High temperature reflow soldering shunt control system and heating apparatus

Abstract

The technical scheme of the present application high-temperature reflow soldering shunt control system comprises: a programmable controller, a plurality of groups of resistance wires and the same number of high-frequency low-voltage solid-state relays as the groups of resistance wires; the programmable controller is connected with a plurality of high-frequency low-voltage solid-state relays, and each high-frequency low-voltage solid-state relay is connected with a group of resistance wires; the programmable controller is used for alternately and cyclically outputting a heating signal to each high-frequency low-voltage solid-state relay when the temperature of the temperature control module starts to drop; and the high-frequency low-voltage solid-state relay is used for controlling the connected resistance wire to heat the temperature control module when the heating signal is received. The programmable controller controls the high-frequency low-voltage solid-state relay, and then the high-frequency low-voltage solid-state relay controls different groups of resistance wires to cyclically heat, so that the purpose of shunt is achieved, the current fluctuation is reduced, the power consumption is reduced, and the impact on the power grid is reduced.

Description

Technical Field

[0001] This invention relates to the field of high-temperature heating technology, and in particular to a high-temperature reflow soldering current distribution control system and heating equipment. Background Technology

[0002] Existing high-temperature reflow soldering temperature control systems are controlled by temperature controllers or temperature modules. When the temperature begins to drop, the temperature controller or temperature control module outputs a signal to control a solid-state relay to heat the equipment. Due to the high power, the current fluctuation is large, the power consumption is also large, which will impact the power grid and require high-quality wiring. If the furnace has a starting power of 100KW, all components will start up when the machine is turned on, resulting in high power and high current.

[0003] When the equipment reaches a constant temperature and needs additional heat, the existing control method calculates the total heating power of the equipment by using PID calculation. After the heating equipment is turned on, the current fluctuates between 30-150A, which has a significant impact on the power grid, requires higher-grade wiring, and results in high energy consumption. Summary of the Invention

[0004] The main objective of this invention is to propose a high-temperature reflow soldering current distribution control system and heating equipment, which aims to solve the problem of not being able to collect optical signals at each node in real time, thus making it impossible to monitor the status of the optical path.

[0005] To achieve the above objectives, the present invention proposes a high-temperature reflow soldering current shunt control system, which includes: a programmable controller, multiple sets of resistance wires, and a high-frequency low-voltage solid-state relay with the same number of resistance wire sets.

[0006] The programmable controller is connected to a plurality of the high-frequency low-voltage solid-state relays, and each of the high-frequency low-voltage solid-state relays is connected to a set of the resistance wires;

[0007] The programmable controller is used to alternately and cyclically output heating signals to each of the high-frequency low-voltage solid-state relays when the temperature of the temperature control module begins to drop.

[0008] The high-frequency low-voltage solid-state relay is used to control the heating of the temperature control module by connecting the resistance wire when the heating signal is received.

[0009] In one embodiment, the programmable controller is configured to control the output duration of the heating signal according to a user command.

[0010] In one embodiment, the resistance wire is divided into multiple groups, and each group of resistance wires is arranged on the heating plate in an up-down order.

[0011] In one embodiment, the resistance wires in each group are arranged on the heating plate in a matrix order.

[0012] In one embodiment, each set of resistance wires includes a heating resistance wire and a connecting resistance wire;

[0013] The connecting resistance wires are arranged at both ends of the heating resistance wire, and each group of resistance wires is arranged in a row on the heating plate;

[0014] The connecting resistance wire is always in a heated state.

[0015] In one embodiment, the programmable controller is configured to output heating signals sequentially to each of the high-frequency low-voltage solid-state relays in the heating sequence when heating begins, wherein the duration of each heating signal output decreases sequentially.

[0016] In one embodiment, the programmable controller is configured to alternately and cyclically output heating signals to each of the high-frequency low-voltage solid-state relays during temperature maintenance, wherein the duration of the heating signal output to each of the high-frequency low-voltage solid-state relays is different.

[0017] In one embodiment, the high-temperature reflow soldering shunt control system further includes: a heating solid-state relay;

[0018] The heating solid-state relay is connected to the high-frequency low-voltage solid-state relay and each of the resistance wires respectively;

[0019] The high-frequency low-voltage solid-state relay is used to generate and send a conduction signal to the negative terminal of the heating solid-state relay when the heating signal is received.

[0020] The heating solid-state relay is used to connect each of the resistance wires and the power supply when the conduction signal is received.

[0021] In one embodiment, the number of high-frequency low-voltage solid-state relays is two to four.

