Epoxy potting resin composition as well as preparation method and application thereof

Abstract

The invention discloses an epoxy potting resin composition and a preparation method and application thereof, the composition comprises a component A and a component B. The component A comprises an epoxy resin matrix, a flexibilizer, a reactive diluent, a modified one-dimensional fiber reinforced material and a first inorganic filler, and the component B comprises anhydride, alcohol ether modified anhydride, a second inorganic filler and an accelerant. The modified one-dimensional fiber reinforced material is obtained by treating a one-dimensional fiber reinforced material with a surface treating agent, and the surface treating agent is a reaction product of a specific secondary amino compound and diisocyanate; when the component A is prepared, part of the epoxy resin matrix and the inorganic filler are firstly extruded in a single-screw extruder, then co-extruded with the modified one-dimensional fiber reinforced material in a double-screw extruder, and finally mixed with the remaining components; the composition provided by the invention has low system viscosity while meeting high cracking resistance, meets the pouring requirements, also has excellent mechanical properties, temperature resistance, electrical properties and the like, and overcomes the current problem that the components are compatible with one another.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of insulating materials, in particular to a pouring type dry-type transformer and motor insulating potting insulating material, and more particularly to an epoxy potting resin composition and a preparation method and application thereof. BACKGROUND

[0002] Transformers and motors are crucial devices in power systems, and with the continuous improvement of power density, the requirements for transformers and motors are becoming higher and higher. The failure of electrical equipment is mainly the failure of insulating materials, so the key to improving the stability of electrical equipment is to improve the stability of insulating materials. At present, most of the dry-type transformers and motors use epoxy potting resin as insulating material, which has good insulating performance, high structural strength and good bonding performance; but also has the shortcomings of poor toughness and easy cracking. In cold regions, the internal and external temperature difference is large in the starting moment of electrical equipment, which is very easy to cause the potting resin to crack, resulting in failure. At present, there are mainly two methods to improve the anti-cracking performance, adding toughening agent and inorganic filler, but in practice, although the addition of toughening agent can increase the toughness of the resin, the strength and temperature resistance of the material will decrease seriously, at the same time, the addition of inorganic filler can reduce the expansion coefficient of the resin and improve the anti-cracking performance, but will make the material brittle and the toughness decrease, there is an obvious problem of losing one to gain the other.

[0003] It should be noted that the information disclosed in the above background section is only for understanding the background of the present application, therefore the background section of the present application can contain background information about the problems or environment of the present application, and is not necessarily a description of the prior art. Therefore, the contents contained in the background section are not the acknowledgement of the prior art by the applicant. SUMMARY

[0004] The purpose of the present application is to overcome one or more deficiencies in the prior art, and to provide an improved anti-cracking epoxy potting resin composition which can solve the problem of losing one to gain the other in current applications.

[0005] The present application also provides a preparation method of the above anti-cracking epoxy potting resin and its application in the preparation of dry-type transformers or motors.

[0006] The inventors of the present application propose adding rigid or semi-rigid materials with high aspect ratio (for example, glass fibers, carbon fibers, aramid fibers, etc.) to the resin system of the epoxy potting resin system to improve the toughness and strength of the potting resin during experimental research, but it is very difficult to uniformly disperse these materials in the resin matrix in practice. For example, glass fibers are prone to agglomeration in epoxy resin, and the tackifying effect is particularly obvious. A small amount of glass fiber can greatly increase the viscosity of the resin, making the resin lose its flowability. Meanwhile, it is difficult to achieve a significant toughening effect with a low content of addition, but it is more difficult to disperse when a high content of addition is used.

[0007] Therefore, the inventors of the present application innovatively propose, on the one hand, surface modification of the rigid or semi-rigid material with high aspect ratio to improve its dispersibility and reduce the viscosity of the system; on the other hand, the present application adds the modified rigid or semi-rigid material with high aspect ratio in the presence of uniformly dispersed inorganic fillers in a double-screw extruder, which utilizes the friction of the inorganic fillers and the strong shearing, extruding and overturning effect of the double-screw extruder to uniformly disperse the rigid or semi-rigid material with high aspect ratio and obtain a shearing effect to form ultra-short materials. In the process of processing or curing, the shortened rigid or semi-rigid material can interact with the hydroxyl groups on the surface of the inorganic fillers through the reactive groups on the surface to form a relatively stable combination, which helps to further reduce the viscosity and improve the uniformity of dispersion.

[0008] In addition, when the content of the high-aspect-ratio fiber added in the resin system of the epoxy potting resin system is more than 12 wt.%, the present application can obtain a relatively ideal comprehensive performance.

[0009] To achieve the above-mentioned purpose, one technical solution adopted by the present application is as follows:

[0010] An epoxy potting resin composition, which comprises a component A and a component B, the raw materials of the component A include an epoxy resin matrix, a toughening agent, an active diluent, a modified one-dimensional fiber reinforced material and a first inorganic filler, and the raw materials of the component B include an anhydride, an alcohol ether modified anhydride, a second inorganic filler and an accelerator.

[0011] The modified one-dimensional fiber reinforced material is obtained by treating the one-dimensional fiber reinforced material with a surface treatment agent, and the surface treatment agent is the reaction product of a compound represented by formula (I) and a compound represented by formula (II).

[0012]

[0013] In the formula, R1, R2, R3, R4, R5, R6, R7 and R8 are independently selected from C 1-6alkyl;

[0014] In the Group A component, the modified one-dimensional fiber reinforced material accounts for 12wt.%-30wt.% and the first inorganic filler accounts for 30wt.%-50wt.% by weight percentage.

[0015] The mass ratio of the anhydride to the alcohol ether modified anhydride is 1:1-3.

[0016] In some embodiments of the present application, the amount of the surface treatment agent used in the process of preparing the modified one-dimensional fiber reinforced material accounts for 0.1wt.%-1wt.% of the added amount of the one-dimensional fiber reinforced material. Further, the amount of the surface treatment agent used in the process of preparing the modified one-dimensional fiber reinforced material accounts for 0.1wt.%-0.5wt.% of the added amount of the one-dimensional fiber reinforced material.

[0017] According to some specific aspects of the present application, the amount of the surface treatment agent used in the process of preparing the modified one-dimensional fiber reinforced material accounts for 0.1wt.%, 0.2wt.%, 0.3wt.%, 0.4wt.%, 0.5wt.%, 0.6wt.%, 0.7wt.%, 0.8wt.%, 0.9wt.%, 1wt.% and the like of the added amount of the one-dimensional fiber reinforced material.

