperature needs to reach 400 degrees Celsius. Since the overall thickness of the mouse foot sticker 140 product is only 0.5mm, it is a thin-walled product that requires high-pressure and rapid filling. The injection stage adopts multi-stage injection, first high-speed filling and then low-speed venting. The injection speed is controlled at 300mm / s, the injection pressure is 150Mpa, and the injection process includes holding pressure, cooling and shaping, demolding, and removal by a robotic arm to complete the product injection molding production process.

[0067] The fourth step is to remove the sprue. After injection molding, the sprue material on the 140 mouse feet needs to be removed. Ultrasonic high-frequency vibration is used to separate the sprue from the product.

[0068] Step 5: Inspection and Packaging. After removing the sprue, the size and appearance of the 140 mouse feet are inspected using a CCD vision inspection system. Qualified products are packaged as semi-finished products and boxed, ready to be transferred to the next process; unqualified products are collected and recycled.

[0069] In some embodiments of this application, when the electromagnetic induction heating module of the front mold 210 or the rear mold 220 is in direct contact with the metal frame of the machine, the machine will absorb a large amount of heat (metal has a high thermal conductivity), which will cause the heating efficiency of the front mold 210 or the rear mold 220 to decrease and the energy consumption to increase. By using the heat insulation plate 500 for the machine, the front mold 210, the rear mold 220 and the machine can be isolated to avoid heat loss and difficulty in heating.

[0070] In one embodiment, the heat insulation plate 500 uses ceramic fiber gaskets (thermal conductivity ≤0.1W / m·K) or aerogel felt (thermal conductivity ≤0.02W / m·K) to form a thermal resistance barrier between the front mold 210, the rear mold 220 and the machine base, blocking heat loss to the machine base. After adding the heat insulation layer, the heating time of the front mold 210 and the rear mold 220 can be shortened by 30%-50%, and energy consumption can be reduced by 20%-35%.

[0071] In some embodiments of the present invention, the ejector pin 310 is an elastic silicone ejector pin 310. The elastic silicone ejector pin 310 ensures that the mouse feet 140 are subjected to uniform ejection force during demolding, thereby ensuring the integrity and flatness of the mouse feet 140.

[0072] In some embodiments of the present invention, the adhesive bonding device 400 further includes an infrared heating device 440, which is disposed at the bottom of the adhesive release film 410. The infrared heating device 440 is used to locally heat the adhesive 411 so that the adhesive 411 and the mouse foot sticker 140 reach the optimal adhesive state at the moment of bonding.

[0073] In this embodiment of the invention, a novel hot-melt pressure-sensitive adhesive is selected as the backing adhesive 411. This adhesive has a certain viscosity at room temperature, making it easy to process and store; its viscosity increases rapidly when heated, allowing it to adhere firmly to the mouse feet and mouse bottom shell. During the bonding process of the backing adhesive 411, an infrared heating device 440 is used to locally heat the backing adhesive 411. The infrared heating device 440 directly penetrates the release film 410 of the backing adhesive through infrared radiation (wavelength 1-3μm), which is quickly absorbed by the pressure-sensitive adhesive layer in the backing adhesive 411. After being heated, the molecular chains of the backing adhesive 411 layer become more fluid, forming a molecular-level interlock with the surface of the mouse feet 140 at the moment of bonding, increasing the bonding strength by 30%-50%. This ensures that the backing adhesive 411 and the mouse feet 140 reach the optimal tack state at the moment of bonding, improving the adhesion between the backing adhesive 411 and the mouse feet 140, and preventing excessive glue flow that could cause glue overflow.

[0074] It should be noted that the infrared heating device 440 is used to locally heat the adhesive 411. Infrared heating has non-contact, directional radiation characteristics, heating only the area of ​​the adhesive 411 (±2mm accuracy), thus preventing the mouse feet 140 from deforming due to high temperature. Compared with traditional heating, hot air heating can easily lead to overall temperature rise, which may cause warping of the PC material; infrared heating has a concentrated energy density, reducing the heat-affected zone by 80%.

