Laser emission sensor and lidar system

Abstract

The application relates to the technical field of laser radars, and discloses a laser emission sensor and a laser radar system, the laser emission sensor comprising: a substrate, the substrate comprising a first wiring layer, an insulating layer and a second wiring layer; a driving module and a plurality of light-emitting modules are arranged on the first wiring layer, any light-emitting module comprises a plurality of light sources, the light sources are connected with the driving module through corresponding first lead wires, and the first lead wires are arranged on the first wiring layer; second lead wires opposite to the first lead wires are arranged on the second wiring layer; a plurality of connecting blocks are arranged on the insulating layer, the first lead wires are connected in parallel with the opposite second lead wires through at least two connecting blocks, the length of the second lead wires connected in parallel is positively correlated with the length of the first lead wires, the application can make the response time and the light-emitting brightness of different light sources tend to be consistent, improve the restoration degree of the laser radar system to a target object, and can avoid signal crosstalk caused by the increase of the line width of the lead wires and the increase of the size of the laser emission sensor.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser radar, in particular to a laser emission sensor and a laser radar system. BACKGROUND

[0002] The laser radar is a radar system that emits a laser beam to detect the position, speed and form of the target, and then receives these characteristic quantities through a laser receiving sensor and converts them into image information, which is widely used in automatic driving, intelligent robots, surveying and mapping, etc.

[0003] In related technologies, the laser emission sensor of the laser radar includes a substrate, a driving module and a plurality of light emitting modules, the light emitting module includes a plurality of light sources, each light source is connected with the driving module through a lead, and since the distances between different light sources and the driving module are different, the lengths of the leads electrically connecting the light sources and the driving module are also different, so that when the driving module simultaneously outputs a control signal for driving control of the light emitting module, the response times of different light sources are different, and the brightnesses are also different. Generally, the response time of the light emitting diode corresponding to the relatively long lead is longer, and the brightness is also lower, so that the position deviation and chrominance difference between the detection results of different light emitting diodes occur, thereby affecting the detection performance of the laser radar. Further, the scanning detection result of the laser radar system is insufficient for restoring the real target object. SUMMARY

[0004] The present application provides a laser emission sensor and a laser radar system to solve the technical problem of insufficient restoration of the scanning detection result of the laser radar system to the real target object.

[0005] In a first aspect, the present application provides a laser emission sensor applied to a laser radar system, comprising:

[0006] The substrate includes a first wiring layer, an insulating layer and a second wiring layer arranged in sequence along the thickness direction of the substrate;

[0007] The first wiring layer is provided with a driving module and a plurality of light emitting modules, any light emitting module includes a plurality of light sources, the light sources are connected with the driving module through corresponding first leads, and the first leads are arranged on the first wiring layer;

[0008] The second wiring layer is provided with a second lead opposite to the first lead;

[0009] The insulating layer is provided with a plurality of connecting blocks penetrating the insulating layer along the thickness direction of the substrate, the first lead is connected in parallel with the opposite second lead through at least two connecting blocks, the length of the second lead connected in parallel is positively correlated with the length of the opposite first lead, so as to reduce the difference in response time of different light sources and the difference in light emitting brightness of different light sources.

[0010] The laser emission sensor of the present application adjusts the resistance of the lead wires between the light sources and the driving module by the second lead wires arranged on the second wiring layer, the length of the second lead wires connected in parallel and the length of the opposite first lead wires are positively correlated, so that the resistance of the lead wires connecting the individual power sources to the driving module tends to be consistent, when the driving module drives and controls the light emitting module, the response time and the light emitting brightness of the different light sources tend to be consistent, the projection on the target object will not have detection deviation, the position between the lines of the movement track of the detection points has no deviation, the color degree of the point cloud composed is accurate, the overall detection result has high restoration degree to the target object, and problems such as signal crosstalk caused by the increase of the line width of the lead wires and the increase of the size of the laser emission sensor can be avoided.

[0011] In an optional embodiment, the number of the connecting blocks connected between the first lead wire and the opposite second lead wire is positively correlated with the length of the first lead wire.

