An enhanced high-precision metal mask

Abstract

The application relates to the field of OLED devices and discloses an enhanced high-precision metal mask plate, which comprises a mask plate, an evaporation area located in the middle of the mask plate, and a non-evaporation area located close to the two side edges of the mask plate; a plurality of micro-hole arrays are arranged in the evaporation area; a plurality of hexagonal opening units penetrating through the mask plate are arranged in the non-evaporation area, a cooling channel is arranged in the inside of each hexagonal opening unit, and the cooling channel is used for introducing a cooling medium. The bionic honeycomb hollow structure is adopted in the non-evaporation area, so that the non-evaporation area is lightened by 80% and high rigidity is achieved. The formed independent opening units can isolate the long-range transmission of thermal stress, and the overall warping deformation is avoided in the structure. Meanwhile, the cooling channel is introduced into the opening unit, an external PID temperature control system is adopted, the overall temperature of the mask plate is controlled, and the occurrence of thermal creep is eliminated from the root.

Description

Technical Field

[0001] This invention relates to the field of OLED devices, and in particular to an enhanced high-precision metal mask. Background Technology

[0002] As AMOLED display technology gradually develops towards larger sizes and higher resolutions, the G8.6 generation line has become a fiercely competitive arena for global panel manufacturers. Against this backdrop, metal masks, as a key component of the vapor deposition process, directly determine the imaging quality, resolution, and production yield of OLED panels. Based on their functional differences, metal masks are mainly divided into the following three categories: 1. General-purpose metal mask (CMM): Responsible for the deposition of common layer materials such as HTL / HIL / ETL, controlling the uniformity of the panel's electrical performance. 2. Encapsulation metal mask (CVD Mask): Precisely defines the encapsulation layer area in chemical vapor deposition, affecting the panel's hermeticity and folding lifespan. 3. High-precision metal mask (FMM): Achieves micron-level pixel deposition of RGB organic light-emitting materials, directly related to resolution and color purity. Its aperture precision must be controlled within ±2.5μm, a critical point in AMOLED manufacturing. Although the localization process has recently achieved a milestone breakthrough, existing metal masks still face significant bottlenecks in terms of large-size deformation control, micro-hole precision stability, and material utilization in order to meet the technological demands of future 8K displays, foldable screens, and other technologies.

[0003] In horizontal evaporation processes, the G8.6 generation FMM is too large, resulting in a certain offset between the center and edges of the FMM. This offset becomes more pronounced as the FMM size increases. The problem of gravity-induced sagging not only hinders the improvement of OLED pixel density (PPI) but also reduces color mixing yield, thereby significantly increasing production costs. Furthermore, temperature fluctuations in the cavity during the evaporation process and the CTE mismatch of the Invar alloy lead to cumulative errors due to thermal expansion. Existing masks lack an active thermal deformation compensation mechanism.

[0004] It is evident that existing technologies still need improvement and enhancement. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide an enhanced high-precision metal mask, which aims to solve the problem of insufficient deformation resistance caused by gravity sagging and lack of thermal stress compensation of existing metal masks.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An enhanced high-precision metal mask includes a mask, a vapor deposition area located in the middle of the mask, and a non-vapor deposition area located near the two side edges of the mask; the vapor deposition area is provided with a plurality of micropore arrays; the non-vapor deposition area is provided with a plurality of hexagonal opening units penetrating the mask, and each hexagonal opening unit is provided with a cooling channel inside, the cooling channel being used to introduce a cooling medium.

[0008] The enhanced high-precision metal mask plate wherein the edges of each of the hexagonal aperture units are fitted together, and each of the hexagonal aperture units shares the same edge with the hexagonal aperture units arranged around it.

[0009] The enhanced high-precision metal mask plate, wherein the wall thickness of each of the hexagonal aperture units is 40-60 μm.

[0010] The enhanced high-precision metal mask plate, wherein the side length of each of the hexagonal opening units is 2 to 4 mm.

