Parallel testing and data processing optimizing device of laser chip testing machine
By using a multi-channel parallel testing and data processing optimization device, the problems of low efficiency, poor accuracy, and low automation of traditional laser chip testing equipment have been solved, realizing efficient and accurate laser chip testing, which is suitable for large-scale production.
Patent Information
- Application Number
- CN202511245465.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-02
- Publication Date
- 2025-11-28
AI Technical Summary
Traditional laser chip testing equipment suffers from low testing efficiency, poor temperature control accuracy, weak data processing capabilities, and low automation, making it difficult to meet the testing needs of large-scale production.
It adopts a multi-channel parallel testing architecture, intelligent temperature control module, data acquisition module, data processing optimization module and central control module, combined with improved Z-score algorithm and Kalman filter algorithm, to achieve efficient and accurate data processing and automated testing.
It significantly improves testing efficiency and data accuracy, possesses high-precision temperature control and strong data processing capabilities, and is suitable for large-scale laser chip production testing.
Smart Images
Figure CN121027792A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of laser chip testing, in particular to a parallel testing and data processing optimization device of a laser chip testing machine. BACKGROUND
[0002] Chip testing refers to a series of testing activities such as function testing, reliability testing, performance testing, and power consumption testing on integrated circuit chips. Through these tests, it can be verified whether the design and manufacturing of the chip meet the specification requirements, ensuring the quality and performance of the chip. Multi-channel parallel testing of chips is a testing method used to test multiple channels or functions on a chip simultaneously. This testing method can improve testing efficiency, reduce testing time, and improve production efficiency.
[0003] Currently, the traditional laser chip testing equipment has the following shortcomings:
[0004] Low testing efficiency: mostly using single-channel testing method, only one chip can be tested at a time, with low testing efficiency, which is difficult to meet the testing needs of large-scale production;
[0005] Poor temperature control accuracy: the temperature control error is large within the temperature range of 10-70℃, and the temperature change rate is not adjustable, affecting the accuracy of the test results;
[0006] Weak data processing capability: lack of effective data optimization processing mechanism, the collected data has a lot of noise and outliers, resulting in large errors in the derived parameters calculated;
[0007] Low automation level: the testing process requires manual intervention, and it is difficult to realize the customization and automatic operation of the testing parameters.
[0008] Therefore, it is of great practical significance to develop a laser chip testing system with high testing efficiency, high precision temperature control, strong data processing capability, and high automation level. SUMMARY
[0009] In view of the shortcomings of the prior art, the present application provides a parallel testing and data processing optimization device of a laser chip testing machine. The system greatly improves the testing efficiency and data accuracy through parallel testing design at the hardware level and data optimization algorithm at the software level, has outstanding innovation, practicality and creativity, and is suitable for large-scale laser chip production testing scenarios.
[0010] To achieve the above purpose, the present application provides the following technical scheme: a parallel testing and data processing optimization device of a laser chip testing machine, comprising a multi-channel testing module, an intelligent temperature control module, a data acquisition module, a data processing optimization module, and a central control module.
[0011] Further, the multi-channel test module comprises at least 4 independent test channels, each of which can independently output continuous current and pulse current, and can synchronously collect the wavelength, optical power, voltage and threshold current of the laser chip under the action of the current, and the interference degree between the channels is less than 0.5%; wherein, in the continuous current mode, the current accuracy of the current source can reach ±0.1mA, in the pulse current mode, the current amplitude accuracy can reach ±0.5mA, and the frequency accuracy can reach ±0.1kHz.
[0012] Further, the intelligent temperature control module adopts a closed-loop feedback control mode, and the temperature is adjusted in the range of 10-70℃ by a semiconductor refrigeration and heating assembly, the temperature control accuracy reaches ±0.1℃, and the temperature change rate can be continuously adjustable in the range of 0.5-5℃ / s; the response time of the temperature sensor is not more than 50ms, which can quickly feedback the temperature change and assist the closed-loop controller to accurately adjust the temperature.
