Assembly production equipment and production process of PCB board and heat sink

Abstract

The application discloses a kind of assembly production equipment and production process of PCB and radiator, it is related to the technical field of mechanical manufacturing, the rack is equipped with upper transport line and lower recovery line, the feeding mechanism includes the code scanner and printer, which are installed on the rack, manually place the radiator on the carrier, the code scanner is used to scan the parameter information of the carrier and / or the radiator and store in the information label printed by the printer, installed on the rack, installed on the rack, the PCB is loaded into the corresponding radiator, one The radiator corresponds to at least one PCB, installed on the rack, for riveting the PCB and the radiator, to process finished product PCB, installed on the rack, for PCT and ICT detection of the finished product PCB;The technical scheme provided by the application improves the production and processing efficiency of PCB and radiator.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mechanical manufacturing, in particular to a PCB and radiator assembling production equipment and production process. BACKGROUND

[0002] In the assembling process of the PCB and the radiator, it is generally required to pass through multi-process assembling and processing. Since each processing process is processed separately, the PCB and the radiator need to be transported for multiple times in the processing process, which is time-consuming and laborious, and the production efficiency is low. SUMMARY

[0003] The main purpose of the present application is to provide a PCB and radiator assembling production equipment and production process, which aims to improve the production and processing efficiency of the PCB and the radiator.

[0004] To achieve the above purpose, the PCB and radiator assembling production equipment provided by the present application comprises:

[0005] A rack, wherein an upper transport line and a lower recovery line are arranged on the rack;

[0006] A feeding mechanism, wherein a code scanner and a printer are arranged on the rack, a worker places a radiator on a carrier, the code scanner is used to scan parameter information of the carrier and / or the radiator and store the information in an information label printed by the printer;

[0007] A dispensing mechanism, which is arranged on the rack and used to apply thermal paste to the radiator on the carrier;

[0008] A PCB taking and placing mechanism, which is arranged on the rack and used to load a PCB into a corresponding radiator, wherein one radiator corresponds to at least one PCB;

[0009] A riveting mechanism, which is arranged on the rack and used to rivet and press the PCB and the radiator to process a finished product PCB;

[0010] A detection mechanism, which is arranged on the rack and used to perform PCT and ICT detection on the finished product PCB; and

[0011] A reflow mechanism, wherein the upper transport line is used to transport the carrier to the feeding mechanism, the dispensing mechanism, the PCB taking and placing mechanism, the riveting mechanism and the detection mechanism in sequence for corresponding processing and detection, the reflow mechanism is used to switch the idle carrier between the upper transport line and the lower recovery line, and the lower recovery line is used to transport the idle carrier to the feeding mechanism.

[0012] In an embodiment, the feeding mechanism comprises a feeding assembly and a discharging assembly, both of which are installed on the frame, the feeding assembly is used to transport the packaging box containing the heat sink, and the heat sink in the packaging box is manually placed on the carrier of the upper conveying line, and the discharging assembly is used to transport the empty packaging box.

[0013] In an embodiment, the frame is provided with a dispensing position, and the dispensing mechanism comprises a dispensing conveying assembly, a dispensing lifting assembly, a dispensing sensor and a dispensing head, when the upper conveying line transports the carrier containing the heat sink to the dispensing position, the dispensing lifting assembly lifts the carrier of the dispensing position, the dispensing sensor and the dispensing head are both installed on the dispensing conveying assembly, the dispensing sensor is used to detect the position information of the heat sink on the carrier, and the dispensing conveying assembly sequentially performs dispensing treatment on the heat sinks on the carrier according to the position information.

[0014] In an embodiment, the dispensing mechanism further comprises an electronic scale, a scraper, a waste glue box and an immersion box, both of which are installed on the frame, when the dispensing head completes dispensing, the dispensing head moves to the scraper to remove the residual glue at the opening of the dispensing head, the removed glue flows into the waste glue box, and the dispensing head moves into the immersion box for solidification prevention treatment, and before the dispensing head is used again each time, the dispensing head releases glue to the electronic scale.

[0015] In an embodiment, the frame is provided with a taking and placing position, and the PCB taking and placing mechanism comprises a PCB storage assembly, a mechanical arm, a taking and placing lifting assembly and a taking and placing sensor, both of which are installed on the frame, when the upper conveying line moves the heat sink after dispensing to the taking and placing position, the taking and placing lifting assembly lifts the carrier of the taking and placing position, the mechanical arm takes the PCB at the PCB storage assembly and places it on the corresponding heat sink of the taking and placing position.