[0075] The infrared heating device 440 and the visual positioning system 430 work together to control the infrared heating device 440 to identify the position of the adhesive 411, which is then activated. The fixture 420 moves to the bonding position and the adhesive 411 reaches its optimal adhesion, thus completing the bonding process. This ensures that the adhesive 411 and the mouse feet 140 are successfully bonded, and that the temperature of the mouse feet 140 is uniform during the molding process, improving flatness and preventing indentation.

[0076] In some embodiments of the present invention, the fixture 420 includes an upper fixture 421 and a lower fixture 422, and the positioning marks preset on the fixture 420 include a positioning groove 431 provided on the upper fixture 421 and a positioning post 432 provided on the lower fixture 422.

[0077] The upper fixture 421 and lower fixture 422 are manufactured using high-precision CNC machining technology. Positioning grooves 431 and positioning posts 432 with an accuracy of ±0.01mm are machined on the surface of fixture 420. Specifically, positioning grooves 431 are machined in the upper fixture 421, and positioning posts 432 are machined in the lower fixture 422. A vision positioning system 430 is introduced. When the adhesive release film 410 and mouse feet 140 are placed between the upper fixture 421 and lower fixture 422, the vision positioning system 430 automatically adjusts the position of fixture 420 by recognizing the positioning grooves 431 of the upper fixture 421, the positioning posts 432 of the lower fixture 422, and the edge features of the feet and adhesive 411. This ensures that the adhesion accuracy error between the adhesive 411 and the feet is extremely small, allowing the adhesive 411 to be precisely adhered to the feet.

[0078] In some embodiments of the present invention, the adhesive release film 410 further includes a release film 412, the surface of which is provided with a layer of micro-nano-scale release agent to facilitate separation of the release film 412 from the adhesive 411.

[0079] The release film 410 is specially treated, and a layer of micro-nano-level release agent is added to the surface of the release film 412 to ensure that the release film 412 is easy to separate from the adhesive 411, while preventing impurities on the release film 412 from being transferred to the surface of the adhesive 411, which would affect the adhesion of the adhesive 411 and the bonding effect of the foot sticker.

[0080] The release agent on the surface of the release film 412 and the infrared heating device 440 are synergistically adapted. The release agent has an absorption rate of <5% under infrared radiation (wavelength 1-3μm), which avoids local overheating and causes uneven softening of the backing adhesive 411, thus improving thermal stability.

[0081] The high-precision fixture 420, together with the vision positioning system 430, and the application of a new hot melt pressure-sensitive adhesive and a specially treated release film 412, achieves precise backing adhesion 411, avoiding glue overflow and impurity contamination.

[0082] In some embodiments of the present invention, the front mold 210 is provided with a first resistance heating element 213, which is used to adjust the heating temperature of the front mold 210, and the rear mold 220 is provided with a second resistance heating element 223, which is used to adjust the heating temperature of the rear mold 220.

[0083] The first resistance heating element 213 is directly integrated into the front mold 210. The first resistance heating element 213 adjusts its heating power according to the first temperature sensor 211, achieving a temperature control accuracy of ±1℃, enabling rapid heating and molding of highly fluid materials. The second resistance heating element 223 independently controls the temperature of the rear mold 220, creating a temperature difference with the front mold 210, and ensuring that the uniformity of heating temperature between the front mold 210 and the rear mold 220 is controlled within ±2℃, optimizing the cooling rate and reducing warping deformation.

[0084] In some embodiments of the present invention, the positioning marks preset on the fixture 420 also include mechanical positioning pins. In the alternative solution for the adhesive 411 bonding process, for the adhesive 411 bonding and positioning, mechanical positioning pins are used in conjunction with a high-precision fixture 420 to replace the visual positioning system 430. The mechanical positioning pins have high installation and adjustment accuracy. In the selection of adhesive 411, a new type of silicone-based adhesive is studied, which has good adhesion and weather resistance.