[0011] The enhanced high-precision metal mask plate, wherein each of the hexagonal aperture units is provided with a reinforcing plate in the hole wall, and the extending direction of the reinforcing plate is parallel to the short sides of the mask plate on both sides.

[0012] The enhanced high-precision metal mask plate, wherein the thickness of the reinforcing plate is 0.3 to 0.5 mm.

[0013] The enhanced high-precision metal mask plate, wherein the cooling channel covers the hole wall surface of the hexagonal opening unit in a serpentine pattern.

[0014] The enhanced high-precision metal mask plate, wherein the cooling channel is an oxygen-free copper cooling channel and the hexagonal opening unit is an Invar alloy hexagonal opening unit, is integrally formed by using high-precision laser selective melting technology to integrate the oxygen-free copper cooling channel and the Invar alloy hexagonal opening unit.

[0015] The enhanced high-precision metal mask plate, wherein the pore diameter of each micropore in the plurality of micropore arrays is 5 to 20 μm.

[0016] The enhanced high-precision metal mask plate, wherein the evaporation zone is an Invar alloy evaporation zone.

[0017] Beneficial effects:

[0018] This invention provides an enhanced high-precision metal mask, which has the following advantages:

[0019] 1. Lightweight: By adopting an enhanced biomimetic honeycomb hollow structure in the non-evaporation zone and adding reinforcing plates in the hexagonal open unit, the structural rigidity of the biomimetic honeycomb is further improved, thereby achieving a weight reduction of 80% in the non-evaporation zone while maintaining high rigidity.

[0020] 2. Enhanced anti-sagging ability: The biomimetic honeycomb structure is not a simple solid material. Its hollow form can efficiently convert the bending stress acting on the mask plate surface into the axial tensile and compressive stress of the honeycomb wall. The material bears the load in its strongest axial direction, thus exhibiting an equivalent elastic modulus far exceeding that of solid materials on a macroscopic scale.

[0021] 3. Structural innovation: By adding an enhanced honeycomb structure to the non-evaporation zone, multiple independent opening units are formed, which can isolate the long-distance transmission of thermal stress. The continuous and huge thermal stress that was originally on a whole mask is divided and dispersed into countless local stresses confined to a single opening unit, thus avoiding overall warping deformation from a structural point of view.

[0022] 4. Suppression of thermal deformation: By introducing a serpentine cooling channel in the aperture unit and passing a -10℃ ethylene glycol aqueous solution through the cooling channel, the overall temperature of the mask plate is regulated by an external PID temperature control system, keeping the working temperature of the mask plate surface below 100℃, thus eliminating the occurrence of thermal creep problems at the source. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of an enhanced high-precision metal mask.

[0024] Figure 2 This is a structural schematic diagram of multiple hexagonal perforated units.

[0025] Figure 3 This is a schematic diagram of a single hexagonal perforated unit.

[0026] Figure 4 This is a schematic diagram showing the gravitational sag of the mask plate in Comparative Example 1.

[0027] Figure 5 This is a schematic diagram of the gravity sag of the enhanced high-precision metal mask plate in Example 1.

[0028] Explanation of key component symbols: 10-evaporation zone, 20-non-evaporation zone; 1-micropore array, 2-hexagonal opening unit, 3-reinforcing plate, 4-cooling channel. Detailed Implementation

[0029] This invention provides an enhanced high-precision metal mask. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the scope of protection of the invention.

[0030] Please see Figure 1-3 The present invention provides an enhanced high-precision metal mask, comprising a mask, a vapor deposition area 10 located in the middle of the mask, and a non-vapor deposition area 20 located near the two side edges of the mask; the vapor deposition area 10 is provided with a plurality of micropore arrays 1; the non-vapor deposition area 20 is provided with a plurality of hexagonal opening units 2 penetrating the mask, and each hexagonal opening unit 2 is provided with a cooling channel 4 inside, the cooling channel 4 being used to introduce a cooling medium.