[0016] In an embodiment, the PCB storage assembly comprises an empty tray storage rack, a tray taking rack, a tray conveying assembly and a plurality of bearing trays, the bearing trays are all rotationally installed on the empty tray storage rack, the empty tray storage rack is provided with a plurality of limiting rods, at least one limiting rod is arranged on each bearing tray, when the bearing tray abuts against the limiting rod, the bearing tray is horizontally arranged, when the tray taking rack is empty of the tray containing the PCB, the tray conveying assembly transports the empty tray to the lower side of the empty tray storage rack, lifts the empty tray and drives the bearing tray to rotate, when the empty tray is separated from the bearing tray, the bearing tray is reset, the tray conveying assembly is lowered, and the empty tray is carried on the bearing tray.

[0017] In an embodiment, the PCB plate taking and placing mechanism further comprises a defective product recycling box, which is installed on the rack, and when the PCB plate taken by the PCB plate taking and placing mechanism is detected as a defective product, the defective product is placed in the defective product recycling box.

[0018] In an embodiment, the PCB plate taking and placing mechanism further comprises a taking and placing cylinder, an extension plate and a change plate, the change plate is provided with a vacuum suction accessory, the taking and placing cylinder is installed on the mechanical arm, an output shaft of the taking and placing cylinder is in transmission connection with the extension plate, and the change plate is detachably connected to the extension plate, when the mechanical arm moves to the tray taking rack, the taking and placing cylinder drives the extension plate to extend or retract, so that the vacuum suction accessory adsorbs and takes the PCB plate on the tray taking rack.

[0019] In an embodiment, the detection mechanism comprises a detection box, a detector and a detection jacking assembly, the rack is provided with a detection position, the detector is installed in the detection box, and a side of the detection box facing the detection position is provided with a floating plate, when the upper transport line transports the riveting and pressing carrier to the detection position, the detection jacking assembly jacks up the carrier, when the detection box is inserted with the PCB plate and the heat sink in the carrier, the detector detects and processes the PCB plate and the heat sink, and the floating plate is clamped between the PCB plate, the heat sink and the detection box.

[0020] The application further provides a production process of the PCB plate and heat sink assembling production equipment.

[0021] When the dispensing head is reactivated each time, the dispensing head is controlled to dispense glue on the electronic scale for a predetermined time, the amount of glue dispensed by the dispensing head within the predetermined time is weighed, and whether the dispensing head dispenses glue normally is judged.

[0022] When dispensing is completed each time and the dispensing head is not used again within a predetermined time, the dispensing head is controlled to the glue scraping plate for glue scraping treatment, and then is placed in a soaking box containing anti-solid-liquid.

[0023] The PCB board and heat sink assembly production equipment of the present invention includes a frame, a loading mechanism, a dispensing mechanism, a PCB board pick-and-place mechanism, a riveting mechanism, a testing mechanism, and a reflow mechanism. An upper transport line transports the carrier to the loading mechanism, where the heat sink is manually placed in a predetermined position on the carrier. A barcode scanner scans the relevant information codes on the heat sink and the carrier, then binds the two types of information codes, and finally prints the codes and affixes them to the heat sink or carrier. Next, the upper transport line transports the carrier containing the heat sink from the loading mechanism to the dispensing mechanism, where it applies adhesive to the heat sink to coat it with thermal paste. Further, the upper transport line transports the carrier with the applied adhesive from the dispensing mechanism to the PCB board pick-and-place mechanism, where the PCB board is picked up and placed. The PCB board is loaded with the corresponding heatsink, with each heatsink corresponding to at least one PCB board. Then, the upper transport line transports the carrier with the PCB board loaded to the riveting mechanism, which rivets the PCB and heatsink together. Finally, the inspection structure performs PCT and ICT inspections on the PCB board and heatsink on the riveted carrier to complete the processing. After passing through the inspection mechanism, the carrier is transported from the upper transport line to the lower recycling line via the return mechanism. The lower recycling line then transports the carrier to the area below the loading mechanism, and then back to the upper transport line via the return mechanism, and finally to the loading mechanism. This allows the assembly and processing of the PCB board and heatsink to be completed on the same production line, eliminating the need for multiple transfers between different machines, thereby improving the production efficiency of the PCB board and heatsink. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0025] Figure 1 A schematic diagram of an embodiment of the PCB board and heat sink assembly production equipment provided by the present invention;

[0026] Figure 2 for Figure 1 Schematic diagram of the feeding mechanism;

[0027] Figure 3 for Figure 1 A schematic diagram of the dispensing mechanism;

[0028] Figure 4 for Figure 3 Schematic diagram of the structure of the dispensing and transport assembly;

