LED integrated lamp panel array distribution design method and device and storage medium

Abstract

The invention discloses an LED integrated lamp panel array distribution design method and device and a storage medium, and the method comprises the steps: obtaining the target working power of an LED integrated lamp panel, and determining the total number of LED lamps based on the target working power; determining a target LED array scheme based on the total number of the LED lamps; obtaining a heat dissipation efficiency limit minimum gap and a breakdown voltage limit minimum gap of the LED integrated lamp panel; determining a horizontal gap and a vertical gap of the LED array according to the heat dissipation efficiency limit minimum gap and the breakdown voltage limit minimum gap; determining the overall structure parameters of the LED integrated lamp panel according to the horizontal gap, the vertical gap and the target LED array scheme; the LED integrated lamp panels are arranged in an array mode according to the horizontal gaps, the vertical gaps and the overall structure parameters of the LED integrated lamp panels, the gaps between the LEDs are designed by combining heat dissipation with limitation of breakdown voltage, the light emitting efficiency is effectively improved, and meanwhile the working stability of the LED integrated lamp panels is guaranteed.

Description

Technical Field

[0001] This application relates to the field of LED light board design technology, and in particular to LED integrated light board array distribution design methods, devices and storage media. Background Technology

[0002] To improve luminous efficiency, LED integrated light boards arrange LEDs as closely as possible. However, excessively small gaps between LEDs can cause two problems, making the LED integrated light board unable to operate stably: 1. Heat dissipation: If the LEDs are arranged too closely, the heat generated during operation exceeds the maximum heat dissipation efficiency of the substrate, creating a significant heat island effect that can lead to inefficient operation or even burnout of the LEDs. 2. Breakdown voltage: To ensure stable operation, LEDs are typically connected using a series-parallel S-circuit connection. This can create an excessively high voltage difference at one end. When this voltage difference exceeds the breakdown voltage of the LED's outer insulation layer, it can cause a short circuit, preventing normal operation.

[0003] In existing LED integrated light board designs, designers often rely on experience or trial and error to determine the spacing between LEDs. This method is not only inefficient but also makes it difficult to guarantee that the designed LED integrated light board has optimal luminous efficiency and stability. Furthermore, traditional LED integrated light board design methods often neglect the limitations imposed by heat dissipation and breakdown voltage on the spacing between LEDs, leading to problems such as heat island effects and short circuits in practical applications. Summary of the Invention

[0004] The main objective of this application is to provide a method, apparatus, and storage medium for the distribution design of LED integrated light board arrays, aiming to solve the technical problems of low efficiency in traditional LED integrated light board designs, which neglect the limitations of heat dissipation and breakdown voltage on the gaps between LEDs, leading to the easy occurrence of heat island effect and circuit short circuit.

[0005] To achieve the above objectives, this application proposes a method for designing the distribution of an LED integrated lamp board array, the method comprising: Obtain the target operating power of the LED integrated light board, and determine the total number of LEDs based on the target operating power; The target LED array scheme is determined based on the total number of LED lights, wherein the target LED array scheme includes the number of LED light rows and the number of LED light columns; Obtain the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage of the LED integrated lamp board; The horizontal and vertical gaps of the LED array are determined based on the minimum gap limit for heat dissipation efficiency and the minimum gap limit for breakdown voltage. The overall structural parameters of the LED integrated light board are determined based on the horizontal gap, the vertical gap, and the target LED array scheme. The LED integrated light panel array is arranged according to the horizontal gap, the vertical gap, and the overall structural parameters of the LED integrated light panel.

[0006] In one embodiment, obtaining the minimum clearance limiting the heat dissipation efficiency of the LED integrated lamp board includes: Obtain the unit heat transfer area, thermal conductivity, base plate thickness, base plate temperature difference, and heat generation of a single LED lamp of the LED integrated light board; The substrate thermal resistance of the LED lamp is determined based on the unit heat transfer area, the thermal conductivity, and the thickness of the base plate. The unit heat transfer is determined based on the thermal resistance of the substrate and the temperature difference of the base plate. The minimum gap for heat dissipation efficiency of the LED integrated light board is determined based on the unit heat transfer and the heat generation of the individual LED.

[0007] In one embodiment, obtaining the minimum gap for the breakdown voltage limit of the LED integrated lamp board includes: Obtain the voltage difference and breakdown distance of the target breakdown area, wherein the target breakdown area is the area corresponding to the two LEDs with the largest ratio of voltage difference to breakdown distance; The breakdown voltage is determined based on the breakdown distance and the dielectric strength of the insulator. The minimum gap for limiting the breakdown voltage is determined based on the breakdown voltage and the voltage difference.

[0008] In one embodiment, determining the horizontal and vertical gaps of the LED array based on the minimum gap limit for heat dissipation efficiency and the minimum gap limit for breakdown voltage includes: The minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage are compared to obtain the comparison result. If the comparison result shows that the minimum gap for heat dissipation efficiency is less than the minimum gap for breakdown voltage, the minimum gap for heat dissipation efficiency is used as the horizontal gap of the LED array and the minimum gap for breakdown voltage is used as the vertical gap of the LED array. If the comparison result shows that the minimum gap for heat dissipation efficiency is greater than the minimum gap for breakdown voltage, the minimum gap for heat dissipation efficiency shall be used as the horizontal and vertical gaps of the LED array.

[0009] In one embodiment, determining the overall structural parameters of the LED integrated light board based on the horizontal gap, the vertical gap, and the target LED array scheme includes: The number of LED rows and LED columns are determined based on the target LED array scheme. Get the length and height of a single LED; The minimum coverage area length and minimum coverage area height of the LED array are determined based on the horizontal gap, the vertical gap, the number of LED rows, the number of LED columns, and the length and height of a single LED. The minimum coverage area length and the minimum coverage area height of the LED array are used as the overall structural parameters of the LED integrated light panel.

[0010] In one embodiment, determining the minimum coverage area length and minimum coverage area height of the LED array based on the horizontal gap, the vertical gap, the number of LED rows, the number of LED columns, and the length and height of a single LED includes: When the horizontal gap is the minimum gap for heat dissipation efficiency and the vertical gap is the minimum gap for breakdown voltage, the minimum coverage area length of the LED array is determined based on the number of LED rows, the length of a single LED, and the minimum gap for heat dissipation efficiency, and the minimum coverage area height of the LED array is determined based on the number of LED rows, the number of LED columns, the height of a single LED, and the minimum gap for breakdown voltage. When both the horizontal gap and the vertical gap are the minimum gaps that limit heat dissipation efficiency, the minimum coverage area length of the LED array is determined based on the number of LED rows, the length of a single LED, and the minimum gaps that limit heat dissipation efficiency, and the minimum coverage area height of the LED array is determined based on the number of LED rows, the number of LED columns, the height of a single LED, and the minimum gaps that limit heat dissipation efficiency.

