A method, device, and electronic device for displaying a temperature gun screen based on segmented refresh.

Abstract

This invention provides a method, device, and electronic device for displaying thermal images on a temperature gun screen based on segmented refresh, relating to the field of image processing technology for temperature measuring equipment. The method includes: performing step-by-step amplification of infrared image data at the original resolution using a bilinear interpolation model to obtain infrared image data at the target resolution; performing feature fusion of the infrared image data and the visible light image at the target resolution to obtain a fused image at the target resolution; calculating the pixel data corresponding to the current display block in the fused image at the target resolution, and sending the pixel data to the temperature gun screen for local refresh until the fused image at the target resolution is displayed on the temperature gun screen. This invention, through a segmented refresh mechanism, solves the technical bottleneck that small-buffer MCUs cannot drive high-resolution LCD screens, making it possible to implement complex thermal image fusion displays using domestically produced MCUs or general-purpose MCUs, thus reducing hardware material costs.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of temperature measurement device image processing technology, in particular to a temperature measurement gun screen display method and device based on segmented refresh and electronic equipment. BACKGROUND

[0002] At present, the core controller (MCU) of the temperature measurement gun on the market, especially the product with screen display function, needs sufficient cache space to store a complete screen image data to realize smooth display. For high-end temperature measurement guns with image fusion function, this demand is more urgent.

[0003] In order to meet this demand, the traditional design scheme usually adopts the following two paths: one is to select a high-performance MCU with built-in large-capacity SRAM, but such chips are high in cost; the second is to use an ordinary MCU with an independent video memory chip (such as AL422B which has been discontinued) or SDRAM. Although the SDRAM scheme can solve the problem, it will significantly increase the hardware cost (about 5-6 yuan) and the circuit board area, and more MCU pins are needed for connection, which is contrary to the current competitive situation of the temperature measurement gun market which is extremely sensitive to cost.

[0004] In addition, in actual use, the user usually needs to aim the temperature measurement gun at the temperature measurement area and keep it still for a short time, so there is no rigid demand for high refresh rate (such as above 60Hz) of the screen. This application feature provides the possibility of breaking through the hardware limit through software algorithm optimization.

[0005] Therefore, a temperature measurement gun screen display method and device based on segmented refresh and electronic equipment are proposed. SUMMARY

[0006] The present application provides a temperature measurement gun screen display method and device based on segmented refresh, which fundamentally solves the technical bottleneck that small cache MCUs cannot drive high-resolution LCD screens, making it possible to use cheap, resource-limited domestic MCUs or general-purpose MCUs to realize complex thermal image fusion display, greatly reducing the hardware material cost.

[0007] The present application provides a temperature measurement gun screen display method based on segmented refresh, comprising:

[0008] Obtain the original resolution infrared image data collected by the infrared array sensor and the visible light image collected by the visible light imaging device;

[0009] The original resolution infrared image data is enlarged by a two-line interpolation model to obtain the target resolution infrared image data;

[0010] cutting the visible light image to obtain a visible light image of a target resolution;

[0011] performing feature fusion on the infrared image data of the target resolution and the visible light image of the target resolution to obtain a fusion image of the target resolution;

[0012] logically dividing a screen of the temperature measuring gun into N display blocks, wherein N is an integer greater than 1, and a pixel data amount of a single display block does not exceed an MCU cache capacity of the temperature measuring gun;

[0013] calculating pixel data corresponding to a current display block in the fusion image of the target resolution, and sending the pixel data to the screen of the temperature measuring gun for local refreshing, and traversing all N display blocks until display of the fusion image of the target resolution on the screen of the temperature measuring gun is completed.

[0014] Optionally, the step of performing stepwise amplification on the infrared image data of the original resolution by using a bilinear interpolation model to obtain infrared image data of a target resolution comprises:

[0015] performing primary amplification on the infrared image data of the original resolution by using a bilinear interpolation model to obtain infrared image data of an intermediate resolution;

[0016] performing secondary amplification on the infrared image data of the intermediate resolution by using a bilinear interpolation model to obtain infrared image data of a target resolution according to a resolution of the screen of the temperature measuring gun.

