Wet chemical treatment system for power supply circuit board

Abstract

The invention relates to the technical field of circuit board processing, and discloses a power supply circuit board wet chemical treatment system, which comprises an etching liquid exchange part, the etching liquid exchange part comprises an etching cylinder, the inner wall of the etching cylinder is detachably provided with a protective net, the bottom end of the etching cylinder is fixedly connected with a lower sealing plate and an etching liquid filtering part, and the etching liquid filtering part is fixedly connected with the lower sealing plate. The etching liquid filtering part is located in a space defined by the etching cylinder, the etching liquid filtering part comprises an upper sealing plate, and the edge face of the upper sealing plate is fixedly connected with the inner wall of the etching cylinder. The wet chemical treatment system for the power supply circuit board can effectively solve the problems that in the prior art, impurities such as solid particle metal ions in etching liquid are deposited at the bottom of a tank along with time accumulation, the etching efficiency and the etching quality can be reduced by the precipitates, and when an etching tank is cleaned regularly, the etching liquid needs to be pumped out and filtered firstly, and liquid supplementing treatment is carried out, so that the etching efficiency and the etching quality are reduced. And then etching precipitates at the bottom of the etching tank are scraped, so that the whole operation is very tedious.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and more specifically to a wet chemical treatment system for power circuit boards. Background Technology

[0002] Wet processing is a crucial step in circuit board manufacturing. It primarily utilizes chemical solutions to etch, electroplate, and clean the circuit board, achieving the electrical connections and wiring precision required by the circuit board design. The main purpose of wet processing is to ensure the precise formation of circuit patterns, the deposition of conductive layers, and the improvement of surface cleanliness through chemical reactions, thereby guaranteeing the quality and performance of the circuit board.

[0003] The wet process typically includes pretreatment, etching, electroplating, cleaning, and drying. In the etching stage, an etching solution is used to remove excess copper layers to form circuit patterns. Over time, solid particles, metal ions, and other impurities in the etching solution accumulate at the bottom of the tank. These deposits not only reduce etching efficiency but can also lead to uneven etching, affecting the quality of the circuit board. Regular cleaning of the etching tank requires first extracting and filtering the etching solution and then replenishing it, followed by scraping off the etching deposits at the bottom of the tank. The entire process is very cumbersome. Summary of the Invention

[0004] Technical problems to be solved

[0005] To address the aforementioned shortcomings of existing technologies, this invention provides a wet chemical treatment system for power circuit boards. This system effectively solves the problem that in existing technologies, impurities such as solid particles and metal ions in the etching solution accumulate and deposit at the bottom of the tank over time. These deposits reduce etching efficiency and quality. Furthermore, when cleaning the etching tank periodically, it is necessary to first extract and filter the etching solution and replenish it, and then scrape off the etching deposits at the bottom of the etching tank, making the entire operation very cumbersome.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] This invention provides a wet chemical treatment system for power circuit boards, comprising:

[0008] An etching solution exchange unit includes an etching cylinder, the inner wall of which is detachably fitted with a protective mesh, and a lower sealing plate is fixedly connected to the bottom end of the etching cylinder.

[0009] The etching solution filtration section is located in the space enclosed by the etching cylinder. The etching solution filtration section includes an upper sealing plate. The edge surface of the upper sealing plate is fixedly connected to the inner wall of the etching cylinder. The upper sealing plate is slidably connected to a filter element through a through hole opened inside it, and the bottom end of the filter element is connected to the inside of the lower sealing plate.

[0010] The etching cylinder has a material pump fixedly connected to its outer surface, and an exchange pipe is fixedly connected to the outer end of the material pump. The upper end of the exchange pipe is connected to the space enclosed by the upper surface of the upper sealing plate and the etching cylinder, and the lower end of the exchange pipe is connected to the space enclosed by the upper sealing plate, the lower sealing plate and the etching cylinder.

[0011] Furthermore, both the upper and lower sealing plates adopt a flared design, with the flared opening of the upper sealing plate facing upwards and the flared opening of the lower sealing plate facing downwards.

[0012] Furthermore, a support is fixedly connected to the outer edge of the bottom end of the etching cylinder, a support frame is fixedly connected to the inner wall of the etching cylinder, and a shaft is rotatably connected inside the support frame, with a sealing cap fixedly connected to the bottom end of the shaft.

[0013] Furthermore, the support frame is located between the protective net and the upper sealing plate, and a rotating frame is fixedly connected to the outer circumference of the shaft, and a scraper that fits against the flared surface of the upper sealing plate is fixedly connected to the outer surface of the rotating frame.