[0018] In some embodiments of the present application, the one-dimensional fiber reinforced material is a combination of one or more selected from glass fiber and aramid fiber.

[0019] In some embodiments of the present application, R1, R2, R3, R4, R5, R6, R7, R8 are independently selected from methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl.

[0020] According to one specific aspect of the present application, the compound represented by formula (I) is 4,4'-bis-sec-butylaminodiphenylmethane.

[0021] According to one specific aspect of the present application, the compound represented by formula (II) is isophorone diisocyanate.

[0022] In some embodiments of the present application, the surface treatment agent is prepared by reacting the compound represented by formula (I) with the compound represented by formula (II) at a molar ratio of 1:1.1-1.3 in a solvent at 75-85°C. Further, the solvent can be butyl acetate and the like.

[0023] According to some specific aspects of the present application, the amount of the solvent used is 70%-85% of the total mass of the compound represented by formula (I), the compound represented by formula (II) and the solvent, for example, it can be 75%-85%, it can be 78%-82% and the like.

[0024] According to a specific aspect of the present application, the molar ratio of the compound of formula (I) to the compound of formula (II) is 1:1.2.

[0025] In some embodiments of the present application, the method for preparing the modified one-dimensional fiber reinforced material comprises: drying the one-dimensional fiber reinforced material, immersing the dried one-dimensional fiber reinforced material into a surface treatment agent solution, and heating treatment.

[0026] Further, the heating treatment comprises treatment at 80-90℃ and treatment at 160-180℃, respectively. Further, the treatment at 80-90℃ can be performed for 8-16h, and the treatment at 160-180℃ can be performed for 17-24h.

[0027] In some embodiments of the present application, the drying of the one-dimensional fiber reinforced material can be performed in an oven, and further, the drying can be performed at 120-140℃.

[0028] In some embodiments of the present application, the surface treatment agent solution is obtained by dispersing the surface treatment agent in a solvent, and the mass concentration of the surface treatment agent can be 0.2%-2%, and further, can be 0.2%-1%.

[0029] According to some specific aspects of the present application, the embodiments for preparing the modified one-dimensional fiber reinforced material comprise:

[0030] After drying the one-dimensional fiber reinforced material, the dried one-dimensional fiber reinforced material is immersed into a surface treatment agent solution, and after complete immersion, the whole is placed into an oven, and treated at 80-90℃ for 8-16h, and treated at 160-180℃ for 17-24h.

[0031] In some embodiments of the present application, the diameter of the modified one-dimensional fiber reinforced material is 5-30μm.

[0032] In some embodiments of the present application, the method for preparing the component A comprises:

[0033] Process (a), uniformly mixing part of the epoxy resin matrix and inorganic fillers in a single screw extruder to obtain a mixture A; or, mixing part of the epoxy resin matrix and inorganic fillers, and then adding into a single screw extruder to uniformly mix to obtain a mixture A;

[0034] Process (b), adding the mixture A and the modified one-dimensional fiber reinforced material into a twin screw extruder from a feeding port, respectively, and obtaining a mixture B through mixing, shearing and extruding;

[0035] Process (c), uniformly mixing the remaining raw materials, and then adding into the mixture B to uniformly disperse, to obtain the component A.

[0036] In some embodiments of the present application, in the a component, the epoxy resin matrix is 25wt.%-40wt.%, the toughening agent is 3wt.%-8wt.%, the active diluent is 5wt.%-10wt.%, the modified one-dimensional fiber reinforced material is 12wt.%-30wt.%, and the first inorganic filler is 30wt.%-50wt.%.

[0037] According to some specific aspects of the present application, in the a component, the epoxy resin matrix is 25wt.%-35wt.%, the toughening agent is 3wt.%-6wt.%, the active diluent is 5wt.%-8wt.%, the modified one-dimensional fiber reinforced material is 15wt.%-25wt.%, and the first inorganic filler is 30wt.%-45wt.%.

[0038] Further, in some embodiments, the a component further comprises a defoaming agent, a leveling agent, an anti-settling agent, a pigment, and the like first other auxiliary agents, and the total addition amount of the first other auxiliary agents is about 0.01wt.%-1wt.%.

[0039] In some embodiments of the present application, in the b component, the anhydride is 10wt.%-25wt.%, the alcohol ether modified anhydride is 20wt.%-35wt.%, the second inorganic filler is 45wt.%-65wt.%, and the accelerator is 0.01wt.%-2wt.%.

[0040] According to some specific aspects of the present application, in the b component, the anhydride is 15wt.%-25wt.%, the alcohol ether modified anhydride is 25wt.%-35wt.%, the second inorganic filler is 45wt.%-60wt.%, and the accelerator is 0.01wt.%-2wt.%.

[0041] Further, in some embodiments, the b component further comprises a defoaming agent, a leveling agent, an anti-settling agent, a pigment, and the like second other auxiliary agents, and the total addition amount of the second other auxiliary agents is about 0.01wt.%-2wt.%.

[0042] In some embodiments of the present application, the mass ratio of the a component to the b component is 1:0.8-1.2.

[0043] According to some specific aspects of the present application, the mass ratio of the a component to the b component is 1:0.9-1.1.

[0044] In some embodiments of the present application, the epoxy resin matrix comprises a bisphenol A epoxy resin and / or a bisphenol F epoxy resin.

[0045] Further, the epoxy resin is composed of bisphenol A epoxy resin and bisphenol F epoxy resin, and further, the mass ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 1.2-1.6:1.

[0046] According to some specific aspects of the present application, when the epoxy resin is composed of bisphenol A epoxy resin and bisphenol F epoxy resin, the embodiment for preparing the A component comprises:

[0047] Process (a), uniformly mixing bisphenol A epoxy resin and inorganic filler in a single screw extruder to obtain mixture A; or, mixing bisphenol A epoxy resin and inorganic filler, and then adding them into a single screw extruder to obtain mixture A;

[0048] Process (b), adding mixture A and modified one-dimensional fiber reinforced material into a twin screw extruder from different feeding ports, and then mixing, shearing and extruding to obtain mixture B;

[0049] Process (c), uniformly mixing the remaining raw materials, and then adding them into mixture B to obtain the A component.

[0050] Further, the epoxy value of the bisphenol A epoxy resin is 0.48-0.55 mol / 100g, and the epoxy value of the bisphenol F epoxy resin is 0.45-0.55 mol / 100g.

[0051] In some embodiments of the present application, the toughening agent is a combination of one or more selected from polyethylene glycol 400, polyethylene glycol 800, polypropylene glycol 1000, polypropylene glycol 2000, and polyurethane prepolymer.

