Power supply system of high-power server and high-power server

Abstract

The application discloses a power supply system of a high-power server and the high-power server, and relates to the technical field of server power supply. The system comprises multiple alternating current connectors, multiple power supplies, a power distribution board and a middle backboard. The alternating current connectors are connected with the power supplies in a corresponding mode, the power supplies are connected with the power distribution board, two copper bar connectors are arranged on the power distribution board, two buckle connectors are arranged on the middle backboard, the copper bar connectors are connected with the buckle connectors in a corresponding mode, the power distribution board is connected with the middle backboard through the copper bar connectors and the buckle connectors, the power of the power supplies is greater than or equal to a preset power threshold, the power supply capacity of the alternating current connectors is adapted to the power supplies, the current passing capacity of the buckle connectors is adapted to the copper bar connectors, and the current passing capacity of the copper bar connectors is greater than or equal to a first current and less than or equal to a second current. Thus, the system is adapted to the power supply and current passing capacity of the connectors based on the power of the power supplies, so that the high-power requirement is met.

Description

Technical Field

[0001] This application relates to the field of server power supply technology, and in particular to a power supply system for a high-power server and a high-power server. Background Technology

[0002] With the explosive development of artificial intelligence technology, the power requirements of high-power servers are increasing. Among them, the power increase of graphics processing units (GPUs) is the most obvious, and traditional power supply system architectures have exposed multiple bottlenecks when dealing with high power surges.

[0003] In related technologies, Power Shelf (a high-efficiency power management system) is used to power high-power servers. However, for high-power central processing units (CPUs) and graphics processing units (with power above 21kW), this system can no longer meet the power requirements. Summary of the Invention

[0004] This application provides a power supply system for a high-power server and a high-power server, in order to at least solve the problem of the inability to meet power requirements in related technologies.

[0005] This application provides a power supply system for a high-power server. The system includes: multiple AC connectors, multiple power supplies, a power distribution board, and a backplane. The AC connectors are connected to the power supplies, and the power supplies are connected to the power distribution board. The power distribution board has two copper busbar connectors, and the backplane has two snap-fit ​​connectors. The copper busbar connectors are connected to the snap-fit ​​connectors, and the power distribution board is connected to the backplane via the copper busbar connectors and the snap-fit ​​connectors. The backplane supplies power to multiple graphics processors via the power connectors. The multiple power supplies include at least one basic power supply and at least one redundant power supply, wherein the power of each power supply is greater than or equal to a preset power rating. The power supply capacity of the AC connector is adapted to the power supply unit, and the current carrying capacity of the snap-fit ​​connector is adapted to the copper busbar connector. The current carrying capacity of the copper busbar connector is greater than or equal to a first current value and less than or equal to a second current value. The second current value is determined by multiplying the power of the power supply unit to the supply voltage by the number of power supplies. The output power of a single power supply unit is determined by the ratio of the power demand of the graphics processor to the number of basic power supplies. The supply current of a single power supply unit is determined by the ratio of the output power of a single power supply unit to the supply voltage. The first current value is determined by multiplying the supply current of a single power supply unit by the number of power supplies.

[0006] This application also provides a high-power server, including the power supply system of the aforementioned high-power server.

[0007] By connecting the AC connector to the power supply, the power supply to the power distribution board, and the copper busbar connector on the power distribution board to the snap-fit ​​connector on the backplate, the power supply's power is made greater than or equal to a preset power threshold by means of a preset power threshold. This also adapts to the power supply capacity of the AC connector and the current carrying capacity of the copper busbar connector and snap-fit ​​connector, thus solving the problem of power requirements not being met in related technologies. Attached Figure Description

[0008] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 A connection diagram of a power supply system for a high-power server provided in an embodiment of this application;

[0010] Figure 2 A flowchart illustrating the power supply system of a high-power server according to a specific embodiment of this application;

[0011] Figure 3 This is a block diagram of a high-power server provided in an embodiment of this application. Detailed Implementation

[0012] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0013] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0014] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0015] The power supply for high-power servers consists of two parts: a 54V power supply system for the graphics processing unit (GPU) and fan modules; and a 12V power supply system for the central processing unit (CPU), double data rate memory (DRAM), network interface controller modules, and so on. The increased power consumption of the GPU places the most significant demands on the 54V power supply system.

[0016] In related technologies, high-power server 54V power supply systems use Powershelf power supply, with two power supply schemes: Scheme 1, Powershelf is an independent unit installed on the server rack, using copper busbars to power each server node; Scheme 2, Powershelf is integrated into the server chassis, powering only a single server node. However, for high-power CPU and GPU systems (power above 21kW), this system can no longer meet the power requirements.

[0017] To address at least one of the aforementioned technical problems, this application proposes a power supply system for a high-power server. This system connects an AC connector to a power supply unit, the power supply unit to a power distribution board, and the copper busbar connectors on the power distribution board to snap-fit ​​connectors on the backplane. By setting a power threshold, the power of the power supply unit is made greater than or equal to this value. Simultaneously, it adapts to the power supply capacity of the AC connector and the current carrying capacity of the copper busbar connector and snap-fit ​​connector, thus solving the problem of insufficient power requirements in related technologies.

[0018] The power supply system of the high-power server according to an embodiment of this application will be described in detail below with reference to the accompanying drawings.

[0019] like Figure 1 As shown, the power supply system 100 of the high-power server in this embodiment of the application may include: multiple AC connectors 10, multiple power supplies 20, a power distribution board 30, a middle backplane 40, and a universal base plate 50.

[0020] The system includes multiple AC connectors 10 connected to multiple power supplies 20, power supplies 20 connected to a power distribution board 30 via two copper busbar connectors 31 on the power distribution board, a backplate 40 with two snap-fit ​​connectors 41, copper busbar connectors 31 connected to snap-fit ​​connectors 41, a power distribution board 30 connected to a backplate 40 via two copper busbar connectors 31 and two snap-fit ​​connectors 41, a first copper busbar 42 and two power connectors 43 on the backplate 40, a general-purpose base plate 50 with two power connectors 51, power connectors 43 connected to power connectors 51, a backplate 40 and a general-purpose base plate 50 connected via two power connectors 43 and two power connectors 51, a general-purpose base plate 50 with multiple graphics processors 52, power connectors 51 supplying power to the graphics processors, a backplate supplying power to the graphics processors via power connectors, and multiple power supplies including at least one basic power supply and at least one redundant power supply.

[0021] The power supply power is greater than or equal to a preset power threshold. The AC connector's power supply capacity is compatible with the power supply. The snap-fit ​​connector's current carrying capacity is compatible with the copper busbar connector. The copper busbar connector's current carrying capacity is greater than or equal to a first current value and less than or equal to a second current value. The second current value is determined by multiplying the power supply power of the power supply to the supply voltage by the number of power supplies. The output power of a single power supply is determined by the ratio of the graphics processor's power demand to the number of basic power supplies. The supply current of a single power supply is determined by the ratio of the output power of a single power supply to the supply voltage. The first current value is determined by multiplying the supply current of a single power supply by the number of power supplies.

