Station cooperative automatic electroplating equipment for plating zinc and nickel on surface of copper foil
By using automated electroplating equipment that coordinates zinc and nickel plating on copper foil, the length of the copper foil is extended by using floating rollers and positioning rollers, combined with liquid level adjustment, which solves the problem of asynchronous time between the preceding and following processes in the copper foil electroplating process, and realizes the continuity of the production line and the stable transfer of copper foil.
Patent Information
- Application Number
- CN202511292244.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-11
- Publication Date
- 2025-12-09
AI Technical Summary
In existing technologies, the zinc-nickel electroplating process on copper foil cannot synchronize the processing time of the preceding and following processes, resulting in a large production line footprint, significant fluctuations in copper foil tension, and the problem of time asynchrony still exists even after adding redundant production lines.
The automated electroplating equipment for zinc and nickel plating of copper foil uses a combination of floating rollers and positioning rollers to extend the length of the copper foil and form a suitable transmission channel. Combined with a liquid level adjustment mechanism, it achieves time synchronization of the copper foil between different tanks.
This technology enables synchronized processing of copper foil in different tanks, avoiding problems such as copper foil wrinkles, strip breaks, and uneven plating, thus improving the continuity and efficiency of the production line.
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Figure CN121087597A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of copper foil surface post-processing, in particular to a work station cooperative automatic electroplating equipment for zinc-nickel plating on the surface of a copper foil. BACKGROUND
[0002] Zinc-nickel plating on the surface of a copper foil is one of the key technologies in the current surface treatment of electronic copper foils, and is mainly used to improve the high-temperature oxidation resistance, corrosion resistance and adhesion strength of the copper foil to the base material, and is widely used in the fields of lithium battery copper foils and flexible circuit boards.
[0003] Taking a continuous production line as an example, zinc-nickel plating on the surface of a copper foil mainly includes roughening, solidification, zinc-nickel plating and passivation processes, and each process is provided with an independent tank body, and the copper foil moves between the tank bodies through a conveying roller. Since the processing time of each process is fixed, when the processing time of the later process needs to be extended, the copper foil in the earlier process cannot be stopped, resulting in a conflict between the processing times of the earlier and later processes, and a continuous production line cannot be formed, and the copper foil is prone to wrinkles, belt breakage or uneven plating. The existing technology mainly synchronizes the processing times of the earlier and later processes by increasing a redundant production line, resulting in a large occupied area of the entire production line and obvious copper foil tension fluctuations. In addition, the increased redundant production line corresponds to the time difference between the processing of the earlier and later processes, so once the processing times of the earlier and later processes change, the processing times of the earlier and later processes will still be out of synchronization.
[0004] Therefore, how to provide a device for synchronizing the processing times of the earlier and later processes of a copper foil is a problem that those skilled in the art need to solve. SUMMARY
[0005] The purpose of the present application is to provide a work station cooperative automatic electroplating equipment for zinc-nickel plating on the surface of a copper foil to solve the problems existing in the prior art.
[0006] To achieve the above-mentioned purpose, the present application provides a work station cooperative automatic electroplating equipment for zinc-nickel plating on the surface of a copper foil, the copper foil sequentially passes through a first tank body and a second tank body, and the processing time of the copper foil in the second tank body is longer than that in the first tank body, and the equipment comprises:
[0007] A first conveying roller is arranged at the outlet of the first tank body;
[0008] A second conveying roller is arranged at the inlet of the second tank body, the copper foil is transmitted from the first tank body to the second tank body, and the copper foil is wound around the upper surfaces of the first and second conveying rollers;
[0009] A floating roller is arranged above the copper foil and between the first and second conveying rollers, and the floating roller can move in the up-down direction; when the floating roller moves downward, it can press down the copper foil, so that the copper foil between the first and second conveying rollers becomes longer and bends downward.
[0010] Further, the equipment further comprises:
[0011] A positioning roller corresponding to the second conveying roller and located above the copper foil, the positioning roller being capable of moving closer to or farther away from the second conveying roller in the up-down direction, and a transmission channel with a size adapted to the thickness of the copper foil being formed between the second conveying roller and the positioning roller when the positioning roller moves closer to the second conveying roller; the positioning roller being a one-way rotating roller, and the rotating direction of the positioning roller corresponding to the moving direction of the copper foil.
[0012] Further, the application further comprises:
[0013] A mounting plate arranged above the copper foil;
[0014] A first air cylinder fixedly arranged on the lower surface of the mounting plate, and the telescopic end of the first air cylinder being connected with the positioning roller.
