Semiconductor process apparatus and process off-gas separation device

Abstract

The application provides a process tail gas separation device of a semiconductor process equipment, which is used for separating non-gaseous by-products in process tail gas discharged from a process chamber of the semiconductor process equipment, and the process tail gas separation device comprises a condensation assembly, which comprises a condenser used for condensing the process tail gas to separate the non-gaseous by-products from the condensed process tail gas; wherein the condenser comprises a condensation cavity used for containing the process tail gas; and a scraper assembly arranged in the condensation cavity and used for scraping off the non-gaseous by-products separated on the inner wall surface of the condensation cavity after the process tail gas is condensed, so that the non-gaseous by-products can be prevented from accumulating on the inner wall surface of the condensation cavity, the process tail gas discharge channel is kept smooth, the safety of the process tail gas separation device is improved, and the maintenance cycle of the process tail gas separation device is shortened. The application further provides a semiconductor process equipment.

Description

[0001] This application is a divisional application of the patent application with application number 2023109222389, application date July 25, 2023, and invention title "Semiconductor process equipment and process exhaust gas separation device thereof". Technical Field

[0002] This invention relates to the field of semiconductor technology, and more specifically, to a semiconductor process equipment and a process exhaust gas separation device thereof. Background Technology

[0003] With the rapid development of optical communication technology, the transmission rate of optical communication is getting faster and faster. As the core chip in an optical communication system, the photodetector chip often uses polyimide as the dielectric layer.

[0004] Polyimide films are formed by polycondensation and casting of phenylene dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a highly polar solvent (water and γ-butyrolactone), followed by imidization. Due to its excellent temperature resistance, dielectric strength, radiation resistance, and adhesion, polyimide is widely used in semiconductor packaging processes. In the packaging process, after the polyimide liquid is cured under vacuum to form a polyimide film, a vertical furnace is typically used for polyimide curing (PIQ). The polyimide film is heated at temperatures above 250°C, and nitrogen gas is introduced into the chamber to promote uniform heating. At high temperatures, the solvent in the polyimide film evaporates, producing water vapor and gaseous γ-butyrolactone, thus curing the polyimide film. After the process is complete, nitrogen, water vapor, and gaseous γ-butyrolactone are discharged from the process chamber as waste gases.

[0005] However, in related technologies, when using a separation device to separate gaseous water and oil mist-like γ-butyrolactone, the byproducts from the separation accumulate in the separation device and cannot be discharged in time, leading to blockage of the exhaust pipe in the process chamber, increased exhaust pressure, and device shutdown. Summary of the Invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a process exhaust gas separation device for semiconductor process equipment to solve the technical problem of easy blockage of pipelines during process exhaust gas separation.

[0007] To achieve the objective of this invention, a process exhaust gas separation device for semiconductor process equipment is provided, used to separate non-gaseous byproducts from the process waste gas discharged from the process chamber of the semiconductor process equipment; the process exhaust gas separation device includes: a condensation assembly, which includes a condenser for condensing the process exhaust gas so that the non-gaseous byproducts are separated after the process exhaust gas is condensed; wherein, the condenser includes a condensation chamber for containing the process exhaust gas; a scraper assembly is disposed in the condensation chamber, and the scraper assembly is used to scrape off the non-gaseous byproducts separated on the inner wall of the condensation chamber after the process exhaust gas is condensed.

[0008] Furthermore, the scraper assembly includes: a rotating member rotatably disposed within the condensation chamber; and a first plate portion connected to the rotating member, the first plate portion being used to scrape off non-gaseous byproducts from the inner wall surface of the condensation chamber when the rotating member rotates.

[0009] Furthermore, the rotating component includes: a tube body disposed within the condensation cavity, the tube body having a first through hole penetrating its thickness; an end plate connected to one end of the tube body, the end plate having a second through hole penetrating its thickness; wherein, the first plate portion is disposed on the outer wall surface of the tube body facing the condensation cavity.

[0010] Furthermore, it also includes: a buffer assembly connected to the condensing assembly, the buffer assembly having an inlet and an outlet, the inlet for introducing process tail gas, and the outlet for discharging gaseous byproducts separated after condensation of the process tail gas, the buffer assembly for reducing the flow rate of the process tail gas introduced from the inlet; wherein, the buffer assembly includes a buffer pipe disposed within the condensing chamber, the buffer pipe forming a buffer cavity communicating with the inlet, and the buffer pipe forming a condensing cavity communicating with the outlet; the condenser is used to condense the process tail gas in the condensing chamber, so that non-gaseous byproducts are separated from the process tail gas on the inner wall of the condensing chamber and the outer wall of the buffer pipe; a scraper assembly disposed in the condensing chamber, the scraper assembly also being used to scrape off the non-gaseous byproducts separated from the outer wall of the buffer pipe after condensation of the process tail gas.