[0022] Specifically, the power supply system for high-power servers includes a 54V power supply system and a 12V power supply system. Taking the 54V power supply system with a 5+1 parallel architecture as an example, the "5" refers to the number of basic power supplies required for the operation of the high-power server, and the "+1" refers to the additional power supply of the same specifications as redundancy. When any one of the basic power supplies fails, the backup power supply can automatically take over, ensuring uninterrupted power supply and improving power reliability. The 54V power supply system uses dual-input power, and the system settings can select either input A or input B to achieve balanced power distribution. The power supply's power is 3300W, and the maximum supported total system output power is 3300 × 5 = 16.5kW. The 12V power supply system uses 1+1 redundancy, and the maximum supported total system output power is 3.3kW.

[0023] For high-power CPU and GPU systems (power exceeding 21kW), a 54V power supply is insufficient. To support higher-power GPUs on general-purpose motherboards, the power supply's wattage must be greater than or equal to a preset power threshold. This threshold can be set according to power requirements. For example, setting the preset threshold to 5500W means that with a power supply of 5500W, the system's total output power can support a maximum of 5500 × 5 = 27.5kW, which is sufficient to power GPUs with power exceeding 21kW.

[0024] However, increased power leads to higher system current, which can cause insufficient power supply / current carrying capacity of AC connectors, copper busbar connectors, and snap-fit ​​connectors, as well as insufficient system heat dissipation. To meet the power requirements of the power supply and ensure the AC connector's power supply capacity is compatible with it, taking a power supply of 5500W as an example: the power distribution unit connects to the power supply via an AC connector. When the power supply is 3300W, the AC connector type is C20, supporting a maximum current of 16A. When the power supply is 5500W, the C20 AC connector's power supply capacity is insufficient. It can be replaced with a BSC301 AC connector. Simultaneously, the original 3-hole socket on one side of the power distribution unit should be replaced with a socket compatible with the BSC301 AC connector. The connecting cable between the power distribution unit and the AC connector should be replaced with a custom Y-type cable. This solution supports a maximum current of 30A and can support a maximum power supply power of 6600W, which meets the power supply's requirements. Alternatively, the C20 AC connector can be replaced with an OCP7Pin AC connector, which also supports a maximum power supply of 6600W.

[0025] To support the power supply of higher-power graphics processors on a general-purpose motherboard, the current-carrying capacity of the copper busbar connectors must be greater than or equal to a first current value and less than or equal to a second current value. Taking a 54V power supply system with a 5+1 parallel architecture and a power supply unit of 5500W as an example, there are 6 power supplies. The second current value is 5500 / 54×6=611.1A, which is the upper limit of the current-carrying capacity of the copper busbar connectors. At this point, the total system output power is 5500×5=27.5kW, which meets the power supply requirements of graphics processors with a power of 21kW or higher. Based on a minimum power requirement of 21kW for the graphics processor, the initial current value is calculated. The output power of a single power supply is 21000 / 5 = 4200W, and the supply current is 4200 / 54 = 77.8A. The initial current value is 77.8 × 6 = 466.8A, which is the lower limit of the current-carrying capacity of the copper busbar connector. Therefore, the current-carrying capacity of the copper busbar connector is [466.8A, 611.1A]. Simultaneously, the current-carrying capacity of the snap-fit ​​connector is adapted to that of the copper busbar connector to address its insufficient current-carrying capacity. For example, the current-carrying capacity of the snap-fit ​​connector can be set to be the same as that of the copper busbar connector. Similarly, the power connectors on the backplane and the general-purpose baseplate also need to be adapted to the current-carrying capacity of the snap-fit ​​connector to ensure that the power supply requirements of multiple high-power graphics processors on the general-purpose baseplate are met.

[0026] Therefore, this embodiment connects the AC connector to the power supply, the power supply to the power distribution board, and the copper busbar connector on the power distribution board to the snap-fit ​​connector on the backplate. Based on the power requirements of the graphics processor on the general-purpose baseboard, a power threshold of the power supply is preset so that the power of the power supply is greater than or equal to this value. At the same time, the power supply capacity of the AC connector, the current carrying capacity of the copper busbar connector and the snap-fit ​​connector are adapted to meet the power requirements of the graphics processor and improve the reliability of the power supply system.

[0027] In some embodiments of this application, a first copper busbar 42 is provided on the back panel 40. One end of the first copper busbar is connected to the snap connector 41, and the other end of the first copper busbar is connected to the power connector 43 provided on the back panel. The thickness of the copper busbar is in the range of 6mm-7mm.

[0028] Specifically, to meet the power requirements of the graphics processor, the current carrying capacity of the backplane needs to be upgraded. The backplane can carry current through a first copper busbar, one end of which is connected to a snap-fit ​​connector, and the other end to a power connector on the backplane. The thickness of the copper busbar is set to 6mm-7mm because, before the upgrade, its thickness was 4mm. To increase the current carrying capacity of the backplane, the original copper busbar can be thickened. Increasing the thickness increases its cross-sectional area, which is a core parameter affecting current carrying capacity. The current carrying capacity of the copper busbar is positively correlated with its cross-sectional area (thickness × width). With a fixed material, a larger cross-sectional area allows for a larger maximum current, thus enabling the backplane to carry a greater current. The quantitative correlation between copper busbar thickness and current carrying capacity is that a 25%-50% increase in cross-sectional area can increase the current carrying capacity by 66.7%. The copper busbar is made of copper. When the ambient temperature is constant, the current carrying capacity is approximately proportional to the cross-sectional area. The original copper busbar is 4mm thick and has a cross-sectional area of ​​S1=W×4, where W is the width of the copper busbar. If the copper busbar is thickened by 2mm (to 6mm), the cross-sectional area becomes S2=W×6, and the increase in cross-sectional area is (S2-S1) / S1=50%, with a corresponding increase in current carrying capacity of 50%. If the copper busbar is thickened by 3mm (to 7mm), the cross-sectional area becomes S3=W×7, and the increase in cross-sectional area is (S3-S1) / S1=75%, with a corresponding increase in current carrying capacity of 75%. Taking the power supply power being increased from 3300W to 5500W as an example, the 54V power supply system adopts a 5+1 parallel architecture. The single-circuit current of the original power supply is I1=P1 / U=3300 / 54=61.1A, and the total current that the copper busbar needs to carry is 61.1A×6=366.6A. After the power supply power is increased to 5500W, the total current that the copper busbar needs to carry is 5500 / 54×6=611.4A. The current carrying capacity after a 50% increase is 366.6A × 1.5 = 549.9A, and the current carrying capacity after a 75% increase is 366.6A × 1.75 = 641.55A > 611.4A, which can meet the power requirements of the power supply. In order to ensure that the overall structure of the power supply system remains unchanged, the first copper busbar cannot interfere with other components. Therefore, the thickness of the copper busbar is set to 6mm-7mm. This thickness can ensure sufficient space for the installation of the copper busbar. This way, the upgraded current carrying capacity can be met without affecting other components in the system, thus achieving a balance between upgrading the current carrying capacity and structural versatility.