[0014] Furthermore, a drive rod is rotatably connected inside the support frame, and the drive rod and the shaft are connected by belt drive. A servo motor that is drive-connected to the drive rod is fixedly connected to the outer circumference of the etching cylinder.

[0015] Furthermore, the filter element includes a horn ring block, the outer circumferential surface of which is slidably and sealingly connected to the through hole of the upper sealing plate. The horn ring block is connected to a filter tube via a filter screen located at its bottom end, and the bottom end of the filter tube is fixedly connected to the interior of the lower sealing plate.

[0016] Furthermore, a sealing groove is provided on the lower surface of the sealing cover, a sealing ring that fits into the sealing groove is fixedly connected to the upper surface of the horn ring block, and a sealing ring plate that fits tightly into the lower surface of the upper sealing plate is fixedly connected to the outer circumference of the horn ring block.

[0017] Furthermore, a hydraulic push cylinder is provided in the space enclosed by the support frame. The output end of the hydraulic push cylinder is fixedly connected to a piston block that slides in a sealed manner with the inner wall of the filter tube. A hydraulic push rod is fixedly connected to the upper surface of the hydraulic push cylinder. An adjusting rod is fixedly connected to the output end of the hydraulic push rod. The top end of the adjusting rod passes through the lower sealing plate and the outer edge of the filter tube in sequence and is fixedly connected to the lower surface of the sealing ring plate.

[0018] The technical solution provided by this invention has the following advantages compared with the prior art:

[0019] This invention comprises a sealing cap, a lower sealing plate, and an etching solution filter. The upper sealing plate features a horn-shaped design with the horn opening facing upwards, facilitating the collection of solid particles. The output end of the hydraulic push rod drives the adjusting rod downwards until the end face of the horn ring block is flush with the outer surface of the upper sealing plate. The sealing ring disengages from the sealing groove, forming a "flow channel" composed of the horn ring block and the filter screen. Under gravity, solid particles and impurities collected near the end face of the horn ring block enter the "flow channel" with the etching solution. The filter screen filters these particles, and the filtered etching solution flows into the space enclosed by the upper sealing plate, the lower sealing plate, and the etching cylinder. Simultaneously, a servo motor drives a drive rod to rotate, which in turn rotates the shaft, causing the rotating frame and scraper to rotate synchronously. Because a large amount of collected solid particles and impurities are preferentially filtered through the "flow channel," the remaining etching solution, under the force of the scraper, begins to scrape and wash away the solid particles and impurities remaining on the inner wall of the upper sealing plate, causing surface impurities to quickly detach until the filter screen has completed filtering all the etching solution. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0021] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of the present invention;

[0022] Figure 2 This is a three-dimensional multi-angle structural schematic diagram of an embodiment of the present invention;

[0023] Figure 3 This is a top view of the structure of an embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of a partial three-dimensional cross-section of an embodiment of the present invention;

[0025] Figure 5 This is a three-dimensional structural diagram of the sealing plate, filter element, sealing cover, rotating frame, and scraper in an embodiment of the present invention.

[0026] Figure 6 This is a three-dimensional structural diagram of the shaft, sealing cover, rotating frame, and scraper according to an embodiment of the present invention;

[0027] Figure 7 This is a schematic diagram of a partial three-dimensional cross-section of the filter element, hydraulic cylinder, hydraulic push rod, adjusting rod, and lower sealing plate according to an embodiment of the present invention.

[0028] The labels in the diagram represent: 1. Etching solution exchange section; 11. Etching cylinder; 110. Servo motor; 111. Feed pump; 112. Exchange pipe; 113. Support; 114. Support frame; 1141. Hydraulic push cylinder; 1142. Piston block; 1143. Hydraulic push rod; 1144. Adjusting rod; 115. Shaft; 116. Sealing cover; 1161. Sealing groove; 117. Rotating frame; 118. Scraper; 119. Drive rod; 12. Protective net; 13. Lower sealing plate; 2. Etching solution filtration section; 21. Upper sealing plate; 22. Filter element; 221. Horn ring block; 2211. Sealing ring; 222. Filter screen; 223. Filter pipe; 224. Sealing ring plate. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0030] The present invention will be further described below with reference to embodiments.