[0015] Further, the application further comprises:
[0016] A second air cylinder fixedly arranged on the lower surface of the mounting plate, and the telescopic end of the second air cylinder being connected with the floating roller.
[0017] Further, the application further comprises:
[0018] A supporting roller arranged between the first conveying roller and the second conveying roller and located below the copper foil, the supporting roller being capable of moving in the up-down direction, and the supporting roller moving upward to move closer to the copper foil and moving downward to move farther away from the copper foil; the floating roller having two, and being respectively arranged between the supporting roller and the first conveying roller and between the supporting roller and the second conveying roller.
[0019] Further, the application further comprises:
[0020] A third air cylinder, the telescopic end of which being connected with the supporting roller.
[0021] Further, the application further comprises:
[0022] A liquid level adjusting mechanism, the first tank body comprising a bottom plate and supporting columns on both sides of the bottom plate, the liquid level adjusting mechanism being arranged in the supporting columns, and the first conveying roller being arranged on the upper surface of the supporting columns; the liquid level adjusting mechanism being used for absorbing or releasing the copper foil processing solution in the first tank body.
[0023] Further, the liquid level adjusting mechanism comprises:
[0024] An inlet valve, a liquid storage chamber being defined in the supporting column, the liquid storage chamber being in communication with the first tank body, and the inlet valve being arranged at the communication position;
[0025] An outlet pipe, one end of the outlet pipe being in communication with the liquid storage chamber and the other end of the outlet pipe being in communication with the first tank body, the communication position being close to the top of the first tank body, and an outlet pump being arranged on the outlet pipe.
[0026] Further, the first tank is internally provided with a liquid level meter.
[0027] Further, a camera is arranged on the inner side wall of the first tank.
[0028] The present application discloses the following technical effects:
[0029] 1. The copper foil can be pressed by the floating roller, so that the copper foil between the first conveying roller and the second conveying roller is lengthened and bent downward, the length of the copper foil is extended under the premise that the positions of the first conveying roller and the second conveying roller remain unchanged, and the processing time of the first tank and the second tank is synchronized.
[0030] 2. The positioning roller is arranged on the basis of the floating roller, the positioning roller is a one-way rotating roller, when the positioning roller is close to the second conveying roller, a transmission channel with a thickness suitable for the copper foil can be formed between the second conveying roller and the positioning roller, so that the copper foil can only move in one direction; when the position of the floating roller needs to be further lowered to adapt to the processing time of the first tank and the second tank during the operation of the equipment, the equipment does not need to be shut down, the floating roller can be continuously lowered under the positioning action of the positioning roller, the lengthened copper foil is input by the first tank, and the copper foil in the second tank will not be displaced.
[0031] 3. In the copper foil electroplating process, if the first tank needs to be shut down when the processing time of the second tank is longer, the liquid level of the copper foil processing solution in the first tank can be adjusted by the liquid level adjusting mechanism, so as to avoid corrosion of the copper foil caused by long time of the copper foil in the copper foil processing solution; and the copper foil is always in a tension state, so that the first tank can be started at any time when the second tank returns to normal. BRIEF DESCRIPTION OF DRAWINGS
[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0033] Figure 1 It is a structural schematic diagram of the present application;
[0034] Figure 2 It is a structural schematic diagram of the first tank;
[0035] Figure 3 It is a schematic diagram of the copper foil pressed by one floating roller;
[0036] Figure 4 It is a schematic diagram of the copper foil pressed by two floating rollers;
[0037] Figure 5 Schematic diagram of introducing a liquid storage chamber for a copper foil treatment solution;
[0038] 1, first groove body; 101, bottom plate; 102, support column; 1021, liquid storage chamber; 2, second groove body; 3, first conveying roller; 4, second conveying roller; 5, floating roller; 6, positioning roller; 7, mounting plate; 8, first air cylinder; 9, second air cylinder; 10, supporting roller; 11, third air cylinder; 12, liquid inlet valve; 13, liquid outlet pipe; 14, liquid outlet pump. DETAILED DESCRIPTION
[0039] Among the existing technologies retrieved:
[0040] CN111058067A discloses a process for electroplating zinc-nickel alloy on metal surfaces, which discloses the following:
[0041] It is composed of 13 fixed sequence offline stations, in order of raw material inspection → chemical degreasing → first water washing → electrochemical degreasing → second water washing → polishing → pickling → third water washing → hanging → electroplating zinc-nickel alloy → fourth water washing → drying → detection and packaging. All stations are “single-piece-batch” type groove or pool; workpieces are transferred by manual or trolley “hanging-transferring-hanging”, without continuous strip transmission; only fixed speed stirring devices are set at the top of zinc-nickel groove to improve mass transfer uniformity. The “residence time” of each process is pre-set in the process card, and is executed by manual timing or simple timer on site, without real-time closed loop; no buffer, tension or speed adjusting mechanism is provided between grooves. Due to the use of “whole hanging-whole moving” mode, the previous hanger must be completely finished before entering the next groove as a whole, resulting in the beat being determined by the slowest station, and individual processes cannot be accelerated or decelerated.
