Display device and method of manufacturing same

Abstract

A display device and a method of manufacturing the same are provided. The display device includes a first substrate and a second substrate facing the first substrate. The first substrate includes: a first support substrate including emission regions arranged side by side and a non-emission region between the emission regions; an element layer disposed on the first support substrate and including a light emitting element disposed in the emission region; an encapsulation layer disposed on the element layer; and a color conversion layer disposed on the encapsulation layer and converting a wavelength range of light emitted from some of the light emitting elements. The color conversion layer includes a light recovery part disposed in a portion of the non-emission region.

Description

TECHNICAL FIELD

[0001] The disclosure relates to a display device and a method of manufacturing a display device. BACKGROUND

[0002] As the information society develops, the demand for display devices for displaying images is increasing in various forms. For example, display devices are applied to various electronic devices such as smart phones, digital cameras, laptop computers, navigation devices, and smart TVs.

[0003] The display device can be a flat panel display device such as a liquid crystal display ("LCD") device, a field emission display ("FED") device, or a light emitting display device. Here, the light emitting display device can include an organic light emitting display device including an organic light emitting element, an inorganic light emitting display device including an inorganic light emitting element including, for example, an inorganic semiconductor, and a micro light emitting display device including a micro light emitting element.

[0004] The organic light emitting display device displays an image using light emitting elements each including a light emitting layer of an organic light emitting material. Since the organic light emitting display device uses a self-emitting element to implement image display, it can have relatively superior performance in power consumption, response speed, light emitting efficiency, brightness, and wide viewing angle compared to other display devices.

[0005] The display surface of the display device, from which light is emitted, can include a display area displaying an image and a non-display area around the display area. In the display area, emission areas emitting light having respective brightness and colors can be arranged. SUMMARY

[0006] The display device can include a color conversion layer converting light emitted from at least some of the light emitting elements into a different wavelength range of light or transmitting light emitted from at least some of the light emitting elements.

[0007] The color conversion layer can include an ink material converting a wavelength range of light.

[0008] The process of providing the color conversion layer can include an inkjet process of partially jetting the ink material into an inkjet area overlapping at least some of the emission areas.

[0009] However, during the inkjet process, there is a limit in reducing the width of the inkjet area due to the margin of the jetting device. This can limit the relatively high resolution of the display device.

[0010] Features of the disclosure provide a display device that can be advantageous in implementing a relatively high resolution and a method of manufacturing a display device.

[0011] However, features of the present disclosure are not limited to the features set forth herein. The above and other features of the present disclosure will become more apparent to one of ordinary skill in the art from the following detailed description of the present disclosure given by reference to the accompanying drawings.

[0012] In an embodiment of the disclosure, a display device including a first substrate and a second substrate facing the first substrate is provided. The first substrate includes a first support substrate including emission regions arranged side by side and non-emission regions between the emission regions, an element layer disposed on the first support substrate and including light emitting elements disposed in the emission regions, an encapsulation layer disposed on the element layer, and a color conversion layer disposed on the encapsulation layer and converting a wavelength range of light emitted from some of the light emitting elements. The color conversion layer can include a light recycling member disposed in a portion of the non-emission regions.

[0013] In an embodiment, the emission regions can include a first emission region emitting light in a first wavelength range, a second emission region emitting light in a second wavelength range lower than the first wavelength range, and a third emission region emitting light in a third wavelength range lower than the second wavelength range. The non-emission regions can include a first margin region connected to a portion of the first emission region, and a second margin region connected to a portion of the second emission region. The light emitting elements can emit light in a fourth wavelength range equal to or lower than the third wavelength range. The color conversion layer can include a first color conversion portion disposed in the first emission region and the first margin region and converting the light in the fourth wavelength range into light in the first wavelength range, a second color conversion portion disposed in the second emission region and the second margin region and converting the light in the fourth wavelength range into light in the second wavelength range, a light transmission portion disposed in the third emission region and transmitting and scattering the light in the fourth wavelength range, and a partition portion disposed between the first color conversion portion, the second color conversion portion, and the light transmission portion. The light recycling member can be disposed in the first margin region and the second margin region.

[0014] In an embodiment, the partition portion can include a first partition wall disposed between the first color conversion portion, the second color conversion portion, and the light transmission portion, a reflection wall covering a side surface of the first partition wall and reflecting light, and a second partition wall disposed on the first partition wall and having a hydrophobicity.

[0015] In an embodiment, the second substrate can include a second support substrate facing the first substrate and including the emission area and the non-emission area, a color filter layer disposed on one surface of the second support substrate, and a color filter cover layer covering the color filter layer. The color filter layer can include a first filter portion disposed in the first emission area and transmitting light in a first wavelength range, a second filter portion disposed in the second emission area and transmitting light in a second wavelength range, a third filter portion disposed in the third emission area and transmitting light in a third wavelength range, and a light blocking portion disposed in the non-emission area and blocking light. The light recycling member can overlap the light blocking portion.

[0016] In an embodiment, the display device can further include a spacer disposed between the first substrate and the second substrate, and a filling layer disposed between the first substrate and the second substrate. The first substrate can further include a color conversion cover layer covering the color conversion layer. The spacer and the filling layer can be disposed between the color conversion cover layer and the color filter cover layer. The spacer can overlap one or more of the first margin area and the second margin area.

[0017] In an embodiment, the light recycling member can include a reflection layer disposed on the first color conversion portion in the first margin area and the second color conversion portion in the second margin area and reflecting light.

[0018] In an embodiment, the light recycling member can include a scattering portion disposed on the first color conversion portion in the first margin area and the second color conversion portion in the second margin area and scattering light. The scattering portion can overlap a portion of the partition portion between the first color conversion portion and the second color conversion portion. The scattering portion can include a base resin having a light-transmitting property and scattering particles dispersed in the base resin.

[0019] In an embodiment, the light-transmitting portion can be provided together with the scattering portion, and can include a base resin and scattering particles.

[0020] In an embodiment, the light recycling member can further include an additional reflection layer disposed on the scattering portion and reflecting light.

[0021] In an embodiment, the light recycling member can include an extended reflection layer extending from the reflection wall and disposed on the encapsulation layer.

[0022] In an embodiment, the first substrate can further include a circuit layer disposed on the first support substrate and including emission pixel drivers electrically connected to the light emitting elements. The element layer can be disposed on the circuit layer. The element layer can include an anode electrode disposed in the emission region, a pixel definition layer disposed in the non-emission region and covering edges of the anode electrode, a light emitting layer disposed on the anode electrode and the pixel definition layer, and a cathode electrode disposed on the light emitting layer. Each of the light emitting elements can have a structure in which the light emitting layer is interposed between the anode electrode and the cathode electrode facing each other.

[0023] In an embodiment of the disclosure, there is provided a method of manufacturing a display device, the method including preparing a first substrate, preparing a second substrate, disposing a filling layer on the first substrate or the second substrate, and bonding the first substrate and the second substrate. The preparing of the first substrate includes preparing a first support substrate including emission regions arranged side by side and non-emission regions between the emission regions, disposing a circuit layer on the first support substrate, disposing an element layer on the circuit layer, the element layer including light emitting elements disposed in the emission regions, disposing an encapsulation layer on the element layer, disposing a color conversion layer on the encapsulation layer, and disposing a color conversion cover layer covering the color conversion layer. After the disposing of the color conversion layer, the color conversion layer can include a light recycling member disposed in a portion of the non-emission regions.

[0024] In an embodiment, in the preparing of the first support substrate, the emission regions can include first emission regions emitting light in a first wavelength range, second emission regions emitting light in a second wavelength range lower than the first wavelength range, and third emission regions emitting light in a third wavelength range lower than the second wavelength range, and the non-emission regions can include a first margin region connected to a portion of the first emission regions and a second margin region connected to a portion of the second emission regions. In the disposing of the element layer, the light emitting elements can emit light in a fourth wavelength range equal to or lower than the third wavelength range. The disposing of the color conversion layer can include disposing a division portion in the entire non-emission regions except for the first margin region and the second margin region, disposing a first color conversion portion converting light in the fourth wavelength range into light in the first wavelength range in the first emission regions and the first margin region, disposing a second color conversion portion converting light in the fourth wavelength range into light in the second wavelength range in the second emission regions and the second margin region, and disposing a light transmission portion transmitting and scattering light in the fourth wavelength range in the third emission regions.

[0025] In an embodiment, after the disposing of the light-transmissive portion, a partition portion can be disposed between the first color conversion portion, the second color conversion portion, and the light-transmissive portion. The disposing of the partition portion can include disposing a first partition wall in the entire non-emission region except for the first and second margin regions, disposing a light-reflecting reflection wall on a side of the first partition wall, and disposing a second partition wall having a hydrophobic property on at least a portion of a top surface of the first partition wall.

[0026] In an embodiment, in the disposing of the reflection wall, an extended reflection layer extending from the reflection wall can be disposed in the first and second margin regions. The light-recycling member can include the extended reflection layer.

[0027] In an embodiment, the preparing of the second substrate can include preparing a second support substrate including an emission region and a non-emission region, disposing a color filter layer on one surface of the second support substrate, and disposing a light filter cover layer covering the color filter layer. The disposing of the color filter layer can include disposing a second light filter portion transmitting light in a second wavelength range in the second emission region and the non-emission region, disposing a first light filter portion transmitting light in a first wavelength range in the first emission region and the non-emission region, and disposing a third light filter portion transmitting light in a third wavelength range in the third emission region and the non-emission region. After the disposing of the color filter layer, the color filter layer can include a light-blocking portion having a structure in which the first, second, and third light filter portions overlap each other. After the bonding of the first and second substrates, the light-recycling member can overlap the light-blocking portion.