[0013] Further, the data acquisition module adopts a 16-bit high-speed A / D converter, the sampling frequency is not less than 1MHz, and the current, voltage signals output by the multi-channel test module and the optical power signals output by the external optical detector can be synchronously collected; and has an automatic range switching function, which can automatically adjust the collection range according to the signal amplitude to ensure the collection accuracy.
[0014] Further, the data processing optimization module comprises:
[0015] An outlier detection unit adopts an abnormal data identification mechanism based on an improved Z-score algorithm, which can automatically identify and mark abnormal data occurring in the test process, and the accuracy of the outlier detection is not less than 95%;
[0016] A data fusion unit fuses the same parameter data collected by multiple channels through a Kalman filtering algorithm, improves the stability and accuracy of the data, and the standard deviation of the fused data is at least 30% lower than that before fusion;
[0017] A parameter calculation unit automatically calculates derived parameters such as thermal power and thermal resistance according to the collected basic data, the calculation error is not more than 1%, and the calculation time is not more than 100ms after the data collection of each test point is completed.
[0018] Further, the central control module adopts an ARM Cortex-A9 processor, communicates with each module through Ethernet, realizes unified control of the test process, supports custom setting of test parameters and automatic running of the test process; the module can store at least 100 different test parameter configurations at the same time, which is convenient for users to quickly call.
[0019] Further, it further comprises a data storage and interaction module, which uses an SSD solid state disk for data storage, with a storage rate not less than 100MB / s and supports data interaction with external devices through a USB interface; the data storage format is compatible with mainstream data analysis software, and no additional conversion is required for import analysis.
[0020] Further, each test channel of the multi-channel test module has an independent optical path calibration function, which can automatically calibrate the optical path before each test, and the deviation of the calibrated optical path is not more than ±0.05nm.
[0021] Further, the intelligent temperature control module has a temperature overshoot suppression function, and when the temperature changes rapidly, the temperature overshoot amplitude is not more than ±0.2℃, which ensures the stability of the test environment temperature.
[0022] Further, it further comprises a laser chip testing method based on the device, comprising the following steps:
[0023] S1: Install the laser chip to be tested to the test fixture, and set the test temperature range (10-70℃), temperature change rate, current parameters (continuous current size, pulse current amplitude and frequency) and other test parameters through the central control module; At the same time, you can choose whether to enable the advanced functions of each module, such as independent optical path calibration of the multi-channel test module, temperature overshoot suppression of the intelligent temperature control module, etc.
[0024] S2: The intelligent temperature control module adjusts the test environment temperature according to the set parameters, and after the temperature is stable (the temperature fluctuation range is not more than ±0.1℃), the multi-channel test module applies current to the laser chip according to the preset current parameters, wherein the preset current parameters include continuous current parameters and pulse current parameters, if both continuous current parameters and pulse current parameters need to be tested under the same temperature and voltage, the pulse current parameter test is performed first, and then the continuous current parameter test is performed, which can reduce the error influence of the self-heating of the chip after the continuous current test on the pulse current test result;
[0025] S3: The data acquisition module synchronously acquires the working temperature, lasing wavelength change, optical power change, voltage change and threshold current of the laser chip under the preset current, and transmits the acquired data to the data processing and optimization module;
[0026] S4: The data processing and optimization module detects the acquired data for abnormal value, data fusion and parameter calculation, and obtains the pulse current slope, temperature difference, thermal power and thermal resistance.
[0027] S5: The central control module stores the processed test data to the data storage and interaction module, and can view and export data through external devices according to user needs, while supporting the generation of detailed test reports, and the report content includes test parameters, raw data, processed data and parameter trend chart, etc.
[0028] Compared with the prior art, the technical scheme of the application has the following beneficial effects:
[0029] 1. The application adopts a multi-channel parallel test architecture, realizes synchronous testing of multiple laser chips, and greatly improves the test efficiency; the data processing optimization module combining the improved Z-score algorithm and Kalman filtering algorithm effectively improves the accuracy and stability of the data.