[0042] CN114075684B discloses a process for electroplating zinc-nickel alloy on metal surfaces, which discloses the following:
[0043] On the basis of the existing technology, five offline modules of “pretreatment → activation → electroplating → stabilization → finished product” are formed; the stabilization step adopts vacuum / positive pressure cyclic heating, which is an independent offline device. Each module still takes “hanger-batch” as a unit, and the workpiece is transferred between grooves by manual or simple trolley; manual hoisting is required between the vacuum-positive pressure reaction kettle and the passivation closed line, without continuous transmission mechanism. The time range of each step is given in the patent (such as electroplating 30–45min, stabilization 3–8min / time x 3–5 times), which is manually set within the upper and lower limits according to experience on site; there is no speed, tension or storage closed loop between modules. The stabilization module takes the longest time and cannot be split, if the capacity of the vacuum reaction kettle is insufficient, the entire batch must wait, causing “empty hanging” of the front electroplating groove or “empty groove” of the rear passivation groove, which cannot be dynamically balanced online.
[0044] Both patents above are based on offline "hanger-trough" operation, where workpieces enter and exit as a whole in "hangers," and the equipment itself lacks a continuous material path. Continuous dynamic synchronization requires that each functional segment can independently change its linear speed without interfering with each other. In offline troughs, hangers are moved manually or by crane as a whole; even if adjacent troughs have different processing times, it's a matter of "person waiting for trough" or "trough waiting for person." The hangers are rigidly connected (using the same crane or transfer trolley), with no excess material for storage, meaning any time difference will directly result in a complete line stoppage or gap.
[0045] Taking the "vacuum-positive pressure cycle" in the second patent as an example, its total duration is 15–90 minutes and the equipment is expensive. If the reaction time needs to be extended due to differences in incoming materials, the upstream electroplating tank can only reduce the current of the entire batch or wait, resulting in energy waste; if the time is shortened, the quality risk increases. The four-tank system of pickling-electroplating-passivation-drying in the first patent also has the same problem. Any fluctuation in any step will be amplified to the entire production line.
[0046] In summary, current technology is not yet able to synchronize the processing time of copper foil in the preceding and following processes.
[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0048] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0049] like Figures 1-5 As shown, this embodiment of the invention provides a station-based automated electroplating equipment for zinc-nickel plating on copper foil. The copper foil passes sequentially through a first tank 1 and a second tank 2, and the processing time of the copper foil in the second tank 2 is longer than the processing time in the first tank 1. The equipment includes:
[0050] The first conveying roller 3 is located at the outlet of the first trough 1;
[0051] The second conveyor roller 4 is located at the entrance of the second tank 2. Copper foil is transferred from the first tank 1 to the second tank 2, and the copper foil is wound around the upper surfaces of the first conveyor roller 3 and the second conveyor roller 4.
[0052] The floating roller 5 is positioned above the copper foil and between the first conveying roller 3 and the second conveying roller 4. The floating roller 5 can move in the vertical direction. When the floating roller 5 moves downward, it can press down on the copper foil, causing the copper foil between the first conveying roller 3 and the second conveying roller 4 to become longer and bend downward.
[0053] In this embodiment, it also includes:
[0054] The positioning roller 6 is located above the copper foil and corresponds to the second conveying roller 4. The positioning roller 6 can move closer to or further away from the second conveying roller 4 in the vertical direction. When the positioning roller 6 moves closer to the second conveying roller 4, a transmission channel adapted to the thickness of the copper foil can be formed between the second conveying roller 4 and the positioning roller 6. The positioning roller 6 is a unidirectional rotating roller, and the rotation direction of the positioning roller 6 corresponds to the movement direction of the copper foil.
[0055] In this embodiment, it also includes:
[0056] Mounting plate 7 is positioned above the copper foil. Mounting plate 7 can be fixed to the ground by a connecting rod or positioned on a suitable bracket above the copper foil.
[0057] The first cylinder 8 is fixedly mounted on the lower surface of the mounting plate 7, and the telescopic end of the first cylinder 8 is connected to the positioning roller 6.