[0011] Furthermore, the scraper assembly also includes a second plate body connected to the rotating member, the second plate body being used to scrape off non-gaseous byproducts from the outer wall of the buffer pipe when the rotating member rotates.

[0012] Furthermore, both the first plate portion and the second plate portion include multiple scrapers, and the orthographic projection of the scrapers on the rotating member is set at a preset angle with the first plane; the preset angle is any angle not equal to 0º; the first plane is perpendicular to the rotation axis of the rotating member.

[0013] Furthermore, multiple scrapers are divided into multiple scraper groups according to their different circumferential positions, and the preset included angles of multiple scrapers in multiple scraper groups are the same; multiple scrapers in any two adjacent scraper groups in the first plate body are staggered along the rotation axis of the rotating component; multiple scrapers in any two adjacent scraper groups in the second plate body are staggered along the rotation axis of the rotating component.

[0014] Furthermore, the buffer assembly also includes: a mounting plate connected to the inner wall of the buffer pipe, the mounting plate being positioned opposite the air inlet, and the mounting plate having a through hole to allow process exhaust gas to enter the buffer pipe; a mounting column connected to the mounting plate and positioned in the buffer chamber along the axial direction of the buffer chamber; and multiple buffer plates connected to the mounting column, the multiple buffer plates being spaced apart along the axial direction of the buffer chamber, each buffer plate being inclined downwards, and adjacent buffer plates being staggered along the axial direction of the buffer chamber, used to change the flow direction of the process exhaust gas in the buffer chamber, thereby reducing the flow rate of the process exhaust gas in the buffer chamber.

[0015] Furthermore, it also includes a drive motor whose output shaft is connected to the rotating part via a transmission assembly. The transmission assembly includes: a transmission shaft, with its two ends connected to the output shaft and the rotating part respectively, the transmission shaft being used to transmit the rotational force output by the drive motor to the rotating part so that the rotating part rotates; a pair of bearings, spaced apart from each other on the transmission shaft; an outer sleeve forming a receiving space for accommodating the pair of bearings; and an inner sleeve disposed within the receiving space and located between the pair of bearings.

[0016] Furthermore, it also includes: a separation component connected to the condensation component, the separation component including a separation chamber for collecting non-gaseous byproducts scraped off by the scraper assembly and discharging the non-gaseous byproducts.

[0017] Furthermore, the separation assembly also includes a cooling component, which is fitted around the separation chamber to cool the collected non-gaseous byproducts and the transmission component, the transmission component being disposed within the cooling component.

[0018] The present invention also provides a semiconductor process apparatus, including a process chamber and a process exhaust gas separation device as described above, which is connected to the exhaust port of the process chamber.

[0019] The present invention has the following beneficial effects:

[0020] The process exhaust gas separation device of the semiconductor process equipment in this application is equipped with a scraper assembly in the condensation chamber. The scraper assembly scrapes away non-gaseous byproducts, such as greasey γ-butyrolactone byproducts, that are separated on the inner wall of the condensation chamber after the process exhaust gas is condensed. This can prevent the accumulation of non-gaseous byproducts on the inner wall of the condensation chamber, keep the process exhaust gas discharge channel unobstructed, and avoid downtime caused by byproducts clogging the exhaust pipe of the process chamber in related technologies. This improves the safety of the process exhaust gas separation device and shortens the maintenance cycle of the process exhaust gas separation device.

[0021] Other objects and features of the present invention will become clear from reading the specification, claims and drawings of this application. Attached Figure Description

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0023] Figure 1 This is a structural schematic diagram of semiconductor process equipment related to the technology.

[0024] Figure 2 This is a structural schematic diagram showing the connection between the process chamber and the process exhaust gas separation device of the semiconductor process equipment according to an embodiment of the present invention.

[0025] Figure 3 yes Figure 2 View of the midsection AA.

[0026] Figure 4 yes Figure 2 A magnified view of part B in the middle.

[0027] Figure 5 yes Figure 2 A magnified view of part C in the middle.

[0028] Figure 6 This is a schematic diagram of the structure connecting the end plate and the drive shaft in the process exhaust gas separation device of the semiconductor process equipment according to an embodiment of the present invention.

