A new energy vehicle-mounted circuit board and a preparation method thereof

Abstract

The present application relates to the technical field of circuit board structure, especially to a new energy vehicle-mounted circuit board and a preparation method thereof, comprising a top plate, a base plate, two limiting frames, a multilayer circuit board mechanism and symmetrically distributed heat dissipation fin plates. The core lies in that three mechanisms working in cooperation are set: one is a connecting mechanism for quick assembly and reliable fixation, which drives a mortise and tenon type clamping structure through a rotating handle to realize quick locking; the second is a separation mechanism set between the circuit boards, which has the functions of insulation, support and interlayer auxiliary heat dissipation; the third is a heat dissipation mechanism integrated in the limiting frame, which performs three-dimensional forced air cooling on the surface and interlayer of the circuit board through internal air ducts and specially designed inclined and parallel air outlets. The present application solves the problems of complex structure, inconvenient assembly and low heat dissipation efficiency of the existing vehicle-mounted circuit board, especially the difficulty in dissipating the heat accumulated between the multilayer boards, and ensures the stable operation of the circuit board under high temperature and high power working conditions.

Description

Technical Field

[0001] This invention relates to the field of circuit board structure technology, and in particular to a new energy vehicle circuit board and its preparation method. Background Technology

[0002] With the rapid development of new energy vehicle technology, the level of electrification and integration of vehicles is increasing. The power density of core electronic units such as on-board controllers and battery management systems (BMS) is constantly increasing, causing their internal circuit boards to generate a large amount of heat during operation. If this heat cannot be dissipated in a timely and effective manner, it will lead to excessively high temperatures of electronic components, thereby affecting their performance, shortening their service life, and even causing safety hazards. Therefore, the structural design of on-board circuit boards, especially their heat dissipation performance, has become one of the key technologies for ensuring the safe and reliable operation of new energy vehicles.

[0003] However, existing automotive circuit boards still have shortcomings in their structural design. Some circuit boards rely on a single, simple heat dissipation method, typically depending solely on natural heat dissipation from the casing or simple air cooling. When dealing with multi-layered circuit board structures, heat from the internal core areas is difficult to transfer efficiently to the outside, leading to significant heat accumulation between boards and creating heat dissipation dead zones, resulting in localized overheating. Furthermore, to achieve secure mounting and some support, existing circuit board structures are often quite complex, with cumbersome assembly processes requiring numerous screws and other fasteners. This not only reduces production and maintenance efficiency but also, under the continuous vibrations of a moving vehicle, the numerous connection points are prone to loosening, posing a challenge to the overall structural reliability of the electronic unit. Summary of the Invention

[0004] The purpose of this invention is to address the problems in the prior art, such as the complex structure, inconvenient assembly, and low heat dissipation efficiency of vehicle circuit boards, especially the difficulty in dissipating heat accumulation between multi-layer boards, and to propose a new energy vehicle circuit board and its preparation method.

[0005] In a first aspect, the present invention provides a new energy vehicle circuit board, comprising two limiting frames, a top plate mounted on the upper surface of the limiting frames, a base plate mounted on the lower surface of the limiting frames, and further comprising:

[0006] A connecting mechanism that runs through the top plate, the limiting frame, and the base plate is used to quickly fix the top plate, the limiting frame, and the base plate.

[0007] The connecting mechanism includes a connecting column that is slidably connected inside the top plate and to the upper side of the middle of the limiting frame, and a positioning pin that is slidably connected inside the base plate and to the lower side of the inside of the limiting frame. One end of the positioning pin is fixedly connected to a fan-shaped positioning block that is tenon-and-mortise engaged with the connecting column. The bottom of the connecting column is slidably connected to a limiting ball that matches the fixed slot. The connecting column is threaded with a threaded column inside. One end of the threaded column is fixedly connected to an internal hexagon handle, and the other end is fixedly connected to a push plate.

[0008] The multi-layer circuit board mechanism is positioned between two limiting frames and engages with a pre-set slot inside the limiting frames;

[0009] The partition mechanism is located in the middle of the multi-layer circuit board mechanism and is used to partition, support and dissipate heat between the multi-layer circuit board mechanisms.