[0030] 2. The application has high-precision temperature control and parameter measurement capability, can meet the testing requirements of multiple parameters of laser chips under different temperature changes of 10-70 DEG C, and has high automation degree and simple operation, and is suitable for large-scale production testing scenarios.
[0031] 3. The application solves the problems of low test efficiency and weak data processing capability of traditional test equipment through the cooperative design of hardware and software, significantly improves the overall performance of laser chip testing, has outstanding substantial features and significant progress. BRIEF DESCRIPTION OF DRAWINGS
[0032] Figure 1 is the overall structure block diagram of the system of the application;
[0033] Figure 2 is the internal block diagram of the multi-channel test module of the application;
[0034] Figure 3 is the system module data transmission total flow chart of the application;
[0035] Figure 4 is the multi-channel test module and data acquisition module interaction flow chart of the application. DETAILED DESCRIPTION
[0036] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, not all. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the application.
[0037] Please refer to Figures 1-4The parallel test and data processing optimization device of the laser chip tester in the embodiment mainly consists of a multi-channel test module, an intelligent temperature control module, a data acquisition module, a data processing optimization module, a central control module, and a data storage and interaction module. The modules work cooperatively to realize efficient and accurate testing of laser chips.
[0038] Specifically, the multi-channel test module is the core component for realizing parallel testing and includes at least four independent test channels, each of which is integrated with a current source, a wavelength detection assembly, a laser power detection assembly, and a voltage acquisition circuit. The current source has flexible output capability and can output a continuous current of 0-6000 mA and a pulse current of 0-6000 mA with a frequency of 1-100 kHz to meet the testing requirements of laser chips under different current conditions.
[0039] Specifically, the wavelength detection assembly has a wavelength measurement range of 370-600 nm and a measurement accuracy of ±0.1 nm, which can accurately capture the wavelength information of the output light of the laser chip. The laser power detection assembly has a measurement range of 0-10000 mW and a measurement accuracy of ±0.5 mW, which can accurately obtain the optical power parameters of the laser chip. The voltage acquisition circuit has a measurement range of 0-8 V and a measurement accuracy of ±0.01 V, which is used to collect voltage data when the laser chip is working. To avoid mutual interference between the channels, electromagnetic shielding design is adopted for each channel, so that the interference degree is less than 0.5%, ensuring that multiple laser chips can have their test data unaffected during synchronous testing, and greatly improving the testing efficiency.
[0040] Specifically, the intelligent temperature control module is responsible for providing a precise and controllable temperature environment for laser chip testing and consists of a semiconductor refrigerator, a heater, a temperature sensor, and a closed-loop controller. The temperature sensor uses a high-precision platinum resistance temperature sensor with a measurement accuracy of ±0.05℃, which can accurately and timely feedback the temperature of the test environment.
[0041] Specifically, the closed-loop controller uses an advanced PID control algorithm to accurately adjust the temperature based on the temperature information fed back by the temperature sensor. This module can realize temperature adjustment within a range of 10-70℃, with a temperature control accuracy of ±0.1℃, fully meeting the testing requirements of laser chips under different temperature conditions. At the same time, the temperature change rate can be continuously adjustable within a range of 0.5-5℃ / s, providing fast response for large-scale temperature rise and fall requirements, as well as hardware support for temperature maintenance and control at the target test temperature, and providing reliable temperature environment support for comprehensive evaluation of the performance of laser chips.
[0042] Specifically, the data acquisition module is the key link to obtain test data. A 16-bit high-speed A / D converter is adopted, and the sampling frequency is not less than 1 MHz, so that the current and voltage signals output by the multi-channel test module and the optical power signals output by the external optical detector can be synchronously collected. To ensure the quality of the collected signals, the module also has perfect signal conditioning functions, which can amplify and filter the collected weak signals, effectively improve the signal-to-noise ratio, and provide high-quality raw data for subsequent data processing.