[0028] In an embodiment, the preparing of the second substrate can further include disposing spacers spaced apart from each other on the light filter cover layer. After the bonding of the first and second substrates, the spacers and the filling layer can be disposed between the color conversion cover layer and the light filter cover layer. The spacers can overlap one or more of the first and second margin regions.

[0029] In an embodiment, the disposing of the color conversion layer can further include, after the disposing of the light-transmissive portion, disposing a reflection layer reflecting light on the first color conversion portion in the first margin region and the second color conversion portion in the second margin region. The light-recycling member can include the reflection layer.

[0030] In an embodiment, in the disposing of the light-transmissive portion, a scattering portion scattering light can be disposed on the first color conversion portion in the first margin region and the second color conversion portion in the second margin region. The scattering portion can overlap a portion of the partition portion between the first and second color conversion portions. The light-transmissive portion and the scattering portion can each include a base resin having a light-transmissive property and scattering particles dispersed in the base resin. The light-recycling member can include the scattering portion.

[0031] In an embodiment, the disposing of the color conversion layer can further include: after the disposing of the light-transmissive portion, disposing an additional reflection layer that reflects light on the scattering portion. The light recycling component can include the additional reflection layer.

[0032] In an embodiment of the disclosure, a display device includes first and second substrates facing each other. The first substrate includes: a first support substrate including emission regions arranged side by side and non-emission regions between the emission regions; an element layer disposed on the first support substrate and including light emitting elements disposed in the emission regions; an encapsulation layer disposed on the element layer; and a color conversion layer disposed on the encapsulation layer and converting a wavelength range of light emitted from some of the light emitting elements. The color conversion layer can include a light recycling component disposed in a portion of the non-emission regions.

[0033] In an embodiment, the color conversion layer can include: a first color conversion portion disposed in the first emission region and the first margin region; a second color conversion portion disposed in the second emission region and the second margin region; and a light-transmissive portion disposed in the third emission region.

[0034] Accordingly, since the first color conversion portion is disposed not only in the first emission region but also in the first margin region of the non-emission region, the width of the first emission region can be smaller than the margin of the jetting device. Also, since the second color conversion portion is disposed not only in the second emission region but also in the second margin region of the non-emission region, the width of the second emission region can be smaller than the margin of the jetting device.

[0035] Accordingly, the width of the emission region can be reduced regardless of the margin of the jetting device, which can be advantageous in realizing a relatively high resolution in the display device.

[0036] According to an embodiment of the disclosure, the light recycling component can be disposed in the first and second margin regions.

[0037] In this way, due to the light recycling component disposed in the first margin region, at least some of the light incident into the first margin region can be reflected and introduced into the first emission region, and then can be emitted through the first emission region. That is, the light incident into the first margin region is not completely extinguished or absorbed in the first margin region, but can be partially recycled through the light recycling component in the first margin region.

[0038] Further, due to the light recycling member provided in the second margin region, at least some of the light incident into the second margin region can be reflected and introduced into the second emission region, and then emitted through the second emission region. That is, the light incident into the second margin region is not completely extinguished or absorbed in the second margin region, but can be partially recycled by the light recycling member in the second margin region.

[0039] Accordingly, since the light in both the first and second margin regions is recycled by the light recycling member, the light emission efficiency of both the first and second emission regions can be improved. As a result, the brightness of the display device can be enhanced.

[0040] Note that the effects of the present disclosure are not limited to the above-mentioned effects, and other effects of the present disclosure will be apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0041] The above and other advantages and features of the present disclosure will become more apparent from the following description of embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0042] Figure 1 is a plan view illustrating an embodiment of a display device according to the present disclosure;

[0043] Figure 2 is a cross-sectional view taken along line A-A' of Figure 1

[0044] Figure 3 is a plan view illustrating a display region and a circuit layer in portion B of Figure 1

[0045] Figure 4 is a block diagram illustrating the circuit layer in portion B of Figure 1

[0046] Figure 5 is an equivalent circuit diagram illustrating an emission pixel driver of Figure 4

[0047] Figure 6 is a plan view illustrating a color conversion layer in portion B of Figure 1

[0048] Figure 7 is a plan view illustrating a color filter layer in portion B of Figure 1

[0049] Figure 8 is a cross-sectional view taken along line C-C' of Figure 6 and Figure 7

[0050] Figure 9 ​​​​​​​It is along Figure 6 and Figure 7 A cross-sectional view taken from line D-D';

[0051] Figure 10 This illustrates a display device according to the present disclosure. Figure 1 A plan view of an embodiment of the color conversion layer in part B;

[0052] Figure 11 , Figure 12 , Figure 13 and Figure 14 It is along Figure 10 A cross-sectional view taken from line E-E';

[0053] Figure 15 This is a flowchart illustrating an embodiment of a method for manufacturing a display device according to the present disclosure;

[0054] Figure 16 This shows the preparation Figure 15 Flowchart of the operation of the first substrate;

[0055] Figure 17 This shows the settings. Figure 16 Flowchart of the color conversion layer operation;

[0056] Figure 18 , Figure 19 , Figure 20 , Figure 21 , Figure 22 , Figure 23 , Figure 24 , Figure 25 , Figure 26 , Figure 27 , Figure 28 , Figure 29 , Figure 30 , Figure 31 and Figure 32 It is shown Figure 11 In the embodiments Figure 15 , Figure 16 and Figure 17 Some cross-sectional views of the operations depicted in the diagram; and

[0057] Figure 33 and Figure 34 It is shown Figure 14 In the embodiments Figure 17 Some cross-sectional views of the operations depicted in the diagram. Detailed Implementation

[0058] In the following description, embodiments will now be described more fully with reference to the accompanying drawings. However, embodiments may be provided in different forms and should not be construed as limiting. Throughout this disclosure, the same reference numerals denote the same parts. In the drawings, the thickness of layers and regions may be exaggerated for clarity.

[0059] Some parts that are not relevant to the description may be omitted in order to describe embodiments of this disclosure.

[0060] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on that other layer or substrate, or an intermediary layer may be present. Conversely, when an element is referred to as being "directly on" another element, an intermediary element may not be present.

[0061] Furthermore, the phrase "in a plan view" means when viewing a portion of the object from above, and the phrase "in a schematic cross-sectional view" means when viewing a schematic cross-section taken by vertically cutting the portion of the object from the side. The terms "overlapping" or "overlapping" mean that the first object may be above, below, or to the side of the second object, and vice versa. Additionally, the term "overlapping" can include layering, stacking, facing or confronting, extending over, covering or partially covering, or any other suitable terminology that will be recognized and understood by one of ordinary skill in the art. The expression "non-overlapping" can include meanings such as "separated from," "set next to," or "offset from," and any other suitable equivalent that will be recognized and understood by one of ordinary skill in the art. The terms "facing" and "confronting" can mean that the first object may be directly or indirectly opposite the second object. In the case where a third object is located between the first and second objects, the first and second objects can be understood as being indirectly opposite each other, although the first and second objects still face each other.

[0062] For ease of description, the spatial relative terms “below,” “under,” “down,” “above,” or “above,” etc., may be used herein to describe the relationship between one element or component and another, as shown in the accompanying drawings. It will be understood that, in addition to the orientation depicted in the drawings, the spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, in the case where the device shown in the drawings is flipped, a device located “below” or “under” another device may be positioned “above” another device. Accordingly, the illustrative term “below” may include both an upper position and a lower position. The device may also be oriented in other orientations, and therefore the spatial relative terms may be interpreted differently depending on the orientation.

[0063] When an element is referred to as being “connected” or “coupled” to another element, the element may be “directly connected” or “directly coupled” to the other element, or the element may be “electrically connected” or “electrically coupled” to the other element, wherein one or more intermediary elements are located between the element and the other element. It will be further understood that when the terms “comprising,” “including,” “containing,” and / or “having” are used, they may indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of other features, integrals, steps, operations, elements, components, and / or any combinations thereof.

[0064] It will be understood that although the terms “first,” “second,” or “third,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another, or for the convenience of its description and explanation. For example, when a “first element” is discussed in the specification, it may be referred to as a “second element” or a “third element,” and “second element” and “third element” may be named in a similar manner without departing from the teachings herein.

[0065] Taking into account the measurements discussed and the errors associated with the measurement of a particular quantity (e.g., limitations of the measurement system), the terms “approximately” or “roughly” as used herein include the value and mean within an acceptable range of deviation from that particular value as determined by a person skilled in the art. For example, “approximately” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5% of the value.

[0066] In the specification and claims, for the purposes of their meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or". For example, "A and / or B" can be understood to mean "A, B, or A and B". The terms "and" and "or" can be used in a combined or separate sense and can be understood to be equivalent to "and / or". In the specification and claims, for the purposes of their meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one selected from the group consisting of...". For example, "at least one of A and B" can be understood to mean "A, B, or A and B".

[0067] Unless otherwise specified or implied, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms such as those defined in commonly used dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and unless expressly defined in the specification, these terms shall not be interpreted in an idealized or overly formal sense.

[0068] In the following description, embodiments will be illustrated with reference to the accompanying drawings.