[0052] In some embodiments of the present application, the active diluent is a combination of one or more selected from butyl glycidyl ether, ethylene glycol diglycidyl ether, phenyl glycidyl ether, polypropylene glycol diglycidyl ether, benzyl glycidyl ether, 1,6-hexanediol diglycidyl ether, propylene oxide o-tolyl ether, o-tolyl glycidyl ether, neopentyl glycol glycidyl ether, and pentaerythritol glycidyl ether.

[0053] In some embodiments of the present application, the first inorganic filler and the second inorganic filler are independently selected from a combination of one or more selected from silica powder, wollastonite, aluminum hydroxide, magnesium hydroxide, aluminum oxide, magnesium oxide, silicon carbide, boron nitride, calcium carbonate, and barium sulfate.

[0054] Further, according to some specific aspects of the present application, the silica powder has a mesh number of 600-2000 mesh.

[0055] Further, according to some specific aspects of the present application, the wollastonite has a mesh number of 500-800 mesh and an aspect ratio greater than 5.

[0056] Further, according to some specific aspects of the present application, the aluminum hydroxide has a mesh number of 1200-2500 mesh.

[0057] Further, according to some specific aspects of the present application, the magnesium hydroxide has a mesh number of 1500-2500 mesh.

[0058] Further, according to some specific aspects of the present application, the aluminum oxide has a mesh number of 400-1200 mesh.

[0059] Further, according to some specific aspects of the present application, the magnesium oxide has a mesh number of 200-600 mesh.

[0060] Further, according to some specific aspects of the present application, the silicon carbide has a mesh number of 800-1200 mesh.

[0061] Further, according to some specific aspects of the present application, the boron nitride has a particle size of 2-5 microns.

[0062] Further, according to some specific aspects of the present application, the calcium carbonate has a mesh number of 2500-4000 mesh.

[0063] Further, according to some specific aspects of the present application, the barium sulfate has a mesh number of 1250-2500 mesh.

[0064] According to one specific aspect of the present application, the first inorganic filler is composed of silicon powder with a mesh number of 1400-1600 mesh, silicon powder with a mesh number of 700-900 mesh, and aluminum oxide with a mesh number of 500-600 mesh.

[0065] Further, the mass ratio of the silicon powder with a mesh number of 1400-1600 mesh, the silicon powder with a mesh number of 700-900 mesh, and the aluminum oxide with a mesh number of 500-600 mesh is 1:1.4-1.85:2-3.

[0066] According to one specific aspect of the present application, the second inorganic filler is composed of silicon powder with a mesh number of 1400-1600 mesh and aluminum oxide with a mesh number of 900-1100 mesh.

[0067] Further, the mass ratio of the silicon powder with a mesh number of 1400-1600 mesh and the aluminum oxide with a mesh number of 900-1100 mesh is 1:0.5-0.8.

[0068] In some embodiments of the present application, the acid anhydride is a combination of one or more selected from tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and methyl nadic anhydride.

[0069] The alcohol ether modified anhydride is prepared by reacting a polyhydric alcohol ether, an anhydride in the presence of a promoter at 120-140℃, further, the mass ratio of the polyhydric alcohol ether to the anhydride is 0.15-0.4:1; further, the polyhydric alcohol ether comprises one or more selected from the group consisting of polyethylene glycol, polypropylene glycol, Tween, Span, castor oil polyoxyethylene ether, random polyether, block polyether.

[0070] The present application combines the unmodified anhydride with the alcohol ether modified anhydride, so that the system of the present application has a more moderate viscosity and is beneficial to improve the curing strength. At the same time, the polyhydric alcohol ether is used for toughening, increasing the toughness while appropriately increasing the viscosity, preventing the filler from settling, and increasing the storage stability.

[0071] In some embodiments of the present application, the promoter comprises one or more selected from the group consisting of imidazole, 2,4,6-tris(dimethylaminomethyl)phenol, N,N-dimethylbenzylamine.

[0072] The present application provides still another technical solution: a preparation method of the epoxy pouring resin composition described above, the preparation method comprising:

[0073] Preparation of the A component:

[0074] Part of the epoxy resin matrix and the inorganic filler are mixed uniformly in a single screw extruder to obtain a mixture A; or, part of the epoxy resin matrix and the inorganic filler are mixed and then added into a single screw extruder to be mixed uniformly to obtain the mixture A;

[0075] The mixture A and the modified one-dimensional fiber reinforced material are added into a twin screw extruder from the feeding port respectively, and are mixed, sheared and extruded to obtain a mixture B;

[0076] The remaining raw materials are mixed uniformly and then added into the mixture B to be dispersed uniformly to obtain the A component;

[0077] Preparation of the B component:

[0078] The raw materials are mixed uniformly to obtain the B component.

[0079] Further, in the process of preparing the A component, the temperature of the single screw extruder is 30-70℃, and the screw rotation speed can be 50-80rpm.

[0080] In some embodiments, in the process of preparing the A component, the temperature of the single screw extruder is: 30-35℃ for the feeding section, 65-70℃ for the melting section, and 45-55℃ for the melt conveying section.

[0081] Further, in the process of preparing the A component, the temperature of the twin screw extruder is 30-80℃, and the screw rotation speed can be 500-700rpm.

[0082] In some embodiments, in the process of preparing the first component, the temperature of each temperature zone of the twin-screw extruder is in turn: 30 DEG C for the first zone, 30 DEG C for the second zone, 50 DEG C for the third zone, 50 DEG C for the fourth zone, 50 DEG C for the fifth zone, 70 DEG C for the sixth zone, 70 DEG C for the seventh zone, 70 DEG C for the eighth zone, and 80 DEG C for the ninth zone.

[0083] In some embodiments, the method for preparing the second component comprises:

[0084] After the acid anhydride, alcohol ether modified acid anhydride, and defoaming agent are mixed and uniformly stirred, the second inorganic filler is added in batches, stirred and uniformly mixed, and then the remaining raw materials are added and mixed and uniformly stirred.

[0085] The application further provides another technical scheme: application of the above-mentioned epoxy pouring resin composition in preparation of a dry-type transformer or a motor.

