Automatic modification device and method for epoxy dual-curing adhesive

Abstract

The invention relates to the technical field of epoxy dual-curing adhesive modification, in particular to an epoxy dual-curing adhesive automatic modification device and a method thereof.The modification device comprises a supporting mechanism used for supporting equipment, the supporting mechanism comprises four supporting rods, a plurality of reinforcing rods are arranged on the four supporting rods, and the reinforcing rods are arranged on the supporting rods; a pulley is arranged at the bottom of each supporting rod; the mixing mechanism is used for containing colloid, the mixing mechanism is arranged on the supporting mechanism, the mixing mechanism comprises a mixing bin, the mixing bin is of a cavity structure with a hollow interior and an opening in the top, two turning covers are symmetrically arranged on the mixing bin, and telescopic rods are rotationally connected to the opposite sides of the two turning covers; the stirring mechanism is used for colloid modification, and the stirring mechanism is arranged in the mixing mechanism. The device has the advantages of being simple in structure, reasonable in design, capable of shortening modification time and reducing manpower and time investment, high in production efficiency and capable of achieving large-scale production, and is worthy of vigorous popularization and application.

Description

Technical Field

[0001] This invention relates to the field of epoxy dual-curing adhesive modification technology, and more specifically, to an automatic epoxy dual-curing adhesive modification device and method. Background Technology

[0002] Modifying epoxy dual-curing adhesives is an effective way to improve their performance. Common modification methods include chemical and physical modification. Chemical modification mainly involves introducing specific functional groups or polymer segments into the epoxy resin molecule to change its chemical properties, such as introducing flexible segments through transesterification or graft copolymerization to improve flexibility. Physical modification typically involves adding various fillers, toughening agents, coupling agents, and other additives to improve the adhesive's physical properties. For example, adding nanoparticles can enhance the strength and hardness of the adhesive layer, while adding rubber-based toughening agents can improve impact resistance.

[0003] Existing modification equipment has a complex structure and an unreasonable design, and often has many problems in the modification process. In particular, in traditional manual or semi-automatic modification operations, the proportioned raw materials are usually directly put into the mixing chamber during feeding, causing the raw materials to clump together and increasing the mixing and modification time. Moreover, the entire modification process is time-consuming, requiring a lot of manpower and time to prepare raw materials, mix and stir to react and process, resulting in low production efficiency and failing to meet the needs of large-scale industrial production.

[0004] In view of this, we propose an automatic modification device and method for epoxy dual-curing adhesives. Summary of the Invention

[0005] The purpose of this invention is to provide an automatic modification device and method for epoxy dual-curing adhesives to solve the above-mentioned technical problems. It has the advantages of simple structure, reasonable design, shortening modification time, reducing manpower and time input, high production efficiency, and large-scale production capability.

[0006] To solve the above technical problems, the present invention provides the following technical solution: an automatic modification device and method for epoxy dual-curing adhesive, comprising: a support mechanism for supporting equipment, the support mechanism comprising four support rods, a plurality of reinforcing rods being provided on the four support rods, and a pulley being provided at the bottom of each support rod; A mixing mechanism for holding colloids is placed on a support mechanism and includes a mixing chamber. The mixing chamber is a hollow cavity structure with an open top. Two flaps are symmetrically arranged on the mixing chamber, and a telescopic rod is rotatably connected to each of the two flaps on opposite sides. A stirring mechanism for colloid modification is placed inside a mixing mechanism. The stirring mechanism includes a rotating shaft with several support rods on it. From the outside to the inside, stirring blade 1, stirring blade 2, and stirring blade 3 are arranged on the several support rods. A drive mechanism for driving the modification device is located on the side of the mixing mechanism and includes a bracket. A rotary motor is installed inside the bracket. The output end of the rotary motor faces the mixing mechanism and is connected to a sprocket. A chain is installed on the sprocket. A sprocket is installed at the end of the chain away from the sprocket. A sprocket is installed inside the sprocket and is rotatably connected to the bracket. A feeding mechanism for feeding colloids is mounted on a mixing mechanism and includes a support frame. Four vibration dampers are mounted on the support frame, with the ends of the four dampers furthest from the support frame connected to the feeding frame. A filter plate is disposed within the feeding frame. Preferably, each of the support rods is provided with a support frame at its top, each of the support frames is connected to the outer wall of the mixing chamber on its side, and each of the reinforcing rods is arranged in an X shape.

[0007] Preferably, a gap is provided between the two flaps for the installation of the feeding mechanism, a discharge pipe is provided at the bottom of the mixing chamber, a valve is provided on the discharge pipe, and a horn-shaped anti-splash plate is provided on the outer wall of the bottom of the discharge pipe.