[0012] In this way, the number of the connecting blocks assists in adjusting the resistance of the lead wires, the number of the connecting blocks increases, the resistance of the lead wires decreases, and the resistance of the lead wires connecting the individual power sources to the driving module tends to be consistent.

[0013] In an optional embodiment, the width of the connecting block connected between the first lead wire and the opposite second lead wire is positively correlated with the length of the first lead wire, wherein the width direction of the connecting block is parallel to the extension direction of the connected first lead wire at the current position.

[0014] In this way, the width of the connecting block assists in adjusting the resistance of the lead wires, the width of the connecting block increases, the resistance of the lead wires decreases, and the resistance of the lead wires connecting the individual power sources to the driving module tends to be consistent.

[0015] In an optional embodiment, the length of the second lead wire is positively correlated with the length of the opposite first lead wire, and any first lead wire is connected in parallel with the opposite second lead wire through two connecting blocks, and the two connecting blocks are arranged at the two ends of the second lead wire respectively.

[0016] In this way, the two connecting blocks are arranged at the two ends of the second lead wire respectively, which connects the second lead wire to the first lead wire, and fully utilizes the second lead wire of the second wiring layer.

[0017] In an optional embodiment, the first lead wire comprises a light source connecting segment, a position adjusting segment and a driving connecting segment, any light source is connected to different pins of the driving module through the light source connecting segment, the position adjusting segment and the driving connecting segment of the corresponding first lead wire in sequence, any driving connecting segment is perpendicular to the length direction of the driving module, the position adjusting segment is perpendicular to the driving connecting segment, and the light source connecting segment is parallel to the driving connecting segment.

[0018] In the mode, the lead arrangement can be more regular and orderly, the cross and interference between the leads can be reduced, the wiring difficulty can be reduced, the utilization rate of the substrate can be improved, and the stable transmission of the signal is also beneficial.

[0019] In an optional implementation, the centers of the light sources are located on the same straight line.

[0020] In the mode, by setting the centers of the light sources on the same straight line, the target object can be conveniently scanned by using the light sources, and the detection accuracy and resolution are improved.

[0021] In an optional implementation, the light source is a lamp bead.

[0022] In the mode, the lamp bead is used as the light source, the production cost can be reduced under the premise of ensuring the performance of the laser emission sensor, and subsequent maintenance and replacement are also facilitated.

[0023] In an optional implementation, the substrate further includes a base layer, and the base layer is arranged on the side close to the second wiring layer.

[0024] In the mode, the overall strength of the substrate can be increased by the base layer.

[0025] In a second aspect, the present application provides a laser radar system, comprising the laser emission sensor according to any one of the first aspect of the present application.

[0026] In an optional implementation, the laser radar system further includes a galvanometer, a laser receiving sensor and an image processor, the galvanometer is arranged at the light beam exit end of the laser emission sensor, and is used for irradiating the exit light beam on the target object after scanning along a single line or a double line, the laser receiving sensor generates an electric signal based on the light beam reflected by the target object, and sends the electric signal to the image processor, and the image processor generates image information based on the electric signal. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed in the following specific embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0028] Figure 1 is a structural schematic diagram of the laser emission sensor in the related art;

[0029] Figure 2 is Figure 1 is a single line scanning detection schematic diagram of the laser emission sensor shown in the figure;

[0030] Figure 3 Fig. 2 is a schematic diagram of a double-line scanning detection of a laser emitting sensor according to an embodiment of the present application; Figure 1

[0031] Fig. 3 is a sectional view of a first laser emitting sensor according to an embodiment of the present application; Figure 4

[0032] Fig. 4 is a top view of a first wiring layer according to an embodiment of the present application; Figure 5

[0033] Fig. 5 is a top view of a second wiring layer according to an embodiment of the present application; Figure 6

[0034] Fig. 6 is a schematic diagram of a single-line scanning detection of a laser emitting sensor according to an embodiment of the present application; Figure 7

[0035] Fig. 7 is a schematic diagram of a double-line scanning detection of a laser emitting sensor according to an embodiment of the present application; Figure 8

[0036] Fig. 8 is a sectional view of a second laser emitting sensor according to an embodiment of the present application; Figure 9

[0037] Fig. 9 is a schematic diagram of a laser radar system according to an embodiment of the present application. Figure 10 BRIEF DESCRIPTION OF DRAWINGS

[0038] 100, substrate; 101, base layer; 102, first wiring layer; 103, insulating layer; 104, second wiring layer; 1031, connecting block; 110, light emitting module; 1101, light source; 1101', projection; 1102, lead wire; 11021, first lead wire; 11022, second lead wire; 200, driving module; 10, laser emitting sensor; 20, galvanometer; 30, laser receiving sensor; 40, image processor.