[0043] Specifically, the data processing optimization module is the core to improve the quality of test data, including an abnormal value detection unit, a data fusion unit and a parameter calculation unit. The abnormal value detection unit adopts an abnormal data identification mechanism based on an improved Z-score algorithm, which can automatically identify and mark abnormal data generated in the test process due to various interference factors by setting a dynamic threshold, thereby reducing the influence of abnormal data on the test results and ensuring the reliability of the data.
[0044] Specifically, the data fusion unit uses Kalman filtering algorithm to fuse the same parameter data collected by multiple channels. Through the optimization and integration of data, the data noise is effectively suppressed, the stability and accuracy of data are improved, and the test results are more valuable. The parameter calculation unit automatically calculates the derived parameters such as thermal power and thermal resistance according to the collected basic data and the preset calculation formula. The thermal power is calculated by the product of current and voltage, and the thermal resistance is calculated by the ratio of temperature difference and thermal power. The calculation error is strictly controlled within 1%, ensuring the accuracy of the derived parameters.
[0045] Specifically, the central control module is the control core of the system, which adopts a powerful ARM Cortex-A9 processor with a main frequency of 1 GHz. It communicates with each module through Ethernet with a communication rate of 100 Mbps, ensuring the timeliness and efficiency of instruction transmission and data exchange. The module is built-in with professional test process control software, which supports users to customize test parameters such as temperature range and current size according to actual test requirements, and can realize automatic operation of test process, reduce manual intervention and improve the automation degree of test. At the same time, the central control module can monitor the working state of each module in real time, and can send alarm signals in time once abnormal conditions are found, so as to facilitate the operator to handle in time.
[0046] Specifically, the data storage and interaction module provides reliable storage and convenient interaction for test data. It uses an SSD solid state disk with a capacity of not less than 1 TB for data storage, and the storage rate is not less than 100 MB / s, which can meet the rapid storage demand of a large amount of data in a large-scale test process. In addition, the module supports data interaction with external devices through a USB 3.0 interface, which facilitates users to view, analyze and export test data at any time, and provides convenience for quality evaluation and performance research of laser chips.
[0047] Embodiment
[0048] This embodiment uses the parallel test and data processing optimization device of the laser chip tester as described in the above summary to test four laser chips of the same model (blue light 450nm-1.6W) to obtain their performance parameters in the temperature range of 10-70℃ and evaluate the quality stability of the chips.
[0049] 1. Preparation before test
[0050] First, four blue light 450nm-1.6W laser chips to be tested are respectively installed on the clamps of the four independent test channels of the multi-channel test module, ensuring good contact between the chips and the test probes and avoiding the influence of poor contact on the accuracy of test data. Then, check the connection of each module of the system, including the line connection between the multi-channel test module and the central control module, the intelligent temperature control module and the data acquisition module, etc., to ensure firm and no loose connection. At the same time, check the data storage and interaction module to confirm that the SSD solid state disk has sufficient capacity (2TB of SSD solid state disk is prepared for this test) and the USB 3.0 interface can work normally.
[0051] 2. Test parameter setting
[0052] The test parameters are set through the human-computer interaction interface of the central control module. The test temperature range is set to 10-70℃, the temperature change rate is 2℃ / s, and the temperature at the blue light 450nm-1.6W laser chip clamp stage is kept stable at 10℃, 20℃, 30℃, 40℃, 50℃, 60℃ and 70℃ for 30s before parameter acquisition. In terms of current parameters, the continuous current is set to 80mA, the pulse current amplitude is set to 150mA, and the frequency is set to 50kHz. In addition, the independent light path calibration function of the multi-channel test module and the temperature overshoot suppression function of the intelligent temperature control module are enabled to further improve the test precision.
[0053] 3. Test process
[0054] 3.1, Intelligent temperature control module starts: after the central control module sends temperature control instructions to the intelligent temperature control module, the intelligent temperature control module starts to adjust the test environment temperature according to the set parameters. Starting from the initial temperature of 10℃, the temperature is raised at a rate of 2℃ / s. In the process of temperature rising, the temperature sensor feeds back the temperature information in real time, and the closed-loop controller controls accurately through the PID algorithm. Because the temperature overshoot suppression function is enabled, the temperature overshoot amplitude is controlled within ±0.15℃. When the temperature reaches 20℃ / 30℃ / 40℃ / 50℃ / 60℃ / 70℃, it is stable for 30s, at this time the temperature fluctuation range is ±0.08℃, which meets the test requirements.