[0010] A heat dissipation mechanism, located inside the limiting frame, is used to improve the heat dissipation effect of the multi-layer circuit board mechanism.

[0011] Two symmetrically distributed heat dissipation fins are fixedly connected between the two top plates and the two base plates, respectively.

[0012] Optionally, the multi-layer circuit board mechanism includes a circuit board one, a circuit board two, and a circuit board connecting cylinder that connects the two electrically, wherein the outer walls of the circuit board one and the circuit board two are both locked in pre-set slots inside the limiting frame.

[0013] Optionally, the separation mechanism includes two sets of insulating pads and a separator plate, which are respectively attached to the lower surface of the circuit board and the upper surface of the second circuit board. The two insulating pads are supported and fixedly connected to the upper and lower sides of the separator plate by a support plate. A heat dissipation fin is fixedly connected between the separator plate and the support plate.

[0014] Optionally, the heat dissipation mechanism includes a conveying air duct and two connecting flanges inside the limiting frame. The two connecting flanges are respectively fixedly connected to the conveying air ducts at the front and rear ends of the limiting frame. Three sets of heat dissipation fins are fixedly connected to the conveying air duct inside the limiting frame. Two sets of oblique air vents are respectively opened on both sides of the inside of the limiting frame, and a set of parallel air vents is opened in the middle of the limiting frame.

[0015] Optionally, the support plate has multiple grooves arranged in a linear array inside, and the heat dissipation fins are disposed inside the grooves and are tightly fitted to the support plate.

[0016] Optionally, multiple positioning posts are fixedly connected to both the upper and lower surfaces of the partition plate. The outer wall of each positioning post penetrates the interior of the support plate, and a limiting top plate for limiting the position of the support plate is fixedly connected to its top.

[0017] Optionally, both sets of the oblique air vents are designed to be oblique, so that they can blow air onto the circuit boards 1 and 2 on the upper and lower sides.

[0018] Optionally, one end of the connecting post is provided with a slot that matches the fan-shaped positioning block, for positioning the connecting post and the positioning pin.

[0019] Optionally, one end of the hexagonal handle is provided with a groove for the limiting ball to slide, and the opening at its outlet is smaller than the diameter of the limiting ball to prevent the limiting ball from sliding out of the hexagonal handle.

[0020] Secondly, the present invention provides a method for manufacturing a new energy vehicle circuit board, applied to the new energy vehicle circuit board described in the first aspect, the method comprising the following steps:

[0021] S1. Install the internal components, insert the multi-layer circuit board mechanism into the preset slots inside the two limit frames through its two sides, and install the separator mechanism in the middle of the multi-layer circuit board mechanism.

[0022] S2. Assemble the main frame, install the top plate and the base plate on the upper and lower sides of the two limiting frames respectively, and fix the two heat dissipation fins between the top plate and the base plate.

[0023] S3. Perform quick locking by rotating the internal hexagonal handle of the connecting mechanism to drive the connecting column downward until it engages with the positioning pin through the sector positioning block, while simultaneously causing the limit ball to engage in the fixed slot, thus completing the fastening of the entire circuit board.

[0024] Compared with the prior art, this application includes at least one of the following beneficial technical effects:

[0025] This invention features a unique connecting mechanism that allows for quick locking or unlocking by simply rotating the handle. Its dual locking design, combining mortise and tenon joints with a limiting ball, ensures high structural stability under vehicle vibration conditions and simplifies installation and maintenance.

[0026] Furthermore, the use of limit bracket slots ensures stable positioning of the circuit board. Meanwhile, the partition mechanism between the boards integrates physical support, electrical insulation, and auxiliary heat dissipation, effectively solving the problem of heat accumulation between boards in traditional structures.

[0027] Finally, the integrated heat dissipation mechanism divides the cooling airflow into three paths: precisely cooling the support frame, the circuit board surface, and the core area between the boards. This multi-path, all-around heat dissipation design greatly improves overall heat dissipation efficiency and ensures the product's reliability under harsh operating conditions. Attached Figure Description

[0028] Figure 1A schematic diagram of the overall structure of a new energy vehicle circuit board and its manufacturing method;

[0029] Figure 2 This is a schematic diagram of the overall explosion.