[0085] Reference Figure 7 As shown, Figure 7 This is a flowchart of a method for preparing mouse feet according to an embodiment of the present invention. The method for preparing mouse feet includes, but is not limited to, steps S100 to S600. Specifically,

[0086] S100: Cleaning injection molding equipment;

[0087] S200: Pour the raw material into the injection molding machine barrel of the feeding device, control the power of the electromagnetic induction preheating module of the injection molding machine barrel so that the raw material flowing through the outlet of the injection molding machine barrel flows into the inlet in a molten state and is injected into the molding cavity.

[0088] S300: Controls the injection molding process parameters of raw materials in the molding cavity;

[0089] S400: Adjust the power of the first electromagnetic induction heating module according to the temperature of the first temperature sensor, and adjust the power of the second electromagnetic induction heating module according to the temperature of the second temperature sensor.

[0090] S500: Drives the ejector pin to connect to the ejection point and demolds the mouse feet from the molding cavity;

[0091] S600: Adjust the position of the fixture according to the recognition result of the visual positioning system so that the adhesive backing is attached to the mouse feet.

[0092] In some embodiments of the present invention, the preparation method of the mouse feet includes: first, cleaning the injection molding device, specifically cleaning the hopper for feeding and the injection molding machine barrel, cleaning the inlet and the molding cavity to avoid impurities in the injection molding device and improve the purity of the mouse feet product; then, drying the hopper, injection molding machine barrel, inlet, and molding cavity to prevent residual moisture from affecting the quality of the mouse feet product. Next, the raw material is poured into the injection molding machine barrel, and the electromagnetic induction preheating module of the injection molding machine barrel heats the raw material to a preset injection temperature, increasing the heating time of the raw material entering the mold device, improving injection efficiency, enhancing the fluidity of the raw material, reducing defects such as internal porosity, and simultaneously ensuring that the raw material is in a molten state. The molten raw material flows into the molding cavity through the inlet; controlling the injection process parameters of the raw material in the molding cavity, including but not limited to injection pressure, injection speed, and holding time, etc., ensures the quality of the mouse feet by precisely controlling these injection process parameters. The injection molding machine's barrel utilizes an electromagnetic induction preheating module and control module to combine multi-stage injection speed control in its injection molding process. This improves injection efficiency and mouse feet quality, reducing internal defects in the mouse feet. The front mold is positioned at the top of the molding cavity, and the rear mold at the bottom, with the molding cavity located between them. A first temperature sensor in the front mold monitors its temperature in real time. Based on the data from this sensor, the power of the first electromagnetic induction heating module is precisely adjusted to ensure a more uniform temperature field in the front mold, maintaining a suitable temperature throughout the injection process, which is beneficial for the flow and molding of the molten material. A second temperature sensor in the rear mold monitors its temperature in real time. The second electromagnetic induction heating module adjusts its heating power based on the temperature detected by the second sensor, further uniformizing the temperature field in the rear mold and preventing defects such as warping.

[0093] Utilizing hot runner technology, the raw material within the injection molding unit's runner is kept molten through heating, allowing it to flow smoothly into the molding cavity. Once the molten material enters the cavity through the sprue, it cools and solidifies according to the pre-set shape of the mouse feet, resulting in the mouse feet. After the mouse feet have cooled and solidified in the molding cavity, ejector pins are connected to the ejection point and demold the mouse feet from the cavity. The ejector pins, in conjunction with the ejection point, push upwards, smoothly demolding the mouse feet from the injection molding unit without damage. Finally, a vision positioning system automatically adjusts the fixture's position by recognizing pre-set positioning marks on the fixture, the edge features of the mouse feet, and the adhesive backing. When a deviation is detected between the shape and outline of the mouse feet and the edge position of the adhesive backing, the fixture is automatically adjusted to ensure accurate adhesion between the adhesive backing and the mouse feet, resulting in a complete mouse feet product. This automated bonding method improves production efficiency and product quality consistency.

[0094] In some embodiments of the present invention, the injection molding process parameters for controlling the raw material in the molding cavity include: using multi-stage injection speed control, with the injection speed increasing or decreasing within the range of 50-100 mm / s; initially filling the molding cavity of the mold device at a lower speed to prevent turbulence caused by high-speed impact of the raw material; when the molding cavity is filled to about 80%, appropriately increasing the injection speed to ensure that the raw material quickly fills the molding cavity; and when the molding cavity is nearly completely filled, reducing the injection speed again to prevent overflow and make the surface of the mouse feet flatter.