[0029] This embodiment achieves copper busbar thickening by setting the thickness of the first copper busbar on the backplane to a range of 6mm-7mm. This upgrades the current carrying capacity of the backplane while ensuring that the power supply system structure remains unchanged, balancing the upgrade of current carrying capacity with structural versatility, and taking into account both current carrying performance and practicality.

[0030] In some embodiments of this application, a copper layer is covered on the backplate 40, and the thickness of the copper layer ranges from 15 oz to 17 oz.

[0031] Specifically, the copper layer covering the backplane can also carry current. To upgrade the current carrying capacity of the backplane, the thickness of the copper layer is set to 15oz-17oz. This is because before the upgrade, the thickness of the copper layer was 11oz-13oz. To increase the current carrying capacity of the backplane, the original copper layer was thickened. With increased thickness, its cross-sectional area increases, and cross-sectional area is a core parameter affecting current carrying capacity, thus allowing it to carry a larger current. However, to ensure that the backplane support does not move, its structural features remain unchanged, and the overall structure of the power supply system remains the same, the thickness of the copper layer is set to 15oz-17oz. This thickness ensures the upgrade of the backplane's current carrying capacity. If the copper layer thickness exceeds 17oz, it will affect the performance of adjacent server modules, including heat dissipation and structural compatibility.

[0032] This embodiment achieves increased copper layer thickness by setting the copper layer thickness on the backplane to a range of 15oz-17oz, thereby increasing the current carrying capacity of the backplane. The thickness range is within a controllable range and will not affect the structure and performance characteristics of the backplane support or adjacent server modules. It achieves a balance between improving current carrying capacity and ensuring the stability of the overall structural performance, meeting the functional requirements of high-power server operation while ensuring the overall compatibility and reliability of the system.

[0033] In some embodiments of this application, a first copper busbar 42 and a second copper busbar are provided on the backplate 40. One end of the first copper busbar and the second copper busbar are connected to the snap connector 41, and the other end of the first copper busbar and the second copper busbar are connected to the power connector 43 provided on the backplate. The thickness of the first copper busbar and the second copper busbar is in the range of 3mm-4mm. The input end of the second copper busbar is connected to the output pin of the snap connector. The second copper busbar is located away from the dense signal line area.

[0034] Specifically, in order to upgrade the current carrying capacity of the backplane, a copper busbar can be added to the backplane as a second copper busbar. One end of the first and second copper busbars is connected to the snap-fit ​​connector, and the other end of the first and second copper busbars is connected to the power connector on the backplane. The thickness of the first and second copper busbars is set to 3mm-4mm, that is, the original thickness is maintained, but the number of copper busbars is increased, which can also upgrade the current carrying capacity of the backplane.

[0035] The core layout principle of the backplane is to anchor the main power supply path and avoid areas with dense signal coverage. The layout needs to distinguish between the power supply link layer and the signal link layer. The power supply link layer carries high-current DC power and is mainly located on the top / bottom surface layer. The signal link layer transmits control signals, monitoring signals, etc., and is mainly located on the middle layer. New copper busbars should be placed along the main power supply path, prioritizing the use of empty areas on the surface layer to avoid occupying the middle signal layer and causing routing conflicts, thus reducing the impact on signal attenuation at the source. If there are dense routing areas on both the top / bottom surface layer, such as the top layer being full of power supply capacitors, then new copper busbars should be placed in the empty areas at the bottom edge of the bottom layer, such as the 10mm wide area at the bottom edge of the backplane. This area usually has no signal routing, meaning the second copper busbar should be placed away from areas with dense signal routing.

[0036] The input terminal of the second copper busbar needs to be directly connected to the output pin of the snap-fit ​​connector, with a distance of less than or equal to 5mm (preferably on the top layer of the same layer). If the first copper busbar is located directly below the snap-fit ​​connector, the second copper busbar should be arranged parallel to the right / left side of the snap-fit ​​connector, with a spacing of greater than or equal to 8mm, to avoid interference with the internal spring pressure plate of the snap-fit ​​connector. If the wiring around the snap-fit ​​connector is dense, such as being filled with power supply pre-capacitors, the second copper busbar should be arranged at the corresponding position on the bottom layer, and connected to the snap-fit ​​connector through vias. The via diameter should be ≥2mm and the number should be ≥4 to ensure the current carrying capacity of the backplane.

[0037] This embodiment upgrades the current carrying capacity of the backplane by adding a second copper busbar on the backplane and setting the connection relationship and thickness range of the first and second copper busbars. The second copper busbar is located away from the dense signal line area, avoiding spatial conflicts with existing components. It does not require extensive changes to the overall structure of the backplane, reducing the design and adaptation difficulty. It achieves a targeted upgrade in current carrying capacity while taking into account the compatibility of the original components of the backplane, and can more flexibly adapt to backplane application scenarios with different specifications and component layouts.

[0038] In some embodiments of this application, the contact area of ​​the internal copper sheet of the copper busbar connector 31 is greater than or equal to a preset area threshold, and the preset area threshold is positively correlated with the current carrying capacity of the copper busbar connector.

[0039] Specifically, to increase the current-carrying capacity of a copper busbar connector, the contact area of ​​the copper contacts inside the connector can be increased. This increased contact area is greater than or equal to a preset area threshold. The preset area threshold is positively correlated with the current-carrying capacity of the copper busbar connector. The preset area threshold can be set according to the current-carrying capacity requirements. For example, when the current-carrying capacity of the copper busbar connector is 200A, the contact surface of the copper contacts inside the connector is a 10mm × 10mm rectangular contact surface, with a contact area of ​​100mm². 2When the current carrying capacity of the copper busbar connector is 300A, the contact surface of the copper plate inside the connector is increased to a rectangular contact surface of 12mm × 12.5mm, with a contact area of ​​150mm². 2 At this point, the preset area threshold is set to 150mm. 2 The current-carrying capacity of a copper busbar connector is increased by increasing the contact area of ​​the copper plates inside the connector. A typical copper busbar connector has a current-carrying capacity of 300A. Figure 1 The two copper busbar connectors have a total current carrying capacity of 600A, which is within the acceptable range for the current carrying capacity of copper busbar connectors.

[0040] This embodiment enables the copper busbar connector to achieve greater current carrying capacity by setting the contact area of ​​the internal copper plates of the copper busbar connector to be greater than or equal to a preset area threshold. At the same time, a larger contact area can reduce the contact resistance during current transmission, thereby reducing the power loss caused by resistance heating, improving energy transmission efficiency, and ensuring the stability of system operation.