[0030] Figure 3 This is an exploded view of the connecting mechanism;

[0031] Figure 4 This is an exploded view of a multilayer circuit board structure.

[0032] Figure 5 Schematic diagram of the explosion of the separation mechanism;

[0033] Figure 6 This is a schematic diagram of the connecting mechanism;

[0034] Figure 7 This is a cross-sectional schematic diagram of the connecting mechanism;

[0035] Figure 8 This is a cross-sectional schematic diagram of the heat dissipation mechanism.

[0036] Reference numerals: 1. Top plate; 2. Limiting frame; 3. Connecting mechanism; 301. Connecting column; 302. Hexagonal handle; 303. Threaded column; 304. Push plate; 305. Limiting ball; 306. Positioning pin; 307. Fan-shaped positioning block; 308. Fixing slot; 4. Heat dissipation fins; 5. Multi-layer circuit board mechanism; 501. Circuit board one; 502. Circuit board connecting cylinder; 503. Circuit board two; 6. Separation mechanism; 601. Separation plate; 602. Positioning column; 603. Limiting top plate; 604. Support plate; 605. Insulating pad; 606. Heat dissipation fin one; 7. Heat dissipation mechanism; 701. Connecting flange; 702. Conveying air duct; 703. Heat dissipation fin two; 704. Angled air outlet; 705. Parallel air outlet; 8. Base plate. Detailed Implementation

[0037] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0038] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0039] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0040] like Figures 1-7 As shown, the present invention proposes a new energy vehicle circuit board, including two limiting frames 2, a top plate 1 installed on the upper surface of the limiting frame 2, and a base plate 8 installed on the lower surface of the limiting frame 2. It also includes a connecting mechanism 3 that penetrates the top plate 1, the limiting frame 2, and the base plate 8 for quickly fixing the top plate 1, the limiting frame 2, and the base plate 8. The connecting mechanism 3 includes a connecting post 301 slidably connected inside the top plate 1 and the upper side of the middle of the limiting frame 2, and a positioning pin 306 slidably connected inside the base plate 8 and the lower side of the inside of the limiting frame 2. The connecting post 301 and the positioning pin 306 slide relative to each other and eventually engage, pulling the top plate 1 and the base plate 8 towards the middle limiting frame 2. One end of the positioning pin 306 is fixedly connected to a fan-shaped positioning block 307 that is tenon-and-mortise engaged with the connecting post 301 for positioning. The slots on block 307 and connecting post 301 form a tenon-and-mortise structure, providing very strong axial and radial positioning when the two are engaged, preventing loosening and rotation. The bottom of connecting post 301 is slidably connected to a limiting ball 305 that matches the fixed slot 308. When the limiting ball 305 and the fixed slot 308 are connected in place, the limiting ball 305 will enter the slot, playing an auxiliary locking role to prevent accidental loosening. The connecting post 301 is internally threaded with a threaded post 303. One end of the threaded post 303 is fixedly connected to an internal hexagon handle 302, and the other end is fixedly connected to a push plate 304. The push plate 304 transmits the linear force generated by the threaded post 303, pushing the connecting post 301 to move. By rotating the handle, the rotational torque is converted into linear thrust or pull force through the threaded transmission.

[0041] As one implementation method, such as Figure 2 , Figure 3 and Figure 4As shown, the vehicle-mounted circuit board in this embodiment also includes a multi-layer circuit board mechanism 5, which is a circuit carrier for performing electronic functions. It is disposed between two limiting frames 2 and engages with a pre-set slot inside the limiting frame 2. In one implementation, the multi-layer circuit board mechanism 5 includes a first circuit board 501, a second circuit board 503, and a circuit board connecting cylinder 502 that connects the two for electrical conduction. The circuit board connecting cylinder 502 serves as a physical separator and electrical connection, connecting two independent circuit boards into a multi-layer structure that works collaboratively. The multi-layer circuit board is described in detail below:

[0042] Both outer walls of circuit board 1 501 and circuit board 2 503 are secured in pre-set slots inside the limiting frame 2. The actual printed circuit boards (PCBs) of circuit board 1 501 and circuit board 2 503 are covered with electronic components and circuits.

