Display device

Abstract

The invention discloses a display device. The display device comprises a substrate; a common electrode layer provided on the substrate, in which the common electrode layer includes a first common pad protruding toward a first direction from a first reference side surface extending along a second direction, the second direction crossing the first direction; a driving layer provided between the substrate and the common electrode layer; a display layer provided between the driving layer and the common electrode layer; a first conductive via spaced apart from the driving layer, and provided between the substrate and the first common pad; a driving chip provided opposite the first conductive via with respect to the driving layer; and a printed circuit substrate which is provided on the opposite side of the display layer with respect to the substrate.

Description

[0001] This application is a divisional application of the application for patent application No. 202011431095.4, filed on December 7, 2020, with the title of "Display device".

[0002] Cross Reference to Related Applications

[0003] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0046822 filed on April 17, 2020, which is hereby incorporated by reference for all purposes as if fully set forth herein. TECHNICAL FIELD

[0004] The present application relates to a display device. BACKGROUND

[0005] Types of electronic paper include a twist ball display using a semi-spherical twist ball with an electrostatic charge, an electrophoretic display using an electrophoretic method and a microcapsule, an in-plane switching type electrophoretic display, and a cholesteric display using a cholesteric liquid crystal. The electrophoretic display, which is the most commercialized, utilizes an electrophoresis phenomenon, which is a phenomenon in which charged particles dispersed in a dielectric liquid move by an applied electric field.

[0006] The most representative electrophoretic display utilizes a microcapsule filled with a dielectric liquid, which contains a plurality of types of ink particles having different charging characteristics and colors. When the microcapsule is mixed with a binder and placed between upper and lower electrodes, and then an electric field is applied, the charged ink particles move to the surface according to the electric field applied to each pixel, thereby completing color development.

[0007] The in-plane switching type electrophoretic display has a partition wall structure called a microcup The microcup structure is formed by molding a photosensitive polymer layer using a calender having a patterned surface, and then curing it by ultraviolet rays. When viewed on a plane, the microcup structure can have various shapes, but generally has a hexagonal honeycomb structure. The in-plane switching type electrophoretic display is manufactured by injecting an electrophoretic dispersion liquid obtained by dispersing various charged pigment particles in a dielectric liquid into the microcup structure and filling it, and then sealing the inlet of the microcup using a sealing layer formed by calendering. SUMMARY

[0008] The problem to be solved is to provide a display device in which a non-display area is miniaturized.

[0009] The problem to be solved is to provide a display device including an additional element.

[0010] However, the problem to be solved is not limited to the disclosure.

[0011] One aspect of embodiments of the present disclosure can provide a display device including: a substrate; a common electrode layer provided on the substrate, wherein the common electrode layer includes a first common pad that protrudes from a first reference side extending in a first direction toward a second direction intersecting the first direction; a driving layer provided between the substrate and the common electrode layer; a display layer provided between the driving layer and the common electrode layer; a first conductive via provided between the substrate and the first common pad, spaced apart from the driving layer; and a driving chip provided opposite the first conductive via with reference to the driving layer.

[0012] The display device can further include: a second conductive via spaced apart from the first conductive via along the first direction, the common electrode layer further including a second common pad provided on the second conductive via, and the second common pad protruding from the first reference side.

[0013] The first common pad and the second common pad can be respectively arranged on two end portions arranged opposite each other along the first direction of the first reference side.

[0014] The display device can further include a protection layer provided on the common electrode layer, wherein the protection layer includes: a first protection pad provided on the first common pad; and a second protection pad provided on the second common pad, wherein the first protection pad and the second protection pad protrude from a second reference side of the protection layer extending in the first direction, and the protection layer, the first protection pad, and the second pad can include an electrically insulating material.

[0015] The first common pad and the second common pad can be respectively provided within the first protection pad and the second protection pad, from an angle along a third direction perpendicular to an upper surface of the substrate.

[0016] The substrate can include: a first protruding substrate provided opposite the first protection pad with reference to the first conductive via; and a second protruding substrate provided opposite the second protection pad with reference to the second conductive via, wherein the first and second protruding substrates can protrude from a third reference side of the substrate extending in the first direction.

[0017] A display device can include: a sealing film extending along an edge of the protection layer, an edge of the first protection pad, and an edge of the second protection pad on the substrate.

[0018] a side surface of the sealing film, which can extend along a third direction perpendicular to the upper surface of the substrate.

[0019] a distance between the side surface of the sealing film and the protective layer can be smaller as further away from the upper surface of the substrate, from an angle along a third direction perpendicular to the upper surface of the substrate.

[0020] the sealing film, which can constitute a single layer film with the protective layer, the first protective pad, and the second protective pad.

[0021] a display device, which can include a printed circuit substrate provided opposite to the display layer with reference to the substrate, and an additional element provided on the printed circuit substrate, wherein the additional element, which can include at least one light emitting component and an antenna component, can be disposed between the first protective pad and the second protective pad, from an angle along a third direction perpendicular to the upper surface of the substrate.

[0022] the substrate, which can include a first protruding substrate provided between the first conductive via and the printed circuit substrate, and a second protruding substrate provided between the second conductive via and the printed circuit substrate, wherein the first and second protruding substrates, which can protrude from a third reference side surface of the substrate extending along the first direction, and the additional element can be exposed between the first protruding substrate and the second protruding substrate.

[0023] the first common pad can be disposed on any one of two end portions disposed opposite to each other along the first direction of the first reference side surface.

[0024] the first common pad can be disposed on a region between the two end portions disposed opposite to each other along the first direction of the first reference side surface.

[0025] the display device can further include a housing, wherein the substrate, the driving layer, the display layer, the protective layer, the first protective pad, the second protective pad, the first conductive via, the second conductive via, and the driving chip are disposed within the housing, and the housing can include a first window overlapping the display layer along a third direction perpendicular to the upper surface of the substrate.

[0026] The display device can further include a printed circuit substrate provided opposite the substrate from the display layer, and a light emitting component provided on the printed circuit substrate, wherein the printed circuit substrate and the light emitting component can be disposed within the housing, and the housing can further include a second window overlapping the light emitting component along the third direction.