[0029] Figure 7 yes Figure 6 Side view.

[0030] Figure 8 yes Figure 6 Top view.

[0031] Figure 9 This is a schematic diagram showing the connection between the scraper assembly, transmission assembly, and drive motor of the process exhaust gas separation device of the semiconductor process equipment according to an embodiment of the present invention.

[0032] Figure 10 yes Figure 9A magnified view of part D in the middle.

[0033] Explanation of key component symbols:

[0034] 1. Reaction chamber; 2. Condensation chamber; 3. Separation chamber; 4. Collection chamber; 5. Exhaust valve;

[0035] 110. Condenser; 111. Condensation chamber; 1121. Condensation outer chamber; 1122. First liquid inlet; 1123. First liquid outlet; 121. First condensation flange; 122. Second condensation flange;

[0036] 200, scraper assembly; 210, rotating component; 211, tube body; 2111, first through hole; 212, end plate; 2121, second through hole; 220, first plate body; 230, second plate body; 231, scraper;

[0037] 300, Buffer assembly; 310, Air inlet; 320, Air outlet; 330, Buffer pipe; 340, Mounting plate; 350, Mounting column; 360, Buffer plate; 370, Buffer flange;

[0038] 400. Drive motor;

[0039] 500. Transmission assembly; 510. Drive shaft; 520. Bearing; 530. Outer sleeve; 540. Inner sleeve;

[0040] 600, Separation assembly; 610, Separation chamber; 621, Cooling outer chamber; 622, Second liquid inlet; 623, Second liquid outlet; 630, Separation flange;

[0041] 700. Storage components;

[0042] 20. Process chamber. Detailed Implementation

[0043] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0044] Figure 1 This is a structural schematic diagram of semiconductor process equipment related to this technology. See also... Figure 1The semiconductor process equipment of the relevant technology includes a reaction chamber 1, a condensation chamber 2, a separation chamber 3, a collection chamber 4, and an exhaust valve 5. The workpiece undergoes a polyimide curing process in the reaction chamber 1. After processing, the reaction chamber 1 discharges high-temperature process waste gas through an exhaust pipe. This high-temperature waste gas includes high-temperature nitrogen, water vapor, and oily γ-butyrolactone byproducts. The exhaust pipe is connected to the condensation chamber 2 to introduce the aforementioned process waste gas. Under the cooling effect of the condensation chamber 2, the high-temperature nitrogen, water vapor, and oily γ-butyrolactone byproducts are separated into medium-temperature gas, water, and oily γ-butyrolactone byproducts, respectively. The separated medium-temperature gas, water, and oily γ-butyrolactone byproducts continue into the separation chamber 3. Due to the different densities of the various separated products, they can be directed to different recovery systems. For example, water and oily γ-butyrolactone byproducts flow into the collection chamber 4 through the exhaust valve, while the medium-temperature gas and some water vapor flow into the plant system through the exhaust valve 5.

[0045] However, as time progresses, more and more oily γ-butyrolactone byproducts enter the separation chamber 3. The decreasing temperature further reduces the fluidity of these byproducts, making it impossible to completely expel them even with increased exhaust valve 5. This can ultimately lead to a shrinking gas flow cross-section in the separation chamber 3, potentially blocking the exhaust pipe connecting the reaction chamber 1 to the condensation chamber 2, causing pressure increases in the reaction chamber 1 and possibly resulting in system failure.

[0046] To address the aforementioned technical problems, this application proposes a process exhaust gas separation device for semiconductor process equipment, used to separate non-gaseous byproducts from the process exhaust gas discharged from the process chamber of the semiconductor process equipment. The embodiments of this disclosure can improve the smoothness of the flow of process exhaust gas in the process exhaust gas separation device of the semiconductor process equipment.

[0047] Figure 2 This is a structural schematic diagram showing the connection between the process chamber 20 and the process exhaust gas separation device of the semiconductor process equipment according to an embodiment of the present invention. See also... Figure 2 The process tail gas separation device includes a condenser assembly and a scraper assembly 200.

[0048] The condensation assembly includes a condenser 110. The condenser 110 is used to condense the process tail gas so that non-gaseous byproducts can be separated from the condensed process tail gas. The condenser 110 includes a condensation chamber 111 for containing the process tail gas.

