Test system and PCB

Abstract

The invention provides a testing system and a PCB, and belongs to the technical field of quality testing. The system comprises a line selection module used for selecting a current detection link from a first detection link and a second detection link, the first detection link being a link used for detecting a connection state of a target non-loading part in a target signal link and a surrounding line corresponding to a target signal, and the second detection link being a link used for detecting a connection state of a target non-loading part and a surrounding line corresponding to a target signal; the second detection link is used for detecting a link of a connection state of a target load part in the target signal link, the target non-loading part is configured with a first detection point corresponding to the target signal, and the target load part is configured with a second detection point corresponding to the target signal; and the light-emitting detection module is used for determining the connection state of the current detection link through the light-emitting state after the test pin is inserted into the first test point or the second test point so as to determine the connection state of the target signal link. The invention aims to test the signal link of the non-loading part on the PCB.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of quality testing, and in particular, to a test system and a PCB. BACKGROUND

[0002] In modern electronic industry, PCB circuit boards have become the core carriers of various intelligent devices. In the face of increasingly fierce market competition, the industry continuously improves the stability and durability standards of PCB products. In order to ensure the quality of circuit boards, after the PCB is completed with parts in the PCBA stage, various tests are performed to ensure the quality of the PCB product, such as flying probe testing, functional testing, open / short testing, and intelligent testing.

[0003] Since the PCB may be assembled with different part configurations according to the needs of different customers, there may be no parts on the PCB. However, in order to improve the quality of the PCB, the signal link of the part without parts still needs to be detected.

[0004] However, the current way of testing the link on the PCB is mostly based on a complete link, that is, the signal link corresponding to the part with parts is tested, and the signal link of the part without parts is difficult to test. Therefore, there is an urgent need for a system that can test the signal link of the part without parts. SUMMARY

[0005] Embodiments of the present application provide a test system and a PCB, which aims to test the signal link of the part without parts on the PCB.

[0006] In a first aspect, the embodiments of the present application provide a test system applied to a PCB, the system is used to detect the connection state of a target signal link of a target part without parts on the PCB, the target signal link is a link for transmitting a target signal between the target part without parts and a target load part; the system comprises: a circuit selection module, configured to select a current detection link from a first detection link and a second detection link, the first detection link is a link for detecting the connection state of the target part without parts and the surrounding circuit corresponding to the target signal in the target signal link, the second detection link is a link for detecting the connection state of the target load part in the target signal link, the target part without parts is configured with a first test point corresponding to the target signal, and the target load part is configured with a second test point corresponding to the target signal; a light emitting detection module, configured to determine the connection state of the current detection link by determining the light emitting state when the first test point or the second test point is inserted into a test probe, so as to determine the connection state of the target signal link.

[0007] Optionally, the light-emitting detection module comprises a power supply and a light-emitting diode, the line selection module comprises a line selector and a total selection switch device, and the system further comprises a control device; A positive pole of the power supply is connected to an input end of the total selection switch device, a negative pole of the power supply is connected to a negative pole of the light-emitting diode, and a positive pole of the light-emitting diode is connected to a first connecting pin of the line selector; A second connecting pin of the line selector is connected to a surrounding line corresponding to a target signal, and the first measuring point arranged on the target load part is connected to a first output end of the total selection switch device, thereby forming a first detection link; A third connecting pin of the line selector is connected to a second measuring point arranged on the target load part, and the second measuring point is connected to a second output end of the total selection switch device, thereby forming a second detection link; The control device is configured to send a link selection signal to the total selection switch device, and the total selection switch device determines the current detection link in response to the link selection signal.

[0008] Optionally, when the target load part has a plurality of target signals, the system further comprises a first selection switch device and a second selection switch device; A plurality of input ends of the first selection switch device are connected to surrounding lines corresponding to respective target signals, and an output end of the first selection switch device is connected to the second connecting pin of the line selector; A plurality of input ends of the second selection switch device are connected to second measuring points arranged on respective target load parts corresponding to the respective target signals, and an output end of the second selection switch device is connected to the third connecting pin of the line selector; The control device is further configured to send a first selection control signal to the first selection switch device and a second selection control signal to the second selection switch device in response to a switching operation, the first selection control signal being used to switch the surrounding line corresponding to the target signal in the first detection link, and the second selection control signal being used to switch the target load part in the second detection link.

[0009] Optionally, the control device is further configured to: detect an insertion signal of a test pin in the first measuring point and the second measuring point in real time; when the insertion signal of the test pin is detected in the first measuring point, send an opening signal to the total selection switch device and the first selection switch device, so that the first detection link serves as the current detection link; When the insertion signal of the test pin is detected in the second test point, an opening signal is sent to the total selection switch device and the second selection switch device, so that the second detection link is used as the current detection link.

