Display device, method of manufacturing display device, and electronic device

Abstract

A display device, a method of manufacturing the display device, and an electronic device are provided. The display device includes a base layer, a first dam, a second dam, and a resin layer. The base layer includes a first region and a second region proximate to the first region. A first dam is disposed in a second region on the base layer. A second dam is disposed in a second region on the base layer and spaced apart from the first dam. The first and second dams include the same material as each other. The resin layer is disposed on the base layer. The resin layer includes a same material as a material of the first and second dams, and the resin layer covers an upper surface of each of the first and second dams.

Description

Technical Field

[0001] This disclosure relates to display devices, and more specifically, to display devices comprising a resin layer and a dam, methods of manufacturing display devices, and electronic devices comprising display devices. Background Technology

[0002] In the manufacture of display devices such as smartphones, televisions, smartwatches, and computer monitors, various layers are stacked on a substrate. An adhesive resin layer is typically used in this process. However, this resin tends to shrink during curing, which can lead to incomplete coverage, especially at the edges of the display. To address this issue, dams are formed at the edges of the display before the resin layer is applied. These dams act as barriers, resisting the shrinkage of the resin during curing and thus preventing or reducing shrinkage. Ongoing research focuses on developing structures that minimize this shrinkage of the resin layer. Summary of the Invention

[0003] The display device includes a base layer, a first dam, a second dam, and a resin layer. The base layer includes a first region and a second region adjacent to the first region. The first dam is disposed in the second region on the base layer. The second dam is disposed in the second region on the base layer. The second dam is spaced apart from the first dam and comprises the same material as the first dam. The resin layer is disposed on the base layer, comprises the same material as the first and second dams, and covers the upper surface of each of the first and second dams.

[0004] The base layer may include a display panel, which includes light-emitting diodes (LEDs).

[0005] The second dam can be located closer to the first area of ​​the foundation layer than the first dam.

[0006] The first dam may have a first height, and the second dam may have a second height. The first height of the first dam may differ from the second height of the second dam.

[0007] The second height can be greater than the first height.

[0008] Each of the first height of the first dam and the second height of the second dam may be approximately 100 μm or less.

[0009] The planar shape of each of the first and second dams can be polygonal or circular.

[0010] The upper surfaces of the first and second dams arranged on the base layer can be hydrophilic.

[0011] Each of the first and second dams may include urethane resin, acrylic resin and / or epoxy resin.

[0012] The planar area of ​​the resin layer can be approximately 95% or more of the planar area of ​​the base layer.

[0013] The width of the second region can be approximately 5 mm or less.

[0014] A method of manufacturing a display device includes performing a first surface treatment process on the upper surface of the second region of a base layer comprising a first region and a second region adjacent to the first region. A dam resin is applied to the second region of the base layer. The dam resin is cured to form a first dam and a second dam spaced apart from the first dam. A main resin comprising the same material as the dam resin is applied to the first and second regions of the base layer. The main resin is cured to form a resin layer covering the upper surfaces of the first and second dams.

[0015] The first surface treatment process may include performing a hydrophilic treatment process on the upper surface of the second region of the base layer.

[0016] When forming the first dam and the second dam, the second dam can be formed in the first region closer to the foundation layer than the first dam.

[0017] The first dam may have a first height, and the second dam may have a second height. The second height of the second dam may differ from the first height of the first dam.

[0018] The second height of the second dam can be greater than the first height of the first dam.

[0019] The method may also include performing a second surface treatment process on the upper surface of the first region of the base layer before applying the main resin.

[0020] Performing a second surface treatment process may include performing a hydrophilic treatment process on the upper surface of the first region of the base layer.

[0021] Each of the first and second surface treatment processes can be a plasma treatment process.

[0022] When applying dam resin, it can be applied by inkjet printing.

[0023] The electronic device includes a display device and a processor configured to drive the display device, wherein the display device includes a base layer, a first dam, a second dam, and a resin layer, the base layer including a first region and a second region adjacent to the first region, the first dam being disposed in the second region on the base layer, the second dam being disposed in the second region on the base layer, the second dam being spaced apart from the first dam and comprising the same material as the first dam, and the resin layer being disposed on the base layer, comprising the same material as the first dam and the second dam, and covering the upper surface of each of the first dam and the second dam. Attached Figure Description

[0024] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. Together with the description, the drawings illustrate embodiments of the inventive concept.

[0025] Figure 1 This is a perspective view showing a display device according to an embodiment of the present disclosure.

[0026] Figure 2 It is shown Figure 1 A cross-sectional view of the display device.

[0027] Figure 3 It is shown Figure 2 A cross-sectional view of the display panel.

[0028] Figure 4 It is shown Figure 2 The diagram shows a plan view of an implementation of the base layer.

[0029] Figure 5 yes Figure 4 An enlarged plan view of the implementation method for region AA.

[0030] Figure 6 yes Figure 4 An enlarged plan view of the implementation method for region AA.

[0031] Figure 7 It is along Figure 5 The cross-sectional view taken from line I-I'.

[0032] Figure 8 yes Figure 4 An enlarged plan view of the implementation method for region AA.

[0033] Figure 9 It is along Figure 8 The cross-sectional view taken from line II-II'.

[0034] Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 and Figure 17 It shows the manufacturing process. Figure 9 A view of the method of dam and resin layer.

[0035] Figure 18 yes Figure 4 An enlarged plan view of the implementation method for region AA.

[0036] Figure 19 It is shown Figure 2 A plan view of the implementation of the basic layer included in the diagram.