[0011] In one embodiment, determining the target LED array scheme based on the total number of LEDs includes: Multiple initial LED array schemes are determined based on the total number of LED lights. Each initial LED array scheme corresponds to a different combination of the number of LED rows and the number of LED columns. The ratio of the number of LED rows to the number of LED columns in each combination is less than or equal to a preset value. The initial LED array schemes are optimized based on the gray wolf optimization algorithm to obtain the optimal LED array scheme; The optimal LED array scheme is taken as the target LED array scheme.

[0012] In one embodiment, optimizing each of the initial LED array schemes based on the Grey Wolf optimization algorithm to obtain the optimal LED array scheme includes: Initialize a gray wolf population, wherein each gray wolf in the population represents an initial LED array scheme, and the position of the gray wolf is determined by the combination of the number of LED rows and the number of LED columns; Calculate the fitness value of each individual gray wolf in the gray wolf population, wherein the fitness value is determined based on the energy efficiency and illumination uniformity of the LED array; The gray wolf population is sorted according to the fitness value. The gray wolf with the highest fitness value is selected as the leader, the gray wolf with the second highest fitness value is selected as the second leader, and the gray wolf with the fitness value at the bottom of the preset proportion is selected as prey. The positions of all gray wolves in the gray wolf population except for the alpha, the second alpha, and the prey are updated to obtain the updated gray wolf population. Updating the positions of individual gray wolves includes moving them toward the alpha and the second alpha, and adjusting their movement speed and direction based on the position information of the alpha and the second alpha to gradually approach the optimal solution. The fitness values ​​of the updated gray wolf population were recalculated, and the gray wolf population was sorted and selected based on the new fitness values. Repeat the above process of updating the gray wolf population and recalculating the fitness value until the preset number of iterations is reached or the optimal solution in the gray wolf population converges. The LED array scheme represented by the gray wolf individual with the highest fitness value in the final iteration is selected as the optimal LED array scheme.

[0013] Furthermore, to achieve the above objectives, this application also proposes an LED integrated lamp panel array distribution design device, which includes: The acquisition module is used to acquire the target operating power of the LED integrated light board and determine the total number of LEDs based on the target operating power; The determining module is used to determine a target LED array scheme based on the total number of LED lights, wherein the target LED array scheme includes the number of LED light rows and the number of LED light columns; The acquisition module is also used to acquire the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage of the LED integrated lamp board. The determining module is further configured to determine the horizontal and vertical gaps of the LED array based on the minimum gap limit set by the heat dissipation efficiency and the minimum gap limit set by the breakdown voltage. The determining module is also used to determine the overall structural parameters of the LED integrated light board based on the horizontal gap, the vertical gap, and the target LED array scheme; The arrangement module is used to arrange the LED integrated light panel array according to the horizontal gap, the vertical gap, and the overall structural parameters of the LED integrated light panel.

[0014] In addition, to achieve the above objectives, this application also proposes an LED integrated lamp panel array distribution design device, the device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the LED integrated lamp panel array distribution design method as described above.

[0015] In addition, to achieve the above objectives, this application also proposes a storage medium, which is a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the steps of the LED integrated lamp board array distribution design method described above.

[0016] In addition, to achieve the above objectives, this application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the steps of the LED integrated lamp board array distribution design method described above.

[0017] This application proposes one or more technical solutions to obtain the target operating power of an LED integrated light board, determine the total number of LEDs based on the target operating power, determine a target LED array scheme based on the total number of LEDs, wherein the target LED array scheme includes the number of LED rows and the number of LED columns; obtain the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage of the LED integrated light board; determine the horizontal and vertical gaps of the LED array based on the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage; determine the overall structural parameters of the LED integrated light board based on the horizontal gap, the vertical gap, and the target LED array scheme; and arrange the LED integrated light board array based on the horizontal gap, the vertical gap, and the overall structural parameters of the LED integrated light board. Through the above methods, by combining the limitations of heat dissipation and breakdown voltage in the gap design between LEDs, the luminous efficiency is effectively improved, while ensuring the working stability of the LED integrated light board. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a flowchart illustrating an embodiment of the LED integrated lamp board array distribution design method of this application. Figure 2 This is a circuit diagram of an LED integrated lamp board provided in an embodiment of the LED integrated lamp board array distribution design method of this application; Figure 3 This is a flowchart illustrating Embodiment 2 of the LED integrated lamp board array distribution design method of this application; Figure 4 This is a schematic diagram of the module structure of the LED integrated lamp board array distribution design device according to an embodiment of this application; Figure 5 This is a schematic diagram of the hardware operating environment of the LED integrated lamp board array distribution design device in the embodiments of this application.

[0021] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0023] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0024] The main solution of this application embodiment is as follows: Obtain the target operating power of the LED integrated light board; determine the total number of LEDs based on the target operating power; determine a target LED array scheme based on the total number of LEDs, wherein the target LED array scheme includes the number of LED rows and the number of LED columns; obtain the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage of the LED integrated light board; determine the horizontal and vertical gaps of the LED array based on the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage; determine the overall structural parameters of the LED integrated light board based on the horizontal gap, the vertical gap, and the target LED array scheme; and arrange the LED integrated light board array based on the horizontal gap, the vertical gap, and the overall structural parameters of the LED integrated light board.

[0025] In existing LED integrated light board designs, designers often rely on experience or trial and error to determine the spacing between LEDs. This method is not only inefficient but also makes it difficult to guarantee that the designed LED integrated light board has optimal luminous efficiency and stability. Furthermore, traditional LED integrated light board design methods often neglect the limitations imposed by heat dissipation and breakdown voltage on the spacing between LEDs, leading to problems such as heat island effects and short circuits in practical applications.

[0026] This application provides a solution that effectively improves luminous efficiency while ensuring the operational stability of the LED integrated light board by combining heat dissipation and breakdown voltage limitations in the spacing design between LEDs.

[0027] It should be noted that the executing entity in this embodiment can be a computing service device with data processing, network communication, and program execution functions, such as a tablet computer, personal computer, or mobile phone, or an electronic device capable of performing the above functions, such as an LED integrated light panel array distribution design device. The following description uses an LED integrated light panel array distribution design device as an example to illustrate this embodiment and the subsequent embodiments.

[0028] Based on this, embodiments of this application provide a method for designing the distribution of an LED integrated lamp board array, referring to... Figure 1 , Figure 1 This is a flowchart illustrating the first embodiment of the LED integrated lamp board array distribution design method of this application.

[0029] In this embodiment, the LED integrated lamp board array distribution design method includes steps S10~S60: Step S10: Obtain the target operating power of the LED integrated light board, and determine the total number of LEDs based on the target operating power.

[0030] It should be noted that an LED integrated light panel is a lighting component composed of multiple LEDs arranged in an array. Its luminous efficiency and stability directly affect the lighting effect and lifespan. The target operating power of the LED integrated light panel is pre-designed, that is, the expected luminous power.

[0031] Understandably, if the expected operating power of the LED integrated light board is W watts, and the operating power of a single LED is w watts, then the total number of LEDs (N) is: Where N is the total number of LEDs, W is the operating power of the LED integrated light board, and w is the operating power of a single LED.

[0032] Step S20: Determine the target LED array scheme based on the total number of LEDs, wherein the target LED array scheme includes the number of LED rows and the number of LED columns.

