Terminal structural member manufacturing method, terminal structural member and terminal equipment

Abstract

The invention discloses a manufacturing method of a terminal structural member, the terminal structural member and terminal equipment, and belongs to the technical field of terminal equipment. The method comprises the steps that an antenna via hole is machined in a substrate of a terminal structural member, conductive slurry is injected into the antenna via hole and solidified to form a via hole antenna, and the solidified conductive slurry protrudes out of the outer surface of the substrate; an antenna is arranged on the surface of the substrate; a film layer is processed on the outer surface of the substrate, the film layer comprises at least one polishable covering layer, and the antenna via hole marks are improved by polishing the covering layer. According to the invention, the appearance surface of the terminal structural member is not affected under the condition that GPS, Bluetooth and LTE signals can be improved by arranging the via hole antenna.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and in particular to a method for manufacturing a terminal structural component, the terminal structural component, and a terminal device. Background Technology

[0002] The primary surface of a product refers to its main exterior surface, which is the surface that directly contacts or is presented to the user, affecting the user's visual experience and the overall aesthetics of the product.

[0003] The outer surface of terminal structural components (such as the outer frame of watches and tablets) is the primary appearance surface. While machining through-hole antennas onto the plastic material of these components and then covering it with multiple layers of paint can improve GPS, Bluetooth, and LTE signal strength, it leaves hole marks on the surface, affecting the overall appearance of the terminal structural component. Therefore, how to machine through-hole antennas onto terminal structural components without compromising their appearance has always been a challenging problem in the industry. Summary of the Invention

[0004] This application provides a method for manufacturing a terminal structural component, a terminal structural component, and a terminal device, to solve the technical problem in the prior art where processing antenna vias on terminal structural components affects the appearance of the terminal structural components.

[0005] The technical solution is as follows:

[0006] The first aspect of this application provides a method for manufacturing a terminal structural component, comprising the following:

[0007] Antenna vias are fabricated on the substrate of the terminal structure component. Conductive paste is injected into the antenna vias and solidified to form a via antenna. The solidified conductive paste protrudes from the outer surface of the substrate.

[0008] An antenna is mounted on the surface of the substrate;

[0009] A film layer is processed on the outer surface of the substrate, the film layer including at least one grindable masking layer, which is ground to improve the marking of the antenna via.

[0010] When fabricating a via antenna, the antenna protrudes from the outer surface of the substrate. Specifically, the conductive paste solidified within the antenna via protrudes from the substrate's outer surface. During the processing of the film layer on the substrate's outer surface, a polishable masking layer is applied. The protruding conductive paste from the antenna via forms a raised mark on the masking layer. Polishing the masking layer improves this mark. Subsequent application of other coatings on the masking layer avoids interference from the via antenna, thus achieving improved GPS, Bluetooth, and LTE signal strength without affecting the appearance of the terminal's structural components.

[0011] In some implementations, the cured conductive paste is polished before the antenna is printed on the substrate surface.

[0012] After the conductive paste has been cured, the protruding conductive paste on the outer surface of the substrate can be polished first. Polishing at this time can reduce the amount of polishing on the masking layer.

[0013] In some implementations, the conductive paste injected into the antenna via is called a via paste, and the paste used to prepare the substrate surface antenna is called a surface paste; the viscosity of the via paste is less than that of the surface paste, and / or, the solvent content of the via paste is less than that of the surface paste.

[0014] The via slurry has a high viscosity, which helps the liquid via slurry protrude from the outer surface of the substrate without overflowing outwards, so that the via antenna can protrude from the upper surface of the substrate.

[0015] When the through-hole paste is heated and cured, the organic solvent in the conductive paste will evaporate, which will make it difficult for the cured conductive paste to protrude from the outer surface of the substrate. Therefore, it is preferable to reduce the proportion of solvent in the through-hole paste.

[0016] In some implementations, the conductive paste injected into the antenna via is a via paste with a viscosity range of 15,000-25,000 cps.

[0017] This allows the liquid via paste to protrude from the outer surface of the substrate without overflowing outwards, thus facilitating the protrusion of the via antenna from the upper surface of the substrate.

[0018] In some implementations, the conductive paste injected into the antenna via is called via paste, and the solvent content of the via paste ranges from 0-15%.

[0019] To avoid a situation where the liquid silver paste protrudes above the substrate surface while the solidified silver paste remains below the substrate surface when pouring silver paste into the antenna vias, it is preferable to set the solvent content of the via paste to be in the range of 0-15%.

[0020] In some implementations, the conductive paste injected into the antenna via is a via paste, and the curing shrinkage rate of the via paste is less than 1%.

[0021] The via paste has a low curing shrinkage rate, which avoids the situation where the liquid silver paste protrudes from the substrate surface while the cured silver paste is below the substrate surface when the silver paste is poured into the antenna via. Therefore, the via paste is preferably a paste with a low curing shrinkage rate.

[0022] In some implementations, the conductive paste injected into the antenna via is a via paste, and the coefficient of thermal expansion of the via paste is less than 30 × 10⁻⁶. -6 / K.

[0023] During the fabrication of terminal structural components, baking and curing are required during the antenna and film layer fabrication processes, causing thermal expansion of the substrate and paste. The via paste is a paste with a low coefficient of thermal expansion to ensure that the shrinkage ratio of the via paste is close to that of some substrates, avoiding the disadvantage of poor imprinting due to a large difference in the coefficient of thermal expansion between the two substrates.

[0024] In some implementations, the diameter of the antenna via is no greater than 0.15 mm.

[0025] If the diameter of the antenna via is too large, when silver paste is poured into the antenna via, the top surface of the silver paste will be concave if the silver paste does not overflow onto the outer surface of the substrate. When the silver paste in the antenna via is solidified, the solid conductive paste will be concave. At this time, the hole mark cannot be eliminated by polishing the masking layer.

[0026] In some implementations, the area on the substrate where antenna vias need to be processed is called the via area, and the substrate is injection molded with a recess on the inner side of the via area.

[0027] The thickness of the via area is less than the thickness of other areas on the substrate except for the via area, so that the inner side of the via area is concave, thereby reducing the height of the antenna via along the thickness direction of the substrate. This facilitates a single grouting operation for the antenna via and makes it easier to use laser processing for the antenna via.

[0028] In some implementations, the height of the via region along the thickness direction is 0.1 to 0.5 mm.

[0029] The height of the via area along the thickness direction is 0.1 to 0.5 mm, that is, the height of the antenna via along the thickness direction is 0.1 to 0.5 mm, which facilitates the one-time grouting operation of the antenna via and the use of laser processing for the antenna via.

[0030] In some implementations, there is one or more antenna vias; the antenna vias are processed in a planar region of the substrate; and / or, the antenna vias are processed in a curved region of the substrate; and / or, a raised region is formed on the substrate, and the antenna vias are processed on the side of the raised region in the circumferential direction.

[0031] The location of the antenna via on the substrate is not limited, as long as it can be fabricated on the substrate.

[0032] For via antennas mounted on planar or curved surfaces, grinding is required in the area corresponding to the shielding layer. However, for via antennas mounted on oblong surfaces, grinding is unnecessary in the area corresponding to the shielding layer because the oblong surface has minimal impact on the appearance of the terminal component. Furthermore, based on light reflection, oblong surfaces have high diffuse reflectivity, followed by curved surfaces, with planar surfaces exhibiting the lowest diffuse reflectivity. Diffuse reflected light is more dispersed and weaker, while specular reflected light is more concentrated and stronger. Due to the high diffuse reflectivity of oblong surfaces, they appear relatively dark, making it difficult to observe markings on them. Therefore, when a via antenna is mounted on an oblong surface, grinding is unnecessary in the area corresponding to the shielding layer. This improves the efficiency of terminal component fabrication without affecting the appearance of the terminal component.

[0033] In some implementations, the thickness of the antenna printed on the outer surface of the substrate is no more than 16 μm.

[0034] Planar antennas have a certain thickness, and planar antennas set on the outer surface of the substrate will also cause a certain height difference mark on the appearance of the terminal structure. By constraining the height difference, the mark formed on the terminal structure by the printed antenna can be improved.

[0035] In some implementations, the antenna printed on the outer surface of the substrate is called a planar outer antenna, and the angle between any two adjacent sides of the planar outer antenna is a rounded corner.

[0036] By rounding the corners between any two adjacent sides of the outer plane antenna, the ink accumulation at the free end of the antenna can be effectively improved.

[0037] In some implementations, the material of the masking layer includes polyurethane resin or UV resin.

[0038] Polyurethane resin and UV resin are both commonly used coating materials, and by selecting the appropriate polyurethane resin and UV resin, the masking layer can be polished.

[0039] In some implementations, the color-to-base ratio of the masking layer is 1:1 to 1:2.

[0040] The masking layer uses a high pigment-to-binder ratio, which makes the masking layer more polishable.

[0041] In some implementations, the hydroxyl content of the resin in the masking layer is ≥1.0.

[0042] By setting the hydroxyl content of the resin in the masking layer to ≥1.0, the masking layer has better sandability.

[0043] In some implementations, the masking layer includes 2-functional resin and 6-functional resin.

[0044] The 6-functional resin is a high-functionality resin, and the 2-functional resin is a low-functionality resin. The combination of high-functionality and low-functionality resins improves the performance of the resin material, resulting in better sandability of the covering layer.

[0045] In some implementations, the thickness of the masking layer ranges from 5 to 40 μm.

[0046] The thickness of the cover layer should be set appropriately so that it can be polished without affecting the film thickness on the terminal structural components.

[0047] In some implementations, there are two or more masking layers, with one masking layer applied over another, or a transition layer applied over one masking layer and then another masking layer applied over the transition layer.

[0048] Because the cover layer is designed to be sanded and has a relatively high hardness, its adhesion is relatively poor. To improve the stability of the film structure on the terminal component, a transition layer is placed between the two cover layers. The transition layer improves the stability of the connection between the two cover layers.

[0049] Of course, a transition layer may not be required between the two covering layers to improve the efficiency of fabricating the terminal structure.

[0050] In some implementations, when there is only one masking layer, a transition layer is coated on the side of the masking layer facing away from the substrate; when there are two or more masking layers, the masking layer furthest from the substrate along the thickness direction of the substrate is called the upper masking layer, and a transition layer is coated on the side of the upper masking layer facing away from the substrate.

[0051] By setting a transition layer, the stability of the membrane structure on the terminal structural component is improved.

[0052] In some implementations, an adhesive underlayer is first coated on the outer surface of the substrate, and then a masking layer is coated; a surface treatment agent is coated on the outer surface of the substrate as an adhesive underlayer; or a primer is coated on the outer surface of the substrate as an adhesive underlayer; or a surface treatment agent layer and a primer layer are coated on the outer surface of the substrate as an adhesive underlayer.

[0053] Because the cover layer is designed to be sandable and has a relatively high hardness, its adhesion is relatively poor. To ensure the stability of the film structure on the terminal device, an adhesive underlayer is first coated on the outer surface of the substrate, and then the cover layer is coated.

[0054] In some implementations, the substrate is a two-color injection molded substrate with a transparent material area formed on the substrate; the film layer includes an adhesive underlayer, a topcoat layer and a transparent treatment layer, the adhesive underlayer is the innermost layer of the film layer, the topcoat layer is the outermost layer of the film layer, the inner side of the topcoat layer is connected to the transparent treatment layer, and laser engraving is performed on the coating between the transparent treatment layer and the adhesive underlayer, and the laser engraved area corresponds to the transparent material area.

[0055] The second aspect of this application provides a terminal structural component, which is manufactured using any of the manufacturing methods provided by the technical solution. The terminal structural component includes a substrate, a planar antenna, and a film layer. One or more via antennas are disposed on the substrate, and planar antennas are printed on the inner and outer surfaces of the substrate. The film layer is disposed on the outer surface side of the substrate and includes one or more grindable cover layers.

[0056] Since the terminal structural components are prepared using the above-described technical solution, they possess at least all the beneficial effects of the manufacturing method, which will not be elaborated further here.

[0057] In some implementations, the film layer includes an indium-plated layer.

[0058] By adding an indium plating layer, corrosion resistance and appearance can be improved.

[0059] In some implementations, the surface of the terminal structural component is matte or glossy.

[0060] The outermost layer of the terminal structural component is a UV topcoat layer. By setting the appearance surface to be matte or glossy, the aesthetics of the terminal structural component are improved.

[0061] A third aspect of this application provides a terminal device, including a terminal structural component as provided in any of the above technical solutions.