[0037] Figure 20 yes Figure 19 A magnified plan view of region BB.

[0038] Figure 21 It is along Figure 20 A cross-sectional view of the embodiment with line V-V' cut off.

[0039] Figure 22 It is along Figure 20 A cross-sectional view of the embodiment with line V-V' cut off.

[0040] Figure 23 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0041] Figure 24 It is based on Figure 23 Schematic diagrams of electronic devices in various embodiments. Detailed Implementation

[0042] Specific structural and functional descriptions are provided regarding the embodiments of this disclosure for the purpose of explaining the embodiments of this disclosure, and the embodiments of this disclosure can be implemented in various forms. However, this disclosure should not necessarily be construed as limited to the embodiments described herein.

[0043] Various modifications and forms may be made in this disclosure, and specific embodiments will be shown in the accompanying drawings and described in detail herein. However, this is not necessarily intended to limit this disclosure to the specific forms disclosed, and it should be understood that all variations, equivalents, or substitutions falling within the spirit and technical scope of this disclosure are to be included.

[0044] Terms such as "first," "second," etc., may be used to describe various components, but these components should not necessarily be limited by the terms. The terms above may be used to distinguish one component from another. For example, without departing from the scope of this disclosure, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component.

[0045] When a component is described as being “connected” to another component, it should be understood that it may be directly connected to the other component, or connected to the other component but other components may exist between them. Other expressions describing the relationship between components, such as “located between” and “directly located between” or “adjacent” and “directly adjacent”, should be interpreted similarly.

[0046] Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” used herein are intended to include the plural forms as well. It should also be understood that the terms “comprising” and / or “including” as used in this specification indicate the presence of stated features, integrals, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0047] In the following, embodiments will be described in detail with reference to the accompanying drawings. The same reference numerals may be used for the same parts in the drawings, and where no element is described in detail with reference to the drawings, it will be understood that the element is at least similar to a corresponding element described elsewhere in this disclosure.

[0048] In this specification, a plane may be defined by a first direction D1 and a second direction D2 intersecting the first direction D1. For example, the second direction D2 may be perpendicular to the first direction D1. Furthermore, a third direction D3 may be the normal direction of the plane. For example, the third direction D3 may be perpendicular to the plane formed by the first direction D1 and the second direction D2.

[0049] Figure 1 This is a perspective view illustrating a display device according to an embodiment of the present disclosure. The display device DD can be configured for use in products such as smartphones, televisions, smartwatches, or computer monitors, but the display device DD can also be configured for use in other types of products including a display panel. When used in a smartphone, the display device DD may include a rigid or folded display panel. The size and resolution of the display panel may be suitable for a smartphone, but in other respects may also be substantially as described herein, equipped with the various dams and resin layers described herein. When used in a television or computer monitor, the display device DD may include a flat or bent display panel. The size and resolution of the display panel may be suitable for a television or computer monitor. When used in a smartwatch, the display device DD may include a rectangular or circular display panel and may have a size and resolution suitable for use as a smartwatch. Other end products such as digital billboards, vehicle navigation systems or other vehicle displays, portable game consoles, tablet computers, e-book readers, personal digital assistants (PDAs), or Internet of Things devices such as smart home appliances including display panels may also utilize the display device DD described herein.

[0050] Reference Figure 1 The display device DD may include a display area DA and a peripheral area SA. The display area DA may be surrounded by the peripheral area SA on at least two sides. The display area DA is close to the peripheral area SA.

[0051] The display area DA can be an area capable of generating light or otherwise displaying an image by adjusting the transmittance of light provided from an external light source such as a backlight. The peripheral area SA can be an area where no image is displayed. However, embodiments of this disclosure are not necessarily limited thereto, and at least a portion of the peripheral area SA can display an image.

[0052] The display area DA can display multiple images IM. Through these multiple images IM, the user can receive information from the display device DD.

[0053] Figure 2 It is shown Figure 1 A cross-sectional view of the display device.

[0054] Reference Figure 2 The display device DD may include a cover film CF, a plate PT, an adhesive film AF, a display panel DP, a polymer layer POL, a window layer WL, an adhesive layer ADL, and a protective film PL.

[0055] A cover film CF may be disposed on the rear surface of the display device DD. The cover film CF serves to protect the display device DD from impacts and to mitigate external strain applied thereto. The cover film CF may comprise sponge, foam, thermoplastic polyurethane, and / or polydimethicone. They may be used alone or in combination with each other. Optionally, the cover film CF may comprise a light-blocking material. Thus, the cover film CF absorbs light incident from the rear surface of the display device DD.

[0056] A plate PT can be disposed on a cover film CF. The plate PT prevents the display panel DP from bending due to external forces. For example, even when an external force is applied from outside the display device DD, the plate PT can keep the display panel DP in a relatively flat state. The plate PT can include rigid or semi-rigid materials. For example, the plate PT can include iron, chromium, carbon, nickel, silicon, manganese, and / or molybdenum. These can be used alone or in combination with each other. However, embodiments of this disclosure are not necessarily limited thereto.

[0057] An adhesive film AF can be disposed on a plate PT. The adhesive film AF can attach the plate PT and the display panel DP to each other. For example, the adhesive film AF may include pressure-sensitive adhesive (PSA), optically clear adhesive (OCA), and / or optically clear resin (OCR). However, embodiments of this disclosure are not necessarily limited thereto.

[0058] The display panel DP can be mounted on the adhesive film AF. The display panel DP can generate light based on a provided signal. Therefore, the display panel DP can provide a visual image to the user of the display device DD. See below for further details. Figure 3 Detailed description of the Display Panel (DP).