[0029] Figure 5 Fig. 2 is a structural schematic view of a dispensing head lifting assembly in the middle part of the device; Figure 3 Fig. 3 is a structural schematic view of a dispensing head lifting assembly in the middle part of the device;

[0030] Figure 6 Fig. 4 is a structural schematic view of a dispensing head lifting assembly in the middle part of the device; Figure 3 Fig. 5 is a structural schematic view of a dispensing head lifting assembly in the middle part of the device;

[0031] Figure 7 Fig. 6 is a structural schematic view of a dispensing head lifting assembly in the middle part of the device; Figure 1 Fig. 7 is a structural schematic view of a PCB plate taking and placing mechanism in the middle part of the device; Fig. 8 is a structural schematic view of a PCB plate taking and placing mechanism in the middle part of the device;

[0032] Fig. 9 is a structural schematic view of a PCB plate taking and placing mechanism in the middle part of the device; Figure 8 Fig. 10 is a structural schematic view of a PCB plate taking and placing mechanism in the middle part of the device; Figure 7 Fig. 11 is a structural schematic view of a PCB plate taking and placing mechanism in the middle part of the device; Fig. 12 is a structural schematic view of a PCB plate taking and placing mechanism in the middle part of the device;

[0033] Fig. 13 is a structural schematic view of a PCB plate taking and placing mechanism in the middle part of the device; Figure 9 Fig. 14 is an enlarged view of a part A in the middle part of the device; Figure 8 Fig. 15 is an enlarged view of a part A in the middle part of the device; Fig. 16 is an enlarged view of a part A in the middle part of the device;

[0034] Fig. 17 is an enlarged view of a part A in the middle part of the device; Figure 10 Fig. 18 is a structural schematic view of a riveting mechanism in the middle part of the device; Figure 7 Fig. 19 is a structural schematic view of a riveting mechanism in the middle part of the device; Fig. 20 is a structural schematic view of a riveting mechanism in the middle part of the device;

[0035] Fig. 21 is a structural schematic view of a riveting mechanism in the middle part of the device; Figure 11 Fig. 22 is a structural schematic view of a riveting mechanism in the middle part of the device. Figure 1 Fig. 23 is a structural schematic view of a riveting mechanism in the middle part of the device. Fig. 24 is a structural schematic view of a riveting mechanism in the middle part of the device.

[0036] Fig. 25 is a structural schematic view of a riveting mechanism in the middle part of the device. Fig. 26 is a structural schematic view of a riveting mechanism in the middle part of the device.

[0037] 10, frame; 11, upper layer conveying line; 12, lower layer recycling line; 20, feeding mechanism; 21, feeding assembly; 22, discharging assembly; 30, dispensing mechanism; 31, dispensing conveying assembly; 311, X-axis support; 312, Y-axis support; 313, Z-axis support; 32, dispensing head lifting assembly; 321, lifting fixed frame; 322, lifting movable frame; 323, lifting cylinder; 324, lifting block; 325, lifting linear bearing; 326, lifting guide rod; 33, dispensing inductor; 34, dispensing head; 35, electronic scale; 36, glue scraping plate; 37, waste glue box; 38, soaking box; 40, PCB plate taking and placing mechanism; 41, PCB plate storage assembly; 411, empty tray storage rack; 413, tray conveying assembly; 414, bearing tray; 415, limiting rod; 42, mechanical arm; 43, taking and placing lifting assembly; 45, defective product recycling box; 46, taking and placing cylinder; 47, telescopic plate; 48, model changing plate; 49, vacuum suction accessory; 50, riveting mechanism; 71, first reflow mechanism; 72, second reflow mechanism.

[0038] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0039] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0040] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0041] In addition, if the embodiments of the present application involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel solutions are included, for example, "A and / or B" includes A solution, or B solution, or A and B solution. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person of ordinary skill in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist and is not within the scope of protection claimed by the present application.

[0042] Referring to Figures 1 to 11 The present application provides a kind of PCB and heat sink assembly production equipment, comprising:

[0043] Frame 10, the upper layer transport line 11 and lower layer recovery line 12 are equipped on the frame 10;

[0044] Feeding mechanism 20, the feeding mechanism 20 includes scanning code machine and printer, manually places heat sink on carrier, and the scanning code machine is used to scan the parameter information of the carrier and / or the heat sink and is stored in the information label printed by the printer;

[0045] Dispensing mechanism 30 is installed on the frame 10, for the heat sink on the carrier is coated with heat-conducting paste;

[0046] PCB plate pick-and-place mechanism 40 is installed on the frame 10, and the PCB plate is loaded into the corresponding heat sink, and at least one PCB plate is corresponding to the heat sink;

[0047] A riveting mechanism 50 is installed on the frame 10 and used for riveting the PCB and the heat sink to process the finished product PCB.