[0041] In some embodiments of this application, the copper busbar connector 31 includes a positive copper busbar connector and a negative copper busbar connector, which are packaged together.

[0042] Specifically, a copper busbar connector consists of a positive copper busbar connector and a negative copper busbar connector. The positive and negative copper busbar connectors are fixed at a uniform spacing by plastic terminals, and then encapsulated together by welding. During welding, the structural precision of the welding must be ensured so that the connection or disconnection of the copper busbar connector and the snap-fit ​​connector meets the requirements.

[0043] This embodiment encapsulates the positive and negative copper busbar connectors together to form a single copper busbar connector, reducing the number of independent components, simplifying the overall structure, and saving space. The uniform spacing is fixed by plastic terminals to avoid affecting the use due to spacing deviations. By ensuring the precision of the welding structure, the copper busbar connector meets the insertion and removal requirements, improving the reliability of use. The integrated design combined with precise control comprehensively improves the integration efficiency and application adaptability of the copper busbar connector.

[0044] In some embodiments of this application, the contact area of ​​the internal spring sheet of the snap connector 41 is the same as the contact area of ​​the internal copper sheet of the copper busbar connector 31.

[0045] Specifically, to support the power supply of higher-power graphics processors on general-purpose baseboards, the current-carrying capacity of the snap-fit ​​connector needs to be adapted to that of the copper busbar connector. This can be achieved by adapting the contact areas of the snap-fit ​​connector and the copper busbar connector. For example, the contact area of ​​the internal spring contacts of the snap-fit ​​connector can be made the same as the contact area of ​​the internal copper contacts of the copper busbar connector; the contact area of ​​the internal copper contacts of the copper busbar connector can be increased to 150mm. 2 At that time, the contact area of ​​the internal spring sheet of the snap connector is set to 150mm². 2 When the contact area of ​​the internal spring sheet of the snap connector is 150mm² 2 At this time, the current carrying capacity of the snap-fit ​​connector is the same as that of the copper busbar connector, which can meet the power requirements of the graphics processor.

[0046] This embodiment ensures that the current-carrying capacity of the snap-fit ​​connector is compatible with that of the copper busbar connector by making the contact area of ​​the spring sheet inside the snap-fit ​​connector the same as that of the copper sheet inside the copper busbar connector. This meets the power requirements of the graphics processor. The matching contact area allows for a more uniform current distribution, thereby reducing energy loss during transmission and improving transmission efficiency. The matching contact area also allows for a tighter connection between the snap-fit ​​connector and the copper busbar connector, reducing problems such as loosening and open circuits. This saves space and improves the reliability of the power supply system.

[0047] In some embodiments of this application, a third snap-fit ​​connector is disposed on the back panel 40 and a third copper busbar connector is disposed on the power distribution board 30, the third snap-fit ​​connector being connected to the third copper busbar connector.

[0048] Specifically, in order to increase the total current carrying capacity of the copper busbar connector and to make the total current carrying capacity of the snap-fit ​​connector match the total current carrying capacity of the copper busbar connector, a copper busbar connector can be added to the power distribution board as the third copper busbar connector, and a snap-fit ​​connector can be added to the back panel as the third snap-fit ​​connector. The third snap-fit ​​connector is connected to the third copper busbar connector, and the other end of the third copper busbar connector is also connected to the power supply. The other end of the third snap-fit ​​connector is also connected to the power connector on the back panel. The specific positions of the third copper busbar connector and the third snap-fit ​​connector are not fixed and can be adjusted according to the actual circuit board layout. For example, if a single copper busbar connector has a current carrying capacity of 200A, adding a third copper busbar connector brings the total number of copper busbar connectors on the power distribution board to three, with a total current carrying capacity of 3 × 200 = 600A. Then, a third snap-fit ​​connector is added to the backplane, bringing the total number of snap-fit ​​connectors on the backplane to three. Each snap-fit ​​connector has a current carrying capacity of 200A, and the total current carrying capacity of the snap-fit ​​connectors is also 600A. Based on the 5+1 redundant parallel architecture of the 54V power supply system, the maximum total output power supported by the system is 27.5kW. The total power that the copper busbar connectors can withstand is 54 × 600 = 32.4kW, which meets the power requirements of the power supply and thus satisfies the power demands of the graphics processor.

[0049] This embodiment adds a third snap-fit ​​connector to the backplane and a third copper busbar connector to the power distribution board, connecting the third snap-fit ​​connector to the third copper busbar connector. This increases the total current carrying capacity of the copper busbar connector and the snap-fit ​​connector, thereby meeting the power requirements of the graphics processor. The additional set of connectors shares the current, reducing the actual load current of each set of connectors. This reduces the heat generation and oxidation losses caused by long-term high loads on a single set of connectors, extending the lifespan of the connectors. Even if a set of connectors experiences a minor fault, the remaining sets can still share the current, reducing system power outages or faults caused by single-point failures and improving the overall reliability of the power supply system.

[0050] In some embodiments of this application, the current-carrying capacity of the snap-fit ​​connector 41 is the same as that of the copper busbar connector 31.

[0051] Specifically, to ensure that the current-carrying capacity of the snap-fit ​​connector is compatible with that of the copper busbar connector, and that their current-carrying capacities are identical (for example, if the current-carrying capacity of the copper busbar connector is upgraded from 200A to 300A, the current-carrying capacity of the snap-fit ​​connector also needs to be upgraded from 200A to 300A), this can be achieved by changing the type or model of the snap-fit ​​connector. The snap-fit ​​connector can be replaced with another type or model of connector with a current-carrying capacity of 300A. It is crucial to ensure the interchangeability of this connector with the snap-fit ​​connector, meaning that the connection method between the replaced connector and the copper busbar connector remains unchanged, without affecting the original system's layout and installation. This ensures that the current-carrying capacity of the snap-fit ​​connector is compatible with that of the copper busbar connector.

[0052] This embodiment ensures that the current-carrying capacity of the snap-fit ​​connector is the same as that of the copper busbar connector, thereby guaranteeing that the current-carrying capacity of the snap-fit ​​connector is compatible with that of the copper busbar connector. The matching of the two together ensures the stability of current transmission in the entire power supply system and avoids circuit failures caused by mismatch in connector performance.

[0053] In some embodiments of this application, a first heat-conducting component is attached to the surface of the first copper busbar 42, and the first heat-conducting component is attached to the chassis heat dissipation bracket, wherein the surface of the first copper busbar is attached to the bottom of the snap connector 41.