[0043] In this embodiment, the multi-layer circuit board mechanism 5, consisting of circuit board one 501, circuit board two 503 and circuit board connecting cylinder 502, is first inserted between the two limiting frames 2. The outer walls of circuit board one 501 and circuit board two 503 will accurately fit into the preset slots inside the limiting frame 2 to achieve stable installation.

[0044] like Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, in order to separate, support, and dissipate heat between the multilayer circuit board structures 5, and to achieve separation, support, insulation, and auxiliary heat dissipation, a separation mechanism 6 is provided in the middle of the multilayer circuit board structure 5. In one embodiment, the separation mechanism 6 includes two sets of insulating pads 605 and a separation plate 601, which are respectively attached to the lower surface of circuit board one 501 and the upper surface of circuit board two 503. The separation is described in detail below:

[0045] Both insulating pads 605 are supported and fixedly connected to the upper and lower sides of the partition plate 601 by the support plate 604. The insulating pads 605 are in direct contact with the circuit board, and their core function is electrical insulation to prevent short circuit between the circuit board and the metal partition mechanism 6. A heat dissipation fin 606 is fixedly connected between the partition plate 601 and the support plate 604. The support plate 604 supports the insulating pads 605 and serves as a heat conduction path for heat to be conducted from the circuit board to the heat dissipation fin 606. Multiple positioning posts 602 are fixedly connected to the upper and lower surfaces of the partition plate 601. The outer wall of the positioning post 602 penetrates the interior of the support plate 604, and a limiting top plate 603 is fixedly connected to its top to limit the position of the support plate 604. The heat dissipation fin 606 is located inside the partition mechanism 6 and is used to dissipate the heat transferred from the two circuit boards, and is cooled in conjunction with the airflow from the parallel air vent 705.

[0046] In this embodiment, the partition mechanism 6 is placed between two circuit boards. The partition mechanism 6 is attached to the lower surface of circuit board 1 501 and the upper surface of circuit board 2 503 respectively by the insulating pads 605 on its upper and lower sides, which serves as insulation. In addition, the insulating pads 605 are supported by the support plate 604, which is fixedly connected to the partition plate 601 in the middle by the positioning post 602 that runs through it, forming a stable support structure. At the same time, heat dissipation fins 606 are also provided between the partition plate 601 and the support plate 604. The heat dissipation fins 606 are tightly embedded in the linear array grooves of the support plate 604, which increases the contact area and helps to conduct the heat generated by the circuit board to the interior of the partition mechanism 6 for heat dissipation.

[0047] like Figure 1 , Figure 2 , Figure 4 and Figure 8 As shown, this embodiment also includes a heat dissipation mechanism 7, which efficiently cools the circuit board and internal structure through forced air cooling. It is located inside the limiting frame 2 to improve the heat dissipation effect on the multi-layer circuit board mechanism 5. In one implementation, the heat dissipation mechanism 7 includes a conveying air duct 702 and two connecting flanges 701 located inside the limiting frame 2. The connecting flanges 701 serve as airflow input / output interfaces for connecting to external fans or vehicle ventilation ducts. The heat dissipation is described in detail below:

[0048] Two connecting flanges 701 are fixedly connected to the front and rear ends of the conveying air ducts 702 of the limiting frame 2. The conveying air ducts 702 are the main channels for the cooling airflow inside the limiting frame 2. Three sets of heat dissipation fins 703 are fixedly connected to the conveying air ducts 702 inside the limiting frame 2. The heat dissipation fins 703 are installed inside the air ducts and are used to cool the limiting frame 2 itself. The limiting frame 2 contacts the circuit board through the slot and conducts heat. These fins are used to carry away this heat. Two sets of oblique air vents 704 are opened on both sides of the inside of the limiting frame 2, and a set of parallel air vents 705 is opened in the middle of the limiting frame 2. Both sets of oblique air vents 704 are designed at an angle so that they can blow air onto the circuit boards 501 and 503 on the upper and lower sides.