[0095] In some embodiments of the present invention, the preset injection temperature is about 250°C. The electromagnetic induction preheating module can quickly and accurately heat the raw material to this temperature, so that the temperature of the raw material is raised to close to the lower limit of the injection temperature before entering the mold device, thereby reducing the heating time of the raw material in the mold device, improving injection efficiency, and preparing for subsequent injection molding.

[0096] In some embodiments of the present invention, the ejector pin is an elastic silicone ejector pin. By cooperating with the ejector point, a flexible ejection method is adopted. For example, by using an elastic silicone ejector pin, the mouse feet are subjected to uniform ejection force during demolding, ensuring the integrity and flatness of the mouse feet product.

[0097] In some embodiments of the present invention, the mold device includes a front mold and a rear mold. The front mold is disposed at the top of the molding cavity, and the rear mold is disposed at the bottom of the molding cavity, with the molding cavity located between the front and rear molds. The front mold is equipped with a first temperature sensor and a first electromagnetic induction heating module. The first temperature sensor is used to monitor the temperature of the front mold in real time. Based on the data fed back by the first temperature sensor, the power of the first electromagnetic induction heating module is precisely adjusted to make the temperature field of the front mold more uniform. For example, when the first temperature sensor detects that the temperature of the front mold is lower than a first set value, the first electromagnetic induction heating module will be activated. The heating power of the first electromagnetic induction heating module will be adjusted according to the temperature difference to heat the front mold until the temperature of the front mold reaches the first set value. This temperature control method can ensure that the front mold maintains a suitable temperature throughout the injection molding process, which is beneficial to the flow and molding of the raw material melt.

[0098] The rear mold is equipped with a second temperature sensor and a second electromagnetic induction heating module. Their functions are similar to those of the front mold's temperature control device. The second temperature sensor monitors the rear mold's temperature in real time, and the second electromagnetic induction heating module adjusts its heating power based on the detected temperature, resulting in a more uniform temperature field in the rear mold. The temperature control of the rear mold also significantly impacts the cooling rate of the molten material within the molding cavity and the molding quality. In this embodiment, when the second temperature sensor detects that the front mold's temperature is lower than a second set value, the second electromagnetic induction heating module is activated. Its heating power is adjusted according to the temperature difference to heat the rear mold until its temperature reaches the second set value. This temperature control method ensures that the rear mold maintains a suitable temperature throughout the injection molding process, which is beneficial for the flow and molding of the molten material. It should be noted that the second set value is smaller than the first set value, ensuring that the rear mold's temperature is slightly lower than the front mold's, thus controlling the cooling sequence of the molten material within the molding cavity and preventing defects such as product warping.

[0099] In some embodiments of the present invention, an infrared heating device is used to locally heat the adhesive backing so that the adhesive backing reaches the optimal adhesive state the moment it is bonded to the mouse feet.

[0100] A novel hot-melt pressure-sensitive adhesive is selected as the backing adhesive. During the adhesive bonding process, an infrared heating device is used to locally heat the backing adhesive. The infrared heating device directly penetrates the release film of the backing adhesive through infrared radiation (wavelength 1-3μm), which is quickly absorbed by the pressure-sensitive adhesive layer in the backing adhesive. After being heated, the molecular chains of the backing adhesive layer become more fluid, forming a molecular-level interlock with the surface of the mouse feet at the moment of bonding. The bonding strength is increased by 30%-50%, allowing the backing adhesive and the mouse feet to reach the optimal tack state at the moment of bonding, improving the bonding force between the backing adhesive and the mouse feet, and avoiding excessive glue flow that causes glue overflow.

[0101] It should be noted that the infrared heating device is used to locally heat the adhesive backing. Infrared heating has non-contact, directional radiation characteristics, heating only the adhesive backing area (±2mm accuracy), thus preventing the mouse feet from deforming due to high temperatures. Compared with traditional heating, hot air heating can easily lead to overall temperature rise, potentially causing warping of the PC material; infrared heating has a concentrated energy density, reducing the heat-affected zone by 80%.