[0017] Optionally, the step of performing primary amplification on the infrared image data of the original resolution by using a bilinear interpolation model to obtain infrared image data of an intermediate resolution comprises:

[0018] the infrared image data of the original resolution is 8x8 pixels;

[0019] the primary amplification is amplification by 8 times to obtain infrared image data of the intermediate resolution of 64x64 pixels.

[0020] Optionally, the step of cutting the visible light image to obtain a visible light image of a target resolution comprises:

[0021] cutting a visible light image of a target resolution from a central region of the visible light image.

[0022] Optionally, the step of performing feature fusion on the infrared image data of the target resolution and the visible light image of the target resolution comprises:

[0023] convert the infrared image data of the target resolution into an infrared grayscale image;

[0024] extract image features from the infrared grayscale image and the visible light image of the target resolution respectively;

[0025] merge temperature information of the infrared grayscale image and detail information of the visible light image of the target resolution based on the extracted image features to generate a fusion image.

[0026] Optionally, the screen of the temperature measurement gun is logically divided into N display blocks, comprising:

[0027] According to the total pixel data amount of the fusion image of the target resolution and the available cache capacity of the MCU, the maximum pixel data amount that a single display block can accommodate is calculated;

[0028] According to the maximum pixel data amount, the number of display blocks and the size of each display block are determined.

[0029] Optionally, the calculation of the pixel data corresponding to the current display block in the fusion image of the target resolution and the sending of the pixel data to the screen of the temperature measurement gun for local refresh comprises:

[0030] According to the coordinate position of the current display block on the screen, the pixel data of the corresponding area in the fusion image of the target resolution is extracted;

[0031] Through the display driver interface of the MCU, the extracted pixel data is directly written into the corresponding area of the video memory of the LCD screen, and local update of the area is triggered.

[0032] The present specification provides a temperature measurement gun screen display device based on segmented refresh, comprising:

[0033] An acquisition module is configured to acquire infrared image data of an original resolution collected by an infrared array sensor and a visible light image collected by a visible light imaging device;

[0034] An amplification module is configured to perform step-by-step amplification on the infrared image data of the original resolution through a double-line interpolation model to obtain infrared image data of a target resolution;

[0035] A cropping module is configured to crop the visible light image to obtain a visible light image of a target resolution;

[0036] A fusion module is configured to perform feature fusion on the infrared image data of the target resolution and the visible light image of the target resolution to obtain a fusion image of the target resolution;

[0037] The dividing module is configured to divide the temperature measuring gun screen logically into N display blocks, where N is an integer greater than 1, and the pixel data of a single display block does not exceed the MCU cache capacity of the temperature measuring gun.

[0038] The display module is configured to calculate the pixel data corresponding to the current display block in the fusion image of the target resolution, and send the pixel data to the temperature measuring gun screen for local refresh, and traverse all N display blocks until the display of the fusion image of the target resolution on the temperature measuring gun screen is completed.

[0039] Optionally, the amplification module comprises:

[0040] The original resolution infrared image data is amplified by a fixed multiple through a bilinear interpolation model to obtain intermediate resolution infrared image data;

[0041] The intermediate resolution infrared image data is amplified twice through a bilinear interpolation model according to the resolution of the temperature measuring gun screen to obtain target resolution infrared image data.

[0042] Optionally, the original resolution infrared image data is amplified by a fixed multiple through a bilinear interpolation model to obtain intermediate resolution infrared image data, comprising:

[0043] The original resolution infrared image data is 8x8 pixels;

[0044] The primary amplification by a fixed multiple is amplification by 8 times to obtain 64x64 pixel intermediate resolution infrared image data.

[0045] Optionally, the cropping module comprises:

[0046] The target resolution visible light image is obtained by cropping from the center region of the visible light image.

[0047] Optionally, the fusion module comprises:

[0048] The target resolution infrared image data is converted into an infrared grayscale image;

[0049] Image features are extracted from the infrared grayscale image and the target resolution visible light image, respectively;

[0050] Based on the extracted image features, the temperature information of the infrared grayscale image and the detail information of the target resolution visible light image are merged to generate a fusion image.

[0051] Optionally, the dividing module comprises:

[0052] According to the total pixel data amount of the fusion image of the target resolution and the available cache capacity of the MCU, the maximum pixel data amount that can be accommodated by a single display block is calculated;

[0053] According to the maximum pixel data amount, the number of display blocks and the size of each display block are determined.

