A piezoelectric micro-pump electrode contact, power supply structure and piezoelectric micro-pump

Abstract

This invention discloses a piezoelectric micropump electrode contact, a power supply structure, and a piezoelectric micropump. The electrode contact includes a contact body and a contour extension structure. The contour extension structure includes a concave structure and / or a convex structure disposed on one or both sides of the contact body. This invention increases the contour length of the electrode contact through the arrangement of the concave structure, extending the adhesive connection line between the electrode contact and the actuating element, reducing the risk of the adhesive being torn along the connection line, thereby improving the connection strength between the electrode contact and the actuating element, and effectively preventing the contact from falling off due to the tearing of the adhesive droplet structure during vibration. The concave structure reduces the overall area and mass of the contact body, thereby reducing the influence of the electrode contact on the natural frequency of the diaphragm layer, and achieving stable operation of the piezoelectric micropump under high-frequency vibration.

Description

Technical Field

[0001] This invention belongs to the field of piezoelectric micropump technology, specifically relating to a piezoelectric micropump electrode contact, power supply structure, and piezoelectric micropump. Background Technology

[0002] Piezoelectric micropumps, as miniature pumping devices that achieve fluid drive based on the piezoelectric effect, are widely used in medical devices, microfluidic systems, and precision transmission equipment due to their small size, fast response speed, and low energy consumption. One of their core components is the actuating element on the diaphragm layer and the electrode contact structure electrically connected to it. The electrode contacts are adhesively bonded to the actuating element using a dispensing process, and must meet the mechanical reliability requirements of long-term vibration environments while ensuring electrical conductivity.

[0003] However, the electrode contact design of existing piezoelectric micropumps still has many shortcomings. First, conventional electrode contacts are mostly simple circular, rectangular, or rounded rectangular structures with relatively simple edge contours and short adhesive connecting lines between the contacts and the actuating element. During high-frequency vibration or long-term operation, the adhesive is prone to tearing along the connecting line, leading to a decrease in adhesion between the electrode contacts and the actuating element, or even contact detachment, thus seriously affecting the stability and lifespan of the device. For example, patent CN116857158A provides a "flow guiding structure and valveless piezoelectric micropump" with rhomboid electrode contacts. Its small contour length and multiple sharp points cause the adhesive to tear during vibration.

[0004] Secondly, existing electrode contacts typically improve adhesion strength by increasing the overall area, but this method inevitably increases the mass of the contacts. Increased contact mass alters the natural frequency of the diaphragm layer, leading to reduced stability of the piezoelectric micropump under high-frequency vibration.

[0005] Furthermore, for structures with two independent electrodes within a single electrode layer, to prevent both electrodes from simultaneously conducting with the diaphragm layer, the electrode layer and the diaphragm layer need to be connected using a segmented adhesive coating method. This involves coating some areas with conductive adhesive and others with insulating adhesive. While this segmented coating method avoids both electrodes being simultaneously conductive with the diaphragm layer, it increases the fabrication difficulty and cost of the piezoelectric micropump compared to a full-coverage coating method, and reduces production efficiency and yield.

[0006] In summary, existing piezoelectric micropumps generally suffer from problems such as insufficient adhesion strength of electrode contacts and power supply structure, excessive mass affecting frequency characteristics, and complex electrical connection methods. There is an urgent need to propose new structural design and process improvement schemes to improve the connection strength between electrode contacts and actuators, reduce the impact on the natural frequency of the diaphragm layer, and simplify the adhesive coating process of the power supply structure. Summary of the Invention

[0007] The purpose of this invention is to provide a piezoelectric micropump electrode contact, a power supply structure, and a piezoelectric micropump.

[0008] In a first aspect, the present invention provides a piezoelectric micropump electrode contact, which includes a contact body and a contour extension structure. The contour extension structure includes a concave structure and / or a convex structure disposed on one or both sides of the contact body.

[0009] Preferably, the contact body has a rounded rectangular sheet structure.

[0010] Preferably, the contour extension structure provided on one or both sides of the contact body is a side concave structure. The side concave structure is an arc shape with a diameter of 0.4 mm to 0.6 mm.

[0011] Preferably, the contour extension structure further includes a central recessed structure disposed on one of the width sides of the contact body. The length by which the central recessed structure extends into the contact body is greater than or equal to 2 / 3 of the overall length of the contact body.

[0012] Preferably, the inner end of the contact body is provided with a rounded transition structure for connecting the elastic cantilever plate.

[0013] Secondly, the present invention provides a piezoelectric micropump power supply structure, comprising a first electrode body, a second electrode body, an elastic cantilever plate, and electrode contacts. The electrode contacts are the aforementioned piezoelectric micropump electrode contacts. The first electrode body and the second electrode body are spaced apart and together form a conductive outer frame. One end of the elastic cantilever plate is connected to the inner edge of the first electrode body. The other end of the elastic cantilever plate is connected to the electrode contacts. The connections between the elastic cantilever plate and the contact body and the first electrode body are all provided with rounded corner structures.