[0031] Example:

[0032] Please see Figures 1-7 The present invention provides a technical solution: a wet chemical treatment system for power circuit boards, comprising:

[0033] The etching solution exchange unit 1 includes an etching cylinder 11, a protective net 12 is detachably installed on the inner wall of the etching cylinder 11, and a lower sealing plate 13 is fixedly connected to the bottom end of the etching cylinder 11.

[0034] The etching solution filtration section 2 is located in the space enclosed by the etching cylinder 11. The etching solution filtration section 2 includes an upper sealing plate 21. The edge surface of the upper sealing plate 21 is fixedly connected to the inner wall of the etching cylinder 11. The upper sealing plate 21 is slidably connected to a filter element 22 through a through hole opened inside it, and the bottom end of the filter element 22 is connected to the interior of the lower sealing plate 13.

[0035] The outer surface of the etching cylinder 11 is fixedly connected to a material pump 111, and the outer end of the material pump 111 is fixedly connected to an exchange pipe 112. The upper end of the exchange pipe 112 is connected to the space enclosed by the upper surface of the upper sealing plate 21 and the etching cylinder 11, and the lower end of the exchange pipe 112 is connected to the space enclosed by the upper sealing plate 21, the lower sealing plate 13 and the etching cylinder 11.

[0036] Both the upper sealing plate 21 and the lower sealing plate 13 adopt a horn-shaped design. The horn opening of the upper sealing plate 21 faces upward, and the horn opening of the lower sealing plate 13 faces downward. The horn-shaped upper sealing plate 21 can be used to collect solid particles, and the horn-shaped lower sealing plate 13 can be used to collect the filtered etching solution.

[0037] A support 113 is fixedly connected to the outer edge of the bottom end of the etching cylinder 11, and a support frame 114 is fixedly connected to the inner wall of the etching cylinder 11. A shaft 115 is rotatably connected inside the support frame 114, and a sealing cover 116 is fixedly connected to the bottom end of the shaft 115.

[0038] The support frame 114 is located between the protective net 12 and the upper sealing plate 21. A rotating frame 117 is fixedly connected to the outer circumference of the shaft 115, and a scraper 118 that fits against the horn surface of the upper sealing plate 21 is fixedly connected to the outer surface of the rotating frame 117.

[0039] The support frame 114 is internally rotatably connected to a drive rod 119, and the drive rod 119 and the shaft 115 are connected by a belt drive. The outer circumference of the etching cylinder 11 is fixedly connected to a servo motor 110 that is connected to the drive rod 119.

[0040] The filter element 22 includes a horn ring block 221. The outer circumferential surface of the horn ring block 221 is slidably connected to the through hole of the upper sealing plate 21. The horn ring block 221 is connected to a filter tube 223 through a filter screen 222 at its bottom end, and the bottom end of the filter tube 223 is fixedly connected to the interior of the lower sealing plate 13.

[0041] A sealing groove 1161 is provided on the lower surface of the sealing cover 116. A sealing ring 2211 that fits into the sealing groove 1161 is fixedly connected to the upper surface of the horn ring block 221. A sealing ring plate 224 that fits tightly into the lower surface of the upper sealing plate 21 is fixedly connected to the outer circumference of the horn ring block 221.

[0042] A hydraulic push cylinder 1141 is provided in the space enclosed by the support frame 114. The output end of the hydraulic push cylinder 1141 is fixedly connected to a piston block 1142 that slides and seals against the inner wall of the filter tube 223. A hydraulic push rod 1143 is fixedly connected to the upper surface of the hydraulic push cylinder 1141. An adjusting rod 1144 is fixedly connected to the output end of the hydraulic push rod 1143. The top end of the adjusting rod 1144 passes through the lower sealing plate 13 and the outer edge of the filter tube 223 in sequence and is fixedly connected to the lower surface of the sealing ring plate 224.

[0043] refer to Figure 1-7During the etching stage, the etching solution is used to remove excess copper layers to form circuit patterns. Solid particles, metal ions and other impurities in the etching solution accumulate and deposit at the bottom of the tank over time. These deposits not only reduce etching efficiency, but may also cause uneven etching and affect the quality of the circuit board. When the etching tank is cleaned regularly, the etching solution needs to be extracted, filtered and replenished first, and then the etching deposits at the bottom of the etching tank need to be scraped off. The whole operation is very cumbersome.

[0044] To overcome the aforementioned shortcomings, this invention designs a wet chemical treatment system for power circuit boards.