[0022] The present invention also proposes a heating device, which includes a high-temperature reflow soldering shunt control system as described above.

[0023] The technical solution of this invention, a high-temperature reflow soldering current shunting control system, includes: a programmable controller, multiple sets of resistance wires, and a number of high-frequency low-voltage solid-state relays equal to the number of resistance wire sets. The programmable controller connects to multiple high-frequency low-voltage solid-state relays, and each high-frequency low-voltage solid-state relay connects to one set of resistance wires. The programmable controller is used to alternately and cyclically output heating signals to each of the high-frequency low-voltage solid-state relays when the temperature of the temperature control module begins to decrease. Upon receiving the heating signal, the high-frequency low-voltage solid-state relays control the heating of the temperature control module via the connected resistance wires. By controlling the high-frequency low-voltage solid-state relays through the programmable controller, and then using the high-frequency low-voltage solid-state relays to control the cyclic heating of different sets of resistance wires, the current shunting purpose is achieved, reducing current fluctuations and power consumption by approximately 15%-20%, thus reducing the impact on the power grid. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0025] Figure 1 A schematic diagram of a module of an embodiment of the high-temperature reflow soldering current distribution control system provided by the present invention;

[0026] Figure 2 A schematic diagram of the structure of the second embodiment of the high-temperature reflow soldering current distribution control system provided by the present invention;

[0027] Figure 3 A schematic diagram of the third embodiment of the high-temperature reflow soldering current distribution control system provided by the present invention;

[0028] Figure 4 This is a schematic diagram of the module of the third embodiment of the high-temperature reflow soldering current distribution control system provided by the present invention.

[0029] Explanation of icon numbers:

[0030]

[0031] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0034] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0035] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0036] The principle of high-temperature reflow soldering is to heat the soldering area to a temperature above the melting point of the solder paste, causing the solder paste to melt and form a reliable solder joint with the soldering area. During the reflow soldering process, the soldering material is transported to the printed circuit board (PCB) via a conveyor belt or hot air equipment to a designated temperature area. The high temperature melts the soldering material, thereby achieving mechanical and electrical connections between the components and the PCB.

[0037] Existing high-temperature reflow soldering temperature control systems are controlled by temperature controllers or temperature modules. When the temperature begins to drop, the temperature controller or temperature control module outputs a signal to control a solid-state relay to heat the equipment. Due to the high power, the current fluctuation is large, the power consumption is also large, which will impact the power grid and require high-quality wiring. If the furnace has a starting power of 100KW, all components will start up when the machine is turned on, resulting in high power and high current.

[0038] When the equipment reaches a constant temperature and needs additional heat, the existing control method calculates the total heating power of the equipment by using PID calculation. After the heating equipment is turned on, the current fluctuates between 30-150A, which has a significant impact on the power grid, requires higher-grade wiring, and results in high energy consumption.

[0039] Please see Figure 1 This invention proposes a high-temperature reflow soldering current shunt control system, comprising: a programmable controller 10, multiple sets of resistance wires 30, and a number of high-frequency low-voltage solid-state relays 20 equal to the number of resistance wire sets; the programmable controller 10 is connected to multiple high-frequency low-voltage solid-state relays, and each high-frequency low-voltage solid-state relay is connected to a set of resistance wires; the programmable controller 10 is used to alternately and cyclically output heating signals to each of the high-frequency low-voltage solid-state relays 20 when the temperature of the temperature control module begins to drop; the high-frequency low-voltage solid-state relays 20 are used to control the heating of the temperature control module by the resistance wires connected to them when they receive the heating signals.

[0040] Understandably, to reduce the impact of current on the power grid and lower electricity consumption, it is necessary to control the current during heating by diverting it. The programmable controller 10 controls multiple high-frequency, low-voltage solid-state relays 20 to start in turn, diverting the current for equipment heating. Taking the same 100KW equipment as an example, this application can start the equipment by diverting the current in stages, controlling the number of heating resistance wires in the deheating zone through software, and gradually increasing the temperature! This application also adopts a new control method through the programmable controller 10. Through diverting control, the current can be controlled to fluctuate between 50-80A for the same power, resulting in less impact on the power grid, reduced stress on wires and cables, and energy savings of 15-20%.

[0041] Optionally, the high-frequency low-voltage solid-state relay 20 can be controlled by the programmable controller 10, and then the high-frequency low-voltage solid-state relay 20 can be used to control the cyclic heating of different groups of resistance wires to achieve the purpose of current diversion, reduce current fluctuations, reduce power consumption by about 15%-20%, and reduce the impact on the power grid. The programmable controller shown can be a PID controller or a PLC.