[0054] Optionally, the display module comprises:

[0055] According to the coordinate position of the current display block on the screen, pixel data of the corresponding region is extracted from the fusion image of the target resolution;

[0056] The extracted pixel data is directly written to the corresponding region of the video memory of the LCD screen through the display driving interface of the MCU, and local update of the region is triggered.

[0057] The specification also provides an electronic device, wherein the electronic device comprises:

[0058] A processor; and a memory storing computer executable instructions, which when executed cause the processor to perform any of the above methods.

[0059] The specification also provides a computer readable storage medium, wherein the computer readable storage medium stores one or more programs, which when executed by a processor, implement any of the above methods.

[0060] In the present application, the technical bottleneck that a small cache MCU cannot drive a high-resolution LCD screen is fundamentally solved by the segmented refresh mechanism, making it possible to use cheap, resource-limited domestic MCUs or general-purpose MCUs to realize complex thermal image fusion display, greatly reducing the cost of hardware materials. The low-resolution infrared image is enlarged using the staged bilinear interpolation algorithm, avoiding the serious jaggedness and mosaic phenomenon caused by one-time enlargement from extremely low resolution to ultra-high resolution, making the infrared image profile smoother and the temperature field transition more natural. By center cutting instead of scaling the high-resolution visible light image, the matching with the screen size is ensured, the clarity of the original image is maximized, and the additional computational overhead caused by the scaling algorithm is avoided, improving the overall efficiency of the system. BRIEF DESCRIPTION OF DRAWINGS

[0061] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0062] Figure 1 A principle schematic diagram of a temperature measuring gun screen display method based on segmented refreshing provided by an embodiment of the present specification;

[0063] Figure 2 A structure schematic diagram of a temperature measuring gun screen display device based on segmented refreshing provided by an embodiment of the present specification;

[0064] Figure 3 A structure schematic diagram of an electronic device provided by an embodiment of the present specification;

[0065] Figure 4 A principle schematic diagram of a computer readable medium provided by an embodiment of the present specification. DETAILED DESCRIPTION

[0066] The following description is provided to enable those skilled in the art to carry out the present application. The preferred embodiments in the following description are only examples to implement the present application. Other obvious modifications can be made by those skilled in the art. The basic principles of the present application defined in the following description can be applied to other embodiments, modifications, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present application.

[0067] The following description is provided to enable those skilled in the art to carry out the present application. The preferred embodiments in the following description are only examples to implement the present application. Other obvious modifications can be made by those skilled in the art. The basic principles of the present application defined in the following description can be applied to other embodiments, modifications, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present application. Figures 1-4 Exemplary embodiments of the present application are described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present application are shown. The present application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. Like reference numerals refer to like elements throughout the specification.

[0068] In the embodiments described in the present specification, features, structures, characteristics or other details not falling within the technical concept of the present application can be combined in one or more other embodiments in a suitable manner.

[0069] In the description of the specific embodiments, the features, structures, characteristics or other details described in the present application are to enable those skilled in the art to fully understand the embodiments. However, it does not exclude that one or more of the specific features, structures, characteristics or other details can be practiced without the technical solution of the present application.

[0070] The flowcharts shown in the drawings are only exemplary descriptions and do not necessarily include all contents and operations / steps, nor do they have to be executed in the order described. For example, some operations / steps can be further divided, and some operations / steps can be combined or partially combined, so the actual execution order may be changed according to the actual situation.

[0071] The block diagrams shown in the drawings are merely functional entities and do not necessarily have to correspond to physically independent entities. That is, the functional entities can be implemented in the form of software, or in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0072] The term "and / or" or "and / or" includes all combinations of one or more of the associated listed items.

[0073] Figure 1 A schematic diagram of the principle of a segmented refresh-based temperature measurement gun screen display method provided by an embodiment of the present specification, which can include:

[0074] S110: Obtain raw resolution infrared image data collected by an infrared array sensor and visible light image data collected by a visible light imaging device;

[0075] In the detailed description of the present specification, the MCU of the temperature measurement gun reads 64 original temperature data points from an infrared array sensor (such as an 8x8 pixel thermocouple sensor) to form raw infrared image data; at the same time, a frame of visible light color image is obtained from a visible light imaging device (such as an OV series camera module with 480x640 pixels).