[0086] Compared with the prior art, the application has the following advantages due to the above-mentioned technical scheme:

[0087] Based on the problems existing in the prior art in improving the epoxy pouring resin, the application innovatively designs the formula and improves the processing technology, so that the epoxy pouring resin composition of the application meets the high anti-cracking performance, the resin composition system has a relatively low viscosity, can meet the pouring requirements, and also has excellent mechanical properties, temperature resistance, electrical properties, etc., and in particular in relatively harsh extreme environment applications, such as cold regions or large temperature difference conditions, the epoxy pouring resin system of the application still has the performance of not cracking and not falling off, and has obvious advantages in the application of dry-type transformer pouring and motor pouring. DETAILED DESCRIPTION

[0088] The above-mentioned schemes are further described below in combination with specific examples; it should be understood that the examples are used to illustrate the basic principles, main features, and advantages of the application, and the application is not limited in scope by the following examples; the implementation conditions used in the examples can be further adjusted according to specific requirements, and the implementation conditions not mentioned are usually the conditions in conventional experiments.

[0089] In the following examples, all raw materials are commercially available or prepared by conventional methods in the art. In the following examples: E54 bisphenol A epoxy resin is purchased from Nantong Xingchen; E51 bisphenol A epoxy resin is purchased from Nantong Xingchen; Bisphenol F epoxy resin is purchased from Nanya, brand NPEF-170; Polyethylene glycol 200, polyethylene glycol 400 are purchased from Jiangsu Hai'an Guolihua Chemical; Active diluent is neopentyl glycol glycidyl ether, purchased from Jiangsu Runfengjia; Toughening agent is purchased from Beijing Qingda Qishi VL-2; Methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride are purchased from Jiaxing Nanyang Wansixing Chemical Co., Ltd.; N,N-dimethylbenzylamine is purchased from Changzhou Huayang Science and Technology; Silicon powder (1500 mesh), silicon powder (800 mesh) are purchased from Zhejiang Zhongzhou Silicon Co., Ltd., Alumina (500 mesh), alumina (1000 mesh) are purchased from Lianyungang Haosen; Glass fiber is purchased from Taishan Glass Fiber; Methyl hexahydrophthalic anhydride is purchased from Puyang Huicheng; 4,4'-bis-sec-butylaminodiphenyl methane is purchased from Zhangjiagang Yaruichemical; Rheological additive is rheological additive BEZ75 (purchased from Deqian), Defoaming agent is Qingtian DH-2020 fluorocarbon defoaming agent; Single screw extruder: Shijiazhuang Dongyue Motor DYD200, Twin-screw extruder: Shijiazhuang Dongyue Motor DYSH75.

[0090] The modified glass fiber (diameter about 30 microns) used in the following examples is prepared by the following method:

[0091] (1) 4,4'-bis-sec-butylaminodiphenyl methane and isophorone diisocyanate are added to butyl acetate according to a molar ratio of 1:1.2, and the amount of butyl acetate accounts for 80% of the total amount (the total weight of 4,4'-bis-sec-butylaminodiphenyl methane, isophorone diisocyanate and butyl acetate), the mixture is heated to 80°C, and the product is an oligomer containing isocyanate groups at the end group (i.e. surface treatment agent), without separation, to obtain a surface treatment agent solution.

[0092] (2) The glass fiber (10 microns, purchased in roll, length greater than 1000 meters) is dried in an oven at 130°C for 10 hours, then the surface treatment agent solution is diluted with butyl acetate to obtain a surface treatment agent diluent with a mass concentration of 0.4%. 100 kg of glass fiber is immersed in 50 kg of surface treatment agent diluent, and after complete immersion, it is placed in an oven, treated at 85°C for 12 hours and at 170°C for 20 hours to obtain modified glass fiber (diameter about 10 microns).

[0093] The modified glass fiber (diameter about 30 microns) used in the following examples is prepared by the following method:

[0094] (1) 4,4'-bis-sec-butylaminodiphenylmethane and isophorone diisocyanate are added into butyl acetate in a molar ratio of 1:1.2, the amount of butyl acetate accounts for 80% of the total amount (the total weight of 4,4'-bis-sec-butylaminodiphenylmethane, isophorone diisocyanate and butyl acetate), the mixture is heated to 80°C, and the product is an oligomer containing isocyanate groups at the end (i.e. a surface treatment agent), which is not separated to obtain a surface treatment agent solution.

[0095] (2) The glass fiber (30 microns, purchased in rolls, length greater than 1000 meters) is dried in an oven at 130°C for 10 hours, then the surface treatment agent solution is diluted with butyl acetate to obtain a surface treatment agent diluent with a mass concentration of 0.4%. 100 kg of glass fiber is immersed in 50 kg of surface treatment agent diluent, after complete immersion, it is placed in an oven and treated at 85°C for 12 hours and at 170°C for 20 hours to obtain modified glass fiber (diameter about 30 microns).

[0096] Example 1

[0097] This example provides an epoxy potting resin composition and a preparation method thereof, the epoxy potting resin composition comprises a component A and a component B;

[0098] The raw materials of the component A include: 18 kg of E51 bisphenol A epoxy resin, 13 kg of bisphenol F epoxy resin, 6 kg of neopentyl glycol glycidyl ether, 4 kg of VL-2 toughening agent, 0.3 kg of Qingtian DH-2020 fluorocarbon defoamer, 10 kg of silicon powder (1500 mesh), 15 kg of silicon powder (800 mesh), 20 kg of aluminum oxide (500 mesh), and 15 kg of modified glass fiber (10 microns);

[0099] The raw materials of the component B include 24 kg of methyl tetrahydrophthalic anhydride, 20 kg of methyl hexahydrophthalic anhydride, 6 kg of polyethylene glycol 400, 0.4 kg of N,N-dimethylbenzylamine, 0.2 kg of BEZ75, 0.2 kg of Qingtian DH-2020 fluorocarbon defoamer, 30 kg of silicon powder (1500 mesh), and 20 kg of aluminum oxide (1000 mesh).

[0100] The preparation method of the epoxy potting resin composition comprises:

[0101] Preparation of the component A:

[0102] Single screw extruder preparation of mixture A: 18 kg of E51 bisphenol A epoxy resin is premixed with 25 kg of silica powder and 20 kg of aluminum oxide. The single screw extruder is started, and after the temperature of each zone is stabilized, the premixed material is slowly added. After the premixed material is extruded, the extruded material is readded to the single screw extruder, and the process is repeated 4 times until the mixture is fully mixed. The operating parameters of the single screw are as follows: screw speed 70 r / min, feeding section 32°C, melting section 70°C, and melt conveying section 50°C.

[0103] Double screw extruder mixing of glass fibers to prepare mixture B: The double screw extruder is started, and after the temperature of each zone is stabilized, the motor is started. Mixture A is added from the feeding port, and at the same time, modified glass fibers (10 microns) are added. After mixing, shearing, and extruding, mixture B is obtained. The operating parameters of the double screw extruder are as follows: the temperature of each zone is set to 30°C for zone 1, 30°C for zone 2, 50°C for zone 3, 50°C for zone 4, 50°C for zone 5, 70°C for zone 6, 70°C for zone 7, 70°C for zone 8, and 80°C for zone 9. The screw speed is controlled at 600 r / min.