[0059] The polymer layer POL can be disposed on the display panel DP. The polymer layer POL can attach the display panel DP and the window layer WL to each other. In addition, the polymer layer POL can support the window layer WL to prevent sagging and protect the display panel DP from external impacts, etc. The polymer layer POL can have a single layer or a multi-layer structure.

[0060] A window layer (WL) may be disposed on the polymer layer (POL). The window layer (WL) may cover the front surface of the display panel (DP) and protect the display panel (DP). The window layer (WL) may comprise a substantially transparent material. For example, the window layer (WL) may be glass or plastic. However, embodiments of this disclosure are not necessarily limited thereto.

[0061] An adhesive layer ADL may be disposed on the window layer WL. The adhesive layer ADL can attach the window layer WL and the protective film PL to each other. The adhesive layer ADL may include a transparent material. For example, the adhesive layer ADL may include pressure-sensitive adhesive (PSA), optically clear adhesive (OCA), and / or optically clear resin (OCR). However, embodiments of this disclosure are not necessarily limited thereto.

[0062] A protective film PL may be disposed on the adhesive layer ADL. The protective film PL protects the window layer WL from external impacts and / or scratches. For example, the protective film PL may include a base layer and a hard coating layer. However, embodiments of this disclosure are not necessarily limited thereto. The protective film PL may also include a low refractive index layer and / or a fingerprint-resistant layer.

[0063] Figure 3 It is shown Figure 2 A cross-sectional view of the display panel.

[0064] Reference Figure 1 , Figure 2 and Figure 3 The display panel DP may include a substrate SUB, a buffer layer BF, a gate insulating layer GI, a transistor TR, an interlayer insulating layer IL, a connection electrode CNE, a first via layer VIA1, a second via layer VIA2, a light-emitting diode LED, a pixel limiting layer PDL, and an encapsulation layer ENC.

[0065] A transistor (TR) may include an active layer (ACT), a gate electrode (GE), a source electrode (SE), and a drain electrode (DE). A light-emitting diode (LED) may include a pixel electrode (PE), an emissive layer (EL), and a common electrode (CE).

[0066] The substrate SUB may include a glass substrate, a metal substrate, a plastic substrate, etc. However, the embodiments disclosed herein are not necessarily limited to these, and the substrate SUB may be an inorganic layer, an organic layer, or a composite material layer.

[0067] A buffer layer (BF) may be disposed on the substrate (SUB). The buffer layer (BF) prevents impurities such as oxygen and moisture from penetrating into the upper part of the substrate (SUB). The buffer layer (BF) may comprise an inorganic insulating material.

[0068] The active layer ACT can be disposed on the buffer layer BF. The active layer ACT can include oxide semiconductors, silicon semiconductors, organic semiconductors, etc. For example, oxide semiconductors can include oxides of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (GE), chromium (Cr), titanium (Ti), and / or zinc (Zn). Silicon semiconductors can include amorphous silicon, polycrystalline silicon, etc. The active layer ACT can include a source region, a drain region, and a channel region disposed between the source and drain regions.

[0069] The gate insulating layer GI may be disposed on the buffer layer BF. For example, the gate insulating layer GI may cover the active layer ACT on the buffer layer BF. The gate insulating layer GI may include an inorganic insulating material. In an embodiment, the gate insulating layer GI may be entirely formed in the display area DA and the peripheral area SA.

[0070] The gate electrode GE may be disposed on the gate insulating layer GI. The gate electrode GE may at least partially overlap with the channel region of the active layer ACT. The gate electrode GE may include a conductive material, such as a metal, alloy, conductive metal nitride, conductive metal oxide, or transparent conductive material. Examples of conductive materials that can be used in the gate electrode (GE) include gold (Au), silver (Ag), aluminum (Al), platinum (PT), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), aluminum-containing alloys, silver-containing alloys, copper-containing alloys, molybdenum-containing alloys, aluminum nitride (AlN), tungsten nitride (WN), titanium nitride (TiN), chromium nitride (CrN), tantalum nitride (TaN), strontium ruthenium oxide (SrRuO), zinc oxide (ZnO), indium tin oxide (ITO), tin oxide (SnO), indium oxide (InO), gallium oxide (GaO), indium zinc oxide (IZO), etc. These can be used alone or in combination with each other. Optionally, the gate electrode (GE) can have a single-layer structure or a multilayer structure including multiple conductive layers.

[0071] An interlayer insulating layer IL may be disposed on the gate electrode GE. For example, the interlayer insulating layer IL may be disposed on the gate insulating layer GI and cover the gate electrode GE on the gate insulating layer GI. The interlayer insulating layer IL may include an inorganic insulating material.

[0072] The source electrode SE and drain electrode DE may be disposed on the interlayer insulating layer IL. Each of the source electrode SE and drain electrode DE may be connected to the active layer ACT. For example, the source electrode SE may contact the source region of the active layer ACT, and the drain electrode DE may contact the drain region of the active layer ACT. Each of the source electrode SE and drain electrode DE may include a conductive material. The active layer ACT, the gate electrode GE, the source electrode SE, and the drain electrode DE may form a transistor TR.

[0073] The first via layer VIA1 may be disposed on the source electrode SE and the drain electrode DE. For example, the first via layer VIA1 may be disposed on the interlayer insulating layer IL and may cover the source electrode SE and the drain electrode DE on the interlayer insulating layer IL. The first via layer VIA1 may include an organic insulating material. In an embodiment, the first via layer VIA1 may be formed only in a portion of the display area DA and the peripheral area SA adjacent to the display area DA.