[0039] DETAILED DESCRIPTION

[0040] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0041] ​It should be noted that the terms "first", "second" are used only for descriptive purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. The terms "mount", "connect", "connection" should be interpreted broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal connection of two elements. The terms "parallel", "vertical", "equal" include the described situation and the approximate situation similar to the described situation, the approximate situation is within the acceptable deviation range, which is determined by the ordinary skilled person in the art considering the measurement being discussed and the error related to the measurement of specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be within 5°, for example; "vertical" includes absolute vertical and approximate vertical, and the acceptable deviation range of approximate vertical can also be within 5°, for example. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be that the difference between the two equalities is less than or equal to 5% of either one, for example. The specific meaning of the above terms in the present application can be understood in specific circumstances by the ordinary skilled person in the art.

[0042] As shown in the related art, the laser emission sensor 10 includes a substrate 100, a driving module 200 and a plurality of light emitting modules 110, the light emitting modules 110 are arranged on the substrate 100 and include a plurality of light sources 1101, and the light emitting modules 110 are electrically connected to the driving module 200 through lead wires 1102. Figure 1 Due to the different distances between different light sources 1101 and the driving module 200, the lengths of the lead wires 1102 used to electrically connect the light sources 1101 and the driving module 200 are also different, for example Figure 1 The lead wire 1102a is obviously longer than the lead wire 1102b, resulting in that the response times of different light sources 1101 are different when the driving module 200 drives and controls the light emitting modules 110, and the brightnesses are also different. Generally, the response time of the light source 1101 corresponding to the relatively longer lead wire 1102 is longer, and the brightness is also lower.

[0043] Figure 2 And Figure 3The laser emission sensor 10 of the laser radar system respectively carries out single-line scanning detection and double-line scanning detection on the target object. The projection 1101' of each light source 1101 of the light emitting module 110 on the target object carries out single-line scanning detection in the X direction or double-line scanning detection in the X direction and the Y direction, for example, the projections of the light source 1101a and the light source 1101b are 1101a' and 1101b' respectively, and then the scanning detection result is fed back to the laser receiving sensor 30 (not shown in the figure) of the laser radar system. In the prior art, the response time of different light sources 1101 is earlier or later, and the brightness also has a difference. The position offset and chrominance difference between the detection results of different light sources 1101 are caused, thereby affecting the detection performance of the laser radar. Furthermore, the restoration degree of the current scanning detection result of the laser radar system to the real target object is insufficient.

[0044] In order to improve the accuracy and pixels of the laser radar detection scanning, the line number of the current laser radar is also increasing, from 16 lines, 32 lines, 64 lines to 128 lines and 192 lines, and in the future it may even develop to more than 1000 lines. With the increase of the line number, the number of light sources 1101 and lead wires 1102 also increases, which causes the length difference of the lead wires 1102 at different positions to be larger, and the scanning detection result offset and restoration difference between different light sources 1101 to be larger.

[0045] In a related improvement scheme, the width of the lead wire 1102 changes with the change of the length, and the longer the length of the lead wire 1102, the wider the width of the lead wire 1102. By adjusting the width of different lead wires 1102, the resistance of all lead wires 1102 tends to be consistent, thereby effectively solving the technical problem of large resistance difference between lead wires 1102 of different lengths in the laser emission sensor 10. However, the longer the length of the lead wire 1102, the wider the width of the lead wire 1102, which requires widening the line width design of the lead wire 1102. The increase of the lead wire width will also cause the distance between the lead wires to be closer. The closer the distance between the lead wires, the more obvious the crosstalk. With the increase of the line spacing, the signal crosstalk will be weakened. In addition, the signal crosstalk is also related to the line width of the lead wire. The larger the line width of the lead wire, the more obvious the signal crosstalk. Generally, when the spacing of the lead wires is more than three times the line width of the lead wire, the crosstalk can be basically ignored. Therefore, due to the increase of the line width of the lead wire 1102, the signal crosstalk problem between adjacent lead wires will be more likely to occur. In order to reduce the signal crosstalk between the lead wires, the spacing between the lead wires needs to be increased, which will further cause the size of the laser emission sensor 10 to be larger.