[0031] The aforementioned enhanced high-precision metal mask adopts a functional partitioning structure, dividing the mask into a vapor deposition area 10 and a non-vapor deposition area 20.

[0032] Among them, the vapor deposition area 10, as the core area of ​​the mask, directly performs the task of forming pixel patterns of organic light-emitting materials (RGB) on the glass substrate. It is equipped with multiple high-precision micro-hole arrays 1 that match the OLED pixel arrangement. The aperture, spacing, and shape accuracy of the micro-holes in the micro-hole array 1 directly determine the resolution, brightness uniformity, and color purity of the final display panel.

[0033] The non-evaporation zone 20 is a support and reinforcement area of ​​the mask plate. It does not participate in the evaporation film formation process. Its main function is to provide stable support for the evaporation zone 10 and resist gravity sagging and thermal stress. It is a key reinforcement skeleton area to improve the overall rigidity of the mask plate. This area integrates a biomimetic honeycomb structure, which uses a regular hexagonal close-packed grid as the basic structural unit. The biomimetic honeycomb structure composed of multiple hexagonal open-cell units 2 can withstand the maximum load with the least amount of material, achieving a balance between lightweight and high rigidity.

[0034] Furthermore, the biomimetic honeycomb structure composed of multiple hexagonal perforated units 2 can efficiently transform the bending stress acting on the mask surface, mainly caused by gravity and tension, into axial tensile and compressive stress within the multiple hexagonal perforated units 2. Moreover, the multiple independent hexagonal perforated units 2 can thermodynamically isolate the long-distance transmission of thermal stress, dividing and dispersing the originally continuous and enormous thermal stress on a single mask into countless localized micro-stresses confined within the hexagonal perforated units 2, structurally preventing overall warping deformation of the mask. Specifically, the honeycomb structure in the non-evaporation zone 20 is made of ultra-thin Invar alloy strip. For ultra-thin strips below 50μm, domestic alternative materials (such as Baosteel Fe-36Ni strip) can be used, reducing dependence on Japanese DNP strips and controlling costs while ensuring wall thickness uniformity (error ≤ ±2μm). The axial tensile strength of Invar alloy is about 500 MPa, and the bending strength is about 350 MPa. The load-bearing capacity of Invar alloy in the axial direction is much higher than that in the bending direction. Therefore, the equivalent elastic modulus of this biomimetic honeycomb structure is 2 to 3 times higher than that of the traditional solid non-vapor-deposited area of ​​the same material and weight. While achieving a weight reduction of 80% (the hollow area accounts for 80% of the area of ​​the non-vapor-deposited area, while the hollow rate of the traditional solid structure is 0%), it also significantly improves the anti-sagging ability.

[0035] Meanwhile, the non-evaporation zone 20 also integrates a microchannel temperature control system to suppress thermal deformation of the mask and solve the problem of insufficient thermal stress compensation in traditional masks. Specifically, the cooling medium is a 40% ethylene glycol aqueous solution with a freezing point as low as -23℃, which can prevent the cooling channel 4 from freezing and blocking in low-temperature environments. At the same time, the solution has a high specific heat capacity and excellent heat dissipation efficiency. Furthermore, an external PID temperature control system can stably control the working temperature of the mask below 100℃ (the temperature of traditional mask evaporation can reach 120-130℃), fundamentally preventing the slippage of the micro-lattice of Invar alloy under high temperature (>120℃) and tension, which would lead to irreversible plastic deformation, i.e., thermal creep. Thermal creep would cause the mask to gradually loosen and permanently lose its precision, thus ensuring that the micro-hole position accuracy error of the mask is small after long-term use.