[0074] The connection electrode CNE can be disposed on the first via layer VIA1. The connection electrode CNE can transmit the signal sent from the transistor TR to the light-emitting diode (LED). The connection electrode CNE can include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. These can be used alone or in combination with each other. However, the embodiments disclosed herein are not necessarily limited thereto.

[0075] The second via layer VIA2 may be disposed on the connection electrode CNE. For example, the second via layer VIA2 may be disposed on the first via layer VIA1 and cover the connection electrode CNE. The second via layer VIA2 may comprise a material substantially the same as that of the first via layer VIA1.

[0076] The pixel electrode PE can be disposed on the second via layer VIA2. The pixel electrode PE may include a conductive material. The pixel electrode PE can be connected to the drain electrode DE via the connection electrode CNE. Therefore, the pixel electrode PE can be electrically connected to the transistor TR.

[0077] A pixel defining layer (PDL) may be disposed on a pixel electrode (PE). For example, the pixel defining layer (PDL) may expose at least a portion of the pixel electrode (PE). The pixel defining layer (PDL) may comprise an inorganic insulating material or an organic insulating material.

[0078] The light-emitting layer EL may be disposed on the pixel electrode PE. For example, the light-emitting layer EL may be disposed within an opening defined by the pixel defining layer PDL. For example, the light-emitting layer EL may be surrounded by the pixel defining layer PDL. The light-emitting layer EL may include organic light-emitting materials and / or quantum dots. However, embodiments of this disclosure are not necessarily limited thereto.

[0079] A common electrode CE can be disposed on the light-emitting layer EL. The common electrode CE can also be disposed on the pixel-defining layer PDL. For example, the common electrode CE can be disposed continuously on the light-emitting layer EL and the pixel-defining layer PDL. The common electrode CE may include a conductive material. The light-emitting layer EL can emit light based on the voltage difference between the pixel electrode PE and the common electrode CE.

[0080] The encapsulation layer ENC can be disposed on the common electrode CE. The encapsulation layer ENC may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In embodiments, the inorganic and organic encapsulation layers may be disposed alternately. For example, the organic encapsulation layer may include a cured polymer, such as polyacrylate, epoxy resin, or silicone resin. For example, the inorganic encapsulation layer may include silicon oxide, silicon nitride, silicon carbide, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc.

[0081] Figure 4 It is shown Figure 2 A plan view of the implementation of the base layer included in the diagram. For example, the base layer BL may be a configuration of... Figure 2 Any of the components of the display device DD shown. For example, the base layer BL may be a display panel DP including light-emitting diodes (LEDs) that emit light. However, embodiments of this disclosure are not necessarily limited thereto.

[0082] Reference Figure 2 and Figure 4 A dam DAM can be arranged on the base layer BL, and a resin layer RL can cover the upper surface of the base layer BL and the dam DAM.

[0083] The base layer BL may include a first region A1 and a second region A2 adjacent to (e.g., surrounding) the first region A1. The second region A2 may have a width within a certain range and may surround the first region A1. For example, the width WT of the second region A2 may be about 5 mm or less. For example, the width WT of the second region A2 may be about 3 mm or less.

[0084] The second region A2 can be a region where a dam DAM is arranged. For example, the dam DAM can be arranged on the upper surface of the second region A2, and can be arranged around the first region A1 of the base layer BL. Figure 4 As shown, multiple dams (DAMs) can be arranged in the second area A2. (See below for further details.) Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 Describe the layout of the dam's DAM.

[0085] Dam DAM may include resins. For example, dam DAM may include urethane resin, acrylic resin, and / or epoxy resin. These may be used alone or in combination with each other. However, embodiments of this disclosure are not necessarily limited thereto.

[0086] In this embodiment, the upper surface of the base layer BL on which the dam DAM is disposed may be hydrophilic. Since the upper surface of the base layer BL is hydrophilic (i.e., hydrophilic), the hydrophilic dam DAM can be stably disposed on the upper surface of the base layer BL.

[0087] A resin layer RL can be disposed on a base layer BL. For example, the resin layer RL can be disposed on the base layer BL and can cover the upper surface of the dam DAM. By covering the dam DAM with the resin layer RL, shrinkage of the resin layer RL in the direction of the first region A1 can be prevented or reduced. For example, when the resin layer RL is cured on the base layer BL, the resin layer RL can shrink in the direction of the first region A1. However, since the dam DAM disposed in the second region A2 generates resistance to shrinkage, shrinkage of the resin layer RL in the direction of the first region A1 can be prevented or reduced. Therefore, the dam DAM can act as an anchor to prevent the resin layer RL from detaching.

[0088] In this embodiment, the planar area of ​​the resin layer RL is approximately 95% or more of the planar area of ​​the base layer BL. For example, the planar area of ​​the resin layer RL is approximately 97% or more of the planar area of ​​the base layer BL. When the planar area of ​​the resin layer RL meets the above range, the base layer BL and other components of the display device DD arranged on the base layer BL can be stably attached.

[0089] The resin layer RL may comprise the same material as the dam DAM. For example, the resin layer RL may comprise urethane resin, acrylic resin, and / or epoxy resin. These may be used alone or in combination with each other. However, embodiments of this disclosure are not necessarily limited thereto. Because the dam DAM and the resin layer RL comprise the same material, additional chemical reactions that may occur at the interface where the dam DAM and the resin layer RL intersect can be prevented or reduced.