[0069] Figure 1 This is a plan view illustrating an embodiment of a display device according to the present disclosure.

[0070] refer to Figure 1 The display device 10 is a device for displaying moving or still images and can be used as a display screen for various products (e.g., mobile phones, smartphones, tablet PCs (“PCs”), smartwatches, watch phones, portable communication terminals, electronic notebooks, e-books, portable multimedia players (“PMPs”), navigation devices and ultra-mobile PCs (“UMPCs”), as well as televisions, laptops, monitors, billboards and Internet of Things (“IoT”) devices).

[0071] Display device 10 may be an organic light-emitting display device, such as an organic light-emitting diode (“OLED”), a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including inorganic semiconductors, a micron-sized light-emitting diode (“micron-sized LED”) display device, or a nano-sized LED display device. Hereinafter, display device 10 will be primarily described as an organic light-emitting display device, but this disclosure is not limited thereto. In alternative embodiments, this disclosure may also be applied to display devices comprising organic insulating materials, organic light-emitting materials, and metallic materials.

[0072] The display device 10 may be formed flat, but this disclosure is not limited thereto. In embodiments, for example, the display device 10 may include curved portions with a consistent curvature or a varying curvature at its left and right ends. Furthermore, the display device 10 may be flexible (e.g., bendable, flexible, foldable, or rollable).

[0073] In this embodiment, the display device 10 may be an organic light-emitting display device.

[0074] like Figure 1 As shown, the display device 10 may have a quadrilateral shape (e.g., a rectangular shape), but this disclosure is not limited thereto. That is, the shape of the display device 10 is not limited to this. Figure 1 The shape shown in the figure. In other words, the display device 10 may have a polygonal shape or a circular shape other than a rectangular shape. In alternative embodiments, at least a portion of the display device 10 may be able to change from a flat form to a bent form, a curved form, a folded form, or a rolled form.

[0075] One surface of the display device 10 may include a display area DA from which light for displaying an image is emitted, and a non-display area NDA surrounding the display area DA.

[0076] The display area DA can occupy most of the surface of the display device 10.

[0077] The non-display area NDA can be in the form of a frame surrounding the display area DA without emitting light for displaying the image. In embodiments, for example, the non-display area NDA can be maintained as a specific color such as black.

[0078] The display device 10 may include an emitter pixel driver EPD (reference) that transmits signals, voltages, or power to an emitter pixel driver disposed in the display area DA. Figure 3 The drivers 11 and 12 are described above. In this disclosure, each of the drivers 11 and 12 may be a drive circuit.

[0079] The driver 11, which can be implemented with relatively simple circuitry, can be located in the non-display area NDA.

[0080] Other drivers 12 may be provided as integrated circuit (“IC”) chips and may be disposed (e.g., mounted) on a circuit board 13 electrically connected to pads in the non-display area NDA. In alternative embodiments, drivers 12 may be disposed (e.g., mounted) on pads in the non-display area NDA.

[0081] Figure 2 It is along Figure 1 A cross-sectional view taken from line A-A'. Figure 3 It is shown Figure 1 The plan view of the display area and circuit layer in part B.

[0082] refer to Figure 2 The display device 10 may include a first substrate 100 and a second substrate 200 facing the first substrate 100.

[0083] The display device 10 may further include a filler layer 300 disposed between the first substrate 100 and the second substrate 200. The filler layer 300 may be disposed at least in the display area DA and may fill the space between the first substrate 100 and the second substrate 200.

[0084] The display device 10 may further include a sealing layer 400 disposed in the non-display area NDA and which bonds the first substrate 100 and the second substrate 200 together.

[0085] The first substrate 100 may include a first support substrate 110, a component layer 130 disposed on the first support substrate 110, an encapsulation layer 140 disposed on the component layer 130, and a color conversion layer 150 disposed on the encapsulation layer 140.

[0086] The first substrate 100 may further include a circuit layer 120 disposed on the first support substrate 110. A component layer 130 may be disposed on the circuit layer 120.

[0087] The first support substrate 110 includes a display area DA that emits light for displaying an image and a non-display area NDA surrounding the display area DA that does not emit light.

[0088] refer to Figure 3 The display area DA may include the emitting area EA that emits light and the non-emitting area NEA between the emitting areas EA.

[0089] The emission region EA may include a first emission region EA1 that emits light within a first wavelength range, a second emission region EA2 that emits light within a second wavelength range lower than the first wavelength range, and a third emission region EA3 that emits light within a third wavelength range lower than the second wavelength range.

[0090] In an embodiment, for example, the first wavelength range may be from approximately 600 nanometers (nm) to approximately 750 nm, and the light within the first wavelength range may be red light. The second wavelength range may be from approximately 480 nm to approximately 560 nm, and the light within the second wavelength range may be green light. The third wavelength range may be from approximately 370 nm to approximately 460 nm, and the light within the third wavelength range may be blue light.

[0091] Accordingly, the unit pixel PX that emits white light can be provided by one or more first emission regions EA1, one or more second emission regions EA2 and one or more third emission regions EA3 that are adjacent to each other in the emission region EA.

[0092] In an embodiment, the first transmission area EA1, the second transmission area EA2, and the third transmission area EA3 can each be arranged side by side on the second direction DR2.

[0093] In addition, the third launch area EA3 can be set on the first direction DR1 between the first launch area EA1 and the second launch area EA2.

[0094] Each of the emission areas EA can be arranged in one of the following shapes: quadrilateral (e.g., rectangular, rhomboid, or trapezoidal), triangular, circular, and elliptical.

[0095] In an embodiment, in the second direction DR2, the third transmission region EA3 may have a width smaller than that of the first transmission region EA1 and the second transmission region EA2. Therefore, in the second direction DR2, the spacing between the third transmission regions EA3 may be greater than the spacing between the first transmission regions EA1 and the spacing between the second transmission regions EA2.

[0096] The circuit layer 120 of the first substrate 100 may include emission pixel drivers (EPDs) arranged side by side.

[0097] The emitter pixel driver EPD may include a light-emitting element LE (reference) electrically connected to the first emitter region EA1. Figure 6 The first emitting pixel driver EPD1, the second emitting pixel driver EPD2 electrically connected to the light-emitting element LE in the second emitting region EA2, and the third emitting pixel driver EPD3 electrically connected to the light-emitting element LE in the third emitting region EA3.

[0098] The element layer 130 of the first substrate 100 may include a light-emitting element LE disposed in the emission region EA.

[0099] The light-emitting element (LE) can emit light in a fourth wavelength range that is equal to or lower than the third wavelength range.

[0100] The light-emitting element LE of element layer 130 can be electrically connected to the emitter pixel driver EPD of circuit layer 120.

[0101] The encapsulation layer 140 may include at least two inorganic insulating layers containing inorganic insulating material and at least one organic insulating layer containing organic insulating material and disposed between the inorganic insulating layers.

[0102] The encapsulation layer 140 can prevent foreign objects from causing defects in the circuit layer 120 or component layer 130, and can prevent oxygen or moisture from penetrating into the circuit layer 120 or component layer 130.

[0103] The color conversion layer 150 can convert the wavelength range of some of the light emitted from the light-emitting elements LE in the element layer 130.

[0104] In other words, the color conversion layer 150 can convert the light emitted from the light-emitting element LE in the first emission region EA1 from the fourth wavelength range to the first wavelength range, convert the light emitted from the light-emitting element LE in the second emission region EA2 from the fourth wavelength range to the second wavelength range, and can transmit and scatter the light emitted from the light-emitting element LE in the third emission region EA3.

[0105] The second substrate 200 may include a second support substrate 210 facing the first support substrate 110 and including an emission region EA and a non-emission region NEA, and a color filter layer 220 disposed on one surface of the second support substrate 210.

[0106] The color filter layer 220 can transmit light of a specific wavelength range from the color conversion layer 150 of the first substrate 100 through each of the emission regions EA.

[0107] In other words, the color filter layer 220 can transmit light within a first wavelength range through the first emission region EA1, transmit light within a second wavelength range through the second emission region EA2, and transmit light within a third wavelength range through the third emission region EA3.

[0108] Figure 4 It is shown Figure 1 The block diagram of the circuit layer in part B. Figure 5 It is shown Figure 4 The equivalent circuit diagram of the emitter pixel driver.

[0109] refer to Figure 4 The circuit layer 120 of the first substrate 100 in the display device 10 may include an emitting pixel driver EPD electrically connected to the light-emitting element LE of the emitting region EA.

[0110] The emitter pixel driver EPD may include a first emitter pixel driver EPD1 electrically connected to a light-emitting element LE electrically connected to a first emitter region EA1, a second emitter pixel driver EPD2 electrically connected to a light-emitting element LE electrically connected to a second emitter region EA2, and a third emitter pixel driver EPD3 electrically connected to a light-emitting element LE electrically connected to a third emitter region EA3.

[0111] The circuit layer 120 may further include a scan write line GWL for transmitting a scan write signal GW to the emitter pixel driver EPD, a scan initialization line GIL for transmitting a scan initialization signal GI to the emitter pixel driver EPD, a data line DL for transmitting a data signal Vdata to the emitter pixel driver EPD, an initialization voltage line VIL for transmitting an initialization voltage VINT to the emitter pixel driver EPD, a first power supply line VDL for transmitting a first power supply ELVDD to the emitter pixel driver EPD, and a second power supply line VSL for transmitting a second power supply ELVSS to the light-emitting element LE.