[0033] It should be noted that LED integrated light panels arrange LEDs in a matrix format, and the number of rows and columns in the matrix directly determines the LED distribution density and lighting effect. After determining the total number of LEDs, a reasonable LED array scheme needs to be designed, that is, the number of rows and columns of LEDs needs to be determined to achieve the desired lighting effect.

[0034] It is understood that the target LED array scheme, i.e., the optimal LED array scheme, can be obtained through various algorithms and design methods. Different LED array schemes can be simulated and tested to select the optimal scheme that meets the requirements of luminous efficiency and stability. Alternatively, the Grey Wolf optimization algorithm can be used to optimize the initial LED array scheme to obtain the optimal combination of the number of LED rows and LED columns, which is also the optimal LED array scheme. This embodiment does not impose specific limitations on this.

[0035] In one feasible implementation, step S20 may include: determining multiple initial LED array schemes based on the total number of LEDs, wherein each initial LED array scheme corresponds to a different combination of the number of LED rows and the number of LED columns, and the ratio of the number of LED rows to the number of LED columns in each combination is less than or equal to a preset value; optimizing each initial LED array scheme based on the Grey Wolf optimization algorithm to obtain an optimal LED array scheme; and using the optimal LED array scheme as the target LED array scheme.

[0036] It should be noted that when the ratio of the number of LED rows to the number of columns is different, the LED array will present different shapes and bring different lighting effects. The relationship between the number of LED rows, the number of columns, and the total number of LEDs is as follows: Where N is the total number of LED lights, a is the number of LED light rows, and b is the number of LED light columns.

[0037] It is understood that the product of the number of LED rows and the number of LED columns equals the total number of LEDs. In the preliminary design stage, a ratio range can be preset, which defines the proportional relationship between the number of LED rows and the number of LED columns to ensure the uniformity of the LED array and the balance of the lighting effect. By generating multiple initial LED array schemes within this ratio range—that is, multiple combinations of different numbers of LED rows and LED columns—the optimal LED array scheme can be further selected. In this embodiment, the combinations of the number of LED rows and the number of LED columns are all less than or equal to a preset value, which can be 30. This embodiment does not initially impose specific limitations; however, it uses 30 as an example for illustration. That is, the number of LED rows a and the number of LED columns b satisfy: It is worth noting that after obtaining multiple initial LED array schemes, each initial scheme was further optimized based on the Grey Wolf Optimization Algorithm. The Grey Wolf Optimization Algorithm is an intelligent optimization algorithm that mimics the pack hunting behavior of grey wolves, possessing advantages such as fast convergence speed and strong global search capability. Using this algorithm, the optimal LED array scheme can be quickly found among multiple initial schemes, that is, the optimal combination of the number of LED rows and LED columns can be determined.

[0038] In its implementation, the optimization of each initial LED array scheme using the gray wolf optimization algorithm mainly involves the following steps: First, the gray wolf population is initialized by randomly generating a set of solutions, each corresponding to an initial LED array scheme. Then, the fitness value of each solution is calculated based on the objective function (e.g., luminous efficiency and stability index) to determine the leader (optimal solution), followers (suboptimal solution), and prey (solution to be optimized) in the gray wolf population. Next, the predation behavior of the gray wolf pack is simulated to update the position of the gray wolf population, i.e., adjusting the combination of the number of LED rows and columns to approximate the optimal solution. The above steps are repeated until the preset number of iterations or the fitness value converges, finally obtaining the optimal LED array scheme.

[0039] In one feasible implementation, the optimization of each initial LED array scheme based on the gray wolf optimization algorithm to obtain the optimal LED array scheme includes: initializing a gray wolf population, wherein each gray wolf in the population represents an initial LED array scheme, and the position of the gray wolf is determined by the combination of the number of LED rows and the number of LED columns; calculating the fitness value of each gray wolf in the population, wherein the fitness value is determined based on the energy efficiency and illumination uniformity of the LED array; sorting the gray wolf population according to the fitness value, selecting the gray wolf with the highest fitness value as the leader, selecting the gray wolf with the second highest fitness value as the second leader, and selecting the gray wolves with fitness values ​​at the bottom of a preset proportion as... The process involves updating the positions of all gray wolves in the wolf population except for the alpha, second-alpha, and prey, resulting in an updated wolf population. Updating the wolf positions includes: moving the wolves towards the alpha and second-alpha, adjusting their speed and direction based on their positions to gradually approach the optimal solution; recalculating the fitness values ​​of the updated wolf population; and sorting and selecting wolves based on the new fitness values; repeating this process of updating the wolf population and recalculating fitness values ​​until a predetermined number of iterations is reached or the optimal solution in the wolf population converges; and finally, selecting the LED array scheme represented by the wolf with the highest fitness value in the final iteration as the optimal LED array scheme.

[0040] It should be noted that the initial population size of the gray wolf population can be set according to the complexity of the actual problem and the limitations of computing resources. An excessively large population size will increase computation and prolong optimization time; an excessively small population size may reduce global search capability and lead to getting trapped in local optima. Therefore, choosing an appropriate population size is crucial to the performance of the gray wolf optimization algorithm.

[0041] Understandably, after initializing the gray wolf population, it is necessary to calculate the fitness value of each individual gray wolf. In this embodiment, the fitness value is determined based on the energy efficiency and illumination uniformity of the LED array. Energy efficiency reflects the luminous efficiency of the LED integrated light panel and is an important indicator for evaluating its performance; illumination uniformity determines the comfort and consistency of the lighting effect. By comprehensively considering these two factors, the advantages and disadvantages of the LED array scheme can be fully evaluated. The formula for calculating the fitness value is: in, Let be the fitness value of the i-th gray wolf individual. The energy efficiency of an array is typically expressed as the ratio of power consumption to light output. The uniformity of illumination can be represented by the variance or standard deviation of illumination intensity. and The shape of the function used to control the nonlinear activation of energy efficiency and the threshold of the energy efficiency value. and The shape and uniformity threshold of the function used to control the nonlinear activation of illumination uniformity. Let represent the position of the i-th individual in the gray wolf population, indicated by the row and column numbers of the LED array. This is the position of the current optimal solution. , , , , , Each item is assigned a weight to control its contribution to the fitness value.

[0042] After obtaining the fitness value of each individual gray wolf, the gray wolf population is sorted. The gray wolf with the highest fitness value is selected as the alpha, the gray wolf with the second highest fitness value is selected as the sub-alpha, and the gray wolves with fitness values ​​at the bottom of a predetermined proportion are selected as prey. The alpha and sub-alpha represent the optimal and second-best solutions in the current population. They will guide other gray wolves toward better outcomes. Prey represents the worst possible solution in the current population and needs to be eliminated by other gray wolves. Through this sorting and selection, the diversity and optimization direction of the gray wolf population can be maintained, avoiding getting trapped in local optima.

[0043] During the updating of the gray wolf population, the positions of individual wolves, except for the alpha, sub-alpha, and prey, are updated based on the position information of the alpha and sub-alpha. Specifically, these wolves will move towards the alpha and sub-alpha, adjusting their speed and direction according to their positions. Through this movement strategy, the gray wolf population can gradually approach the optimal solution, improving the performance of the LED array solution.