[0062] Since the terminal device includes the aforementioned terminal structural components, it possesses at least all the beneficial effects of the terminal structural components, which will not be elaborated further here. Attached Figure Description

[0063] Figure 1 This is a front view diagram of an existing watch;

[0064] Figure 2 This is a rear view diagram of an existing watch;

[0065] Figure 3 yes Figure 1 A schematic cross-sectional view of the watch case along line AA;

[0066] Figure 4 This is a rear view illustration of another type of watch;

[0067] Figure 5 It is a simplified cross-sectional view of the existing terminal structure. Figure 1 ;

[0068] Figure 6 It is a simplified cross-sectional view of the existing terminal structure. Figure 2 ;

[0069] Figure 7 It is a simplified cross-sectional view of the existing terminal structure. Figure 3 ;

[0070] Figure 8 It is a simplified cross-sectional view of the existing terminal structure. Figure 4 ;

[0071] Figure 9 It is a simplified cross-sectional view of the existing terminal structure. Figure 5 ;

[0072] Figure 10 This is a cross-sectional schematic diagram of existing terminal structural component materials;

[0073] Figure 11 This is a cross-sectional schematic diagram of a via antenna disposed on a substrate according to an embodiment of this application;

[0074] Figure 12 This is a cross-sectional schematic diagram of a substrate with a cover layer provided in an embodiment of this application (the cover layer is not polished);

[0075] Figure 13 This is a cross-sectional schematic diagram of a substrate with a cover layer provided in an embodiment of this application (the cover layer has been polished);

[0076] Figure 14 This is a cross-sectional schematic diagram of the substrate provided in the embodiments of this application;

[0077] Figure 15 This is a front view schematic diagram of a circular substrate provided in an embodiment of this application;

[0078] Figure 16 yes Figure 15 Schematic diagram of the cross section at point BB;

[0079] Figure 17 This is a front view schematic diagram of the square substrate provided in an embodiment of this application;

[0080] Figure 18 This is a front view schematic diagram of the circular substrate of the printed PDS antenna provided in the embodiments of this application;

[0081] Figure 19 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 1 ;

[0082] Figure 20 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 2 ;

[0083] Figure 21 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 3 ;

[0084] Figure 22 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 4 ;

[0085] Figure 23 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 5 ;

[0086] Figure 24 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 6 ;

[0087] Figure 25 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 7 ;

[0088] Figure 26 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 8 ;

[0089] Figure 27 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 9 ;

[0090] Figure 28 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 10 ;

[0091] Figure 29 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 10 one;

[0092] Figure 30 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 10 two;

[0093] Figure 31 This is a cross-sectional view of the terminal structure provided in the embodiments of this application. Figure 10 three.

[0094] The meanings of the various symbols in the attached icons are as follows:

[0095] 1. Watch;

[0096] 11. Housing; 12. Display assembly; 13. Light-transmitting part;

[0097] 111 - Front shell; 112 - Rear shell; 113 - Transparent area;

[0098] 2. Terminal structural components;

[0099] 21. Material; 22. Substrate; 23. Film layer; 24. PDS antenna; 25. Via antenna;

[0100] 211. PC transparent material area;

[0101] 221. Antenna via; 222. Via area; 223. Curved surface; 224. Plane; 225. Waist-shaped surface; 226. Transparent material area;

[0102] 231 - Treatment layer; 232 - PU color paint layer; 233 - UV topcoat layer; 234 - PU primer layer; 235 - UV primer layer; 236 - Indium plating layer; 237 - UV intermediate coat layer; 238 - PU overcoat layer; 239 - Masking layer; 2310 - Adhesive undercoat; 2311 - Transition layer; 2312 - Transparent treatment layer; 2313 - Laser engraving area;

[0103] 241. Planar outer-side antenna;

[0104] 2411, Rounded corners; 2412, Hollowed-out area;

[0105] 2391, PU covering layer; 2392, UV covering layer. Detailed Implementation

[0106] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings. The embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0107] In the description of this application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inner", "outer", "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0108] To facilitate a clear description of the technical solutions of this application, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" do not necessarily imply that they are different.

[0109] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0110] In this application, "and / or" is merely a way of describing the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0111] It should be noted that, in this application, the words "in one embodiment," "exemplarily," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "in one embodiment," "exemplarily," or "for example" should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of words such as "in one embodiment," "exemplarily," and "for example" is intended to present the relevant concepts in a specific manner.

[0112] See Figures 1-3 , Figure 1 This is a front view diagram of an existing watch. Figure 2 This is a rear view illustration of an existing watch. Figure 3 yes Figure 1 A schematic cross-sectional view of the watch case along line AA; Figure 5 This is a rear view illustration of another type of watch.

[0113] The outer surface of a terminal structural component is its appearance surface. For example, when the terminal device is a watch, the terminal structural component is the watch case; when the terminal device is a mobile phone, the terminal structural component can be the mobile phone's mid-frame or back cover; when the terminal device is an electronic device such as a computer (PC) or tablet computer, the terminal structural component can be the computer or tablet computer's casing.

[0114] See Figures 1-4 Taking watch 1 as an example, the terminal device includes a casing 11, a circuit board, a display module 12, a battery, and a motherboard. The casing 11 includes a front shell 111 and a back shell 112. The display module 12 is disposed on the front shell 111, and the battery and motherboard are disposed within the cavity formed by the front shell 111 and the back shell 112. The front shell 111 and the back shell 112 of watch 1 are terminal structural components.

[0115] See Figures 1-3 The back cover 112 has a perforated hole, and a light-transmitting part 13 is installed at the perforated hole of the back cover 112. The material of the light-transmitting part 13 can be light-transmitting glass.

[0116] Watch 1 includes a vital signs sensor housed within the casing 11. The vital signs sensor includes a light emitting element and a light receiving element. The light emitting element emits light towards the user's skin through the light-transmitting portion 13. A portion of the light is absorbed by the user's skin, and another portion is reflected. The reflected portion of the light is received by the light receiving element. The vital signs sensor may be a PPG (PhotoPlethysmoGraph) sensor.

[0117] Terminal structural component 2 typically includes a substrate 21 and a film layer 23 sprayed onto the substrate. Additionally, to improve the radio frequency signal of the terminal device, a PDS antenna is printed on the substrate, and the PDS antenna is connected to the PCB circuit board of the terminal device. The basic function of an antenna is to radiate and receive radio waves; during transmission, it converts high-frequency current into electromagnetic waves, and during reception, it converts electromagnetic waves into high-frequency current, making it an indispensable part of wireless communication.

[0118] Material 21 includes resin and reinforcing material. The reinforcing material enhances the strength of the substrate; any material added to the resin that can increase the strength of the substrate can be used as a reinforcing material. The resin can be PA (Polyamide, nylon), and the reinforcing material can be glass fiber (GF). For example, Material 21 can be made of PA + 55% GF. PA + 55% GF is a polyamide and glass fiber composite material, in which the glass fiber content is 55%.

[0119] See Figure 4 The back cover 112 does not have any perforations; instead, it has a transparent area 113 to allow light to pass through. Specifically, the material 21 of the back cover 112 is made of two-color injection molding, for example, using PA+55%GF material and polycarbonate (PC) material for two-color injection molding. The PC material is transparent and is used in the transparent area 113.

[0120] See Figures 5-8 , Figure 5 It is a simplified cross-sectional view of the existing terminal structure. Figure 1 , Figure 6 It is a simplified cross-sectional view of the existing terminal structure. Figure 2 , Figure 7 It is a simplified cross-sectional view of the existing terminal structure. Figure 3 , Figure 8 It is a simplified cross-sectional view of the existing terminal structure. Figure 4 .

[0121] PU paint is a type of polyurethane coating, while UV paint is a type of coating that cures rapidly into a film within seconds under ultraviolet light. Treatment agents are substances used to treat the surfaces of plastics, fillers, pigments, and adhesive carriers to improve adhesion.

[0122] The following are examples of four existing terminal structural components with film layer structures and manufacturing methods. These four terminal structural components can be applied to the case where a light-transmitting part 13 is provided on the back case 112 of a watch. Of course, the following four film layer structures are not limited to application only to watch 1:

[0123] (1) PA+55%GF material + UV high-gloss topcoat, mainly used for watch back cases.

[0124] See Figure 5 This illustrates the film layer 23 on material 21. Figure 5 In the middle, from bottom to top, there are PA+55%GF material material 21, treatment agent layer 231, PU color paint layer 232 and UV topcoat layer 233.

[0125] Color paint is a coating made by adding various pigments and fillers to the paint film to give it color and block light transmission, or to enhance the mechanical and chemical properties of the coating film. Topcoat is the outermost film layer in a metal component coating system. Its main function is to shield the surface of the metal component coating system from the damaging effects of ultraviolet rays from the sun and atmospheric pollution, resist wind, snow, and rain, and also provide excellent aesthetic decoration. UV topcoats are classified into matte, semi-matte, and glossy finishes.

[0126] The specific processing method is as follows: Wipe the PA+55%GF material 21 with alcohol and perform electrostatic dust removal; spray the treatment agent, with a film thickness of 4-8μm, bake at 70-80℃ for 10-30 minutes to form the treatment agent layer 231; spray the PU paint, with a film thickness of 8-15μm, bake at 70-80℃ for 10-30 minutes to form the PU paint layer 232; spray the UV topcoat, with a film thickness of 20-30μm, bake at 50-60℃ for 3-8 minutes, using an energy of 800-1000mJ / cm. 2 Irradiate with ultraviolet light to form a UV topcoat layer 233; perform CNC drilling and laser engraving of characters.

[0127] (2) PA+55%GF material + indium plating + UV topcoat, mainly used in mobile phone mid-frame.

[0128] See Figure 6 This illustrates the film layer 23 on material 21. Figure 6In the middle, from bottom to top, are: PA+55%GF material 21, treatment agent layer 231, PU primer layer 234, UV primer layer 235, indium plating layer 236, UV intermediate coating layer 237, and UV topcoat layer 233.

[0129] Primer is used to improve the adhesion of the topcoat, increase its fullness, provide alkali resistance, and offer anti-corrosion properties. It also ensures uniform absorption of the topcoat, allowing the paint system to perform at its best. Indium is plated onto the surface of the UV primer layer 235 using NCVM (Non-conductive vacuum metallization) technology to form an indium-plated layer 236, thereby improving corrosion resistance and appearance. The intermediate coat is the middle layer coating and is commonly referred to as the "intermediate paint."

[0130] The specific processing method is as follows: Wipe the PA+55%GF material material 21 with alcohol and perform electrostatic dust removal; spray the treatment agent, with a film thickness of 4-8μm, bake at 70-80℃ for 10-30 minutes to form the treatment agent layer 231; spray the black PU primer, with a film thickness of 6-10μm, bake at 70-80℃ for 10-20 minutes to form the PU primer layer 234; spray the UV primer, with a film thickness of 22-25μm, and bake at... Baking temperature 50-60℃ for 3-8 minutes to form a UV primer layer 235; Indium electroplating to form an indium plating layer 236; Spraying UV intermediate coat (mixed with colorant), film thickness 6-8μm, baking temperature 50-60℃ for 3-8 minutes to form a UV intermediate coat layer 237; Spraying UV topcoat, film thickness 20-25μm, baking temperature 50-60℃ for 3-8 minutes, then applying an energy of 800-1000mJ / cm 2 Irradiate with ultraviolet light to form a UV topcoat layer 233; perform CNC drilling and laser engraving of characters.

[0131] (3) PA+55%GF material + PDS + UV topcoat, mainly used for watch back cases.

[0132] See Figure 7 The diagram illustrates the film layer 23 on the material 21. In the diagram, from bottom to top, the layers are: material 21 made of PA+55%GF material, PDS antenna 24, treatment agent layer 231, PU cover layer 238, UV primer layer 235, PU paint layer 232, and UV topcoat layer 233.

[0133] The process of printing PDS antennas on the substrate is as follows: Based on the antenna drawings, the steel plate surface undergoes film etching and etching processes to create grooves of varying depths. Conductive silver paste is poured onto a pad printing machine, scraped into the grooves of the steel plate, and under pressure, the pad printing head picks up the silver paste according to the groove pattern. After hot air drying, under pressure, the silver paste is transferred from the pad printing head to both sides of the substrate. The substrate is then placed in an oven and baked at 90-140℃ for 2-4 hours for curing.

[0134] The specific processing method is as follows: Wipe the PA+55%GF material 21 with alcohol and perform electrostatic dust removal; pad print PDS silver paste to form PDS antenna 24; spray treatment agent, film thickness 3-12μm, baking temperature 70-80℃, baking time 10-20min, to form treatment agent 231; spray PU cover layer 238, film thickness 20-35μm, baking temperature 70-80℃, baking time 10-20min; spray UV primer, film thickness 5-12μm, baking temperature 50-60℃, baking time 3-8min, and then apply energy of 800-1000mJ / cm. 2 Irradiation with ultraviolet light forms a UV primer layer 235; spraying PU cover coat with a film thickness of 5-15μm, baking temperature 70-80℃, baking time 10-15min, to form a PU color coat layer 232; spraying UV topcoat with a film thickness of 15-30μm, baking temperature 50-60℃, baking time 3-8min, and then applying an energy of 800-1000mJ / cm². 2 Irradiate with ultraviolet light to form a PU paint layer 232; perform CNC drilling and laser engraving of characters.

[0135] (4) PA+55%GF material + PDS + indium plating + UV topcoat, mainly used for watch back cases.

[0136] See Figure 8 This illustrates the film layer 23 on material 21. Figure 8 In the middle, from bottom to top, are: PA+55%GF material 21, PDS antenna 24, treatment agent layer 231, PU cover layer 238, UV primer layer 235, indium plating layer 236, PU intermediate coating layer 237, and UV topcoat layer 233.