[0054] Specifically, after upgrading the current carrying capacity of the backplane, the increased current can cause the temperature rise of local areas of the backplane (such as the snap-fit ​​connector interface and copper busbar soldering points) and surrounding components (such as the general baseboard power supply interface and the copper busbar connector connection of the power distribution board) to exceed the safety threshold, which is typically required to be ≤85℃. At the same time, traditional heat dissipation methods are not effective enough for high power density areas, which can easily lead to local heat accumulation, affecting power supply stability and component lifespan. Therefore, it is necessary to combine hardware structure optimization and heat dissipation medium upgrades to improve heat dissipation capacity. To enhance passive heat dissipation in the middle backplate, a first thermal conductive component is attached to the surface of the first copper busbar. The surface of the first copper busbar is attached to the bottom of the snap-fit ​​connector, and the first thermal conductive component is attached to the chassis heat dissipation bracket. This transfers the local heat from the first copper busbar and snap-fit ​​connector on the middle backplate to the chassis heat dissipation bracket, which then rapidly transfers the local heat to the chassis shell for heat dissipation. The first thermal conductive component can be selected according to the required heat dissipation effect. For example, a 0.5-1mm thick graphene thermal conductive pad can be selected as the first thermal conductive component. The thermal conductivity of ordinary silicone thermal conductive pads is usually only 10-50W / (m•K), while graphene, due to its layered structure and electronic conduction characteristics, has a thermal conductivity far exceeding that of traditional materials, with a high thermal conductivity of ≥400W / (m•K). This allows for rapid heat dissipation, preventing heat accumulation on the surface of the copper busbar and the bottom of the connector. The thickness of graphene thermal pads is 0.5-1mm because if they are too thin (<0.5mm), they may affect heat dissipation, while if they are too thick (>1mm), the heat conduction path becomes longer, which weakens the heat dissipation effect. 0.5-1mm is the optimal balance range.

[0055] This embodiment attaches a first heat-conducting component to the surface of the first copper busbar, with the surface of the first copper busbar fitting to the bottom of the snap-fit ​​connector and the first heat-conducting component fitting to the chassis heat dissipation bracket. This allows the localized heat from the first copper busbar and snap-fit ​​connector on the backplate to be quickly conducted to the chassis shell for heat dissipation through the chassis heat dissipation bracket, meeting temperature requirements and preventing heat accumulation in localized areas. This achieves short-path, low-loss heat transfer and effectively avoids component performance degradation, shortened lifespan, or failure risks caused by high temperatures, ensuring the stable operation of the power supply system while balancing practicality and economy.

[0056] In some embodiments of this application, a second heat-conducting component is attached to the surface of the second copper busbar. The second heat-conducting component is attached to the chassis heat sink bracket and the distance between the two components is less than or equal to 1 mm. The thickness of the second heat-conducting component is 0.5 mm to 1 mm. The surface of the second copper busbar is attached to the bottom of the snap-fit ​​connector 41.

[0057] Specifically, for enhanced passive heat dissipation in the middle backplate, a second thermally conductive component is attached to the surface of the second copper busbar. The surface of the second copper busbar is attached to the bottom of the snap-fit ​​connector, and the second thermally conductive component is attached to the chassis heatsink bracket. This transfers localized heat from the second copper busbar and snap-fit ​​connector on the middle backplate to the chassis heatsink bracket, which then rapidly conducts the heat to the chassis casing for dissipation. The upper surface of the second copper busbar must be completely aligned with the second thermally conductive component. The thickness of the second thermally conductive component is 0.5mm-1mm, covering the middle area of ​​the second copper busbar. The length of the second thermally conductive component is at least 2 / 3 of the length of the second copper busbar, and the distance between the other end of the second thermally conductive component and the chassis heatsink bracket is less than or equal to 1mm to ensure effective heat dissipation. The material of the second thermally conductive component can be selected according to the required heat dissipation effect; for example, a graphene thermal pad can be chosen as the second thermally conductive component to improve thermal conductivity. This embodiment attaches a second heat-conducting component to the surface of the second copper busbar, with the surface of the second copper busbar fitting against the bottom of the snap-fit ​​connector and the second heat-conducting component fitting against the chassis heat dissipation bracket. This allows the localized heat from the second copper busbar and snap-fit ​​connector on the backplate to be quickly conducted to the chassis shell for heat dissipation through the chassis heat dissipation bracket, meeting temperature requirements and preventing heat accumulation in localized areas. This achieves short-path, low-loss heat transfer and effectively avoids component performance degradation, shortened lifespan, or failure risks caused by high temperatures, ensuring the stable operation of the power supply system while balancing practicality and economy.

[0058] In some embodiments of this application, a plurality of heat dissipation holes are formed in the current bottleneck area of ​​the middle back plate 40, and the diameter of the heat dissipation holes ranges from 1mm to 3mm. The current bottleneck area includes at least one of the following: copper busbar welding point, interlayer connection point, and high current path intersection point. The distance between the copper busbar welding point of the second copper busbar and the heat dissipation hole is greater than or equal to 3mm.

[0059] Specifically, to enhance passive heat dissipation in the backplane, multiple heat dissipation holes can be created in the current bottleneck area of ​​the backplane. The current bottleneck area is a critical region with high current, including at least one of the following: copper busbar solder joints, interlayer connections, or intersections of high-current paths. The hole diameter can be set between 1mm and 3mm. Too small a diameter (<1mm) will result in insufficient heat dissipation, while too large a diameter (>3mm) will interfere with other components on the backplane. The number of heat dissipation holes is not fixed; as many holes as possible can be created based on the actual usable space of the backplane to reduce localized heat accumulation and improve heat dissipation. Furthermore, the distance between the copper busbar solder joints of the second copper busbar and the heat dissipation holes should be greater than or equal to 3mm to avoid reducing the cross-sectional area of ​​the second copper busbar and thus decreasing current flow capacity. Simulation results have verified that this solution can reduce the temperature in the backplane area by 12-15℃. This embodiment improves the heat dissipation capacity of the back panel by opening multiple heat dissipation holes in the flow bottleneck area of ​​the back panel and setting the hole diameter range to 1mm-3mm. This is done without affecting other components on the back panel. Moreover, the number of heat dissipation holes is not fixed, and as many holes as possible can be opened according to the actual space of the back panel to further explore the heat dissipation potential and improve the flexibility and adaptability of the solution.

[0060] In some embodiments of this application, a heat dissipation coating is sprayed onto the surface of the copper busbar connector 31, and the thickness of the heat dissipation coating is 0.1mm-0.3mm.

[0061] Specifically, for the coordinated heat dissipation design of the copper busbar connector and the power distribution board, a heat-dissipating coating is sprayed onto the surface of the copper busbar connector. The thickness of the heat-dissipating coating is 0.1mm-0.3mm. This heat-dissipating coating can be a nano-ceramic heat-dissipating coating with a thermal conductivity ≥60W / (m•K). If the thickness of the heat-dissipating coating is too thin (<0.1mm), the heat dissipation capacity will be insufficient; if the thickness is too thick (>0.3mm), it will have an insulating effect on heat, which will actually affect the heat dissipation capacity. This heat-dissipating coating can also reduce the contact thermal resistance between the copper busbar connector and the power distribution board, thereby preventing heat from accumulating at the copper busbar connector. The power distribution board can dissipate heat through its own structure, thereby improving the overall heat dissipation speed.