[0112] The circuit layer 120 may also include a first additional power line VDAL for reducing the resistance of the first power line VDL and a second additional power line VSAL for reducing the resistance of the second power line VSL.

[0113] The first additional power line VDAL may extend in a direction intersecting with the first power line VDL and may be electrically connected to the first power line VDL.

[0114] The second additional power line VSAL can extend in a direction that intersects with the second power line VSL and can be electrically connected to the second power line VSL.

[0115] The data line DL may include a first data line DL1 for transmitting the data signal Vdata to the first emitter pixel driver EPD1, a second data line DL2 for transmitting the data signal Vdata to the second emitter pixel driver EPD2, and a third data line DL3 for transmitting the data signal Vdata to the third emitter pixel driver EPD3.

[0116] refer to Figure 5 The emitter pixel driver EPD can be electrically connected between the first power line VDL and the light-emitting element LE, and the light-emitting element LE can be electrically connected between the emitter pixel driver EPD and the second power line VSL.

[0117] The light-emitting element LE can be an organic light-emitting diode (“OLED”) including an organic light-emitting layer, a quantum dot light-emitting diode (“LED”) including a quantum dot light-emitting layer, a micron LED, or an inorganic LED including inorganic semiconductors.

[0118] The second power supply ELVSS can have a lower voltage level than the first power supply ELVDD.

[0119] In other words, the anode electrode of the light-emitting element LE can be electrically connected to the emitter pixel driver EPD, and the cathode electrode of the light-emitting element LE can be electrically connected to the second power line VSL.

[0120] The emitter pixel driver EPD may include a first transistor ST1 that generates the drive current for the light-emitting element LE, and one or more transistors (i.e., a second transistor ST2 and a third transistor ST3) electrically connected to the first transistor ST1, and at least one capacitor (i.e., a first capacitor C1).

[0121] The first transistor ST1 can be electrically connected between the first power line VDL and the light-emitting element LE.

[0122] The first electrode of the first transistor ST1 can be electrically connected to the first power supply line VDL.

[0123] The second electrode of the first transistor ST1 can be electrically connected to the second node N2 and the anode electrode of the light-emitting element LE.

[0124] The first gate electrode of the first transistor ST1 can be electrically connected to the first node N1 and the second transistor ST2.

[0125] The second gate electrode of the first transistor ST1 can be electrically connected to the second node N2.

[0126] The second transistor ST2 can be electrically connected between the data line DL and the first node N1.

[0127] The gate electrode of the second transistor ST2 can be electrically connected to the scan write line GWL. That is, the second transistor ST2 can be turned on by the scan write signal GW from the scan write line GWL.

[0128] When the second transistor ST2 is turned on, the data signal Vdata from the data line DL can be transmitted to the first node N1.

[0129] Because of the data signal Vdata transmitted to the first node N1, the voltage difference between the first gate electrode and the first electrode of the first transistor ST1 (i.e., the gate-source voltage difference) can become the voltage difference between the first power supply ELVDD and the data signal Vdata, and can exceed the threshold voltage of the first transistor ST1. Therefore, the first transistor ST1 can be turned on, thereby generating a source-drain current corresponding to the data signal Vdata between the first electrode and the second electrode of the first transistor ST1. The source-drain current of the first transistor ST1 can be supplied to the light-emitting element LE as a driving current.

[0130] Therefore, since the driving current corresponding to the data signal Vdata is supplied to the light-emitting element LE, the light-emitting element LE can emit light with a brightness corresponding to the data signal Vdata.

[0131] The first capacitor C1 can be electrically connected between the first node N1 and the second node N2.

[0132] The first capacitor C1 can be charged via the data signal Vdata transmitted to the first node N1 through the conducting second transistor ST2.

[0133] Accordingly, the potential of the first node N1 can be maintained for a predetermined period of time by the voltage charged into the first capacitor C1.

[0134] The third transistor ST3 can be electrically connected between the initialization voltage line VIL and the second node N2.

[0135] The gate electrode of the third transistor ST3 can be electrically connected to the scan initialization line GIL. That is, the third transistor ST3 can be turned on by the scan initialization signal GI from the scan initialization line GIL.

[0136] When the third transistor ST3 is turned on, the potential of the second node N2 (i.e., the potential of the anode electrode of the light-emitting element LE) can be initialized to the initial voltage VINT of the initialization voltage line VIL.

[0137] like Figure 5 As shown, in the embodiments, the first transistor ST1, the second transistor ST2, and the third transistor ST3 may be N-type metal-oxide-semiconductor field-effect transistors (“MOSFETs”), but this disclosure is not limited thereto. In alternative embodiments, at least one of the first transistor ST1, the second transistor ST2, and the third transistor ST3 may be a P-type MOSFET.

[0138] Figure 6 It is shown Figure 1 A plan view of the color conversion layer in part B.

[0139] refer to Figure 6 The display area DA of the display device 10 may include an emission area EA and a non-emission area NEA, which is the gap area between the emission areas EA.

[0140] The emission region EA may include a first emission region EA1 that emits light within a first wavelength range, a second emission region EA2 that emits light within a second wavelength range lower than the first wavelength range, and a third emission region EA3 that emits light within a third wavelength range lower than the second wavelength range.

[0141] The non-emission area NEA may include a first margin area MGA1 connected to a portion of the first emission area EA1 and a second margin area MGA2 connected to a portion of the second emission area EA2.

[0142] In an embodiment, the first margin region MGA1 may extend from a portion of the first emission region EA1 along the first direction DR1 and the second direction DR2.

[0143] Similarly, the second margin region MGA2 can be extended from a portion of the second emission region EA2 along the first direction DR1 and the second direction DR2.

[0144] The first margin region MGA1 and the second margin region MGA2 can face each other in the first direction DR1.

[0145] The first margin region MGA1 and the second margin region MGA2 may have widths corresponding to the margins of the jetting device used in the inkjet process for arranging the color conversion layer 150.

[0146] The color conversion layer 150 in the first substrate 100 of the display device 10 may include a first color conversion portion 151 disposed in the first emission region EA1 and the first margin region MGA1, a second color conversion portion 152 disposed in the second emission region EA2 and the second margin region MGA2, a light-transmitting portion 153 disposed in the third emission region EA3, and a separating portion 154 disposed between the first color conversion portion 151, the second color conversion portion 152 and the light-transmitting portion 153.

[0147] The first color conversion section 151 can convert light emitted from the light-emitting element LE in a fourth wavelength range into light in a first wavelength range.

[0148] The second color conversion section 152 can convert light emitted from the light-emitting element LE in the fourth wavelength range into light in the second wavelength range.

[0149] The light-transmitting portion 153 can transmit and scatter light in the fourth wavelength range emitted from the light-emitting element LE.

[0150] Since the first color conversion section 151 is disposed in both the first emission region EA1 and the first margin region MGA1, the width of the first emission region EA1 can be reduced regardless of the margin of the jetting device used in the inkjet process for arranging the first color conversion section 151.

[0151] Similarly, since the second color conversion section 152 is disposed in both the second emission region EA2 and the second margin region MGA2, the width of the second emission region EA2 can be reduced regardless of the margin of the jetting device used in the inkjet process for arranging the second color conversion section 152.

[0152] Therefore, the margin of the jetting device used in the inkjet process can be eliminated from the influence of the width of the emission area EA, which can help achieve a relatively high resolution in the display device 10.

[0153] The display device 10 includes a light recovery component (LRC) disposed in a portion of the non-emission area (NEA).

[0154] In other words, the light recovery component LRC can be set in the first margin region MGA1 and the second margin region MGA2.

[0155] The light recovery component LRC can reflect at least some of the light introduced into the first margin region MGA1 and the second margin region MGA2 back into the first emission region EA1 and the second emission region EA2, respectively. Due to the light recovery component LRC, some of the light introduced into the first margin region MGA1 and the second margin region MGA2 can be emitted through the first emission region EA1 and the second emission region EA2, respectively, instead of being extinguished or absorbed in the non-emission region NEA. That is, since the light can be reused, the luminous efficiency can be improved, and therefore the brightness of the display device 10 can be enhanced.

[0156] In an embodiment, the light recovery component LRC may include a reflective layer RFL.

[0157] The reflective layer RFL can be disposed in the first margin region MGA1 and the second margin region MGA2, and can include a material that reflects light.

[0158] The display device 10 may further include a spacer SPC disposed between the first substrate 100 and the second substrate 200.

[0159] The spacer SPC may overlap with the first margin region MGA1 and / or the second margin region MGA2.

[0160] In this way, since the spacer SPC overlaps with the light recovery component LRC disposed in the first margin region MGA1 or the second margin region MGA2, the gap between the first substrate 100 and the second substrate 200 can be reduced, the thickness of the light recovery component LRC can be reduced, and as a result, the thickness of the spacer SPC can be reduced.

[0161] Figure 7 It is shown Figure 1 A plan view of the color filter layer in part B.

[0162] refer to Figure 7 The color filter layer 220 in the second substrate 200 of the display device 10 may include a first filter portion 221 disposed in the first emission region EA1 and transmitting light within a first wavelength range, a second filter portion 222 disposed in the second emission region EA2 and transmitting light within a second wavelength range, a third filter portion 223 disposed in the third emission region EA3 and transmitting light within a third wavelength range, and a light blocking portion 224 disposed in the non-emission region NEA and blocking light.

[0163] The spacer SPC can overlap with the light-blocking portion 224.