[0076] S120: Perform step-by-step magnification on the raw resolution infrared image data through a bilinear interpolation model to obtain infrared image data of a target resolution;

[0077] Optionally, the S120 includes:

[0078] Perform primary magnification of a fixed multiple on the raw resolution infrared image data through a bilinear interpolation model to obtain infrared image data of an intermediate resolution;

[0079] According to the resolution of the temperature measurement gun screen, perform secondary magnification on the infrared image data of the intermediate resolution through a bilinear interpolation model to obtain infrared image data of a target resolution.

[0080] In the detailed description of the present application, directly magnifying the original 8x8 low-resolution infrared data to a high-resolution such as 240x320 will cause serious distortion. Therefore, the present application adopts a two-step strategy. The first step (primary magnification): using the bilinear interpolation algorithm, the 8x8 image data is magnified by a fixed multiple, for example, 8 times, to obtain a 64x64 pixel intermediate-resolution infrared image. The purpose of this step is to increase the data volume to a moderate level, laying a good foundation for subsequent magnification. The second step (secondary magnification): the MCU reads the pre-stored or obtained through detection screen resolution parameters, for example, 240x320. Then, the bilinear interpolation algorithm is called again to calculate the scaling ratio required to magnify the 64x64 image to the target resolution (240x320) and perform magnification, finally obtaining high-quality target-resolution infrared image data.

[0081] Optionally, the primary magnification of the original-resolution infrared image data by a fixed multiple through the bilinear interpolation model to obtain intermediate-resolution infrared image data comprises:

[0082] The original-resolution infrared image data is 8x8 pixels;

[0083] The primary magnification by a fixed multiple is magnification by 8 times to obtain 64x64 pixel intermediate-resolution infrared image data.

[0084] In the detailed description of the present application, the original-resolution infrared image data comes from a standard 8x8 pixel infrared array sensor. Therefore, the primary magnification by a fixed multiple is specifically magnification by 8 times. Through bilinear interpolation calculation, the original 64 pixel points are interpolated and supplemented to generate an intermediate-resolution infrared image data (64x64 pixels) composed of 64 rows, 64 columns, and a total of 4096 pixel points. This 64x64 intermediate image has a preliminary outline in vision, and its data volume is still easy to process for the MCU, providing a good data foundation for subsequent adaptation to different screens.

[0085] S130: cropping the visible light image to obtain a target-resolution visible light image;

[0086] Optionally, the cropping of the visible light image to obtain a target-resolution visible light image comprises:

[0087] The target-resolution visible light image is obtained by cutting from the center region of the visible light image.

[0088] In the specific embodiments described in this specification, since the resolution of a visible light camera (e.g., 480x640) is typically higher than that of the target screen (e.g., 240x320), scaling it is unnecessary and would result in a loss of quality. Therefore, this invention employs a center-cropping method. Specifically, the MCU calculates the center point of the visible light image and then, using this point as the center, expands outwards to crop a rectangular image area with a width of 240 pixels and a height of 320 pixels. Since the subject being measured is usually located in the center of the image, this cropping method can retain the core visual information to the maximum extent, while quickly obtaining a visible light image that perfectly matches the screen resolution with zero computational cost, ensuring the smooth progress of subsequent fusion steps.

[0089] S140: Perform feature fusion on the infrared image data at the target resolution and the visible light image at the target resolution to obtain a fused image at the target resolution;

[0090] Optionally, S140 includes:

[0091] Convert the infrared image data at the target resolution into an infrared grayscale image;

[0092] Image features are extracted from the infrared grayscale image and the visible light image at the target resolution, respectively;

[0093] Based on the extracted image features, the temperature information of the infrared grayscale image is merged with the detail information of the visible light image at the target resolution to generate a fused image.