[0010] Optionally, a pressure sensor is arranged in the first test point and the second test point. When the test pin is inserted into the first test point or the second test point, the pressure sensor sends a pressure detection result to the control device as an insertion signal.

[0011] Optionally, the first test point and the second test point are a first blind hole containing L1 layer to L2 layer, a second blind hole containing Ln-1 layer to Ln layer, and a buried hole containing L2 layer to Ln-1 layer, and the first blind hole and the second blind hole are plated with copper.

[0012] Optionally, the line selector comprises an insulating connector seat, and the first connecting pin, the second connecting pin and the third connecting pin are arranged on the connector seat. Among the first connecting pin, the second connecting pin and the third connecting pin, a group of sockets is arranged between any two connecting pins, and each group of sockets comprises a first socket and a second socket, the first socket is connected to one connecting pin through a wire, and the second socket is connected to another connecting pin through a wire. A connecting assembly is arranged on each group of sockets, the connecting assembly is detachably connected with each group of sockets, the connecting assembly is used for conducting the first socket and the second socket, and the connecting assembly is used for adjusting the resistance value in the current detection link.

[0013] Optionally, the connecting assembly comprises a first flexible board for plugging into the first socket and a second flexible board for plugging into the second socket. A plurality of first connecting pieces are arranged on the first flexible board, the first connecting piece comprises a first metal contact terminal, a target resistance and a first pin which are connected in sequence through a wire, when the first flexible board is plugged into the first socket, the first metal contact terminal is in contact with a metal contact terminal arranged on the inner wall of the first socket, and the number of the first metal contact terminals is the same as the number of the metal contact terminals arranged on the inner wall of the first socket. A plurality of second connecting pieces are arranged on the second flexible board, the second connecting piece comprises a second metal contact terminal and a second pin which are connected in sequence through a wire, when the second flexible board is plugged into the second socket, the second metal contact terminal is in contact with a metal contact terminal arranged on the inner wall of the second socket, and the number of the second metal contact terminals is the same as the number of the metal contact terminals arranged on the inner wall of the second socket. The plurality of metal contact terminals arranged on the inner walls of the first socket and the second socket are connected in series by wires; The first pin and the second pin are provided with a clamping piece, and when the clamping piece is in a clamped state, the first pin and the second pin are in contact.

[0014] Optionally, the clamping piece includes a clamping sheet and a clamping hole. The clamping sheet is arranged at one end of the first pin away from the target resistor. The clamping hole is arranged at one end of the second pin away from the second metal contact terminal. When the clamping sheet is inserted into the clamping hole, the clamping piece is in a clamped state. When the clamping sheet is pulled out of the clamping hole, the clamping piece is in an unclamped state.

[0015] In a second aspect, the embodiments of the present application provide a PCB, which comprises the test system of the first aspect.

[0016] Advantages: The system can test the connection state of the target signal link of the target non-mounted part on the PCB. The target signal link is divided into a part of test objects, which includes the target non-mounted part and the surrounding circuit corresponding to the target signal. The first detection link is used for testing. The target load part in the target signal link is another part of test objects, and the second detection link is used for testing.

[0017] The current detection link is selected from the first detection link and the second detection link by the circuit selection module. The light-emitting detection module is used for inserting the test pin into the first test point corresponding to the target signal arranged on the target non-mounted part or the second test point corresponding to the target signal arranged on the target load part, and determining the connection state of the current detection link by the light-emitting state, so as to determine the connection state of the target signal link. Therefore, the connection state of the target signal link of the non-mounted part on the PCB can be tested, the open / short circuit problem can be tested, the target signal link is divided into two parts for testing, and the testing efficiency can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 is a functional module diagram of the test system according to an embodiment of the present application; Figure 2 is a connection diagram of a test system according to an embodiment of the present application; Figure 3 is a connection diagram of a test system according to an embodiment of the present application; Figure 4 is a diagram of a test point according to an embodiment of the present application; Figure 5 is a diagram of a test point position for a DIP type part according to an embodiment of the present application; Figure 6 is a structural diagram of a line selector according to an embodiment of the present application; Figure 7 is a diagram of the inside of a socket according to an embodiment of the present application; Figure 8 is a diagram of a connection assembly according to an embodiment of the present application. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0021] PCB: Printed Circuit Board, printed circuit board; PCBA: Printed Circuit Board Assembly, refers to a process of SMT on a PCB bare board, and then DIP insertion, SMT and DIP are both ways of integrating parts on a PCB, SMT does not need to drill holes on the PCB, and DIP needs to insert the PIN of the part into the already drilled holes.