[0049] In one embodiment, the vehicle circuit board also includes two symmetrically distributed heat dissipation fins 4, which are fixedly connected between the two top plates 1 and the two base plates 8 respectively. One end of the connecting post 301 is provided with a slot that matches the fan-shaped positioning block 307, which is used to position the connecting post 301 and the positioning pin 306. One end of the internal hexagon handle 302 is provided with a groove for the sliding of the limiting ball 305. The opening size at its outlet is smaller than the diameter of the limiting ball 305 to prevent the limiting ball 305 from sliding out of the internal hexagon handle 302.

[0050] In this embodiment, the multilayer circuit board mechanism 5 is first engaged between the two limiting frames 2. Then, the top plate 1, the two limiting frames 2, and the substrate 8 are sequentially aligned. Next, the positioning pin 306 is passed through the interior of the substrate 8 so that its top can be positioned on the lower interior side of the limiting frame 2. Then, the connecting post 301 is passed through the interior of the top plate 1 so that its bottom end slides inside the limiting frame 2 and abuts against the top of the positioning pin 306. Then, the connecting post 301 is rotated until the slot at the bottom of the connecting post 301 and the fan-shaped positioning block 307 at the top of the positioning pin 306 are engaged in a tenon-and-mortise joint, thus positioning the positioning pin 306 and the connecting post 301. Finally, the inner hexagon in the connecting mechanism 3 is rotated. The hexagon handle 302 drives the threaded post 303 to rotate, which in turn drives the push plate 304 to move downward. The push plate 304 slides down along the sliding path of the connecting post 301. As the connecting post 301 moves downward, the limiting ball 305 at its bottom is squeezed by the inclined surface of the push plate 304 and gradually moves outward, thus embedding and engaging in the fixing slot 308, which quickly fastens the positioning pin 306 to the connecting post 301. When disassembly is required, the hexagon handle 302 can be quickly loosened by rotating it in the opposite direction. The groove designed for the limiting ball 305 on the hexagon handle 302 has an outlet smaller than the diameter of the ball, which can effectively prevent the limiting ball 305 from falling off during disassembly and assembly.

[0051] Furthermore, the air duct of the external radiator is connected to the conveying air duct 702 inside the limiting frame 2 via the connecting flange 701. The airflow flows through the three sets of heat dissipation fins 703 in the air duct, carrying away the heat conducted from the multi-layer circuit board mechanism 5 to the limiting frame 2. Subsequently, the cooling airflow is blown out from the air vents opened on the inner wall of the limiting frame 2 to directly cool the circuit board. Among them, the two sets of inclined air vents 704 are set at an angle, which can accurately blow the airflow onto the surfaces of circuit board 501 and circuit board 503 respectively. The parallel air vent 705 located in the middle blows the airflow into the space between the two circuit boards, cooling the separation mechanism 6 and its heat dissipation fins 606, thereby achieving efficient heat dissipation in all directions and through multiple paths.

[0052] A method for manufacturing a circuit board for new energy vehicles, the method comprising the following steps:

[0053] S1. Install the internal components, insert the multi-layer circuit board mechanism 5 into the pre-set slots inside the two limit frames 2 through its two sides, and install the separator mechanism 6 in the middle of the multi-layer circuit board mechanism 5.

[0054] S2. Assemble the main frame, install the top plate 1 and the base plate 8 on the upper and lower sides of the two limiting frames 2 respectively, and fix the two heat dissipation fins 4 between the top plate 1 and the base plate 8.

[0055] S3. Perform quick locking by rotating the internal hexagon handle 302 of the connecting mechanism 3 to drive the connecting column 301 downward until it engages with the positioning pin 306 through the sector positioning block 307, while simultaneously causing the limit ball 305 to engage in the fixed slot 308, thus completing the fastening of the entire circuit board.

[0056] In this embodiment, the multi-layer circuit board mechanism 5 is first assembled from circuit board one 501, circuit board two 503 and circuit board connecting cylinder 502. Then, the multi-layer circuit board mechanism 5 is inserted between the two limiting frames 2, so that the outer walls of circuit board one 501 and circuit board two 503 are engaged in the preset slots inside the limiting frame 2, thus completing the initial positioning of the multi-layer circuit board mechanism 5.