[0062] This embodiment improves the heat dissipation capacity and speed of the copper busbar connector and the power distribution board by spraying a heat dissipation coating on the surface of the copper busbar connector. The thickness of the heat dissipation coating is set to 0.1mm-0.3mm, which reduces Joule heat loss during current transmission, indirectly reduces overall energy consumption, and improves the energy efficiency of the power supply system.

[0063] In some embodiments of this application, the back of the mounting area of ​​the copper busbar connector 31 has a hollowed-out pattern, the width of which ranges from 0.6mm to 1.0mm, and the spacing of which ranges from 0.8mm to 1.2mm.

[0064] Specifically, for the coordinated heat dissipation design of the copper busbar connector and the power distribution board, a perforated pattern can be etched on the back of the area corresponding to the copper busbar connector mounting on the power distribution board. The width of the perforated pattern ranges from 0.6mm to 1.0mm, and the spacing ranges from 0.8mm to 1.2mm. A width less than 0.6mm or a spacing less than 0.8mm results in insufficient heat dissipation, while a width greater than 1.0mm or a spacing greater than 1.2mm will affect the connection structure between the copper busbar connector and the power distribution board. The shape of the perforated pattern can be grid-like, square, diamond-shaped, etc. Increasing the etched perforated pattern can increase the heat dissipation area of ​​the power distribution board, reducing the temperature at the connection point between the copper busbar connector and the power distribution board by 8-10℃, and preventing poor contact of the copper busbar connector due to localized overheating.

[0065] This embodiment increases the heat dissipation area of ​​the power distribution board by etching hollow patterns on the back of the copper busbar connector mounting area, thereby improving heat dissipation capacity, accelerating heat dissipation rate, and avoiding local heat accumulation. This maintains the copper busbar connector and the power distribution board as a whole in a more suitable operating temperature range, reduces electrical performance degradation caused by high temperature, extends product life, reduces the risk of failure caused by overheating, and ensures the reliability and stability of the power supply system.

[0066] In some embodiments of this application, the AC connector 10 integrates a first sensor for acquiring the input current of the AC connector.

[0067] Specifically, after upgrading the power supply system's power output and optimizing its heat dissipation, it's necessary to monitor key parameters of the power supply system in real time, such as input current, output voltage, connector contact resistance, and component temperature. This allows for timely warnings of potential faults and prevents issues like sudden current drops due to loose connectors or overheating and aging of copper busbars from affecting the overall system reliability. Therefore, a first sensor is integrated into the AC connector to collect the connector's input current in real time. This first sensor can be a Hall effect current sensor, which is suitable for non-contact AC current acquisition and offers high stability. Since the AC connector connects to the power supply, current flows from the connector into the power supply. Therefore, the power supply's rated current should be used as the detection standard. For example, with a power supply power of 5500W, the rated input current is 25A. Thus, the first sensor's range can be selected as 0-30A, and its accuracy as ±0.5A.

[0068] This embodiment integrates a first sensor into the AC connector to collect the input current of the AC connector, preparing for subsequent real-time parameter monitoring and fault early warning, thereby improving the stability and reliability of the power supply system.

[0069] In some embodiments of this application, the output end of the copper busbar connector 31 integrates a second sensor for acquiring the output voltage of the power distribution board 30.

[0070] Specifically, to monitor the key parameters of the power supply system in real time, a second sensor can be integrated at the output end of the copper busbar connector to collect the output voltage of the power distribution board in real time. The second sensor can be a voltage sensor. Taking a 54V power supply system as an example, the rated voltage of the power distribution board is 54V, so the range of the second sensor can be selected from 0-60V, and the accuracy can be selected from ±0.1V.

[0071] This embodiment integrates a second sensor at the output end of the copper busbar connector to collect the output voltage of the power distribution board in real time, preparing for subsequent real-time parameter monitoring and fault early warning, thereby improving the stability and reliability of the power supply system.

[0072] In some embodiments of this application, a third sensor is integrated inside the snap-fit ​​connector 41 to collect the contact resistance of the contact points of the snap-fit ​​connector, wherein the distance between the second copper busbar and the terminal of the snap-fit ​​connector is greater than or equal to 3 mm.

[0073] Specifically, to monitor key parameters of the power supply system in real time, a third sensor can be integrated inside the snap-fit ​​connector to collect the contact resistance of the connector's contact points. Contact resistance reflects the quality of the contact. The third sensor can be a miniature contact resistance sensor, which is small in size and suitable for installation inside the space-constrained snap-fit ​​connector. The contact resistance is typically low, so the sensor's range can be selected from 0-100mΩ, and its accuracy can be ±5mΩ. Furthermore, the distance between the second copper busbar and the snap-fit ​​connector's terminals is greater than or equal to 3mm to prevent the magnetic field generated by the current flowing through the second copper busbar from interfering with the sampling signal of the contact resistance sensor. This embodiment integrates a third sensor inside the snap-fit ​​connector to collect the contact resistance of the connector's contact points in real time, reflecting the quality of the contact and preparing for subsequent real-time parameter monitoring and fault early warning.

[0074] In some embodiments of this application, a fourth sensor, a fifth sensor, and a sixth sensor are provided on the back panel 40. The fourth sensor is correspondingly provided with the snap-fit ​​connector 41 and is used to collect the first temperature value of the snap-fit ​​connector. The fifth sensor is correspondingly provided with the first copper busbar 42 and is used to collect the second temperature value of the first copper busbar. The sixth sensor is correspondingly provided with the second copper busbar and is used to collect the third temperature value of the second copper busbar. The distance between the second copper busbar and the sixth sensor is greater than or equal to 5 mm. A seventh sensor is provided at the air outlet of the power supply 20 and is used to collect the fourth temperature value of the air outlet.

[0075] Specifically, to monitor key parameters of the power supply system in real time, a fourth, fifth, and sixth sensor can be installed on the backplane. The fourth sensor corresponds to the snap-fit ​​connector and can collect the first temperature value of the connector in real time. The fifth sensor corresponds to the first copper busbar and can collect the second temperature value of the first copper busbar in real time. The sixth sensor corresponds to the second copper busbar and is used to collect the third temperature value of the second copper busbar. The distance between the second copper busbar and the sixth sensor is greater than or equal to 5mm to avoid the high temperature of the second copper busbar being directly conducted to the sixth sensor, which would cause measurement deviation of the third temperature value. The fourth, fifth, and sixth sensors can be negative temperature coefficient thermistors, which can monitor hardware temperature more accurately, with good stability and high sensitivity. A seventh sensor is installed at the air outlet of the power supply to collect the fourth temperature value of the air outlet in real time. The seventh sensor can be a temperature sensor. By collecting the first, second, third, and fourth temperature values, the temperature of key components can be monitored in real time, optimizing heat dissipation control.