[0048] A detection mechanism is installed on the frame 10 and used for PCT and ICT detection of the finished product PCB.

[0049] A reflow mechanism is used for switching the idle carrier between the upper transport line 11 and the lower recovery line 12 after processing, and the lower recovery line 12 is used for transporting the idle carrier to the feeding mechanism 20.

[0050] The assembly production equipment of the PCB and the heat sink in the technical scheme includes a frame 10, a feeding mechanism 20, a dispensing mechanism 30, a PCB plate taking and placing mechanism 40, a riveting mechanism 50, a detection mechanism, and a reflow mechanism. The upper transport line 11 transports the carrier to the feeding mechanism 20, and then the heat sink is placed at the predetermined position of the carrier manually. The code scanning machine scans the relevant information code on the heat sink and the carrier, and then binds the two information codes. Finally, the code is printed out by the printer and pasted on the heat sink or the carrier. Then the upper transport line 11 transports the carrier with the heat sink at the feeding mechanism 20 to the dispensing mechanism 30, and the dispensing mechanism 30 dispenses the heat sink to coat the heat-conducting paste on the heat sink. Further, the upper transport line 11 transports the carrier after dispensing at the dispensing mechanism 30 to the PCB plate taking and placing mechanism 40, and then the PCB plate is loaded into the corresponding heat sink through the PCB plate taking and placing mechanism 40, wherein one heat sink corresponds to at least one PCB plate. Then the upper transport line 11 transports the carrier with the loaded PCB plate to the riveting mechanism 50, and the riveting mechanism 50 rivets the PCB and the heat sink. Finally, the detection mechanism detects the PCB and the heat sink on the carrier after riveting to complete the processing. The carrier after the detection mechanism is transported to the lower recovery line 12 by the reflow mechanism from the upper transport line 11. Then the lower recovery line 12 transports the carrier to below the feeding mechanism 20, and then the upper transport line 11 is transported to the feeding mechanism 20 through the reflow mechanism. Thus, the assembly and processing of the PCB and the heat sink are completed on the same production line, and multiple transfers between multiple devices are not required, thereby improving the production and processing efficiency of the PCB and the heat sink. The qualified products of the PCB and the heat sink after the detection mechanism are packaged by the packaging machine, and the unqualified products enter the recovery process.

[0051] The return mechanism includes a first return mechanism 71 and a second return mechanism 72. The first return mechanism 71 is installed upstream of the feeding mechanism 20. When the lower recovery line 12 transports the empty carrier to the first return mechanism 71, the first return mechanism 71 lifts the empty carrier and pushes it into the upper transport line 11, and the upper transport line 11 transports the empty carrier to the feeding mechanism 20. The second return mechanism 72 is installed downstream of the detection mechanism, and is used to lower the empty carrier flowing into the detection mechanism to the lower recovery line 12 and push it onto the lower recovery line 12.

[0052] The first return mechanism 71 includes a first return cylinder, a first return guide rail, and a first return frame. The first return frame is slidingly connected to the first return guide rail. The first return cylinder is installed on the rack 10 and is drivingly connected to the first return frame to drive the first return frame to slide on the first return guide rail, thereby driving the carrier on the first return frame to rise to the level of the upper transport line 11, and then pushing the carrier onto the upper transport line 11 by the driving member and the push rod. The second return mechanism 72 has the same principle as the first return mechanism 71, and will not be described here.

[0053] Referring to Figure 1 and Figure 2 , specifically, the feeding mechanism 20 includes an inlet assembly 21 and an outlet assembly 22, both of which are installed on the rack 10. The inlet assembly 21 is used to transport the packaging box containing the heat sink. The heat sink in the packaging box is placed on the carrier of the upper transport line 11 by manual operation. The outlet assembly 22 is used to transport the empty packaging box. It can be understood that the packaging box on the inlet assembly 21 contains a large number of heat sinks. The heat sinks in the packaging box are placed in the corresponding carriers by manual operation, and then the empty packaging box is placed on the outlet assembly 22 by manual operation and transported to the corresponding recovery position by the outlet assembly 22 to recover the packaging box.

