Micro electro mechanical system fault detection method, electronic equipment and storage medium

Abstract

The invention provides a micro-electro-mechanical system fault detection method, which comprises the following steps of: performing appearance detection on a micro-electro-mechanical system with a fault to obtain appearance detection information; and performing ray detection on the micro electro mechanical system to obtain ray detection information. And performing function detection on the micro electro mechanical system to obtain function detection information. And unsealing the micro-electro-mechanical system, and detecting the unsealed micro-electro-mechanical system to obtain unsealing detection information. And judging the fault of the micro electro mechanical system according to the appearance detection information, the nondestructive detection information, the function detection information and the unsealing detection information to obtain a fault detection result. Therefore, the problem that fault parts are easy to damage when fault detection is carried out on the micro-electro-mechanical system with faults is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor device detection and analysis, and particularly relates to a micro-electro-mechanical system fault detection method, electronic equipment and a storage medium. BACKGROUND

[0002] At present, MEMS (micro-electro-mechanical system) is widely used in aerospace, industry and other fields due to its small size, light weight, high reliability and sensitivity. For example, mobile electronic products, unmanned aerial vehicles, smart phones, wristbands, automobiles and the like. Since MEMS includes an ASIC chip and a MEMS chip, the ASIC is a special interface chip for MEMS, which is similar to a traditional integrated circuit chip. If there is damage in a local part of the chip, it will cause abnormal function of the circuit, and the signal cannot be processed and analyzed, resulting in abnormal output. Similarly, the MEMS chip belongs to a sensing unit, and under the condition of external stress (such as vibration, impact, etc.), the internal microstructure unit produces relative displacement to generate an output signal, which is amplified by the ASIC chip and output externally. If the MEMS chip is damaged, it will also cause abnormal operation of the micro-electro-mechanical system.

[0003] At present, occasional failures occur during use. Some of them are due to the existence of defects in the device, and under long-term working conditions, the parameters will degenerate until the parameters are out of tolerance, and finally fail. Another part is due to the effect of abnormal electrical stress or mechanical stress on the device during use, which causes over-stress damage to the chip.

[0004] In order to further analyze whether the chip failure is a use problem or a self problem, it is often necessary to perform fault positioning analysis on the chip, and then perform step-by-step dissection and inspection analysis on the microstructure. Since different MEMS chip structures differ, and the failed device is usually only one with unique properties, improper handling during fault positioning and opening process can easily cause artificial damage to the device, which cannot be analyzed. Therefore, there is no clear method for fault positioning and opening analysis of MEMS accelerometers at present. SUMMARY

[0005] Therefore, the purpose of the present application is to provide a micro-electro-mechanical system fault detection method, electronic equipment and a storage medium.

[0006] In order to achieve the above purpose, the present application provides a micro-electro-mechanical system fault detection method, which comprises the following steps: performing appearance detection on a micro-electro-mechanical system that has failed to obtain appearance detection information; performing ray detection on the micro-electro-mechanical system to obtain ray detection information; performing function detection on the micro-electro-mechanical system to obtain function detection information; opening the micro-electro-mechanical system, and detecting the micro-electro-mechanical system after opening to obtain opening detection information; and judging the fault of the micro-electro-mechanical system according to the appearance detection information, the non-destructive detection information, the function detection information and the opening detection information to obtain a fault detection result.

[0007] In some embodiments, the micro-electro-mechanical system comprises an integrated circuit chip and a sensor chip; the opening detection information comprises integrated circuit detection information and sensor detection information; and the opening and detection of the micro-electro-mechanical system specifically comprises: opening the micro-electro-mechanical system to expose the integrated circuit chip and the sensor chip on the surface of the micro-electro-mechanical system after opening; detecting the integrated circuit chip to obtain the integrated circuit detection information; and detecting the sensor chip to obtain the sensor detection information.

[0008] In some embodiments, the integrated circuit chip further comprises a chip body and bonding points; and the detection of the integrated circuit chip to obtain the integrated circuit detection information specifically comprises: appearance detection of the chip body to obtain internal appearance detection information; voltage-current curve test of at least one pair of the bonding points to obtain an IV curve; and the internal appearance detection information and the IV curve as the integrated circuit detection information.

[0009] In some embodiments, the detection of the sensor chip to obtain the sensor detection information specifically comprises: taking the sensor chip off the substrate of the micro-electro-mechanical system, non-destructive testing of the sensor chip to obtain non-destructive testing information; infrared detection of the sensor chip to obtain infrared detection information; disassembling the cover plate of the sensor chip according to the non-destructive testing information to obtain a sensor body; scanning electron microscope detection of the sensor body to obtain micro-morphology information; and the non-destructive testing information, the infrared detection information and the micro-morphology information as the sensor detection information.