[0022] In modern electronic industry, PCB has become the core carrier of various intelligent devices. In the face of increasingly fierce market competition, the industry continuously improves the stability and durability standards of PCB products. In order to ensure the quality of the circuit board, engineers must strictly implement standardized design processes, especially when dealing with core circuit modules, they must prioritize component screening and performance verification, and through systematic reliability testing to ensure product quality.

[0023] PCB board in the PCBA stage, after the parts are punched, there will be various tests to ensure the quality of the PCB product, for example, flying probe test, function test, open short test and intelligent test, etc. However, with the increasing complexity of electronic devices, the quality test of PCBA also faces greater challenges. The high-density components and node number limit the above-mentioned test methods. In order to ensure the reliability of the quality of PCBA and make the PCBA test proceed smoothly, the design of special parts on the PCB board needs to be improved.

[0024] When designing the PCB board, test points will be added to the link signal net that needs to be tested, which is used for flying probe test in the PCBA stage to test the open short of the link signal net.

[0025] After the parts are punched in the PCBA stage, the function test can also be used to test the quality of the PCB board for the complete link net.

[0026] Open short test uses current detection method or resistance measurement method to judge the connection state between each solder joint and trace of PCB.

[0027] Intelligent test includes AI stress test system, environmental simulation matrix, three-dimensional upgrade path, etc. For AI stress test system, some industrial control device manufacturers introduce machine learning algorithm for stress test, which significantly improves the reliability and life of the product by loading more than rated current and training fault prediction model using thermal imaging data; for environmental simulation matrix, through multi-dimensional environmental simulation such as temperature, humidity and vibration, the performance of PCB in actual use environment is verified, which can significantly reduce the field failure rate; for three-dimensional upgrade path, including dynamic signal tracking method, AI stress test system and environmental simulation matrix, etc. New technologies improve the efficiency of signal integrity verification and product reliability. It can be seen that intelligent test is also for testing the complete link net.

[0028] In summary, the current various tests need to meet the following conditions: Flying probe test requires adding test points or vias on the link signal net.

[0029] Function test: requires complete link signal net.

[0030] Open short test: requires complete link signal net.

[0031] Intelligent test: requires complete link signal net.

[0032] However, due to the research and design of the PCB board, generally one mainboard can be assembled into multiple configurations, such as different customers have different needs, and the same mainboard has different part configurations according to the needs of customers, so there may be missing parts on the PCB board, that is, there are missing parts in one link, which leads to the incomplete link; in addition, the area of the current PCB board is compressed in the small direction, and the part density is also large, so each link signal net on the PCB board is added to the test point, which obviously cannot be achieved, so for the incomplete link and the link signal net without adding the test point, the open short circuit of the link signal net is tested, and the current test method cannot meet the requirements.

[0033] Therefore, for the signal link of the missing part, the embodiment of the application provides a test system, which can not only test the signal link of the missing part on the PCB board, but also improve the test efficiency.

[0034] The test system provided by the embodiment of the application can be applied to a PCB board, such as a PCB board after assembly according to customer needs in the PCBA stage, and the system is used to detect the connection state of a target signal link of a target missing part on the PCB board, and the target signal link is a link for transmitting a target signal between the target missing part and a target load part.

[0035] The missing part refers to a part that does not need to be configured, but the signal and signal link of the missing part have been designed when designing the PCB board, and the missing part is not used according to the needs of users, but in order to improve the quality of the PCB board, the signal link of each signal of the missing part still needs to be detected to determine whether the connection state of the signal link has an open short circuit problem.

[0036] In the actual implementation process, the target missing part and the target signal link of the target missing part that need to be tested can be determined according to the test requirements, the assembly position reserved for the target missing part is designed to have surrounding lines connected to the load part for transmitting the target signal, and the target signal link for transmitting the target signal of the target missing part is formed.

[0037] Referring to Figure 1 , a functional module diagram of a test system in the embodiment of the application is shown, the test system is applied to a PCB board, and the system includes a line selection module and a light emitting detection module.

[0038] Specifically, the line selection module is used to select a current detection link in a first detection link and a second detection link.

[0039] The first detection link is a link for detecting the connection state of the target non-mounting part and the surrounding line corresponding to the target signal in the target signal link, and the second detection link is a link for detecting the connection state of the target load part in the target signal link.

[0040] The light-emitting detection module is configured to determine the connection state of the current detection link by the light-emitting state when the first test point or the second test point is inserted into the test pin, so as to determine the connection state of the target signal link.

[0041] In the actual implementation process, after the target non-mounting part and the target signal link are determined, the test system provided in the embodiment of the application can be deployed on the PCB board, the first test point corresponding to the target signal is configured on the target non-mounting part, and the second test point corresponding to the target signal is configured on the target load part.