[0137] The specific processing method is as follows: Wipe the PA+55%GF material 21 with alcohol and perform electrostatic dust removal; pad print PDS silver paste to form PDS antenna 24; spray treatment agent, film thickness 3-12μm, baking temperature 70-80℃, baking time 10-20min to form treatment agent layer 231; spray PU cover layer 238, film thickness 8-20μm, baking temperature 70-80℃, time 10-20min; spray UV primer, film thickness 20-35μm, baking temperature 50-60℃, baking time 3-8min, energy 800-1000mJ / cm 2 To form a UV primer layer 235; electroplating indium to form an indium plating layer 236; spraying a UV intermediate coat (mixed with colorant), with a film thickness of 5-8 μm, baking temperature of 50-60℃, baking time of 3-8 min, and then applying an energy of 800-1000 mJ / cm 2 Irradiate with ultraviolet light to form a PU intermediate coating layer 237; spray with UV topcoat, film thickness 15-30μm, baking temperature 50-60℃, baking time 3-8min, then apply energy of 800-1000mJ / cm 2 Irradiate with ultraviolet light to form a UV topcoat layer 233; perform CNC drilling and laser engraving of characters.

[0138] In the first two terminal structural components 2, the lack of PDS antenna 24 results in poor radio frequency signal; in the latter two terminal structural components 2, PDS antenna 24 is printed on the surface of material 21, but the lack of via antenna will also affect the radio frequency signal.

[0139] See Figure 9 , Figure 9 It is a simplified cross-sectional view of the existing terminal structure. Figure 5 .

[0140] The following example illustrates a film layer structure and manufacturing method for an existing terminal structural component. This terminal structural component can be applied to the case 112 of watch 1 where a transparent area 113 is formed. Of course, the following film layer structure is not limited to application only to watch 1:

[0141] exist Figure 9 In the middle, from bottom to top, are: PA+55%GF and PA double injection molding material 21, treatment agent layer 231, PU color paint layer 232, transparent treatment layer 2312, and UV topcoat layer 233.

[0142] The area corresponding to the PA material on material 21 is the PC transparent material area 211, and the PC transparent material area 211 corresponds to the transparent area 113 on the back shell 112; the transparent treatment layer 2312 is a coated transparent treatment agent.

[0143] The specific processing method is as follows: Wipe the PA+55%GF and PA double injection molding material 21 with alcohol and perform electrostatic dust removal; spray a treatment agent with a film thickness of 4-8μm, bake at 70-80℃ for 10-30 minutes to form a treatment agent layer 231; spray PU paint with a film thickness of 8-15μm, bake at 70-80℃ for 10-30 minutes to form a PU paint layer 232; laser engrave the PU paint layer 232, with the laser engraved area 2313 on the PU paint layer 232 corresponding to the PC transparent material area 211 on the material 21; spray a transparent treatment agent to form a transparent treatment layer 2312; spray a UV topcoat with a film thickness of 20-30μm, bake at 50-60℃ for 3-8 minutes, using an energy of 800-1000mJ / cm². 2 Irradiate with ultraviolet light to form a UV topcoat layer 233; perform CNC drilling and laser engraving of characters.

[0144] See Figure 10 This is a cross-sectional schematic diagram of existing terminal structural component materials.

[0145] If the radio frequency signal is improved, a via antenna 25 can be provided on the material 21, but this will result in a hole mark on the surface of the terminal structure 2.

[0146] PDS antennas are printed on the inner and outer surfaces of the terminal structural component material 21. Through holes are made in the material 21 along the thickness direction, and the through holes are filled with conductive paste. After the conductive paste solidifies, a via antenna 25 is formed. The via antenna 25 facilitates the extension of the PDS antenna on the upper surface of the material 21 to the PDS antenna on the lower surface of the material.

[0147] Regarding the via marking, after the conductive silver paste is poured into the antenna hole from the inside of material 21, the upper surface of the conductive silver paste is usually a concave arc surface. During the baking process of the conductive silver paste, the solidification of the conductive silver paste and the evaporation of the solvent inside the conductive silver paste will cause shrinkage in the via antenna 25. See Figure 10 This illustrates that the top surface of the through-hole antenna 25 is recessed downwards, forming an inwardly concave arc surface 251, which in turn creates a hole mark on the outer surface of the terminal structure.

[0148] Therefore, how to process through-hole antennas on terminal structural components without affecting the appearance of the terminal structural components has always been a difficult problem in the industry.

[0149] To address the aforementioned issues, this application provides a method for manufacturing a terminal structural component. When manufacturing a via antenna, the via antenna needs to protrude from the outer surface of the substrate. During the processing of the film layer on the outer surface of the substrate, a grindable cover layer is provided. The protruding portion of the via antenna will form a raised mark on the cover layer. By grinding the cover layer, this mark can be improved. When other film layers are subsequently applied to the cover layer, the influence of the via antenna on these other film layers can be avoided, thus resolving the via antenna mark issue. This allows for improved GPS, Bluetooth, and LTE signal strength without affecting the appearance of the terminal structural component.

[0150] The terminal structural components provided in this application are applicable to scenarios including but not limited to tablets, mobile phones, and watches.

[0151] The following section, in conjunction with the accompanying drawings, provides a detailed explanation of the specific structure of the terminal component manufacturing method.

[0152] See Figures 11-13 , Figure 11 This is a cross-sectional view of a via antenna mounted on a substrate. Figure 12 This is a cross-sectional view of a masking layer on a substrate (the masking layer is not polished). Figure 13 This is a cross-sectional view of a masking layer on a substrate (the masking layer has been polished).

[0153] A method for manufacturing a terminal structural component includes the following:

[0154] Antenna via 221 is processed on substrate 22 of terminal structure 2. Conductive paste is injected into antenna via 221 and solidified to form via antenna 25. The solidified conductive paste protrudes from the outer surface of substrate 22.

[0155] An antenna is disposed on the surface of substrate 22;

[0156] A film layer 23 is processed on the outer surface of the substrate 22. The film layer 23 includes at least one grindable masking layer 239, which can be ground to improve the marking of the via antenna 25.

[0157] An antenna via 221 is provided on the substrate 22. The antenna via 221 is a through hole on the substrate 22, and the antenna via 221 connects the inner surface and the outer surface of the substrate 22. A conductive paste is injected into the antenna via 221. After the conductive paste solidifies in the antenna via 221, a via antenna 25 is formed. The antenna is printed on the inner surface and the outer surface of the substrate 22. After multiple film layers 23 are provided on the outer surface of the substrate 22, the appearance surface is formed.

[0158] A conductive paste, including metallic silver, is injected into the antenna via 221. Of course, the conductive paste may include, but is not limited to, silver alone, and the material of the conductive paste may also be conductive materials such as copper or aluminum. When the conductive paste includes metallic silver, it is called conductive silver paste.

[0159] Conductive paste is injected into the antenna via 221 and solidified to form the via antenna 25. Antennas are provided on both the inner and outer surfaces of the substrate 22. The antennas provided on the side of the substrate 22 are called planar antennas, and the antennas provided on the inner surface of the substrate 22 are called planar inner antennas. The antennas provided on the outer surface of the substrate 22 are called planar outer antennas 241. The planar outer antenna 241 is connected to the planar inner antenna through the via antenna 25. The planar inner antenna is connected to the PCB board of the terminal device.

[0160] In this embodiment, when fabricating the via antenna 25, the via antenna 25 protrudes from the outer surface of the substrate 22, that is, the conductive paste solidified inside the antenna via 221 protrudes from the outer surface of the substrate 22. See [reference needed]. Figure 11 This illustrates the conductive paste within the antenna via 221 protruding from the outer surface of the substrate 22. During the fabrication of the film layer 23 on the outer surface of the substrate 22, a polishable cover layer 239 is fabricated. The protruding conductive paste from the antenna via 221 forms a raised mark on the cover layer 239. (See attached image.) Figure 12 The diagram illustrates the area where the cover layer 239 bulges upwards under the influence of the through-hole antenna 25. The markings can be improved by polishing the cover layer 239. See also... Figure 13 The diagram illustrates the polished cover layer 239. When other coatings are subsequently applied to the cover layer 239, the influence of the via antenna 25 on these coatings can be avoided. This ensures that the via antenna 25 can improve GPS, Bluetooth, and LTE signals without affecting the appearance of the terminal structural component 2.

[0161] The masking layer 239 is a polishable coating. The masking layer 239 needs to meet certain hardness and thickness requirements to allow it to be polished. In the prior art, the coatings on the terminal structural component 2 cannot be polished, as polishing the coatings is easy to penetrate and leave polishing marks.

[0162] Preferably, the covering layer 239 comprises a highly cross-linked resin.

[0163] The degree of crosslinking in resin refers to the number and density of chemical bonds formed by crosslinking groups in the resin molecule. Resins with a high degree of crosslinking have better thermal stability, wear resistance, and mechanical properties.

[0164] The masking layer 239 comprises a highly cross-linked resin, which makes the masking layer 239 more sandable.

[0165] Preferably, the masking layer 239 has a high pigment-to-binder ratio.

[0166] The pigment-to-resin ratio is the proportion of pigment to resin in a coating.

[0167] The masking layer 239 uses a higher pigment-to-binder ratio, which makes the masking layer 239 more sandable.

[0168] Specifically, the film layer 23 also includes an adhesive underlayer 2310 (surface treatment agent or primer) and a paint layer (topcoat, etc.). The masking layer 239 provided in this embodiment is disposed between the adhesive underlayer 2310 and the paint layer.

[0169] Preferably, the number of masking layers 239 is one or more. The more masking layers 239 there are, the better it is to cover the mark. However, a large number of masking layers 239 will increase the thickness of the film layer 23 on the outer surface of the substrate 22 and make the operation more complicated. Therefore, it is necessary to design a reasonable number of masking layers 239.

[0170] Preferably, the antenna on the surface of substrate 22 is fabricated using PDS technology, in which case the planar antenna is a PDS antenna 24. PDS technology is a technique used for printed antennas, specifically a pad printing process. This process involves coating a conductive paste onto the surface of a workpiece and then printing multiple layers to form a conductive three-dimensional circuit.

[0171] Preferably, the thickness of the antenna (planar outer antenna 241) printed on the outer surface of the substrate 22 is reduced to improve the markings caused by the height difference between the planar outer antenna 241 and the substrate 22.

[0172] Preferably, one or more antenna vias 221 are processed on the substrate 22 of the terminal structure 2, and conductive paste is injected into each antenna via 221 so that one or more via antennas 25 are formed on the terminal structure 2.

[0173] Specifically, the location of the antenna via 221 on the substrate 22 is not limited, as long as it can be fabricated on the substrate 22.

[0174] Preferably, the outer surface of the terminal structure 2 is matte or glossy.

[0175] Preferably, the film layer 23 includes an indium plating layer to increase the metallic texture of the outer surface of the terminal structure 2.

[0176] The conductive paste injected into the antenna via 221 is a via paste, and the silver paste used to prepare the surface antenna of the substrate 22 is a surface paste. Preferably, the via paste is a conductive paste with a relatively high viscosity.

[0177] The viscosity of the through-hole slurry is relatively high, which is conducive to the liquid through-hole slurry protruding from the outer surface of the substrate 22 without overflowing to the surroundings, so that the solidified through-hole slurry protrudes from the upper surface of the substrate 22.

[0178] Preferably, the through-hole slurry is a conductive slurry with a relatively low solvent content.

[0179] When the through-hole paste is heated and cured, the organic solvent in the conductive paste will evaporate, which will make it difficult for the cured conductive paste to protrude from the outer surface of the substrate 22. Therefore, it is preferable to reduce the proportion of solvent in the through-hole paste.

[0180] Preferably, the through-hole slurry is a conductive slurry with low curing shrinkage.

[0181] The via paste has a low curing shrinkage rate, which avoids the situation where the liquid paste protrudes from the surface of the substrate 22 while the cured silver paste is below the outer surface of the substrate 22 when the conductive paste is poured into the antenna via 221. Therefore, the via paste is preferably a paste with a low curing shrinkage rate.

[0182] In addition, the preferred surface paste is also a conductive paste with low curing shrinkage.

[0183] Preferably, the through-hole slurry is a conductive slurry with a low coefficient of thermal expansion.

[0184] During the fabrication of terminal structure 2, baking and curing are required during the fabrication of antenna and film layer 23, causing thermal expansion of substrate 22 and paste. The via paste is a conductive paste with a low coefficient of thermal expansion to ensure that the shrinkage ratio of the via paste is close to that of some substrates 22, avoiding the disadvantage of poor imprinting due to a large difference in the coefficient of thermal expansion between the via paste and substrate 22.

[0185] In addition, the preferred surface slurry is also a slurry with a low coefficient of thermal expansion.

[0186] Preferably, by reasonably setting the parameters of the antenna via 221, the conductive paste of the antenna via 221 protrudes from the outer surface of the substrate 22 when the via antenna 25 is manufactured.

[0187] Specifically, the substrate 22 is made of plastic. Depending on the application scenario of the terminal structural component 2, different materials can be selected for the substrate 22.

[0188] The substrate 22 is made of resin and reinforcing materials. Examples of resins include PA (Polyamide, nylon), PBT (Polybutylene Terephthalate), PPS (Polyphenylene Sulfide), PEEK (Poly(Ether-Ether-Ketone)), or PC (Polycarbonate). Examples of reinforcing materials include glass fiber (GF) and carbon fiber (CF). The function of the reinforcing materials is to enhance the strength of the substrate; any material added to the resin that can enhance the strength of the substrate can be used as a reinforcing material.