[0094] In the specific implementation of this specification, the magnified infrared image data at the target resolution (essentially a temperature value matrix) is converted into an infrared grayscale image using a grayscale mapping function, where the grayscale value of each pixel represents the relative temperature of that point. Then, a feature extraction algorithm is run in parallel to extract feature information, such as edges (using operators like Canny and Sobel), contours, or salient regions, from both the infrared grayscale image and the cropped visible light image. Finally, the fusion stage begins: based on the extracted features, the high-temperature regions in the infrared image are superimposed onto the corresponding positions in the visible light image in the form of highlights or pseudo-color. For example, the contour of a high-temperature target identified in the infrared image can be aligned with the device portion in the visible light image to generate a new fused image at the target resolution.

[0095] S150: The temperature gun screen is logically divided into N display blocks, where N is an integer greater than 1, and the pixel data of a single display block does not exceed the MCU cache capacity of the temperature gun.

[0096] Optionally, S150 includes:

[0097] According to the total pixel data amount of the fusion image of the target resolution and the available cache capacity of the MCU, the maximum pixel data amount that a single display block can accommodate is calculated;

[0098] According to the maximum pixel data amount, the number of display blocks and the size of each display block are determined.

[0099] In the detailed description of the present specification, the system performs the following calculation before performing the refresh: first, the total pixel data amount of the fusion image of the target resolution is determined, for example, for a 240x320 RGB565 format image, the data amount is 240*320*2 bytes = 153,600 bytes. Then, the MCU queries its available cache capacity, which is assumed to be 40KB (40,960 bytes). Subsequently, the maximum pixel data amount that a single display block can accommodate is calculated, and a certain amount of margin is left to ensure stability, for example, the upper limit of the data amount of a single block is set to 38,000 bytes. According to this upper limit, the maximum number of pixels that each block can contain is about 19,000 pixels. According to this, the number of display blocks and the size of each display block can be determined, for example, a 240x320 screen is divided into 8 rows and 5 columns, a total of 40 blocks, and each block has a size of 48x64 pixels. This dynamic division mechanism ensures that the scheme can adapt to different MCU models and screen resolutions.

[0100] S160: Calculate the pixel data corresponding to the current display block in the fusion image of the target resolution, and send the pixel data to the temperature gun screen for local refresh. Traverse all N display blocks until the display of the fusion image of the target resolution on the temperature gun screen is completed.

[0101] Optionally, the calculation of the pixel data corresponding to the current display block in the fusion image of the target resolution and the sending of the pixel data to the temperature gun screen for local refresh comprises:

[0102] According to the coordinate position of the current display block on the screen, the pixel data of the corresponding region in the fusion image of the target resolution is extracted;

[0103] Through the display driver interface of the MCU, the extracted pixel data is directly written into the corresponding region of the video memory of the LCD screen, and the local update of the region is triggered.

[0104] In the detailed description of the present specification, after the screen partition is completed, the MCU starts to refresh in sequence in the order of rows or columns (such as from left to right, from top to bottom). For the current display block, assuming that it is the (2, 3) block, the MCU first extracts the complete pixel data of the corresponding region from the fusion image of the target resolution according to the starting coordinates (X_Start, Y_Start) and the size (Width, Height) of the block in the entire screen. Then, the MCU positions the write pointer of the LCD screen memory to the physical position corresponding to the block through the display driver interface (such as the parallel 8080 interface or the RGB interface) by setting the row and column address commands, and then directly writes the extracted pixel data stream. After the writing is completed, sometimes a specific update instruction is needed, or the automatic refresh mechanism of the screen is relied on to trigger the local update of the region, so that the small piece of fusion image is displayed on the screen.

[0105] In the present application, the technical bottleneck that the small cache MCU cannot drive the high-resolution LCD screen is fundamentally solved through the segmented refresh mechanism, making it possible to use cheap and resource-limited domestic MCUs or general-purpose MCUs to realize complex thermal image fusion display, greatly reducing the hardware material cost. The low-resolution infrared image is enlarged by using the two-stage bilinear interpolation algorithm, which avoids the serious jaggy and mosaic phenomenon caused by one-time enlargement from extremely low resolution to super high resolution, making the infrared image profile smoother and the temperature field transition more natural. By center cutting instead of scaling the high-resolution visible light image, the matching with the screen size is ensured, the clarity of the original image is maximally preserved, and the additional calculation overhead caused by the scaling algorithm is avoided, improving the overall efficiency of the system.