[0055] 3.2, Multi-channel test module works: at each temperature stable point, the multi-channel test module applies current to the four laser chips according to the preset current parameters. Among them, the continuous current is 80mA, the pulse current amplitude is 150mA, and the frequency is 50kHz. At the same time, the wavelength detection components, optical power detection components and voltage acquisition circuits of each channel work synchronously, and respectively collect the working temperature, lasing wavelength change, optical power change, voltage change and threshold current and other parameters of the laser chips. Because each channel adopts electromagnetic shielding design, the interference degree between channels is 0.3% after testing, which ensures the independence of each chip test data.
[0056] 3.3, Data acquisition and processing: the data acquisition module synchronously collects each parameter of the four channels at each temperature stable point. The 16-bit high-speed A / D converter it uses works at a sampling frequency of 1MHz, and through the automatic range switching function, it automatically adjusts the acquisition range according to the signal amplitude of different parameters, ensuring the accuracy of the collected data. The collected data is transmitted to the data processing optimization module in real time. The abnormal value detection unit uses the improved Z-score algorithm to detect the data, and uses 3 times the standard deviation as the dynamic threshold. In this test, 3 abnormal data points are identified and marked; the data fusion unit uses Kalman filtering algorithm to fuse the same parameter data collected by the four channels. The standard deviation of the fused data is reduced by 40% compared with that before fusion; the parameter calculation unit calculates the heat power, thermal resistance and other derived parameters according to the fused data, and the calculation error is 0.8%, and the calculation time is within 80ms.
[0057] 3.4, data storage and interaction: the central control module stores the processed test data in the data storage and interaction module according to the preset format, and the storage rate reaches 120MB / s. After the test is completed, the user exports the test data to the computer through the USB3.0 interface. Since the data storage format is compatible with mainstream data analysis software, it can be directly imported into the software for analysis. The analysis results show that the change trend of each parameter of the four blue light 450nm-1.6W laser chips at each 10℃ interval point is consistent, and the parameter fluctuation is small, indicating that the thermal resistance difference of the batch of measured chips is small, the packaging process difference is small, and the interface thermal resistance difference between materials is small.
[0058] Through the test process of the embodiment, it can be known that the parallel test and data processing optimization system of the laser chip tester can efficiently and accurately complete the test of multiple parameters of the laser chip, and meet the demand of large-scale production test.
[0059] It should be noted that in this paper, relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including a" does not exclude the presence of other identical elements in the process, method, article or equipment including the element.
[0060] Although the embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A parallel testing and data processing optimization device for a laser chip testing machine, characterized in that, It includes a multi-channel testing module, an intelligent temperature control module, a data acquisition module, a data processing and optimization module, and a central control module.
2. The parallel testing and data processing optimization device for the laser chip testing machine according to claim 1, characterized in that, The multi-channel test module contains at least four independent test channels. Each channel can independently output continuous current and pulsed current, and can simultaneously acquire the wavelength, optical power, voltage and threshold current of the laser chip under the action of the current. The interference between channels is less than 0.5%. In continuous current mode, the current accuracy can reach ±0.1mA. In pulsed current mode, the current amplitude accuracy can reach ±0.5mA and the frequency accuracy can reach ±0.1kHz.
3. The parallel testing and data processing optimization device for the laser chip testing machine according to claim 1, characterized in that, The intelligent temperature control module adopts a closed-loop feedback control method, and achieves temperature regulation within the range of 10-70℃ through semiconductor refrigeration and heating components. The temperature control accuracy reaches ±0.1℃, and the temperature change rate can be continuously adjusted within the range of 0.5-5℃ / s. The temperature sensor has a response time of no more than 50ms, which can quickly feedback temperature changes and assist the closed-loop controller in accurately adjusting the temperature.