[0046] Therefore, the embodiments of the present application provide a laser emission sensor 10 and a laser radar system. In order for the person skilled in the art to better understand the present application scheme, the present application will be further described in detail in conjunction with the drawings and specific embodiments.

[0047] According to an embodiment of the present application, a laser emission sensor 10 is provided, which is applied to a laser radar system. As shown in Figure 4 、 Figure 5 and Figure 6 , the laser emission sensor 10 comprises:

[0048] a substrate 100, which comprises a first wiring layer 102, an insulating layer 103 and a second wiring layer 104 arranged in sequence along the thickness direction of the substrate 100;

[0049] a driving module 200 and a plurality of light-emitting modules 110 are arranged on the first wiring layer 102, and any light-emitting module 110 comprises a plurality of light sources 1101, which are connected to the driving module 200 through corresponding first lead wires 11021 arranged on the first wiring layer 102;

[0050] a second lead wire 11022 opposite to the first lead wire 11021 is arranged on the second wiring layer 104;

[0051] a plurality of connecting blocks 1031 penetrating the insulating layer 103 along the thickness direction of the substrate 100 are arranged on the insulating layer 103, and the first lead wire 11021 is connected in parallel to the opposite second lead wire 11022 through at least two connecting blocks 1031, and the length of the second lead wire 11022 connected in parallel is positively correlated with the length of the opposite first lead wire 11021, so as to reduce the difference in response time of different light sources 1101 and the difference in luminous intensity of different light sources 1101.

[0052] Specifically, the substrate 100 is a physical support platform for carrying components on the laser emission sensor 10, and can specifically adopt a printed circuit board (PCB). The printed circuit board comprises a single-layer printed circuit board, a double-layer printed circuit board or a multi-layer printed circuit board, and the substrate 100 of the embodiment of the present application adopts a double-layer printed circuit board.

[0053] The driving module 200 comprises a single-chip microcomputer and a corresponding driving circuit, and the single-chip microcomputer outputs a driving signal to the driving circuit to control the opening and closing of each light source 1101 through the driving circuit.

[0054] A plurality of light-emitting modules 110 are arranged, and each light-emitting module 110 is provided with a plurality of light sources 1101. The light source 1101 is a signal emitter of the laser radar system, and can adopt a 905nm semiconductor laser, a 1550nm optical fiber laser, a lamp bead and the like.

[0055] The number of the light-emitting module 110 and the light source 1101 can be set according to actual conditions. In an example, the light-emitting module 110 is arranged at intervals on the substrate 100, and five light-emitting modules 110 are arranged on the substrate 100, and each light-emitting module 110 includes 16 light sources 1101.

[0056] The driving module 200 and the light-emitting module 110 are both located on the first wiring layer 102 and are connected by the first lead wire 11021.

[0057] The insulating layer 103 is made of an insulating material, and the first wiring layer 102 and the second wiring layer 104 are isolated by the insulating layer 103, so that the circuit wiring on the first wiring layer 102 and the second wiring layer 104 do not interfere with each other.

[0058] The connecting block 1031 is made of a metal material capable of conducting current, and the connecting block 1031 is mainly used to realize the electrical connection of the first wiring layer 102 and the second wiring layer 104.

[0059] The second lead wire 11022 on the second wiring layer 104 and the first lead wire 11021 on the first wiring layer 102 are arranged opposite to each other, wherein the length of the second lead wire 11022 is shorter than or equal to the length of the corresponding first lead wire 11021, and the second lead wire 11022 is projected onto the first wiring layer 102 along the thickness direction of the substrate 100 and is covered by the corresponding first lead wire 11021.