[0189] The substrate 22 can be made by two-color injection molding. In this case, the material of the substrate 22 includes the resin with added reinforcing material and the transparent plastic material. The transparent plastic material can be PC (Polycarbonate) or PMMA (PolymethylMethacrylate).

[0190] The conductive paste injected into the antenna via 221 is a via paste, and the paste used to prepare the surface antenna of the substrate 22 is a surface paste. In one embodiment, the viscosity of the via paste is less than that of the surface paste.

[0191] Viscosity refers to the resistance a fluid exhibits to its flow.

[0192] Because the conductive paste of the via antenna 25 needs to protrude from the outer surface of the substrate 22, liquid via paste is required to protrude from the outer surface of the substrate 22 when processing the via antenna 25.

[0193] Assuming the silver paste has a very low viscosity, when the conductive paste is poured into the antenna via 221, if the conductive paste protrudes beyond the outer surface of the substrate 22, it will easily overflow due to the low resistance between fluids. This would hinder the conductive paste of the via antenna 25 from protruding beyond the outer surface of the substrate 22. Therefore, the viscosity of the via paste should be set relatively high.

[0194] The surface paste needs to be printed on the surface of the substrate 22 to form a planar antenna. If the surface paste is relatively large, it will be difficult to print. Therefore, the viscosity of the through-hole paste should be set to be relatively small.

[0195] In this embodiment, the viscosity of the through hole paste is set to be less than that of the surface paste. This facilitates the conductive paste of the through hole antenna 25 protruding from the outer surface of the substrate 22, while also making it easier for the surface paste to be printed on the surface of the substrate 22.

[0196] In one embodiment, the viscosity of the through-hole slurry is in the range of 15,000-25,000 cps.

[0197] The viscosity range of the paste used to prepare the antenna on the surface of the substrate 22 is usually around 5000 cps. In this embodiment, the viscosity range of the through hole paste is designed to be 15000-25000 cps, which is beneficial to make the conductive paste protrude from the outer surface of the substrate 22 after the antenna through hole 221 is cured.

[0198] In this embodiment, the viscosity range of the through-hole slurry is 15,000-25,000 cps. For example, the viscosity value of the through-hole slurry can be 15,000 cps, 20,000 cps, 25,000 cps, etc.

[0199] In one embodiment, the solvent content of the through-hole slurry is less than that of the surface slurry.

[0200] Solvent percentage refers to the proportion of solvent in a solution, usually expressed as mass ratio or volume ratio.

[0201] Conductive pastes have a complex composition. Taking conductive silver paste as an example, it includes high-purity silver powder, conductive medium, binder, other additives, organic solvents, polymers, glass oxides, organic raw materials and various additives. These components work together to achieve the conductivity and printing performance of the silver paste.

[0202] When the conductive paste is heated and cured, the organic solvent in the conductive paste will evaporate, which will make it difficult for the cured conductive paste to protrude from the outer surface of the substrate 22. Therefore, it is best to reduce the proportion of solvent in the through-hole paste.

[0203] Adding solvent to conductive paste can improve the performance of silver paste and facilitate its coating and printing. Therefore, compared to surface paste, a relatively higher solvent content in silver paste is preferable.

[0204] In this embodiment, the solvent ratio of the through-hole paste is set to be less than that of the surface paste. This not only facilitates the conductive paste after the antenna through-hole 221 is cured to protrude from the outer surface of the substrate 22, but also makes it easier to print and manufacture planar antennas.

[0205] In one embodiment, the solvent content of the through-hole slurry ranges from 0-15%.

[0206] The conductive paste is usually conductive silver paste. The solvent ratio of the silver paste used to prepare the planar antenna is usually 15-25%. In this embodiment, the solvent ratio of the through hole paste is designed to be 0-15%, which is beneficial to make the conductive paste protrude from the outer surface of the substrate 22 after the antenna through hole 221 is cured.

[0207] In this embodiment, the solvent content of the through-hole slurry ranges from 0 to 15%. For example, the solvent content of the through-hole slurry can be 5%, 8%, 10%, 15%, etc.

[0208] In one embodiment, the curing shrinkage rate of the through-hole slurry is less than 1%.

[0209] Curing shrinkage rate refers to the proportion of resin volume reduction during the curing process.

[0210] In this embodiment, the curing shrinkage rate of the via paste is set to be less than 1%. The low curing shrinkage rate of the via paste avoids the situation where, when silver paste is poured into the antenna via 221, the liquid silver paste protrudes from the surface of the substrate 22, while the cured silver paste is below the surface of the substrate 22.

[0211] The curing shrinkage rate of the preferred surface paste is also less than 1%, which is beneficial for the fabrication of planar antennas on substrate 22.

[0212] In this embodiment, the curing shrinkage rate of the through-hole slurry is less than 1%, for example, the curing shrinkage rate of the through-hole slurry is 0.7% or 0.9%.

[0213] In one embodiment, the coefficient of thermal expansion of the through-hole slurry is less than 30 × 10⁻⁶. -6 / K.

[0214] The coefficient of thermal expansion is a physical quantity that characterizes the thermal expansion property of an object; that is, it measures how an object expands or contracts due to changes in temperature. The contraction ratio refers to the relationship between thermal expansion and changes in the size of an object.

[0215] When the substrate 22 is made of a polyamide and glass fiber composite material, the coefficient of thermal expansion of the through-hole slurry is less than 30 × 10⁻⁶. -6 / K, so that the shrinkage ratio of the via paste and the substrate 22 are close, and the difference between the thermal expansion coefficient of the via paste and the thermal expansion coefficient of the substrate 22 is large, which is not conducive to improving the hole imprint.

[0216] The preferred surface slurry has a coefficient of thermal expansion of less than 30 × 10⁻⁶. -6 / K.

[0217] In this embodiment, the coefficient of thermal expansion of the through-hole slurry is less than 30 × 10⁻⁶. -6 / K, for example, the coefficient of thermal expansion of through-hole slurry is 20×10. -6 / K, 10×10 -6 / K etc.

[0218] See Figure 14 The diagram shows a cross-sectional view of the substrate, illustrating the antenna via 221.

[0219] In one embodiment, the diameter of the antenna via 221 is no greater than 0.15 mm.

[0220] Taking conductive silver paste as an example, if the diameter of the antenna via 221 is too large, when silver paste is poured into the antenna via 221, the top surface of the silver paste is concave if the silver paste does not overflow to the outer surface of the substrate 22. When the silver paste in the antenna via 221 is solidified, the solid conductive paste is concave. At this time, the hole mark cannot be eliminated by polishing the masking layer 239.

[0221] In this embodiment, the diameter d of the antenna via 221 is set to be no greater than 0.15 mm. The small diameter of the antenna via 221 is beneficial to achieve the effect that the silver paste protrudes from the outer surface of the substrate 22 without overflowing onto the outer surface of the substrate 22.

[0222] In this embodiment, the diameter of the antenna via 221 is no greater than 0.15mm. For example, the diameter of the antenna via 221 can be set to 0.5mm, 0.1mm or 0.15mm, etc.

[0223] When injecting silver paste into the antenna via 221, conductive silver paste is injected into the antenna via 221 from the inner side of the substrate 22 using a filling device. Setting the diameter of the antenna via 221 to no more than 0.15 mm makes it easy to achieve a single filling operation. That is, when injecting conductive paste into the antenna via 221 using a filling device, the antenna via 221 can be filled in one operation. However, if the diameter of the antenna via 221 is large, it may not be filled in one operation, requiring a second filling, which will affect the quality of the conductive paste injected into the antenna via 221.

[0224] Alternatively, the antenna via 221 can be fabricated on the substrate 22 of the terminal structure 2 by means of the following method: the antenna via 221 is fabricated from the inside to the outside of the substrate 22 using a laser, and then the fuzz inside the antenna via 221 is removed.

[0225] In this embodiment, when there are two antenna vias 221, the diameters of the two antenna vias 221 may be the same or different.

[0226] In this embodiment, when there are three or more antenna vias 221, the diameter of each antenna via 221 is the same, or the diameter of each antenna via 221 is different, or some antenna vias 221 have the same diameter.

[0227] In one embodiment, the area on the substrate 22 where the antenna via 221 needs to be processed is called the via region 222. The substrate 22 is injection molded and the inner side of the via region 222 is injection molded with a recess.

[0228] During injection molding of the substrate 22, the thickness of the via region 222 is less than the thickness of other regions on the substrate 22 excluding the via region 222. A recess is formed on the inner surface of the via region 222 to reduce the height of the antenna via 221 along the thickness direction of the substrate 22, facilitating a single injection operation for the antenna via 221. See also... Figure 14 The via region 222 is shown.

[0229] When a grouting operation is performed, that is, when the conductive grout is injected into the antenna through hole 221 using a filling equipment, the antenna through hole 221 can be filled in one grouting operation. However, if the thickness of the through hole area 222 is large, the antenna through hole 221 may not be filled in one grouting operation, so a second grouting operation is required, which will affect the quality of the conductive grout injected into the antenna through hole 221.

[0230] Therefore, in order to facilitate the grouting operation of the antenna via 221, the height of the antenna via 221 along the thickness direction of the substrate 22 should be as small as possible. However, a small height will affect the strength of the terminal structure 2. Therefore, the height of the antenna via 221 (via area 222) along the thickness direction of the substrate 22 should be set reasonably.

[0231] For example, when the strength of the substrate 22 is relatively high, that is, when the strength of the material used in the substrate 22 is relatively high, the height value of the via area 222 along the thickness direction of the substrate 22 can be set to be smaller; when the strength of the substrate 22 is relatively low, that is, when the strength of the material used in the substrate 22 is relatively low, the height value of the via area 222 along the thickness direction of the substrate 22 can be set to be larger.

[0232] In this embodiment, the diameter of the via region 222 should be minimized as much as possible while still allowing for injection molding, in order to improve the strength of the terminal structural component 2. Specifically, the diameter of the via region 222 (the diameter of the recess) is larger than the diameter of the antenna via 221. One via region 222 can be used to process one antenna via 221. Of course, one via region 222 can also be used to process two or more antenna vias 221.

[0233] In this embodiment, by setting a recessed via area 222, it is not only convenient to carry out a grouting operation in one go, but also convenient to process the antenna via 221 by laser in the via area 222, so that the antenna via 221 can be processed by laser circling once, avoiding the need for multiple laser circling processing which would affect the accuracy of the antenna via 221.

[0234] In this embodiment, the number of via regions 222 is one or more, for example, one or two via regions 222 are formed on the substrate 22.

[0235] In one embodiment, the height of the via region 222 along the thickness direction is 0.1 to 0.5 mm.

[0236] In this embodiment, the height of the via area 222 along the thickness direction is set to 0.1 to 0.5 mm, that is, the height of the antenna via 221 along the thickness direction is limited to 0.1 to 0.5 mm, so as to facilitate the grouting operation of the antenna via 221 in one go.

[0237] In this embodiment, the height of the via region 222 along the thickness direction is 0.1 to 0.5 mm. For example, the height of the via region 222 along the thickness direction can be 0.1 mm, 0.3 mm, or 0.5 mm.

[0238] In one embodiment, before the antenna is disposed on the surface of the substrate 22, the conductive paste protruding from the outer surface of the substrate 22 is polished.

[0239] After injecting and solidifying the conductive paste into the antenna via, the conductive paste protruding from the outer surface of the substrate 22 can be polished first. Polishing at this time can reduce the amount of polishing on the cover layer 239.

[0240] The process of polishing the conductive paste protruding from the outer surface of the substrate 22 can be called coarse polishing. It is preferable to perform the coarse polishing first when preparing the terminal structure 2, and then polish the cover layer 239. Of course, coarse polishing can also be omitted, that is, the conductive paste protruding from the outer surface of the substrate 22 is not polished.

[0241] Regarding the polishing operation, 1500-grit and 3000-grit sandpaper can be used alternately to polish until smooth. When polishing the conductive paste protruding from the outer surface of the substrate 22, no polishing depressions should be formed. The polishing operation of the conductive paste protruding from the outer surface of the substrate 22 includes, but is not limited to, using 1500-grit and 3000-grit sandpaper alternately to polish until smooth.

[0242] See Figures 15-17 , Figure 15 This is a front view schematic diagram of a circular substrate; Figure 16 yes Figure 15 Schematic diagram of the cross section at point BB; Figure 17 This is a front view schematic diagram of a square substrate.

[0243] In one embodiment, there is one or more antenna vias 221; the antenna vias 221 are processed in a planar region of the substrate 22; and / or, the antenna vias 221 are processed in an arcuate region of the substrate 22; and / or, a raised region is formed on the substrate 22, and the antenna vias 221 are processed on the side of the raised region in the circumferential direction.

[0244] The external surfaces of the terminal structure 2 typically include flat and curved surfaces. If an outwardly protruding area is formed on the terminal structure 2, the circumferential side of the protruding area can be called a waist-shaped surface. See also Figure 15 and Figure 17 The diagram illustrates the plane 224, the curved surface 223, and the waist-shaped surface 225 of the substrate 22. Regarding the curved surface 223, all areas on the surface other than the waist-shaped surface 225 and the plane 224 can be referred to as the curved surface 223.