[0027] One aspect of an embodiment of the present disclosure can provide a display device including a substrate, an electronic paper layer provided on the substrate, and a driving chip controlling the electronic paper layer, wherein the driving chip and the electronic paper layer are disposed along a first direction parallel to an upper surface of the substrate, and the electronic paper layer has a first protruding portion and a second protruding portion protruding from a reference side surface disposed opposite the driving chip, and the driving chip generates an electric field in the electronic paper layer, thereby controlling electrophoretic particles in the electronic paper layer.

[0028] The display device can include a first conductive via provided between the first protruding portion and the substrate, and a second conductive via provided between the second protruding portion and the substrate, wherein the first conductive via and the second conductive via can apply a common voltage to the electronic paper layer.

[0029] The display device can further include a printed circuit substrate provided opposite the substrate from the electronic paper layer, and an additional element provided on the printed circuit substrate, wherein the additional element can include at least one light emitting component and an antenna component, and the additional element can be disposed between the first protruding portion and the second protruding portion from an angle along a second direction perpendicular to the upper surface of the substrate.

[0030] The display device can further include a housing covering the substrate, the electronic paper layer, the driving chip, the printed circuit substrate, and the additional element, wherein the electronic paper layer includes a display area in which the electrophoretic particles are provided, and a non-display area provided at a periphery of the display area, and the housing can include a first window exposing the display area of the electronic paper layer, and a second window overlapping the additional element along the second direction. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 A perspective view of a display device according to an exemplary embodiment.

[0032] Figure 2 A plan view of a display device of Figure 1

[0033] ​Figure 3 is a cross-sectional view along line A-A' of Figure 2 .

[0034] Figure 4 is a cross-sectional view along line B-B' of Figure 2 .

[0035] Figure 5 is a perspective view of a display device according to an exemplary embodiment.

[0036] Figure 6 is a plan view of a display device of Figure 5 .

[0037] Figure 7 is a cross-sectional view along line C-C' of Figure 6 .

[0038] Figure 8 is a perspective view of a display device according to an exemplary embodiment.

[0039] Figure 9 is a plan view of a display device of Figure 8 .

[0040] Figure 10 is a cross-sectional view along line D-D' of Figure 9 .

[0041] Figure 11 is a plan view of a display device according to an exemplary embodiment.

[0042] Figure 12 is a cross-sectional view along line E-E' of Figure 11 .

[0043] Figure 13 is a cross-sectional view along line F-F' of Figure 11 .

[0044] Figure 14 is a cross-sectional view along line E-E' of a display device according to an exemplary embodiment, corresponding to Figure 11 .

[0045] Figure 15 is a cross-sectional view along line F-F' of a display device of Figure 14 , corresponding to Figure 11 .

[0046] Figure 16 is a perspective view of a display device according to an exemplary embodiment.

[0047] Figure 17 is a plan view of a display device of Figure 16 .

[0048] Figure 18 is a cross-sectional view along lineFigure 17 A cross-sectional view of the G-G' line.

[0049] Figure 19 This is a perspective view of a display device according to an exemplary embodiment.

[0050] Figure 20 for Figure 19 A plan view of the display device.

[0051] Figure 21 According to Figure 20 A cross-sectional view of the H-H' line.

[0052] Figure 22 This is a perspective view of a display device according to an exemplary embodiment.

[0053] Figure 23 for Figure 22 A plan view of the display device.

[0054] Figure 24 According to Figure 23 A cross-sectional view of line I-I'.

[0055] Figure 1 This is a perspective view of a display device according to an exemplary embodiment.

[0056] Figure 2 for Figure 1 A plan view of the display device. Detailed Implementation

[0057] The embodiments will now be described in more detail with reference to the accompanying drawings. In these drawings, the same reference numerals denote the same technical features, and for clarity and convenience, the dimensions of each technical feature may be enlarged. Furthermore, the embodiments described below are merely exemplary and various modifications can be made based on these embodiments.

[0058] In the following text, the term "upper part" or "above" can include not only the part that is in direct contact with the surface, but also the part that is not in contact with the surface.

[0059] Singular expressions include plural expressions unless the context clearly indicates otherwise. Furthermore, when a part “includes” a technical feature, it means that other technical features may be further included rather than excluded, unless otherwise clearly stated.

[0060] Figure 3 This is a perspective view of a display device according to an exemplary embodiment. Figure 2 for Figure 4 A plan view of the display device. Figure 2 According to Figures 1 to 4 A cross-sectional view of line A-A'. Figure 5A cross-sectional view taken along the B-B' line of Figure 6

[0061] Referring to Figure 5 A display device 1 can be provided. The display device 1 can include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a common pad 410, a conductive via 600, a lower pad 610, a protection layer 500, a protection pad 510, and a sealing film 700. The driving layer 200, the display layer 300, the common electrode layer 400, the common pad 410, the protection layer 500, and the protection pad 510 can be referred to as an electronic paper layer. The substrate 100 can include a transparent electrically insulating material. For example, the substrate 100 can be a glass substrate or a plastic substrate.

[0062] The driving chip 10 can be provided on the substrate 100. The driving chip 10 can be electrically connected to the driving layer 200 and the common electrode layer 400. For example, the driving chip 10 can be electrically connected to the driving layer 200 and the common electrode layer 400 through a wire (not shown) provided on the substrate 100. The driving chip 10 can control a driving element in the driving layer 200 and can apply a common voltage to the common electrode layer 400.

[0063] The driving layer 200 can be provided on the substrate 100. The driving layer 200 and the driving chip 10 can be arranged along a first direction DR1 parallel to an upper surface 100u of the substrate 100. For example, the driving layer 200 can be spaced apart from the driving chip 10 along the first direction DR1. The driving layer 200 can include a driving element, a first conductive line, and a second conductive line. The driving element can define each pixel. For example, the driving element can be a thin film transistor. The driving element can respectively have a pixel electrode facing the display layer 300.

[0064] The first conductive line can extend along the first direction DR1 parallel to the upper surface 100u of the substrate 100. The second conductive line can extend along a second direction DR2 parallel to the upper surface 100u of the substrate 100 and intersecting the first direction DR1. The driving element can be respectively arranged in an area where the first conductive line and the second conductive line intersect each other. The first conductive line and the second conductive line can receive an electrical signal from the driving chip. A driving voltage can be applied to the pixel electrode of the driving element in the area where the first conductive line and the second conductive line to which the electrical signal is applied intersect each other.