[0044] Repeat the process of updating the gray wolf population and recalculating fitness values ​​until the preset number of iterations is reached or the optimal solution in the gray wolf population converges. During the iteration process, the updated gray wolf population will get closer to the optimal solution with each update, until the optimal LED array scheme is finally found.

[0045] After selecting the LED array scheme represented by the gray wolf individual with the highest fitness value in the final iteration as the optimal LED array scheme, this scheme will be applied to the design of the LED integrated light board. This design method ensures that the LED integrated light board has optimal luminous efficiency and stability, meeting the needs of practical applications.

[0046] Step S30: Obtain the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage of the LED integrated lamp board.

[0047] It's important to note that the minimum gap for heat dissipation efficiency refers to the minimum distance between LEDs to ensure effective heat dissipation during LED integrated lighting board operation. This prevents the heat generated during operation from exceeding the maximum heat dissipation efficiency of the substrate, which could lead to a heat island effect and cause the LEDs to burn out due to inefficient operation. This distance is calculated based on theoretical calculations of heat conduction and convection to ensure that the heat generated during LED operation is dissipated in a timely manner, maintaining the normal operating temperature of the LED integrated lighting board. Simultaneously, the minimum gap for breakdown voltage refers to the minimum safe distance between LEDs to prevent breakdown due to excessive voltage. This distance is determined based on the breakdown voltage characteristics of the LEDs and circuit design requirements to ensure stable operation of the LED integrated lighting board under high-voltage environments, avoiding short circuits and damage. When designing LED integrated lighting boards, both heat dissipation efficiency and breakdown voltage limitations need to be considered comprehensively to determine a reasonable gap between LEDs, thereby ensuring both luminous efficiency and the operational stability and safety of the LED integrated lighting board.

[0048] In one feasible implementation, step S30, "obtaining the minimum gap for heat dissipation efficiency of the LED integrated lamp board," may include: obtaining the unit heat transfer area, thermal conductivity, base plate thickness, base plate temperature difference, and heat generation of a single LED lamp of the LED integrated lamp board; determining the substrate thermal resistance of the LED lamp based on the unit heat transfer area, the thermal conductivity, and the base plate thickness; determining the unit heat transfer based on the substrate thermal resistance and the base plate temperature difference; and determining the minimum gap for heat dissipation efficiency of the LED integrated lamp board based on the unit heat transfer and the heat generation of a single LED lamp.

[0049] It should be noted that if the heat generation efficiency of the LED exceeds the maximum heat dissipation efficiency of the base plate, a significant heat island effect will be formed, causing the LED to burn out due to inefficiency. Therefore, when the heat generation efficiency of the LED is less than or equal to the maximum heat dissipation efficiency of the base plate, damage to the LED due to overheating can be prevented. Based on the relationship between the two, the gap range between the LEDs can be determined, thereby determining the minimum gap limit for heat dissipation efficiency.

[0050] Understandably, determining the minimum clearance for heat dissipation efficiency requires comprehensive consideration of factors such as the unit heat transfer area of ​​the LED integrated light board, thermal conductivity, substrate thickness, substrate temperature difference, and the heat generation of a single LED. Through precise calculation and analysis, the minimum safe distance between LEDs, i.e., the minimum clearance for heat dissipation efficiency, can be determined while ensuring effective heat dissipation of the LED integrated light board. Setting this clearance is crucial for the long-term stable operation of the LED integrated light board, effectively preventing LED damage and reduced efficiency due to overheating.

[0051] It is worth noting that because the LED substrate is an isotropic medium, its thermal conductivity in all directions is... The same applies. Therefore, the unit area is set as the minimum gap away from the short edge of the LED to limit heat dissipation efficiency. The area covered, or the unit heat transfer area. unit heat transfer area The calculation formula is: in, This refers to the unit heat transfer area of ​​the LED integrated light panel. The length of a single LED light, The height of a single LED light, Minimum clearance is required to ensure efficient heat dissipation.

[0052] When the LED light operates in a stable state where the heat transferred from the LED light to the base plate is dynamically balanced with the stable heat dissipation per unit area of ​​the base plate, the LED light and the base plate can be considered as a single, highly conductive heat-conducting sheet. In this state, the heat generated by a single LED light is: in, I represents the heat generated by a single LED, I represents the current, and R represents the resistance.

[0053] The thermal resistance of the LED lamp substrate ( )for: in, d represents the thermal resistance of the LED light substrate, and d represents the substrate thickness. For thermal conductivity, This refers to the unit heat transfer area of ​​the LED integrated light panel.

[0054] Therefore, the heat transfer per unit area is: in, For unit heat transfer, The temperature difference between the upper and lower surfaces of the base plate is related to the overall heat dissipation structure. The thermal resistance of the LED lamp substrate.

[0055] It is worth noting that, for an LED to operate stably without continuously accumulating heat, the heat generated by the LED must be less than or equal to the heat dissipated per unit area, i.e.: That is: The minimum gap limiting heat dissipation efficiency can be determined using the above formula. .

[0056] In one feasible implementation, step S30, "obtaining the minimum gap for the breakdown voltage limit of the LED integrated light board," may include: obtaining the voltage difference and breakdown distance of the target breakdown region, wherein the target breakdown region is the region corresponding to the two LEDs with the largest ratio of voltage difference to breakdown distance; determining the breakdown voltage based on the breakdown distance and the dielectric strength of the insulator; and determining the minimum gap for the breakdown voltage limit based on the breakdown voltage and the voltage difference.

[0057] It should be noted that in this embodiment, the LEDs are also connected using an S-loop series-parallel connection to ensure circuit stability and safety. Simultaneously, the heat dissipation structure allows airflow within the heat sink fins, improving heat dissipation efficiency. The minimum clearance for breakdown voltage is set to prevent breakdown between LEDs under high voltage conditions, which could lead to short circuits and damage. Therefore, when determining the minimum clearance for breakdown voltage, factors such as the voltage difference of the target breakdown area, the breakdown distance, and the dielectric strength of the insulator must be considered. Through precise calculation and analysis, the minimum safe distance between LEDs, i.e., the minimum clearance for breakdown voltage, can be determined while ensuring circuit safety. Setting this clearance is crucial for the stable operation of the LED integrated light board under high voltage conditions, effectively preventing circuit failures and damage caused by breakdown.

[0058] It is understandable that the target breakdown area is the area most susceptible to voltage breakdown, where the ratio of voltage difference to breakdown distance is the largest, and the breakdown distance is the distance between the corresponding two LEDs. For example... Figure 2 As shown, Figure 2 This is a circuit diagram of an LED integrated light board. In the LED integrated light board, LEDs are connected in series and parallel using an S-loop. The area between A and B in the diagram is the area most susceptible to voltage breakdown. A and B are the LEDs with the largest ratio of voltage difference to breakdown distance. The breakdown distance is the distance between A and B.

[0059] Voltage difference in the area most susceptible to voltage breakdown for: in, Where 'a' represents the voltage difference and 'a' represents the number of LED rows. This refers to the operating voltage of a single LED.