[0049] The scraper assembly 200 is disposed inside the condensation chamber 111. The scraper assembly 200 is used to scrape off the non-gaseous byproducts separated on the inner wall surface of the condensation chamber 111 after the process tail gas is condensed, so as to avoid the accumulation of non-gaseous byproducts on the inner wall surface of the condensation chamber 111.

[0050] In some embodiments, the condenser 110 further includes a condensing component surrounding the condensing chamber 111, used to cool the process tail gas discharged from the process chamber 20 into the condensing chamber 111, so that the process tail gas separates non-gaseous byproducts after condensation. When the process tail gas includes high-temperature nitrogen, water vapor, and oil mist-like γ-butyrolactone byproducts, the condensing component causes the process tail gas to separate into medium-temperature gas, water, and oily γ-butyrolactone byproducts after condensation. The density of the separated products is different, which facilitates further separation and collection.

[0051] Specifically, the condensation component may include a condensation outer cavity 1121, which is fitted around the condensation cavity body 111. The condensation outer cavity 1121 is provided with a first liquid inlet 1122 and a first liquid outlet 1123. The first liquid inlet 1122 can be connected to a cooling medium source (not shown in the figure) to guide the cooling medium provided by the cooling medium source into the space between the condensation outer cavity 1121 and the condensation cavity body 111. The first liquid outlet 1123 allows the cooling medium to flow out, ensuring that the cooling medium remains fluid within the space between the condensation outer cavity 1121 and the condensation cavity body 111. The cooling medium exchanges heat with the condensation cavity body 111, cooling the condensation cavity body 111, thereby cooling and condensing the process exhaust gas within the condensation cavity body 111 to separate non-gaseous byproducts.

[0052] Preferred, see Figure 2 The first liquid inlet 1122 can be located below the first liquid outlet 1123, so that the cooling medium flows in from below the condensing outer cavity 1121 and flows out from above the condensing outer cavity 1121. This allows the cooling medium to flow through the entire space between the condensing outer cavity 1121 and the condensing cavity 111, thereby filling the entire space between the condensing outer cavity 1121 and the condensing cavity 111, thus improving the condensation effect of the condensing component on the process exhaust gas.

[0053] In this embodiment, the process tail gas separation device is equipped with a scraper assembly 200 inside the condensation chamber 111. The scraper assembly 200 scrapes away non-gaseous byproducts, such as greaseous γ-butyrolactone byproducts, that are separated on the inner wall of the condensation chamber 111 after the process tail gas is condensed. This can prevent the accumulation of non-gaseous byproducts on the inner wall of the condensation chamber 111, keep the process tail gas emission channel unobstructed, improve the safety of the process tail gas separation device, and shorten the maintenance cycle of the process tail gas separation device.

[0054] Figure 3 yes Figure 2 View of the midsection AA. Figure 4 yes Figure 2 A magnified view of part B in the image. See also... Figure 3 and Figure 4The process tail gas separation device also includes a buffer assembly 300. The buffer assembly 300 is connected to the condensation assembly. The buffer assembly 300 is provided with an inlet 310 and an outlet 320. The inlet 310 is used to introduce process tail gas, and the outlet 320 is used to discharge the gaseous by-products separated after condensation of the process tail gas. The buffer assembly 300 is used to reduce the flow rate of the process tail gas introduced from the inlet 310.

[0055] The buffer assembly 300 includes a buffer pipe 330. The buffer pipe 330 is disposed within the condensation chamber 111 to reduce the overall installation space of the process tail gas separator. A buffer chamber communicating with the air inlet 310 is formed inside the buffer pipe 330, and a condensation chamber communicating with the air outlet 320 is formed outside the buffer pipe 330.

[0056] It is understood that the buffer pipe 330 is disposed within the condensing cavity 111, and the buffer pipe 330 is used to divide the condensing cavity 111 into a connected buffer cavity and a condensing cavity. Therefore, the condensing cavity 111 includes a condensing cavity and a buffer cavity.

[0057] The condenser 110 is used to condense the process exhaust gas from the condensation chamber, so that the process exhaust gas flowing from bottom to top in the condensation chamber at a lower flow rate. Non-gaseous byproducts separated after condensation of the process exhaust gas may adhere to the inner wall of the condensation chamber 111 and the outer wall of the buffer pipe 330. A scraper assembly 200 is disposed in the condensation chamber. The scraper assembly 200 can be used not only to scrape off the non-gaseous byproducts separated on the inner wall of the condensation chamber 111, but also to scrape off the non-gaseous byproducts separated on the outer wall of the buffer pipe 330 after condensation of the process exhaust gas.