[0065] ​The display layer 300 can be provided on the driving layer 200. The display layer 300 can cover the driving layer 200. As an example, a bonding layer can be provided between the display layer 300 and the driving layer 200. The display layer 300 can include electrophoretic particles having different electrical characteristics and different colors. For example, some of the electrophoretic particles can have a positive charge and black color, and some other electrophoretic particles can have a negative charge and white color. For example, the electrophoretic particles having a positive charge and black color can be carbon black particles, and the electrophoretic particles having a negative charge and white color can be titanium dioxide (TiO2) particles or silicon dioxide (SiO2) particles. The electrophoretic particles can be provided in a microcapsule or a barrier structure together with a transparent dielectric liquid. Depending on the positions of the electrophoretic particles, the content output by the display device 1 can be decided. In an embodiment, the electrophoretic particles can include white particles, black particles, and colored particles. The white particles and the black particles can be substantially the same as described above. The colored particles can have a color different from white and black. For example, the colored particles can have cyan, magenta, yellow, red, green, or blue. The colored particles can be charged to be negative or positive. For example, the colored particles can have a net charge amount smaller than that of the white particles and that of the black particles. The common electrode layer 400 can be provided on the display layer 300. The common electrode layer 400 can face the driving layer 200 through the display layer 300. The common electrode layer 400 can include a transparent conductive material. For example, the common electrode layer 400 can include indium tin oxide (ITO). A common voltage different from the driving voltage can be applied to the common electrode layer 400. An electric field can be formed between the common electrode layer 400 and the pixel electrode. The positions of the electrophoretic particles can be controlled by the electric field between the common electrode layer 400 and the pixel electrode. In other words, the content output by the display device 1 can be decided by the electric field between the common electrode layer 400 and the pixel electrode controlled by the driving chip 10. From the perspective along the third direction DR3 perpendicular to the upper face 100u of the substrate 100, although the common electrode layer 400 is illustrated as including the display layer 300, it is not limited thereto. In other embodiments, from the perspective along the third direction DR3, the common electrode layer 400 can completely overlap the display layer 300.

[0066] A common pad 410 can be provided on a first reference side 400s of the common electrode layer 400. The first reference side 400s can be a side of the common electrode layer 400 facing the first direction DR1. A distance between the first reference side 400s and a side of the substrate 100 can be about 5 to 7 mm from an angle along the third direction DR3. The common pad 410 can be provided on an end portion of the first reference side 400s. The common pad 410 can protrude from the first reference side 400s. For example, the common pad 410 can extend along the first direction DR1 on the first reference side 400s. The common pad 410 can include a conductive material. For example, the common pad 410 can include a metal (e.g., aluminum (Al) or copper (Cu)) or a transparent electrode material (e.g., ITO). The common pad 410 can be electrically connected to the common electrode layer 400. For example, the common pad 410 can directly contact the common electrode layer 400. As an example, the common pad 410 can form a single layer film with the common electrode layer 400. In other words, the common pad 410 and the common electrode layer 400 can be connected to each other without an interface therebetween. As an example, the common pad 410 and the common electrode layer 400 can be different films. In other words, the common pad 410 and the common electrode layer 400 can be connected to each other with an interface therebetween.

[0067] A lower pad 610 can be provided between the common pad 410 and the substrate 100. For example, the lower pad 610 can directly contact the upper face 100u of the substrate 100. The lower pad 610 can be electrically connected to the driving chip 10 by a conductive wire extending along the upper face 100u of the substrate 100. The lower pad 610 can include a conductive material. For example, the lower pad 610 can include aluminum (Al) or copper (Cu).

[0068] A conductive via 600 can be provided between the lower pad 610 and the common pad 410. The conductive via 600 can be electrically connected to the lower pad 610 and the common pad 410. For example, the conductive via 600 can directly contact the lower pad 610 and the common pad 410. The conductive via 600 can apply a common voltage to the common pad 410. For example, the conductive via 600 can include a silver paste. The common pad 410 can apply the common voltage to the common electrode layer 400.

[0069] A protective layer 500 can be provided on the common electrode layer 400. The protective layer 500 can cover the common electrode layer 400. The protective layer 500 can protect a film disposed under the protective layer 500 from being damaged. The protective layer 500 can include a transparent electrically insulating material. For example, the protective layer 500 can include a polyethylene terephthalate (PET) film. As an example, an anti-glare film can be provided on the upper face or the bottom face of the protective layer 500. Although the protective layer 500 is illustrated as including the common electrode layer 400 from the perspective along the third direction DR3, it is not limited thereto. In other embodiments, the protective layer 500 can completely overlap the common electrode layer 400 from the perspective along the third direction DR3.

[0070] A protective pad 510 can be provided on the common pad 410. The protective pad 510 can cover the common pad 410. The protective pad 510 can be provided on a second reference side 500s of the protective layer 500. The second reference side 500s can be a side of the protective layer 500 facing the first direction DR1. The second reference side 500s can be a side of the protective layer 500 directly adjoining the first reference side 400s. The protective pad 510 can protrude from the second reference side 500s. For example, the protective layer 500 can extend along the first direction DR1 on the second reference side 500s. The protective pad 510 can include an electrically insulating material. For example, the protective pad 510 can include a PET film. As an example, the protective pad 410 can form a single layer film with the protective layer 500. In other words, the protective pad 510 and the protective layer 500 can be connected to each other without an interface therebetween. As an example, the protective pad 510 and the protective layer 500 can be different films. In other words, the protective pad 510 and the protective layer 500 can be connected to each other with an interface therebetween. Although the protective pad 510 is illustrated as including the common pad 410 from the perspective along the third direction DR3, it is not limited thereto. In other embodiments, the protective pad 510 can completely overlap the common pad 410 from the perspective along the third direction DR3.

[0071] The sealing film 700 can be provided between the protective layer 500 and the substrate 100 and between the protective pad 510 and the substrate 100. The sealing film 700 can extend along edges of the protective layer 500 and edges of the protective pad 510. The sealing film 700 can cover the technical features so as not to damage the drive layer 200, the display layer 300, the common electrode layer 400, the common pad 410, the lower pad 610, and the conductive via 600. The outer side surface 700s of the sealing film 700 can be perpendicular to the upper surface 100u of the substrate 100. The outer side surface 700s of the sealing film 700 can extend along the third direction DR3. Although the outer side surface 700s of the sealing film 700 directly adjoining the second reference side surface 500s is illustrated as forming a coplanar surface with the second reference side surface 500s, it is not limited thereto. In other embodiments, the outer side surface 700s of the sealing film 700 and the second reference side surface 500s can have a step difference, or the sealing film 700 can cover the second reference side surface 500s. The sealing film 700 can include an electrically insulating material. For example, the sealing film 700 can include silicon (Si) or a hot melt epoxy adhesive.