[0102] The infrared heating device and the vision positioning system work together to control the adhesive backing. The vision positioning system identifies the position of the adhesive backing → the infrared heating device is activated → the fixture moves to the bonding position → the bonding is completed when the adhesive backing reaches the optimal adhesion. This achieves a closed-loop process, ensuring successful bonding of the adhesive backing and mouse feet, ensuring uniform temperature during the mouse feet molding process, improving flatness, and preventing indentation.

[0103] Reference Figure 8 As shown, Figure 8This is a detailed flowchart of step S300 in the method for preparing mouse feet provided in this embodiment of the invention. Step S300 includes, but is not limited to, steps S310 to S340. Specifically,

[0104] S310: Control the injection speed of the raw material in the molding cavity to the first preset speed;

[0105] S320: Control the injection pressure of the raw material in the molding cavity to the first preset pressure;

[0106] S330: Control the holding pressure of the raw material in the molding cavity to be 60% to 80% of the injection pressure, and the holding time to be the first preset time;

[0107] S340: Control the cooling time of the raw material in the molding cavity to the second preset time.

[0108] Injection speed determines how quickly the molten material fills the molding cavity. A reasonable injection speed can prevent the molten material from condensing or flowing unevenly during the filling process. Injection pressure is the pressure that pushes the molten material to fill the molding cavity. Appropriate injection pressure ensures that the molten material can fully fill all corners of the molding cavity, avoiding defects such as insufficient material. Holding time is the time after injection molding is completed, during which a certain pressure is maintained in the mold to ensure that the mouse feet cool and solidify. This helps to eliminate defects such as air bubbles and shrinkage cavities inside the mouse feet.

[0109] In a preferred embodiment of the present invention, the injection molding process parameters of the raw material controlled by the control module of the feeding device include: controlling the injection speed of the raw material in the molding cavity to be 50 mm / s to 100 mm / s; controlling the injection pressure of the raw material in the molding cavity to be 100 MPa to 150 MPa; controlling the holding pressure of the raw material in the molding cavity to be 60% to 80% of the injection pressure, and the holding time to be 30 seconds; and controlling the cooling time of the raw material in the molding cavity to be 35 seconds. This injection molding process, combining the control of multi-level injection molding process parameters, can improve injection molding efficiency and the quality of mouse feet, and reduce internal defects.

[0110] It should be noted that in the embodiments of the present invention, the first preset speed is 50mm / s to 100mm / s, the first preset pressure is 100MPa to 150MPa, the holding pressure is 60% to 80% of the injection pressure, the first preset time is 30 seconds, and the second preset time is 35 seconds. By setting the above-mentioned preferred parameters for the multi-stage injection molding process, the interaction of these parameters can effectively improve injection molding efficiency and the quality of the mouse feet, and reduce internal defects. Those skilled in the art can set the magnitudes of the first preset speed, first preset pressure, holding pressure, first preset time, and second preset time according to actual conditions. The embodiments of this application do not limit the magnitudes of the first preset speed, first preset pressure, holding pressure, first preset time, and second preset time.

[0111] Reference Figure 9 As shown, Figure 9 This is a detailed flowchart of a method for preparing mouse feet according to an embodiment of the present invention. The method for preparing mouse feet includes, but is not limited to, steps S810 to S830. Specifically,

[0112] S810: Controls the electromagnetic induction preheating module to heat the raw material flowing through the feed port of the injection molding machine barrel to the hot nozzle to the first preset temperature;

[0113] S820: The electromagnetic induction preheating module controls the temperature of the raw material flowing through the injection molding device's inlet to be the second preset temperature, so that the raw material is in a molten state;

[0114] S830: Adjust the power of the first electromagnetic induction heating module according to the temperature of the first temperature sensor so that the temperature of the front mold is at the third preset temperature, and adjust the power of the second electromagnetic induction heating module according to the temperature of the second temperature sensor so that the temperature of the rear mold is at the fourth preset temperature.