[0058] See Figure 2 The scraper assembly 200 includes a rotating member 210 and a first plate portion 220. The rotating member 210 is rotatably disposed within the condensation chamber 111. The first plate portion 220 is connected to the rotating member 210. The first plate portion 220 is used to scrape off non-gaseous byproducts from the inner wall surface of the condensation chamber 111 when the rotating member 210 rotates.

[0059] The scraper assembly 200 also includes a second plate portion 230. The second plate portion 230 is connected to the rotating member 210 and is used to scrape off non-gaseous byproducts on the outer wall of the buffer pipe 330 when the rotating member 210 rotates.

[0060] In some embodiments, both the first plate portion 220 and the second plate portion 230 are connected to the rotating member 210. When the condensing member condenses the process exhaust gas from the condensing chamber, non-gaseous byproducts may separate on the inner wall surface of the condensing chamber 111 and the outer wall surface of the buffer pipe 330. Therefore, the first plate portion 220 can scrape off the non-gaseous byproducts on the inner wall surface of the condensing chamber 111 when the rotating member 210 rotates, and the second plate portion can scrape off the non-gaseous byproducts on the outer wall surface of the buffer pipe 330 when the rotating member 210 rotates.

[0061] In some embodiments, the process tail gas separation device further includes a storage component 700, which is fixedly connected to the gas outlet 320 via a pipe and is used to collect the separated gaseous byproducts.

[0062] See Figure 2 The rotating component 210 includes a tube body 211 and an end plate 212. The tube body 211 is disposed within the condensation chamber 111. The tube body 211 has a first through hole 2111 extending through its thickness. The end plate 212 is connected to one end of the tube body 211. The end plate 212 has a second through hole 2121 extending through its thickness.

[0063] The first plate portion 220 is disposed on the outer wall surface of the tube body 211 facing the condensation cavity 111, so that the first plate portion 220 can scrape off the non-gaseous byproducts on the inner wall surface of the condensation cavity 111 when the tube body 211 rotates.

[0064] Specifically, the second plate portion 230 is disposed on the inner wall surface of the tube body 211 facing the buffer pipe 330, so that the second plate portion 230 can scrape off the non-gaseous byproducts on the outer wall surface of the buffer pipe 330 when the tube body 211 rotates.

[0065] See Figure 2 The first through hole 2111 provided on the pipe body 211 is used to allow part of the process exhaust gas flowing from the buffer chamber into the pipe body 211 to flow out of the pipe body 211 through it, so as to divert the process exhaust gas after the speed reduction.

[0066] The second through hole 2121 provided on the end plate 212 is used to allow the non-gaseous byproducts scraped off by the second plate body 230 to enter the separation chamber 610 of the separation assembly 600 through it.

[0067] Specifically, the tube body 211 is provided with 16 first through holes 2111 evenly distributed along the circumference, and the end plate 212 is provided with 6 second through holes 2121 evenly distributed along the circumference.

[0068] Figure 6 This is a schematic diagram of the structure connecting the end plate 212 and the drive shaft 510 in the process exhaust gas separation device of the semiconductor process equipment according to an embodiment of the present invention. Figure 7 yes Figure 6 Side view. See also Figure 6 and Figure 7 The drive shaft 510 is connected to the end plate 212 of the scraper assembly 200. Both the first plate body 220 and the second plate body 230 include multiple scrapers 231. The orthographic projection of the scraper 231 onto the rotating member 210 forms a preset angle with the first plane. The preset angle is any angle not equal to 0º, and the first plane is perpendicular to the rotation axis of the rotating member 210, so as to scrape non-gaseous byproducts. For example, the preset angle can be 30º, 40º, 50º, 60º, or 120º.

[0069] In some embodiments, the multiple scrapers 231 are divided into multiple groups of scraper 231 according to different circumferential positions, and the preset included angles of the multiple scrapers 231 in the multiple groups of scraper 231 are the same. In the first plate portion 220, the multiple scrapers 231 in any two adjacent groups of scraper 231 are staggered along the rotation axis of the rotating member, so that when the first plate portion 220 rotates, non-gaseous byproducts on the inner wall of the condensation cavity 111 are avoided from being missed. In the second plate portion 230, the multiple scrapers 231 in any two adjacent groups of scraper 231 are staggered along the rotation axis of the rotating member, so that when the second plate portion 230 rotates, non-gaseous byproducts on the outer wall of the buffer pipe 330 are avoided from being missed.