[0058] In this embodiment, it also includes:
[0059] The second cylinder 9 is fixedly mounted on the lower surface of the mounting plate 7, and the telescopic end of the second cylinder 9 is connected to the floating roller 5.
[0060] In this embodiment, it also includes:
[0061] The support roller 10 is located between the first conveying roller 3 and the second conveying roller 4 and below the copper foil. The support roller 10 can move in the vertical direction. When the support roller 10 moves up, it moves closer to the copper foil, and when the support roller 10 moves down, it moves away from the copper foil. There are two floating rollers 5, located between the support roller 10 and the first conveying roller 3 and between the support roller 10 and the second conveying roller 4, respectively.
[0062] In this embodiment, it also includes:
[0063] The third cylinder 11 has its telescopic end connected to the support roller 10; the third cylinder 11 is set on the ground, and the first trough 1 and the second trough 2 are also set on the ground.
[0064] In this embodiment, it also includes:
[0065] The liquid level regulating mechanism includes a first tank 1 comprising a base plate 101 and support columns 102 on both sides of the base plate 101. The support column 102 on the right side can be considered as the inlet of the first tank 1, and the support column 102 on the left side can be considered as the outlet of the first tank 1. The liquid level regulating mechanism is disposed inside the support column 102, and the first conveying roller 3 is disposed on the upper surface of the support column 102. The liquid level regulating mechanism is used to absorb the copper foil treatment solution in the first tank 1 or release the copper foil treatment solution into the first tank 1.
[0066] In this embodiment, the liquid level regulating mechanism includes:
[0067] The liquid inlet valve 12 defines a liquid storage chamber 1021 within the support column 102. The liquid storage chamber 1021 is connected to the first tank 1, and the liquid inlet valve 12 is located at the connection point.
[0068] The outlet pipe 13 is connected at one end to the storage chamber 1021 and at the other end to the first tank 1. The connection point is close to the top of the first tank 1. An outlet pump 14 is installed on the outlet pipe 13.
[0069] In this embodiment, a level gauge is installed in the first tank 1 to measure the level of the copper foil processing solution.
[0070] In this embodiment, a camera is provided on the inner wall of the first tank 1 to confirm whether the copper foil is below the surface of the copper foil processing solution.
[0071] The specific work process is as follows:
[0072] like Figure 3 As shown, under normal conditions, the floating roller 5 on the left presses down on the copper foil, causing the copper foil between the support roller 10 and the second conveyor roller 4 to bend downwards, while the floating roller 5 on the right only adheres to the upper surface of the copper foil; a transmission channel adapted to the thickness of the copper foil is formed between the positioning roller 6 and the second conveyor roller 4, and the copper foil passes through the transmission channel and enters the second tank 2.
[0073] When it is necessary to further extend the length of the copper foil between the first conveying roller 3 and the second conveying roller 4, since there are two floating rollers 5 in this embodiment, there are two adjustment methods. First: Activate the second cylinder 9. The second cylinder 9 drives the floating roller 5 located on the left to further press down the copper foil, causing the copper foil between the support roller 10 and the second conveying roller 4 to bend further downwards. Under the action of the positioning roller 6, the copper foil located in the second groove 2 will not move in the opposite direction, while the copper foil located in the first groove 1 will move rapidly for a short period during the pressing process of the second cylinder 9, extending the copper foil between the support roller 10 and the second conveying roller 4. When the second cylinder 9 moves down to a suitable position and remains stationary, the copper foil in the first groove 1 returns to its original transmission speed. Second: ... Figure 4As shown, the second cylinder 9 is activated, which drives the floating roller 5 located on the right side to press down the copper foil, causing the copper foil between the support roller 10 and the first conveyor roller 3 to bend downward, thereby extending the overall length of the copper foil between the first conveyor roller 3 and the second conveyor roller 4.
[0074] When the copper foil processing time in the second tank 2 needs to be significantly extended, the copper foil processing in the first tank 1 needs to be stopped. At this time, the inlet valve 12 needs to be opened to introduce the copper foil processing solution from the first tank 1 into the storage chamber 1021 until the liquid level of the copper foil processing solution in the first tank 1 is below the copper foil. Figure 5 As shown, close the inlet valve 12. Measure the level of the copper foil treatment solution using a level gauge, and simultaneously confirm via camera whether the copper foil is below the surface of the copper foil treatment solution.