[0245] The number of antenna vias 221 can be set to one. In this case, the antenna via 221 can be set on the plane 224, the arc surface 223, or the waist-shaped surface 225.

[0246] The number of antenna vias 221 can also be set to two. In this case, the two antenna vias 221 can both be set on the plane 224, both on the arc surface 223, or both on the waist-shaped surface 225; or, the two antenna vias 221 can be set on different surfaces, such as one on the plane 224 and the other on the arc surface 223.

[0247] The number of antenna vias 221 can also be set to three or more. In this case, the antenna vias 221 can all be set on the plane 224, or all on the arc surface 223, or all on the waist-shaped surface 225; or, antenna vias 221 can be set on the plane 224, the arc surface 223, and the waist-shaped surface 225.

[0248] For via antennas 25 positioned on the plane 224 and the curved surface 223, grinding is required in the area corresponding to the cover layer 239. However, for via antennas 25 positioned on the waist-shaped surface 225, grinding is not required in the area corresponding to the cover layer 239 because the waist-shaped surface 225 has little impact on the appearance of the terminal structure 2. Furthermore, based on light reflection, the waist-shaped surface of the terminal structure 2 has high diffuse reflectivity, followed by the curved surface, with the plane mirror exhibiting the lowest diffuse reflectivity. Diffuse reflected light is more dispersed and weaker, while specular reflected light is more concentrated and stronger. Due to the high diffuse reflectivity of the waist-shaped surface, it appears relatively dark, making it difficult to observe markings on the waist-shaped surface of the terminal structure 2. Therefore, when the via antenna 25 is positioned on the waist-shaped surface 225 of the substrate 22, grinding is not required in the area corresponding to the cover layer 239. This improves the efficiency of manufacturing the terminal structure 2 without affecting its appearance.

[0249] In this embodiment, if the antenna via 221 is disposed on the waist-shaped surface, the diameter of the antenna via 221 is not limited to less than 0.2 mm.

[0250] For example, terminal structure 2 is the back cover 112 of watch 1, see... Figure 15 and Figure 16 A perforated hole is formed in the middle of the substrate 22, which is used to install the light-transmitting part 13 of the terminal structure 2.

[0251] For example, terminal structure 2 is the back cover 112 of watch 1, see... Figure 17 In the middle, the substrate 22 is made by two-color injection molding, and a transparent material area 226 is formed on the substrate 22.

[0252] In one embodiment, the thickness of the antenna printed on the outer surface of the substrate 22 is no greater than 16 μm.

[0253] The antenna disposed on the side of the substrate 22 is called a planar antenna, and the antenna disposed on the outer surface of the substrate 22 is called the planar outer antenna 241. The planar outer antenna 241 has a certain thickness, and the planar outer antenna 241 will also cause a certain drop mark on the appearance surface of the terminal structure 2. By constraining the thickness of the planar outer antenna 241, the mark formed on the terminal structure 2 by the planar outer antenna 241 can be improved.

[0254] In this embodiment, the thickness of the planar outer antenna 241 is set to be no greater than 16μm. For example, the thickness of the planar outer antenna 241 can be 10μm, 12μm, 14μm, 16μm, etc.

[0255] Preferably, since the planar outer antenna 241 needs to be connected to each via antenna, the number of via antennas and their distribution on the substrate 22 will affect the area of ​​the planar outer antenna 241 printed on the substrate 22. For example, when the number of via antennas is relatively large and their distribution on the substrate 22 is relatively dispersed, a large-area PDS antenna is used when printing the PDS antenna on the substrate 22.

[0256] For example, the area of ​​the planar outer antenna 241 printed on the substrate 22 is greater than 50%.

[0257] See Figure 18 , Figure 18 This is a front view schematic diagram of the circular substrate 22 for printed PDS antennas. It shows the planar outer antenna 241 printed over a large area on the substrate 22.

[0258] When printing the outer plane antenna 241, the printing can be completed in one sampling step, or, depending on the shape of the substrate 22, the outer plane antenna 241 can be printed in two steps.

[0259] In one embodiment, the angle between any two adjacent sides of the planar outer antenna 241 is a rounded corner 2411.

[0260] The antenna is printed using PDS technology. The specific operation is as follows: Silver paste is poured onto the pad printing equipment, and the pad printing head dips into the silver paste in the groove according to the groove pattern of the steel plate. After hot air drying, under a certain pressure, the silver paste of the pad printing head is transferred to the surface of the substrate 22 with antenna vias 221.

[0261] The principle of silver paste pad printing is to use silicone to deform and extract silver paste, and then use silicone to deform and remove the silver paste. The silicone deforms from the center to the periphery, so the end is squeezed by the silicone deformation to generate ink accumulation. The thickness of the ink accumulation position is thick, so the free end of the PDS antenna increases the height difference mark on the appearance surface of the terminal structural component 2.

[0262] In this embodiment, by setting the corner between any two adjacent sides of the planar outer antenna 241 as a rounded corner 2411, the ink accumulation at the free end of the PDS antenna is effectively improved, thus mitigating the markings formed by the PDS antenna on the terminal structure 2. See also Figure 18 This illustrates that the apex corner of the free end of the planar outer antenna 241 is rounded 2411.

[0263] In this embodiment, any two adjacent sides include any two adjacent outer sides, or any two connected inner sides. The area of ​​the unprinted planar outer antenna 241 is called the cutout area 2412, see [link to documentation]. Figure 18 This illustrates the hollowed-out area 2412. Figure 18 The edge of the hollowed-out area 2412 is the inner edge of the planar outer antenna 241. See also Figure 18 The diagram illustrates a strip-shaped hollow area 2412, where the angle between any two sides is rounded 2411.

[0264] In this embodiment, it is preferable that the radii of the rounded corners between any two adjacent sides of the planar outer antenna 241 are the same.

[0265] In this embodiment, the radius of the rounded corner between any two adjacent sides of the planar outer antenna 241 is preferably in the range of 0.2 to 1.0 mm. For example, the radius of the rounded corner between any two adjacent sides of the planar outer antenna 241 is 0.2 mm, 0.6 mm, or 1.0 mm.

[0266] In this embodiment, the antenna disposed on the inner side of the substrate 22 is called the in-plane antenna, and preferably the corner between any two adjacent sides of the in-plane antenna is rounded.

[0267] In this embodiment, the radius of the angle between any two adjacent sides of the in-plane antenna is preferably in the range of 0.2 to 1.0 mm.

[0268] In one embodiment, the material of the masking layer 239 includes polyurethane resin or UV resin.

[0269] Polyurethane (PU), short for polyurethane, is a polymer material with excellent mechanical properties and extremely high plasticity, formed by the condensation reaction of polyols and polyisocyanates. UV is a material that can rapidly cure into a film within seconds under ultraviolet light, and is typically composed of resin, photoinitiator, and additives.

[0270] In this embodiment, the masking layer 239 includes polyurethane resin or UV resin. Both polyurethane resin and UV resin are commonly used coating materials. By selecting appropriate polyurethane resin and UV resin, the masking layer 239 can be polished.

[0271] Specifically, when there is only one cover layer 239, the cover layer 239 may be made of polyurethane resin or UV resin.

[0272] When there are two masking layers 239, both masking layers 239 are made of polyurethane resin or both masking layers 239 are made of UV resin, or one of the two masking layers 239 is made of polyurethane resin and the other is made of UV resin.

[0273] When there are two masking layers 239, one of which is made of polyurethane resin and the other of which is made of UV resin, the polyurethane resin masking layer 239 is disposed on the side closer to the substrate 22, or the UV resin masking layer 239 is disposed on the side closer to the substrate 22.

[0274] When there are three or more masking layers 239, each masking layer 239 is made of polyurethane resin or each masking layer 239 is made of UV resin. Alternatively, all masking layers 239 may include both polyurethane resin masking layers 239 and UV resin masking layers 239.

[0275] When the number of masking layers 239 is three or more, including both polyurethane resin masking layers 239 and UV resin masking layers 239, it is preferable to alternately provide polyurethane resin masking layers 239 and UV resin masking layers 239 in sequence.

[0276] In one embodiment, the pigment-to-binder ratio of the masking layer 239 is 1:1 to 1:2.

[0277] The pigment-to-binder ratio is the weight ratio of pigment to binder in a coating. By limiting the pigment-to-binder ratio of the opacifier layer 239 to 1:1 to 1:2, the opacifier layer 239 has better sandability.

[0278] In one embodiment, when the material of the cover layer 239 includes polyurethane resin, the resin hydroxyl content in the cover layer 239 is ≥1.0.

[0279] The hydroxyl value of resin is a parameter that evaluates the amount of hydroxyl groups inside the resin molecule. The higher the hydroxyl value, the more hydroxyl groups inside the resin molecule, and vice versa.

[0280] In this embodiment, by setting the resin hydroxyl content in the masking layer 239 to ≥1.0, the masking layer 239 has better sandability.

[0281] In one embodiment, when the material of the cover layer 239 includes a UV resin material, the resin of the cover layer 239 includes a 2-functional resin and a 6-functional resin.

[0282] High-functionality resins and low-functionality resins both refer to the number of functional groups in a polymer.

[0283] In this embodiment, the 6-functional resin is a high-functional resin and the 2-functional resin is a low-functional resin. The combination of high-functional and low-functional resins improves the performance of the resin material, making the masking layer 239 more polishable.

[0284] In one embodiment, the thickness of the covering layer 239 ranges from 5 to 40 μm.

[0285] The thickness of the cover layer 239 is set reasonably so that the cover layer 239 can be polished without affecting the film thickness on the terminal structural component 2.

[0286] In this embodiment, the thickness of the covering layer 239 ranges from 5 to 40 μm, for example, the thickness of the covering layer 239 is 10 μm, 20 μm, 30 μm or 40 μm.

[0287] In this embodiment, when there are two covering layers 239, the thickness of each covering layer 239 is the same, or the thickness of each covering layer 239 is different.

[0288] In this embodiment, when the number of masking layers 239 is three or more, the thickness of each masking layer 239 is the same, or the number of each masking layer 239 is not completely the same (i.e., some are the same), or the thickness of each masking layer 239 is different.

[0289] In this embodiment, when the number of cover layers 239 is three or more, cover layers 239 of the same material can be set to have the same thickness, and cover layers 239 of different materials can have different thicknesses.

[0290] In one embodiment, the substrate 22 of the terminal structure 2 is made of plastic. Depending on the application scenario of the terminal structure 2, different materials can be selected for the substrate 22.

[0291] See Table 1 below for specific examples:

[0292] The material of terminal structural component 2 can be PA+20-75%GF, where PA+20-75%GF is a composite material of polyamide and glass fiber, and the glass fiber content is 20-75%. In this case, terminal structural component 2 can be the casing of a watch.

[0293] The terminal structural component 2 can be made of PA + 20-75% GF and PC materials. That is, the terminal structural component 2 is made of polyamide and glass fiber composite material and polycarbonate material in two-color injection molding. Among them, the glass fiber content in the polyamide material is 20-75%. In this case, the terminal structural component 2 can be the shell of a laptop (Personal Computer, PC).

[0294] The terminal structural component 2 can be made of PA + 20-75% GF and PMMA materials. That is, the terminal structural component 2 is made of polyamide and glass fiber composite material and polymethyl methacrylate material in two-color injection molding. Among them, the glass fiber content in the polyamide material is 20-75%. In this case, the terminal structural component 2 can be the shell of a laptop (Personal Computer, PC).

[0295] The terminal structural component 2 can be made of PBT + 10-50% GF and PC materials. That is, the terminal structural component 2 is made of polybutylene terephthalate and glass fiber composite material and polycarbonate material in two-color injection molding. Among them, the glass fiber content in polybutylene terephthalate is 10-50%. In this case, the terminal structural component 2 can be the shell of a flat plate.

[0296] The terminal structural component 2 can be made of PBT + 10-50% GF and PMMA materials. That is, the terminal structural component 2 is made of polybutylene terephthalate and glass fiber composite material and polymethyl methacrylate material in two-color injection molding. Among them, the glass fiber content in polybutylene terephthalate is 10-50%. In this case, the terminal structural component 2 can be the shell of a flat plate.

[0297] The terminal structural component 2 can be made of PPS + 10-50% GF and PC materials. That is, the terminal structural component 2 is made of polyphenylene sulfide and glass fiber composite material and polycarbonate material in two-color injection molding. Among them, the glass fiber content in polyphenylene sulfide is 10-50%. In this case, the terminal structural component 2 can be the battery cover of the mobile phone.

[0298] The terminal structural component 2 can be made of PPS + 10-50% GF and PMMA materials. That is, the terminal structural component 2 is made of polyphenylene sulfide and glass fiber composite material and polymethyl methacrylate material in two-color injection molding. Among them, the glass fiber content in polyphenylene sulfide is 10-50%. In this case, the terminal structural component 2 can be the battery cover of the mobile phone.

[0299] The terminal structural component 2 can be made of PEEK + 10-50% GF and PC materials. That is, the terminal structural component 2 is made of polyether ether ketone and glass fiber composite material and polycarbonate material in two-color injection molding. Among them, the glass fiber content in polyether ether ketone is 10-50%. At this time, the terminal structural component 2 is the shell of watches, tablets, etc.