[0070] Figure 8 yes Figure 6 A top view. See also Figure 8 The first plate body 220 includes two sets of scrapers 231, which are located on the same diameter of the tube body 211. Similarly, the second plate body 230 also includes two sets of scrapers 231, which are also located on the same diameter of the tube body 211.

[0071] See Figure 4 The buffer assembly 300 also includes a mounting plate 340, a mounting post 350, and multiple buffer plates 360.

[0072] Mounting plate 340 is connected to the inner wall of buffer pipe 330. Mounting plate 340 is disposed opposite to air inlet 310, and mounting plate 340 is provided with through hole to allow process exhaust gas to enter buffer pipe 330 through it.

[0073] Mounting post 350 is connected to mounting plate 340 and is positioned within the buffer cavity along its axial direction.

[0074] Multiple buffer plates 360 are connected to the mounting column 350. The multiple buffer plates 360 are spaced apart in the axial direction of the buffer chamber. Each buffer plate 360 ​​is inclined downward, and two adjacent buffer plates 360 are staggered in the axial direction of the buffer chamber to change the flow direction of the process exhaust gas in the buffer chamber, so as to reduce the flow rate of the process exhaust gas in the buffer chamber.

[0075] In some embodiments, the mounting plate 340 is fixedly connected to the inner wall of the buffer pipe 330. Multiple buffer plates 360 are threadedly connected to the mounting post 350 for adjustment.

[0076] Preferably, the mounting column 350 and the buffer pipe 330 are installed concentrically.

[0077] Figure 9 This is a schematic diagram showing the connection between the scraper assembly 200, the transmission assembly 500, and the drive motor 400 of the process exhaust gas separation device of the semiconductor process equipment according to an embodiment of the present invention. Figure 10 yes Figure 9 A magnified view of a portion of point D. See also... Figure 9 and Figure 10 The process exhaust gas separation device also includes a drive motor 400. The output shaft of the drive motor 400 is connected to the rotating component 210 via a transmission assembly 500. The transmission assembly 500 includes a drive shaft 510, a pair of bearings 520, an outer sleeve 530, and an inner sleeve 540.

[0078] The drive shaft 510 is connected at both ends to the output shaft of the drive motor 400 and the rotating component 210, respectively. The drive shaft 510 is used to transmit the rotational force output by the drive motor 400 to the rotating component 210, so that the rotating component 210 rotates. A pair of bearings 520 are spaced apart on the drive shaft 510 to provide steel support force to the drive shaft 510, reduce the friction force when the drive shaft 510 rotates, and also to ensure that the drive shaft 510, the output shaft of the drive motor 400, the buffer channel and the cooling cavity are coaxial.

[0079] The outer sleeve 530 forms a receiving space for accommodating a pair of bearings 520 to ensure reliable positioning of the pair of bearings 520 in the axial direction of the drive shaft 510. The inner sleeve 540 is disposed within the receiving space and located between the pair of bearings 520. The inner sleeve 540 is concentrically arranged with the outer sleeve 530 and is used to support the upper bearing of the pair of bearings 520 for easy installation.

[0080] Specifically, the outer sleeve 530 is fixedly connected to the cooling cavity.

[0081] Figure 5 yes Figure 2 A magnified view of part C in the middle. See also Figure 5 The process tail gas separation device also includes a separation component 600. The separation component 600 is connected to the condensation component and includes a separation chamber 610. Non-gaseous byproducts fall into the separation chamber 610 under their own gravity. The separation chamber 610 is also used to collect the non-gaseous byproducts scraped off by the scraper assembly 200 and discharge the non-gaseous byproducts.

[0082] This embodiment adopts a modular design for the process exhaust gas separation device, which includes a condensation component, a scraper component 200, a buffer component 300, a transmission component 500, a separation component 600, and a storage component 700. The modular design facilitates the installation and disassembly of each component, improving maintenance convenience.

[0083] In some embodiments, the condensation assembly further includes a first condensation flange 121 and a second condensation flange 122 arranged vertically. The buffer assembly 300 includes a buffer flange 370 with an inlet 310 and an outlet 320. The separation assembly 600 includes a separation flange 630. The buffer flange 370 is located above the first condensation flange 121 and is connected to the first condensation flange 121 by fasteners. A sealing ring may also be provided at the connection to improve sealing. The second condensation flange 122 is located above the separation flange 630 and is connected to the separation flange 630 by fasteners. A sealing ring may also be provided at the connection to improve sealing. The exhaust port of the process chamber 20 is welded to the buffer flange 370 of the process separation device. The above arrangement ensures the sealing of the process exhaust gas separation device and prevents leakage of process exhaust gas.