[0008] Preferably, each of the support rods is arranged in a cross shape, and both ends of the rotating shaft are rotatably connected to the mixing chamber. The end of the rotating shaft facing the drive mechanism extends out of the mixing chamber and is connected to the sprocket.

[0009] Preferably, there are two of each of the three stirring blades: the first stirring blade, the second stirring blade, and the third stirring blade. The two first stirring blades are rotated and staggered. The rotation radius of the first stirring blade is greater than that of the second stirring blade, and the rotation radius of the second stirring blade is greater than that of the third stirring blade.

[0010] Preferably, the diameter of the first sprocket is smaller than the diameter of the second sprocket.

[0011] Preferably, the support frame is provided with a feed pipe, each of the vibration dampers is provided with a damper, a vibration motor is provided on the side of the feed frame, and a discharge hopper is provided at the bottom of the feed frame.

[0012] Preferably, the discharge hopper is funnel-shaped, and the bottom of the discharge hopper extends into the feed pipe, wherein the diameter of the feed pipe is greater than the diameter of the bottom of the discharge hopper.

[0013] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention provides an automatic modification device for epoxy dual-curing adhesives. The modification device includes a support mechanism, a mixing mechanism, a stirring mechanism, a driving mechanism, and a feeding mechanism. The overall structure is simple and reasonably designed. The feeding mechanism includes a support frame with four vibration dampers. The ends of the four vibration dampers away from the support frame are connected to the feeding frame. A filter plate is installed inside the feeding frame. A feeding pipe is installed on the support frame. Each vibration damper has a damper inside. A vibration motor is installed on the side of the feeding frame, and a discharge hopper is installed at the bottom of the feeding frame. The discharge hopper is funnel-shaped, and its bottom extends into the feeding pipe. Through the support frame installed on the mixing chamber, the feeding frame filters and divides the raw materials into fine particles. The vibration motor increases the refining efficiency, and the vibration dampers dampen the vibration, which can disperse the distributed raw materials, prevent them from agglomerating, shorten the modification time of the adhesive, and improve the modification efficiency.

[0014] 2. The stirring mechanism in this invention includes a rotating shaft with several support rods. From the outside to the inside, three stirring blades (one, two, and three) are arranged on the support rods. Two of each of the three types are provided, with the two one stirring blades rotated out of alignment. The rotation radius of the one stirring blade is greater than that of the two stirring blades, and the rotation radius of the two stirring blades is greater than that of the three stirring blades. The support rods on the rotating shaft connect the three stirring blades (one, two, and one) with gradually increasing rotation radii from the inside out, thus stirring and modifying the raw materials in the mixing chamber, thereby increasing the modification effect of the colloid. Attached Figure Description

[0015] Figure 1 This is a front view structural diagram of the present invention; Figure 2 This is a bottom-view structural diagram of the present invention; Figure 3 For the present invention Figure 1 A front view schematic diagram of the stirring mechanism; Figure 4 For the present invention Figure 1 A side view of the stirring mechanism; Figure 5 For the present invention Figure 1 A side view of the feed mechanism.

[0016] Explanation of the labels in the diagram: 1. Support mechanism; 11. Support rod; 12. Reinforcing rod; 13. Pulley; 14. Support frame; 2. Mixing mechanism; 21. Mixing chamber; 22. Flip cover; 23. Telescopic rod; 24. Discharge pipe; 25. Splash guard; 3. Stirring mechanism; 31. Rotating shaft; 32. Support rod; 33. Stirring blade one; 34. Stirring blade two; 35. Stirring blade three; 4. Drive mechanism; 41. Bracket; 42. Rotary motor; 43. Sprocket one; 44. Chain; 45. Sprocket two; 5. Feeding mechanism; 51. Support frame; 52. Feeding pipe; 53. Vibration damper; 54. Feeding frame; 55. Filter plate; 56. Vibration motor; 57. Discharge hopper. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] In the description of the embodiments of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0019] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0020] Please see Figure 1 and Figure 2The present invention relates to an automatic modification device for epoxy dual-curing adhesive, including a support mechanism 1 for supporting equipment. The support mechanism 1 includes four support rods 11, and a plurality of reinforcing rods 12 are provided on the four support rods 11. Each support rod 11 is provided with a pulley 13 at its bottom and a support frame 14 at its top. Each support frame 14 is connected to the outer wall of the mixing chamber 21 on its side. Each reinforcing rod 12 is arranged in an X shape. The mixing mechanism 2 is used to hold the colloid. The mixing mechanism 2 is placed on the support mechanism 1 and includes a mixing chamber 21. The mixing chamber 21 is a cavity structure with a hollow interior and an open top. Two flip covers 22 are symmetrically arranged on the mixing chamber 21. A telescopic rod 23 is rotatably connected to the opposite side of the two flip covers 22. A gap is provided between the two flip covers 22 for the installation of the feeding mechanism 5. A discharge pipe 24 is provided at the bottom of the mixing chamber 21. A valve is provided on the discharge pipe 24, and a horn-shaped anti-splash plate 25 is provided on the outer wall of the bottom of the discharge pipe 24. The drive mechanism 4 is used to drive the modification device. The drive mechanism 4 is located on the side of the mixing mechanism 2. The drive mechanism 4 includes a bracket 41. A rotary motor 42 is installed inside the bracket 41. The output end of the rotary motor 42 faces the mixing mechanism 2 and is connected to a first sprocket 43. A chain 44 is installed on the first sprocket 43. A second sprocket 45 is installed at the end of the chain 44 away from the first sprocket 43. A short shaft that is rotatably connected to the bracket 41 is installed inside the second sprocket 45. Please refer to it again. Figure 1 and Figure 2 The mixing chamber 21 is supported by the support rod 11, and the pulley 13 at the bottom of the support rod 11 facilitates the transfer of the device. The two flip covers 22, which are rotatably set on the mixing chamber 21, facilitate the observation of the modification status during the modification process and also facilitate the addition of raw materials at any time.