[0010] In some embodiments, the infrared detection of the sensor chip to obtain infrared detection information specifically comprises: judging the type of the sensor chip according to the model of the micro-electro-mechanical system; in response to the sensor chip being a single-layer structure, setting an infrared light source behind the observation surface of the sensor chip, and detecting the sensor chip by an infrared detector to obtain the infrared detection information; and in response to the sensor chip being a double-layer structure, setting the infrared light source and the infrared detector on one side of the observation surface of the sensor chip, and detecting the sensor chip by the infrared detector to obtain the infrared detection information.

[0011] In some embodiments, the micro-electro-mechanical system is an acceleration micro-electro-mechanical system; the functional detection of the micro-electro-mechanical system to obtain functional detection information specifically comprises: building a test circuit according to a model of the acceleration micro-electro-mechanical system; detecting an output signal of the acceleration micro-electro-mechanical system in a static state of the acceleration micro-electro-mechanical system to obtain static detection information; moving in a direction sensitive to acceleration of the acceleration micro-electro-mechanical system and recording the output signal of the acceleration micro-electro-mechanical system to obtain dynamic detection information; and taking the static detection information and the dynamic detection information as the functional detection information.

[0012] In some embodiments, the functional detection information further comprises ultrasonic detection information; and the functional detection of the micro-electro-mechanical system to obtain functional detection information further comprises: in response to a packaging structure of the acceleration micro-electro-mechanical system being a plastic packaging, performing ultrasonic detection on the acceleration micro-electro-mechanical system to obtain the ultrasonic detection information.

[0013] In some embodiments, the functional detection information further comprises sealing detection information; and the functional detection of the micro-electro-mechanical system to obtain functional detection information further comprises: in response to a packaging structure of the acceleration micro-electro-mechanical system being a vacuum packaging, performing sealing detection on the acceleration micro-electro-mechanical system to obtain the sealing detection information.

[0014] The application further provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and capable of running on the processor, wherein the processor implements the method according to any one of the preceding embodiments when executing the program.

[0015] The application further provides a non-transitory computer readable storage medium storing computer instructions for causing a computer to execute the method according to any one of the preceding embodiments.

[0016] As can be seen from the above, the micro-electro-mechanical system fault detection method provided by the application can detect a micro-electro-mechanical system that has failed, can maximize the acquisition of relevant detection information of the micro-electro-mechanical system that has failed, and can avoid the micro-electro-mechanical system from being damaged due to premature opening. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the application or the related art, the following will briefly introduce the drawings needed to be used in the embodiments or the related art descriptions. Obviously, the drawings in the following description are only embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0018] Figure 1A flowchart of a micro-electro-mechanical system fault detection method provided by an embodiment of the present application is shown in FIG. 1.

[0019] Figure 2 A structural diagram of a detection device for detecting a single-layer sensor chip provided by an embodiment of the present application is shown in FIG. 2.

[0020] Figure 3 A structural diagram of a detection device for detecting a double-layer sensor chip provided by an embodiment of the present application is shown in FIG. 3.

[0021] Figure 4 A more specific electronic device hardware structural diagram provided by an embodiment of the present application is shown in FIG. 4. DETAILED DESCRIPTION

[0022] To make the objectives, technical solutions and advantages of the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be understood as the common meanings understood by those with ordinary skills in the art to which the present application belongs. The terms "first", "second", and similar terms used in the embodiments of the present application do not represent any order, number, or importance, but are only used to distinguish different components. The terms "include", "contain", and similar terms mean that the elements or objects listed before the terms cover the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms do not mean physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like only represent relative positional relationships, which can change when the absolute positions of the described objects change.

[0024] At present, MEMS accelerometers (capacitive type) are widely used in aerospace, industry, and other fields due to their small size, light weight, high reliability, and high sensitivity. For example, mobile electronic products, unmanned aerial vehicles, smart phones, wristbands, and cars. Since the MEMS accelerometer includes an ASIC chip and a MEMS chip, the ASIC is a special interface chip for the MEMS accelerometer, which is similar to a traditional integrated circuit chip. If there is damage to a local part of the chip, it will cause abnormal function of the circuit, unable to process and analyze the signal, resulting in abnormal output. Similarly, the MEMS chip is the sensing unit of the accelerometer, which produces relative displacement of the internal microstructure unit under external stress (such as vibration, impact, etc.), generates an output signal, is amplified by the ASIC chip, and is output externally. If the MEMS chip is damaged, it will also cause the accelerometer to work abnormally.