[0300] The terminal structural component 2 can be made of PEEK + 10-50% GF and PMMA materials. That is, the terminal structural component 2 is made of polyetheretherketone and glass fiber composite material and polymethyl methacrylate material in two-color injection molding. Among them, the glass fiber content in polyetheretherketone is 10-50%. In this case, the terminal structural component 2 is the shell of watches, tablets, etc.

[0301] The terminal structural component 2 can be made of PC + 20-30% GF and PC materials. That is, the terminal structural component 2 is made of polycarbonate and glass fiber composite material and polycarbonate material in two-color injection molding. Among them, the glass fiber content in polycarbonate is 20-30%. In this case, the terminal structural component 2 is the shell of watches, tablets, etc.

[0302] The terminal structural component 2 can be made of PC + 20-30% GF and PMMA materials. That is, the terminal structural component 2 is made of polycarbonate and glass fiber composite material and polymethyl methacrylate material in two-color injection molding. Among them, the glass fiber content in polycarbonate is 20-30%. In this case, the terminal structural component 2 is the shell of watches, tablets, etc.

[0303] Table 1

[0304]

[0305] See Figures 19-26 , Figure 19 It is a simplified cross-sectional view of the terminal structural component. Figure 1 , Figure 20 It is a simplified cross-sectional view of the terminal structural component. Figure 2 , Figure 21 It is a simplified cross-sectional view of the terminal structural component. Figure 3 , Figure 22 It is a simplified cross-sectional view of the terminal structural component. Figure 4 , Figure 23 It is a simplified cross-sectional view of the terminal structural component. Figure 5 , Figure 24 It is a simplified cross-sectional view of the terminal structural component. Figure 6 , Figure 25 It is a simplified cross-sectional view of the terminal structural component. Figure 7 , Figure 26 It is a simplified cross-sectional view of the terminal structural component. Figure 8 .

[0306] In one embodiment, there are two or more masking layers 239, one of which is coated on top of another masking layer 239, or a transition layer 2311 is first coated on one masking layer 239, and then another masking layer 239 is coated on the transition layer 2311. The transition layer 2311 is used to improve the bonding force between the two masking layers 239.

[0307] In this embodiment, the number of masking layers 239 can be set to two. Two masking layers 239, while satisfying the requirement of improving hole markings, will not make the thickness of the film layer 23 on the terminal structure 2 too thick. Of course, the number of masking layers 239 is preferably two, but the number of masking layers 239 is not limited to only two, and can also be three or more.

[0308] When the number of masking layers 239 is two, see Figure 22One of the masking layers 239 is applied over the other masking layer 239. At this time, the two masking layers 239 can be made of the same material or different materials, and both masking layers 239 need to be polished.

[0309] When the number of masking layers 239 is two, see Figure 23 This illustrates that a transition layer 2311 is first applied onto a cover layer 239, and then another cover layer 239 is applied onto the transition layer 2311. At this time, the two cover layers 239 can be made of the same material or different materials, and both cover layers 239 need to be polished.

[0310] Because the cover layer 239 is designed to be sanded, its hardness is relatively high, resulting in relatively poor adhesion. To improve the stability of the film structure on the terminal structural component 2, a transition layer 2311 is provided between the two cover layers 239. The transition layer 2311 improves the stability of the connection between the two cover layers 239.

[0311] Preferably, the transition layer 2311 includes polyurethane and a masking filler, wherein the masking filler is dispersed in the polyurethane. In this case, the transition layer 2311 is also called a PU transition layer.

[0312] When there are three or more cover layers 239, each cover layer 239 is arranged sequentially along the thickness direction and adjacent cover layers 239 are connected; or, each cover layer 239 is arranged sequentially along the thickness direction and any two adjacent cover layers 239 are provided with a transition layer 2311; or, each cover layer 239 is arranged sequentially along the thickness direction, there are two cover layers 239 that are directly connected, and there are also two cover layers 239 that are connected through a transition layer 2311.

[0313] In one embodiment, when there is one cover layer 239, a transition layer 2311 is coated on the side of the cover layer 239 facing away from the substrate 22; when there are two or more cover layers 239, the cover layer 239 furthest from the substrate 22 along the thickness direction of the substrate 22 is called the upper cover layer, and a transition layer 2311 is coated on the side of the upper cover layer facing away from the substrate 22.

[0314] In this embodiment, when the number of covering layers 239 is one, please refer to... Figure 25 A transition layer 2311 is coated on the side of the masking layer 239 facing away from the substrate 22, and then a paint layer or the like is coated on the transition layer 2311 to improve the stability of the film structure on the terminal structural member 2. Of course, it is preferable to coat the transition layer 2311 on the side of the masking layer 239 facing away from the substrate 22, but it is also possible not to coat the transition layer 2311 on the side of the masking layer 239 facing away from the substrate 22, and instead directly coat the paint layer or the like on the masking layer 239.

[0315] In this embodiment, when there are two or more masking layers 239, a transition layer 2311 is coated on the side of the upper masking layer (the masking layer 239 furthest from the substrate 22 is called the upper masking layer) facing away from the substrate 22, and then a paint layer or the like is coated on the transition layer 2311 to improve the stability of the film structure on the terminal structural member 2. Of course, it is preferable to coat the transition layer 2311 on the side of the upper masking layer facing away from the substrate 22, but the transition layer 2311 may not be coated on the side of the upper masking layer facing away from the substrate 22, and a paint layer or the like may be directly coated on the upper masking layer instead.

[0316] Preferably, the transition layer 2311 includes polyurethane and a masking filler, wherein the masking filler is dispersed in the polyurethane. In this case, the transition layer 2311 is also called a PU transition layer.

[0317] In one embodiment, an adhesive underlayer 2310 is first coated on the outer surface of the substrate 22, and then a cover layer 239 is coated.

[0318] Because the cover layer 239 is designed to be sandable and has a relatively high hardness, its adhesion performance is relatively poor. To ensure the stability of the film layer on the terminal device, an adhesive underlayer 2310 is first coated on the outer surface of the substrate 22, and then the cover layer 239 is coated.

[0319] In this embodiment, after the adhesive underlayer 2310 is coated, the masking layer 239 can be coated and the masking layer 239 can be polished to improve the hole markings.

[0320] In one embodiment, a surface treatment agent is coated on the outer surface of the substrate 22 as an adhesive underlayer 2310; or, a primer is coated on the outer surface of the substrate 22 as an adhesive underlayer 2310; or, a surface treatment agent layer and a primer layer are coated on the outer surface of the substrate 22 as an adhesive underlayer 2310.

[0321] Surface treatment agents and primers both improve adhesion.

[0322] After the antenna is printed on the surface of the substrate 22, a surface treatment agent can be coated on the outer surface of the substrate 22. The thickness of the surface treatment agent is preferably 1 to 5 μm.

[0323] After the antenna is printed on the surface of the substrate 22, a primer can also be applied to the outer surface of the substrate 22. The thickness of the primer is preferably 3 to 15 μm.

[0324] After the antenna is printed on the surface of the substrate 22, a surface treatment agent can be applied to the outer surface of the substrate 22 first, followed by a primer, or a primer can be applied to the outer surface of the substrate 22 first, followed by a surface treatment agent. The thickness of the surface treatment agent is preferably 1 to 5 μm, and the thickness of the primer is preferably 3 to 15 μm.

[0325] Based on the above content, see Figures 19-26 This embodiment provides the following eight specific embodiments of terminal structural components 2:

[0326] The substrate 22 of the terminal structural component 2 is made of PA+65%GF material. PA+65%GF is a composite material of polyamide and glass fiber, in which the glass fiber content is 65%. PA+65%GF is a crystalline material with a flexural modulus of 19-29 GPa and a flexural strength of 380 MPa, which is stronger than PC+20%GF (amorphous material). Therefore, PA+65%GF is selected for use in the terminal structural component to meet the requirements of high modulus, high strength and thinning of the terminal structural component.

[0327] A via antenna 25 is disposed on a substrate 22 made of PA+65%GF material. An adhesive underlayer 2310 is disposed on the substrate 22. The adhesive underlayer 2310 is a surface treatment agent or primer, or a layer of surface treatment agent and a layer of primer serving as the adhesive underlayer 2310. The UV topcoat layer 233 is a UV matte paint layer or a UV high-gloss paint layer. The PU cover layer 2391 refers to a cover layer 239 comprising PU resin material, and the UV cover layer 2392 refers to a cover layer 239 comprising UV resin material. The UV intermediate coat contains colorant.

[0328] (1) PA+65%GF material substrate 22+PDS+UV masking layer 2392+UV topcoat layer 233

[0329] See Figure 19 This illustrates the film layer 23 on the substrate 22. Figure 19 In the middle, from bottom to top, are PA+65%GF substrate 22, adhesive underlayer 2310, UV cover layer 2392, PU color paint layer 232, and UV topcoat layer 233.

[0330] The specific processing method is as follows: Wipe the PA+65%GF substrate 22 with alcohol and perform electrostatic dust removal; prepare the PDS via antenna 25; pad print PDS silver paste to prepare the PDS antenna 24; inspect the appearance and performance of the PDS; spray a surface treatment agent and / or primer, with a film thickness of 1-5μm for the treatment agent and 3-15μm for the primer, bake and cure to form the bonding underlayer 2310; spray a UV masking layer 2392, with a film thickness of 5-40μm, bake and cure, and polish the UV masking layer 2392; spray a PU paint, with a film thickness of 8-25μm, bake and cure to form the PU paint layer 232; spray a UV matte / high gloss paint, with a film thickness of 15-35μm, bake and cure to form the UV topcoat layer 233; CNC drilling; antenna performance testing.

[0331] (2) PA+65%GF material substrate 22+PDS+PU cover layer 2391+UV topcoat layer 233

[0332] See Figure 20 This illustrates the film layer 23 on the substrate 22. Figure 20 In the middle, from bottom to top, there are a substrate 22 made of PA+65%GF material, an adhesive underlayer 2310, a PU cover layer 2391, a PU color paint layer 232, and a UV topcoat layer 233.

[0333] The specific processing method is as follows: Wipe the PA+65%GF substrate 22 with alcohol and perform electrostatic dust removal; prepare the PDS via antenna 25; pad print PDS silver paste to prepare the PDS antenna 24; inspect the appearance and performance of the PDS; spray a surface treatment agent and / or primer, with a film thickness of 1-5μm for the treatment agent and 3-15μm for the primer, bake and cure to form the bonding underlayer 2310; spray a PU cover layer 2391, with a film thickness of 5-40μm, bake and cure, and polish the PU cover layer 2391; spray a PU color paint, with a film thickness of 5-20μm, bake and cure to form the PU color paint layer 232; spray a UV matte / high gloss paint, with a film thickness of 15-35μm, bake and cure to form the UV topcoat layer 233; CNC drilling; antenna performance testing.

[0334] (3) PA+65%GF material substrate 22+PDS+UV masking layer 2392+PU masking layer 2391+UV topcoat layer 233

[0335] See Figure 21 This illustrates the film layer 23 on the substrate 22. Figure 21 In the middle, from bottom to top, there are a substrate 22 made of PA+65%GF material, an adhesive underlayer 2310, a UV masking layer 2392, a PU masking layer 2391, a PU color paint layer 232, and a UV topcoat layer 233.

[0336] The specific processing method is as follows: Wipe the PA+65%GF substrate 22 with alcohol and perform electrostatic dust removal; prepare the PDS via antenna 25; pad print PDS silver paste to prepare the PDS antenna 24; inspect the appearance and performance of the PDS; spray a surface treatment agent and / or primer, with a film thickness of 1-5μm for the treatment agent and 3-15μm for the primer, bake and cure to form the bonding underlayer 2310; spray a UV masking layer 2392, with a film thickness of 5-40μm, bake and cure, and polish the UV masking layer 2392; spray a PU masking layer 2391, with a film thickness of 5-40μm, bake and cure, and polish the PU masking layer 2391; spray a PU color paint, with a film thickness of 5-20μm, bake and cure to form a PU color paint layer 232; spray a UV matte / high gloss paint, with a film thickness of 15-35μm, bake and cure to form a UV topcoat layer 233; CNC drilling; antenna performance testing.

[0337] (4) PA+65%GF material substrate 22+PDS+PU cover layer 2391+UV cover layer 2392+UV topcoat layer 233

[0338] See Figure 22 This illustrates the film layer 23 on the substrate 22. Figure 22 In the middle, from bottom to top, there are a substrate 22 made of PA+65%GF material, an adhesive underlayer 2310, a PU cover layer 2391, a UV cover layer 2392, a PU color paint layer 232, and a UV topcoat layer 233.

[0339] The specific processing method is as follows: Wipe the PA+65%GF substrate 22 with alcohol and perform electrostatic dust removal; prepare the PDS via antenna 25; pad print PDS silver paste to prepare the PDS antenna 24; inspect the appearance and performance of the PDS; spray a surface treatment agent and / or primer, with a film thickness of 1-5μm for the treatment agent and 3-15μm for the primer, bake and cure to form the bonding underlayer 2310; spray a PU cover layer 2391, with a film thickness of 5-40μm, bake and cure, and polish the PU cover layer 2391; spray a UV cover layer 2392, with a film thickness of 5-40μm, bake and cure, and polish the UV cover layer 2392; spray a PU color paint, with a film thickness of 5-20μm, bake and cure to form a PU color paint layer 232; spray a UV matte / high gloss paint, with a film thickness of 15-35μm, bake and cure to form a UV topcoat layer 233; CNC drilling; antenna performance testing.