[0054] The inlet assembly 21 includes an inlet motor, an inlet driving wheel, an inlet driven wheel, and an inlet chain. The inlet motor is installed on the rack 10. The inlet driving wheel and the inlet driven wheel are rotatably connected to the rack 10. The inlet chain is driven to be sleeved on the inlet driving wheel and the inlet driven wheel. The inlet motor is drivingly connected to the inlet driving wheel to drive the inlet chain and the inlet driven wheel to rotate, thereby driving the packaging box on the inlet chain to move. The inlet chain can also be a transmission belt. The structures of the upper transport line 11, the lower recovery line 12, and the outlet assembly 22 are basically the same as that of the inlet assembly 21.

[0055] Referring to Figures 3 to 6Specifically, the rack 10 is provided with a dispensing position, the dispensing mechanism 30 comprises a dispensing conveying assembly 31, a dispensing lifting assembly 32, a dispensing sensor 33 and a dispensing head 34, when the upper conveying line 11 conveys the carrier carrying the heat sink to the dispensing position, the dispensing lifting assembly 32 lifts the carrier at the dispensing position, the dispensing sensor 33 and the dispensing head 34 are both installed on the dispensing conveying assembly 31, the dispensing sensor 33 is used to detect the position information of the heat sink on the carrier, and the dispensing conveying assembly 31 performs dispensing treatment on the plurality of heat sinks on the carrier in sequence according to the position information.

[0056] The position information of the heat sink on the carrier is detected by the dispensing sensor 33, then the idle dispensing conveying assembly 31 drives the dispensing head 34 to move and performs dispensing treatment on the heat sink, wherein the heat-conducting paste is dispensed on the heat sink, so that the heat in the heat sink is dissipated through the heat-conducting paste, thereby improving the heat dissipation effect of the heat sink.

[0057] The dispensing conveying assembly 31 comprises an X-axis cylinder, an X-axis support 311, a Y-axis support 312, a Y-axis cylinder, a Z-axis support 313 and a Z-axis cylinder, wherein the X-axis support 311, the Y-axis support 312 and the Z-axis support 313 are respectively provided with X-axis sliding rails, Y-axis sliding rails and Z-axis sliding rails, wherein the dispensing head 34 is slidingly connected to the Z-axis sliding rails and is drivingly connected to the Z-axis cylinder, the Z-axis support 313 is slidingly connected to the Y-axis sliding rails and is drivingly connected to the Y-axis cylinder, the Y-axis support 312 is slidingly connected to the X-axis sliding rails and is drivingly connected to the X-axis cylinder, and the X-axis support 311 is installed on the rack 10.

[0058] The dispensing lifting assembly 32 comprises a lifting fixed frame 321, a lifting movable frame 322, a lifting cylinder 323, a lifting block 324, a plurality of lifting linear bearings 325 and a plurality of lifting guide rods 326, the lifting fixed frame 321 is installed on the rack 10, one lifting linear bearing 325 is correspondingly sleeved on one lifting guide rod 326, the lifting linear bearing 325 and the lifting cylinder 323 are fixed on the lifting fixed frame 321, one end of the lifting guide rod 326 is fixed on the lifting movable frame 322, the lifting block 324 is drivingly connected to the output shaft of the lifting cylinder 323, and the lifting cylinder 323 drives the lifting movable frame 322 to ascend or descend relative to the lifting fixed frame 321 through the lifting block 324.

[0059] Further, the glue dispensing mechanism 30 further comprises an electronic scale 35, a glue scraping plate 36, a waste glue box 37 and a soaking box 38, which are all mounted on the frame 10. When the glue dispensing head 34 finishes dispensing glue, the glue dispensing head 34 moves to the glue scraping plate 36 to scrape off the glue remaining on the opening of the glue dispensing head 34, and the scraped glue flows into the waste glue box 37, and the glue dispensing head 34 is moved into the soaking box 38 for anti-solidification treatment. Before the glue dispensing head 34 is used again each time, the glue dispensing head 34 releases glue onto the electronic scale 35. After the dispensing of glue on the heat sink on each carrier is completed, the glue in the glue dispensing head 34 is likely to coagulate at the opening of the glue dispensing head 34, thereby blocking the glue dispensing head 34, and thus affecting the use of the glue dispensing head 34 next time. Therefore, in the technical scheme of the present application, the glue remaining on the opening of the glue dispensing head 34 is scraped off by the glue scraping plate 36 after the dispensing of glue is completed each time, and then the glue dispensing head 34 is soaked in the soaking box 38 containing anti-solidification liquid, so as to avoid the coagulation of the glue in the glue dispensing head 34, thereby improving the dispensing effect of the glue dispensing mechanism 30. If the interval time of dispensing glue between adjacent two carriers is short, the glue dispensing head 34 does not need to be scraped; if the interval of dispensing glue between adjacent two carriers is long, the scraping and soaking treatment is needed after the dispensing of glue on the heat sink in each carrier is completed.