[0025] At present, the failure occurs occasionally in use, part of which is due to the defects of the device itself, and the parameters are degraded under long-term working conditions, until the parameters are out of tolerance, and finally fail; another part is due to the effect of abnormal electrical stress or mechanical stress on the device during use, which leads to over-stress damage of the chip.

[0026] In order to further analyze whether the chip failure is a use problem or a self problem, it is often necessary to perform fault positioning analysis on the chip, and then perform step-by-step dissection and check analysis on the microstructure. Because different MEMS chip structures are different, and the failed parts are usually only one, which has unique properties, improper handling during fault positioning and opening process can easily lead to artificial damage of the device, which cannot be analyzed. Therefore, there is no clear method for fault positioning and opening analysis of MEMS accelerometer at present.

[0027] Generally, the chip mounting structure of MEMS accelerometer (mainly referring to ASIC chip and MEMS chip) mainly has two kinds, one is left-right structure, that is, ASIC chip and MEMS chip are arranged side by side, and after opening, the two chips can be directly observed, and the other is up-down structure, that is, ASIC chip is located at the top and MEMS chip is located at the bottom. Regardless of which structure, if the MEMS chip has a fault, it needs to be removed for fault detection, therefore, a detection analysis method and test device need to be established to ensure the accuracy and reliability of the analysis process.

[0028] As shown in Figure 1 The present application provides a micro-electro-mechanical system fault detection method, comprising:

[0029] Step S1, appearance detection is performed on the micro-electro-mechanical system with a fault, and appearance detection information is obtained.

[0030] In this embodiment, the appearance detection can include checking whether the shell, pins and other parts of the failed micro-electro-mechanical system are corroded, cracked, contaminated, etc., and combining the abnormal conditions (such as parameter out of tolerance, no output, related to input or output, or both) of the failed micro-electro-mechanical system to determine whether the failure reason of the micro-electro-mechanical system is external damage, and detailed video or photo records are made during the checking process.

[0031] Step S2, ray detection is performed on the micro-electro-mechanical system, and ray detection information is obtained.

[0032] The ray detection can use X-ray or CT to detect the micro-electro-mechanical system, compare the projection photo of the failed micro-electro-mechanical system with the appearance detection information, and check the pin chip, internal bonding wire appearance, internal and external bonding points and other areas in detail, so as to determine whether the failure reason of the micro-electro-mechanical system is internal damage, and detailed video or photo records are made during the checking process.

[0033] Step S3, function detection is performed on the micro-electro-mechanical system to obtain function detection information.

[0034] The function detection can be adaptively designed according to the type of the micro-electro-mechanical system, the micro-electro-mechanical system is connected to a test platform, and then external sensing information is input according to different types of micro-electro-mechanical systems, and the input and output information of the micro-electro-mechanical system is detected to determine the fault type of the micro-electro-mechanical system. For example, for a pressure sensor type micro-electro-mechanical system, a corresponding pressure can be applied to the failed micro-electro-mechanical system; for an acceleration sensor type micro-electro-mechanical system, a suitable acceleration can be applied in the acceleration sensitive direction of the micro-electro-mechanical system.

[0035] Step S4, the micro-electro-mechanical system is opened, and the opened micro-electro-mechanical system is detected to obtain opening detection information.

[0036] The detection sequence of the non-destructive detection part of the micro-electro-mechanical system that has failed can not be in order, and preferably, the micro-electro-mechanical system can be opened and disassembled after all non-destructive detection is completed, so that the fault point caused by damage to the micro-electro-mechanical system cannot be detected.

[0037] Step S5, judging the fault of the micro-electro-mechanical system according to the appearance detection information, the non-destructive detection information, the function detection information and the opening detection information to obtain the fault detection result.

[0038] The detection information of the micro-electro-mechanical system is comprehensively judged, and the fault reason of the micro-electro-mechanical system can be more comprehensively detected.

[0039] In some embodiments, the micro-electro-mechanical system includes an integrated circuit chip and a sensor chip. The opening detection information includes integrated circuit detection information and sensor detection information.

[0040] Step S4 specifically includes:

[0041] Step S41, the micro-electro-mechanical system is opened to expose the integrated circuit chip and the sensor chip on the surface of the opened micro-electro-mechanical system.

[0042] Step S42, detecting the integrated circuit chip to obtain integrated circuit detection information.

[0043] Step S43, detecting the sensor chip to obtain sensor detection information.

[0044] In this embodiment, the micro-electro-mechanical system is initially opened to remove part of the shell and the plastic sealing material of the micro-electro-mechanical system, so that the internal chip and the bonding wire are exposed on the surface, and the internal part of the micro-electro-mechanical system is convenient to detect.

[0045] In some embodiments, the integrated circuit chip further comprises a chip body and a bonding point.