[0060] Penetration distance ( )for: in, For penetration distance, The height of a single LED light, Minimum gap is limited to the breakdown voltage.

[0061] Because the breakdown voltage of the insulator satisfies: in, This is the breakdown voltage of the insulator. The dielectric strength of an insulator. This refers to the penetration distance.

[0062] Therefore, for an LED to operate stably, i.e., for the dielectric to not break down, the breakdown voltage must be greater than or equal to the voltage difference at that point. Right now: Therefore, the minimum gap for limiting breakdown voltage can be determined. for: It's worth noting that after determining the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage, a reasonable gap range between LEDs can be determined based on these two limitations and the overall design requirements of the LED integrated light board. This gap range must be set to ensure both luminous efficiency and the operational stability and safety of the LED integrated light board. By setting a reasonable gap, the performance of the LED integrated light board can be optimized, improving its luminous efficiency and stability.

[0063] Step S40: Determine the horizontal and vertical gaps of the LED array based on the minimum gap limit for heat dissipation efficiency and the minimum gap limit for breakdown voltage.

[0064] It should be noted that the breakdown voltage factor limits the minimum clearance in the vertical direction, while the heat dissipation factor affects the minimum clearance in both the horizontal and vertical directions. Therefore, the minimum clearance needs to be limited based on the heat dissipation efficiency. Breakdown voltage limit minimum gap Only by knowing the specific size relationship can the minimum gap in the horizontal and vertical directions be determined.

[0065] In one feasible implementation, step S40 may include: comparing the minimum gap for heat dissipation efficiency limitation and the minimum gap for breakdown voltage limitation to obtain a comparison result; if the comparison result is that the minimum gap for heat dissipation efficiency limitation is less than the minimum gap for breakdown voltage limitation, using the minimum gap for heat dissipation efficiency limitation as the horizontal gap of the LED array and the minimum gap for breakdown voltage limitation as the vertical gap of the LED array; if the comparison result is that the minimum gap for heat dissipation efficiency limitation is greater than the minimum gap for breakdown voltage limitation, using the minimum gap for heat dissipation efficiency limitation as both the horizontal and vertical gaps of the LED array.

[0066] It should be noted that when the minimum gap for heat dissipation efficiency is less than the minimum gap for breakdown voltage, that is... At this point, heat dissipation becomes the dominant factor determining the spacing between LED arrays. Since heat dissipation primarily affects the horizontal (left-right) and vertical (up-down) LED spacing, the minimum gap size is determined by optimizing heat dissipation efficiency. As the horizontal gap of the LED array, i.e., the minimum gap in the horizontal direction, it ensures that the LEDs do not suffer from poor heat dissipation due to excessively small spacing in the horizontal direction. Simultaneously, it limits the breakdown voltage to the minimum gap. As the vertical gap of the LED array, that is, the minimum gap in the vertical direction, it can ensure that even if there is a high voltage difference in the vertical direction, there will be no breakdown due to the gap being too small, thus ensuring the safety of the circuit.

[0067] It is understandable that when the minimum gap for heat dissipation efficiency is greater than the minimum gap for breakdown voltage, that is... At this point, both heat dissipation and breakdown voltage factors influence the setting of the LED array gap size. The minimum gap size is limited by heat dissipation efficiency. Numerically greater than the minimum gap limiting the breakdown voltage This means that when setting the gap between LED arrays, both heat dissipation and breakdown voltage must be considered to ensure the operational stability and safety of the integrated LED board. Therefore, in this case, it is possible to choose to limit the gap to a minimum to maximize heat dissipation efficiency. The minimum horizontal and vertical gaps of the LED array are both set to [value]. This design ensures effective heat dissipation for the LED lights while preventing breakdown due to excessive voltage differences in the vertical direction, thus comprehensively improving the performance and stability of the LED integrated light board. By setting appropriate gaps, the luminous efficiency and stability of the LED integrated light board can be further optimized to meet the needs of various application scenarios.

[0068] Step S50: Determine the overall structural parameters of the LED integrated light board based on the horizontal gap, the vertical gap, and the target LED array scheme.

[0069] It should be noted that the overall structural parameters of the LED integrated light panel include the length and height of the minimum coverage area of ​​the LED array.

[0070] Understandably, after determining the horizontal and vertical gaps, the minimum coverage area of ​​the LED integrated light panel can be determined based on these gap values ​​and the target LED array scheme, i.e., the number of rows and columns of LEDs. The length and height of this minimum coverage area will directly affect the size and shape of the LED integrated light panel. Furthermore, based on these structural parameters, the specific arrangement of the LEDs can be further refined, including the distance and angle between lights, to ensure that the overall luminous efficacy and heat dissipation performance of the LED integrated light panel reach their optimal state.

[0071] Step S60: Arrange the LED integrated light panel array according to the horizontal gap, the vertical gap, and the overall structural parameters of the LED integrated light panel.

[0072] It should be noted that after determining the horizontal and vertical gaps and the overall structural parameters of the LED integrated light board, the array layout design of the LED integrated light board can be carried out based on these two gap values. During layout, it is necessary to ensure that the distance between each LED and its adjacent LEDs meets the determined minimum gap requirements, while also satisfying the minimum coverage area of ​​the LED array, to ensure the uniformity of light emission and heat dissipation efficiency of the entire LED integrated light board.

[0073] Understandably, during the layout process, the connection methods and circuit layout between LEDs must also be considered to ensure circuit stability and safety. A reasonable array arrangement can optimize the luminous efficiency, heat dissipation, and stability of the LED integrated light board, meeting the needs of various application scenarios. Simultaneously, the rationality of the array arrangement directly affects the manufacturing cost and production efficiency of the LED integrated light board. Therefore, multiple factors need to be comprehensively considered during array arrangement to ensure that the final designed LED integrated light board has excellent performance and cost-effectiveness. During the layout process, advanced layout software and algorithms can be used to simulate and optimize the arrangement of LEDs to achieve the best luminous effect and heat dissipation performance. For example, intelligent layout algorithms can automatically calculate and adjust the position and spacing of LEDs to ensure that the determined minimum gap requirements are met, while optimizing luminous effect and heat dissipation performance. During simulation, factors such as the luminous characteristics of LEDs, heat dissipation requirements, and circuit layout can be fully considered. By continuously adjusting and optimizing the arrangement of LEDs, the luminous uniformity, heat dissipation efficiency, and circuit stability of the entire LED integrated light board can be optimized.

[0074] This embodiment provides a method for designing the distribution of an LED integrated light panel array. The method involves obtaining the target operating power of the LED integrated light panel, determining the total number of LEDs based on the target operating power, determining a target LED array scheme based on the total number of LEDs (including the number of LED rows and columns), obtaining the minimum gap required for heat dissipation efficiency and the minimum gap required for breakdown voltage of the LED integrated light panel, determining the horizontal and vertical gaps of the LED array based on these minimum gaps, the overall structural parameters of the LED integrated light panel based on the horizontal and vertical gaps and the target LED array scheme, and arranging the LED integrated light panel array according to the horizontal and vertical gaps and the overall structural parameters of the LED integrated light panel. By combining the limitations of heat dissipation and breakdown voltage in the gap design between LEDs, the luminous efficiency is effectively improved while ensuring the operational stability of the LED integrated light panel.