[0057] The separator 6 is placed between circuit board 1 501 and circuit board 2 503. The insulating pads 605 on the upper and lower sides of the separator 6 are respectively attached to the lower surface of circuit board 1 501 and the upper surface of circuit board 2 503. At the same time, the support plate 604 is fixedly connected to the separator 601 through the positioning post 602 to form a stable support structure. The heat dissipation fins 606 are embedded in the groove of the support plate 604 to build a heat conduction path for the circuit board.

[0058] Place the top plate 1 on the upper surface of the two limiting frames 2, and place the base plate 8 on the lower surface of the two limiting frames 2, aligning the holes of the top plate 1, the limiting frames 2, and the base plate 8. Then, pass the positioning pin 306 through the interior of the base plate 8, so that its top is located on the lower side inside the limiting frame 2; then, pass the connecting post 301 through the interior of the top plate 1, so that its bottom end slides into the interior of the limiting frame 2 and fits against the top of the positioning pin 306.

[0059] Rotate the connecting column 301 so that the groove at the bottom of the connecting column 301 and the fan-shaped positioning block 307 at the top of the positioning pin 306 form a tenon-and-mortise engagement, realizing the axial and radial positioning of the connecting column 301 and the positioning pin 306. Then rotate the hexagon handle 302, which drives the threaded column 303 to rotate. The threaded column 303 drives the push plate 304 to move downward. The push plate 304 pushes the connecting column 301 downward. The limiting ball 305 at the bottom of the connecting column 301 is squeezed outward and embedded and engaged in the fixed groove 308, pulling the top plate 1 and the base plate 8 towards the middle limiting frame 2, completing the rapid fastening of the overall structure.

[0060] The air duct of the external radiator is connected to the conveying air duct 702 inside the limiting frame 2 via the connecting flange 701. After the cooling airflow enters the conveying air duct 702, it first flows through the three sets of heat dissipation fins 703, carrying away the heat conducted by the limiting frame 2. Then the airflow is blown out from the two sets of oblique air outlets 704 on both sides inside the limiting frame 2, blowing onto the surfaces of circuit board 1 501 and circuit board 2 503 respectively, cooling the surface of the circuit boards; at the same time, the parallel air outlet 705 in the middle blows the airflow into the space between circuit board 1 501 and circuit board 2 503, cooling the partition mechanism 6 and the heat dissipation fins 606, realizing multi-path all-round heat dissipation.

[0061] When disassembly is required, rotate the hexagon handle 302 in the reverse direction. The hexagon handle 302 drives the threaded post 303 to rotate in the reverse direction, the push plate 304 moves upward, and the limit ball 305 disengages from the locking state of the fixing slot 308. Then rotate the connecting post 301 in the reverse direction to separate the tenon and mortise engagement between the connecting post 301 and the fan-shaped positioning block 307. Finally, remove the connecting post 301 and the positioning pin 306 in sequence to disassemble the top plate 1, the limit frame 2, the base plate 8, and the internal components.