[0090] In this embodiment, the sum of the planar areas of each of the dam DAMs may be approximately 50% or greater of the planar area of ​​the second region A2. For example, the sum of the planar areas of each of the dam DAMs may be approximately 60% or greater of the planar area of ​​the second region A2. By arranging the dam DAMs on the upper surface of the second region A2 within the aforementioned range, the dam DAMs can effectively prevent shrinkage of the resin layer RL.

[0091] Figure 5 yes Figure 4 An enlarged plan view of the implementation method for region AA. Figure 6 yes Figure 4 An enlarged plan view of the implementation method for region AA.

[0092] Reference Figure 4 , Figure 5 and Figure 6 Multiple dams (DAMs) can be arranged in the second region A2 of the base layer BL. The dams (DAMs) can be spaced apart from each other in the first direction D1 and / or the second direction D2. The dams (DAMs) can also be spaced apart from each other diagonally.

[0093] For example, dam DAM can be like Figure 5 The arrangement shown is random (e.g., without a clear order). For example, one dam DAM may be spaced apart from another dam DAM in a diagonal direction, and may be arranged side by side in a first direction D1 and / or a second direction D2.

[0094] For another instance, each of the dam DAMs can be as follows: Figure 6 The diagram shows dams arranged side-by-side in a regular pattern along a first direction D1 and a second direction D2 on the base layer BL. In this case, the spacing between each dam DAM can be the same. However, embodiments of this disclosure are not necessarily limited to this. Even when the dam DAMs are arranged side-by-side in the first direction D1 and / or the second direction D2, the spacing between the dam DAMs can be different.

[0095] Each of the dams in the DAM can have a planar shape that is polygonal. For example, each of the dams in the DAM can have a planar shape that is triangular, square, and / or straight. However, the embodiments of this disclosure are not necessarily limited to this.

[0096] Figure 7 It is along Figure 5 The cross-sectional view taken from line I-I'.

[0097] Reference Figure 5 and Figure 7 The dams (DAMs) can be arranged in the second region A2 of the base layer BL, and the resin layer RL can cover the upper surface of each of the dams (DAMs). For example, the thickness HT of the resin layer RL in either the first region A1 or the second region A2 can be greater than the height of each of the dams (DAMs).

[0098] For example, the thickness HT of the resin layer RL can be about 100 μm or less. Since the thickness HT of the resin layer RL covering the upper surface of the dam DAM in either the first region A1 or the second region A2 can be greater than the height of each of the dam DAMs, the height of each of the dam DAMs can be about 100 μm or less. For example, the height of each of the dam DAMs can be about 80 μm or less.

[0099] In this implementation, each of the dam DAMs can have the same height. For example, as... Figure 7 As shown, each of the dam DAMs can have the same height. (See below for reference.) Figure 8 and Figure 9 Describe dams (DAMs) with different heights.

[0100] exist Figure 7 In this description, the dam DAM is depicted as being disposed on the upper surface of the base layer BL, but embodiments of this disclosure are not necessarily limited to this. The dam DAM can also be disposed on the lower surface of the base layer BL. For example, when the base layer BL is a display panel (e.g., Figure 2 When using a display panel (DP), the dam DAM can be arranged on the display panel (e.g., DP). Figure 2 The upper and lower surfaces of the display panel (DP).

[0101] Figure 8 yes Figure 4 An enlarged plan view of the implementation method for region AA. Figure 9 It is along Figure 8 The cross-sectional view taken from line II-II'. (Refer to...) Figure 8 and Figure 9 Description and reference Figure 5 and Figure 7 The difference in the description may lie in the height of each in the dam DAM. Therefore, in the absence of a detailed description of the element with reference to this figure, it can be understood that the element is at least similar to the corresponding element described elsewhere in this disclosure.

[0102] Reference Figure 8 and Figure 9 The dam DAM may include the first dam DAM1, the second dam DAM2, and the third dam DAM3.

[0103] In this specification, the terms First Dam DAM1, Second Dam DAM2, and Third Dam DAM3 are introduced to distinguish three randomly selected dams within a Dam DAM. For example, in this specification, the three randomly selected dams within a Dam DAM are distinguished according to their proximity to a first region A1. For instance, Third Dam DAM3 may refer to the dam closest to the first region A1 among the three randomly selected dams, First Dam DAM1 may refer to the dam furthest from the first region A1 among the dams, and Second Dam DAM2 may refer to one of the dams other than First Dam DAM1 and Third Dam DAM3.

[0104] In the following description, embodiments of this disclosure will focus on... Figure 8 The first dam DAM1, the second dam DAM2, and the third dam DAM3 are randomly selected from the dams shown in the diagram.

[0105] exist Figure 8In the diagram, the first dam DAM1, the second dam DAM2, and the third dam DAM3 are shown arranged side-by-side in the second direction D2, but the embodiments of this disclosure are not necessarily limited to this. Each of the first dam DAM1, the second dam DAM2, and the third dam DAM3 may be spaced apart from each other in the first direction D1 and / or the second direction D2. For example, each of the first dam DAM1, the second dam DAM2, and the third dam DAM3 may be diagonally spaced apart from each other. For example, if the second dam DAM2 is arranged closer to the first region A1 of the foundation layer BL than the first dam DAM1, and the third dam DAM3 is arranged closer to the first region A1 of the foundation layer BL than the second dam DAM2, then it may correspond to an embodiment of this disclosure.