[0072] The additional area R1 can be provided on the second reference side surface 500s. The additional area R1 can be an area between the sealing film 700 directly adjoining the second reference side surface 500s and the sealing film 700 provided under the protective pad 510. As an example, the additional element can be provided on the opposite side of the additional area R1 with reference to the substrate 100. For example, the additional element can be at least one of a light emitting assembly and an antenna assembly. When the additional element is the light emitting assembly, the additional area R1 can be an area for radiating light generated from the light emitting assembly to the outside of the display device 1. When the additional element is the antenna assembly, the additional area can be an area for smooth electric wave transmission / reception operation between the antenna assembly and an external device. When the drive layer 200, the display layer 300, and the common electrode layer 400 are disposed in the additional area R1, the layers can absorb light or interfere with communication.

[0073] Unlike the present disclosure, when the common pad 410, the protective pad 510, the lower pad 610, and the conductive via 600 are disposed to adjoin the drive chip 10, the substrate 100 on the drive chip 10 side can be required to have a large area in order to dispose the common pad 410, the protective pad 510, the lower pad 610, and the conductive via 600. In addition, in order for the display device 1 to have an additional element (e.g., a light emitting assembly or an antenna assembly), the additional area R1 can additionally be required as described in the present disclosure.

[0074] The common pad 410, the protection pad 510, the lower pad 610, the conductive via 600, and the additional area R1 of the present disclosure can improve the integration of the display device 1 by being provided on the opposite side of the driving chip 10. The size of the non-display area (i.e., the area other than the display layer 300 from the angle along the third direction DR3) of the display device 1 can be reduced.

[0075] Figure 7 A perspective view of a display device according to an exemplary embodiment. Figure 6 A plan view of a display device. Figures 1 to 4 A plan view of a display device. Figures 5 to 7 A cross-sectional view of a C-C' line according to an exemplary embodiment. Figures 1 to 4 For the sake of simplicity of explanation, the contents substantially the same as those described with reference to Figures 1 to 4 may not be described again.

[0076] With reference to Figures 1 to 4 , a display device 2 can be provided. The display device 2 can include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a common pad 410, a conductive via 600, a lower pad 610, a protection layer 500, a protection pad 510, and a sealing film 700.

[0077] Except for the positions of the common pad 410, the protection pad 510, the lower pad 610, and the conductive via 600, the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, the common pad 410, the conductive via 600, the lower pad 610, the protection layer 500, the protection pad 510, and the sealing film 700 can be substantially the same as those described with reference to Figure 8 .

[0078] Unlike the description with reference to Figure 9 , the common pad 410 can be provided between both end portions of the first reference side surface 400s along the second direction DR2. For example, the common pad 410 can be disposed on the center portion of the first reference side surface 400s. The lower pad 610 and the conductive via 600 can be provided under the common pad 410.

[0079] The protection pad 510 can be provided between both end portions of the second reference side surface 500s along the second direction DR2. For example, the protection pad 510 can be disposed on the center portion of the second reference side surface 500s. The protection pad 510 can be provided on the common pad 410 to cover the common pad 410.

[0080] The first additional area R2a and the second additional area R2b can be disposed apart from each other with the protection pad 510 interposed therebetween. Except for the positions of the first additional area R2a and the second additional area R2b, it can be substantially the same as described with reference to Figure 8 The additional area R1 described can be substantially the same as described with reference to

[0081] The common pad 410, the protection pad 510, the lower pad 610, the conductive via 600, and the first additional area R2a and the second additional area R2b of the present disclosure can be provided on the opposite side of the driving chip 10, and thus the integration of the display device 2 can be improved. The display device 2 can be provided to have a small area of a non-display area.

[0082] Figure 10 A perspective view of a display device according to an exemplary embodiment. Figure 9 A plan view of a display device. Figures 1 to 4 A plan view of a display device. Figures 8 to 10 A cross-sectional view taken along line D-D' of a display device according to Figures 1 to 4 A cross-sectional view taken along line D-D' of a display device according to Figures 1 to 4 The content described for the sake of simplicity of explanation can be substantially the same as described with reference to

[0083] Referring to Figures 1 to 4 A display device 3 can be provided. The display device 3 can include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a first common pad 412, a second common pad 414, a first conductive via 602, a second conductive via 604, a first lower pad 612, a second lower pad 614, a protection layer 500, a first protection pad 512, a second protection pad 514, and a sealing film 700.

[0084] The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 can be substantially the same as described with reference to Figures 1 to 4 The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 described for the sake of simplicity of explanation can be substantially the same as described with reference to

[0085] The first common pad 412 and the second common pad 414 can be provided on the first reference side surface 400s. The first common pad 412 and the second common pad 414 can be spaced apart from each other along the second direction DR2. The first common pad 412 and the second common pad 414 can be respectively provided on both end portions of the first reference side surface 400s along the second direction DR2. Except for the positions of the first common pad 412 and the second common pad 414, it can be substantially the same as described with reference to Figures 1 to 4 The common pad 410 described for the sake of simplicity of explanation can be substantially the same as described with reference to

[0086] The first lower pad 612 and the second lower pad 614 can be spaced apart from each other along the second direction DR2. The first lower pad 612 and the second lower pad 614 can be provided under the first common pad 412 and the second common pad 414, respectively. Except for the positions of the first lower pad 612 and the second lower pad 614, they can be substantially the same as the lower pad 610 described with reference to FIG. 6. Figures 1 to 4 The first lower pad 612 and the second lower pad 614 can be spaced apart from each other along the second direction DR2. The first lower pad 612 and the second lower pad 614 can be provided under the first common pad 412 and the second common pad 414, respectively. Except for the positions of the first lower pad 612 and the second lower pad 614, they can be substantially the same as the lower pad 610 described with reference to FIG. 6.