[0060] Because the distribution positions of different light sources 1101 are different, the distances between the light sources 1101 and the driving module 200 are different, so the lengths of the first lead wires 11021 are also not completely the same. For example, when the light-emitting module 110 is located at the lower middle part of the substrate 100, and the light sources 1101 are distributed above the substrate 100 and arranged in the horizontal direction, the length of the first lead wire 11021 between the middle light source 1101 and the driving module 200 is shorter, and the lengths of the first lead wires 11021 between the light sources 1101 on both sides and the driving module 200 are longer.

[0061] For the first lead wires 11021 of different lengths, the longer the length is, the greater the resistance is, which will cause the brightness of different light sources 1101 to be different, causing errors such as color difference or light intensity difference in the detected light signal, and the time for the signal to reach the light source 1101 from the driving module 200 is also longer, which will cause the time for the light source 1101 to output the light beam to be inconsistent, causing time synchronization to be unable to be realized when scanning the target object, causing the position of the scanning result to deviate, and these two factors will affect the restoration degree of the scanning detection result to the real target object.

[0062] The embodiment of the present application sets the connecting blocks 1031 at the two ends or near the two ends of the second lead 11022, and the second lead 11022 and the first lead 11021 are connected in parallel. According to the parallel characteristic, the resistance after parallel connection is smaller than the resistance before parallel connection. The length of the second lead 11022 connected in parallel is positively correlated with the length of the opposite first lead 11021, that is, the longer the first lead 11021, the longer the second lead 11022 connected in parallel, and the more the resistance is reduced, so that the wire resistance between the different light sources 1101 and the driving module 200 tends to be the same.

[0063] As shown in Figure 7 and Figure 8 In the embodiment of the present application, the longer the first lead 11021, the longer the length of the second lead 11022 connected in parallel is set, so that the wire resistance between the different light sources 1101 and the driving module 200 tends to be the same. When single-line scanning detection or double-line scanning detection is performed on the target object, the response time and luminous brightness of the different light sources 1101 tend to be consistent, and the projection 1101' on the target object can accurately represent the position and shape of the target object, without detection deviation, and the restoration degree of the detection result to the target object is high.

[0064] The laser emission sensor 10 of the present application adjusts the resistance of the lead between each light source 1101 and the driving module 200 through the second lead 11022 arranged on the second wiring layer 104. The length of the second lead 11022 connected in parallel is positively correlated with the length of the opposite first lead 11021, so that the resistance of the lead connecting each power source to the driving module 200 tends to be consistent. When the driving module 200 drives and controls the light-emitting module 110, the response time and luminous brightness of the different light sources 1101 tend to be consistent, and the projection on the target object will not have detection deviation, the positions between the lines of the movement track of the detection points are not offset, the color degree of the point cloud composed is accurate, the restoration degree of the overall detection result to the target object is high, and problems such as signal crosstalk caused by increasing the line width of the lead and the increase in the size of the laser emission sensor 10 can be avoided.

[0065] In one embodiment, the length of the second lead 11022 is positively correlated with the length of the opposite first lead 11021, and any first lead 11021 is connected in parallel with the opposite second lead 11022 through two connecting blocks 1031, and the two connecting blocks 1031 are arranged at the two ends of the second lead 11022, respectively.

[0066] Specifically, two connecting blocks 1031 are arranged at two ends of the second lead line 11022 respectively, which connects all the second lead lines 11022 on the second wiring layer 104 to the first lead line 11021, fully utilizes the second lead lines 11022 on the second wiring layer 104, and makes the resistance of the lead lines connecting the power supply to the driving module 200 consistent by increasing the length of the first lead line 11021 and the second lead line 11022.

[0067] In one embodiment, the number of the connecting blocks 1031 connecting the first lead line 11021 and the second lead line 11022 is positively correlated with the length of the first lead line 11021.

[0068] Specifically, the connecting block 1031 is provided with a plurality of connecting blocks 1031 respectively connecting the first lead line 11021 and the corresponding second lead line 11022.

[0069] The connecting block 1031 is essentially a wire with a certain thickness. When the connecting block 1031 is arranged between the first lead line 11021 and the second lead line 11022, the thickness of the wire at the position of the connecting block 1031 increases, so the resistance of the wire at this position decreases, and the signal transmission delay decreases. The more the number of the connecting blocks 1031 arranged, the more obvious the decrease of the resistance and the signal transmission delay.