[0042] It should be noted that a resistance wire is a thin, long, filamentous metal conductor made of a specific material with high resistivity, primarily used to limit current or generate heat. When current passes through the resistance wire, a voltage drop occurs due to its resistance, converting electrical energy into heat energy, thereby achieving temperature regulation. Multiple resistance wires 30 form a resistance wire group 300, and each high-frequency, low-voltage solid-state relay 20 is connected to one of the resistance wire groups 300 to control the opening and closing of the connected resistance wire groups 300.

[0043] Specifically, the high-frequency low-voltage solid-state relay 20 (SSR) is a contactless switch composed of microelectronic circuits, discrete electronic devices, and power electronic devices. It achieves contactless and spark-free connection and disconnection of circuits. The high-frequency low-voltage solid-state relay 20 can operate stably at higher frequencies, with fast response and high-frequency switching; it requires lower voltage for its input control signal; compared to traditional electromagnetic relays, the high-frequency low-voltage solid-state relay 20 has a smaller size and lighter weight, making it easier to install and carry; solid-state relays are less susceptible to external interference and have a certain degree of anti-interference capability, enabling stable operation in harsh environments.

[0044] The programmable controller 10 is used to control the output duration of the heating signal according to the user's command.

[0045] Understandably, to address the issue of excessive current, current diversion is implemented in the software. The diversion method involves writing a current diversion program into the programmable controller 10, which outputs heating signals to multiple high-frequency, low-voltage solid-state relays 20. The output duration of the heating signal to each high-frequency, low-voltage solid-state relay 20 is different, and the heating duration of each high-frequency, low-voltage solid-state relay 20 connected to different resistance wire groups 300 also varies. The program in the programmable controller 10 can be programmed according to user commands to change the heating duration of each resistance wire group 300, or to select different resistance wire groups 300 for heating.

[0046] In this embodiment, when the temperature of the temperature control module begins to drop, the programmable controller 10 alternately and cyclically outputs heating signals to each of the high-frequency low-voltage solid-state relays. The duration of each heating signal is different. When the high-frequency low-voltage solid-state relay 20 receives the heating signal, it controls the connected resistance wire to heat the temperature control module, thereby controlling multiple resistance wire groups 300 to heat the temperature control module in turn. The duration of each resistance wire group 300 in turn is also controlled by the programmable controller 10.

[0047] like Figure 2 The diagram shown is a structural schematic of the second embodiment of the high-temperature reflow soldering current distribution control system proposed in this embodiment.

[0048] Based on the first embodiment described above, a second embodiment of the high-temperature reflow soldering current distribution control system of the present invention is proposed.

[0049] The resistance wires are divided into multiple groups, and each group of resistance wires is placed on the heating plate in an up-down arrangement.

[0050] Understandably, all the resistance wires 30 are set on the heating plate. The resistance wires 30 can be evenly divided into multiple resistance wire groups 300. Assuming there are 10 resistance wires, they are evenly divided into two groups. The first group of resistance wires 300-1 is arranged above the heating plate, and the second group of resistance wires 300-2 is arranged below the heating plate.

[0051] Each set of resistance wires includes a heating resistance wire and a connecting resistance wire; the connecting resistance wires are arranged at both ends of the heating resistance wire, and each set of resistance wires is arranged in a row on the heating plate; the connecting resistance wires are always in a heated state.

[0052] Understandably, in practical applications, the first and last connecting resistance wires 30-1 of the two rows are always working and do not need to participate in alternating heating. This is because the solder is always cold when it enters the heating zone, resulting in high heat absorption. To maintain a constant temperature, the connecting resistance wires 30-1 need to be continuously heated. Figure 2 As shown, the resistance wires in each resistance wire group 300 are arranged in a uniform row.

[0053] The programmable controller is configured to output heating signals sequentially to each of the high-frequency low-voltage solid-state relays 20 according to the heating sequence when heating begins, wherein the duration of each heating signal output decreases sequentially.

[0054] The programmable controller is used to alternately and cyclically output heating signals to each of the high-frequency low-voltage solid-state relays 20 when maintaining the temperature, wherein the duration of the heating signal output to each of the high-frequency low-voltage solid-state relays is different.

[0055]

[0056] Understandably, for example, with a total of 10 resistance wires 30, arranged in two rows of five each, they can be energized alternately, and the heating time for each segment can be set (ms). The first high-frequency low-voltage solid-state relay 20 is connected to the first group of resistance wires 300-1, and the second high-frequency low-voltage solid-state relay 20 is connected to the second group of resistance wires 300-2.