[0340] (5) PA+65%GF material substrate 22+PDS+PU cover layer 2391+PU transition layer 2311+UV cover layer 2392+UV topcoat layer 233

[0341] See Figure 23 This illustrates the film layer 23 on the substrate 22. Figure 23 In the middle, from bottom to top, there are a substrate 22 made of PA+65%GF material, an adhesive bottom layer 2310, a PU cover layer 2391, a PU transition layer 2311, a UV cover layer 2392, a PU color paint layer 232, and a UV topcoat layer 233.

[0342] The specific processing method is as follows: Wipe the PA+65%GF substrate 22 with alcohol and perform electrostatic dust removal; prepare the PDS via antenna 25; pad print PDS silver paste to prepare the PDS antenna 24; inspect the appearance and performance of the PDS; spray a surface treatment agent and / or primer, with a treatment agent film thickness of 1-5μm and a primer film thickness of 3-15μm, bake and cure to form the bonding underlayer 2310; spray a PU masking layer 2391, with a film thickness of 5-40μm, bake and cure to cover the PU masking layer. Layer 2391 is sanded; PU transition layer 2311 is sprayed with a film thickness of 5-15μm and baked to cure; UV masking layer 2392 is sprayed with a film thickness of 5-40μm and baked to cure, and the UV masking layer 2392 is sanded; PU paint is sprayed with a film thickness of 5-20μm and baked to cure, forming PU paint layer 232; UV matte / high gloss paint is sprayed with a film thickness of 15-35μm and baked to cure, forming UV topcoat layer 233; CNC drilling is performed; antenna performance is tested.

[0343] (6) PA+65%GF material substrate 22+PDS+PU cover layer 2391+Indium plating layer 236+UV topcoat layer 233

[0344] See Figure 24 This illustrates the film layer 23 on the substrate 22. Figure 24 In the middle, from bottom to top, there are a substrate made of PA+65%GF material 22, an adhesive underlayer 2310, a PU cover layer 2391, a UV primer layer 235, an indium plating layer 236, a UV intermediate coat layer 237, and a UV topcoat layer 233.

[0345] The specific processing method is as follows: Wipe the PA+65%GF substrate 22 with alcohol and perform electrostatic dust removal; prepare the PDS via antenna 25; pad print PDS silver paste to prepare the PDS antenna 24; inspect the appearance and performance of the PDS; spray a surface treatment agent and / or primer, with the treatment agent film thickness being 1-5μm and the primer film thickness being 3-15μm, bake and cure to form the bonding underlayer 2310; spray a PU masking layer 2391, with a film thickness of 5-40μm, and bake... Baking and curing; sanding the PU cover layer 2391; spraying UV primer, 15-40μm thick, baking and curing to form UV primer layer 235; electroplating indium to form indium plating layer 236; spraying UV intermediate coat, 5-12μm thick, baking and curing to form UV intermediate coat layer 237; spraying UV matte / high gloss paint, 15-35μm thick, baking and curing to form UV topcoat layer 233; CNC drilling; antenna performance testing.

[0346] (7) PA+65%GF material substrate 22+PDS+PU cover layer 2391+PU transition layer 2311+Indium plating layer 236+UV topcoat layer 233

[0347] See Figure 25This illustrates the film layer 23 on the substrate 22. Figure 25 In the middle, from bottom to top, there are: a substrate made of PA+65%GF material 22, an adhesive underlayer 2310, a PU cover layer 2391, a PU transition layer 2311, a UV primer layer 235, an indium plating layer 236, a UV intermediate coat layer 237, and a UV topcoat layer 233.

[0348] The specific processing method is as follows: Wipe the PA+65%GF substrate 22 with alcohol and perform electrostatic dust removal; prepare the PDS via antenna 25; pad print PDS silver paste to prepare the PDS antenna 24; inspect the appearance and performance of the PDS; spray a surface treatment agent and / or primer, with a treatment agent film thickness of 1-5μm and a primer film thickness of 3-15μm, bake and cure to form the bonding underlayer 2310; spray a PU masking layer 2391, with a film thickness of 5-40μm, bake and cure, and apply the PU masking layer 23... 91. Polishing; Spraying PU transition layer 2311, film thickness 5-20μm, baking and curing; Spraying UV primer, film thickness 15-40μm, baking and curing, UV primer layer 235; Electroplating indium to form indium plating layer 236; Spraying UV intermediate coat, film thickness 5-12μm, baking and curing, forming UV intermediate coat layer 237; Spraying UV matte / high gloss paint, film thickness 15-35μm, baking and curing, forming UV topcoat layer 233; CNC drilling; Antenna performance testing.

[0349] (8) PA+65%GF material substrate 22+PDS+UV masking layer 2392+PU transition layer 2311+Indium plating layer 236+UV topcoat layer 233

[0350] See Figure 26 This illustrates the film layer 23 on the substrate 22. Figure 26 In the middle, from bottom to top, there are: a PA+65%GF material substrate 22, an adhesive underlayer 2310, a UV cover layer 2392, a PU transition layer 2311, a UV primer layer 235, an indium plating layer 236, a UV intermediate coat layer 237, and a UV topcoat layer 233.

[0351] The specific processing method is as follows: Wipe the PA+65%GF substrate 22 with alcohol and perform electrostatic dust removal; prepare the PDS via antenna 25; pad print PDS silver paste to prepare the PDS antenna 24; inspect the appearance and performance of the PDS; spray a surface treatment agent and / or primer, with a treatment agent film thickness of 1-5μm and a primer film thickness of 3-15μm, bake and cure to form the bonding underlayer 2310; spray a UV masking layer 2392, with a film thickness of 5-40μm, bake and cure, and apply the UV masking layer 23. 92. Polishing; Spraying PU transition layer 2311, film thickness 5-20μm, baking and curing; Spraying UV primer, film thickness 15-40μm, baking and curing, UV primer layer 235; Electroplating indium to form indium plating layer 236; Spraying UV intermediate coat, film thickness 5-12μm, baking and curing, forming UV intermediate coat layer 237; Spraying UV matte / high gloss paint, film thickness 15-35μm, baking and curing, forming UV topcoat layer 233; CNC drilling; Antenna performance testing.

[0352] Based on the above content, a specific embodiment of a method for manufacturing a terminal structural component 2 is provided, including the following:

[0353] Step 1: PDS via + grinding process

[0354] At the antenna via 221, a thickness of 0.3-0.35mm is reserved for injection molding. The laser is used to penetrate the via from the inside to the outside of the substrate 22, with a diameter of 0.1-0.15mm. The burrs inside the hole are removed with a steel needle (microscopic observation shows no burrs or impurities in the through hole). The conductive paste is slowly poured into the antenna via 221 to prevent bubbles from forming during the pouring process. The via is then placed in an oven at 90-120℃ for 1-2 hours to cure. Finally, the raised silver paste on the outer surface of the substrate 22 is polished with 3000-grit sandpaper.

[0355] Step 2: Steel Plate Fabrication

[0356] Based on the antenna drawings, the steel plate surface is subjected to film and etching processes to create grooves of different depths, with a groove depth tolerance of ±1.0-2.5.

[0357] Step 3: PDS silver paste pad printing process

[0358] Add 2-3% diluent to the conductive silver paste, stir for 15-25 minutes to mix evenly, then pour it onto the pad printing equipment. The silver paste is scraped into the groove of the steel plate. Under a certain pressure, the pad printing head (35+ / -5HA) picks up the silver paste in the groove according to the groove pattern. After hot air surface drying for 1-2 seconds, under a certain pressure, the silver paste is transferred from the pad printing head to the outer and inner surfaces of the through-hole substrate 22. Place it in an oven and bake at 90-140℃ for 2-4 hours to cure.

[0359] Step 4: PDS antenna film thickness analysis and resistance test

[0360] PDS film thickness analysis and resistance measurement were performed using glue-filled sections, and PDS environmental testing was also conducted.

[0361] Step 5: Spraying and sanding processes

[0362] Spraying various film layers 23, wherein each film layer 23 includes several of the following: adhesive undercoat 2310, PU color paint layer 232, PU masking layer 2391, UV masking layer 2392, UV intermediate coat 237, UV topcoat layer 233, and UV primer layer 235. For example, the baking temperature of PU color paint layer 232 is 75-85℃, and the baking time is 10-20 minutes; the baking temperature of PU masking layer 2391 is 75-85℃, and the baking time is 30-60 minutes; the baking temperature of UV masking layer 2392, UV intermediate coat 237, and UV topcoat layer 233 is 55-65℃, and the baking time is 5 minutes.

[0363] The PU cover layer 2391 and the UV cover layer 2392 are polished smooth by alternating sanding with 1500 grit / 3000 grit sandpaper.

[0364] Step 6: Film thickness analysis and testing (adhesion, boiling water, etc.).

[0365] See Figures 27-31 , Figure 27 It is a simplified cross-sectional view of the terminal structural component. Figure 9 , Figure 28 It is a simplified cross-sectional view of the terminal structural component. Figure 10 , Figure 29 It is a simplified cross-sectional view of the terminal structural component. Figure 10 one, Figure 30 It is a simplified cross-sectional view of the terminal structural component. Figure 10 two, Figure 31 It is a simplified cross-sectional view of the terminal structural component. Figure 10 three.

[0366] In one embodiment, the substrate 22 is a two-color injection molded substrate and a transparent material region 226 is formed on the substrate 22; the film layer includes an adhesive underlayer 2310, a topcoat layer and a transparent treatment layer 2312, the adhesive underlayer 2310 is the innermost layer of the film layer, the topcoat layer is the outermost layer of the film layer, the inner side of the topcoat layer is connected to the transparent treatment layer 2312, and laser engraving is performed on the coating between the transparent treatment layer 2312 and the adhesive underlayer 2310, and the laser engraved area corresponds to the transparent material region 226.

[0367] Watch 1 includes a vital signs sensor housed within the casing 11. The vital signs sensor includes a light emitting element and a light receiving element. The light emitting element emits light towards the user's skin through a transparent material area 226. A portion of the light is absorbed by the user's skin, and another portion is reflected. The reflected portion of the light is received by the light receiving element.

[0368] The substrate 22 is made by two-color injection molding. For example, the substrate 22 is made by two-color injection molding of PA+20-75%GF and PC. The PC material on the substrate 22 forms a transparent material area 226.

[0369] For example, the transparent treatment layer 2312 is a transparent treatment agent, or a transparent treatment agent and a transparent UV coating are used to form the transparent treatment layer 2312.

[0370] Preferably, when the transparent treatment layer 2312 is a transparent treatment agent, the thickness of the transparent treatment layer 2312 is in the range of 2 to 12 μm.

[0371] Preferably, a transparent treatment layer 2312 is formed by a transparent treatment agent and a transparent UV coating layer, wherein the thickness of the transparent treatment layer 2312 is in the range of 2 to 12 μm, and the thickness of the transparent UV coating layer is in the range of 15 to 30 μm.

[0372] In this embodiment, the film layer typically does not include the indium plating layer 236.

[0373] For example, see Figure 27 This illustrates the film layer 23 on the substrate 22. Figure 27 In the middle, from bottom to top, there are substrate 22, adhesive bottom layer 2310, UV cover layer 2392, PU paint layer 232, transparent treatment layer 2312, and UV topcoat layer 233. A transparent material area 226 is formed on the substrate 22, and the areas of the UV cover layer 2392 and the PU paint layer 232 corresponding to the transparent material area 226 are laser-engraved.

[0374] For example, see Figure 28 This illustrates the film layer 23 on the substrate 22. Figure 28 In the middle, from bottom to top, there are substrate 22, adhesive bottom layer 2310, PU cover layer 2391, PU paint layer 232, transparent treatment layer 2312, and UV topcoat layer 233. A transparent material area 226 is formed on the substrate 22, and the areas of the PU cover layer 2391 and the PU paint layer 232 corresponding to the transparent material area 226 are laser-engraved.

[0375] For example, see Figure 29 This illustrates the film layer 23 on the substrate 22. Figure 29In the middle, from bottom to top, there are substrate 22, adhesive bottom layer 2310, UV cover layer 2392, PU cover layer 2391, PU paint layer 232, transparent treatment layer 2312, and UV topcoat layer 233. A transparent material area 226 is formed on the substrate 22. The areas of the UV cover layer 2392, PU cover layer 2391, and PU paint layer 232 corresponding to the transparent material area 226 are laser-engraved.

[0376] For example, see Figure 30 This illustrates the film layer 23 on the substrate 22. Figure 30 In the middle, from bottom to top, there are substrate 22, adhesive bottom layer 2310, PU cover layer 2391, UV cover layer 2392, PU paint layer 232, transparent treatment layer 2312, and UV topcoat layer 233. A transparent material area 226 is formed on the substrate 22. The areas of the PU cover layer 2391, UV cover layer 2392, and PU paint layer 232 corresponding to the transparent material area 226 are laser-engraved.