[0036] Please see Figure 1 and Figure 2In some embodiments, the edges of each of the hexagonal opening units 2 are fitted together, and each of the hexagonal opening units 2 shares the same edges with the hexagonal opening units 2 surrounding it. This limitation enables the non-evaporation area 20 to form a seamless, continuous, thin-walled biomimetic honeycomb skeleton network, which efficiently converts the bending stress generated by gravity and tension into axial tensile and compressive stresses in the honeycomb wall. This achieves maximum weight reduction in the non-evaporation area 20 while improving overall support stiffness, effectively solving the problem of gravity-induced sagging caused by the excessive size of the G8.6 generation mask, and ensuring OLED pixel density (PPI) and color mixing yield. Furthermore, the continuous honeycomb network divides the non-evaporation area 20 into numerous independent micro-units, which can fragment the continuous thermal stress generated by temperature fluctuations in the evaporation chamber into localized stresses, avoiding overall warping caused by long-distance transmission of thermal stress.

[0037] Please see Figure 2 In some embodiments, the wall thickness of each hexagonal aperture unit 2 is 40–60 μm. This wall thickness range provides sufficient axial load-bearing capacity for the hexagonal aperture unit 2. Combined with the closely packed hexagonal structure, the bending stress acting on the mask can be efficiently converted into axial tensile and compressive stress on the aperture wall, avoiding pixel shift and reduced color mixing yield due to insufficient support. Simultaneously, this wall thickness range does not affect the overall weight reduction of the mask, aligning with the concept of balancing lightweight and high rigidity in the non-evaporation zone 20. Furthermore, this wall thickness range facilitates high-precision processing through laser cutting, forming, and other processes.

[0038] Please see Figure 2 In some embodiments, the side length of each hexagonal perforated unit 2 is 2–4 mm. This side length range is reasonably proportioned to the wall thickness range of the hexagonal perforated unit 2, which can balance the requirements of support strength and lightweight while ensuring the high specific stiffness characteristics of the biomimetic honeycomb structure. In addition, the above-mentioned side length range allows the honeycomb unit to form a thermally insulating micro-region of appropriate size. With the help of the cooling channel 4, the thermal stress during vapor deposition can be confined within a single unit, preventing overall warping caused by long-distance transmission of thermal stress. At the same time, this side length range can ensure that the cooling medium can quickly absorb the heat of each unit, stabilizing the working temperature of the mask plate below 100°C and eliminating thermal creep of the Invar alloy. Furthermore, this side length range can achieve high-precision cutting and forming without ultra-precision equipment, avoiding the surge in processing difficulty caused by excessively small side lengths or the decrease in structural stability caused by excessively large side lengths.

[0039] Please see Figure 2 and Figure 3In some embodiments, a reinforcing plate 3 is provided in the hole wall of each hexagonal aperture unit 2, and the extension direction of the reinforcing plate 3 is parallel to the short sides of the mask on both sides. The reinforcing plate 3 can compensate for the shortness of the buckling resistance of the hexagonal aperture unit 2 when it is supported only by the hole wall. Especially when the larger G8.6 generation mask is subjected to gravity and tension, it can effectively prevent the hole wall from deforming or buckling due to local stress concentration, and avoid the displacement of the micro-hole array 10 of the vapor deposition area 10 due to structural deformation. The extension direction of the reinforcing plate 3 parallel to the short side of the mask can cope with the bending stress that is easily generated along the long side direction (i.e., outward tension) of the mask during horizontal vapor deposition. The gravity effect in the long side direction is more significant for large-sized masks. By directional reinforcement, the deformation resistance in the long side direction is improved, which solves the problem that the displacement of the middle and edge of the traditional mask increases with the size. Specifically, the reinforcing plate 3 can be made of the same Invar alloy material as the hexagonal perforated unit 2, and can be integrally formed with the hole wall and cooling channel 4 through high-precision laser selective melting (SLM) technology to achieve synergistic optimization of structural strength, thermal stability and process feasibility.