[0057] It should be noted that, as shown in the table above, after startup, when heating begins, the programmable controller 10 outputs a 900ms heating signal to the first high-frequency low-voltage solid-state relay 20, causing the first high-frequency low-voltage solid-state relay 20 to control the first group of resistance wires 300-1 to heat for 900ms. Then, the programmable controller 10 outputs an 800ms heating signal to the second high-frequency low-voltage solid-state relay 20, which controls the second group of resistance wires 300-2 to heat for 800ms. The first group of resistance wires 300-1 then heats for 900ms, followed by the second group of resistance wires 300-2 heating for 800ms, and this cycle repeats. The first group of resistance wires 300-1 and the second group of resistance wires 300-2 are heated cyclically until the temperature reaches a constant level.

[0058] Specifically, as shown in the table above, after the temperature is constant, during temperature maintenance, the programmable controller 10 outputs a 400ms heating signal to the first high-frequency low-voltage solid-state relay 20, causing the first high-frequency low-voltage solid-state relay 20 to control the first group of resistance wires 300-1 to heat for 400ms. Then, the programmable controller 10 outputs a 300ms heating signal to the second high-frequency low-voltage solid-state relay 20, which controls the second group of resistance wires 300-2 to heat for 300ms. The first group of resistance wires 300-1 is then heated for 400ms, followed by the second group of resistance wires 300-2 being heated for 300ms, and this cycle repeats. The first group of resistance wires 300-1 and the second group of resistance wires 300-2 are heated cyclically until the temperature is constant.

[0059] Optionally, the duration of each heating signal output by the programmable controller 10 decreases sequentially according to the heating sequence, and the duration of the heating signal output to different high-frequency low-voltage solid-state relays is different because the welding material absorbs more heat when it is turned on first, so the heating time is longer.

[0060] In this embodiment, all resistance wires 30 are mounted on the heating plate. The resistance wires 30 can be divided into multiple resistance wire groups 300, with the resistance wires in each group arranged in a row. The resistance wires in each group can be arranged vertically on the heating plate. At the start of heating, the first group of resistance wires 300-1 is heated for 900ms, then the second group of resistance wires 300-2 is heated for 800ms, then the first group of resistance wires 300-1 is heated for 900ns, and this cycle repeats until a constant temperature is reached. After reaching a constant temperature, the first group of resistance wires 300-1 is heated for 400ms, then the second group of resistance wires 300-2 is heated for 300ms, then the first group of resistance wires 300-1 is heated for 400ns, and this cycle repeats. By grouping and heating the resistance wires, current diversion is achieved, reducing current fluctuations and lowering power consumption by approximately 15%-20%, thus reducing the impact on the power grid.

[0061] like Figure 3 and Figure 4 As shown, Figure 3 This is a schematic diagram of the third embodiment of the high-temperature reflow soldering current distribution control system provided by the present invention. Figure 4 This is a schematic diagram of the module of the third embodiment of the high-temperature reflow soldering current distribution control system provided by the present invention.

[0062] Based on the first and / or second embodiments described above, a third embodiment of the high-temperature reflow soldering current distribution control system of the present invention is proposed.

[0063] The resistance wires in each group are arranged in a matrix order on the heating plate.

[0064] It is understandable that, such as Figure 3 As shown, there are 20 resistance wires, evenly divided into four groups. Resistance wire group 1 301 is arranged in the upper left of the heating plate, resistance wire group 2 302 is arranged in the lower left of the heating plate, resistance wire group 303 is arranged in the upper right of the heating plate, and resistance wire group 304 is arranged in the lower right of the heating plate. The four groups of resistance wires 300 are arranged in a matrix array.

[0065] It should be noted that the duration of each heating signal output by the programmable controller 10 decreases sequentially according to the heating sequence, and the duration of the heating signal output to different high-frequency low-voltage solid-state relays is not the same.

[0066] The number of high-frequency low-voltage solid-state relays is two to four.

[0067] Understandably, two or three resistance wire groups are arranged vertically at 300, and four resistance wire groups are arranged in a matrix of 300. When there are more than four resistance wire groups, the heating speed and efficiency of the cyclic heating may decrease. Therefore, each resistance wire group is connected to a high-frequency low-voltage solid-state relay, so there are also two to four high-frequency low-voltage solid-state relays.