[0042] By dividing the target signal link corresponding to the target signal of the target non-mounting part into two test objects, that is, taking the target non-mounting part and the surrounding line corresponding to the target signal as one test object and taking the target load part as another test object, the connection state of the two test objects can be detected separately by switching the current detection link through the line selection module, so that the range of investigation is reduced and the test efficiency is improved.

[0043] In a feasible implementation manner, taking the target signal corresponding to one signal of the target non-mounting part as the target signal and testing the target test link corresponding to the target signal as an example, the light-emitting detection module of the test system includes a power supply and a light-emitting diode, the line selection module includes a line selector and a general selection switch device, and the system further includes a control device.

[0044] Referring to Figure 2 , a connection schematic diagram of the test system provided in the embodiment of the application is shown, in which a solid line represents a detection link and a dashed line represents a signal interaction path with the control device.

[0045] The positive electrode of the power supply is connected to the input end of the general selection switch device, the negative electrode of the power supply is connected to the negative electrode of the light-emitting diode, and the positive electrode of the light-emitting diode is connected to the first connecting pin of the line selector.

[0046] The second connecting pin of the line selector is connected to the surrounding line corresponding to the target signal, and the first test point configured on the target non-mounting part is connected to the first output end of the general selection switch device, thereby forming a first detection link.

[0047] The third connecting pin of the line selector is connected to a second measuring point arranged on the target load part, and connected to a second output end of the total selection switch device through the second measuring point, thereby forming a second detection link.

[0048] The control device is configured to send a link selection signal to the total selection switch device in response to a link selection operation, and the total selection switch device is configured to determine the current detection link in response to the link selection signal.

[0049] In actual implementation, the control device can be a BMC arranged on a PCB, or other control device arranged on the PCB, or an additional control device, and the total selection switch device can be a Switch IC switch chip, which is not limited in the embodiments of the present application.

[0050] For example, when the first detection link needs to be tested, a tester can select the first detection link through a link selection operation, and the control device sends a first link selection signal to the total selection switch device in response to the link selection operation, and the total selection switch device selects the first detection link in response to the first link selection signal.

[0051] Then, the test pin is inserted into the first measuring point, the first detection link is turned on, and if the light-emitting diode is in a light-emitting state, the target load part and the surrounding line corresponding to the target signal are normal, and there is no open / short circuit problem, and if the light-emitting diode is in a non-light-emitting state, the target load part and the surrounding line corresponding to the target signal have an open / short circuit problem, which needs to be checked and repaired.

[0052] When the second detection link needs to be tested, a tester can select the second detection link through a link selection operation, and the control device sends a second link selection signal to the total selection switch device in response to the link selection operation, and the total selection switch device selects the second detection link in response to the second link selection signal.

[0053] Then, the test pin is inserted into the second measuring point, the second detection link is turned on, and if the light-emitting diode is in a light-emitting state, the target load part has no open / short circuit problem, and if the light-emitting diode is in a non-light-emitting state, the target load part has an open / short circuit problem, which needs to be checked and repaired.

[0054] In addition to the tester determining the current detection link through a link selection operation, a pressure sensor can also be arranged in the first measuring point and the second measuring point, and when the test pin is inserted into the first measuring point or the second measuring point, the pressure sensor sends a pressure detection result as an insertion signal to the control device.

[0055] The control device is used for detecting the insertion signal of the test pin in the first test point and the second test point in real time, sending a first link selection signal to the total selection switch device when the insertion signal of the test pin is detected in the first test point, and selecting the first detection link in response to the first link selection signal; sending a second link selection signal to the total selection switch device when the insertion signal of the test pin is detected in the second test point, and selecting the second detection link in response to the second link selection signal.

[0056] In a feasible implementation, a plurality of signals of the target non-assembly part are taken as target signals, and the system further comprises a first selection switch device and a second selection switch device when testing the target test link corresponding to each target signal.

[0057] With reference to Figure 3 , a connection diagram of the test system provided by the embodiment is shown, in which a solid line represents a detection link, and a dashed line represents a signal interaction path with the control device.

[0058] The plurality of input ends of the first selection switch device are connected to the peripheral circuit corresponding to each target signal, and the output end of the first selection switch device is connected to the second connecting pin of the line selector.

[0059] The plurality of input ends of the second selection switch device are connected to the second test point configured on the target load part corresponding to each target signal, and the output end of the second selection switch device is connected to the third connecting pin of the line selector.