[0040] Please see Figure 3 In some embodiments, the thickness of the reinforcing plate 3 is 0.3–0.5 mm. This thickness range compensates for the shortcomings of the hexagonal aperture unit 2 with a wall thickness of 40–60 μm in terms of buckling resistance. When the G8.6 generation mask is subjected to gravity and tension, the 0.3–0.5 mm thick reinforcing plate 3 can significantly improve the deformation resistance of the aperture wall. Combined with its extension direction parallel to the short side of the mask, it can directionally resist the bending stress of the mask along its long side. At the same time, this thickness will not increase the overall weight of the mask due to excessive material, thus affecting the overall weight reduction effect of the mask. Specifically, the thickness of the reinforcing plate 3 is greater than the thickness of the side length of the hexagonal perforated unit 2. The honeycomb structure composed of the hexagonal perforated unit 2 is mainly used to achieve the lightweighting of the non-evaporation zone 20 while constructing a basic support skeleton. An excessively thick side length will reduce the weight reduction effect of the non-evaporation zone 20, while an excessively thin side length will not be able to form a stable skeleton. The main function of the reinforcing plate 3 is to directionally strengthen the buckling resistance. Because the mask plate is too large, it is easy to generate bending stress along the long side during horizontal evaporation, resulting in sagging in the middle. The reinforcing plate 3 needs to provide stronger structural rigidity through greater thickness to make up for the shortcomings of the thin wall of the hexagonal perforated unit 2 in resisting local buckling and stress concentration, and ensure that it can resist the deformation caused by gravity and tension.

[0041] Please see Figure 3 In some embodiments, the cooling channel 4 covers the hole wall of the hexagonal opening unit 2 in a serpentine pattern. The serpentine orientation of the cooling channel 4 allows it to cover the hole wall of the hexagonal opening unit 2 to the maximum extent, ensuring that the cooling medium therein can uniformly absorb the heat of each opening unit.

[0042] In some embodiments, the cooling channel 4 is an oxygen-free copper cooling channel, and the hexagonal opening unit 2 is an Invar alloy hexagonal opening unit. High-precision laser selective melting technology is used to integrally form the oxygen-free copper cooling channel and the Invar alloy hexagonal opening unit. Oxygen-free copper has an extremely high thermal conductivity, more than 10 times that of Invar alloy. As a material for the cooling channel 4, it can quickly absorb the heat generated by the Invar alloy hexagonal opening unit 2 during the vapor deposition process. Combined with the serpentine cooling channel 4, heat can be efficiently transferred to the cooling medium, effectively solving the problem of thermal expansion accumulation errors caused by temperature fluctuations in the vapor deposition cavity. The integral forming achieved by high-precision laser selective melting technology avoids the interfacial thermal resistance generated by traditional welding processes, forming a tightly connected integral structure between the oxygen-free copper channel and the Invar alloy opening unit. This eliminates heat transfer losses caused by interfacial gaps and avoids local deformation caused by welding stress, further improving the stability and fatigue resistance of the overall mask structure.

[0043] In some embodiments, the aperture of each micropore in the plurality of micropore arrays 1 is 5–20 μm. The mask needs to meet the requirements of 4K / 8K high resolution and different generation line panel production. For 8K display adaptation, an aperture of 5–8 μm can be selected, while for 4K display adaptation, an aperture of 10–15 μm is selected. This accurately corresponds to the pixel size requirements of the OLED panel, avoiding pixel overlap due to excessively large apertures or insufficient brightness due to excessively small apertures, directly ensuring the resolution, brightness uniformity, and color purity of the display panel. The 5–20 μm aperture range is highly compatible with high-precision laser etching processes, meeting the accuracy requirements of G8.6 generation lines with resolutions above 300 PPI, while avoiding the increased processing difficulty due to excessively small apertures or the decreased structural strength due to excessively large apertures.

[0044] In some embodiments, the vapor deposition area 10 is an Invar alloy vapor deposition area. The vapor deposition area 10 is entirely made of Invar alloy (Fe-36Ni). Invar alloy has an extremely low coefficient of thermal expansion (approximately 1.2×10-6 / ℃ at 20℃). The vapor deposition area 10 made of the above material can significantly reduce the impact of temperature fluctuations in the vapor deposition chamber on the positional accuracy of micro-holes and avoid pixel shift and color mixing problems caused by thermal expansion.