[0106] Figure 2 A structure diagram of a temperature measurement gun screen display device based on segmented refresh is provided for the embodiment of the present specification. The device can include:

[0107] The acquisition module 10 is configured to acquire infrared image data of original resolution collected by an infrared array sensor and a visible light image collected by a visible light imaging device.

[0108] The magnification module 20 is configured to magnify the infrared image data of the original resolution by a two-stage interpolation model to obtain infrared image data of a target resolution.

[0109] The cutting module 30 is configured to cut the visible light image to obtain a visible light image of a target resolution.

[0110] The fusion module 40 is configured to perform feature fusion on the infrared image data of the target resolution and the visible light image of the target resolution to obtain a fusion image of a target resolution.

[0111] a dividing module 50, configured to divide a screen of the temperature measuring gun logically into N display blocks, where N is an integer greater than 1, and a pixel data amount of a single display block does not exceed a MCU cache capacity of the temperature measuring gun;

[0112] a display module 60, configured to calculate pixel data corresponding to a current display block in a fusion image at the target resolution, and send the pixel data to the screen of the temperature measuring gun for local refreshing, and traverse all N display blocks until display of the fusion image at the target resolution on the screen of the temperature measuring gun is completed.

[0113] Optionally, the amplifying module 20 comprises:

[0114] the infrared image data at the original resolution is amplified by a fixed multiple of one time through a bilinear interpolation model to obtain infrared image data at an intermediate resolution;

[0115] the infrared image data at the intermediate resolution is amplified by two times through a bilinear interpolation model according to the resolution of the screen of the temperature measuring gun to obtain infrared image data at the target resolution.

[0116] Optionally, the infrared image data at the original resolution is amplified by a fixed multiple of one time through a bilinear interpolation model to obtain infrared image data at an intermediate resolution, comprising:

[0117] the infrared image data at the original resolution is 8x8 pixels;

[0118] the primary amplification by a fixed multiple of one time is amplification by 8 times to obtain infrared image data at an intermediate resolution of 64x64 pixels.

[0119] Optionally, the cropping module 30 comprises:

[0120] a target resolution visible light image is cropped from a central region of the visible light image.

[0121] Optionally, the fusion module 40 comprises:

[0122] the infrared image data at the target resolution is converted into an infrared grayscale image;

[0123] image features are extracted from the infrared grayscale image and the target resolution visible light image respectively;

[0124] based on the extracted image features, temperature information of the infrared grayscale image and detail information of the target resolution visible light image are merged to generate a fusion image.

[0125] Optionally, the dividing module 50 comprises:

[0126] According to the total pixel data amount of the fusion image of the target resolution and the available cache capacity of the MCU, the maximum pixel data amount that a single display block can accommodate is calculated;

[0127] According to the maximum pixel data amount, the number of display blocks and the size of each display block are determined.

[0128] Optionally, the display module 60 comprises:

[0129] According to the coordinate position of the current display block on the screen, pixel data of the corresponding region is extracted from the fusion image of the target resolution;

[0130] The extracted pixel data is directly written to the corresponding region of the video memory of the LCD screen through the display driver interface of the MCU, and local update of the region is triggered.

[0131] The functions of the system of the embodiment of the application have been described in the method embodiment described above, and thus the description of the embodiment of the application will not be described in detail, and reference can be made to the relevant description in the foregoing embodiment.

[0132] Based on the same inventive concept, the embodiment of the specification also provides an electronic device.

[0133] The electronic device embodiment of the application is described below, which can be regarded as a specific entity implementation of the method and device embodiments of the application described above. The details described in the electronic device embodiment of the application should be regarded as a supplement to the method or device embodiments described above; for the details not disclosed in the electronic device embodiment of the application, reference can be made to the method or device embodiments described above.

[0134] Figure 3 A structural schematic diagram of an electronic device provided by the embodiment of the specification is shown. The electronic device 300 according to the embodiment of the application is described below with reference to Figure 3 Figure 3 The electronic device 300 is only an example, and should not bring any limitation to the functions and use range of the embodiment of the application.

[0135] As shown in Figure 3 The electronic device 300 is in the form of a general computing device. The components of the electronic device 300 can include but are not limited to: at least one processing unit 310, at least one storage unit 320, a bus 330 connecting different system components (including the storage unit 320 and the processing unit 310), a display unit 340, etc.