[0075] When the second tank 2 returns to normal, the outlet pump 14 is turned on to reintroduce the copper foil treatment solution in the storage chamber 1021 into the first tank 1, so that the copper foil is below the liquid surface of the copper foil treatment solution.
[0076] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.
[0077] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.
Claims
1. A station-based automated electroplating equipment for zinc-nickel plating on copper foil, wherein the copper foil passes sequentially through a first tank (1) and a second tank (2), and the processing time of the copper foil in the second tank (2) is longer than the processing time in the first tank (1), characterized in that, include: The first conveying roller (3) is located at the outlet of the first trough (1); The second conveyor roller (4) is located at the entrance of the second tank (2). Copper foil is transferred from the first tank (1) to the second tank (2), and the copper foil is wound around the upper surfaces of the first conveyor roller (3) and the second conveyor roller (4). A floating roller (5) is positioned above the copper foil and between the first conveying roller (3) and the second conveying roller (4). The floating roller (5) can move in the up and down direction. When the floating roller (5) moves down, it can press down on the copper foil, causing the copper foil between the first conveying roller (3) and the second conveying roller (4) to become longer and bend downward.
2. The automated electroplating equipment for zinc-nickel plating on copper foil as described in claim 1, characterized in that, Also includes: The positioning roller (6) is located above the copper foil and corresponds to the second conveying roller (4). The positioning roller (6) can move closer to or further away from the second conveying roller (4) in the vertical direction. When the positioning roller (6) moves closer to the second conveying roller (4), a transmission channel adapted to the thickness of the copper foil can be formed between the second conveying roller (4) and the positioning roller (6). The positioning roller (6) is a unidirectional rotating roller, and the rotation direction of the positioning roller (6) corresponds to the movement direction of the copper foil.
3. The automated electroplating equipment for zinc-nickel plating on copper foil as described in claim 2, characterized in that, Also includes: Mounting plate (7) is positioned above the copper foil; The first cylinder (8) is fixedly mounted on the lower surface of the mounting plate (7), and the telescopic end of the first cylinder (8) is connected to the positioning roller (6).
4. The automated electroplating equipment for zinc-nickel plating on copper foil as described in claim 3, characterized in that, Also includes: The second cylinder (9) is fixedly installed on the lower surface of the mounting plate (7), and the telescopic end of the second cylinder (9) is connected to the floating roller (5).
5. The automated electroplating equipment for zinc-nickel plating on copper foil as described in claim 2, characterized in that, Also includes: A support roller (10) is disposed between the first conveying roller (3) and the second conveying roller (4) and located below the copper foil. The support roller (10) can move in the vertical direction. When the support roller (10) moves up, it is close to the copper foil, and when the support roller (10) moves down, it is away from the copper foil. There are two floating rollers (5), which are respectively located between the support roller (10) and the first conveying roller (3) and between the support roller (10) and the second conveying roller (4).
6. The automated electroplating equipment for zinc-nickel plating on copper foil as described in claim 5, characterized in that, Also includes: The third cylinder (11) has its telescopic end connected to the support roller (10).
7. The automated electroplating equipment for zinc-nickel plating on copper foil according to any one of claims 2-6, characterized in that, Also includes: The liquid level adjustment mechanism is provided in the first tank (1), which includes a bottom plate (101) and support columns (102) on both sides of the bottom plate (101). The liquid level adjustment mechanism is disposed in the support columns (102), and the first conveying roller (3) is disposed on the upper surface of the support columns (102). The liquid level adjustment mechanism is used to absorb the copper foil treatment solution in the first tank (1) or release the copper foil treatment solution into the first tank (1).
8. The automated electroplating equipment for zinc-nickel plating on copper foil as described in claim 7, characterized in that, The liquid level regulating mechanism includes: The liquid inlet valve (12) defines a liquid storage chamber (1021) within the support column (102), the liquid storage chamber (1021) is connected to the first tank (1), and the liquid inlet valve (12) is located at the connection point; The outlet pipe (13) is connected at one end to the liquid storage chamber (1021) and at the other end to the first tank (1). The connection point is close to the top of the first tank (1). An outlet pump (14) is installed on the outlet pipe (13).
9. The automated electroplating equipment for zinc-nickel plating on copper foil as described in claim 8, characterized in that, A level gauge is installed inside the first tank (1).
10. The automated electroplating equipment for zinc-nickel plating on copper foil as described in claim 8, characterized in that, A camera is installed on the inner wall of the first tank (1).
Citation Information
Patent Citations
Zinc-nickel alloy electroplating process for metal surface
CN111058067A
A process for electroplating zinc-nickel alloy on metal surface
CN114075684B