[0045] To further illustrate the enhanced high-precision metal mask provided by the present invention, the following embodiments are provided.

[0046] Example 1

[0047] An enhanced high-precision metal mask includes a mask, a vapor deposition zone made of Invar alloy located in the middle of the mask, and a non-vapor deposition zone made of Invar alloy located near the two side edges of the mask; the vapor deposition zone is provided with a plurality of micropore arrays; the non-vapor deposition zone is provided with a plurality of hexagonal opening units penetrating the mask, and each hexagonal opening unit has a cooling channel that covers the hole wall surface of the hexagonal opening unit in a serpentine manner, and the cooling channel is used to introduce a cooling medium.

[0048] The micropore arrays all have a pore diameter of 5 μm. Each hexagonal aperture unit is edge-to-edge fitted, and each hexagonal aperture unit shares the same edge with the surrounding hexagonal aperture units. Each hexagonal aperture unit has a wall thickness of 50 μm and a side length of 4 mm. A 0.4 mm thick reinforcing plate is provided in the aperture wall of each hexagonal aperture unit, the extension direction of which is parallel to the short sides of the mask plate on both sides. The cooling channel is an oxygen-free copper cooling channel, and the hexagonal aperture units are Invar alloy hexagonal aperture units. High-precision laser selective melting technology is used to integrally form the oxygen-free copper cooling channel and the Invar alloy hexagonal aperture units.

[0049] Example 2

[0050] An enhanced high-precision metal mask includes a mask, a vapor deposition zone made of Invar alloy located in the middle of the mask, and a non-vapor deposition zone made of Invar alloy located near the two side edges of the mask; the vapor deposition zone is provided with a plurality of micropore arrays; the non-vapor deposition zone is provided with a plurality of hexagonal opening units penetrating the mask, and each hexagonal opening unit has a cooling channel that covers the hole wall surface of the hexagonal opening unit in a serpentine manner, and the cooling channel is used to introduce a cooling medium.

[0051] The micropore arrays each have a pore diameter of 10 μm. The edges of each hexagonal aperture unit are fitted together, and each hexagonal aperture unit shares the same edge with the surrounding hexagonal aperture units. Each hexagonal aperture unit has a wall thickness of 60 μm and a side length of 3 mm. A 0.3 mm thick reinforcing plate is provided within the aperture wall of each hexagonal aperture unit, and the extension direction of the reinforcing plate is parallel to the short sides of the mask plate on both sides. The cooling channel is an oxygen-free copper cooling channel, and the hexagonal aperture units are Invar alloy hexagonal aperture units. High-precision laser selective melting technology is used to integrally form the oxygen-free copper cooling channel and the Invar alloy hexagonal aperture units.

[0052] Example 3

[0053] An enhanced high-precision metal mask includes a mask, a vapor deposition zone made of Invar alloy located in the middle of the mask, and a non-vapor deposition zone made of Invar alloy located near the two side edges of the mask; the vapor deposition zone is provided with a plurality of micropore arrays; the non-vapor deposition zone is provided with a plurality of hexagonal opening units penetrating the mask, and each hexagonal opening unit has a cooling channel that covers the hole wall surface of the hexagonal opening unit in a serpentine manner, and the cooling channel is used to introduce a cooling medium.

[0054] The micropore arrays each have a pore diameter of 15 μm. The edges of each hexagonal aperture unit are fitted together, and each hexagonal aperture unit shares the same edge with the surrounding hexagonal aperture units. Each hexagonal aperture unit has a wall thickness of 40 μm and a side length of 2 mm. A 0.5 mm thick reinforcing plate is provided in the aperture wall of each hexagonal aperture unit, and the extension direction of the reinforcing plate is parallel to the short sides of the mask plate on both sides. The cooling channel is an oxygen-free copper cooling channel, and the hexagonal aperture units are Invar alloy hexagonal aperture units. High-precision laser selective melting technology is used to integrally form the oxygen-free copper cooling channel and the Invar alloy hexagonal aperture units.