[0084] See Figure 5 The separation assembly 600 also includes a cooling component. The cooling component is fitted around the separation chamber 610 and is used to cool the collected non-gaseous byproducts and the transmission assembly 500, which is disposed within the cooling component.

[0085] In some embodiments, the cooling component may include a cooling outer cavity 621, which is sleeved around the separation cavity 610, and has a second liquid inlet 622 and a second liquid outlet 623. The second liquid inlet 622 may be connected to a cooling medium source (not shown in the figure, which may be the same as or different from the cooling medium source of the first liquid inlet 1122) to guide the cooling medium provided by the cooling medium source into the space between the cooling outer cavity 621 and the separation cavity 610. The second liquid outlet 623 allows the cooling medium in the cooling outer cavity 621 to flow out, enabling the cooling medium to circulate within the space between the cooling outer cavity 621 and the separation cavity 610. Through heat exchange between the cooling medium in the cooling outer cavity 621 and the separation cavity 610, the separation cavity 610 and a pair of bearings 520 of the transmission assembly 500 are cooled, further reducing the temperature of non-gaseous byproducts in the separation cavity 610 and the bearings 520.

[0086] Preferred, see Figure 5The second liquid inlet 622 can be located below the second liquid outlet 623 so that the cooling medium flows in from below the cooling outer cavity 621 and flows out from above the cooling outer cavity 621. This allows the cooling medium to flow through the entire space between the cooling outer cavity 621 and the separation cavity 610, thereby filling the entire space between the cooling outer cavity 621 and the separation cavity 610 and improving the cooling effect of the cooling component.

[0087] In some embodiments, the separation chamber 610 is connected to a drain pipe that slopes downwards through the cooling outer chamber 621 and is fixedly connected to the bottom of the separation chamber 610 to drain non-gaseous byproducts. An electric drain valve can be installed on the drain pipe to achieve automated control, which can be opened when the process tail gas separation device is idle to discharge non-gaseous byproducts, thereby reducing labor costs and shortening maintenance cycles.

[0088] Understandably, the process tail gas entering the process tail gas separator through inlet 310 first enters the buffer chamber, where its high temperature and reduced flow rate allow it to flow into the condensation chamber, ensuring high fluidity within the buffer chamber. In the condensation chamber, the process tail gas contacts the inner wall of the condensation chamber 111 and the outer wall of the buffer pipe 330, thus condensing and accelerating the separation of non-gaseous and gaseous byproducts. Under the influence of the scraper assembly 200 and gravity, the two separate. Finally, the gaseous byproducts leave the process tail gas separator through outlet 320, while the non-gaseous byproducts further enter the separation chamber 610 and then leave the process tail gas separator through the discharge pipe.

[0089] See Figure 2 The semiconductor process equipment is used for performing a polyimide curing process. The semiconductor process equipment includes a process chamber 20 and a process exhaust gas separation device according to any of the above embodiments. The exhaust port of the process chamber 20 is connected to the process exhaust gas separation device.

[0090] The process chamber 20 is used to provide a certain process temperature and introduce a certain proportion of process gas to carry out the polyimide curing process of the workpiece.

[0091] In some embodiments, the process chamber 20 can be connected to the condensation chamber 111 of the process tail gas separator via an exhaust pipe to provide the condensation chamber 2 with the process tail gas after the polyimide curing process. It is understood that the process tail gas includes at least high-temperature nitrogen, water vapor, and oil mist-like γ-butyrolactone byproducts.

[0092] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0093] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0094] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0095] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0096] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A process exhaust gas separation device for semiconductor process equipment, used to separate non-gaseous byproducts from the process exhaust gas discharged from the process chamber of the semiconductor process equipment, characterized in that, The process tail gas separation device includes: A condensation assembly includes a condenser for condensing process tail gas to separate the non-gaseous byproducts after condensation; wherein the condenser includes a condensation chamber for containing the process tail gas. A buffer assembly is connected to the condenser assembly, and the buffer assembly is provided with an air inlet and an air outlet. A scraper assembly is disposed within the condensation chamber. The scraper assembly is used to scrape off the non-gaseous byproducts separated on the inner wall of the condensation chamber after the process tail gas has been condensed. The scraper assembly includes: A rotating component is rotatably disposed within the condensation chamber. The rotating component includes a tube body and an end plate. The tube body is disposed within the condensation chamber and has a first through hole penetrating its thickness. The end plate is connected to one end of the tube body. The first plate body is connected to the outer wall surface of the rotating component; The second plate is connected to the inner wall surface of the rotating component.