[0104] High-speed disperser dispersing mixture: The formula amount of bisphenol F epoxy resin, neopentyl glycol glycidyl ether, VL-2 toughening agent, and Qingtian DH-2020 fluorocarbon defoamer are mixed uniformly, then mixture B is added, and high-speed dispersion (800 r / min) is performed for 1 hour. The finished product, i.e., component A, is obtained after filtration (80-mesh filter).

[0105] Preparation of component B:

[0106] Preparation of alcohol ether modified anhydride: 0.1 kg of N,N-dimethylbenzylamine, 24 kg of methyl tetrahydrophthalic anhydride, and 6 kg of polyethylene glycol 400 are added to a reaction kettle, and under stirring conditions, they are reacted at 140°C for 2 hours to generate alcohol ether modified anhydride. The reaction mixture is obtained after reaction;

[0107] To the reaction mixture, 20 kg of methyl hexahydrophthalic anhydride and 0.2 kg of Qingtian DH-2020 fluorocarbon defoamer are added and stirred uniformly. Then, 30 kg of silica powder and 20 kg of aluminum oxide are added in 4 portions, and high-speed dispersion is performed for 1 hour.

[0108] Finally, 0.3 kg of N,N-dimethylbenzylamine and 0.2 kg of BEZ75 are added, and stirring is performed for 15 minutes. The finished product, i.e., component B, is obtained after filtration (120-mesh filter).

[0109] When needed, component A and component B are mixed according to a mass ratio of 1:1 to prepare an epoxy potting resin composition.

[0110] Example 2

[0111] The present example provides an epoxy potting resin composition and a preparation method thereof. The epoxy potting resin composition comprises component A and component B.

[0112] The raw materials of the A component include: 18 kg of E51 bisphenol A epoxy resin, 13 kg of bisphenol F epoxy resin, 6 kg of neopentyl glycol glycidyl ether, 4 kg of VL-2 toughening agent, 0.3 kg of Qingtian DH-2020 fluorocarbon defoamer, 7 kg of silicon powder (1500 mesh), 12 kg of silicon powder (800 mesh), 16 kg of aluminum oxide (500 mesh), and 25 kg of modified glass fiber (10 microns);

[0113] The raw materials of the B component include 24 kg of methyl tetrahydrophthalic anhydride, 20 kg of methyl hexahydrophthalic anhydride, 6 kg of polyethylene glycol 400, 0.4 kg of N,N-dimethylbenzylamine, 0.2 kg of BEZ75, 0.2 kg of Qingtian DH-2020 fluorocarbon defoamer, 30 kg of silicon powder (1500 mesh), and 20 kg of aluminum oxide (1000 mesh).

[0114] The preparation method of the epoxy pouring resin composition includes:

[0115] Preparation of the A component:

[0116] Preparation of mixed material A by a single screw extruder: 18 kg of E51 bisphenol A epoxy resin is premixed with 19 kg of silicon powder and 16 kg of aluminum oxide. After the temperature of each zone is stabilized, the premixed material is slowly added to the single screw extruder. After the premixed material is extruded, the extruded material is readded to the single screw extruder, and the process is repeated 4 times until the mixing is complete. The operating parameters of the single screw are as follows: screw speed 70 r / min, feeding section 32℃, melting section 70℃, and melt conveying section 50℃.

[0117] Preparation of mixed material B by a double screw extruder: After the temperature of each zone is stabilized, the motor is started, and mixed material A is added from the feeding port. At the same time, modified glass fiber (10 microns) is added. After mixing, shearing, and extruding, mixed material B is obtained. The operating parameters of the double screw extruder are as follows: the temperature of each zone is set as follows: zone 1 30℃, zone 2 30℃, zone 3 50℃, zone 4 50℃, zone 5 50℃, zone 6 70℃, zone 7 70℃, zone 8 70℃, and zone 9 80℃. The screw speed is controlled at 600 r / min.

[0118] Dispersion of mixed material by a high-speed disperser: The formula amount of bisphenol F epoxy resin, neopentyl glycol glycidyl ether, VL-2 toughening agent, and Qingtian DH-2020 fluorocarbon defoamer is added and mixed uniformly. Then, mixed material B is added, and high-speed dispersion (800 r / min) is performed for 1 hour. After filtration (80 mesh filter), the finished product, i.e., the A component, is obtained.

[0119] Preparation of the B component:

[0120] Preparation of alcohol ether modified anhydride: 0.1 kg of N,N-dimethylbenzylamine, 24 kg of methyltetrahydrophthalic anhydride, 6 kg of polyethylene glycol 400 are added to a reaction kettle, and an alcohol ether modified anhydride is generated under stirring at 140°C for 2 hours, and a post-reaction mixture is obtained;

[0121] To the post-reaction mixture, 20 kg of methylhexahydrophthalic anhydride and 0.2 kg of Qingtian DH-2020 fluorocarbon defoamer are added and stirred uniformly, and then 30 kg of silicon powder and 20 kg of aluminum oxide are added in 4 times, and stirred for 1 hour by a high-speed dispersion machine;

[0122] Finally, 0.3 kg of N,N-dimethylbenzylamine and 0.2 kg of BEZ75 are added, stirred for 15 minutes, filtered (120 mesh filter screen), and the finished product is obtained, i.e., the B component.

[0123] When needed, the A component and the B component are mixed according to a mass ratio of 1:1 to prepare an epoxy potting resin composition.

[0124] Example 3

[0125] The present example provides an epoxy potting resin composition and a preparation method thereof, the epoxy potting resin composition comprising an A component and a B component;

[0126] The raw materials of the A component include 18 kg of E51 bisphenol A epoxy resin, 13 kg of bisphenol F epoxy resin, 6 kg of neopentyl glycol glycidyl ether, 4 kg of VL-2 toughening agent, 0.3 kg of Qingtian DH-2020 fluorocarbon defoamer, 8 kg of silicon powder (1500 mesh), 13 kg of silicon powder (800 mesh), 24 kg of aluminum oxide (500 mesh), and 20 kg of modified glass fiber (10 microns);

[0127] The raw materials of the B component include 24 kg of methyltetrahydrophthalic anhydride, 20 kg of methylhexahydrophthalic anhydride, 6 kg of polyethylene glycol 400, 0.4 kg of N,N-dimethylbenzylamine, 0.2 kg of BEZ75, 0.2 kg of Qingtian DH-2020 fluorocarbon defoamer, 30 kg of silicon powder (1500 mesh), and 20 kg of aluminum oxide (1000 mesh).