[0060] The control device is further used for sending a first selection control signal to the first selection switch device and a second selection control signal to the second selection switch device in response to a switching operation, the first selection control signal being used for switching the peripheral circuit corresponding to the target signal in the first detection link, and the second selection control signal being used for switching the target load part in the second detection link.

[0061] For example, when the target non-assembly part includes three target signals, the target transmission link 1 corresponding to the target signal 1 includes the peripheral circuit 1 and the load part 1, the target transmission link 2 corresponding to the target signal 2 includes the peripheral circuit 2 and the load part 2, the target transmission link 3 corresponding to the target signal 3 includes the peripheral circuit 3 and the load part 3, and the first test point for testing the three target signals respectively is configured on the target non-assembly part, and the second test point corresponding to the target signal is configured on the load part 1, the load part 2 and the load part 3, i.e., each target signal corresponds to one test point on the target non-assembly part and the load part respectively.

[0062] The three input ends of the first selection switch device are connected to the surrounding line 1, the surrounding line 2 and the surrounding line 3 respectively; the three input ends of the second selection switch device are connected to the second measuring point arranged on the load part 1, the second measuring point arranged on the load part 2 and the second measuring point arranged on the load part 3 respectively.

[0063] The tester tests the target transmission link 1, the target transmission link 2 and the target transmission link 3 by switching the surrounding line corresponding to the target signal in the first detection link and / or switching the target load part in the second detection link.

[0064] After determining any target transmission link to be tested by the switching operation, the control device is further configured to: The insertion signal of the test pin in the first measuring point and the second measuring point is detected in real time. For example, a pressure sensor can be arranged in each first measuring point and each second measuring point. When the test pin is inserted into any first measuring point or any second measuring point, the pressure sensor in the measuring point sends the pressure detection result as the insertion signal to the control device. When the insertion signal of the test pin is detected in the first measuring point, the opening signal is sent to the total selection switch device and the first selection switch device, so that the first detection link is used as the current detection link.

[0065] When the insertion signal of the test pin is detected in the second measuring point, the opening signal is sent to the total selection switch device and the second selection switch device, so that the second detection link is used as the current detection link.

[0066] Referring to Figure 4 , a schematic diagram of the measuring point provided by the embodiment of the application is shown. In a feasible implementation manner, the first measuring point and the second measuring point are a first blind hole containing L1 layer to L2 layer, a second blind hole containing Ln-1 layer to Ln layer and a buried hole containing L2 layer to Ln-1 layer, and the first blind hole and the second blind hole are plated with copper.

[0067] In the actual implementation process, when the pressure sensor is arranged in the measuring point, the pressure sensor can be arranged at the L2 layer of the measuring point.

[0068] Because the measuring point is arranged on the non-loading part and the load part, the signal has a redundant conductor. If the conductor is too long, it may affect the integrity of the signal link and the quality of the transmitted signal. By designing such a measuring point plated with copper on the top and the bottom and not plated with copper in the middle, the length of the redundant conductor of the signal link can be effectively reduced.

[0069] For example, the whole PCB board is 92.9 mil thick, and the thickness of the L1 / L2, Ln / Ln-1 layers is 3 mil. If a via copper-plated test point is designed, the excess conductor length is at least 92.9 mil, or even longer, while the test point provided by the embodiment of the present application is plated with copper on the top and bottom and not plated with copper in the middle, and the excess conductor length of the test point is only 3 mil, which has less impact on the signal quality.

[0070] When the test pin is inserted into the test point, the L1 and Ln layers of the test point are connected, and the detection link corresponding to the test point is turned on. When the test pin is removed, the detection link corresponding to the test point is no longer turned on, and the excess conductor of the tested link can also be controlled to be minimum, so that the signal quality is not affected.

[0071] In the actual implementation process, when the configuration position of the test point is selected, the non-mounting part and the load part include SMT parts and reflow soldering DIP parts. The type of parts has a steel mesh. When the parts are punched, the solder paste is brushed in the hole of the pad or the DIP type PIN. In order to better solder, the solder paste has a non-conductive flux in the surface layer of the solder paste, so that a protective film is formed. Therefore, directly inserting the test pin into the hole of the part is often not conductive, and the flux needs to be wiped off additionally. However, this will affect the test speed, and further affect the production speed.

[0072] Therefore, when the non-mounting part or the load part is an SMT part, the test point can be punched on the PIN corresponding to the target signal. After the subsequent test is completed, the L1 layer blind hole on the PIN can be resin plugged, and then electroplated to be flat, so as to ensure the integrity of the mounting conditions of the parts.