[0075] Based on the first embodiment of this application, in the second embodiment of this application, the content that is the same as or similar to that in the first embodiment described above can be referred to the above description, and will not be repeated hereafter. Based on this, please refer to... Figure 3 Step S50 includes steps S501 to S504: Step S501: Determine the number of LED rows and the number of LED columns according to the target LED array scheme.

[0076] It should be noted that once the target LED array scheme is determined, the required number of rows (a) and columns (b) of LEDs are also determined. Different numbers of rows and columns will directly affect the luminous effect and heat dissipation performance of the LED integrated light board.

[0077] Understandably, after determining the number of rows 'a' and the number of columns 'b', the specific arrangement of the LED lights can be further refined, including the distance and angle between the lights, thereby further determining the overall structural parameters of the LED integrated light board.

[0078] Step S502: Obtain the length and height of a single LED.

[0079] It should be noted that when obtaining the length of a single LED... l After determining the height h, these parameters will be used to calculate the minimum coverage area of ​​the LED integrated light panel. (Length) l The dimensions of an LED typically refer to its horizontal dimensions, while the height (h) refers to its vertical dimensions. Understanding the dimensions of individual LEDs is crucial for determining the layout of the entire LED integrated light panel, as it directly affects the distance between lights, the compactness of the array, and the final luminous effect.

[0080] Step S503: Determine the minimum coverage area length and minimum coverage area height of the LED array based on the horizontal gap, the vertical gap, the number of LED rows, the number of LED columns, and the length and height of a single LED.

[0081] It should be noted that the calculation method for the minimum coverage area length of the LED array ensures that the LEDs will not suffer from poor heat dissipation in the horizontal direction due to excessively small spacing, while also guaranteeing the compact layout and luminous effect of the LED integrated light board in the horizontal direction. The calculation method for the minimum coverage area height of the LED array ensures that the LEDs will not experience breakdown in the vertical direction due to excessively small spacing, while also guaranteeing the rational layout and circuit safety of the LED integrated light board in the vertical direction.

[0082] Understandably, the minimum coverage area length of an LED array depends on the number of LED rows, the length of individual LEDs, and the minimum gap required for heat dissipation efficiency, while the minimum coverage area height of an LED array is determined by the minimum gap required for heat dissipation efficiency. Breakdown voltage limit minimum gap The specific size relationship, the number of LED light rows, and the height of each LED are used to determine the size.

[0083] In one feasible implementation, step S503 may include steps A11-A12: Step A11: When the horizontal gap is the minimum gap for heat dissipation efficiency and the vertical gap is the minimum gap for breakdown voltage, determine the minimum coverage area length of the LED array based on the number of LED rows, the length of a single LED, and the minimum gap for heat dissipation efficiency, and determine the minimum coverage area height of the LED array based on the number of LED rows, the number of LED columns, the height of a single LED, and the minimum gap for breakdown voltage.

[0084] It should be noted that, in this embodiment, the horizontal gap is the minimum gap required to limit heat dissipation efficiency. The vertical gap is the minimum gap for limiting breakdown voltage. , that is The minimum horizontal gap is The minimum vertical gap is .

[0085] Minimum coverage area length of LED array (L): Where 'a' represents the number of LED light rows. The length of a single LED Minimum clearance is required to ensure efficient heat dissipation.

[0086] This formula ensures that when LEDs are arranged horizontally, the minimum gap between adjacent LEDs is the minimum gap required for heat dissipation efficiency. This ensures the heat dissipation performance and luminous effect of the LED integrated light panel in the horizontal direction. Meanwhile, considering the length of the LEDs themselves, the minimum horizontal coverage length of the entire LED array can be obtained by summing the length of each row of LEDs and the gaps between them.

[0087] Minimum coverage area height of LED array (H): Where b is the number of LED arrays, and h is the height of a single LED. Minimum gap is limited to the breakdown voltage.

[0088] This formula ensures that when LEDs are arranged vertically, the minimum gap between adjacent LEDs is equal to the minimum gap limited by the breakdown voltage. This ensures the circuit safety and luminous effect of the LED integrated light board in the vertical direction. Similarly, considering the height of the LEDs themselves, the minimum vertical coverage height of the entire LED array can be obtained by summing the height of each row of LEDs and the gaps between them.

[0089] Step A12: When both the horizontal gap and the vertical gap are the minimum gaps that limit heat dissipation efficiency, determine the minimum coverage area length of the LED array based on the number of LED rows, the length of a single LED, and the minimum gaps that limit heat dissipation efficiency, and determine the minimum coverage area height of the LED array based on the number of LED rows, the number of LED columns, the height of a single LED, and the minimum gaps that limit heat dissipation efficiency.

[0090] It should be noted that, in this embodiment, both the horizontal and vertical gaps are the minimum gaps required to limit heat dissipation efficiency. , that is The minimum horizontal gap is The minimum vertical gap is .

[0091] Minimum coverage area length of LED array (L): Where 'a' represents the number of LED light rows. The length of a single LED Minimum clearance is required to ensure efficient heat dissipation.

[0092] Minimum coverage area height of LED array (H): Where b is the number of LED arrays, and h is the height of a single LED. Minimum clearance is required to ensure efficient heat dissipation.

[0093] This formula ensures that when LEDs are arranged horizontally and vertically, the minimum gap between adjacent LEDs is the minimum gap limited by heat dissipation efficiency. This design approach is suitable for scenarios where the minimum gap for heat dissipation efficiency is greater than the minimum gap for breakdown voltage. By unifying the gap size in both the horizontal and vertical directions, the overall size of the LED integrated light board can be minimized while ensuring heat dissipation performance, thus improving the compactness of the layout.

[0094] It is worth noting that when determining the minimum coverage area length and height, the size and number of the LED lights themselves still need to be considered to ensure the luminous effect and circuit safety of the entire LED array.

[0095] Step S504: Use the minimum coverage area length and minimum coverage area height of the LED array as the overall structural parameters of the LED integrated light board.

[0096] It should be noted that the minimum coverage area length and height of the LED array are key components of the overall structural parameters of the LED integrated light board, directly determining its size and layout. By incorporating these two parameters into the overall structural parameters, it is possible to ensure that the LED integrated light board achieves optimal luminous efficacy and circuit layout while meeting heat dissipation and breakdown voltage limitations.

[0097] Understandably, after determining the overall structural parameters of the LED integrated light board, the array arrangement of the LED integrated light board can be further carried out. Based on the determined horizontal and vertical gaps, as well as the number of rows and columns of LEDs, the LEDs are arranged on the LED integrated light board according to a predetermined pattern. This arrangement not only ensures reasonable spacing between LEDs but also ensures the uniformity of light emission and heat dissipation performance of the entire LED integrated light board. Finally, by comprehensively considering heat dissipation efficiency, breakdown voltage limits, and the specific size and number of LEDs, a highly efficient, stable, and compact LED integrated light board array distribution scheme is designed.