[0068] like Figure 4 As shown, the high-temperature reflow soldering shunt control system further includes: a heating solid-state relay 40; the heating solid-state relay 40 is connected to the high-frequency low-voltage solid-state relay and each of the resistance wires respectively; the high-frequency low-voltage solid-state relay is used to generate and send a conduction signal to the negative terminal of the heating solid-state relay when the heating signal is received; the heating solid-state relay 40 is used to connect each of the resistance wires and the power supply when the conduction signal is received.

[0069] Understandably, the traditional solution involves keeping the negative terminal of the heating solid-state relay 40 constantly energized, while the PID controller controls the positive terminal of the heating solid-state relay 40. This solution uses the aforementioned high-frequency, low-voltage solid-state relay to control the negative terminal of the heating solid-state relay 40. Even if the positive terminal of the heating solid-state relay 40 is constantly energized, it will not operate; instead, the state of the negative terminal of the heating solid-state relay 40 needs to be monitored, thus minimizing current fluctuations. For example, a single temperature zone has a power of 8KW-10KW, and high-temperature reflow soldering includes 20-32 temperature zones; the power required for traditional heating would be considerably higher.

[0070] In this embodiment, a high-frequency low-voltage solid-state relay is used to control the negative terminal of the heating solid-state relay to switch it on and off, thereby controlling the heating temperature control module of the resistance wire group. This application uses a programmable controller to control the high-frequency low-voltage solid-state relay. The high-frequency low-voltage solid-state relay 20 controls the negative terminal of the heating solid-state relay 40, so that the positive terminal of the heating solid-state relay does not work even if it is energized, thereby achieving the purpose of current diversion, reducing current fluctuations, reducing power consumption by about 15%-20%, and reducing the impact on the power grid.

[0071] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0072] The present invention also proposes a heating device, which includes a high-temperature reflow soldering current distribution control system. The specific structure of the high-temperature reflow soldering current distribution control system is as described in the above embodiments. Since the heating device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0073] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A high-temperature reflow soldering current shunting control system, characterized in that, include: A programmable controller, multiple sets of resistance wires, and a high-frequency, low-voltage solid-state relay with the same number of resistance wire sets; The programmable controller is connected to a plurality of the high-frequency low-voltage solid-state relays, and each of the high-frequency low-voltage solid-state relays is connected to a set of the resistance wires; The programmable controller is used to alternately and cyclically output heating signals to each of the high-frequency low-voltage solid-state relays when the temperature of the temperature control module begins to drop. The high-frequency low-voltage solid-state relay is used to control the temperature control module connected to the resistance wire to heat up when the heating signal is received. Each set of resistance wires includes a heating resistance wire and a connecting resistance wire; the connecting resistance wires are arranged at both ends of the heating resistance wires, and each set of resistance wires is arranged in a row on the heating plate; the connecting resistance wires are always in a heated state.

2. The high-temperature reflow soldering current distribution control system as described in claim 1, characterized in that, The programmable controller is used to control the output duration of the heating signal according to the user's command.

3. The high-temperature reflow soldering current distribution control system as described in claim 1, characterized in that, The resistance wires are divided into multiple groups, and each group of resistance wires is placed on the heating plate in an up-down arrangement.

4. The high-temperature reflow soldering current distribution control system as described in claim 3, characterized in that, The resistance wires in each group are arranged in a matrix order on the heating plate.

5. The high-temperature reflow soldering current distribution control system as described in claim 1, characterized in that, The programmable controller is configured to output heating signals sequentially to each of the high-frequency low-voltage solid-state relays according to the heating sequence when heating begins, wherein the duration of each heating signal output decreases sequentially.

6. The high-temperature reflow soldering current distribution control system as described in claim 1, characterized in that, The programmable controller is used to alternately and cyclically output heating signals to each of the high-frequency low-voltage solid-state relays when maintaining the temperature, wherein the duration of the heating signal output to each of the high-frequency low-voltage solid-state relays is different.

7. The high-temperature reflow soldering current distribution control system as described in claim 1, characterized in that, The high-temperature reflow soldering current shunt control system also includes: a heating solid-state relay; The heating solid-state relay is connected to the high-frequency low-voltage solid-state relay and each of the resistance wires respectively; The high-frequency low-voltage solid-state relay is used to generate and send a conduction signal to the negative terminal of the heating solid-state relay when the heating signal is received. The heating solid-state relay is used to connect each of the resistance wires and the power supply when the conduction signal is received.

8. The high-temperature reflow soldering current distribution control system as described in claim 1, characterized in that, The number of high-frequency low-voltage solid-state relays is two to four.

9. A heating device, characterized in that, The heating equipment includes the high-temperature reflow soldering shunt control system as described in any one of claims 1 to 8.

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