[0060] With reference to Figures 7 to 10 Specifically, the frame 10 is provided with a taking and placing position, and the PCB taking and placing mechanism 40 comprises a PCB storage assembly 41, a mechanical arm 42, a taking and placing jacking assembly 43 and a taking and placing sensor, which are all mounted on the frame 10. When the upper conveying line 11 moves the heat sink after dispensing of glue to the taking and placing position, the taking and placing jacking assembly 43 jacks up the carrier of the taking and placing position, and the mechanical arm 42 takes and places the PCB on the PCB storage assembly 41 on the corresponding heat sink on the taking and placing position. The taking and placing sensor is used to detect the specific position of the PCB to be taken on the PCB storage assembly 41, so as to facilitate the mechanical arm 42 to take the PCB. Meanwhile, the taking and placing sensor can also detect the specific position of the heat sink on the carrier, thereby facilitating the mechanical arm 42 to place the taken PCB on the corresponding heat sink.

[0061] Further, the PCB plate storage assembly 41 comprises an empty tray storage rack 411, a tray taking rack, a tray transportation assembly 413, and a plurality of bearing trays 414, the plurality of bearing trays 414 are rotationally installed on the empty tray storage rack 411, and a plurality of limiting rods 415 are arranged on the empty tray storage rack 411, at least one limiting rod 415 is arranged corresponding to one bearing tray 414, when the bearing tray 414 abuts against the limiting rod 415, the bearing tray 414 is arranged horizontally, when the tray taking rack is empty of the PCB plate tray, the tray transportation assembly 413 transports the empty tray to the lower side of the empty tray storage rack 411, jacks up the empty tray, and drives the bearing tray 414 to rotate, when the empty tray is separated from the bearing tray 414, the bearing tray 414 is reset, the tray transportation assembly 413 is lowered, and the empty tray is carried on the bearing tray 414.

[0062] That is, the mechanical arm 42 takes the PCB plate on the tray taking rack each time, and then places it in the corresponding heat sink of the carrier, and then when all the PCB plates in the tray are taken, the tray transportation assembly 413 transports the empty tray to the lower side of the empty tray storage rack 411, and then jacks up the empty tray, which drives the bearing tray 414 to rotate in the process of abutting against the bearing tray 414, until the empty tray is separated from the bearing tray 414, at which time the bearing tray 414 is restored to the horizontal state under the action of gravity, and then the empty tray is lowered, at which time the empty tray is carried on the upper side of the bearing tray 414, so that the empty trays can be continuously stacked from bottom to top. The stacking control method is simple and reliable, without the need to set up a complex mechanical structure, thereby reducing the production cost of the PCB plate taking and placing assembly. The taking and placing jacking assembly 43 refers to the dispensing jacking assembly 32. The tray transportation assembly 413 refers to the feeding assembly 21.

[0063] Specifically, the PCB plate taking and placing mechanism 40 further comprises a defective product recycling box 45, which is installed on the rack 10, and when the PCB plate taken by the PCB plate taking and placing mechanism 40 is detected as a defective product, the defective product is placed in the defective product recycling box 45. It can be understood that in the process of taking the PCB plate by the mechanical arm 42, the mechanical arm 42 is further provided with a PCB detector, which detects whether the PCB plate is good or not, if it is good, it can be loaded into the corresponding heat sink, if it is a defective product, it is directly placed in the defective product recycling box 45.

[0064] Further, the PCB plate taking and placing mechanism 40 further comprises a taking and placing cylinder 46, an extension plate 47 and a shape changing plate 48, the shape changing plate 48 is provided with a vacuum suction accessory 49, the taking and placing cylinder 46 is installed on the mechanical arm 42, the output shaft of the taking and placing cylinder 46 is in transmission connection with the extension plate 47, and the shape changing plate 48 is detachably connected to the extension plate 47. When the mechanical arm 42 moves to the tray taking rack, the taking and placing cylinder 46 drives the extension plate 47 to extend or retract, so that the vacuum suction accessory 49 adsorbs and takes the PCB plate on the tray taking rack. In one aspect, the PCB plate is taken by the vacuum suction accessory 49, thereby reducing damage in the process of taking the PCB plate, and improving the yield rate. Meanwhile, the vacuum suction accessory 49 is installed on the shape changing plate 48, so that when the PCB plates of different models and sizes are needed, only the shape changing plate 48 of the corresponding model and size needs to be replaced to take the PCB plate. The number, size and installation position of the vacuum suction accessory 49 on the shape changing plate 48 of different models are different.