[0164] Figure 8 It is along Figure 6 and Figure 7The cross-sectional view taken from line C-C'. Figure 9 It is along Figure 6 and Figure 7 The cross-sectional view taken by line D-D'.

[0165] refer to Figure 8 and Figure 9 The first substrate 100 of the display device 10 may include a first support substrate 110, a circuit layer 120 disposed on the first support substrate 110, a component layer 130 disposed on the circuit layer 120, an encapsulation layer 140 disposed on the component layer 130, a color conversion layer 150 disposed on the encapsulation layer 140, and a color conversion cover layer 160 covering the color conversion layer 150.

[0166] The element layer 130 includes a light-emitting element LE disposed in the emission region EA.

[0167] The light-emitting element LE may have a structure in which the light-emitting layer 133 is disposed between the anode electrode 131 and the cathode electrode 134 facing the anode electrode 131.

[0168] In other words, the element layer 130 may include an anode electrode 131 disposed in the emission region EA, a pixel defining layer 132 disposed in the non-emission region NEA and covering the edge of the anode electrode 131, a light-emitting layer 133 disposed on the anode electrode 131 and the pixel defining layer 132, and a cathode electrode 134 disposed on the light-emitting layer 133.

[0169] In an alternative embodiment, the light-emitting layer 133 may be disposed in the emission region EA.

[0170] The encapsulation layer 140 disposed on the component layer 130 may include a first encapsulation layer 141 containing inorganic insulating material, a second encapsulation layer 142 disposed on the first encapsulation layer 141 and containing organic insulating material, and a third encapsulation layer 143 disposed on the second encapsulation layer 142 and containing inorganic insulating material.

[0171] The color conversion layer 150 may include a first color conversion portion 151 disposed in a first emission region EA1, a second color conversion portion 152 disposed in a second emission region EA2, a light-transmitting portion 153 disposed in a third emission region EA3, and a separating portion 154 disposed between the first color conversion portion 151, the second color conversion portion 152 and the light-transmitting portion 153.

[0172] The first color conversion section 151 can convert light emitted from the light-emitting element LE in the first emission region EA1 into light in the fourth wavelength range.

[0173] The first color conversion section 151 may be an ink substance cured from a first ink material comprising a base resin and first color conversion particles dispersed in the base resin. The first color conversion particles can convert light in a fourth wavelength range into light in a first wavelength range.

[0174] The second color conversion section 152 can convert light emitted from the light-emitting element LE in the second emission region EA2 within a fourth wavelength range into light within a second wavelength range.

[0175] The second color conversion section 152 may be an ink material cured from a second ink material comprising a base resin and second color conversion particles dispersed in the base resin. The second color conversion particles can convert light in a fourth wavelength range into light in a second wavelength range.

[0176] The light-transmitting portion 153 can transmit and scatter light in the fourth wavelength range emitted from the light-emitting element LE in the third emission region EA3.

[0177] The light-transmitting portion 153 may include a base resin BSR and scattering particles SCP dispersed in the base resin BSR.

[0178] Scattering particles (SCPs) can be metal oxide particles or organic particles.

[0179] The metal oxide particles can be particles of at least one of titanium oxide (TiO2), zirconium oxide (ZrO2), aluminum oxide (Al2O3), indium oxide (In2O3), zinc oxide (ZnO), and tin oxide (SnO2).

[0180] Organic particles can be particles of acrylic resin or urethane resin.

[0181] The first color conversion section 151 and the second color conversion section 152 may each further include scattering particles dispersed in the base resin.

[0182] The first color conversion particle and the second color conversion particle can each be one or more of quantum dots, quantum rods, and phosphors.

[0183] Quantum dots may include group IV element or compound nanocrystals, group II-VI compound nanocrystals, group III-V compound nanocrystals, group IV-VI compound nanocrystals and / or combinations thereof, or may be composed of group IV element or compound nanocrystals, group II-VI compound nanocrystals, group III-V compound nanocrystals, group IV-VI compound nanocrystals and / or combinations thereof.

[0184] The first color conversion portion 151, the second color conversion portion 152, and the light-transmitting portion 153 may include the same base resin or different base resins.

[0185] like Figure 9 As shown, the first color conversion section 151 can be set not only in the first emission region EA1, but also in the first margin region MGA1 of the non-emission region NEA.

[0186] Similarly, the second color conversion section 152 can be set not only in the second emission region EA2, but also in the second margin region MGA2 of the non-emission region NEA.

[0187] In this way, the widths of the first emission region EA1 and the second emission region EA2 are not limited by the margin of the jetting device, which can help achieve a relatively high resolution in the display device 10.

[0188] like Figure 8 and Figure 9 As shown, the dividing portion 154 may surround the first color conversion portion 151, the second color conversion portion 152, and the light-transmitting portion 153.

[0189] The partition portion 154 may include a first partition wall 1541 disposed between the first color conversion portion 151, the second color conversion portion 152 and the light-transmitting portion 153, a reflective wall 1542 covering the side of the first partition wall 1541 and reflecting light, and a second partition wall 1543 disposed on the first partition wall 1541 and having hydrophobicity.

[0190] The first partition wall 1541 may define the boundary between the first color conversion portion 151, the second color conversion portion 152, and the light-transmitting portion 153. The first partition wall 1541 may include an organic material.

[0191] The reflective wall 1542 may include a reflective metallic material. The reflective wall 1542 can reflect light guided to the first partition wall 1541 back into the first color conversion section 151, the second color conversion section 152, and the light-transmitting section 153.

[0192] The reflective wall 1542 may not cover the central portion of the top surface of the first partition wall 1541. Due to the conductivity of the reflective wall 1542, this can reduce the inflow or accumulation of static electricity, thereby preventing damage from static electricity.

[0193] The second partition wall 1543 may include an organic material with a hydrophobic surface.

[0194] Due to the hydrophobicity of the second partition wall 1543, during the arrangement of the first color conversion section 151 and the second color conversion section 152, the first ink material INK1 (reference) Figure 23 ) and the second ink material INK2 (reference) Figure 24 They can be easily gathered in the first launch area EA1 and the second launch area EA2, respectively.

[0195] The color conversion capping layer 160 covering the color conversion layer 150 may include an inorganic insulating material.

[0196] The display device 10 may include a light recovery component (LRC) disposed in a first margin region MGA1 and a second margin region MGA2.

[0197] like Figure 9 As shown in the embodiment, the light recovery component LRC may include a reflective layer RFL disposed on a first color conversion portion 151 in the first margin region MGA1 and a second color conversion portion 152 in the second margin region MGA2.

[0198] The reflective layer RFL can include reflective metallic materials.

[0199] In an embodiment, for example, the reflective layer RFL can be disposed on the color conversion capping layer 160 and can be covered by an additional capping layer 161. This can help reduce the peeling of the reflective layer RFL.

[0200] The second substrate 200 of the display device 10 may include a second support substrate 210, a color filter layer 220 disposed on one surface of the second support substrate 210, and a filter cover layer 230 covering the color filter layer 220.

[0201] In the direction in which light is emitted from the display device 10 (i.e., third direction DR3), a color filter layer 220 may be disposed on the color conversion layer 150, and a second support substrate 210 may be disposed on the color filter layer 220. Therefore, light emitted from the light-emitting element LE of the element layer 130 can pass through the color conversion layer 150, the color filter layer 220, and the second support substrate 210 to be emitted outward.

[0202] The color filter layer 220 may include a first filter portion 221 disposed in the first emission region EA1 and transmitting light within a first wavelength range, a second filter portion 222 disposed in the second emission region EA2 and transmitting light within a second wavelength range, a third filter portion 223 disposed in the third emission region EA3 and transmitting light within a third wavelength range, and a light blocking portion 224 disposed in the non-emission region NEA and blocking light.

[0203] The first filter section 221, the second filter section 222, and the third filter section 223 may each include a colorant such as a dye or pigment. The colorant may be a material that absorbs light in a wavelength range other than a predetermined wavelength range.

[0204] In other words, the first filter portion 221 can transmit light within the first wavelength range by including a colorant that absorbs light within a wavelength range other than the first wavelength range.

[0205] The second filter section 222 can transmit light in the second wavelength range by including a colorant that absorbs light in a wavelength range other than the second wavelength range.

[0206] The third filter section 223 can transmit light in the third wavelength range by including a colorant that absorbs light in a wavelength range other than the third wavelength range.

[0207] The light blocking portion 224 may have a stacked structure of two or more of the first filter portion 221, the second filter portion 222 and the third filter portion 223.

[0208] In an alternative embodiment, the light-blocking portion 224 may include a light-absorbing material such as a black matrix material.

[0209] The light recovery unit (LRC) located in the first margin region MGA1 and the second margin region MGA2 can overlap with the light blocking portion 224 in the non-emitting region NEA. This can reduce color mixing or light leakage caused by the light recovery unit (LRC).

[0210] The filter cover layer 230 may cover the color filter layer 220 and may include inorganic insulating material.

[0211] The display device 10 may further include a low refractive index layer disposed between the color filter layer 220 and the color conversion layer 150. The low refractive index layer may include an organic material having a refractive index of about 1.1 to about 1.4.

[0212] In an embodiment, for example, a low refractive index layer may be disposed on the color conversion capping layer 160 or the filter capping layer 230.

[0213] The display device 10 may further include a filler layer 300 disposed between the first substrate 100 and the second substrate 200.