[0087] The first conductive via 602 and the second conductive via 604 can be spaced apart from each other along the second direction DR2. The first conductive via 602 can be provided between the first common pad 412 and the first lower pad 612. The second conductive via 604 can be provided between the second common pad 414 and the second lower pad 614. Except for the positions of the first conductive via 602 and the second conductive via 604, they can be substantially the same as the conductive via 600 described with reference to FIG. 6. Figures 1 to 4 The first conductive via 602 and the second conductive via 604 can be spaced apart from each other along the second direction DR2. The first conductive via 602 can be provided between the first common pad 412 and the first lower pad 612. The second conductive via 604 can be provided between the second common pad 414 and the second lower pad 614. Except for the positions of the first conductive via 602 and the second conductive via 604, they can be substantially the same as the conductive via 600 described with reference to FIG. 6.

[0088] The first protection pad 512 and the second protection pad 514 can be provided on the second reference side surface 500s. The first protection pad 512 and the second protection pad 514 can be spaced apart from each other along the second direction DR2. For example, the first protection pad 512 and the second protection pad 514 can be provided on two end portions of the second reference side surface 500s along the second direction DR2, respectively. The first protection pad 512 and the second protection pad 514 can be provided on the first common pad 412 and the second common pad 414, respectively. Except for the positions of the first protection pad 512 and the second protection pad 514, they can be substantially the same as the protection pad 510 described with reference to FIG. 5. Figure 11 The first protection pad 512 and the second protection pad 514 can be provided on the second reference side surface 500s. The first protection pad 512 and the second protection pad 514 can be spaced apart from each other along the second direction DR2. For example, the first protection pad 512 and the second protection pad 514 can be provided on two end portions of the second reference side surface 500s along the second direction DR2, respectively. The first protection pad 512 and the second protection pad 514 can be provided on the first common pad 412 and the second common pad 414, respectively. Except for the positions of the first protection pad 512 and the second protection pad 514, they can be substantially the same as the protection pad 510 described with reference to FIG. 5.

[0089] The sealing film 700 can extend on the substrate 100 along the edge of the first protection pad 512, the edge of the second protection pad 514, and the edge of the protection layer 500. Except for the shape of the sealing film 700, it can be substantially the same as the sealing film 700 described with reference to FIG. 6. Figure 12 The sealing film 700 can extend on the substrate 100 along the edge of the first protection pad 512, the edge of the second protection pad 514, and the edge of the protection layer 500. Except for the shape of the sealing film 700, it can be substantially the same as the sealing film 700 described with reference to FIG. 6.

[0090] The additional area R3 can be provided between the first protection pad 512 and the second protection pad 514. Except for the position of the additional area R3, it can be substantially the same as the additional area R1 described with reference to FIG. 4. Figure 11 The additional area R3 can be provided between the first protection pad 512 and the second protection pad 514. Except for the position of the additional area R3, it can be substantially the same as the additional area R1 described with reference to FIG. 4.

[0091] The first common pad 412, the first protection pad 512, the first lower pad 612, the first conductive via 602, the second common pad 414, the second protection pad 514, the second lower pad 614, the second conductive via 604, and the additional area R3 of the present disclosure can improve the integration of the display device 3 by being provided on the opposite side of the driving chip 10. The display device 3 can be provided with a small area of a non-display area.

[0092] Figure 13 is a plan view of a display device according to an exemplary embodiment. Figure 11 is a cross-sectional view taken along line E-E' of Figures 1 to 4 Figures 8 to 10 is a cross-sectional view taken along line F-F' of Figures 11 to 13 For the sake of simplicity of explanation, the content that is substantially the same as the content described with reference to Figures 1 to 4 and the content described with reference to Figures 8 to 10 may not be described again.

[0093] With reference to Figures 1 to 4 , a display device 4 can be provided. The display device 4 can include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a first common pad 412, a second common pad 414, a first conductive via 602, a second conductive via 604, a first lower pad 612, a second lower pad 614, a protection layer 500, a first protection pad 512, a second protection pad 514, and a sealing film 700.

[0094] The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 can be substantially the same as the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 described with reference to Figures 1 to 4 The first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, and the second protection pad 514 can be substantially the same as the first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, and the second protection pad 514 described with reference to Figure 14

[0095] ​​The outer side surface 700s of the sealing film 700 can be inclined. The outer side surface 700s of the sealing film 700 can extend along a direction intersecting the third direction DR3. For example, the outer side surface 700s of the sealing film 700 is farther from the upper surface 100u of the substrate 100, it is closer to the driving layer 200, the display layer 300, the common electrode layer 400, the first common pad 412, the second common pad 414, the protective layer 500, the first protective pad 512, and the second protective pad 514, as viewed from an angle along the third direction DR3. For example, the outer side surface 700s of the sealing film 700 is farther from the upper surface 100u of the substrate 100, the circumference of the outer side surface 700s of the sealing film 700 is smaller. The circumference of the outer side surface 700s of the sealing film 700 can be a closed loop extending on the outer side surface 700s along a direction parallel to the upper surface 100u of the substrate 100. Although the outer side surface 700s of the sealing film 700 is illustrated as a curved surface, it is not limited thereto. The sealing film can be substantially the same as the sealing film 700 described with reference to Figure 11

[0096] The additional region R4 can be provided between the first protective pad 512 and the second protective pad 514. The additional region R4 can be substantially the same as the additional region R1 described with reference to Figure 15

[0097] The display device 4 can be provided, in which the first common pad 412, the first protective pad 512, the first lower pad 612, the first conductive via 602, the second common pad 414, the second protective pad 514, the second lower pad 614, the second conductive via 604, and the additional region R4 of the present disclosure are provided opposite the driving chip 10. The display device 4 can be provided, which has a small area of a non-display region.

[0098] Figure 14 A cross-sectional view of a display device according to an exemplary embodiment, corresponding to line E-E' of Figure 11 Figures 1 to 4 A cross-sectional view of a display device of Figures 8 to 10 , corresponding to line F-F' of Figures 11 to 13 For the sake of simplicity of explanation, contents substantially the same as the contents described with reference to Figures 14 to 15 , the contents described with reference to Figures 1 to 4 , and the contents described with reference to Figures 8 to 10

[0099] Figures 11 to 13 ​​​​​The display device 5 can be provided. The display device 5 can include the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, the first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the protection layer 500, the first protection pad 512, the second protection pad 514, and the sealing film 520.