[0046] Step S42 specifically comprises:

[0047] Step S412, appearance detection is performed on the chip body to obtain internal appearance detection information.

[0048] In the present embodiment, by performing appearance detection on the chip body, it is determined whether there is a local breakdown burnout pattern on the chip surface, so as to determine the failure cause of the micro-electro-mechanical system, and a detailed video or photo record is made for the inspection process.

[0049] Step S422, voltage-current curve test is performed on at least one pair of bonding points to obtain an IV curve.

[0050] In which, by performing IV curve test between all bonding points on the surface of the chip body and comparing with a reference, it is determined whether there is damage in the internal circuit of the chip body.

[0051] Preferably, by comparing the IV curves of the chip body and the reference, if the IV curve of the chip body is abnormal, further detection can be performed on the chip by using a micro-light microscope to check whether there is local electric leakage.

[0052] The internal appearance detection information and the IV curve are taken as the integrated circuit detection information.

[0053] In some embodiments, step S43 specifically comprises:

[0054] Step S413, the sensor chip is taken off from the substrate of the micro-electro-mechanical system, non-destructive detection is performed on the sensor chip to obtain non-destructive detection information.

[0055] In the present embodiment, the form of non-destructive detection is not limited, and can be reasonably selected according to actual application needs, for example, can be one of X-ray, CT, ultrasonic detection.

[0056] Preferably, in the present embodiment, X-ray is used for non-destructive detection, by observing the internal structure of the chip, it is confirmed whether the sensor chip is damaged. In addition, by X-ray detection, the cover plate thickness of the sensor chip can be measured, which is convenient for subsequent detection.

[0057] Step S423, infrared detection is performed on the sensor chip to obtain infrared detection information.

[0058] In which, the infrared detection uses an infrared image acquisition system to observe the internal microstructure of the chip, and the acquisition system comprises an infrared detector (CCD photosensitive range is not less than 900 μm-1700 μm), an infrared light source (can generate 900 μm-1800 μm wave band light), a sample mounting device and the like.

[0059] Preferably, the thickness of the cover plate of the sensor chip can be detected, and an infrared light source of appropriate wavelength can be selected according to the thickness of the cover plate of the sensor chip to facilitate penetration of the cover plate of the sensor chip and make the infrared detection image clearer.

[0060] Preferably, when the infrared detection image is unclear, the infrared detection image can be made more complete by adjusting the incident angle of the infrared light source.

[0061] Step S433: Based on the non-destructive testing information, the cover plate of the sensor chip is disassembled to obtain the sensor body.

[0062] As an alternative implementation, the sensor chip body can be exposed by grinding the sensor chip cover. During the grinding process, the chip is first fixed in place, and the thickness of the cover on the sensor chip surface is reduced to approximately 1 / 2 to 1 / 4 of its original thickness through grinding. Leads are then fixed by applying adhesive to the center of the cover in the thinned area, and the cover is broken and removed using mechanical force to expose the internal microstructure.

[0063] Step S443: The sensor body is inspected by scanning electron microscopy to obtain microscopic morphology information.

[0064] Among these methods, scanning electron microscopy was used to examine the internal microstructure and fracture areas, and images were taken.

[0065] Non-destructive testing information, infrared detection information, and microscopic morphology information are used as sensor detection information.

[0066] In some embodiments, step S423 specifically includes:

[0067] Step S401: Determine the type of sensor chip based on the model of the microelectromechanical system.

[0068] In step S403, in response to the sensor chip having a single-layer structure, an infrared light source is placed behind the observation surface of the sensor chip, and the sensor chip is detected by an infrared detector to obtain infrared detection information.

[0069] In this embodiment, as Figure 2 As shown, for a single-layer sensor chip, the sensor chip can be placed above a transparent plate that has low absorption of infrared light with wavelengths of 900μm to 1800μm, so that the infrared light source can pass through the transparent plate to illuminate the sensor chip.

[0070] As an alternative implementation, the transparent plate can be etched on the side closest to the infrared light source to create a textured surface on the transparent plate, thereby reducing the reflectivity of the infrared light source.

[0071] As an optional implementation, the absorption coefficient of the cover plate to infrared light of different wavelengths can be estimated according to the thickness of the sensor chip cover plate, and an infrared light source with stronger penetration ability to the cover plate is selected, so that a clearer infrared detection image can be obtained.

[0072] In step S405, in response to the sensor chip being a double-layer structure, the infrared light source and the infrared detector are arranged on one side of the observation surface of the sensor chip, the sensor chip is detected by the infrared detector, and infrared detection information is obtained.