[0214] The filling layer 300 can fill the space between the first substrate 100 and the second substrate 200.

[0215] The filler layer 300 can be disposed between the color conversion capping layer 160 of the first substrate 100 and the filter capping layer 230 of the second substrate 200.

[0216] The filler layer 300 may include an organic material with light-transmitting and adhesive properties.

[0217] In some embodiments, for example, the filling layer 300 may include silicon (Si)-based organic materials or epoxy-based organic materials.

[0218] As described above, since the first color conversion section 151 is disposed in both the first emission region EA1 and the first margin region MGA1, and the second color conversion section 152 is disposed in both the second emission region EA2 and the second margin region MGA2, the widths of the first emission region EA1 and the second emission region EA2 are not limited by the margin of the ejection device. This can help achieve a relatively high resolution in the display device 10.

[0219] In addition, such as Figure 9 As shown, the display device 10 includes a light recovery component LRC disposed in a first margin region MGA1 and a second margin region MGA2.

[0220] In an embodiment, the light recovery component LRC may include a reflective layer RFL.

[0221] Therefore, some of the light emitted from the light-emitting element LE and introduced into the first margin region MGA1 and the second margin region MGA2 can be reflected by the reflective layer RFL and the reflective wall 1542 due to the difference in refractive index at the interface, and can therefore be reused as light RCL emitted into the first emission region EA1 and the second emission region EA2.

[0222] Therefore, the luminous efficiency in the first emission region EA1 and the second emission region EA2 can be improved, which can enhance the brightness of the display device 10.

[0223] Figure 10 This illustrates a display device according to the present disclosure. Figure 1 A plan view of an embodiment of the color conversion layer in part B. Figure 11 , Figure 12 , Figure 13 and Figure 14 It is along Figure 10 The cross-sectional view taken from line E-E'.

[0224] Except for the light recovery component LRC, which includes the scattering section SCT instead of the reflective layer RFL. Figure 10 The display device 10 and Figure 6 The display device 10 is essentially the same, and therefore, redundant descriptions will be omitted below.

[0225] refer to Figure 10The scattering portion SCT can be set in the first margin region MGA1 and the second margin region MGA2.

[0226] The scattering portion SCT can overlap with the portion of the separating portion 154 between the first color conversion portion 151 and the second color conversion portion 152.

[0227] In an embodiment, for example, the scattering portion SCT may be connected to the light-transmitting portion 153 of the third emission region EA3.

[0228] refer to Figure 11 The light recovery component LRC may include a scattering portion SCT disposed on a first color conversion portion 151 in a first margin region MGA1 and a second color conversion portion 152 in a second margin region MGA2.

[0229] The scattering component SCT may include a base resin BSR with light-transmitting properties and scattering particles SCP dispersed in the base resin BSR.

[0230] The light-transmitting portion 153 can be provided together with the scattering portion SCT. In other words, both the light-transmitting portion 153 and the scattering portion SCT can include a base resin BSR and scattering particles SCP dispersed in the base resin BSR.

[0231] Therefore, some of the light emitted from the light-emitting element LE and introduced into the first margin region MGA1 and the second margin region MGA2 can be reflected by the scattering particles SCP due to the difference in refractive index at the interface, and can thus be reused as light RCL emitted into the first emission region EA1 and the second emission region EA2.

[0232] Therefore, the luminous efficiency in the first emission region EA1 and the second emission region EA2 can be improved, which can enhance the brightness of the display device 10.

[0233] In this way, since the arrangement of the light recycling component LRC does not require additional stacking or etching processes, the manufacturing process of the display device 10 can be prevented from becoming more complicated.

[0234] Furthermore, since the thickness of the scattering portion SCT, which includes a base resin BSR containing organic materials or composed of organic materials, is greater than the thickness of the reflective layer RFL, which includes metallic materials, the thickness of the spacer SPC can be further reduced by the light recovery component LRC.

[0235] according to Figure 10 and Figure 11In one embodiment, since the scattering portion SCT is arranged using the same process as the light-transmitting portion 153, the color conversion capping layer 160 can further cover the scattering portion SCT together with the color conversion layer 150.

[0236] In addition to the light recovery component LRC, there is also an additional reflective layer ARFL disposed on the scattering portion SCT and reflecting light. Figure 12 The display device 10 and Figure 10 and Figure 11 The display device 10 is essentially the same, and therefore, redundant descriptions will be omitted below.

[0237] In this case, the color conversion capping layer 160 can further cover the additional reflective layer ARFL together with the color conversion layer 150 and the scattering portion SCT.

[0238] The additional reflective layer ARFL can include reflective metallic materials.

[0239] In this way, the amount of light reflected from the first margin region MGA1 and the second margin region MGA2 is increased due to the additional reflective layer ARFL, thus increasing the amount of reusable light.

[0240] Except that the additional reflective layer ARFL is not placed on the scattering part SCT but on the color conversion capping layer 160 and is covered by the additional capping layer 161. Figure 13 The display device 10 and Figure 12 The display device 10 is essentially the same, and therefore, redundant descriptions will be omitted below.

[0241] In this way, the stripping of the additional reflective layer ARFL can be reduced.

[0242] In addition to the light recovery component LRC, it further includes an extended reflective layer ERFL extending from the reflector wall 1542. Figure 14 The display device 10 and Figure 10 and Figure 11 The display device 10 is essentially the same, and therefore, redundant descriptions will be omitted below.

[0243] The extended reflective layer ERFL can be disposed on the encapsulation layer 140 in the first margin region MGA1 and the second margin region MGA2, and can extend from the reflective wall 1542.

[0244] In this way, since the light reflected by the scattering particles SCP of the scattered portion SCT is further reflected by the extended reflective layer ERFL, the amount of reusable light can be increased. As a result, the brightness of the display device 10 can be further improved.

[0245] Figure 15 This is a flowchart illustrating an embodiment of a method for manufacturing a display device according to the present disclosure. Figure 16 This shows the preparation Figure 15 The flowchart shows the operation of the first substrate. Figure 17 This shows the settings. Figure 16 The flowchart shows the operation of the color conversion layer. Figure 18 , Figure 19 , Figure 20 , Figure 21 , Figure 22 , Figure 23 , Figure 24 , Figure 25 , Figure 26 , Figure 27 , Figure 28 , Figure 29 , Figure 30 , Figure 31 and Figure 32 It is shown Figure 11 In the embodiments Figure 15 , Figure 16 and Figure 17 Some cross-sectional views of the operations depicted in the diagram. Figure 33 and Figure 34 It is shown Figure 14 In the embodiments Figure 17 Some cross-sectional views of the operations depicted in the diagram.

[0246] refer to Figure 15 The method of manufacturing the display device 10 in the embodiments of this disclosure may include operation S100 of preparing a first substrate 100, operation S200 of preparing a second substrate 200, operation S300 of providing a filler layer 300 on the first substrate 100 or the second substrate 200, and operation S400 of combining the first substrate 100 and the second substrate 200.

[0247] refer to Figure 16 The operation S100 for preparing the first substrate 100 may include: preparing a first support substrate 110 including side-by-side emission regions EA and non-emission regions NEA between the emission regions EA; preparing a circuit layer 120 on the first support substrate 110; preparing a component layer 130 on the circuit layer 120; preparing an encapsulation layer 140 on the component layer 130; preparing a color conversion layer 150 on the encapsulation layer 140; and preparing a color conversion capping layer 160 covering the color conversion layer 150.

[0248] As referenced above Figure 6 , Figure 9 and Figures 10 to 14As described, after the operation S150 of setting the color conversion layer 150, the color conversion layer 150 includes a light recovery component LRC disposed in a portion of the non-emission region NEA.

[0249] As referenced above Figure 3 , Figure 6 and Figure 10 The described emission region EA may include a first emission region EA1 that emits light in a first wavelength range, a second emission region EA2 that emits light in a second wavelength range lower than the first wavelength range, and a third emission region EA3 that emits light in a third wavelength range lower than the second wavelength range.

[0250] In addition, the non-emission area NEA may include a first margin area MGA1 connected to a portion of the first emission area EA1 and a second margin area MGA2 connected to a portion of the second emission area EA2.

[0251] In addition, as referenced above Figure 6 , Figure 9 and Figures 10 to 14 As described, element layer 130 may include light-emitting elements LE disposed in emission region EA.

[0252] The light-emitting element (LE) can emit light in a fourth wavelength range that is equal to or lower than the third wavelength range.

[0253] refer to Figure 17 The operation S150 of setting the color conversion layer 150 may include the operation S151 of setting a separation portion 154 in the entire non-emitting region NEA except for the first margin region MGA1 and the second margin region MGA2, the operation S152 of setting a first color conversion portion 151 in the first emission region EA1 and the first margin region MGA1 to convert light in the fourth wavelength range into light in the first wavelength range, the operation S153 of setting a second color conversion portion 152 in the second emission region EA2 and the second margin region MGA2 to convert light in the fourth wavelength range into light in the second wavelength range, and the operation S154 of setting a light-transmitting portion 153 in the third emission region EA3 to transmit and scatter light in the fourth wavelength range and setting a scattering portion SCT in a part of the non-emitting region NEA.

[0254] The operation S151 of setting the partition 154 may include the operation S1511 of setting a first partition wall 1541 in the entire non-emissive region NEA except for the first margin region MGA1 and the second margin region MGA2, the operation S1512 of setting a reflective wall 1542 for reflecting light on the side of the first partition wall 1541, and the operation S1513 of setting a hydrophobic second partition wall 1543 on at least a portion of the top surface of the first partition wall 1541.