[0073] Referring to Figure 5 , a schematic diagram of a test point position for a DIP part provided by the embodiment of the present application is shown. When the non-mounting part or the load part is a reflow soldering DIP part, if the pad of the signal PIN hole of the DIP part is large enough, the position of the test point can be designed on the pad like the SMT part, but the test point is required to be more than 7 mil away from the hole wall to ensure that the hole is not damaged. If the pad is not large enough, the pad can be offset and tangent to the pad.

[0074] Referring to Figure 6 , a structural schematic diagram of a line selector provided by the embodiment of the present application is shown. The line selector includes an insulating connecting seat. The first connecting leg, the second connecting leg and the third connecting leg are arranged on the connecting seat.

[0075] In the actual implementation process, the line selector is punched into the PCB board. The first connecting leg, the second connecting leg and the third connecting leg have conductivity. The layout of the line selector is selected to be placed between the surrounding line of the target non-mounting part and the target load part.

[0076] For the line selector provided by the embodiment of the application, a set of sockets is arranged between any two of the first connecting pin, the second connecting pin and the third connecting pin, each set of sockets includes a first socket and a second socket, any socket is a groove on the connecting seat, the first socket is connected to one connecting pin through a wire, and the second socket is connected to another connecting pin through a wire.

[0077] Referring to Figure 7 , a schematic diagram of the inside of the socket provided by the embodiment of the application is shown, a plurality of metal contact terminals are arranged on the inner walls of the first socket and the second socket, and the plurality of metal contact terminals are connected in series through wires.

[0078] A connecting assembly is arranged on each set of sockets, the connecting assembly is detachably connected with each set of sockets, the connecting assembly is used for conducting the first socket and the second socket, and the connecting assembly is used for adjusting the resistance value in the current detection link.

[0079] Referring to Figure 8 , a schematic diagram of the connecting assembly provided by the embodiment of the application is shown, the connecting assembly includes a first flexible board used for being plugged into the first socket and a second flexible board used for being plugged into the second socket.

[0080] A plurality of first connecting pieces are arranged on the first flexible board, the first connecting piece includes a first metal contact terminal, a target resistance and a first pin needle which are connected in sequence through wires.

[0081] When the first flexible board is plugged into the first socket, the first metal contact terminal is in contact with the metal contact terminal arranged on the inner wall of the first socket, the number of the first metal contact terminal is the same as that of the metal contact terminal arranged on the inner wall of the first socket, and the layout interval of the metal contact terminals is also the same.

[0082] A plurality of second connecting pieces are arranged on the second flexible board, the second connecting piece includes a second metal contact terminal and a second pin needle which are connected in sequence through wires.

[0083] When the second flexible board is plugged into the second socket, the second metal contact terminal is in contact with the metal contact terminal arranged on the inner wall of the second socket, the number of the second metal contact terminal is the same as that of the metal contact terminal arranged on the inner wall of the second socket, and the layout interval of the metal contact terminals is also the same.

[0084] The first pin needle and the second pin needle are provided with a clamping piece, when the clamping piece is in a clamping state, the first pin needle and the second pin needle are in contact, the first pin needle and the second pin needle are metal materials with wire properties, in the actual implementation process, the material of the pin needle can be selected according to the actual application requirement, and the embodiment is not limited.

[0085] As Figure 8 The clamping piece includes a clamping sheet and a clamping hole, the clamping sheet is arranged at one end of the first pin away from the target resistor, and the clamping hole is arranged at one end of the second pin away from the second metal contact terminal.

[0086] The clamping hole can be made of rubber, and the clamping sheet can be a triangular rubber sheet, so that the tester can pull out or insert the clamping sheet from the clamping hole more easily; when the clamping sheet is inserted into the clamping hole, the clamping piece is in a clamped state; when the clamping sheet is pulled out of the clamping hole, the clamping piece is in an unclamped state.

[0087] In actual implementation, the resistance value of the resistor in the detection link can be changed by adjusting the number of clamping pieces, and the resistance value of the target resistor can be set according to actual application requirements, which is not limited in the embodiment.

[0088] Suppose that two groups of first connecting pieces, first connecting piece 1 and first connecting piece 2, are arranged on the first soft board, and two groups of second connecting pieces, second connecting piece 1 and second connecting piece 2, are arranged on the second soft board, and the target resistor in each group of first connecting pieces is 1 ohm.

[0089] When only the first connecting piece 1 and the second connecting piece 1 are connected through the clamping piece, a 1-ohm resistor is added to the detection link connected by the two connecting pins; When the first connecting piece 1 and the second connecting piece 1, and the first connecting piece 2 and the second connecting piece 2 are connected through the respective clamping pieces, two 1-ohm resistors are connected in parallel, and according to the equivalent formula of multiple resistors connected in parallel:

[0090] That is, a 1 / 2-ohm resistor is added to the detection link connected by the two connecting pins.