[0021] Please see Figure 1 , Figure 3 and Figure 4 A stirring mechanism 3 is used for colloid modification. The stirring mechanism 3 is placed inside the mixing mechanism 2 and includes a rotating shaft 31. Several support rods 32 are provided on the rotating shaft 31. From the outside to the inside, stirring blades 33, 34 and 35 are provided on the support rods 32. Each support rod 32 is arranged in a cross shape. Both ends of the rotating shaft 31 are rotatably connected to the mixing chamber 21. The end of the rotating shaft 31 facing the drive mechanism 4 extends out of the outside of the mixing chamber 21 and is connected to the sprocket 45. There are two stirring blades 33, 34 and 35. The two stirring blades 33 are rotated and staggered. The rotation radius of stirring blade 33 is greater than that of stirring blade 34. The rotation radius of stirring blade 34 is greater than that of stirring blade 35. The diameter of sprocket 43 is smaller than that of sprocket 45. Please refer to it again. Figure 1 , Figure 3 and Figure 4 By using stirring blades 35, 34, and 33, which are set on the support rod 32 with gradually increasing rotation radii from the inside out, the raw materials can be stirred and modified as a whole during the modification process, thereby improving the modification effect.

[0022] Please see Figure 1 and Figure 5 Feeding mechanism 5 is used for colloid feeding. Feeding mechanism 5 is placed on mixing mechanism 2 and includes support frame 51. Four dampers 53 are provided on support frame 51. The end of the four dampers 53 away from support frame 51 is connected to feeding frame 54. Filter plate 55 is provided in feeding frame 54. Feed pipe 52 is provided on support frame 51. Damper is provided inside each damper 53. Vibration motor 56 is provided on the side of feeding frame 54 and discharge hopper 57 is provided at the bottom of feeding frame 54. Discharge hopper 57 is funnel-shaped and the bottom of discharge hopper 57 extends into feed pipe 52. The diameter of feed pipe 52 is larger than the diameter of the bottom of discharge hopper 57. Please refer to it again. Figure 1 and Figure 5 Raw materials are placed into the feed frame 54, and the feed frame 54 is vibrated by the vibration motor 56. The filter plate 55 refines the raw materials, and the vibration damper 53 reduces the vibration. The refined raw materials fall from the feed pipe 52 into the mixing chamber 21 through the discharge hopper 57.

[0023] The embodiments disclosed in this invention are preferred embodiments, but are not limited thereto. Those skilled in the art can easily understand the spirit of this invention based on the above embodiments and make different extensions and variations, but as long as they do not depart from the spirit of this invention, they are all within the protection scope of this invention.