[0098] In this embodiment, by considering the specific size relationship between the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage, as well as the number of rows and columns of LEDs, the overall structural parameters of the LED integrated light board are determined. This not only ensures that the spacing of the LEDs in the horizontal and vertical directions is reasonable, but also takes into account heat dissipation performance and circuit safety, thereby achieving a high-efficiency, stable and compact layout of the LED integrated light board.

[0099] It should be noted that the above examples are only for understanding this application and do not constitute a limitation on the LED integrated lamp board array distribution design method of this application. Any simple modifications based on this technical concept are within the protection scope of this application.

[0100] This application also provides an LED integrated lamp board array distribution design device, please refer to... Figure 4 The LED integrated lamp panel array distribution design device includes: The acquisition module 10 is used to acquire the target operating power of the LED integrated light board and determine the total number of LEDs based on the target operating power.

[0101] The determining module 20 is used to determine a target LED array scheme based on the total number of LED lights, wherein the target LED array scheme includes the number of LED light rows and the number of LED light columns.

[0102] The acquisition module 10 is also used to acquire the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage of the LED integrated lamp board.

[0103] The determining module 20 is further configured to determine the horizontal and vertical gaps of the LED array based on the minimum gap limit of heat dissipation efficiency and the minimum gap limit of breakdown voltage.

[0104] The determining module 20 is also used to determine the overall structural parameters of the LED integrated light board based on the horizontal gap, the vertical gap and the target LED array scheme.

[0105] The arrangement module 30 is used to arrange the LED integrated light panel array according to the horizontal gap, the vertical gap and the overall structural parameters of the LED integrated light panel.

[0106] The LED integrated lamp board array distribution design device provided in this application, employing the LED integrated lamp board array distribution design method in the above embodiments, can solve the technical problems of low efficiency in traditional LED integrated lamp board designs and the neglect of heat dissipation and breakdown voltage limitations on the gaps between LEDs, leading to heat island effects and circuit short circuits. Compared with the prior art, the beneficial effects of the LED integrated lamp board array distribution design device provided in this application are the same as those of the LED integrated lamp board array distribution design method provided in the above embodiments, and other technical features in the LED integrated lamp board array distribution design device are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0107] This application provides an LED integrated light panel array distribution design device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the LED integrated light panel array distribution design method in the above embodiment 1.

[0108] The following is for reference. Figure 5 This document illustrates a structural schematic diagram of an LED integrated light panel array distribution design device suitable for implementing embodiments of this application. The LED integrated light panel array distribution design device in this application embodiment may include, but is not limited to, mobile terminals such as mobile phones, laptops, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Description), PMPs (Portable Media Players), and in-vehicle terminals (e.g., in-vehicle navigation terminals), as well as fixed terminals such as digital TVs and desktop computers. Figure 5 The LED integrated light panel array distribution design device shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0109] like Figure 5As shown, the LED integrated lamp panel array distribution design device may include a processing unit 1001 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to the program stored in ROM (Read Only Memory) 1002 or the program loaded from storage device 1003 into RAM (Random Access Memory) 1004. RAM 1004 also stores various programs and data required for the operation of the LED integrated lamp panel array distribution design device. The processing unit 1001, ROM 1002, and RAM 1004 are interconnected via bus 1005. Input / output (I / O) interface 1006 is also connected to the bus. Typically, the following systems can be connected to I / O interface 1006: input devices 1007 including, for example, touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices 1008 including, for example, LCDs (Liquid Crystal Displays), speakers, vibrators, etc.; storage devices 1003 including, for example, magnetic tapes, hard disks, etc.; and communication devices 1009. Communication device 1009 allows the LED integrated light panel array distribution design device to communicate wirelessly or wiredly with other devices to exchange data. Although the figure shows an LED integrated light panel array distribution design device with various systems, it should be understood that it is not required to implement or have all the systems shown. More or fewer systems can be implemented alternatively.

[0110] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from ROM 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0111] The LED integrated lamp board array distribution design device provided in this application, employing the LED integrated lamp board array distribution design method described in the above embodiments, can solve the technical problems of low efficiency in traditional LED integrated lamp board designs and the neglect of heat dissipation and breakdown voltage limitations on the gaps between LEDs, leading to heat island effects and short circuits. Compared with the prior art, the beneficial effects of the LED integrated lamp board array distribution design device provided in this application are the same as those of the LED integrated lamp board array distribution design method provided in the above embodiments, and other technical features in this LED integrated lamp board array distribution design device are the same as those disclosed in the previous embodiment method, and will not be repeated here.

[0112] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0113] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0114] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, which are used to execute the LED integrated lamp board array distribution design method in the above embodiments.

[0115] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, RAM (Random Access Memory), ROM (Read Only Memory), EPROM (Erasable Programmable Read Only Memory or Flash Memory), optical fibers, CD-ROM (CD-Read Only Memory), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0116] The aforementioned computer-readable storage medium may be included in the LED integrated lamp panel array distribution design equipment; or it may exist independently and not be assembled into the LED integrated lamp panel array distribution design equipment.

[0117] The aforementioned computer-readable storage medium carries one or more programs. When these programs are executed by the LED integrated lamp board array distribution design device, the LED integrated lamp board array distribution design device causes the following: it acquires the target operating power of the LED integrated lamp board and determines the total number of LEDs based on the target operating power; it determines a target LED array scheme based on the total number of LEDs, wherein the target LED array scheme includes the number of LED rows and the number of LED columns; it acquires the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage of the LED integrated lamp board; it determines the horizontal and vertical gaps of the LED array based on the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage; it determines the overall structural parameters of the LED integrated lamp board based on the horizontal gap, the vertical gap, and the target LED array scheme; and it arranges the LED integrated lamp board array based on the horizontal gap, the vertical gap, and the overall structural parameters of the LED integrated lamp board.

[0118] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including LAN (Local Area Network) or WAN (Wide Area Network)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0119] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0120] The modules described in the embodiments of this application can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0121] The readable storage medium provided in this application is a computer-readable storage medium that stores computer-readable program instructions (i.e., a computer program) for executing the above-described LED integrated lamp board array distribution design method. This solves the technical problems of low efficiency in traditional LED integrated lamp board designs, which neglect the limitations imposed by heat dissipation and breakdown voltage on the gaps between LEDs, leading to heat island effects and short circuits. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the LED integrated lamp board array distribution design method provided in the above embodiments, and will not be repeated here.

[0122] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the LED integrated lamp board array distribution design method described above.

[0123] The computer program product provided in this application can solve the technical problems of low efficiency in traditional LED integrated light board designs, which neglect the limitations of heat dissipation and breakdown voltage on the gaps between LEDs, leading to heat island effects and short circuits. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as those of the LED integrated light board array distribution design method provided in the above embodiments, and will not be repeated here.