2. The process tail gas separation device according to claim 1, characterized in that, The first plate portion is used to scrape off the non-gaseous byproducts on the inner wall of the condensation chamber when the rotating member rotates.

3. The process tail gas separation device according to claim 2, characterized in that, The end plate is provided with a second through hole that penetrates its thickness; The first plate portion is disposed on the outer wall surface of the tube body facing the condensation cavity.

4. The process tail gas separation device according to claim 2, characterized in that, The air inlet is used to introduce the process exhaust gas, the air outlet is used to discharge the gaseous byproducts separated after the process exhaust gas is condensed, and the buffer component is used to reduce the flow rate of the process exhaust gas introduced from the air inlet. The buffer assembly includes a buffer pipe disposed within the condensation cavity, wherein a buffer cavity communicating with the air inlet is formed inside the buffer pipe, and a condensation cavity communicating with the air outlet is formed outside the buffer pipe. The condenser is used to condense the process exhaust gas in the condensation chamber, so that the process exhaust gas separates non-gaseous byproducts from the inner wall of the condensation chamber and the outer wall of the buffer pipe. The scraper assembly is disposed in the condensation chamber, and the scraper assembly is also used to scrape off the non-gaseous byproducts separated on the outer wall of the buffer pipe after the process tail gas is condensed.

5. The process tail gas separation device according to claim 4, characterized in that, The second plate is used to scrape off non-gaseous byproducts from the outer wall of the buffer pipe when the rotating component rotates.

6. The process tail gas separation device according to claim 5, characterized in that, Both the first plate portion and the second plate portion include multiple scrapers. The orthographic projection of the scraper onto the rotating member forms a preset angle with the first plane. The preset angle is any angle not equal to 0º. The first plane is perpendicular to the rotation axis of the rotating member.

7. The process tail gas separation device according to claim 6, characterized in that, The multiple scrapers are divided into multiple scraper groups according to their different circumferential positions, and the preset included angles of the multiple scrapers in the multiple scraper groups are the same; In the first plate body, multiple scrapers of any two adjacent scraper groups are staggered along the rotation axis of the rotating member; In the second plate body, multiple scrapers of any two adjacent scraper groups are staggered along the rotation axis of the rotating member.

8. The process tail gas separation device according to claim 4, characterized in that, The buffer component also includes: An mounting plate is connected to the inner wall of the buffer pipe. The mounting plate is positioned opposite to the air inlet. The mounting plate has a through hole to allow the process exhaust gas to enter the buffer pipe through it. The mounting post is connected to the mounting plate and is disposed in the buffer cavity along the axial direction of the buffer cavity; Multiple buffer plates are connected to the mounting column. The multiple buffer plates are spaced apart in the axial direction of the buffer cavity. Each buffer plate is inclined downward and two adjacent buffer plates are staggered in the axial direction of the buffer cavity. This is used to change the flow direction of the process exhaust gas in the buffer cavity, so as to reduce the flow rate of the process exhaust gas in the buffer cavity.

9. The process tail gas separation device according to claim 2, characterized in that, It also includes a drive motor whose output shaft is connected to the rotating component via a transmission assembly, the transmission assembly comprising: A drive shaft is connected at both ends to the output shaft and the rotating component, respectively. The drive shaft is used to transmit the rotational force output by the drive motor to the rotating component so that the rotating component rotates. A pair of bearings, spaced apart on the drive shaft; The outer sleeve forms a receiving space for accommodating the two bearings; The inner sleeve is disposed within the receiving space and located between the two bearings.

10. The process tail gas separation device according to claim 9, characterized in that, Also includes: A separation component is connected to the condensation component. The separation component includes a separation chamber for collecting the non-gaseous byproducts scraped off by the scraper assembly and discharging the non-gaseous byproducts.

11. The process tail gas separation device according to claim 10, characterized in that, The separation component also includes: A cooling component, which is sleeved around the separation chamber, is used to cool the collected non-gaseous byproducts and the transmission assembly, which is disposed within the cooling component.

12. A semiconductor process apparatus, characterized in that, A process exhaust gas separation device for a semiconductor process apparatus as described in any one of claims 1 to 11, comprising a process chamber and an exhaust port connected to the process chamber.

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