[0073] In this embodiment, when the infrared light directly penetrates the sensor chip, the imaging of the two layers of the double-layer structure chip will overlap, so the incident angle of the infrared light source needs to be adjusted to obtain the infrared image information of the two layers of the sensor. As shown in Figure 3 The incident direction and position of the light source are adjusted, infrared light is irradiated on the sample from the upper side (such as a ring-shaped infrared light source), different waveband incident light is adjusted, and the upper and lower surfaces of the chip are flipped to observe, the microstructure close to the upper surface or the lower surface inside the sensor chip can be detected, the internal microstructure fracture is photographed and recorded by the infrared system for collection and amplification processing.

[0074] In some embodiments, the micro-electro-mechanical system is an acceleration micro-electro-mechanical system.

[0075] Step S3 specifically includes:

[0076] In step S31, a test circuit is built according to the model of the acceleration micro-electro-mechanical system.

[0077] In this embodiment, the test circuit can be built according to the device manual of the acceleration micro-electro-mechanical system, and whether there is output or parameter out-of-tolerance is verified in combination with the working circuit of the device.

[0078] In step S32, the output signal of the acceleration micro-electro-mechanical system is detected in a static state of the acceleration micro-electro-mechanical system, and static detection information is obtained.

[0079] The static detection information is used to represent the input and output signals of the acceleration micro-electro-mechanical system when no acceleration is detected. By analyzing the output voltage of the acceleration micro-electro-mechanical system in a static state, whether the acceleration micro-electro-mechanical system has a zero voltage abnormality can be checked.

[0080] In step S33, the acceleration micro-electro-mechanical system is moved in the direction sensitive to acceleration, the output signal of the acceleration micro-electro-mechanical system is recorded, and dynamic detection information is obtained.

[0081] The dynamic detection information is used to represent the input and output signals of the acceleration micro-electro-mechanical system when detecting acceleration, moving or shaking in the acceleration sensitive direction, observing whether the output voltage signal changes, and checking whether the device has certain functions.

[0082] In step S34, the static detection information and the dynamic detection information are taken as the function detection information.

[0083] As an optional embodiment, the function detection information further includes IV curve information, and the IV characteristic curve between the external pins of the acceleration micro-electro-mechanical system is compared with a reference part for test, so as to confirm whether the circuit of the acceleration micro-electro-mechanical system has a problem.

[0084] In some embodiments, the function detection information further includes ultrasonic detection information.

[0085] Step S3 further includes:

[0086] In step S301, in response to the packaging structure of the acceleration micro-electro-mechanical system being plastic packaging, the acceleration micro-electro-mechanical system is subjected to ultrasonic detection to obtain ultrasonic detection information.

[0087] In the embodiment, the ultrasonic detection is performed on the acceleration micro-electro-mechanical system, so as to confirm whether the chip bonding and the bonding point have delamination abnormity, and whether the analysis of the no output or open circuit abnormity in the electrical performance test has certain correlation is analyzed in combination with other detection information, and the test result and the picture are recorded.

[0088] In some embodiments, the function detection information further includes sealing detection information.

[0089] Step S3 further includes:

[0090] In step S303, in response to the packaging structure of the acceleration micro-electro-mechanical system being empty packaging, the acceleration micro-electro-mechanical system is subjected to sealing detection to obtain sealing detection information.

[0091] In the embodiment, the sealing detection is performed on the acceleration micro-electro-mechanical system, and whether the sealing has abnormity is confirmed in combination with the device manual or product specification, and whether the analysis result has correlation is analyzed if the sealing is abnormal.

[0092] As an optional embodiment, it can also be confirmed according to the product manual whether the excess material detection (PIND) can be performed, and if there is a related provision in the detailed rules, the manual is carried out, and the excess material mapping result is recorded.

[0093] As can be seen from the above embodiments of the application, the micro-electro-mechanical system with a fault is detected by the method provided by the application, the related detection information of the micro-electro-mechanical system with a fault can be obtained to the maximum, and the micro-electro-mechanical system is prevented from being damaged due to premature opening.

[0094] It should be noted that the method of the embodiments of the present application can be executed by a single device, such as a computer or a server, etc. The method of the embodiments can also be applied to a distributed scenario, and be completed by multiple devices cooperating with each other. In the distributed scenario, one of the multiple devices can only execute one or more steps in the method of the embodiments of the present application, and the multiple devices can interact with each other to complete the method.

[0095] It should be noted that some embodiments of the present application have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in a different order and still achieve desirable results. Additionally, the process depicted in the figures does not necessarily require the particular order shown, or sequential order to achieve the desired results. In certain implementations, multitasking and parallel processing can be advantageous.

[0096] Based on the same inventive concept, the present application also provides an electronic device corresponding to the method of any of the above embodiments, comprising a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the micro-electro-mechanical system fault detection method of any of the embodiments.