[0055] Comparative Example 1

[0056] It is basically the same as Example 1, except that Comparative Example 1 does not have a non-evaporation zone.

[0057] Performance testing:

[0058] from Figure 4 and Figure 5 The amount of sag of the mask plate due to its own weight under the tension of the tension mesh (the two short sides of the mask plate are subjected to outward tension) can be seen in Comparative Example 1 ( Figure 4 The maximum deformation under gravity is -0.82392 mm, Example 1 ( Figure 5 The maximum deformation value under gravity is -0.79968mm. Compared with the previous version, the deformation value under gravity of this enhanced FMM is reduced by about 25μm, which can improve the anti-sagging ability of the mask plate and achieve weight reduction while meeting the rigidity requirements.

[0059] In summary, this invention achieves 80% weight reduction in the non-evaporation zone while maintaining high rigidity by employing an enhanced biomimetic honeycomb perforated structure. This effectively converts bending stress acting on the mask surface into axial tensile and compressive stress in the honeycomb walls, allowing the material to withstand loads in its strongest axial direction, thus exhibiting an equivalent elastic modulus far exceeding that of solid materials on a macroscopic scale. Furthermore, the formed independent perforated units isolate the long-range transmission of thermal stress, dividing and dispersing the originally continuous and massive thermal stress on a single mask into numerous localized stresses confined to individual perforated units, structurally preventing overall warping deformation. Simultaneously, by introducing serpentine cooling channels within the perforated units and utilizing an external PID temperature control system, the overall temperature of the mask is regulated, keeping the operating temperature of the mask surface below 100°C, fundamentally eliminating the problem of thermal creep.

[0060] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0061] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0062] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0063] It is understood that those skilled in the art can make equivalent substitutions or changes to the technical solution and inventive concept of the present invention, and all such changes or substitutions should fall within the protection scope of the present invention.

Claims

1. An enhanced high precision metal mask plate, characterized by, The mask plate comprises an evaporation area in the middle of the mask plate and non-evaporation areas near the edges of the mask plate; a plurality of micro-hole arrays are arranged in the evaporation area; a plurality of hexagonal opening units are arranged in the non-evaporation areas, and each hexagonal opening unit is provided with a cooling channel for passing cooling medium.

2. The enhanced high precision metal mask of claim 1, wherein, The edges of each hexagonal opening unit are in contact with each other, and each hexagonal opening unit shares the same edges with the hexagonal opening units arranged around it.

3. The enhanced high precision metal mask of claim 2, wherein, The wall thickness of each hexagonal opening unit is 40-60 μm.

4. The enhanced high precision metal mask of claim 2, wherein, The length of each hexagonal opening unit is 2-4 mm.

5. The enhanced high precision metal mask of claim 2, wherein, A reinforcing plate is arranged in the hole wall of each hexagonal opening unit, and the extension direction of the reinforcing plate is parallel to the short edges of the mask plate.

6. The enhanced high precision metal mask of claim 5, wherein, The thickness of the reinforcing plate is 0.3-0.5 mm.

7. The enhanced high precision metal mask of claim 1, wherein, The cooling channel covers the hole wall surface of the hexagonal opening unit in a serpentine shape.

8. The enhanced high precision metal mask of claim 7, wherein, The cooling channel is an oxygen-free copper cooling channel, and the hexagonal opening unit is an invar alloy hexagonal opening unit, and the oxygen-free copper cooling channel and the invar alloy hexagonal opening unit are integrally formed by using high-precision laser selective melting technology.

9. The enhanced high precision metal mask of claim 1, wherein, The diameter of the micro-holes in the plurality of micro-hole arrays is 5-20 μm.

10. The enhanced high precision metal mask of claim 1, wherein, The evaporation area is an invar alloy evaporation area.

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