[0070] The number of the connecting blocks 1031 assists in adjusting the resistance of the lead line. The number of the connecting blocks 1031 connecting the first lead line 11021 and the second lead line 11022 is positively correlated with the length of the first lead line 11021, that is, the longer the first lead line 11021, the more the number of the connecting blocks 1031, the smaller the resistance of the lead line, which further makes the resistance of the lead lines connecting the power supply to the driving module 200 consistent, and the luminous brightness and response time of the light source 1101 consistent.

[0071] In one embodiment, the width of the connecting block 1031 connecting the first lead line 11021 and the second lead line 11022 is positively correlated with the length of the first lead line 11021, wherein the width direction of the connecting block 1031 is parallel to the extension direction of the first lead line 11021 at the current position.

[0072] Specifically, the longer the width of the connecting block 1031 is, the longer the portion of the conductor formed by the first lead 11021, the connecting block 1031 and the second lead 11022 is, the greater the degree of reduction of the resistance of the overall conductor is, and the signal transmission time is shortened, therefore, by positively correlating the width of the connecting block 1031 connecting between the first lead 11021 and the opposite second lead 11022 and the length of the first lead 11021, that is, the longer the length of the first lead 11021 is, the wider the width of the connecting block 1031 is, the resistance of the longer lead can be further reduced, and the resistance of the leads connecting the respective power sources to the driving module 200 tends to be consistent.

[0073] In an embodiment, the first lead 11021 comprises a light source 1101 connecting segment, a position adjusting segment and a driving connecting segment, any light source 1101 is connected to different pins of the driving module 200 through the light source 1101 connecting segment, the position adjusting segment and the driving connecting segment of the corresponding first lead 11021 in sequence, any driving connecting segment is perpendicular to the length direction of the driving module 200, the position adjusting segment is perpendicular to the driving connecting segment, and the light source 1101 connecting segment is parallel to the driving connecting segment.

[0074] Specifically, by arranging the first leads 11021 as parallel as possible at different positions, the arrangement of the first leads 11021 can be more regular and orderly, the intersection and interference between the first leads 11021 can be reduced, the wiring difficulty can be reduced, the utilization rate of the first wiring layer 102 can be improved, and at the same time, the stable transmission of signals is also conducive.

[0075] It should be understood that the second lead 11022 and the first lead 11021 are arranged correspondingly, and the difference is that the length of the second lead 11022 is less than the length of the corresponding first lead 11021.

[0076] In an embodiment, the centers of any light source 1101 are located on the same straight line.

[0077] Specifically, by setting the centers of the light sources 1101 on the same straight line, a row of light sources 1101 can perform single-line scanning detection on the target object, which facilitates scanning the target object by the light sources 1101 and improves the accuracy and resolution of detection.

[0078] Further, the light source 1101 adopts a lamp bead, such as various types of LED lamp beads, and adopting a lamp bead as the light source 1101 can reduce the production cost on the premise of ensuring the performance of the laser emission sensor 10, and is also convenient for subsequent maintenance and replacement.

[0079] In an embodiment, as Figure 9As shown, the substrate 100 also includes a base layer 101 disposed on the side close to the second wiring layer 104. The overall strength of the substrate 100 can be increased by the base layer 101.

[0080] According to an embodiment of the present application, a laser radar system is also provided, which includes the laser emitting sensor 10 as described above.

[0081] In particular, as Figure 10 As shown, the laser radar system includes the laser emitting sensor 10, the galvanometer 20, the laser receiving sensor 30, and the image processor 40. The galvanometer 20 is disposed at the beam exit end of the laser emitting sensor 10, and is used to irradiate the outgoing beam onto the target object after scanning along a single line or a double line. The laser receiving sensor 30 generates an electrical signal based on the light beam reflected back by the target object, and sends the electrical signal to the image processor 40. The image processor 40 generates image information based on the electrical signal.

[0082] The laser radar system can be used in scenarios such as autonomous driving, intelligent robots, and surveying and mapping.