[0065] In an embodiment, the detection mechanism comprises a detection box, a detector and a detection jacking assembly. The rack 10 is provided with a detection position. The detector is installed in the detection box, and a floating plate is arranged on the side of the detection box facing the detection position. When the upper transport line 11 transports the riveting and pressing carrier to the detection position, the detection jacking assembly jacks up the carrier. When the detection box is inserted into the PCB plate and the heat sink in the carrier, the detector detects the PCB plate and the heat sink, and the floating plate is clamped between the PCB plate, the heat sink and the detection box. The detector detects the assembled PCB plate and the heat sink by PCT detection and ICT detection. PCT detection is functional circuit test, which means that the power is turned on to simulate the real working environment to test the overall function logic and performance. ICT detection is online circuit test, which means that the electrical parameters and connectivity of the components are measured without power. The detection assembly checks the assembled and processed PCB plate and heat sink, thereby improving the yield rate of the final product. The floating plate is arranged to reduce the probability of the detection box crushing the PCB plate and the heat sink in the carrier, thereby improving the yield rate of the product.

[0066] Understandably, the dispensing head 34 controls the moving speed of the dispensing head 34 during the dispensing process, and the moving speed of the dispensing head 34 is set in advance according to the dispensing speed of the dispensing head 34, and after each dispensing is completed, the dispensing head 34 may still cause the glue at the opening of the dispensing head 34 to solidify and other problems during the process of passing the glue scraping plate 36 and being placed in the soaking box 38, which will affect the dispensing speed of the dispensing head 34, and if the preset moving speed of the dispensing head 34 is still used at this time, the glue coated on the heat sink will not be as expected, which will cause the glue coated on the heat sink to be insufficient, therefore, the application also provides a production process of the PCB and heat sink assembly production equipment as described above, comprising: when the dispensing head 34 is used again each time, controlling the dispensing head 34 to dispense glue on the electronic scale 35 within a predetermined time to weigh the dispensing amount of the dispensing head 34 within the predetermined time to determine whether the dispensing head 34 dispenses normally; when each dispensing is completed and is not used within the predetermined time, controlling the dispensing head 34 to the glue scraping plate 36 for glue scraping treatment, and then placing it in the soaking box 38 containing the anti-solid liquid.

[0067] By setting the electronic scale 35, when the dispensing head 34 is used again each time, only the dispensing head 34 needs to be moved to the electronic scale 35 and dispensed on the electronic scale within a predetermined time, and the dispensing speed of the dispensing head 34 is determined by the preset time and the dispensing amount on the electronic scale, so that the moving speed of the dispensing head 34 is reset or the glue in the dispensing head 34 is replaced.

[0068] Further, there is a groove structure on the outer surface of the heat sink, when the groove structure allows glue to remain, the dispensing head 34 normally dispenses glue without avoiding; when the groove structure does not allow glue to remain, and the size of the groove structure is less than a predetermined value, the dispensing head 34 normally dispenses glue without avoiding the groove structure, and the glue in the groove structure is sucked out by the vacuum suction pipe; when the size of the groove structure is greater than or equal to the predetermined value, the dispensing head 34 is controlled to avoid the groove structure to reduce the glue entering the groove structure.

[0069] Understandably, the small groove structure does not need to be avoided because the glue around the small groove structure will flow into the small structure; and the large groove structure facilitates the avoidance of the dispensing head 34; thereby improving the dispensing efficiency of the heat sink and improving the dispensing effect of the heat sink.

[0070] The above only describes exemplary embodiments of the application, and does not limit the protection scope of the application, and any equivalent structural transformation made under the technical concept of the application, or direct / indirect application in other related technical fields is included in the protection scope of the application.