[0045] Circuit board etching process:

[0046] Initially, the hydraulic push rod 1143 is activated, and its output end drives the adjusting rod 1144 on the filter element 22 to move upward, causing the sealing ring plate 224, the horn ring block 221, and the sealing ring 2211 to move upward synchronously. At the same time, the filter screen 222 is stretched and deformed (pulled up and down to unfold) until the outer surface of the sealing ring plate 224 is tightly attached to the lower surface of the upper sealing plate 21, which seals the outer circumference of the horn ring block 221 (the horn ring block 221 itself and the through hole of the upper sealing plate 21 are connected by a sealed sliding connection). At the same time, the sealing ring 2211 is inserted into the sealing groove 1161 of the sealing cover 116, which seals the inner side of the horn ring block 221, so that the horn ring block 221, the sealing ring 2211, the sealing ring plate 224, the sealing cover 116, and the upper sealing plate 21 are combined into a whole (a small amount of seepage is allowed at the joint surface).

[0047] A large amount of etching solution is filled between the upper cover plate 21 and the etching cylinder 11, and the etching solution overflows the protective net 12. An external robot or hoisting equipment is used to pick up the substrate and then send it into the etching solution above the protective net 12. During the etching process, the parts not protected by photoresist will be corroded by the etching solution, while the parts protected by photoresist will be retained to form circuit lines and connection points. After etching is completed, the basic structure of the circuit board is formed.

[0048] It is important to emphasize in this invention that if impurities in the etching solution are not cleaned for a long period of time, they will have the following impacts on the etching process and product quality:

[0049] 1. Reduced etching rate: Impurities form a protective layer in the etching solution, slowing down the reaction rate between the etchant and the material to be etched. 2. Affected etching uniformity: The accumulation of impurities may lead to uneven etching of the material by the etching solution, causing over-etching or under-etching in some areas, affecting the precision and quality of the product. 3. Accelerated etching solution aging: Some impurities may accelerate the chemical changes of the etching solution, shortening its service life. 4. Clogged nozzles: Impurity particles may clog the nozzles, affecting the normal circulation and spraying of the etching solution, and in severe cases, may lead to equipment failure.

[0050] To address the aforementioned issues, this invention includes an etching solution filtration unit 2. After several batches of substrates have been etched (not after large-scale substrate etching where a large number of impurities remain), a small amount of solid particles will accumulate on the horn-shaped upper sealing plate 21. To quickly achieve the rapid return and collection of etching solution and impurities, the horn-shaped upper sealing plate 21, in conjunction with the sealing cap 116, can achieve etching solution replenishment and exchange. At the same time, the etching solution filtration unit 2 achieves the return impurity cleaning. "Three processes are carried out simultaneously" (recovery of consumed etching solution, impurity filtration, and replenishment), ensuring the substrate etching accuracy, avoiding interference from etching impurities, and greatly reducing downtime (the etching solution exchange of this invention basically does not require machine interruption), eliminating the trouble of manually cleaning etching impurities.

[0051] Meanwhile, the conductivity detectors used can automatically record the detection values ​​and compare them with the preset standard values. Therefore, the control system will automatically start the external liquid replenishment device to replenish the liquid, thereby maintaining the ion concentration of the filtered etching solution. Through the material pump 111 and the exchange pipe 112, the replenished etching solution is circulated back into the space enclosed by the upper sealing plate 21 and the etching cylinder 11 for the next etching cycle, realizing the "recycling of etching solution replenishment and exchange".

[0052] It should be emphasized again that manually cleaning etched impurities will encounter the following problems:

[0053] First, wear appropriate personal protective equipment (PPE), such as protective clothing, gloves, goggles, and masks, to prevent chemicals from coming into contact with the skin or being inhaled by harmful vapors, and ensure good ventilation in the work area to reduce the concentration of harmful gases;

[0054] Second, before extracting the liquid, check whether the extraction equipment (such as pumps, pipes, valves) is intact, ensure there are no leaks, confirm the sealing of the connecting parts, and prevent liquid leakage. The operation is complicated.

[0055] Third, control the extraction speed to avoid liquid splashing or bubble formation caused by excessively fast extraction, which may lead to chemical exposure or loss. Excessively slow extraction speed may increase operation time and the risk of chemical exposure, and batch extraction efficiency will be low.

[0056] Fourth, pay attention to the temperature and pressure of the etching solution, as some chemicals may become unstable under specific temperatures and pressures.