[0083] The galvanometer 20 is a kind of mirror that can vibrate quickly, and is usually made of micro-electro-mechanical system technology. It changes the propagation direction of the outgoing beam by applying an alternating voltage on the mirror surface, so that the mirror surface produces periodic vibration. In the laser radar system, the galvanometer 20 is disposed at the beam exit end of the laser emitting sensor 10, and is used to irradiate the outgoing beam onto the target object after scanning along a single line or a double line. By quickly changing the propagation direction of the light beam, the galvanometer 20 can make the laser radar system scan a large area of the target region in a short time, so as to obtain rich environmental information.

[0084] The laser receiving sensor 30 generates an electrical signal based on the light beam reflected back by the target object. For example, in the autonomous driving scenario, when the laser beam emitted by the laser emitting sensor 10 is irradiated onto the target object such as a vehicle or a pedestrian in front and reflected back, the laser receiving sensor 30 receives these reflected light beams and converts them into electrical signals, providing raw data for subsequent image processing and target recognition.

[0085] The image processor 40 is the core processing component of the laser radar system, which receives the electrical signal from the laser receiving sensor 30, and converts these electrical signals into image information through a series of algorithms and calculations.

[0086] Although the embodiments of the present application are described in conjunction with the accompanying drawings, various modifications and changes can be made by those skilled in the art without departing from the spirit and scope of the present application, and such modifications and changes fall within the scope defined by the appended claims.

Claims

1. A laser emission sensor, applied in a lidar system, characterized in that, include: A substrate, the substrate comprising a first wiring layer, an insulating layer and a second wiring layer sequentially disposed along the thickness direction of the substrate; The first wiring layer is provided with a driving module and a plurality of light-emitting modules. Each of the light-emitting modules includes a plurality of light sources. The light sources are connected to the driving module through corresponding first leads. The first leads are provided on the first wiring layer. The second wiring layer is provided with a second lead opposite to the first lead; The insulating layer is provided with a plurality of connecting blocks that penetrate the insulating layer along the thickness direction of the substrate. The first lead is connected in parallel with the opposite second lead through at least two of the connecting blocks. The length of the second lead connected in parallel is positively correlated with the length of the opposite first lead, so as to reduce the difference in response time of different light sources and reduce the difference in luminous brightness of different light sources.

2. The laser emission sensor according to claim 1, characterized in that, The number of connecting blocks between the first lead and the opposite second lead is positively correlated with the length of the first lead.

3. The laser emission sensor according to claim 1, characterized in that, The width of the connecting block connecting the first lead and the opposite second lead is positively correlated with the length of the first lead, wherein the width direction of the connecting block is parallel to the extension direction of the connected first lead at the current position.

4. The laser emission sensor according to claim 1, characterized in that, The length of the second lead is positively correlated with the length of the corresponding first lead, and any first lead is connected in parallel with the corresponding second lead through two connecting blocks, with the two connecting blocks respectively located at both ends of the second lead.

5. The laser emission sensor according to claim 1, characterized in that, The first lead includes a light source connection segment, a position adjustment segment, and a drive connection segment. Each of the light sources is sequentially connected to different pins of the drive module through the corresponding light source connection segment, the position adjustment segment, and the drive connection segment of the first lead. Each drive connection segment is perpendicular to the length direction of the drive module. The position adjustment segment is perpendicular to the drive connection segment, and the light source connection segment is parallel to the drive connection segment.

6. The laser emission sensor according to any one of claims 1 to 5, characterized in that, The centers of all the light sources are located on the same straight line.

7. The laser emission sensor according to claim 1, characterized in that, The light source is an LED chip.

8. The laser emission sensor according to claim 1, characterized in that, The substrate further includes a base layer disposed on a side close to the second wiring layer.

9. A lidar system, characterized in that, Including the laser emission sensor as described in any one of claims 1 to 8.

10. The lidar system according to claim 9, characterized in that, It also includes a galvanometer, a laser receiving sensor, and an image processor. The galvanometer is disposed at the beam emission end of the laser emitting sensor and is used to scan the emitted beam along a single or dual line and then illuminate the target object. The laser receiving sensor generates an electrical signal based on the beam reflected back from the target object and sends the electrical signal to the image processor. The image processor generates image information based on the electrical signal.

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