[0097] Figure 4 A more specific hardware structure of an electronic device provided by the embodiments is shown, which can include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040 and a bus 1050. The processor 1010, the memory 1020, the input / output interface 1030 and the communication interface 1040 are connected to each other through the bus 1050 for communication within the device.

[0098] The processor 1010 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an ASIC (Application Specific Integrated Circuit), or one or more integrated circuits, etc., for executing related programs to implement the technical solutions provided by the embodiments of the present application.

[0099] The memory 1020 can be implemented in the form of a ROM (Read Only Memory), a RAM (Random Access Memory), a static storage device, a dynamic storage device, etc. The memory 1020 can store an operating system and other application programs, and when the technical solutions provided by the embodiments of the present specification are implemented by software or firmware, the related program codes are stored in the memory 1020 and are called and executed by the processor 1010.

[0100] The input / output interface 1030 is configured to connect an input / output module to realize information input and output. The input / output module can be configured as a component in the device (not shown in the figure) or can be externally connected to the device to provide corresponding functions. The input device can include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output device can include a display, a speaker, a vibrator, an indicator light, etc.

[0101] The communication interface 1040 is configured to connect a communication module (not shown in the figure) to realize the communication interaction between the device and other devices. The communication module can realize communication through a wired manner (such as USB, network cable, etc.) or through a wireless manner (such as mobile network, WIFI, Bluetooth, etc.).

[0102] The bus 1050 includes a channel for transmitting information between various components (such as the processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040) of the device.

[0103] It should be noted that although the above device only shows the processor 1010, the memory 1020, the input / output interface 1030, the communication interface 1040, and the bus 1050, in the specific implementation process, the device can also include other components necessary for normal operation. In addition, those skilled in the art can understand that the above device can also only contain the components necessary to implement the embodiments of the present specification, and does not have to contain all the components shown in the figure.

[0104] The electronic device of the above embodiments is used to implement the corresponding micro-electro-mechanical system fault detection method in any of the preceding embodiments, and has the beneficial effects of the corresponding method embodiments, which are not described here.

[0105] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides a non-transitory computer readable storage medium storing computer instructions for causing the computer to execute the micro-electro-mechanical system fault detection method of any of the above embodiments.

[0106] The computer readable medium of the embodiments includes permanent and non-permanent, removable and non-removable media, which can realize information storage by any method or technology. The information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassette, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information accessible by a computing device.

[0107] The storage medium of the above embodiments stores computer instructions for causing the computer to execute the micro-electro-mechanical system fault detection method as described in any of the above embodiments, and has the beneficial effects of the corresponding method embodiments, which are not described here again.

[0108] It should be noted that the embodiments of the present application can also be further described in the following ways:

[0109] A micro-electro-mechanical system fault detection method comprises:

[0110] Appearance detection is performed on the micro-electro-mechanical system that has failed, to obtain appearance detection information;

[0111] Radiographic detection is performed on the micro-electro-mechanical system, to obtain radiographic detection information;

[0112] Functional detection is performed on the micro-electro-mechanical system, to obtain functional detection information;

[0113] The micro-electro-mechanical system is unsealed, and detection is performed on the micro-electro-mechanical system after unsealing, to obtain unsealing detection information;

[0114] The fault of the micro-electro-mechanical system is judged according to the appearance detection information, the non-destructive detection information, the functional detection information and the unsealing detection information, to obtain a fault detection result.

[0115] Optionally, the micro-electro-mechanical system comprises an integrated circuit chip and a sensor chip; and the unsealing detection information comprises integrated circuit detection information and sensor detection information.

[0116] The micro-electro-mechanical system is unsealed, and detection is performed on the micro-electro-mechanical system after unsealing, to obtain unsealing detection information.

[0117] unsealing the micro-electro-mechanical system to expose the integrated circuit chip and the sensor chip on the surface of the micro-electro-mechanical system after unsealing;

[0118] detecting the integrated circuit chip to obtain the integrated circuit detection information;

[0119] detecting the sensor chip to obtain the sensor detection information.

[0120] Optionally, the integrated circuit chip further comprises a chip body and a bonding point.

[0121] The detecting the integrated circuit chip to obtain the integrated circuit detection information specifically comprises:

[0122] performing appearance detection on the chip body to obtain internal appearance detection information;

[0123] performing voltage-current curve testing on at least one pair of the bonding points to obtain an IV curve;

[0124] taking the internal appearance detection information and the IV curve as the integrated circuit detection information.