[0091] When testing the first detection link and the second detection link, a set of sockets between the first connecting pin and the second connecting pin of the line selector are inserted into the connecting assembly, and a set of sockets between the first connecting pin and the third connecting pin are inserted into the connecting assembly, so that the first detection link and the second detection link can be tested respectively.

[0092] In a feasible implementation, if the target component part is mounted, the connecting assembly can be inserted into a set of sockets between the second connecting pin and the third connecting pin of the line selector, at this time, the target signal link from the component part to the target load part is complete, and the function test can be continued, if the function test is normal, it indicates that the target signal link is normal, if the function test cannot be performed, it indicates that there is a problem in the target signal link, which needs to be further investigated.

[0093] The test system provided by the embodiment of the present application can test the connection state of the target signal link of the target non-mounted part on the PCB, and the target signal link is divided into a part of test objects, which are the target non-mounted part and the surrounding circuit corresponding to the target signal, and the target load part in the target signal link is another part of test objects, which is tested through the second detection link. The test efficiency is improved, and the PCB with mounted parts can be tested more completely, the quality of the PCB is improved, the probability of maintenance and return of the PCB is reduced, and thus the quality of the electronic product is improved and the defective rate is reduced.

[0094] The embodiment of the present application also provides a PCB, which comprises the test system provided by the embodiment of the present application.

[0095] Each embodiment in the present specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same and similar parts of each embodiment can be referred to each other.

[0096] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, device or computer program product. Therefore, the embodiments of the present application can adopt a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware aspects. Moreover, the embodiments of the present application can adopt the form of a computer program product implemented on one or more computer usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer usable program codes.

[0097] The embodiments of the present application are described with reference to the flowcharts and / or block diagrams of the method, terminal device (system) and computer program product according to the embodiments of the present application. It should be understood that each flow and / or block in the flowcharts and / or block diagrams, and the combination of the flows and / or blocks in the flowcharts and / or block diagrams can be realized by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, special-purpose computer, embedded processor or other programmable data processing terminal device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device produce a means for implementing the functions specified in the flowcharts and / or block diagrams. Figure 1 The means for implementing the functions specified in one or more flows and / or blocks. Figure 1 The means for implementing the functions specified in one or more flows and / or blocks.

[0098] These computer program instructions can also be stored in a computer readable storage medium, which can guide the computer or other programmable data processing terminal device to work in a specific manner, so that the instructions stored in the computer readable storage medium produce a product including instruction means, which implements the functions specified in the flowcharts and / or block diagrams. Figure 1one or more processes and / or blocks Figure 1 the function specified in the one or more blocks or one or more blocks.

[0099] These computer program instructions can also be loaded into a computer or other programmable data processing terminal device, so that a series of operation steps are performed on the computer or other programmable terminal device to generate a computer implemented process, so that the instructions executed on the computer or other programmable terminal device provide a process for implementing the flow Figure 1 one or more processes and / or blocks Figure 1 the function specified in the one or more blocks or one or more blocks.

[0100] Although the preferred embodiments of the present application have been described, those skilled in the art who understand the basic inventive concept after getting to know the present application can make additional changes and modifications to the embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the embodiments of the present application.

[0101] Finally, it should also be noted that, in this document, the relationship terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or terminal device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or terminal device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or terminal device including the element.

[0102] The principles and implementation modes of the present application are described by applying specific examples in this document, and the above description of the embodiments is only used to help understand the method of the present application and its core idea; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation mode and application range; in view of the above, the content of the present description should not be understood as a limitation of the present application.

Claims

1. A test system, characterized by, The system is applied to a PCB board, and is used for detecting a connection state of a target signal link of a target non-mounted part on the PCB board, the target signal link being a link for transmitting a target signal between the target non-mounted part and a target load part; the system comprises: a line selection module, configured to select a current detection link from among a first detection link and a second detection link, the first detection link being a link for detecting a connection state of the target non-mounted part and a surrounding line corresponding to the target signal in the target signal link, the second detection link being a link for detecting a connection state of the target load part in the target signal link, the target non-mounted part being configured with a first measuring point corresponding to the target signal, and the target load part being configured with a second measuring point corresponding to the target signal; a light-emitting detection module, configured to determine the connection state of the current detection link by a light-emitting state when the first measuring point or the second measuring point is inserted into a test pin, so as to determine the connection state of the target signal link.