[0255] like Figure 18 As shown, in operation S110 of preparing the first support substrate 110, the first support substrate 110 can be prepared as a flat plate including a display area DA and a non-display area NDA.

[0256] The display area DA can include the emission area EA and the non-emission area NEA.

[0257] In the operation S120 of setting the circuit layer 120, including Figure 3 The circuit layer 120 of the emitter pixel driver EPD can be disposed on the first support substrate 110.

[0258] Each of the emitter pixel driver (EPD) can include two or more transistors.

[0259] In the operation S130 of setting the element layer 130, the element layer 130 may include an anode electrode 131 disposed in the emission region EA, a pixel limiting layer 132 disposed in the non-emission region NEA and covering the edge of the anode electrode 131, a light-emitting layer 133 disposed on the anode electrode 131 and the pixel limiting layer 132, and a cathode electrode 134 disposed on the light-emitting layer 133.

[0260] The light-emitting element LE can be disposed in the emission region EA and can have a structure in which the light-emitting layer 133 is located between the anode electrode 131 and the cathode electrode 134 facing each other.

[0261] In operation S140 of setting the encapsulation layer 140, the encapsulation layer 140 may include a first encapsulation layer 141 covering the element layer 130 and including an inorganic insulating material, a second encapsulation layer 142 disposed on the first encapsulation layer 141 and including an organic insulating material, and a third encapsulation layer 143 disposed on the second encapsulation layer 142 and including an inorganic insulating material.

[0262] like Figure 19As shown, in operation S1511, a sub-operation of operation S151 which is the setting of the partition portion 154, the first partition wall 1541 can be set by selectively etching organic material on the encapsulation layer 140. The first partition wall 1541 can be formed in the entire non-emitting region NEA except for the first margin region MGA1 and the second margin region MGA2, and can include an opening that exposes the encapsulation layer 140.

[0263] refer to Figure 20 The operation S1512 of setting the reflective wall 1542 may include setting a reflective metal material layer RFM on the encapsulation layer 140 and covering the first partition wall 1541, and setting a mask MSK on a portion of the metal material layer RFM. The mask MSK may overlap with the edge of the top surface of the first partition wall 1541 and the side surface of the first partition wall 1541.

[0264] refer to Figure 21 The operation S1512 of setting the reflective wall 1542 may further include the operation of selectively etching the metal material layer RFM using a mask MSK. As a result, the reflective wall 1542 may be set on the side of the first partition wall 1541.

[0265] refer to Figure 22 The operation S1513 of setting the second partition wall 1543 may include the operation of exposing and developing the portion of the organic material covering the first partition wall 1541 and the reflective wall 1542 (specifically the portion of the organic material set on the first partition wall 1541).

[0266] During the exposure of the organic material, the hydrophobic substances in the organic material can react with light and flow to the surface. Therefore, during the development of the organic material, a second partition wall 1543 with a hydrophobic surface can be formed.

[0267] As a result, the partition portion 154, including the first partition wall 1541, the reflective wall 1542, and the second partition wall 1543, can be set in the entire non-emission region NEA except for the first margin region MGA1 and the second margin region MGA2.

[0268] refer to Figure 23 The operation S152 of setting the first color conversion section 151 may include the operation of using a jetting device NZ that moves while facing the display area DA to jet the first ink material INK1 into at least a portion of the first margin area MGA1 and the first emission area EA1.

[0269] The first ink material INK1 may include a liquid base resin, scattering particles, and a first ink that converts light in a fourth wavelength range into light in a first wavelength range.

[0270] At this time, due to the hydrophobic surface of the second partition wall 1543, the first ink material INK1 can be retained in the space overlapping with the partition portion 154 and the space surrounded by the partition portion 154 in the first emission region EA1 and the first margin region MGA1.

[0271] refer to Figure 24 The operation S152 of setting the first color conversion section 151 may further include the operation of forming the first color conversion section 151 by curing the first ink material INK1 retained in the first emission region EA1 and the first margin region MGA1.

[0272] Subsequently, the operation S153 of setting the second color conversion section 152 may include the operation of using a jetting device NZ that moves while facing the display area DA to jet the second ink material INK2 into at least a portion of the second margin area MGA2 and the second emission area EA2.

[0273] The second ink material INK2 may include a liquid base resin, scattering particles, and a second ink that converts light in a fourth wavelength range into light in a second wavelength range.

[0274] At this time, due to the hydrophobic surface of the second partition wall 1543, the second ink material INK2 can be retained in the space overlapping with the partition portion 154 and the space surrounded by the partition portion 154 in the second emission region EA1 and the second margin region MGA1.

[0275] refer to Figure 25 The operation S153 of setting the second color conversion section 152 may further include the operation of forming the second color conversion section 152 by curing the second ink material INK2 retained in the second emission region EA2 and the second margin region MGA2.

[0276] refer to Figure 26 In the operation S154 of setting the light-transmitting portion 153 and the scattering portion SCT, the light-transmitting portion 153 and the scattering portion SCT can be set by selectively etching a transparent organic material covering the encapsulation layer 140, the first color conversion portion 151, the second color conversion portion 152 and the separating portion 154.

[0277] The light-transmitting portion 153 and the scattering portion SCT may each include a base resin BSR and scattering particles SCP dispersed in the base resin BSR.

[0278] The light-transmitting portion 153 can be retained in the space overlapping with the dividing portion 154 and the space surrounded by the dividing portion 154 in the third emission region EA3.

[0279] The scattering portion SCT can be set on the first color conversion portion 151 in the first margin region MGA1 and the second color conversion portion 152 in the second margin region MGA2.

[0280] As a result, the scattering portion SCT and the color conversion layer 150 including the first color conversion portion 151, the second color conversion portion 152, the light transmission portion 153 and the separating portion 154 can be configured.

[0281] refer to Figure 27 In operation S160 of setting the color conversion cover layer 160, the color conversion cover layer 160 can be set by laminating an inorganic insulating material to cover the color conversion layer 150.

[0282] Color conversion capping layer 160 can also cover the scattering portion of SCT.

[0283] refer to Figure 28 In the operation of preparing the second support substrate 210, which is a sub-operation of operation S200 for preparing the second substrate 200, the second support substrate 210 can be prepared as a flat plate including a display area DA and a non-display area NDA.

[0284] refer to Figure 28 , Figure 29 and Figure 30 The operation of setting the color filter layer 220 may include setting a second filter portion 222 in the second emission region EA2 and the non-emission region NEA that transmits light within a second wavelength range, setting a first filter portion 221 in the first emission region EA1 and the non-emission region NEA that transmits light within a first wavelength range, and setting a third filter portion 223 in the third emission region EA3 and the non-emission region NEA that transmits light within a third wavelength range.

[0285] refer to Figure 28 In the operation of setting the second filter portion 222, the second filter portion 222 can be set on the second support substrate 210 in the second emission region EA2 and the non-emission region NEA.

[0286] refer to Figure 29 In the operation of setting the first filter portion 221, some of the first filter portions 221 can be set on the second support substrate 210 in the first emission region EA1, and the other first filter portions 221 can be set on the second filter portion 222 in the non-emission region NEA.

[0287] refer to Figure 30In the operation of setting the third filter portion 223, some of the third filter portions 223 can be set on the second support substrate 210 in the third emission region EA3, and the other third filter portions 223 can be set on the first filter portion 221 in the non-emission region NEA.

[0288] Therefore, the light-blocking portion 224 formed by laminating the second filter portion 222, the first filter portion 221, and the third filter portion 223 can be disposed in the non-emission region NEA. A color filter layer 220 including the first filter portion 221, the second filter portion 222, the third filter portion 223, and the light-blocking portion 224 can be disposed.

[0289] refer to Figure 31 The operation S200 of preparing the second substrate 200 may include the operation of setting the filter cap layer 230.

[0290] In the operation of setting the filter cover layer 230, the filter cover layer 230 can be set by laminating an inorganic insulating material to cover the color filter layer 220.

[0291] Furthermore, the operation S200 of preparing the second substrate 200 may further include the operation of setting spacers SPC that are spaced apart from each other on the filter cap layer 230.

[0292] In the operation of setting spacer SPCs, spacer SPCs spaced apart from each other can be set in the non-emissive region NEA by selectively etching organic material on the filter cap 230.

[0293] Each of the spacers SPCs may overlap with one or more of the first margin region MGA1 and the second margin region MGA2.

[0294] refer to Figure 32 In the operation S400 of bonding the first substrate 100 and the second substrate 200 following the operation S300 of forming the filler layer 300 on the first substrate 100 or the second substrate 200, the first substrate 100 and the second substrate 200 can be aligned such that the color conversion layer 150 of the first substrate 100 and the color filter layer 220 of the second substrate 200 can face each other, wherein the filler layer 300 is located between the color conversion layer 150 and the color filter layer 220. The filler layer 300 can be widely distributed by reducing the gap between the first substrate 100 and the second substrate 200. Then, the first substrate 100 and the second substrate 200 can be bonded together by the filler layer 300 and the second substrate 200. Figure 2 The sealing layer 400 is bonded together.

[0295] refer to Figure 33 ,exist Figure 14During the manufacturing of the display device 10, in operation S1512 of setting the reflective wall 1542, the mask MSK' on the metal material layer RFM can not only overlap with the edge of the top surface of the first partition wall 1541 and the side of the first partition wall 1541, but also overlap with the first margin region MGA1 and the second margin region MGA2.