[0076] This embodiment includes a fourth, fifth, and sixth sensor on the backplane to collect the first temperature value of the snap-fit ​​connector, the second temperature value of the first copper busbar, and the third temperature value of the second copper busbar in real time. A seventh sensor is also installed at the air outlet of the power supply to collect the fourth temperature value of the air outlet in real time. By collecting the first, second, third, and fourth temperature values, the temperature of key components can be monitored in real time, preparing for subsequent fault warnings and improving the stability and reliability of the power supply system.

[0077] In some embodiments of this application, the power supply system of the high-power server further includes: an early warning module, used to provide an overcurrent warning when the input current of the AC connector 10 is greater than a preset current, and to provide a voltage abnormality warning when the output voltage of the power distribution board 30 is greater than a first preset voltage threshold or less than a second preset voltage threshold, and to provide a poor contact warning when the contact resistance of the contact point of the snap connector 41 is greater than or equal to a preset resistance threshold; the early warning module is also used to provide an overheat warning when a first temperature value, a second temperature value, a third temperature value, and a fourth temperature value exceed the corresponding temperature threshold.

[0078] Specifically, to provide timely warnings of potential faults, the power supply system of this high-power server also includes an overcurrent warning module. This module issues an overcurrent warning when the input current of the AC connector exceeds a preset current. The preset current can be set according to the rated input current of the power supply. For example, if the rated input current of the power supply is 25A, the preset current is set to 27.5A when the current exceeds 10% of the rated input current of the power supply. When the input current of the AC connector exceeds 27.5A, an overcurrent warning will be triggered, reminding maintenance personnel to check or repair in time to avoid damage to the AC connector or other safety risks caused by abnormal current.

[0079] The warning module can also issue a voltage anomaly warning when the output voltage of the power distribution board is greater than a first preset voltage threshold or less than a second preset voltage threshold. The first and second preset voltage thresholds can be set according to the rated voltage of the power distribution board. Taking the rated voltage of the power distribution board as 54V as an example, if the first preset voltage threshold is set to 56V and the second preset voltage threshold is set to 52V, then a voltage anomaly warning will be issued when the output voltage of the power distribution board is greater than 56V or less than 52V, in order to prevent the power distribution board from being damaged by overvoltage or failing due to undervoltage, and to promptly remind maintenance personnel to check or repair it.

[0080] The early warning module can also issue a contact failure warning when the contact resistance of the snap-fit ​​connector's contact point is greater than or equal to a preset resistance threshold. Since the contact resistance is low when the contact is good, the preset resistance threshold can be set according to the actual situation. For example, if the preset resistance threshold is set to 50mΩ, a contact failure warning will be issued when the contact resistance of the snap-fit ​​connector's contact point is ≥50mΩ, so as to reflect the loosening or oxidation fault of the connector and promptly remind maintenance personnel to check or repair it.

[0081] The early warning module can also issue overheat warnings when the first, second, third, and fourth temperature values ​​exceed the corresponding temperature thresholds. The local temperature inside the power supply system is generally ≤85℃. Therefore, the temperature threshold corresponding to each temperature value can be adjusted according to the upper limit of the local temperature to match the appropriate temperature values ​​of the snap-fit ​​connector, the first copper busbar, the second copper busbar, and the air outlet of the power supply. When the first, second, third, or fourth temperature value exceeds the corresponding temperature threshold, an overheat warning is issued to avoid damage to key components, performance degradation, or even circuit failures and safety risks caused by local overheating. It promptly reminds maintenance personnel to check or repair, ensuring the stability, safety, and reliability of the overall operation of the power supply system.

[0082] Furthermore, key data such as current, voltage, contact resistance, and temperature values ​​collected by the sensors are transmitted to the baseboard management controller on the server via the communication bus. The baseboard management controller software platform realizes real-time display of key parameters, storage of historical data, and fault SMS / email push functions, which can be stored for ≥3 months. Maintenance personnel can remotely monitor the status of the power supply system in real time and carry out timely inspections or repairs to ensure the stability, safety, and reliability of the overall operation of the power supply system. The fault response time can be shortened to less than 10 minutes.

[0083] This embodiment uses an early warning module to provide early warnings for overcurrent, abnormal voltage, poor connector contact, and overheating. It remotely monitors key parameters of the power supply system in real time, and can promptly inspect or repair faults to ensure the stability, safety, and reliability of the overall operation of the power supply system. Historical data can also be stored to provide strong data support for future server performance optimization and comprehensively improve server reliability.

[0084] As a specific embodiment of this application, the working process of the power supply system of the high-power server is as follows: Figure 2 As shown, the following steps may be included:

[0085] S201, the power of the upgraded power supply is greater than or equal to the preset power threshold.

[0086] S202 upgrades the power supply capability of the AC connector to match the power supply.

[0087] S203 upgrades the current-carrying capacity of the copper busbar connector.

[0088] S204 upgrades the current-carrying capacity of the snap-fit ​​connector to be compatible with copper busbar connectors.

[0089] S205, upgraded backplane for improved flow capacity.

[0090] S206 optimizes heat dissipation for key components such as the backplane, copper busbars, copper busbar connectors, and snap-fit ​​connectors.

[0091] The S207 uses sensors to monitor key parameters such as current, voltage, contact resistance, and temperature in real time, and provides fault warnings through an early warning module.

[0092] Therefore, the power supply system for the high-power server proposed in this embodiment has the following technical advantages:

[0093] (1) For high-power central processing unit and graphics processing unit system, the power supply power is upgraded to meet the power supply demand, the chain problem after the power supply upgrade is targeted to solve the power supply bottleneck, the power supply capacity of AC connector is upgraded to solve the power supply bottleneck, the current carrying capacity of copper busbar connector, snap connector and back panel is upgraded, the current carrying link is strengthened, and through heat dissipation optimization and multi-dimensional real-time monitoring and fault early warning, a technical route of solving one by one and adapting to each link is formed, which improves the stability, safety and reliability of the overall operation of the power supply system.

[0094] (2) The heat dissipation optimization scheme solves the problem of local heat accumulation after the upgrade of the current carrying capacity. Through the layered heat dissipation scheme of passive heat conduction, directional active heat dissipation and component collaboration, the maximum temperature of the middle back panel, power distribution board and key connection components copper busbar, copper busbar connector and snap connector is controlled within 80℃, which meets the temperature requirements of long-term operation of high power server. At the same time, the heat dissipation scheme is fully compatible with the power supply / current carrying capacity upgrade scheme, without the need to make additional changes to the overall structure of the server chassis, taking into account both heat dissipation effect and structural adaptability.

[0095] (3) All upgrade and heat dissipation solutions take into account the compatibility of existing equipment and future expansion. No changes are required to the overall structure of the chassis. They can be adapted to the future expansion requirements of higher power consumption of central processing units and graphics processors, greatly reducing the impact of power supply upgrades on current flow, heat dissipation and structure, and improving the efficiency of power supply upgrades.