[0062] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A new energy vehicle circuit board, comprising two limiting frames (2), a top plate (1) mounted on the upper surface of the limiting frames (2), and a base plate (8) mounted on the lower surface of the limiting frames (2), characterized in that, Also includes: A connecting mechanism (3) is installed inside the top plate (1), the limiting frame (2), and the base plate (8) to quickly fix the top plate (1), the limiting frame (2), and the base plate (8); The connecting mechanism (3) includes a connecting post (301) slidably connected inside the top plate (1) and the upper side of the middle part of the limiting frame (2), and a positioning pin (306) slidably connected inside the base plate (8) and the lower side of the inside of the limiting frame (2). One end of the positioning pin (306) is fixedly connected to a fan-shaped positioning block (307) that is tenon-locked and positioned with the connecting post (301). One end of the connecting post (301) has a slot that matches the fan-shaped positioning block (307) for positioning the connecting post (301) and the positioning pin (306). The bottom of the connecting post (301) is slidably connected to a limiting ball (305) that matches the fixed slot (308). The connecting post (301) is threadedly connected to a threaded post (303). One end of the threaded post (303) is fixedly connected to... There is an internal hexagon handle (302), and a push plate (304) is fixedly connected to the other end. One end of the internal hexagon handle (302) is provided with a groove for the sliding of the limiting ball (305). The opening size at its outlet is smaller than the diameter of the limiting ball (305) to prevent the limiting ball (305) from sliding out of the internal hexagon handle (302). By rotating the internal hexagon handle (302) in the connecting mechanism (3), the internal hexagon handle (302) drives the threaded column (303) to rotate, thereby driving the push plate (304) to move downward. The push plate (304) moves down along the sliding path of the connecting column (301). While the connecting column (301) moves down, the limiting ball (305) at its bottom is squeezed by the inclined surface of the push plate (304) and gradually moves outward, thereby embedding and engaging in the fixed slot (308). The multi-layer circuit board mechanism (5) is set between the two limiting frames (2) and engages with the pre-set slot inside the limiting frame (2); The partition mechanism (6) is located in the middle of the multi-layer circuit board mechanism (5) and is used to partition, support and dissipate heat between the multi-layer circuit board mechanisms (5); The heat dissipation mechanism (7) is located inside the limiting frame (2) to improve the heat dissipation effect on the multilayer circuit board mechanism (5); The heat dissipation mechanism (7) includes a conveying air duct (702) and two connecting flanges (701) inside the limiting frame (2). The two connecting flanges (701) are fixedly connected to the conveying air ducts (702) at the front and rear ends of the limiting frame (2). Three sets of heat dissipation fins (703) are fixedly connected to the conveying air ducts (702) inside the limiting frame (2). Two sets of oblique air vents (704) are opened on both sides of the inside of the limiting frame (2). Both sets of oblique air vents (704) are designed to be oblique so that they can blow air onto the circuit board 1 (501) and circuit board 2 (503) on the upper and lower sides. A set of parallel air vents (705) is opened in the middle of the limiting frame (2). The parallel air vents (705) are used to blow airflow into the space between the two circuit boards. Two symmetrically distributed heat dissipation fins (4) are fixedly connected between two top plates (1) and two base plates (8).

2. The new energy vehicle circuit board according to claim 1, characterized in that, The multi-layer circuit board mechanism (5) includes circuit board one (501), circuit board two (503) and circuit board connecting cylinder (502) that connects the two for conduction. The outer walls of circuit board one (501) and circuit board two (503) are both locked in the slots preset inside the limiting frame (2).

3. A new energy vehicle circuit board according to claim 1, characterized in that, The separation mechanism (6) includes two sets of insulating pads (605) and a separation plate (601), which are respectively attached to the lower surface of circuit board one (501) and the upper surface of circuit board two (503). The two insulating pads (605) are supported and fixedly connected to the upper and lower sides of the separation plate (601) by the support plate (604). A heat dissipation fin (606) is fixedly connected between the separation plate (601) and the support plate (604).

4. A new energy vehicle circuit board according to claim 3, characterized in that, The support plate (604) has multiple grooves arranged in a linear array inside, and the heat dissipation fins (606) are disposed inside the grooves and are tightly fitted to the support plate (604).

5. A new energy vehicle circuit board according to claim 3, characterized in that, Multiple positioning posts (602) are fixedly connected to the upper and lower surfaces of the partition plate (601). The outer wall of the positioning post (602) is disposed through the interior of the support plate (604), and a limiting top plate (603) for limiting the support plate (604) is fixedly connected to its top.

6. A method for manufacturing a new energy vehicle circuit board, applied to the new energy vehicle circuit board according to any one of claims 1-5, characterized in that, The method includes the following steps: S1. Install the internal components, insert the multi-layer circuit board mechanism (5) into the pre-set slots inside the two limit frames (2) through its two sides, and install the separation mechanism (6) in the middle of the multi-layer circuit board mechanism (5); S2. Assemble the main frame, install the top plate (1) and the base plate (8) on the upper and lower sides of the two limiting frames (2) respectively, and fix the two heat dissipation fins (4) between the top plate (1) and the base plate (8). S3. Perform quick locking by rotating the internal hexagon handle (302) of the connecting mechanism (3) to drive the connecting column (301) downward until it engages with the positioning pin (306) through the fan-shaped positioning block (307), while the limit ball (305) is engaged in the fixed slot (308) to complete the fastening of the entire circuit board.

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