Claims

1. An assembly and production equipment for PCB boards and heat sinks, characterized in that, include: A frame, on which an upper transport line and a lower recycling line are provided; The feeding mechanism includes a barcode scanner and a printer, both mounted on the frame. The radiator is manually placed on the carrier. The barcode scanner is used to scan the parameter information of the carrier and / or the radiator and store it in the information label printed by the printer. A dispensing mechanism, mounted on the frame, is used to apply thermal paste to the radiator on the carrier. A PCB board loading and unloading mechanism is installed on the frame to load PCB boards into the corresponding heat sinks, with one heat sink corresponding to at least one PCB board. A riveting mechanism, mounted on the frame, is used to rivet the PCB board and the heat sink to produce a finished PCB. The testing apparatus, installed on the rack, is used to perform PCT and ICT testing on the finished PCB; and The return mechanism is used to transport the carrier sequentially to the loading mechanism, dispensing mechanism, PCB board picking and placing mechanism, riveting mechanism and inspection mechanism for corresponding processing and inspection. The return mechanism is used to switch the empty carrier after processing between the upper transport line and the lower recycling line. The lower recycling line is used to transport the empty carrier to the loading mechanism. The rack is provided with a pick-and-place position. The PCB board pick-and-place mechanism includes a PCB board storage assembly, a robotic arm, a pick-and-place lifting assembly, and a pick-and-place sensor, all of which are installed on the rack. When the upper transport line moves the heat sink after dispensing to the pick-and-place position, the pick-and-place lifting assembly lifts the carrier at the pick-and-place position, and the robotic arm picks up the PCB board from the PCB board storage assembly and places it on the corresponding heat sink at the pick-and-place position. The PCB board storage assembly includes an empty tray storage rack, a tray picking rack, a tray transport assembly, and multiple carrier trays. Each carrier tray is rotatably mounted on the empty tray storage rack, and the empty tray storage rack is equipped with multiple limiting rods. Each carrier tray has at least one limiting rod. When the carrier tray abuts against a limiting rod, the carrier tray is horizontally positioned. When the tray holding the PCB boards on the tray picking rack is empty, the tray transport assembly transports the empty tray to below the empty tray storage rack, lifts the empty tray, and drives the carrier tray to rotate. When the empty tray detaches from the carrier tray, the carrier tray resets, the tray transport assembly descends, and the empty tray rests on the carrier tray.

2. The apparatus for producing an assembly of a PCB board and a heat sink according to claim 1, wherein The feeding mechanism includes a feeding component and a discharging component, both mounted on the frame. The feeding component is used to transport a packaging box containing the radiator. The radiator inside the packaging box is manually placed onto the carrier on the upper transport line. The discharging component is used to transport an empty packaging box.

3. The apparatus for producing an assembly of a PCB board and a heat spreader according to claim 1, wherein The rack is provided with a point glue position, the point glue mechanism includes a point glue transportation assembly, a point glue lifting assembly, a point glue sensor and a point glue head, when the upper layer transportation line transports the carrier carrying the heat sink to the point glue position, the point glue lifting assembly lifts the carrier of the point glue position, the point glue sensor and the point glue head are installed on the point glue transportation assembly, the point glue sensor is used for detecting the position information of the heat sink on the carrier, and the point glue transportation assembly sequentially performs point glue processing on the plurality of heat sinks on the carrier according to the position information.

4. The apparatus for producing an assembly of a PCB board and a heat sink according to claim 3, wherein The point glue mechanism further includes an electronic scale, a glue scraping plate, a waste glue box and a soaking box which are all installed on the rack, when the point glue head completes the point glue, the point glue head moves to the glue scraping plate to scrape off the residual glue at the opening of the point glue head, the scraped glue flows into the waste glue box, and the point glue head is moved into the soaking box for solidification prevention treatment; before the point glue head is used again each time, the point glue head releases glue to the electronic scale.

5. The apparatus for producing an assembly of a PCB board and a heat sink according to claim 1, wherein The PCB plate taking and placing mechanism further includes a defective product recycling box, the defective product recycling box is installed on the rack, when the PCB plate taken by the PCB plate taking and placing mechanism is detected as a defective product, the defective product is placed into the defective product recycling box.

6. The apparatus for producing an assembly of a PCB board and a heat sink according to claim 1, wherein The PCB plate taking and placing mechanism further includes a taking and placing cylinder, an extension plate and a change plate, the change plate is provided with a vacuum suction accessory, the taking and placing cylinder is installed on the mechanical arm, an output shaft of the taking and placing cylinder is in transmission connection with the extension plate, and the change plate is detachably connected to the extension plate, when the mechanical arm moves to the material disc taking rack, the taking and placing cylinder drives the extension plate to extend or retract, so that the vacuum suction accessory adsorbs and takes the PCB plate on the material disc taking rack.

7. The apparatus for producing an assembly of a PCB board and a heat sink according to claim 1, wherein The detection mechanism includes a detection box, a detector and a detection lifting assembly, the rack is provided with a detection position, the detector is installed in the detection box, and one side of the detection box facing the detection position is provided with a floating plate, when the upper layer transportation line transports the riveting and pressing carrier to the detection position, the detection lifting assembly lifts the carrier, when the detection box is inserted with the PCB plate and the heat sink in the carrier, the detector detects and processes the PCB plate and the heat sink, and the floating plate is clamped between the PCB plate, the heat sink and the detection box.

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