[0377] For example, see Figure 31 This illustrates the film layer 23 on the substrate 22. Figure 31 In the middle, from bottom to top, there are substrate 22, adhesive bottom layer 2310, PU cover layer 2391, PU transition layer 2311, UV cover layer 2392, PU paint layer 232, transparent treatment layer 2312, and UV topcoat layer 233. Among them, a transparent material area 226 is formed on substrate 22, and the areas of PU cover layer 2391, PU transition layer 2311, UV cover layer 2392, and PU paint layer 232 corresponding to the transparent material area 226 are laser engraved.

[0378] The terminal structure 2 will be described in detail below with reference to the accompanying drawings.

[0379] See Figures 19-31 , Figure 19 It is a simplified cross-sectional view of the terminal structural component. Figure 1 , Figure 20 It is a simplified cross-sectional view of the terminal structural component. Figure 2 , Figure 21 It is a simplified cross-sectional view of the terminal structural component. Figure 3 , Figure 22 It is a simplified cross-sectional view of the terminal structural component. Figure 4 , Figure 23 It is a simplified cross-sectional view of the terminal structural component. Figure 5 , Figure 24 It is a simplified cross-sectional view of the terminal structural component. Figure 6 , Figure 25 It is a simplified cross-sectional view of the terminal structural component. Figure 7 , Figure 26 It is a simplified cross-sectional view of the terminal structural component. Figure 8 ; Figure 27It is a simplified cross-sectional view of the terminal structural component. Figure 9 ; Figure 28 It is a simplified cross-sectional view of the terminal structural component. Figure 10 ; Figure 29 It is a simplified cross-sectional view of the terminal structural component. Figure 10 one; Figure 30 It is a simplified cross-sectional view of the terminal structural component. Figure 10 two; Figure 31 It is a simplified cross-sectional view of the terminal structural component. Figure 10 three.

[0380] This embodiment provides a terminal structure 2, which is manufactured using the fabrication method provided in any of the above embodiments. The terminal structure 2 includes a substrate 22, a planar antenna, and multiple film layers 23. One or more via antennas 25 are disposed on the substrate 22. Planar antennas are printed on the inner and outer surfaces of the substrate 22. Multiple film layers 23 are disposed on the outer surface side of the substrate 22, and each film layer 23 includes one or more polishable cover layers 239.

[0381] When fabricating the via antenna 25, it needs to protrude from the outer surface of the substrate 22. During the processing of the film layer 23 on the outer surface of the substrate 22, a polishable cover layer 239 is provided. The conductive paste protruding from the antenna via 221 forms a raised mark on the cover layer 239. Polishing the cover layer 239 can improve this mark. When other coatings are subsequently applied to the cover layer 239, the influence of the via antenna 25 on these coatings can be avoided. Therefore, while the via antenna 25 can improve GPS, Bluetooth, and LTE signals, it does not affect the appearance of the terminal component 2.

[0382] In one embodiment, an adhesive underlayer 2310 is first coated on the outer surface of the substrate 22, and then a cover layer 239 is coated.

[0383] Because the cover layer 239 is designed to be sandable and has a relatively high hardness, its adhesion performance is relatively poor. To ensure the stability of the film layer 23 structure on the terminal device, an adhesive underlayer 2310 is first coated on the outer surface of the substrate 22, and then the cover layer 239 is coated.

[0384] Preferably, a surface treatment agent is coated on the outer surface of the substrate 22 as an adhesive underlayer 2310; or, a primer is coated on the outer surface of the substrate 22 as an adhesive underlayer 2310; or, a surface treatment agent layer and a primer layer are coated on the outer surface of the substrate 22 as an adhesive underlayer 2310.

[0385] In one embodiment, there are two or more masking layers 239, one of which is coated on top of another masking layer 239, or a transition layer 2311 is first coated on one masking layer 239, and then another masking layer 239 is coated on the transition layer 2311. The transition layer 2311 is used to improve the bonding force between the two masking layers 239.

[0386] In this embodiment, the number of masking layers 239 can be set to two. Two masking layers 239, while satisfying the requirement of improving hole markings, will not make the thickness of the film layer 23 on the terminal structure 2 too thick. Of course, the number of masking layers 239 is preferably two, but the number of masking layers 239 is not limited to only two, and can also be three or more.

[0387] See Figure 22 One of the masking layers 239 is coated on top of another masking layer 239.

[0388] See Figure 23 This illustrates that a transition layer 2311 is first applied to a cover layer 239, and then another cover layer 239 is applied to the transition layer 2311. Because the cover layer 239 is designed to be sandable and has a relatively high hardness, its adhesion is relatively poor. To improve the stability of the film structure on the terminal component 2, a transition layer 2311 is provided between the two cover layers 239. The transition layer 2311 improves the stability of the connection between the two cover layers 239.

[0389] Preferably, the transition layer 2311 includes polyurethane and a masking filler, wherein the masking filler is dispersed in the polyurethane. In this case, the transition layer 2311 is also called a PU transition layer.

[0390] In one embodiment, when there is one cover layer 239, a transition layer 2311 is coated on the side of the cover layer 239 facing away from the substrate 22; when there are two or more cover layers 239, the cover layer 239 furthest from the substrate 22 along the thickness direction of the substrate 22 is called the upper cover layer, and a transition layer 2311 is coated on the side of the upper cover layer facing away from the substrate 22.

[0391] In this embodiment, see Figure 25 When there is only one masking layer 239, a transition layer 2311 is coated on the side of the masking layer 239 facing away from the substrate 22, and then a color paint layer or the like is coated on the transition layer 2311 to facilitate the stability of the film structure on the terminal structural component 2.

[0392] In this embodiment, when there are two masking layers 239, a transition layer 2311 is coated on the side of the upper masking layer away from the substrate 22, and then a color paint layer or the like is coated on the transition layer 2311 to facilitate the stability of the film structure on the terminal structural component 2.

[0393] In one embodiment, film 23 includes an indium-plated layer 236.

[0394] Indium plating is generally achieved by electrolysis to deposit indium onto a surface to form an indium film, thereby improving corrosion resistance and appearance.

[0395] See Figures 24-26 The diagram illustrates the indium plating layer 236. When the indium plating layer 236 is provided, a UV primer layer 235 is also provided below the indium plating layer 236, a UV intermediate coating layer 237 is provided above the indium plating layer 236, and a UV topcoat layer 238 is provided above the UV intermediate coating layer 237.

[0396] In one embodiment, the surface of the terminal structure 2 is matte or glossy.

[0397] In this embodiment, see Figures 19-31 The outermost layer of the terminal structural component 2 is a UV topcoat layer 238. The UV topcoat has different gloss levels, including matte, semi-matte, and glossy. Preferably, the surface of the terminal structural component 2 is matte or glossy.

[0398] In one embodiment, see Figures 27-31 A transparent material region 226 is formed on the substrate 22. The film layer 23 includes a topcoat layer and a transparent treatment layer 2312. The topcoat layer is the outermost layer of the film layer 23. The inner side of the topcoat layer is connected to the transparent treatment layer 2312. Laser engraving is performed on the coating between the transparent treatment layer 2312 and the adhesive substrate 2310, and the laser engraved area corresponds to the transparent material region 226.

[0399] In one embodiment, the thickness of the antenna printed on the outer surface of the substrate 22 is no greater than 16 μm.

[0400] In one embodiment, see Figure 18 The angle between any two adjacent sides of the outer plane antenna 241 is rounded 2411.

[0401] A terminal device includes the terminal structure component 2 provided in any of the embodiments described above.

[0402] Terminal devices include, but are not limited to, handheld devices, in-vehicle devices, wearable devices, computing devices, or other processing devices connected to a wireless modem. For example, terminal devices may include smartwatches, smart wristbands, smartphones, personal digital assistant (PDA) computers, tablet computers, laptop computers, in-vehicle computers, smart glasses, and other terminal devices that require a via antenna 25 to be provided on the terminal structure 2.

[0403] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for manufacturing a terminal structural component, characterized in that, Includes the following: Antenna vias are fabricated on the substrate of the terminal structure, and conductive paste is injected into the antenna vias and solidified to form a via antenna, wherein the solidified conductive paste protrudes from the outer surface of the substrate. An antenna is disposed on the surface of the substrate; A film layer is processed on the outer surface of the substrate, the film layer including at least one sandable masking layer, which can be sanded to improve the marking of the antenna via.

2. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, Before the antenna is mounted on the surface of the substrate, the solidified conductive paste is polished.

3. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, The conductive paste injected into the antenna via is called via paste, and the paste used to prepare the antenna on the substrate surface is called surface paste. The viscosity of the through-hole slurry is less than that of the surface slurry, and / or the solvent content of the through-hole slurry is less than that of the surface slurry.

4. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, The conductive slurry injected into the antenna via is a via slurry, and the viscosity of the via slurry is in the range of 15000-25000cps.

5. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, The conductive slurry injected into the antenna via is a via slurry, and the solvent content of the via slurry ranges from 0 to 15%.

6. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, The conductive paste injected into the antenna via is a via paste, and the curing shrinkage rate of the via paste is less than 1%.

7. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, The conductive paste injected into the antenna via is a via paste, and the coefficient of thermal expansion of the via paste is less than 30 × 10⁻⁶. -6 / K.

8. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, The diameter of the antenna via is no greater than 0.15 mm.

9. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, The area on the substrate where antenna vias need to be processed is called the via area. The substrate is injection molded and the inner side of the via area is injection molded with a recess.

10. The method for manufacturing the terminal structural component as described in claim 9, characterized in that, The height of the via region along the thickness direction of the substrate is 0.1 to 0.5 mm.

11. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, The antenna via is one or more; The antenna via is fabricated in a planar region of the substrate; And / or, the antenna via is machined in the arcuate region of the substrate; And / or, a raised region is formed on the substrate, and the antenna via is machined on the side of the raised region in the circumferential direction.

12. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, The thickness of the antenna printed on the outer surface of the substrate is no greater than 16 μm.

13. The method for manufacturing the terminal structural component as described in claim 1, characterized in that, The antenna printed on the outer surface of the substrate is called the planar outer antenna, and the angle between any two adjacent sides of the planar outer antenna is a rounded corner.

14. The method for manufacturing the terminal structural component as described in any one of claims 1-13, characterized in that, The material of the covering layer includes polyurethane resin, or the material of the covering layer includes UV resin.

15. The method for manufacturing the terminal structural component as described in claim 14, characterized in that, The pigment-to-binder ratio of the covering layer is 1:1 to 1:

2.

16. The method for manufacturing the terminal structural component as described in claim 14, characterized in that, The hydroxyl content of the resin in the covering layer is ≥1.

0.

17. The method for manufacturing the terminal structural component as described in claim 14, characterized in that, The covering layer comprises difunctional resin and hexafunctional resin.

18. The method for manufacturing the terminal structural component as described in any one of claims 1-13, characterized in that, The thickness of the covering layer ranges from 5 to 40 μm.

19. The method for manufacturing the terminal structural component as described in any one of claims 1-13, characterized in that, The number of the masking layers is two or more, with one masking layer applied on top of another masking layer, or a transition layer is first applied on one masking layer, and then another masking layer is applied on the transition layer.

20. The method for manufacturing the terminal structural component as described in any one of claims 1-13, characterized in that, When there is one cover layer, a transition layer is coated on the side of the cover layer facing away from the substrate; when there are two or more cover layers, the cover layer furthest from the substrate along the thickness direction of the substrate is called the upper cover layer, and a transition layer is coated on the side of the upper cover layer facing away from the substrate.

21. The method for manufacturing the terminal structural component as described in any one of claims 1-13, characterized in that, The outer surface of the substrate is first coated with an adhesive underlayer, and then coated with the masking layer. A surface treatment agent is coated on the outer surface of the substrate to serve as the adhesive underlayer. Alternatively, a primer may be applied to the outer surface of the substrate to serve as the adhesive underlayer; Alternatively, a surface treatment agent layer and a primer layer may be coated on the outer surface of the substrate to serve as the adhesive underlayer.

22. The method for manufacturing the terminal structural component as described in any one of claims 1-13, characterized in that, The substrate is a two-color injection molded substrate with a transparent material area formed on it; the film layer includes an adhesive underlayer, a topcoat layer and a transparent treatment layer, the adhesive underlayer is the innermost layer of the film layer, the topcoat layer is the outermost layer of the film layer, the inner side of the topcoat layer is connected to the transparent treatment layer, and laser engraving is performed on the coating between the transparent treatment layer and the adhesive underlayer, and the laser engraved area corresponds to the transparent material area.

23. A terminal structural component, characterized in that, The terminal structure is manufactured using the manufacturing method of any one of claims 1-22, wherein the terminal structure includes a substrate, a planar antenna, and a film layer, wherein one or more via antennas are disposed on the substrate, the planar antennas are printed on the inner and outer surfaces of the substrate, the film layer is disposed on the outer surface side of the substrate, and the film layer includes one or more grindable masking layers.

24. The terminal structural component as described in claim 23, characterized in that, The film layer includes an indium-plated layer.

25. The terminal structural component as described in claim 23, characterized in that, The surface of the terminal structural component is either matte or glossy.

26. A terminal device, characterized in that, Includes the terminal structure as described in any one of claims 23-25.

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