[0100] The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 can be substantially the same as the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 described with reference to Figures 1 to 4 The first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, and the second protection pad 514 can be substantially the same as the first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, and the second protection pad 514 described with reference to Figures 1 to 4 The first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, and the second protection pad 514 can be substantially the same as the first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, and the second protection pad 514 described with reference to

[0101] The sealing film 520 can constitute a single layer film with the protection layer 500. In other words, the sealing film 520 and the protection layer 500 can be connected to each other without an interface therebetween. The sealing film 520 can constitute a single layer film with the first protection pad 512. In other words, the sealing film 520 and the first protection pad 512 can be connected to each other without an interface therebetween. The sealing film 520 can constitute a single layer film with the second protection pad 514. In other words, the sealing film 520 and the second protection pad 514 can be connected to each other without an interface therebetween. For example, the sealing film 520, the protection layer 500, the first protection pad 512, and the second protection pad 514 can constitute a single layer film. The sealing film 520 can include the same material as the protection pad 510. For example, the sealing film 520 can include a PET film. As described with reference to Figure 16 The outer side surface 520s of the sealing film 520 can be inclined. The sealing film 520 can be substantially the same as the sealing film 700 described with reference to Figure 17 The outer side surface 520s of the sealing film 520 can be inclined. The sealing film 520 can be substantially the same as the sealing film 700 described with reference to

[0102] The additional area R5 can be provided between the first protection pad 512 and the second protection pad 514. The additional area R5 can be substantially the same as the additional area R1 described with reference to Figure 16 The additional area R5 can be provided between the first protection pad 512 and the second protection pad 514. The additional area R5 can be substantially the same as the additional area R1 described with reference to

[0103] A display device 5 can be provided in which the first common pad 412, the first protection pad 512, the first lower pad 612, the first conductive via 602, the second common pad 414, the second protection pad 514, the second lower pad 614, the second conductive via 604, and the additional area R5 of the present disclosure are provided opposite the driving chip 10. A display device 5 can be provided which has a small area of a non-display area.

[0104] Figure 18 A perspective view of a display device according to an exemplary embodiment. Figure 17 A plan view of a display device. Figures 1 to 4 A plan view of a display device.

[0105] Figures 8 to 10 A cross-sectional view of line G-G' according to the display device of Figures 16 to 18 For the sake of simplicity of explanation, the content described with reference to Figures 1 to 4 and the content described with reference to Figures 8 to 10 may be substantially the same.

[0106] With reference to Figures 1 to 4 , a display device 6 can be provided. The display device 6 can include the substrate 100, the first protruding substrate 122, the second protruding substrate 124, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, the first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the protection layer 500, the first protection pad 512, the second protection pad 514, and the sealing film 700.

[0107] The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 can be substantially the same as the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 described with reference to Figure 19 The first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, the second protection pad 514, and the sealing film 700 can be substantially the same as the first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, the second protection pad 514, and the sealing film 700 described with reference to Figure 20 The first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, the second protection pad 514, and the sealing film 700 can be substantially the same as the first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, the second protection pad 514, and the sealing film 700 described with reference to

[0108] The first protruding substrate 122 and the second protruding substrate 124 can be provided on a third reference side surface 100s of the substrate 100. The third reference side surface 100s can be a side surface of the substrate 1100 facing the first direction DR1. The first protruding substrate 122 and the second protruding substrate 124 can be provided on both end portions of the third reference side surface 100s along the second direction DR2, respectively. The first protruding substrate 122 and the second protruding substrate 124 can protrude from the third reference side surface 100s. For example, the first protruding substrate 122 and the second protruding substrate 124 can extend on the third reference side surface 100s along the first direction DR1. The first protruding substrate 122 and the second protruding substrate 124 can include a transparent electrically insulating material. For example, the first protruding substrate 122 and the second protruding substrate 124 can include glass. As an example, the first protruding substrate 122 and the second protruding substrate 124 can constitute a single layer film with the substrate 100. In other words, the first protruding substrate 122 and the second protruding substrate 124 can be connected to each other without an interface therebetween. As an example, the first protruding substrate 122 and the second protruding substrate 124 can be different films from the substrate 100. In other words, the first protruding substrate 122 and the second protruding substrate 124 can be connected to each other with an interface therebetween.

[0109] The first lower pad 612, the first conductive via 602, the first common pad 412, and the first protection pad 512 can be sequentially provided on the first protruding substrate 122. The second lower pad 614, the second conductive via 604, the second common pad 414, and the second protection pad 514 can be sequentially provided on the second protruding substrate 124. The sealing film 700 can be provided between the first protruding substrate 122 and the first protection pad 512 and between the second protruding substrate 124 and the second protection pad 514.

[0110] The upper additional area R6 can be provided between the first protection pad 512 and the second protection pad 514. The lower additional area R7 can be provided between the first protruding substrate 122 and the second protruding substrate 124. Unlike the description with reference to Figure 19 The additional element can be provided under the lower additional area R7. When the additional element is a light emitting component, the upper additional area R6 and the lower additional area R7 can be areas for radiating light generated from the light emitting component to the outside of the display device 6. When the additional element is an antenna component, the upper additional area and the lower additional area can be areas for smooth electric wave transmission / reception operation between the antenna component and an external device.

[0111] Although the sealing film 700 and the third reference side surface 100s are illustrated as having a step between the sealing film 700 and the third reference side surface 100s directly adjoining the third reference side surface 100s, the present embodiment is not limited thereto. In another embodiment, the third reference side surface 100s can form a coplanar surface with the sealing film 700. Although the first protection pad 512 and the second protection pad 514 are illustrated as being arranged within the first protruding substrate 122 and the second protruding substrate 124, respectively, from an angle along the third direction DR3, the present embodiment is not limited thereto. In another embodiment, the first protection pad 512 and the second protection pad 514 can completely overlap the first protruding substrate 122 and the second protruding substrate 124, respectively.

[0112] The first common pad 412, the first protection pad 512, the first lower pad 612, the first conductive via 602, the second common pad 414, the second protection pad 514, the second lower pad 614, the second conductive via 604, the upper additional area R6, and the lower additional area R7 of the present disclosure can be provided on the opposite side of the driving chip 10. The display device 6 can be provided, which has a small area of a non-display area.

[0113] Figure 21 A perspective view of a display device according to an exemplary embodiment. Figure 20 A plan view of a display device. Figures 1 to 4

[0114] Figures 8 to 10 A cross-sectional view of the H-H' line according to the display device. Figures 19 to 21 For the sake of simplicity of explanation, the contents which are substantially the same as those described with reference to Figures 1 to 4 and those described with reference to Figures 8 to 10 may not be described again.