[0128] The preparation method of the epoxy potting resin composition comprises:

[0129] Preparation of the A component:

[0130] Single screw extruder preparation of mixture A: 18 kg of E51 bisphenol A epoxy resin is premixed with 21 kg of silica powder and 24 kg of aluminum oxide. The single screw extruder is started, and after the temperature of each zone is stabilized, the premixed material is slowly added. After the premixed material is extruded, the extruded material is readded to the single screw extruder, and the process is repeated 4 times until the mixture is fully mixed. The operating parameters of the single screw are as follows: screw speed 70 r / min, feeding section 32°C, melting section 70°C, and melt conveying section 50°C.

[0131] Double screw extruder mixing of glass fibers to prepare mixture B: The double screw extruder is started, and after the temperature of each zone is stabilized, the motor is started. The mixture A is added from the feeding port, and at the same time, modified glass fibers (10 microns) are added. After mixing, shearing, and extruding, mixture B is obtained. The operating parameters of the double screw extruder are as follows: the temperature of each zone is set as follows: zone 1 30°C, zone 2 30°C, zone 3 50°C, zone 4 50°C, zone 5 50°C, zone 6 70°C, zone 7 70°C, zone 8 70°C, and zone 9 80°C. The screw speed is controlled at 600 r / min.

[0132] High-speed disperser dispersing the mixture: The formula amount of bisphenol F epoxy resin, neopentyl glycol glycidyl ether, VL-2 toughening agent, and Qingtian DH-2020 fluorocarbon defoaming agent are mixed uniformly, and then mixture B is added. High-speed dispersion (800 r / min) is carried out for 1 hour, and filtration (80 mesh filter) is carried out to obtain the finished product, which is component A.

[0133] Preparation of component B:

[0134] Preparation of alcohol ether modified anhydride: 0.1 kg of N,N-dimethylbenzylamine, 24 kg of methyl tetrahydrophthalic anhydride, and 6 kg of polyethylene glycol 400 are added to a reaction kettle. After stirring at 140°C for 2 hours, alcohol ether modified anhydride is generated, and the reaction mixture is obtained.

[0135] To the reaction mixture, 20 kg of methyl hexahydrophthalic anhydride and 0.2 kg of Qingtian DH-2020 fluorocarbon defoaming agent are added and stirred uniformly. Then, 30 kg of silica powder and 20 kg of aluminum oxide are added in 4 portions, and high-speed dispersion is carried out for 1 hour.

[0136] Finally, 0.3 kg of N,N-dimethylbenzylamine and 0.2 kg of BEZ75 are added, and stirring is carried out for 15 minutes. Filtration (120 mesh filter) is carried out to obtain the finished product, which is component B.

[0137] When needed, component A and component B are mixed according to a mass ratio of 1:1 to prepare an epoxy pouring sealant composition.

[0138] Example 4

[0139] The present example provides an epoxy pouring sealant composition and a preparation method thereof. The epoxy pouring sealant composition comprises component A and component B.

[0140] The raw materials of the A component include: 18 kg of E51 bisphenol A epoxy resin, 13 kg of bisphenol F epoxy resin, 6 kg of neopentyl glycol glycidyl ether, 4 kg of VL-2 toughening agent, 0.3 kg of Qingtian DH-2020 fluorocarbon defoamer, 8 kg of silicon powder (1500 mesh), 13 kg of silicon powder (800 mesh), 24 kg of aluminum oxide (500 mesh), and 20 kg of modified glass fiber (30 microns);

[0141] The raw materials of the B component include 24 kg of methyl tetrahydrophthalic anhydride, 20 kg of methyl hexahydrophthalic anhydride, 6 kg of polyethylene glycol 400, 0.4 kg of N,N-dimethylbenzylamine, 0.2 kg of BEZ75, 0.2 kg of Qingtian DH-2020 fluorocarbon defoamer, 30 kg of silicon powder (1500 mesh), and 20 kg of aluminum oxide (1000 mesh).

[0142] The preparation method of the epoxy potting resin composition includes:

[0143] Preparation of the A component:

[0144] Preparation of mixed material A by a single screw extruder: 18 kg of E51 bisphenol A epoxy resin is premixed with 21 kg of silicon powder and 24 kg of aluminum oxide. After the temperature of each zone is stabilized, the premixed material is slowly added to the single screw extruder. After the premixed material is extruded, the extruded material is readded to the single screw extruder, and the process is repeated 4 times until the mixture is fully mixed. The operating parameters of the single screw are as follows: screw speed 70 r / min, feeding section 32℃, melting section 70℃, and melt conveying section 50℃.

[0145] Preparation of mixed material B by a double screw extruder: After the temperature of each zone is stabilized, the motor is started, and mixed material A is added from the feeding port. At the same time, modified glass fiber (30 microns) is added. After mixing, shearing, and extruding, mixed material B is obtained. The operating parameters of the double screw extruder are as follows: the temperature of each zone is set as follows: zone 1 30℃, zone 2 30℃, zone 3 50℃, zone 4 50℃, zone 5 50℃, zone 6 70℃, zone 7 70℃, zone 8 70℃, and zone 9 80℃. The screw speed is controlled at 600 r / min.

[0146] Dispersion of mixed material by a high-speed disperser: The formula amount of bisphenol F epoxy resin, neopentyl glycol glycidyl ether, VL-2 toughening agent, and Qingtian DH-2020 fluorocarbon defoamer is added and mixed uniformly. Then, mixed material B is added, and high-speed dispersion (800 r / min) is performed for 1 hour. After filtration (80 mesh filter), the finished product, i.e., the A component, is obtained.

[0147] Preparation of the B component:

[0148] Preparation of alcohol ether modified anhydride: 0.1 kg of N,N-dimethylbenzylamine, 24 kg of methyltetrahydrophthalic anhydride, and 6 kg of polyethylene glycol 400 were added to a reaction kettle, and an alcohol ether modified anhydride was generated under stirring at 140°C for 2 hours, and a post-reaction mixture was obtained;

[0149] To the post-reaction mixture, 20 kg of methylhexahydrophthalic anhydride and 0.2 kg of Qingtian DH-2020 fluorocarbon antifoaming agent were added and stirred uniformly, and then 30 kg of silicon powder and 20 kg of aluminum oxide were added in four portions and stirred for 1 hour by a high-speed dispersion machine;

[0150] Finally, 0.3 kg of N,N-dimethylbenzylamine and 0.2 kg of BEZ75 were added and stirred for 15 minutes, and a finished product was obtained by filtration (120-mesh filter screen), and the B component was obtained.