[0057] The etching solution replenishment and exchange process includes:

[0058] During the etching process, as time accumulates, solid particle impurities in the etching solution gradually deposit at the bottom of the groove of the upper sealing plate 21. Because the upper sealing plate 21 adopts a horn-shaped design and the horn opening of the upper sealing plate 21 faces upward, the horn-shaped upper sealing plate 21 facilitates the aggregation of solid particles. In order to achieve rapid filtration of solid particles and other impurities, this application can restart the hydraulic push rod 1143, whose output end drives the adjusting rod 1144 on the filter element 22 to move downward, driving the sealing ring plate 224, the horn ring block 221, the sealing ring 2211, etc. to move downward synchronously until the end face of the horn ring block 221 is flush with the outer surface of the upper sealing plate 21, and the sealing ring 2211 disengages from the sealing groove 1161, forming a "flow channel" composed of the horn ring block 221 and the filter screen 222. Under the influence of gravity, solid particulate impurities that accumulate near the end face of the horn ring block 221 enter the "flow channel" along with the etching solution. The filter screen 222 filters them, and the filtered etching solution flows into the space enclosed by the upper sealing plate 21, the lower sealing plate 13, and the etching cylinder 11. At the same time, the servo motor 110 starts, and its output drives the drive rod 119 to rotate. The drive rod 119 drives the shaft 115 to rotate via the belt assembly, which in turn drives the rotating frame 117 and the scraper 118 to rotate synchronously. Since a large number of accumulated solid particulate impurities are preferentially filtered through the "flow channel," the remaining large amount of etching solution, under the force of the scraper 118, begins to scrape and wash away the solid particulate impurities remaining on the inner wall of the upper sealing plate 21, causing the surface impurities to quickly detach, until the filter screen 222 completes the filtration of all the etching solution.

[0059] It is worth noting that this application employs a sealing cap 116, a lower sealing plate 13, and an etching solution filter section 2, which has the following advantages:

[0060] Firstly, the upper sealing plate 21, the sealing cover 116, and the filter element 22 adopt a sealable or separable structure. When etching is required, the horn ring block 221, the sealing ring 2211, the sealing ring plate 224, the sealing cover 116, and the upper sealing plate 21 are combined into a whole for the preservation of the etching solution. When the etching solution needs to be replaced, the sealing ring 2211 is separated from the sealing groove 1161, forming a "flow channel" composed of the horn ring block 221 and the filter screen 222, which allows for rapid filtration.

[0061] Secondly, both the upper sealing plate 21 and the lower sealing plate 13 adopt a horn-shaped design, with the horn opening of the upper sealing plate 21 facing upwards and the horn opening of the lower sealing plate 13 facing downwards. The horn-shaped upper sealing plate 21 can be used to collect solid particles; the horn-shaped lower sealing plate 13 can be used to collect the filtered etching solution, preventing the filtered etching solution from seeping to the outside through the gap between the adjusting rod 1144 and the lower sealing plate 13, thus avoiding safety hazards.

[0062] Thirdly, when the "flow channel" formed by the horn ring block 221 and the filter screen 222 is opened, solid particulate impurities near the end face of the horn ring block 221 can enter the "flow channel" with the etching solution as soon as possible for priority filtration (avoiding the large amount of accumulated impurities from being stirred up again); subsequently, the remaining large amount of etching solution, under the force of the scraper 118, begins to scrape and rinse the solid particulate impurities remaining on the inner wall of the upper sealing plate 21, so that the surface impurities can be quickly removed.

[0063] Fourthly, the filtered etching solution remains in the space enclosed by the upper sealing plate 21, the lower sealing plate 13, and the etching cylinder 11. At this point, the change in ion concentration in the liquid can be determined by detecting the liquid's conductivity (the principle of conductivity detection is based on the sensitivity of conductivity to ion concentration in the liquid; the higher the ion concentration, the greater the conductivity). Generally, conductivity detectors can automatically record the detected values ​​and compare them with preset standard values. Therefore, the control system automatically activates the external liquid replenishment device to replenish the liquid, thereby maintaining the ion concentration of the filtered etching solution. Finally, through the feed pump 111 and the exchange pipe 112, the replenished etching solution is circulated back into the space enclosed by the upper sealing plate 21 and the etching cylinder 11 for the next etching cycle.

[0064] After filtration, solid particulate impurities remain in the filter tube 223, along with a small amount of etching solution. To remove these impurities and avoid wasting the etching solution, the hydraulic push cylinder 1141 is activated. Its output end drives the piston block 1142 to slide gently upwards along the inner wall of the filter tube 223. The impurities and etching solution on the inner wall of the filter tube 223 move upwards synchronously, and the remaining etching solution is filtered through the filter screen 222. Subsequently, the piston block 1142 resets, and the impurities follow the piston block 1142 to complete the final cleaning.