[0115] With reference to Figure 22 , a display device 1100 can be provided. The display device 1100 can include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a first common pad 412, a second common pad 414, a first conductive via 602, a second conductive via 604, a first lower pad 612, a second lower pad 614, a protection layer 500, a first protection pad 512, a second protection pad 514, a sealing film 700, a printed circuit substrate 20, a connector 40, and a light emitting assembly 30. The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 can be substantially the same as those described with reference to Figure 23 ​The substrate 100, driver chip 10, driver layer 200, display layer 300, common electrode layer 400, and protective layer 500 described herein are substantially the same. The first common pad 412, second common pad 414, first conductive via 602, second conductive via 604, first lower pad 612, second lower pad 614, first protective pad 512, second protective pad 514, and sealing film 700 can be respectively compared with the referenced... Figure 22 The first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protective pad 512, the second protective pad 514, and the sealing film 700 are substantially the same.

[0116] With reference to substrate 100, printed circuit board 20 can be provided opposite to the electronic paper layer. Printed circuit board 20 may include predetermined elements for controlling display device 1100. For example, printed circuit board 20 may include control components for generating command signals provided to driver chip 10, storage components, communication components, and input components for receiving signals from a user on display device 7. Printed circuit board 20 and driver chip 10 can be electrically connected to each other via connector 40.

[0117] The light-emitting component 30 can be provided on the printed circuit board 20. For example, the light-emitting component 30 can be inserted into and penetrate the printed circuit board 20. The light-emitting component 30 can overlap with the additional region R8 along the third direction DR3. Light emitted from the light-emitting component 30 can sequentially pass through the substrate 100 and the additional region R8. For example, the light-emitting component 30 can include a light-emitting diode (LED). In another embodiment, an antenna component can be provided on the printed circuit board 20, either in place of or together with the light-emitting component 30.

[0118] The first common pad 412, the first protective pad 512, the first lower pad 612, the first conductive via 602, the second common pad 414, the second protective pad 514, the second lower pad 614, the second conductive via 604, and the additional region R8 disclosed herein can be provided opposite to the driver chip 10. A display device 1100 can be provided having a small non-display area.

[0119] Figure 24 This is a perspective view of a display device according to an exemplary embodiment. Figure 23 for Figures 1 to 4 A plan view of the display device.

[0120] Figures 8 to 10 According to Figures 16 to 18FIG. 1 is a cross-sectional view of an I-I' line of the display device 100. For simplicity of explanation, the contents of the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500 can not be explained again. Figure 25 the contents of the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500. Figure 26 the contents of the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500. Figure 25 the contents of the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500.

[0121] the contents of the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500. Figures 19 to 21 A display device 1200 can be provided. The display device 1200 can include the substrate 100, a first protruding substrate 122, a second protruding substrate 124, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, a first common pad 412, a second common pad 414, a first conductive via 602, a second conductive via 604, a first lower pad 612, a second lower pad 614, the protective layer 500, a first protective pad 512, a second protective pad 514, a sealing film 700, the printed circuit substrate 20, the connector 40, and the light emitting assembly 30.

[0122] the contents of the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500. Figures 22 to 24 the contents of the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500. Figure 25 the contents of the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500. Figure 26 the contents of the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500.

[0123] The printed circuit substrate 20 can be provided opposite the electronic paper layer with reference to the substrate 100. The printed circuit substrate 20 can include predetermined components for controlling the display device 1200. For example, the printed circuit substrate 20 can include a control component for generating a command signal provided to the driving chip 10, a storage component, a communication component, and an input component for receiving a signal from a user of the display device 1200. The printed circuit substrate 20 and the driving chip 10 can be electrically connected to each other through the connector 40.

[0124] The light emitting component 30 can be provided on the printed circuit substrate 20. For example, the light emitting component 30 can be inserted into the printed circuit substrate 20, and can penetrate the printed circuit substrate 20. The light emitting component 30 can overlap the upper additional area R9 and the lower additional area R10 along the third direction DR3. The light emitting component 30 can be exposed by the lower additional area R10. Light radiated from the light emitting component 30 can sequentially pass through the lower additional area R10 and the upper additional area R9. For example, the light emitting component 30 can include an LED. In another embodiment, an antenna component can be provided on the printed circuit substrate 20 instead of or together with the light emitting component 30.

[0125] The first common pad 412, the first protection pad 512, the first lower pad 612, the first conductive via 602, the second common pad 414, the second protection pad 514, the second lower pad 614, the second conductive via 604, the upper additional area R9, and the lower additional area R10 of the present disclosure can be provided on the opposite side of the driving chip 10. The display device 1200 can be provided, which has a small area of a non-display area.

[0126] Figures 19 to 21 A perspective view of a display device according to an exemplary embodiment. Figures 22 to 24 A perspective view of a display device according to an exemplary embodiment. ​ A plan view of a display device. For the sake of brief explanation, the contents which are substantially the same as those described with reference to ​ and those described with reference to ​ may not be described again.

[0127] With reference to ​ and ​ , a display device 2000 can be provided, which includes a housing 2100, a first window 2200, a second window 2300, and an input area 2400. The housing 2100 can surround the display device 1100 described with reference to ​ or the display device 1200 described with reference to ​ .

[0128] The first window 2200 can be provided on a light emitting component. The first window 2200 can receive light generated by the light emitting component, and radiate it to the outside of the display device 2000. The first window 2200 can include a transparent material or a translucent material, or can be an opening.

[0129] A second window 2300 can be provided on the display layer 300. A user of the display device 2000 can view the content output on the display layer 300 through the second window 2300. The second window 2300 can include a transparent material, or can be an opening. Although the second window 2300 is illustrated as being included in the display layer 300 from the perspective of a direction in which the second window 2300 and the display layer 300 face each other, it is not limited thereto. In another embodiment, the second window 2300 and the display layer 300 can completely overlap each other from the perspective of a direction in which the second window 2300 and the display layer 300 face each other.

[0130] The first common pad 412, the first protection pad 512, the first lower pad 612, the first conductive via hole 602, the second common pad 414, the second protection pad 514, the second lower pad 614, the second conductive via hole 604, and the additional area can be provided opposite the driving chip. The display device 2000 can be provided, which has a small area of a non-display area.