[0151] When needed, the A component and the B component were mixed according to a mass ratio of 1:1 to prepare an epoxy potting resin composition.

[0152] Comparative Example 1

[0153] The example provides an epoxy potting resin composition and a preparation method thereof, which are basically the same as those of Example 1, and the only difference is that no modified glass fiber (10 microns) is added to the A component, and the addition amount of E51 bisphenol A epoxy resin is adjusted to 27 kg and the addition amount of bisphenol F epoxy resin is adjusted to 19 kg while keeping the total weight of the A component unchanged.

[0154] Comparative Example 2

[0155] The example provides an epoxy potting resin composition and a preparation method thereof, which are basically the same as those of Example 1, and the only difference is that 15 kg of unmodified glass fiber (10 microns) is added to the A component.

[0156] Comparative Example 3

[0157] The example provides an epoxy potting resin composition and a preparation method thereof, which are basically the same as those of Example 1, and the only difference is that the modified glass fiber (10 microns) in the A component is replaced by the same amount of commercially available silane-modified glass fiber (purchased from Taishan Glass Fiber).

[0158] Comparative Example 4

[0159] The example provides an epoxy potting resin composition and a preparation method thereof, which are basically the same as those of Example 1, and the only difference is that the “24 kg of methyltetrahydrophthalic anhydride and 6 kg of polyethylene glycol 400” in the B component is replaced by methylhexahydrophthalic anhydride, that is, the total addition amount of methylhexahydrophthalic anhydride in the B component is 50 kg.

[0160] Comparative Example 5

[0161] This example provides an epoxy potting resin composition and a preparation method thereof, which are substantially the same as those of Example 1, and the only difference is that in the preparation process of the A component, the inorganic filler is not co-extruded with the modified glass fiber, and specifically, the preparation method of the A component is as follows:

[0162] Preparation of the first mixture: 13 kg of bisphenol F epoxy resin is premixed with 25 kg of silica powder and 20 kg of aluminum oxide. A single screw extruder is started, and after the temperature of each zone is stabilized, the premixed material is slowly added. After the premixed material is extruded, the extruded material is readded to the single screw extruder, and the process is repeated 4 times until the mixture is fully mixed. The operating parameters of the single screw are as follows: screw speed 70 r / min, feeding section 32℃, melting section 70℃, and melt conveying section 50℃;

[0163] Preparation of the second mixture: a double screw extruder is started, and after the temperature of each zone is stabilized, the motor is started. 18 kg of E51 bisphenol A epoxy resin is added from the feeding port, and at the same time, modified glass fiber (10 microns) is added. After mixing, shearing, and extruding, the second mixture is obtained. The operating parameters of the double screw extruder are as follows: the temperature of each zone is set as follows: zone 1 30℃, zone 2 30℃, zone 3 50℃, zone 4 50℃, zone 5 50℃, zone 6 70℃, zone 7 70℃, zone 8 70℃, and zone 9 80℃, and the screw speed is controlled at 600 r / min.

[0164] High-speed dispersion machine disperses the mixture: the formula amount of neopentyl glycol glycidyl ether, VL-2 toughening agent, and Qingtian DH-2020 fluorocarbon defoaming agent is added and mixed uniformly, and then the first mixture and the second mixture are added. High-speed dispersion (800 r / min) is carried out for 1 hour, and filtration (40 mesh filter) is carried out to obtain the finished product, i.e., the A component.

[0165] Performance test

[0166] The epoxy potting resin compositions prepared in Examples 1-4 and Comparative Examples 1-5 above are subjected to the following performance tests, and the specific results are shown in Tables 1 and 2.

[0167] Performance index test explanation:

[0168] Preparation of the cured product: the resin and the curing agent of the potting adhesive are mixed in a ratio of 1:1, vacuum is removed to remove bubbles, and then curing is carried out at 80℃ for 4 hours, at 100℃ for 3 hours, at 110℃ for 2 hours, and at 130℃ for 8 hours.

[0169] 1. Density test: the density of the cured product is tested by a direct-reading electronic densitometer, in accordance with GB / T 4472-2011.

[0170] 2. Viscosity test: a rotary viscometer is used in combination with a constant temperature water bath to carry out constant temperature, in accordance with GB / T1981.2-2009.

[0171] 3. Gel time: After mixing the two components, place into a test tube, then place the test tube into an 80°C oil bath until the resin loses its flowability as the end point.

[0172] 4. Glass transition temperature (ASTM 3418), thermal conductivity (GB / T 29313-2012), tensile strength (ISO R 527), flexural strength (ISO R 527), linear expansion coefficient (DIN 53752), impact strength (ISO 180-2019) were tested using corresponding molds, and the samples were prepared according to the preparation method of cured product to prepare samples of corresponding size.

[0173] 5. Low temperature performance test: Place an iron block with sharp edges into the mixed rubber compound, and prepare the corresponding sample block according to the preparation method of cured product. The prepared sample block is kept at a constant temperature of 40°C, and then placed into a low temperature box and frozen for 24 hours. Observe whether the sharp edges of the iron block and the resin combination crack.

[0174] 6. Cold and hot impact test: The corresponding sample block is prepared according to "5. Low temperature performance test", and the sample block is baked at 150°C for 1 hour, and then immediately placed into a low temperature box at -40°C and frozen for 2 hours. Then the sample block is taken out, baked at 150°C for 1 hour, and then placed into a low temperature box at -40°C and frozen for 2 hours, and the cycle is repeated for 10 times.

[0175] Table 1

[0176]

[0177] Table 2

[0178]

[0179] The above examples are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and essence of the present application should be covered within the protection scope of the present application.

[0180] The endpoints of the ranges and any values disclosed herein are not limited to the precise values recited as the exact dimensions are not considered critical for the present application. The endpoints of the ranges and any values are only approximations. The range is a continuum, and endpoints are provided for clarity. Any value between the endpoints is also considered as a possible value within the scope of the present application. The endpoints of the ranges and any values are only approximations. The range is a continuum. Any value between the endpoints is also considered as a possible value within the scope of the present application. The singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise.