[0115] In some embodiments of the present invention, in order to ensure that the raw material can be fully melted and decomposed, the injection molding machine barrel is provided with a feed port and a hot nozzle. An electromagnetic induction preheating module is provided at the injection molding machine barrel. The temperature of the raw material flowing through the injection molding machine barrel is controlled by the electromagnetic induction preheating module. Specifically, the temperature of the raw material flowing through the feed port to the hot nozzle of the injection molding machine barrel is heated to 400°C to 420°C. The electromagnetic induction preheating module is controlled to keep the temperature of the raw material flowing through the injection inlet of the injection device at 420°C to 430°C so that the raw material is in a molten state. The power of the first electromagnetic induction heating module is adjusted according to the temperature of the first temperature sensor. By adjusting the power of the first electromagnetic induction heating module, the temperature of the front mold is kept at 150°C to 200°C. The power of the second electromagnetic induction heating module is adjusted according to the temperature of the second temperature sensor. By adjusting the power of the second electromagnetic induction heating module, the temperature of the rear mold is kept at 150°C to 200°C.

[0116] By adopting segmented temperature control for the injection molding machine barrel, the injection device's sprue, and the front and rear molds, the raw material can be fully melted and decomposed. At the same time, it can fully fill every corner of the molding cavity, avoiding defects such as material shortage, thus improving injection molding efficiency and mouse foot sticker quality.

[0117] It should be noted that in the embodiments of the present invention, the first preset temperature is 400℃ to 420℃, the second preset temperature is 420℃ to 430℃, the third preset temperature is 150℃ to 200℃, and the fourth preset temperature is 150℃ to 200℃. By setting the temperature control parameters to the above-mentioned preferred parameters, the interaction of these parameters allows the raw material to fully melt and avoid decomposition, while also ensuring that all corners of the molding cavity are fully filled, thereby improving injection molding efficiency and the quality of the mouse feet. Those skilled in the art can set the values ​​of the first, second, third, and fourth preset temperatures according to actual conditions. The embodiments of this application do not limit the values ​​of the first, second, third, and fourth preset temperatures.

[0118] In summary, the mouse feet manufacturing system utilizes a temperature control technology that combines multiple temperature sensors in the mold assembly with an electromagnetic heating module to ensure uniform temperature during the molding process, improving flatness. The injection molding process, combining electromagnetic induction preheating of the injection molding machine barrel with multi-stage injection speed control, enhances injection efficiency and mouse feet quality, reducing internal defects. Furthermore, the use of high-precision fixtures and a vision positioning system, along with novel hot-melt pressure-sensitive adhesives and specially treated release films, ensures precise adhesive bonding, preventing glue overflow and contamination.

[0119] By optimizing the mold design and injection molding process, the flatness of the mouse feet can reach a precision of 0.02mm or even higher, effectively solving the problem of uneven mouse feet affecting mouse positioning accuracy. This results in more precise mouse pointer positioning, reduced frame drops and pointer malfunctions, and an improved user experience. In gaming scenarios, players can control their character's movement more accurately; in office scenarios, users performing graphic design, document editing, and other operations can reduce misoperations and improve work efficiency. Improved adhesive bonding technology prevents glue overflow, reduces dust accumulation on the mouse feet edges, and ensures a neat appearance. Simultaneously, the new adhesive and specially treated release film enhance the bonding strength between the adhesive and the mouse feet, increasing stability and durability, extending the lifespan of the mouse feet, and reducing the frequency of replacements and operating costs for users.

[0120] The above description is merely a preferred embodiment of the present invention. The present invention is not limited to the above-described embodiments. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this disclosure, as long as they achieve the same technical effects, should be included within the scope of protection of this disclosure and fall under the protection scope of the present invention. Within the protection scope of the present invention, the technical solutions and / or implementation methods can have various modifications and variations.