[0106] The first dam DAM1 may have a first height, the second dam DAM2 may have a second height, and the third dam DAM3 may have a third height. The first height, the second height, and the third height may be different from each other. For example, each of the first height, the second height, and the third height may be different from each other. However, the embodiments of this disclosure are not necessarily limited thereto. In another example, the first height may be different from the second height, and the second height may be the same as the third height.

[0107] In implementation, the second height may be greater than the first height, and the third height may be greater than the second height. For example, the height of any one of the dams DAMs may be less than or equal to the height of another dam DAM located closer to the first region A1. For example, as... Figure 9 As shown, the third height of the third dam DAM3 can be greater than the second height of the second dam DAM2, and the second height of the second dam DAM2 can be greater than the first height of the first dam DAM1.

[0108] The thickness HT of the resin layer RL can increase as it approaches the center of the first region A1. Therefore, since the dams in the dams DAM, which are arranged relatively closer to the first region A1, have a higher height, shrinkage of the resin layer RL in the direction of the first region A1 can be effectively prevented or reduced.

[0109] Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 and Figure 17 It shows the manufacturing process. Figure 9 A view of the method of dam and resin layer.

[0110] Reference Figure 10 and Figure 11 , Figure 11 It is along Figure 10The cross-sectional view taken by line III-III' shows that a first mask MK1 can be arranged on the first region A1 of the base layer BL, and a first surface treatment process can be performed only on the upper surface of the second region A2. The first surface treatment process can be a hydrophilic treatment process. For example, by performing the first surface treatment process only on the upper surface of the second region A2 of the base layer BL, the upper surface of the second region A2 can be relatively hydrophilic than the upper surface of the first region A1. The first surface treatment process can be a plasma-based treatment process.

[0111] Further reference Figure 12 and Figure 13 , Figure 13 It is along Figure 12 A cross-sectional view taken along line IV-IV' shows the application of dam resin PDAM to the upper surface of the second region A2, to which the first surface treatment process has been completed. When the dam resin PDAM is cured, a dam (e.g., Figure 14 Dam DAM). For example, dam resin PDAM can be composed of components related to dams (e.g., Figure 14 The dam (DAM) is made of the same material as the dam (e.g., Figure 14 The preparatory components of the dam (DAM).

[0112] The dam resin PDAM may include a first dam resin PDAM1, a second dam resin PDAM2, and a third dam resin PDAM3. The second dam resin PDAM2 may be formed closer to the first region A1 than the first dam resin PDAM1, and the third dam resin PDAM3 may be formed closer to the first region A1 than the second dam resin PDAM2.

[0113] In some embodiments, each of the dam resin PDAMs may have a different height. For example, the height of the second dam resin PDAM2 may be greater than the height of the first dam resin PDAM1. The height of the third dam resin PDAM3 may be greater than the height of the second dam resin PDAM2. However, the embodiments of this disclosure are not necessarily limited thereto. Some of the dam resin PDAMs may have the same height, while other portions of the dam resin PDAMs may have different heights.

[0114] In this embodiment, the contact angle formed between each of the dam resin PDAMs and the upper surface of the base layer BL can be about 90 degrees or less. For example, the contact angle formed between each of the dam resin PDAMs and the upper surface of the base layer BL can be about 80 degrees or less. Since the upper surface of the second region A2 of the base layer BL is hydrophilic through the first surface treatment process, the upper surface of the base layer BL and each of the dam resin PDAMs can be stably formed with contact angles.

[0115] In one embodiment, the dam resin PDAM can be formed by inkjet printing. However, the embodiments disclosed herein are not necessarily limited to this. The dam resin PDAM can be formed on the second region A2 by electrohydrodynamic (EHD) printing, nano-implantation, dispenser processes, etc.

[0116] Further reference Figure 14 The dam resin PDAM can be cured. Because the dam resin PDAM is cured, a first dam DAM1, a second dam DAM2, and a third dam DAM3 can be formed. For example, the first dam resin PDAM1 can be cured to form the first dam DAM1, the second dam resin PDAM2 can be cured to form the second dam DAM2, and the third dam resin PDAM3 can be cured to form the third dam DAM3. Figure 13 In this context, because the heights of the first dam resin PDAM1, the second dam resin PDAM2, and the third dam resin PDAM3 are different, the height of each of the first dam PDAM1, the second dam PDAM2, and the third dam PDAM3 can also be different. However, as... Figure 7 As shown, each of the dams in the DAM can have the same height.

[0117] Further reference Figure 15 A second mask MK2 can be disposed on the second region A2 of the base layer BL, and a second surface treatment process can be performed only on the upper surface of the first region A1. The second surface treatment process can be substantially the same as the first surface treatment process. For example, the second surface treatment process can be a surface treatment process that uses plasma to make the upper surface of the first region A1 hydrophilic.

[0118] For example, after the second surface treatment process, the surface properties of each of the upper surfaces of the first region A1 and the second region A2 of the base layer BL can be substantially the same. For example, by performing the second surface treatment process on the first region A1 of the base layer BL and the first surface treatment process on the second region A2 of the base layer BL, both the upper surfaces of the first region A1 and the second region A2 can be hydrophilic. Because both the upper surfaces of the first region A1 and the second region A2 are hydrophilic, the resin layer (e.g., Figure 17 The resin layer (RL) can be stably formed on the upper surface of the base layer BL.

[0119] Further reference Figure 16 and Figure 17 The main resin MR can be applied to the first region A1 and the second region A2 of the base layer BL. The main resin MR may include the same material as the dam resin PDAM. For example, the main resin MR may include urethane resin, acrylic resin, and epoxy resin. These may be used alone or in combination with each other. However, embodiments of this disclosure are not necessarily limited thereto.