[0296] Therefore, as Figure 34 As shown, by selectively etching the metal material layer RFM using a mask MSK', a reflective wall 1542 can be disposed on the side of the first partition wall 1541, and an extended reflective layer ERFL can be disposed on the encapsulation layer 140 in the first margin region MGA1 and the second margin region MGA2.

[0297] Although embodiments of the invention have been described with reference to the accompanying drawings, those skilled in the art will understand that the invention may be embodied in other predetermined forms without departing from its spirit and essential characteristics. Therefore, the described embodiments should be considered illustrative rather than restrictive in all respects.

Claims

1. A display device, comprising: The first substrate includes: The first support substrate includes emission regions arranged side by side and non-emission regions between the emission regions; The element layer is disposed on the first support substrate and includes a light-emitting element disposed in the emission region; An encapsulation layer is disposed on the component layer; and A color conversion layer, disposed on the encapsulation layer, converts the wavelength range of light emitted from some of the light-emitting elements, the color conversion layer including a light recovery component disposed in a portion of the non-emitting region; and The second substrate faces the first substrate.

2. The display device according to claim 1, wherein The launch area includes: The first emission region emits light within a first wavelength range; The second emission region emits light within a second wavelength range that is lower than the first wavelength range; And the third emission region emits light in a third wavelength range that is lower than the second wavelength range. The non-emission region includes: a first margin region connected to a portion of the first emission region; and a second margin region connected to a portion of the second emission region. The light-emitting element emits light within a fourth wavelength range that is equal to or lower than the third wavelength range. The color conversion layer includes: a first color conversion portion disposed in the first emission region and the first margin region, which converts light in the fourth wavelength range into light in the first wavelength range; a second color conversion portion disposed in the second emission region and the second margin region, which converts light in the fourth wavelength range into light in the second wavelength range; a light-transmitting portion disposed in the third emission region, which transmits and scatters light in the fourth wavelength range; and a separating portion disposed between the first color conversion portion, the second color conversion portion, and the light-transmitting portion. The light recovery component is disposed in the first margin region and the second margin region.

3. The display device according to claim 2, wherein, The dividing portion includes: A first partition wall is disposed between the first color conversion section, the second color conversion section, and the light-transmitting section; A reflective wall, covering the side of the first partition wall and reflecting light; and The second partition wall is disposed on the first partition wall and is hydrophobic.

4. The display device according to claim 3, wherein The second substrate includes: A second support substrate faces the first substrate and includes the emission region and the non-emission region; A color filter layer is disposed on one surface of the second support substrate; and a filter cap layer, covering the color filter layer, The color filter layer includes: a first filter portion disposed in the first emission region and transmitting light within the first wavelength range; a second filter portion disposed in the second emission region and transmitting light within the second wavelength range; a third filter portion disposed in the third emission region and transmitting light within the third wavelength range; and a light-blocking portion disposed in the non-emission region and blocking light. The light-recovery component overlaps with the light-blocking portion.

5. The display device according to claim 4, further comprising: A spacer is disposed between the first substrate and the second substrate; as well as A filler layer is disposed between the first substrate and the second substrate. in The first substrate further includes a color conversion capping layer covering the color conversion layer. The spacer and the filling layer are disposed between the color conversion cap layer and the filter cap layer, and The spacer overlaps with one or more of the first margin region and the second margin region.

6. The display device according to claim 4, wherein, The light recovery component includes a reflective layer disposed on the first color conversion portion in the first margin region and the second color conversion portion in the second margin region, and reflects light.

7. The display device according to claim 4, wherein The light recovery component includes a scattering portion, which is disposed on the first color conversion portion in the first margin region and the second color conversion portion in the second margin region, and scatters light. The scattering portion overlaps with the portion of the separating portion between the first color conversion portion and the second color conversion portion, and The scattering component includes a base resin with light-transmitting properties and scattering particles dispersed in the base resin.

8. The display device according to claim 7, wherein, The light-transmitting portion is provided together with the scattering portion and includes the base resin and the scattering particles.

9. The display device according to claim 7, wherein, The light-recovery component further includes an additional reflective layer disposed on the scattering portion and reflecting light.

10. The display device according to claim 4, wherein, The light-recovery component includes an extended reflective layer that extends from the reflective wall and is disposed on the encapsulation layer.

11. The display device according to any one of claims 4 to 10, wherein The first substrate further includes a circuit layer disposed on the first support substrate and including an emitting pixel driver electrically connected to the light-emitting element. The component layer is disposed on the circuit layer. The component layer includes: An anode electrode is disposed in the emission region; A pixel-defining layer is disposed in the non-emitting region and covers the edge of the anode electrode; A light-emitting layer is disposed on the anode electrode and the pixel defining layer; And a cathode electrode, disposed on the light-emitting layer, and Each of the light-emitting elements has a structure in which the light-emitting layer is located between the anode electrode and the cathode electrode facing each other.

12. A method of manufacturing a display device, the method comprising: Fabrication of the first substrate; Fabrication of a second substrate; A filler layer is disposed on the first substrate or the second substrate; as well as The first substrate and the second substrate are combined. in The fabrication of the first substrate includes: A first support substrate is prepared, the first support substrate including emission regions arranged side by side and non-emission regions between the emission regions; A circuit layer is disposed on the first support substrate; A component layer is disposed on the circuit layer, the component layer including light-emitting elements disposed in the emission region; An encapsulation layer is disposed on the component layer; A color conversion layer is disposed on the encapsulation layer; and Set a color conversion overlay layer to cover the color conversion layer, and Following the setting of the color conversion layer, the color conversion layer includes a light recovery component disposed in a portion of the non-emissive region.

13. The method of claim 12, wherein In the fabrication of the first support substrate, the emitting region includes a first emitting region that emits light within a first wavelength range, a second emitting region that emits light within a second wavelength range lower than the first wavelength range, and a third emitting region that emits light within a third wavelength range lower than the second wavelength range. The non-emitting region includes a first margin region connected to a portion of the first emitting region and a second margin region connected to a portion of the second emitting region. In the aforementioned arrangement of the element layer, the light-emitting element emits light within a fourth wavelength range that is equal to or lower than the third wavelength range, and The settings of the color conversion layer include: A dividing portion is provided in the entire non-emission region, excluding the first margin region and the second margin region; A first color conversion part is provided in the first emission region and the first margin region to convert the light in the fourth wavelength range into the light in the first wavelength range; A second color conversion section is provided in the second emission region and the second margin region to convert the light in the fourth wavelength range into the light in the second wavelength range; and A light-transmitting portion is provided in the third emission region to transmit and scatter the light in the fourth wavelength range.

14. The method of claim 13, wherein After the light-transmitting portion is configured, the separating portion is disposed between the first color conversion portion, the second color conversion portion, and the light-transmitting portion, and The configuration of the partition includes: A first partition wall is provided in the entire non-emission area, excluding the first margin area and the second margin area; A reflective wall for reflecting light is provided on the side of the first partition wall; as well as A second partition wall with hydrophobic properties is provided on at least a portion of the top surface of the first partition wall.

15. The method according to claim 14, wherein, In the aforementioned arrangement of the reflective wall, an extended reflective layer extending from the reflective wall is disposed in the first margin region and the second margin region, and The light-recovery component includes the extended reflective layer.

16. The method according to claim 13, wherein, The fabrication of the second substrate includes: fabricating a second support substrate, the second support substrate including the emitting region and the non-emitting region; forming a color filter layer on one surface of the second support substrate; and forming a filter cap layer covering the color filter layer. The configuration of the color filter layer includes: A second filter portion that transmits light within the second wavelength range is provided in the second emitting region and the non-emitting region; A first filter portion that transmits light within the first wavelength range is provided in the first emitting region and the non-emitting region; and A third filter portion that transmits light within the third wavelength range is provided in both the third emission region and the non-emission region. After the color filter layer is configured, the color filter layer includes a light-blocking portion having a structure in which the first filter portion, the second filter portion, and the third filter portion overlap each other, and After the first substrate and the second substrate are joined, the light-recovery component overlaps with the light-blocking portion.

17. The method of claim 16, wherein The fabrication of the second substrate further includes providing spacers spaced apart from each other on the filter cap layer. After the first substrate and the second substrate are bonded, the spacer and the filler layer are disposed between the color conversion cap layer and the filter cap layer, and The spacer overlaps with one or more of the first margin region and the second margin region.

18. The method of claim 13, wherein The setting of the color conversion layer further includes: After the light-transmitting portion is configured, reflective layers for reflecting light are provided on the first color conversion portion in the first margin region and the second color conversion portion in the second margin region, and The light-recovery component includes the reflective layer.

19. The method of claim 13, wherein In the arrangement of the light-transmitting portion, the scattering portion of the scattered light is disposed on the first color conversion portion in the first margin region and the second color conversion portion in the second margin region. The scattering portion overlaps with the portion of the separating portion between the first color conversion portion and the second color conversion portion. The light-transmitting portion and the scattering portion each include a base resin with light-transmitting properties and scattering particles dispersed in the base resin, and The light recovery component includes the scattering portion.

20. The method of claim 19, wherein The setting of the color conversion layer further includes: After the light-transmitting portion is configured, an additional reflective layer for reflecting light is provided on the scattering portion, and The light-recovery component further includes the additional reflective layer.

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