[0131] The above description of the embodiments of the technical idea of the present invention provides examples for explaining the technical idea of the present invention. Therefore, the technical idea of the present invention is not limited to the above-described embodiments, and it is obvious that various modifications and changes such as combinations of the described embodiments can be made by those skilled in the art within the scope of the technical idea of the present invention.

[0132] The present disclosure can provide a display device including a minimized non-display area.

[0133] The present disclosure can provide a display device including an additional element.

[0134] However, the effects of the present invention are not limited to the disclosure.

[0135] Reference Signs

[0136] 1, 2, 3, 4, 5, 6, 1100, 1200, 2000: display device

[0137] 10: driving chip

[0138] 20: printed circuit substrate

[0139] 30: light emitting assembly

[0140] 40: connector

[0141] 100: substrate

[0142] 200: driving layer

[0143] 300: display layer

[0144] 400: common electrode layer

[0145] 410: common pad

[0146] 500: protective layer

[0147] 510: protective pad

[0148] 600: conductive via

[0149] 700: sealing film

Claims

1. A display device comprising: a substrate; a common electrode layer provided on the substrate, wherein the common electrode layer includes a first common pad that protrudes from a first reference side extending along a second direction toward a first direction, the second direction crossing the first direction; a drive layer provided between the substrate and the common electrode layer; a display layer provided between the drive layer and the common electrode layer; a first conductive via that is spaced apart from the drive layer and is provided between the substrate and the first common pad; a drive chip provided opposite the first conductive via with respect to the drive layer; and a printed circuit substrate provided opposite the display layer with respect to the substrate. a second conductive via that is spaced apart from the first conductive via along the first direction, wherein 2. The display device of claim 1, further comprising: the common electrode layer further includes a second common pad provided on the second conductive via, and the second common pad protrudes from the first reference side. The first common pad and the second common pad are respectively arranged on two end portions of the first reference side arranged on both sides along the first direction.

3. The display device of claim 2, wherein, a protective layer provided on the common electrode layer, wherein 4. The display device of claim 3, the device further comprising: the protective layer includes: a first protective pad provided on the first common pad; and a second protective pad provided on the second common pad, wherein the first protective pad and the second protective pad protrude from a second reference side of the protective layer extending along the first direction, and the protective layer, the first protective pad, and the second protective pad include an electrically insulating material. The first common pad and the second common pad are respectively provided within the first protective pad and the second protective pad from an angle along a third direction perpendicular to an upper surface of the substrate.

5. The display device of claim 4, wherein, The substrate includes:

6. The display device of claim 4, wherein, a first protruding substrate provided opposite the first protective pad with respect to the first conductive via; and a second protruding substrate provided opposite the second protective pad with respect to the second conductive via, wherein the first protruding substrate and the second protruding substrate protrude from a third reference side of the substrate extending along the first direction. a sealing film extending on the substrate along an edge of the protective layer, an edge of the first protective pad, and an edge of the second protective pad.

7. The display device of claim 6, the device further comprising: A side surface of the sealing film extends along a third direction perpendicular to an upper surface of the substrate.

8. The display device of claim 7, wherein, From an angle along the third direction perpendicular to the upper surface of the substrate, the farther away from the upper surface of the substrate, the smaller the distance between the side surface of the sealing film and the protective layer.

9. The display device of claim 7, wherein, The sealing film constitutes a single layer film with the protective layer, the first protective pad, and the second protective pad.

10. The display device of claim 7, wherein, ​ 11. The display device according to claim 4, the device further comprising: an additional element provided on the printed circuit substrate, wherein the additional element includes at least one of a light emitting component and an antenna component, and the additional element is disposed between the first protection pad and the second protection pad from an angle along a third direction perpendicular to an upper surface of the substrate.

12. The display device of claim 11, wherein, the substrate includes: a first protruding substrate provided between the first conductive via and the printed circuit substrate; and a second protruding substrate provided between the second conductive via and the printed circuit substrate, wherein the first protruding substrate and the second protruding substrate protrude from a third reference side of the substrate extending along the first direction, and the additional element is exposed between the first protruding substrate and the second protruding substrate.

13. The display device of claim 1, wherein, the first common pad is disposed on either one of two end portions disposed on both sides along the first direction of the first reference side.

14. The display device of claim 1, wherein, the first common pad is disposed on an area between the two end portions disposed on both sides along the first direction of the first reference side.

15. The display device according to claim 4, the device further comprising: a housing, wherein the substrate, the drive layer, the display layer, the protection layer, the first protection pad, the second protection pad, the first conductive via, the second conductive via, and the drive chip are disposed within the housing, and the housing includes a first window overlapping the display layer along a third direction perpendicular to an upper surface of the substrate.

16. The display device according to claim 15, the device further comprising: a light emitting component provided on the printed circuit substrate, wherein the printed circuit substrate and the light emitting component are disposed within the housing, and the housing further includes a second window overlapping the light emitting component along the third direction.

17. A display device comprising: a substrate; an electronic paper layer provided on the substrate; a drive chip controlling the electronic paper layer; and a printed circuit substrate provided opposite the electronic paper layer with respect to the substrate, wherein the drive chip and the electronic paper layer are disposed along a first direction parallel to an upper surface of the substrate, the electronic paper layer includes a first protruding portion and a second protruding portion protruding from a reference side disposed opposite the drive chip, and the drive chip generates an electric field in the electronic paper layer, thereby controlling electrophoretic particles in the electronic paper layer.

18. The display device according to claim 17, the device further comprising: a first conductive via provided between the first protruding portion and the substrate; and a second conductive via provided between the second protruding portion and the substrate, wherein ​ ​ The first conductive via and the second conductive via apply a common voltage to the electronic paper layer.

19. The display device of claim 18, the device further comprising: an additional element provided on the printed circuit substrate, wherein the additional element includes at least one of a light emitting component and an antenna component, and the additional element is disposed between the first protrusion and the second protrusion from an angle along a second direction perpendicular to an upper face of the substrate.

20. The display device of claim 19, the device further comprising: a housing covering the substrate, the electronic paper layer, the drive chip, the printed circuit substrate, and the additional element, wherein the electronic paper layer includes: a display region in which the electrophoretic particles are provided; and a non-display region provided at a periphery of the display region, and the housing includes: a first window exposing the display region of the electronic paper layer; and a second window overlapping the additional element along the second direction.

Images