[0120] In this embodiment, after performing the second surface treatment process, the contact angles formed by the main resin MR with each of the upper surfaces of the first region A1 and the second region A2 can be substantially the same. For example, the upper surfaces of the first region A1 and the second region A2 are made hydrophilic through substantially the same process, such that the upper surfaces of the first region A1 and the second region A2 have substantially the same surface properties.

[0121] Subsequently, the main resin MR can be cured to form such as Figure 17 The resin layer RL is shown. As the main resin MR cures, the main resin MR can shrink in the direction of the first region A1. For example, the resin layer RL can be formed to partially shrink in the direction of the first region A1.

[0122] However, since the dam DAM is formed in the second region A2, resistance to the shrinkage of the main resin MR in the direction of the first region A1 can occur when the main resin MR shrinks. Therefore, the shrinkage of the main resin MR can be prevented or reduced. Therefore, the planar area of ​​the resin layer RL, which is resisted by the dam DAM, can be increased compared to any resin layer formed without the dam DAM. Therefore, when the polymer layer (e.g., Figure 2 When the polymer layer (POL) is attached to the base layer BL, the polymer layer (POL) can be stably attached. Furthermore, this can improve the performance of the display device (e.g., Figure 1 The external display quality of the display device (DD).

[0123] Figure 18 yes Figure 4 An enlarged plan view of the implementation of region AA. For example, due to the planar shape of dam DAM, refer to... Figure 18 Description and reference Figure 5 The description is the same as that in this figure, and therefore, in the absence of a detailed description of the element, it can be understood that the element is at least similar to the corresponding element described elsewhere in this disclosure.

[0124] Reference Figure 4 and Figure 18 The dam DAMs can be arranged in the second region A2 of the base layer BL. The dam DAMs can be arranged randomly (e.g., without an observable pattern) or regularly.

[0125] In the implementation, the planar shape of each in the dam DAM can be as follows: Figure 18 The diagram shown is circular. However, embodiments of this disclosure are not necessarily limited to this. The planar shape of each of the dams in the DAM may include various shapes such as elliptical or rectangular shapes.

[0126] Figure 19 It is shown Figure 2A plan view of the implementation of the basic layer included in it. For example, in addition to the dam DAM, refer to Figure 19 The description can be compared with Figure 4 The descriptions in the figures are substantially the same. Therefore, in the absence of a detailed description of the element with reference to the figure, it can be understood that the element is at least similar to the corresponding element described elsewhere in this disclosure.

[0127] Reference Figure 19 Each of the dam DAMs can extend primarily in one direction within the second region A2 of the base layer BL. For example, two dam DAMs spaced apart on either side of the first region A1 and in the second direction D2 can extend in the first direction D1. For example, two dam DAMs spaced apart on either side of the first region A1 and in the first direction D1 can extend in the second direction D2. For example, with Figure 4 The dam shown is different from the DAM shown. Figure 19 Each of the dams DAM shown can extend on one side of the second region A2 in either the first direction D1 or the second direction D2.

[0128] However, the embodiments disclosed herein are not necessarily limited thereto. Figure 19 In the diagram, each of the dam DAMs is shown as disconnected at a corner, but each of the dam DAMs may be connected at a corner of the second region A2. For example, each of the dam DAMs may be formed integrally without separating from each other.

[0129] Figure 20 yes Figure 19 A magnified plan view of region BB. Figure 21 It is along Figure 20 A cross-sectional view of the embodiment with line V-V' cut off. Figure 22 It is along Figure 20 A cross-sectional view of the embodiment with line V-V' cut off.

[0130] For example, in addition to the planar shape of the dam DAM, refer to Figure 20 The description can be compared with the reference. Figure 8 The description is the same. In addition, besides the cross-sectional shape of the dam DAM, refer to... Figure 21 and Figure 22 The description can be compared with the reference. Figure 9 The description is the same. Therefore, in the absence of a detailed description of the element with reference to the figure, it can be understood that the element is at least similar to the corresponding element described elsewhere in this disclosure.

[0131] Reference Figure 20 and Figure 21One of the dams (DAMs) can be arranged in the second region A2 of the base layer BL, extending in the first direction D1. The upper surface of the dam (DAM) can be flat. For example, regardless of its position in the second direction D2, the upper surface of the dam (DAM) can be at the same height on the upper surface of the base layer BL.

[0132] Further reference Figure 22 The cross-sectional shape of the dam DAM can have a shape that increases in the direction approaching the first region A1. For example, one of the dam DAMs can have a first dam DAM1, a second dam DAM2, and a third dam DAM3. Figure 22 As shown, the first dam DAM1, the second dam DAM2, and the third dam DAM3 can be arranged adjacent to each other. For example, the first dam DAM1, the second dam DAM2, and the third dam DAM3 can be formed integrally. By increasing the height of the dam DAMs in the direction close to the first region A1, shrinkage that occurs during the formation of the resin layer RL can be effectively prevented or reduced.

[0133] The structures and techniques described in this disclosure are applicable to display devices and electronic devices that include display devices. For example, this disclosure is applicable to high-resolution display smartphones, mobile phones, smart panels, smartwatches, tablet computers, vehicle navigation systems, televisions, computer monitors, laptop computers, etc.

[0134] Although this disclosure has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit or scope of this disclosure.