[0125] Optionally, the detecting the sensor chip to obtain the sensor detection information specifically comprises:

[0126] taking the sensor chip off the substrate of the micro-electro-mechanical system, performing non-destructive testing on the sensor chip to obtain non-destructive testing information;

[0127] performing infrared detection on the sensor chip to obtain infrared detection information;

[0128] disassembling a cover plate of the sensor chip according to the non-destructive testing information to obtain a sensor body;

[0129] performing scanning electron microscope detection on the sensor body to obtain micro-morphology information;

[0130] taking the non-destructive testing information, the infrared detection information and the micro-morphology information as the sensor detection information.

[0131] Optionally, the performing infrared detection on the sensor chip to obtain infrared detection information specifically comprises:

[0132] judging the type of the sensor chip according to the model of the micro-electro-mechanical system;

[0133] in response to the sensor chip being a single-layer structure, setting an infrared light source behind an observation surface of the sensor chip, and detecting the sensor chip through an infrared detector to obtain the infrared detection information.

[0134] In response to the sensor chip being a double-layer structure, the infrared light source and the infrared detector are arranged on one side of the observation surface of the sensor chip, and the sensor chip is detected by the infrared detector to obtain the infrared detection information.

[0135] Optionally, the micro-electro-mechanical system is an acceleration micro-electro-mechanical system.

[0136] The function detection of the micro-electro-mechanical system to obtain the function detection information specifically includes:

[0137] A test circuit is built according to the model of the acceleration micro-electro-mechanical system.

[0138] The output signal of the acceleration micro-electro-mechanical system is detected in a static state of the acceleration micro-electro-mechanical system to obtain static detection information.

[0139] The acceleration micro-electro-mechanical system is moved in a direction sensitive to acceleration, and the output signal of the acceleration micro-electro-mechanical system is recorded to obtain dynamic detection information.

[0140] The static detection information and the dynamic detection information are taken as the function detection information.

[0141] Optionally, the function detection information further includes ultrasonic detection information.

[0142] The function detection of the micro-electro-mechanical system to obtain the function detection information further includes:

[0143] In response to the packaging structure of the acceleration micro-electro-mechanical system being plastic packaging, the acceleration micro-electro-mechanical system is ultrasonically detected to obtain the ultrasonic detection information.

[0144] Optionally, the function detection information further includes sealing detection information.

[0145] The function detection of the micro-electro-mechanical system to obtain the function detection information further includes:

[0146] In response to the packaging structure of the acceleration micro-electro-mechanical system being empty packaging, the acceleration micro-electro-mechanical system is sealed to obtain the sealing detection information.

[0147] An electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor executes the program to implement the method of any one of the above.

[0148] A non-transitory computer-readable storage medium storing computer instructions for causing a computer to perform any of the above-described methods.

[0149] Those skilled in the art will understand that the above-described examples are merely illustrative and are not intended to limit the scope of the application (including the claims) in any way. Embodiments of the application can be implemented in any of the above-described embodiments or in any other way. For example, one or more of the functions described above can be implemented on one or more servers and / or devices and / or one or more virtual machines executing on one or more servers and / or devices. It will be appreciated that the above-described embodiments are merely examples and that many other variations are possible. For example, the above-described embodiments and / or variations thereof can be combined in any way. Also, it will be appreciated that some embodiments can be implemented by way of one or more software programs. However, it will be appreciated that other embodiments can be implemented by way of firmware and / or hardware, as would be understood by one of ordinary skill in the art. The functions described above can be implemented, interactively or non- interactively, in various ways, such as with scripts or other flow control mechanisms. Also, the various steps can be performed in the same or different ways. Also, the steps can be performed at the same or different times. Also, one or more of the steps can be performed by one or more servers and / or devices and / or one or more virtual machines executing on one or more servers and / or devices.

[0150] In addition, to simplify the description and discussion and so as not to obscure the inventive aspects of the embodiments of the application, known power / ground connections to integrated circuit (IC) chips and other components can or can not be shown in the figures. Furthermore, aspects of the embodiments of the application can be shown, for the sake of brevity, in a somewhat schematic form rather than in full detail, since additional aspects of such embodiments will be apparent to one of ordinary skill in the art with the benefit of this disclosure. It will be appreciated that the features described above can be implemented in various ways, such as by way of software, hardware, or a combination thereof. In one embodiment, for example, one or more of the features described above can be implemented by way of software, such as program code executed by one or more processors. In another embodiment, for example, one or more of the features described above can be implemented by way of hardware, such as by utilizing one or more integrated circuits (ICs), gate arrays, or by way of a software / hardware combination. In one embodiment, for example, one or more of the features described above can be implemented by way of a software / hardware combination, such as by utilizing one or more application-specific integrated circuits (ASICs) in combination with program code.