[0136] ​The storage unit stores program codes which can be executed by the processing unit 310, so that the processing unit 310 performs the steps according to various exemplary embodiments of the present application described in the processing method part of the present specification. For example, the processing unit 310 can perform the steps as shown in the following. Figure 1

[0137] The storage unit 320 can include readable media in the form of volatile storage unit, such as random access memory (RAM) 3201 and / or cache memory 3202, and further include read-only memory (ROM) 3203.

[0138] The storage unit 320 can further include program / utility 3204 having a set of programs / modules 3205, including but not limited to: operating system, one or more application programs, other program modules, and program data, each of which or a combination thereof can include implementation of a network environment.

[0139] The bus 330 can represent one or more of several types of bus structures, including a storage unit bus or bus controller, a peripheral bus, a graphics acceleration port, a processing unit bus, or a local bus using any of a variety of bus architectures.

[0140] The electronic device 300 can also communicate with one or more external devices 400, such as a keyboard or pointing device, a Bluetooth device, etc.; other devices that enable a user to interact with the electronic device 300; and / or one or more devices that enable the electronic device 300 to communicate with one or more other computing devices. Such communication can occur via Input / Output (I / O) interface 350. Still yet, the electronic device 300 can communicate with one or more networks, such as a local area network (LAN), a wide area network (WAN), and / or the Internet, through a network adapter 360. The network adapter 360 can communicate with the other modules of the electronic device 300 through the bus 330. It should be appreciated that the for illustrative purposes, the electronic device 300 is shown with several interactive and / or communication components, it is understood that other devices can have fewer or more interactive and / or communication components of any kind. Figure 3 It is to be appreciated that other hardware and / or software modules that can be used in conjunction with the electronic device 300, such as, but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data archival storage systems, etc. have not been shown in the electronic device 300, but can be used in conjunction with the same.

[0141] ​Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described in this invention can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this invention can be embodied in the form of a software product, which can be stored in a computer-readable storage medium (such as a CD-ROM, USB flash drive, external hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, or network device, etc.) to execute the method described above according to this invention. When the computer program is executed by a data processing device, it enables the computer-readable medium to implement the method described above, i.e.: as... Figure 1 The method shown.

[0142] Figure 4 This is a schematic diagram of a computer-readable medium provided for embodiments of this specification.

[0143] accomplish Figure 1 The computer program of the method shown can be stored on one or more computer-readable media. A computer-readable medium can be a readable signal medium or a readable storage medium. A readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof.

[0144] The computer-readable storage medium may include data signals propagated in baseband or as part of a carrier wave, carrying readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. The readable storage medium may also be any readable medium other than a readable storage medium, capable of transmitting, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the readable storage medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination thereof.

[0145] Program code for performing the operations of this invention can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java and C++, and conventional procedural programming languages ​​such as C or similar languages. The program code can execute entirely on the audience's computing device, partially on the audience's device, as a standalone software package, partially on the audience's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the audience's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0146] In summary, the present invention can be implemented in hardware, or as software modules running on one or more processors, or a combination thereof. Those skilled in the art will understand that in practice, general-purpose data processing devices such as microprocessors or digital signal processors (DSPs) can be used to implement some or all of the functions of some or all of the components according to the embodiments of the present invention. The present invention can also be implemented as a device or apparatus program (e.g., a computer program and computer program product) for performing part or all of the methods described herein. Such programs implementing the present invention can be stored on a computer-readable medium or can be in the form of one or more signals. Such signals can be downloaded from an Internet website, provided on a carrier signal, or provided in any other form.

[0147] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the present invention is not inherently related to any specific computer, virtual device, or electronic device, and various general-purpose devices can also implement the present invention. The above descriptions are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

[0148] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0149] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A temperature measuring gun screen display method based on segmented refresh, characterized in that, The method comprises the following steps: acquiring infrared image data of original resolution collected by an infrared array sensor and visible light image data collected by a visible light imaging device; performing step-by-step magnification on the infrared image data of original resolution by using a bilinear interpolation model to obtain infrared image data of target resolution; cropping the visible light image to obtain a visible light image of target resolution; performing feature fusion on the infrared image data of target resolution and the visible light image of target resolution to obtain a fusion image of target resolution; logically dividing a screen of a temperature measuring gun into N display blocks, wherein N is an integer greater than 1, and the pixel data amount of a single display block does not exceed the MCU cache capacity of the temperature measuring gun; calculating the pixel data corresponding to the current display block in the fusion image of target resolution, and sending the pixel data to the screen of the temperature measuring gun for local refresh, and iterating through all N display blocks until the display of the fusion image of target resolution on the screen of the temperature measuring gun is completed.