2. The system of claim 1, wherein, The light-emitting detection module comprises a power supply and a light-emitting diode, the line selection module comprises a line selector and a total selection switch device, and the system further comprises a control device; a positive electrode of the power supply is connected to an input end of the total selection switch device, a negative electrode of the power supply is connected to a negative electrode of the light-emitting diode, and a positive electrode of the light-emitting diode is connected to a first connecting pin of the line selector; a second connecting pin of the line selector is connected to the surrounding line corresponding to the target signal, and the first measuring point configured on the target non-mounted part is connected to a first output end of the total selection switch device, so as to form the first detection link; a third connecting pin of the line selector is connected to the second measuring point configured on the target load part, and the second measuring point is connected to a second output end of the total selection switch device, so as to form the second detection link; the control device is configured to send a link selection signal to the total selection switch device, and the total selection switch device determines the current detection link in response to the link selection signal.

3. The system of claim 2, wherein, When the target non-mounted part has a plurality of target signals, the system further comprises a first selection switch device and a second selection switch device; a plurality of input ends of the first selection switch device are connected to the surrounding lines corresponding to the target signals respectively, and an output end of the first selection switch device is connected to the second connecting pin of the line selector; a plurality of input ends of the second selection switch device are connected to the second measuring points configured on the target load parts corresponding to the target signals respectively, and an output end of the second selection switch device is connected to the third connecting pin of the line selector; the control device is further configured to send a first selection control signal to the first selection switch device and a second selection control signal to the second selection switch device in response to a switching operation, the first selection control signal being used for switching the surrounding lines corresponding to the target signals in the first detection link, and the second selection control signal being used for switching the target load parts in the second detection link.

4. The system of claim 3, wherein, The control device is further configured to: Detecting an insertion signal of the test pin in the first detection point and the second detection point in real time; When the insertion signal of the test pin is detected in the first detection point, sending an opening signal to the total selection switch device and the first selection switch device to make the first detection link as the current detection link; When the insertion signal of the test pin is detected in the second detection point, sending an opening signal to the total selection switch device and the second selection switch device to make the second detection link as the current detection link.

5. The system of claim 4, wherein, A pressure sensor is arranged in the first detection point and the second detection point; When the test pin is inserted into the first detection point or the second detection point, the pressure sensor sends a pressure detection result as an insertion signal to the control device.

6. The system according to any one of claims 1-5, characterized in that, The first detection point and the second detection point are a first blind hole containing L1 layer to L2 layer, a second blind hole containing Ln-1 layer to Ln layer, and a buried hole containing L2 layer to Ln-1 layer, and the first blind hole and the second blind hole are plated with copper.

7. The system of claim 2, wherein, The line selector comprises an insulating connecting seat, and the connecting seat is provided with the first connecting pin, the second connecting pin and the third connecting pin; In the first connecting pin, the second connecting pin and the third connecting pin, a group of sockets is arranged between any two connecting pins, each group of sockets comprises a first socket and a second socket, the first socket is connected to one connecting pin through a wire, and the second socket is connected to another connecting pin through a wire; Each group of sockets is provided with a connecting assembly, the connecting assembly is detachably connected with each group of sockets, the connecting assembly is used for conducting the first socket and the second socket, and the connecting assembly is used for adjusting the resistance value in the current detection link.

8. The system of claim 7, wherein, The connecting assembly comprises a first flexible board for plugging into the first socket and a second flexible board for plugging into the second socket; The first flexible board is provided with a plurality of first connecting pieces, the first connecting piece comprises a first metal contact terminal, a target resistance and a first pin which are connected in sequence through wires, when the first flexible board is plugged into the first socket, the first metal contact terminal is in contact with the metal contact terminal arranged on the inner wall of the first socket, and the number of the first metal contact terminals is the same as that of the metal contact terminals arranged on the inner wall of the first socket; The second flexible board is provided with a plurality of second connecting pieces, the second connecting piece comprises a second metal contact terminal and a second pin which are connected in sequence through wires, when the second flexible board is plugged into the second socket, the second metal contact terminal is in contact with the metal contact terminal arranged on the inner wall of the second socket, and the number of the second metal contact terminals is the same as that of the metal contact terminals arranged on the inner wall of the second socket; The plurality of metal contact terminals arranged on the inner wall of the first socket and the second socket are connected in series through wires; The first pin and the second pin are provided with a clamping piece, when the clamping piece is in a clamping state, the first pin and the second pin are in contact.

9. The system of claim 8, wherein, The clamping piece comprises a clamping sheet and a clamping port; The clamping sheet is arranged at one end of the first pin away from the target resistance; The card interface is arranged at one end of the second pin away from the second metal contact terminal; When the card piece is inserted into the card interface, the card piece is in a carded state; When the card piece is pulled out of the card interface, the card piece is in an uncarded state.

10. A PCB board characterized by, The PCB board comprises the test system of any one of claims 1-9.

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