[0124] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A method for designing the distribution of an LED integrated lamp board array, characterized in that, The method includes: Obtain the target operating power of the LED integrated light board, and determine the total number of LEDs based on the target operating power; The target LED array scheme is determined based on the total number of LED lights, wherein the target LED array scheme includes the number of LED light rows and the number of LED light columns; Obtain the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage of the LED integrated lamp board; The horizontal and vertical gaps of the LED array are determined based on the minimum gap limit for heat dissipation efficiency and the minimum gap limit for breakdown voltage. The overall structural parameters of the LED integrated light board are determined based on the horizontal gap, the vertical gap, and the target LED array scheme. The LED integrated light panel array is arranged according to the horizontal gap, the vertical gap, and the overall structural parameters of the LED integrated light panel.

2. The method as described in claim 1, characterized in that, The step of obtaining the minimum gap limiting the heat dissipation efficiency of the LED integrated lamp board includes: Obtain the unit heat transfer area, thermal conductivity, base plate thickness, base plate temperature difference, and heat generation of a single LED lamp of the LED integrated light board; The substrate thermal resistance of the LED lamp is determined based on the unit heat transfer area, the thermal conductivity, and the thickness of the base plate. The unit heat transfer is determined based on the thermal resistance of the substrate and the temperature difference of the base plate. The minimum gap for heat dissipation efficiency of the LED integrated light board is determined based on the unit heat transfer and the heat generation of the individual LED.

3. The method as described in claim 1, characterized in that, The step of obtaining the minimum gap for the breakdown voltage limit of the LED integrated lamp board includes: Obtain the voltage difference and breakdown distance of the target breakdown area, wherein the target breakdown area is the area corresponding to the two LEDs with the largest ratio of voltage difference to breakdown distance; The breakdown voltage is determined based on the breakdown distance and the dielectric strength of the insulator. The minimum gap for limiting the breakdown voltage is determined based on the breakdown voltage and the voltage difference.

4. The method as described in claim 1, characterized in that, The determination of the horizontal and vertical gaps of the LED array based on the minimum gap limit for heat dissipation efficiency and the minimum gap limit for breakdown voltage includes: The minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage are compared to obtain the comparison result. If the comparison result shows that the minimum gap for heat dissipation efficiency is less than the minimum gap for breakdown voltage, the minimum gap for heat dissipation efficiency is used as the horizontal gap of the LED array and the minimum gap for breakdown voltage is used as the vertical gap of the LED array. If the comparison result shows that the minimum gap for heat dissipation efficiency is greater than the minimum gap for breakdown voltage, the minimum gap for heat dissipation efficiency shall be used as the horizontal and vertical gaps of the LED array.

5. The method as described in claim 1, characterized in that, The process of determining the overall structural parameters of the LED integrated light board based on the horizontal gap, the vertical gap, and the target LED array scheme includes: The number of LED rows and LED columns are determined based on the target LED array scheme. Get the length and height of a single LED; The minimum coverage area length and minimum coverage area height of the LED array are determined based on the horizontal gap, the vertical gap, the number of LED rows, the number of LED columns, and the length and height of a single LED. The minimum coverage area length and the minimum coverage area height of the LED array are used as the overall structural parameters of the LED integrated light panel.

6. The method as described in claim 5, characterized in that, The determination of the minimum coverage area length and minimum coverage area height of the LED array based on the horizontal gap, the vertical gap, the number of LED rows, the number of LED columns, and the length and height of a single LED includes: When the horizontal gap is the minimum gap for heat dissipation efficiency and the vertical gap is the minimum gap for breakdown voltage, the minimum coverage area length of the LED array is determined based on the number of LED rows, the length of a single LED, and the minimum gap for heat dissipation efficiency, and the minimum coverage area height of the LED array is determined based on the number of LED rows, the number of LED columns, the height of a single LED, and the minimum gap for breakdown voltage. When both the horizontal gap and the vertical gap are the minimum gaps that limit heat dissipation efficiency, the minimum coverage area length of the LED array is determined based on the number of LED rows, the length of a single LED, and the minimum gaps that limit heat dissipation efficiency, and the minimum coverage area height of the LED array is determined based on the number of LED rows, the number of LED columns, the height of a single LED, and the minimum gaps that limit heat dissipation efficiency.

7. The method as described in claim 1, characterized in that, The determination of the target LED array scheme based on the total number of LEDs includes: Multiple initial LED array schemes are determined based on the total number of LED lights. Each initial LED array scheme corresponds to a different combination of the number of LED rows and the number of LED columns. The ratio of the number of LED rows to the number of LED columns in each combination is less than or equal to a preset value. The initial LED array schemes are optimized based on the gray wolf optimization algorithm to obtain the optimal LED array scheme; The optimal LED array scheme is taken as the target LED array scheme.

8. The method as described in claim 7, characterized in that, The optimization of each initial LED array scheme based on the gray wolf optimization algorithm to obtain the optimal LED array scheme includes: Initialize a gray wolf population, wherein each gray wolf in the population represents an initial LED array scheme, and the position of the gray wolf is determined by the combination of the number of LED rows and the number of LED columns; Calculate the fitness value of each individual gray wolf in the gray wolf population, wherein the fitness value is determined based on the energy efficiency and illumination uniformity of the LED array; The gray wolf population is sorted according to the fitness value. The gray wolf with the highest fitness value is selected as the leader, the gray wolf with the second highest fitness value is selected as the second leader, and the gray wolf with the fitness value at the bottom of the preset proportion is selected as prey. The positions of all gray wolves in the gray wolf population except for the alpha, the second alpha, and the prey are updated to obtain the updated gray wolf population. Updating the positions of individual gray wolves includes moving them toward the alpha and the second alpha, and adjusting their movement speed and direction based on the position information of the alpha and the second alpha to gradually approach the optimal solution. The fitness values ​​of the updated gray wolf population were recalculated, and the gray wolf population was sorted and selected based on the new fitness values. Repeat the above process of updating the gray wolf population and recalculating the fitness value until the preset number of iterations is reached or the optimal solution in the gray wolf population converges. The LED array scheme represented by the gray wolf individual with the highest fitness value in the final iteration is selected as the optimal LED array scheme.

9. A device for designing the distribution of an LED integrated lamp panel array, characterized in that, The LED integrated lamp panel array distribution design device includes: The acquisition module is used to acquire the target operating power of the LED integrated light board and determine the total number of LEDs based on the target operating power; The determining module is used to determine a target LED array scheme based on the total number of LED lights, wherein the target LED array scheme includes the number of LED light rows and the number of LED light columns; The acquisition module is also used to acquire the minimum gap for heat dissipation efficiency and the minimum gap for breakdown voltage of the LED integrated lamp board. The determining module is further configured to determine the horizontal and vertical gaps of the LED array based on the minimum gap limit set by the heat dissipation efficiency and the minimum gap limit set by the breakdown voltage. The determining module is also used to determine the overall structural parameters of the LED integrated light board based on the horizontal gap, the vertical gap, and the target LED array scheme; The arrangement module is used to arrange the LED integrated light panel array according to the horizontal gap, the vertical gap, and the overall structural parameters of the LED integrated light panel.

10. A storage medium, characterized in that, The storage medium stores an LED integrated lamp board array distribution design program, which, when executed by a processor, implements the LED integrated lamp board array distribution design method as described in any one of claims 1 to 8.

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