2. The segmented refresh-based temperature measuring gun screen display method according to claim 1, wherein, The step of performing step-by-step magnification on the infrared image data of original resolution by using a bilinear interpolation model to obtain infrared image data of target resolution comprises the following steps: performing primary magnification on the infrared image data of original resolution by using a bilinear interpolation model to obtain infrared image data of intermediate resolution; performing secondary magnification on the infrared image data of intermediate resolution by using a bilinear interpolation model to obtain infrared image data of target resolution according to the resolution of the screen of the temperature measuring gun.

3. The segmented refresh-based temperature measuring gun screen display method according to claim 2, wherein, The step of performing primary magnification on the infrared image data of original resolution by using a bilinear interpolation model to obtain infrared image data of intermediate resolution comprises the following steps: the infrared image data of original resolution is 8x8 pixels; the primary magnification is 8 times, and the infrared image data of intermediate resolution is 64x64 pixels.

4. The segmented refresh-based temperature measuring gun screen display method according to claim 3, wherein, The step of cropping the visible light image to obtain a visible light image of target resolution comprises the following steps: cropping a central region of the visible light image to obtain a visible light image of target resolution.

5. The segmented refresh-based temperature measuring gun screen display method according to claim 4, wherein, The step of performing feature fusion on the infrared image data of target resolution and the visible light image of target resolution comprises the following steps: converting the infrared image data of target resolution into an infrared grayscale image; extracting image features from the infrared grayscale image and the visible light image of target resolution, respectively; merging temperature information of the infrared grayscale image and detail information of the visible light image of target resolution based on the extracted image features to generate a fusion image.

6. The segmented refresh-based temperature measuring gun screen display method according to claim 1, wherein, The step of logically dividing a screen of a temperature measuring gun into N display blocks comprises the following steps: calculating the maximum pixel data amount that can be accommodated by a single display block according to the total pixel data amount of the fusion image of target resolution and the available cache capacity of the MCU; determining the number of display blocks and the size of each display block according to the maximum pixel data amount.

7. The segmented refresh-based temperature measuring gun screen display method according to claim 1, wherein, The calculation of the current display block in the target resolution of the fusion image corresponding pixel data, and the pixel data is sent to the temperature gun screen for local refresh, comprising: According to the coordinate position of the current display block on the screen, the pixel data of the corresponding area is extracted from the target resolution of the fusion image; Through the display driver interface of the MCU, the extracted pixel data is directly written into the corresponding area of the LCD screen memory, and the local update of the area is triggered.

8. A temperature measuring gun screen display device based on segmented refresh, characterized by, Comprising: The acquisition module is used for acquiring the infrared array sensor collected original resolution infrared image data and the visible light image device collected visible light image; The amplification module is used for carrying out step amplification on the original resolution infrared image data through a double line interpolation model to obtain target resolution infrared image data; The cutting module is used for cutting the visible light image to obtain target resolution visible light image; The fusion module is used for carrying out feature fusion on the target resolution infrared image data and the target resolution visible light image to obtain target resolution fusion image; The division module is used for logically dividing the temperature gun screen into N display blocks, wherein N is an integer greater than 1, and the pixel data amount of a single display block does not exceed the MCU cache capacity of the temperature gun; The display module is used for calculating the corresponding pixel data of the current display block in the target resolution of the fusion image, and sending the pixel data to the temperature gun screen for local refresh, and traversing all N display blocks until the target resolution of the fusion image is displayed on the temperature gun screen.

9. An electronic device, comprising: The electronic device comprises: A processor; and a memory storing computer executable instructions, which when executed cause the processor to perform the method according to any one of claims 1-7.

10. A computer readable storage medium, wherein, The computer readable storage medium stores one or more programs, which when executed by a processor, implement the method of any one of claims 1-7.

Images