4. The parallel testing and data processing optimization device for the laser chip testing machine according to claim 1, characterized in that, The data acquisition module uses a 16-bit high-speed A / D converter with a sampling frequency of no less than 1MHz. It can simultaneously acquire current and voltage signals output by multiple test modules and optical power signals output by external photodetectors. It also has an automatic range switching function, which can automatically adjust the acquisition range according to the signal amplitude to ensure acquisition accuracy.
5. The parallel testing and data processing optimization device for the laser chip testing machine according to claim 1, characterized in that, The data processing optimization module includes: The outlier detection unit employs an outlier data recognition mechanism based on an improved Z-score algorithm, which can automatically identify and mark outlier data that occurs during the test, with an outlier detection accuracy of no less than 95%. The data fusion unit uses the Kalman filter algorithm to fuse data of the same parameter collected from multiple channels, thereby improving the stability and accuracy of the data. The standard deviation of the fused data is reduced by at least 30% compared to the data before fusion. The parameter calculation unit automatically calculates derived parameters such as thermal power and thermal resistance based on the collected basic data. The calculation error does not exceed 1%, and the calculation time does not exceed 100ms after the data collection of each test point is completed.
6. The parallel testing and data processing optimization device for the laser chip testing machine according to claim 1, characterized in that, The central control module uses an ARM Cortex-A9 processor and communicates with each module via Ethernet to achieve unified control of the testing process. It supports customized settings of test parameters and automated operation of the testing process. The module can store at least 100 different test parameter configurations at the same time for easy access by users.
7. The parallel testing and data processing optimization device for the laser chip testing machine according to claim 1, characterized in that, It also includes a data storage and interaction module, which uses an SSD solid-state drive for data storage with a storage speed of no less than 100MB / s and supports data interaction with external devices via a USB interface; the data storage format is compatible with mainstream data analysis software and can be imported and analyzed without additional conversion.
8. The parallel testing and data processing optimization device for the laser chip testing machine according to claim 1, characterized in that, Each test channel of the multi-channel test module has an independent optical path calibration function, which can automatically perform optical path calibration before each test, and the optical path deviation after calibration does not exceed ±0.05nm.
9. The parallel testing and data processing optimization device for the laser chip testing machine according to claim 1, characterized in that, The intelligent temperature control module has a temperature overshoot suppression function. When the temperature changes rapidly, the temperature overshoot amplitude does not exceed ±0.2℃, ensuring the stability of the test environment temperature.
10. The parallel testing and data processing optimization device for the laser chip testing machine according to claim 1, further comprising a laser chip testing method based on the system of any one of claims 1-9, characterized in that, Includes the following steps: S1: Install the laser chip to be tested onto the test fixture, and set the test temperature range (10-70℃), temperature change rate, current parameters (continuous current magnitude, pulse current amplitude and frequency) and other test parameters through the central control module; at the same time, you can choose whether to enable the advanced functions of each module, such as independent optical path calibration of the multi-channel test module and temperature overshoot suppression of the intelligent temperature control module. S2: The intelligent temperature control module adjusts the test environment temperature according to the set parameters. After the temperature stabilizes (the temperature fluctuation range does not exceed ±0.1℃), the multi-channel test module applies current to the laser chip according to the preset current parameters, which include continuous current parameters and pulse current parameters. S3: The data acquisition module synchronously acquires basic parameters of the laser chip under the preset current, such as operating temperature, lasing wavelength change, optical power change, voltage change, and threshold current, and transmits the acquired data to the data processing and optimization module. S4: The data processing and optimization module performs outlier detection, data fusion, and parameter calculation on the collected data to obtain the pulse current slope, temperature difference, thermal power, and thermal resistance. S5: The central control module stores the processed test data to the data storage and interaction module, and allows users to view and export the data through external devices as needed. It also supports the generation of detailed test reports, which include test parameters, raw data, processed data, and charts showing parameter change trends.