[0065] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A power circuit board wet chemical processing system, characterized by, Include: Etching liquid exchange part (1), the etching liquid exchange part (1) includes etching cylinder (11), the inner wall of etching cylinder (11) is detachably installed with protective net (12), the bottom end of etching cylinder (11) is fixedly connected with lower sealing plate (13); Etching liquid filtering part (2), the etching liquid filtering part (2) is located in the space surrounded by etching cylinder (11), the etching liquid filtering part (2) includes upper sealing plate (21), the edge surface of upper sealing plate (21) is fixedly connected with the inner wall of etching cylinder (11), the upper sealing plate (21) is sealingly slidably connected with filter element (22) by the through hole in its inside, and the bottom end of the filter element (22) is communicated with the inside of the lower sealing plate (13); Wherein, the outer surface of the etching cylinder (11) is fixedly connected with the material pump (111), the outer end of the material pump (111) is fixedly communicated with the exchange pipe (112), the upper end of the exchange pipe (112) is communicated with the space surrounded by the upper surface of the upper sealing plate (21) and the etching cylinder (11), and the lower end of the exchange pipe (112) is communicated with the space surrounded by the upper sealing plate (21), the lower sealing plate (13) and the etching cylinder (11).

2. A power supply circuit board wet chemical processing system according to claim 1, wherein: The upper sealing plate (21) and the lower sealing plate (13) are both designed as horn type, the horn mouth of the upper sealing plate (21) faces upward, and the horn mouth of the lower sealing plate (13) faces downward.

3. A power supply circuit board wet chemical processing system as defined in claim 1, wherein: The bottom end of the etching cylinder (11) is fixedly connected with a support (113), the inner wall of the etching cylinder (11) is fixedly connected with a support frame (114), and the inside of the support frame (114) is rotatably connected with a shaft rod (115), the bottom end of the shaft rod (115) is fixedly connected with a sealing cover (116).

4. A power supply circuit board wet chemical processing system according to claim 3, wherein: The support frame (114) is located between the protective net (12) and the upper sealing plate (21), the circumferential outer surface of the shaft rod (115) is fixedly connected with a rotating frame (117), and the outer surface of the rotating frame (117) is fixedly connected with a scraper (118) which is attached to the horn surface of the upper sealing plate (21).

5. A power supply circuit board wet chemical processing system as defined in claim 3, wherein: The inside of the support frame (114) is rotatably connected with a driving rod (119), the driving rod (119) and the shaft rod (115) are connected through a belt transmission, and the circumferential outer surface of the etching cylinder (11) is fixedly connected with a servo motor (110) which is transmissionally connected with the driving rod (119).

6. A power supply circuit board wet chemical processing system as defined in claim 3 wherein: The filter element (22) includes a horn ring block (221), the circumferential outer surface of the horn ring block (221) is sealingly slidably connected with the through hole of the upper sealing plate (21), the horn ring block (221) is connected with a filter pipe (223) through a filter screen (222) arranged at the bottom end thereof, and the bottom end of the filter pipe (223) is fixedly communicated with the inside of the lower sealing plate (13).

7. A power supply circuit board wet chemical processing system according to claim 6, wherein: The lower surface of the sealing cover (116) is provided with a sealing groove (1161), the upper surface of the horn ring block (221) is fixedly connected with a sealing ring (2211) which is attached to the sealing groove (1161), and the circumferential outer surface of the horn ring block (221) is fixedly connected with a sealing ring plate (224) which is tightly attached to the lower surface of the upper sealing plate (21).

8. A power supply circuit board wet chemical processing system according to claim 7, wherein: The space surrounded by the support frame (114) is provided with a hydraulic push cylinder (1141), the output end of the hydraulic push cylinder (1141) is fixedly connected with a piston block (1142) which sealingly slides with the inner wall of the filter pipe (223), the upper surface of the hydraulic push cylinder (1141) is fixedly connected with a hydraulic push rod (1143), the output end of the hydraulic push rod (1143) is fixedly connected with an adjusting rod (1144), and the top end of the adjusting rod (1144) penetrates the outer extension edge of the filter pipe (223) from the lower sealing plate (13) in sequence and is fixedly connected with the lower surface of the sealing ring plate (224).

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