[0151] While the present application has been described with respect to a limited number of embodiments, those skilled in the art will appreciate numerous modifications and variations within the scope of the appended claims. For example, other memory architectures (e.g., dynamic RAM (DRAM)) can use the embodiments discussed.

[0152] It is intended that the application encompass all such variations, modifications and alterations. Accordingly, the application is not to be limited to the precise details of description and examples given above, as such can vary in many ways.

Claims

1. A fault detection method for microelectromechanical systems, comprising: Visual inspection is performed on the faulty microelectromechanical system to obtain visual inspection information; The microelectromechanical system was subjected to X-ray inspection to obtain X-ray inspection information; The microelectromechanical system is subjected to functional testing to obtain functional testing information; The microelectromechanical system (MEMS) is unpacked, and the unpacked MEMS is tested to obtain unpacking test information. Based on the appearance inspection information, the non-destructive testing information, the functional testing information, and the unpacking inspection information, the faults of the microelectromechanical system are determined, and the fault detection results are obtained.

2. The microelectromechanical system fault detection method according to claim 1, wherein, The microelectromechanical system includes integrated circuit chips and sensor chips; the unpacking detection information includes integrated circuit detection information and sensor detection information. The step of unpacking the microelectromechanical system and testing the unpacked microelectromechanical system specifically includes: The microelectromechanical system is unpacked to expose the integrated circuit chip and the sensor chip on the surface of the unpacked microelectromechanical system. The integrated circuit chip is tested to obtain integrated circuit test information; The sensor chip is tested to obtain the sensor detection information.

3. The microelectromechanical system fault detection method according to claim 2, wherein, The integrated circuit chip also includes a chip body and bonding points; The step of testing the integrated circuit chip to obtain integrated circuit testing information specifically includes: The chip body is subjected to external inspection to obtain internal external inspection information; Voltage-current curves were tested on at least one pair of the bonding points to obtain IV curves; The internal appearance inspection information and the IV curve are used as the integrated circuit inspection information.

4. The microelectromechanical system fault detection method according to claim 2, wherein, The step of detecting the sensor chip to obtain sensor detection information specifically includes: The sensor chip is removed from the substrate of the microelectromechanical system and subjected to non-destructive testing to obtain non-destructive testing information. Infrared detection is performed on the sensor chip to obtain infrared detection information; The cover plate of the sensor chip is disassembled based on the non-destructive testing information to obtain the sensor body; The sensor body was examined by scanning electron microscopy to obtain its microstructure information; The non-destructive testing information, infrared testing information, and microscopic morphology information are used as the sensor detection information.

5. The microelectromechanical system fault detection method according to claim 4, wherein, The step of performing infrared detection on the sensor chip to obtain infrared detection information specifically includes: The type of the sensor chip is determined based on the model of the microelectromechanical system; In response to the fact that the sensor chip has a single-layer structure, an infrared light source is placed behind the observation surface of the sensor chip, and the sensor chip is detected by an infrared detector to obtain the infrared detection information; In response to the fact that the sensor chip has a dual-layer structure, the infrared light source and the infrared detector are placed on one side of the observation surface of the sensor chip, and the infrared detector detects the sensor chip to obtain the infrared detection information.

6. The microelectromechanical system fault detection method according to claim 1, wherein, The microelectromechanical system is an acceleration microelectromechanical system; The step of performing functional testing on the microelectromechanical system to obtain functional testing information specifically includes: A test circuit was built based on the model of the acceleration microelectromechanical system. The output signal of the acceleration microelectromechanical system is detected when the acceleration microelectromechanical system is at rest to obtain static detection information; By moving along the acceleration-sensitive direction of the acceleration microelectromechanical system, the output signal of the acceleration microelectromechanical system is recorded to obtain dynamic detection information; The static detection information and the dynamic detection information are used as the functional detection information.

7. The microelectromechanical system fault detection method according to claim 6, wherein, The functional testing information also includes ultrasonic testing information; The step of performing functional testing on the microelectromechanical system to obtain functional testing information also includes: In response to the fact that the packaging structure of the acceleration microelectromechanical system is plastic encapsulation, ultrasonic testing is performed on the acceleration microelectromechanical system to obtain the ultrasonic testing information.

8. The microelectromechanical system fault detection method according to claim 6, wherein, The functional testing information also includes sealing testing information; The step of performing functional testing on the microelectromechanical system to obtain functional testing information also includes: In response to the fact that the packaging structure of the acceleration microelectromechanical system is an empty seal, the sealing performance of the acceleration microelectromechanical system is tested to obtain the sealing performance test information.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the program, implements the method as claimed in any one of claims 1 to 8.

10. A non-transitory computer-readable storage medium storing computer instructions for causing a computer to perform the method of any one of claims 1 to 8.

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