[0096] Embodiments of this application also provide a high-power server, such as... Figure 3 As shown, the high-power server 1000 includes a power supply system 100 for the high-power server.

[0097] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for specific applications, but such implementations should not be considered beyond the scope of this application.

[0098] The power supply system and high-power server of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only intended to help understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A power supply system for a high-power server, characterized in that, The system includes: multiple AC connectors, multiple power supplies, a power distribution board, and a backplane. The AC connectors are connected to the power supplies, and the power supplies are connected to the power distribution board. The power distribution board has two copper busbar connectors, and the backplane has two snap-fit ​​connectors. The copper busbar connectors are connected to the snap-fit ​​connectors. The power distribution board and the backplane are connected via the copper busbar connectors and the snap-fit ​​connectors. The backplane supplies power to multiple graphics processors via the power connectors. The multiple power supplies include at least one basic power supply and at least one redundant power supply. The power supply's power is greater than or equal to a preset power threshold; the AC connector's power supply capacity is adapted to the power supply; the snap-fit ​​connector's current-carrying capacity is adapted to the copper busbar connector; the copper busbar connector's current-carrying capacity is greater than or equal to a first current value and less than or equal to a second current value, wherein... The second current value is determined by multiplying the ratio of the power supply's power to the supply voltage by the number of power supplies. The output power of a single power supply is determined by the ratio of the graphics processor's power demand to the number of basic power supplies. The supply current of a single power supply is determined by the ratio of its output power to the supply voltage. The first current value is determined by multiplying the supply current of a single power supply by the number of power supplies. A first copper busbar and a second copper busbar are provided on the backplate. One end of the first and second copper busbars is connected to the snap-fit ​​connector, and the other end of the first and second copper busbars is connected to the... The power connector on the back panel is connected in the following manner: the thickness of the first copper busbar and the second copper busbar ranges from 3mm to 4mm; the input end of the second copper busbar is connected to the output pin of the snap-fit ​​connector; the second copper busbar is located away from areas with dense signal lines; if the first copper busbar is located directly below the snap-fit ​​connector, the second copper busbar is arranged parallel to the right or left side of the snap-fit ​​connector with a spacing of ≥8mm; if the wiring around the snap-fit ​​connector is dense, the second copper busbar is arranged at the corresponding position on the bottom layer of the back panel and is connected to the snap-fit ​​connector through vias, wherein the diameter of the vias is ≥2mm and the number of vias is ≥4. The backplate has multiple heat dissipation holes in the current bottleneck area. The diameter of the heat dissipation holes ranges from 1mm to 3mm. The current bottleneck area includes at least one of the following: copper busbar welding point, interlayer connection point, and high current path intersection point. The distance between the copper busbar welding point of the second copper busbar and the heat dissipation hole is greater than or equal to 3mm. The contact area of ​​the internal copper sheet of the copper busbar connector is greater than or equal to a preset area threshold, and the preset area threshold is positively correlated with the current carrying capacity of the copper busbar connector. The copper busbar connector includes a positive copper busbar connector and a negative copper busbar connector, which are packaged together. The contact area of ​​the internal spring sheet of the snap connector is the same as the contact area of ​​the internal copper sheet of the copper busbar connector; A third snap-fit ​​connector is provided on the middle back panel and a third copper busbar connector is provided on the power distribution board. One end of the third snap-fit ​​connector is connected to the third copper busbar connector, and the other end of the third snap-fit ​​connector is connected to the power connector on the middle back panel. The current-carrying capacity of the snap-fit ​​connector is the same as that of the copper busbar connector.

2. The power supply system for a high-power server according to claim 1, characterized in that, The backplate is covered with a copper layer, the thickness of which ranges from 15oz to 17oz.

3. The power supply system for a high-power server according to claim 2, characterized in that, A first heat-conducting component is attached to the surface of the first copper busbar, and the first heat-conducting component is attached to the heat dissipation bracket of the chassis. The surface of the first copper busbar is attached to the bottom of the snap-fit ​​connector.

4. The power supply system for a high-power server according to claim 1, characterized in that, A second heat-conducting component is attached to the surface of the second copper busbar. The second heat-conducting component is attached to the chassis heat dissipation bracket and the distance between the second heat-conducting component and the chassis heat dissipation bracket is less than or equal to 1 mm. The thickness of the second heat-conducting component is 0.5 mm to 1 mm. The surface of the second copper busbar is attached to the bottom of the snap connector.

5. The power supply system for a high-power server according to claim 1, characterized in that, The surface of the copper busbar connector is coated with a heat dissipation coating, the thickness of which is 0.1mm-0.3mm.

6. The power supply system for a high-power server according to claim 1 or 5, characterized in that, The back of the mounting area of ​​the copper busbar connector has a hollowed-out pattern, the width of which ranges from 0.6mm to 1.0mm, and the spacing of which ranges from 0.8mm to 1.2mm.

7. The power supply system for a high-power server according to claim 1, characterized in that, The AC connector integrates a first sensor for collecting the input current of the AC connector.

8. The power supply system for a high-power server according to claim 7, characterized in that, The output end of the copper busbar connector integrates a second sensor for collecting the output voltage of the power distribution board.

9. The power supply system for a high-power server according to claim 8, characterized in that, The snap-fit ​​connector integrates a third sensor to collect the contact resistance of the snap-fit ​​connector's contact points, wherein the distance between the second copper busbar and the terminal block of the snap-fit ​​connector is greater than or equal to 3mm.

10. The power supply system for a high-power server according to claim 9, characterized in that, in, The backplate is equipped with a fourth sensor, a fifth sensor, and a sixth sensor. The fourth sensor is configured to correspond to the snap-fit ​​connector and is used to collect the first temperature value of the snap-fit ​​connector. The fifth sensor is configured to correspond to the first copper busbar and is used to collect the second temperature value of the first copper busbar. The sixth sensor is configured to correspond to the second copper busbar and is used to collect the third temperature value of the second copper busbar. The distance between the second copper busbar and the sixth sensor is greater than or equal to 5 mm. The power supply is equipped with a seventh sensor at the air outlet to collect the fourth temperature value at the air outlet.

11. The power supply system for a high-power server according to claim 10, characterized in that, Also includes: The warning module is used to provide an overcurrent warning when the input current of the AC connector is greater than a preset current, to provide a voltage abnormality warning when the output voltage of the power distribution board is greater than a first preset voltage threshold or less than a second preset voltage threshold, and to provide a poor contact warning when the contact resistance of the contact point of the snap connector is greater than or equal to a preset resistance threshold. The warning module is also used to issue an overheat warning when the first temperature value, the second temperature value, the third temperature value, and the fourth temperature value exceed the corresponding temperature threshold.

12. A high-power server, characterized in that, The power supply system for a high-power server as described in any one of claims 1-11.

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