Claims

1. A system for preparing mouse feet, characterized in that, include: The injection molding device includes an injection molding machine barrel, a glue inlet, a molding cavity, and an electromagnetic induction preheating module. The glue inlet is connected to the outlet of the injection molding machine barrel and communicates with the molding cavity. The electromagnetic induction preheating module is installed on the injection molding machine barrel. A mold assembly includes a front mold and a rear mold. The front mold is disposed at the top of the molding cavity and is equipped with a first temperature sensor and a first electromagnetic induction heating module. The rear mold is disposed at the bottom of the molding cavity and is equipped with a second temperature sensor and a second electromagnetic induction heating module. The demolding device includes a first state and a second state, wherein the first state is in which the ejector pin and the ejector point are connected, and the second state is in which the ejector pin and the ejector point are separated. An adhesive bonding device includes an adhesive release film, a fixture, and a vision positioning system. The adhesive release film includes an adhesive backing. The vision positioning system adjusts the position of the fixture by recognizing preset positioning marks on the fixture, mouse feet, and edge features of the adhesive backing, so that the adhesive backing adheres to the mouse feet.

2. The mouse feet preparation system according to claim 1, characterized in that, The adhesive bonding device also includes an infrared heating device, which is disposed at the bottom of the adhesive release film.

3. The mouse feet preparation system according to claim 1, characterized in that, The fixture includes an upper fixture and a lower fixture, and the positioning marks preset on the fixture include a positioning groove provided on the upper fixture and a positioning post provided on the lower fixture.

4. The mouse feet preparation system according to claim 1, characterized in that, The adhesive release film also includes a release film, the surface of which is provided with a layer of micro-nano-scale release agent.

5. The mouse feet preparation system according to claim 1, characterized in that, The front mold is provided with a first resistance heating element, and the rear mold is provided with a second resistance heating element.

6. The mouse feet preparation system according to claim 1, characterized in that, It also includes a first heat insulation plate and a second heat insulation plate, wherein the first heat insulation plate is disposed between the front mold and the machine base, and the second heat insulation plate is disposed between the rear mold and the machine base.

7. A method for preparing mouse feet, characterized in that, The method includes: Cleaning the injection molding unit; The raw material is poured into the injection molding machine barrel of the feeding device, and the power of the electromagnetic induction preheating module of the injection molding machine barrel is controlled so that the raw material flowing through the outlet of the injection molding machine barrel flows into the inlet in a molten state and is injected into the molding cavity. Control the injection molding process parameters of the raw material in the molding cavity; The power of the first electromagnetic induction heating module is adjusted according to the temperature of the first temperature sensor, and the power of the second electromagnetic induction heating module is adjusted according to the temperature of the second temperature sensor. The ejector pin is connected to the ejection point and demolds the mouse feet from the molding cavity; Adjust the position of the fixture according to the recognition results of the visual positioning system so that the adhesive backing is attached to the mouse feet.

8. The method for preparing mouse feet according to claim 7, characterized in that, Also includes: The adhesive is locally heated using an infrared heating device to raise its temperature to a preset bonding temperature to achieve optimal adhesion.

9. The method for preparing the mouse feet according to claim 7, characterized in that, The injection molding process parameters for controlling the raw material within the molding cavity include: The injection speed of the raw material into the molding cavity is controlled to be a first preset speed; The injection pressure of the raw material in the molding cavity is controlled to a first preset pressure; The holding pressure of the raw material in the molding cavity is controlled to be 60% to 80% of the injection pressure, and the holding time is a first preset time; The cooling time of the raw material in the molding cavity is controlled to be a second preset time.

10. The method for preparing mouse feet according to claim 7, characterized in that, The method further includes: The electromagnetic induction preheating module controls the temperature of the raw material flowing through the feed port of the injection molding machine barrel to the hot nozzle to the first preset temperature; The electromagnetic induction preheating module controls the temperature of the raw material flowing through the injection molding device's inlet to be a second preset temperature, so that the raw material is in a molten state; The power of the first electromagnetic induction heating module is adjusted according to the temperature of the first temperature sensor so that the temperature of the front mold is at the third preset temperature, and the power of the second electromagnetic induction heating module is adjusted according to the temperature of the second temperature sensor so that the temperature of the rear mold (220) is at the fourth preset temperature.

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