Claims

1. An automatic modification device for epoxy dual-curing adhesive, characterized in that, include: A support mechanism (1) is used to support the equipment. The support mechanism (1) includes four support rods (11), and a number of reinforcing rods (12) are provided on the four support rods (11). Each support rod (11) is provided with a pulley (13) at its bottom. A mixing mechanism (2) is used to hold colloids. The mixing mechanism (2) is placed on a support mechanism (1). The mixing mechanism (2) includes a mixing chamber (21). The mixing chamber (21) is a cavity structure with a hollow interior and an open top. Two flip covers (22) are symmetrically arranged on the mixing chamber (21). A telescopic rod (23) is rotatably connected to the opposite side of the two flip covers (22). A stirring mechanism (3) is used for colloid modification. The stirring mechanism (3) is placed inside the mixing mechanism (2). The stirring mechanism (3) includes a rotating shaft (31). A plurality of support rods (32) are provided on the rotating shaft (31). A stirring blade 1 (33), a stirring blade 2 (34) and a stirring blade 3 (35) are provided on the plurality of support rods (32) from the outside to the inside. A drive mechanism (4) is used to drive the modification device. The drive mechanism (4) is located on the side of the mixing mechanism (2). The drive mechanism (4) includes a bracket (41). A rotary motor (42) is provided inside the bracket (41). The output end of the rotary motor (42) is facing the mixing mechanism (2) and is connected to a sprocket (43). A chain (44) is provided on the sprocket (43). A sprocket (45) is provided at the end of the chain (44) away from the sprocket (43). A short shaft that is rotatably connected to the bracket (41) is provided inside the sprocket (45). Feeding mechanism (5) is used for colloid feeding. The feeding mechanism (5) is placed on the mixing mechanism (2). The feeding mechanism (5) includes a support frame (51). Four dampers (53) are provided on the support frame (51). The end of the four dampers (53) away from the support frame (51) is connected to a feeding frame (54). A filter plate (55) is provided inside the feeding frame (54).

2. The automatic modification device for epoxy dual-curing adhesive according to claim 1, characterized in that, Each of the support rods (11) is provided with a support frame (14) at the top, and each of the support frames (14) is connected to the outer wall of the mixing chamber (21) on the side. Each of the reinforcing rods (12) is provided in an X shape.

3. The automatic modification device for epoxy dual-curing adhesive according to claim 1, characterized in that, A gap is provided between the two flaps (22) for the installation of the feeding mechanism (5). A discharge pipe (24) is provided at the bottom of the mixing chamber (21). A valve is provided on the discharge pipe (24), and a horn-shaped anti-splash plate (25) is provided on the bottom outer wall of the discharge pipe (24).

4. The automatic modification device for epoxy dual-curing adhesive according to claim 1, characterized in that, Each of the support rods (32) is arranged in a cross shape. Both ends of the shaft (31) are rotatably connected to the mixing chamber (21), and the end of the shaft (31) facing the drive mechanism (4) extends out of the outside of the mixing chamber (21) and is connected to the second sprocket (45).

5. The automatic modification device for epoxy dual-curing adhesive according to claim 1, characterized in that, Two stirring blades are provided for each of the three stirring blades: one (33), two (34), and three (35). The two stirring blades are rotated and staggered. The rotation radius of the stirring blade is greater than that of the stirring blade, and the rotation radius of the stirring blade is greater than that of the stirring blade.

6. The automatic modification device for epoxy dual-curing adhesive according to claim 1, characterized in that, The diameter of sprocket one (43) is smaller than the diameter of sprocket two (45).

7. The automatic modification device for epoxy dual-curing adhesive according to claim 1, characterized in that, The support frame (51) is provided with a feed pipe (52), each of the vibration dampers (53) is provided with a damper, the feed frame (54) is provided with a vibration motor (56) on the side, and the feed frame (54) is provided with a discharge hopper (57) at the bottom.

8. The automatic modification device for epoxy dual-curing adhesive according to claim 7, characterized in that, The discharge hopper (57) is funnel-shaped, and the bottom of the discharge hopper (57) extends into the feed pipe (52), the diameter of which is greater than the diameter of the bottom of the discharge hopper (57).

9. A method of using the automatic modification device for epoxy dual-curing adhesive according to any one of claims 1-8, characterized in that, Includes the following steps: S1. Raw material preparation: According to the modification target and formulation requirements, put the epoxy resin, photoinitiator, thermosetting agent, modifier and other raw materials into the corresponding storage tanks respectively. S2. Raw material mixing: Each raw material is transported to the mixing mechanism (2) according to the set ratio; the stirring mechanism (3) is driven by the driving mechanism (4) to stir and mix the raw materials at a specific speed so that each component is fully and evenly dispersed to form a preliminary mixed adhesive. S3. Photocuring treatment: The mixed or reacted adhesive is delivered to the photocuring system, and the ultraviolet light source is turned on. This causes the photoinitiator in the adhesive to absorb light energy, initiating a photocuring reaction. The adhesive quickly develops initial tack or partially cures, forming a certain strength and shape. S4. Heat curing treatment: After light curing, the adhesive enters the heat curing system. According to the set heat curing program, the temperature is raised and maintained for a certain time to allow the heat curing agent in the adhesive to play its role, further complete the curing reaction, and improve the crosslinking density and various properties of the adhesive, such as heat resistance and mechanical strength. S5. Quality Inspection and Packaging: Conduct quality inspections on the modified epoxy dual-curing adhesive, including testing its viscosity, hardness, bond strength, curing time, and other performance indicators. After passing the inspection, package the adhesive according to the specified packaging specifications for storage and transportation.

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