[0135] Figure 23 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0136] Reference Figure 1 and Figure 23 The display device DD according to the embodiment can be applied to various electronic devices 10. The electronic device 10 according to the embodiment may include the display device DD, and may also include modules or devices with additional functions in addition to the display device DD.

[0137] The electronic device 10 may include a display module 11, a processor 12, a memory 13, and a power module 14.

[0138] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0139] The memory 13 can store data information required for the operation of the processor 12 or the display module 11. When the processor 12 executes the application stored in the memory 13, image data signals and / or input control signals are sent to the display module 11, and the display module 11 can process the received signals and output image information through the display screen.

[0140] The power module 14 may include a power supply module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device 10.

[0141] At least one of the components of the electronic device 10 described above may be included in the display device DD according to the above embodiment. Furthermore, some individual modules that are functionally included in one module may be included in the display device DD, while other components may be disposed separately from the display device DD. For example, the display device DD may include a display module 11, and the processor 12, memory 13, and power module 14 may be disposed in the form of other devices within the electronic device 10 besides the display device DD.

[0142] Figure 24 It is based on Figure 23 Schematic diagrams of electronic devices in various embodiments.

[0143] Reference Figure 23 and Figure 24 The various electronic devices 10 that utilize the display device DD according to the embodiments may include not only image display electronic devices such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, TVs 10_1d, and desktop monitors 10_1e, but also wearable electronic devices with display modules, such as smart glasses 10_2a, head-mounted displays 10_2b, and smartwatches 10_2c, as well as vehicle electronic devices 10_3 with display modules, such as CID (Central Information Display) arranged on the dashboard, central trim panel or dashboard, and interior mirror displays of automobiles.

[0144] However, this is exemplary, and the electronic device 10 according to embodiments of this disclosure is not necessarily limited thereto. For example, the electronic device 10 may be implemented as a mobile phone, video phone, smartboard, smartwatch, tablet PC, vehicle display, computer monitor, laptop computer, head-mounted display device, etc. Furthermore, the electronic device 10 may be a television, monitor, laptop computer, or tablet computer. Additionally, the electronic device 10 may be an automobile.

Claims

1. A display device, comprising: A base layer, the base layer comprising a first region and a second region adjacent to the first region; The first dam is arranged in the second region on the foundation layer; The second dam is arranged in the second region on the foundation layer, the second dam is spaced apart from the first dam, and comprises the same material as the first dam; as well as A resin layer, disposed on the base layer, comprising the same material as the first dam and the second dam, and covering the upper surface of each of the first dam and the second dam.

2. The display device according to claim 1, wherein, The base layer includes a display panel, which includes light-emitting diodes.

3. The display device according to claim 1, wherein, The second dam is positioned closer to the first region of the foundation layer than the first dam.

4. The display device according to claim 3, wherein, The first dam has a first height, and the second dam has a second height, and The first height of the first dam is different from the second height of the second dam.

5. The display device according to claim 4, wherein, The second height is greater than the first height.

6. The display device according to claim 4, wherein, Each of the first height of the first dam and the second height of the second dam is 100 μm or less.

7. The display device according to claim 1, wherein, The planar shape of each of the first dam and the second dam is either polygonal or circular.

8. The display device according to claim 1, wherein, The base layer is arranged with the upper surfaces of the first dam and the second dam being hydrophilic.

9. The display device according to claim 1, wherein, Each of the first dam and the second dam comprises urethane resin, acrylic resin and / or epoxy resin.

10. The display device according to claim 1, wherein, The planar area of ​​the resin layer is 95% or more of the planar area of ​​the base layer.

11. The display device according to claim 1, wherein, The width of the second region is 5 mm or less.

12. A method for manufacturing a display device, comprising: A first surface treatment process is performed on the upper surface of the second region of the base layer, the base layer including a first region and a second region adjacent to the first region; Apply the dam resin to the second region of the base layer; The dam resin is cured to form a first dam and a second dam spaced apart from the first dam; A main resin comprising the same material as the dam resin is applied to the first and second regions of the base layer; as well as The main resin is cured to form a resin layer covering the upper surfaces of the first dam and the second dam.

13. The method according to claim 12, wherein, Performing the first surface treatment process includes performing a hydrophilic treatment process on the upper surface of the second region of the base layer.

14. The method according to claim 12, wherein, When the first dam and the second dam are formed, the second dam is formed closer to the first region of the base layer than the first dam.

15. The method according to claim 14, wherein, The first dam has a first height, and the second dam has a second height, and The second height of the second dam is different from the first height of the first dam.

16. The method according to claim 15, wherein, The second height of the second dam is greater than the first height of the first dam.

17. The method of claim 12, further comprising: Before applying the main resin, a second surface treatment process is performed on the upper surface of the first region of the base layer.

18. The method according to claim 17, wherein, Performing the second surface treatment process includes performing a hydrophilic treatment process on the upper surface of the first region of the base layer.

19. The method of claim 17, wherein, Each of the first surface treatment process and the second surface treatment process is a plasma treatment process.

20. The method according to claim 12, wherein, When applying the dam resin The dam resin is applied by inkjet printing.

21. An electronic device comprising: Display device; as well as A processor configured to drive the display device, and The display device includes: A base layer, the base layer comprising a first region and a second region adjacent to the first region; The first dam is arranged in the second region on the foundation layer; The second dam is arranged in the second region on the foundation layer. The second dam is spaced apart from the first dam and comprises the same material as the first dam; and A resin layer, disposed on the base layer, comprising the same material as the first dam and the second dam, and covering the upper surface of each of the first dam and the second dam.

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