Claims

1. An epoxy potting resin composition, characterized by comprising: The epoxy potting resin composition comprises a component A and a component B, raw materials of the component A include an epoxy resin matrix, a toughening agent, an active diluent, a modified one-dimensional fiber reinforced material and a first inorganic filler, and raw materials of the component B include an anhydride, an alcohol ether modified anhydride, a second inorganic filler and an accelerator; The modified one-dimensional fiber reinforced material is obtained by treating a one-dimensional fiber reinforced material with a surface treatment agent, and the surface treatment agent is a reaction product of a compound represented by formula (I) and a compound represented by formula (II). wherein R1, R2, R3, R4, R5, R6, R7, R8are independently selected from C 1-6 alkyl; In the component A, the modified one-dimensional fiber reinforced material accounts for 12wt.%-30wt.% and the first inorganic filler accounts for 30wt.%-50wt.% by weight percentage. The mass ratio of the anhydride to the alcohol ether modified anhydride is 1:1-3.

2. The epoxy potting resin composition according to claim 1, characterized by In the process of preparing the modified one-dimensional fiber reinforced material, the amount of the surface treatment agent accounts for 0.1wt.%-1wt.% of the added amount of the one-dimensional fiber reinforced material. The one-dimensional fiber reinforced material is glass fiber and / or aramid fiber.

3. The epoxy potting resin composition according to claim 1, characterized by R1, R2, R3, R4, R5, R6, R7 and R8 are independently selected from methyl, ethyl, n-propyl, isopropyl, n-butyl and isobutyl; and / or, in the process of preparing the modified one-dimensional fiber reinforced material, the amount of the surface treatment agent accounts for 0.1wt.%-0.5wt.% of the added amount of the one-dimensional fiber reinforced material; The surface treatment agent is prepared by reacting the compound represented by formula (I) and the compound represented by formula (II) in a solvent at 75-85℃ according to a molar ratio of 1:1.1-1.

3.

4. The epoxy potting resin composition according to claim 1, characterized by, The preparation method of the modified one-dimensional fiber reinforced material comprises: drying the one-dimensional fiber reinforced material, immersing it in a surface treatment agent solution, and heating to prepare; further, the heating treatment comprises respectively treating at 80-90℃ and treating at 160-180℃; the compound represented by formula (I) is 4,4'-bis-sec-butylaminodiphenyl methane; the compound represented by formula (II) is isophorone diisocyanate; and the diameter of the modified one-dimensional fiber reinforced material is 5-30μm.

5. The epoxy potting resin composition according to claim 1, wherein The preparation method of the component A comprises: Process (a), uniformly mixing part of the epoxy resin matrix and the inorganic filler in a single screw extruder to obtain a mixture A; or mixing part of the epoxy resin matrix and the inorganic filler and then adding them into a single screw extruder to uniformly mix to obtain the mixture A; Process (b), adding the mixture A and the modified one-dimensional fiber reinforced material into a twin screw extruder from different feeding ports, mixing, shearing and extruding to obtain a mixture B; Process (c), uniformly mixing the remaining raw materials and adding them into the mixture B to uniformly disperse, to obtain the component A.

6. The epoxy potting resin composition according to claim 1, characterized by In the component A, the epoxy resin matrix accounts for 25wt.%-40wt.%, the toughening agent accounts for 3wt.%-8wt.%, the active diluent accounts for 5wt.%-10wt.%, the modified one-dimensional fiber reinforced material accounts for 12wt.%-30wt.% and the first inorganic filler accounts for 30wt.%-50wt.% by weight percentage; and / or, The acid anhydride is 10wt.%-25wt.% in the B component, the alcohol ether modified acid anhydride is 20wt.%-35wt.% in the B component, the second inorganic filler is 45wt.%-65wt.% in the B component, and the promoter is 0.01wt.%-2wt.% in the B component; and / or, The mass ratio of the A component to the B component is 1:0.8-1.

2.

7. The epoxy potting resin composition according to claim 1 or 6, characterized by, The epoxy resin matrix comprises bisphenol A epoxy resin and / or bisphenol F epoxy resin; Further, the epoxy resin is composed of bisphenol A epoxy resin and bisphenol F epoxy resin, and further, the mass ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 1.2-1.6:1; Further, the epoxy value of the bisphenol A epoxy resin is 0.48-0.55 mol / 100g, and the epoxy value of the bisphenol F epoxy resin is 0.45-0.55 mol / 100g; And / or, The toughening agent is a combination of one or more selected from polyethylene glycol 400, polyethylene glycol 800, polypropylene glycol 1000, polypropylene glycol 2000, and polyurethane prepolymer; And / or, The active diluent is a combination of one or more selected from butyl glycidyl ether, ethylene glycol diglycidyl ether, phenyl glycidyl ether, polypropylene glycol diglycidyl ether, benzyl glycidyl ether, 1,6-hexanediol diglycidyl ether, propylene oxide o-tolyl ether, o-tolyl glycidyl ether, neopentyl glycol glycidyl ether, and pentaerythritol glycidyl ether; And / or, The first inorganic filler and the second inorganic filler are independently selected from a combination of one or more selected from silica powder, wollastonite, aluminum hydroxide, magnesium hydroxide, aluminum oxide, magnesium oxide, silicon carbide, boron nitride, calcium carbonate, and barium sulfate.

8. The epoxy potting resin composition according to claim 1, characterized by, The acid anhydride is a combination of one or more selected from tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, and methyl nadic anhydride; And / or, The alcohol ether modified acid anhydride is prepared by reacting a polyol ether and an acid anhydride in the presence of a promoter at 120-140℃, and further, the mass ratio of the polyol ether to the acid anhydride is 0.15-0.4:1; and further, the polyol ether comprises a combination of one or more selected from polyethylene glycol, polypropylene glycol, Tween, Span, castor oil polyoxyethylene ether, random polyether, and block polyether; And / or, the promoter comprises a combination of one or more selected from imidazole, 2,4,6-tris(dimethylaminomethyl)phenol, and N,N-dimethylbenzylamine.

9. A method for producing the epoxy potting resin composition according to any one of claims 1 to 8, characterized by, The preparation method comprises: Preparation of the A component: Part of the epoxy resin matrix and the inorganic filler are uniformly mixed in a single screw extruder to obtain a mixture A; or, part of the epoxy resin matrix and the inorganic filler are mixed and then added into a single screw extruder to obtain the mixture A; The mixture A and the modified one-dimensional fiber reinforced material are respectively added into a twin screw extruder from a feeding port, and then mixed, sheared and extruded to obtain a mixture B; The remaining raw materials are uniformly mixed and then added into the mixture B to be uniformly dispersed, thereby obtaining the A component; Preparation of the B component: The raw materials are mixed and uniformly prepared to obtain the B component.

10. Use of the epoxy potting resin composition according to any one of claims 1 to 8 for the production of dry transformers or electric machines.

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