[0014] Preferably, the inner contour of the second electrode body is provided with one or more conductive grooves. Insulating adhesive is applied to both sides of the first and second electrode bodies. The conductive grooves are filled with conductive adhesive; the inner surface of the conductive grooves is connected to the diaphragm layer of the piezoelectric micropump via conductive adhesive. The electrode contacts are bonded to the side of the actuating element in the piezoelectric micropump away from the diaphragm layer by dispensing adhesive.

[0015] Preferably, the conductive outer frame is rectangular. The four corners of the inner contour of the conductive outer frame are provided with beveled structures; the conductive groove is disposed on the beveled structure of the second electrode body.

[0016] Thirdly, the present invention provides a power supply structure array, comprising a main body; the main body is provided with a plurality of hollow structures arranged in a matrix. Each hollow structure is located within a grid cell divided by a grid-like segmentation path. The hollow structure includes a central through slot and two dividing through slots. One end of the two dividing through slots is connected to different positions at the central through slot; the other end of the two dividing through slots extends to the segmentation path. The shape of each grid cell with a hollow structure is the same as that of the aforementioned piezoelectric micropump power supply structure.

[0017] The power supply structure array also includes protruding positioning portions. One or more of these protruding positioning portions are connected to the edge of the main body. The end of the dividing channel opposite to the central channel has a circular hole structure. The diameter of the circular hole structure is larger than the width of the dividing channel. The circular hole structure intersects with the dividing path.

[0018] Fourthly, the present invention provides a piezoelectric micropump, comprising a heat dissipation input layer, a flow channel layer, a resonant layer, a diaphragm layer, a power supply structure, and a valve layer stacked sequentially. The power supply structure employs the aforementioned piezoelectric micropump power supply structure. The power supply structure and the opposite side of the diaphragm layer are bonded together by an insulating adhesive that completely covers the side of the power supply structure. The conductive groove on the inner contour of the second electrode body is filled with conductive adhesive; the conductive adhesive is bonded and connected to the inner surface of the conductive groove and the diaphragm layer. An actuating element is provided on the diaphragm layer; the electrode contact droplet structure of the piezoelectric micropump power supply structure is bonded to the side of the diaphragm layer opposite to the actuating element.

[0019] Preferably, the valve layer comprises a first fixing layer, an elastic film layer, a second fixing layer, and an output layer stacked sequentially along a direction away from the power supply structure. The outer contours of the first fixing layer, the elastic film layer, the second fixing layer, and the output layer are all rectangular. The valve layer is provided with an air supply valve structure. The air supply valve structure includes a first air supply hole on the first fixing layer, a second air supply hole on the elastic film layer, and a third air supply hole on the second fixing layer. The first and second air supply holes are completely within the range of the third air supply hole. The first and second air supply holes are offset from each other. The output layer has an output chamber communicating with the third air supply hole.

[0020] Preferably, the valve layer is provided with a vent valve structure; the vent valve structure includes a first vent hole on a first fixed layer, an annular reinforcing portion on an elastic film layer, and a second vent hole on a second fixed layer, as well as an exhaust structure within the output chamber. The first vent hole, the annular reinforcing portion, and the second vent hole are arranged and aligned sequentially. The annular reinforcing portion has a segmented, surrounding structure. The exhaust structure extends from the inner wall of the output chamber to a position aligned with the central area of ​​the second vent hole. An exhaust channel is provided within the exhaust structure. The inlet of the exhaust channel is aligned with the second vent hole.

[0021] Preferably, the outlet of the exhaust channel is located at the side edge of the output layer. A reinforcing plate is provided on the side of the exhaust structure facing the elastic film layer. The top surface of the reinforcing plate is higher than the top surface of the output layer. The diameter of the second exhaust hole is larger than the diameter of the reinforcing plate.

[0022] Preferably, the annular reinforcing portion includes a plurality of reinforcing units arranged in a circular pattern. The reinforcing units are fan-shaped.

[0023] Preferably, a padding layer is provided between the diaphragm layer and the power supply structure. The padding layer has a relief groove aligned with the conductive groove. The conductive adhesive passes through the relief groove.

[0024] Preferably, the piezoelectric micropump further includes a control layer disposed on the side of the valve layer opposite to the power supply structure. The control layer has a circuit for driving the actuation element to vibrate, and two power supply interfaces; the two power supply interfaces are aligned with the first electrode body and the second electrode body on the power supply structure, respectively. Each layer between the control layer and the power supply structure has a power supply through-hole aligned with the two power supply interfaces. An elastic conductive element is accommodated in the power supply through-hole. The two power supply interfaces are electrically connected to the first electrode body and the second electrode body, respectively, through the elastic conductive element.

[0025] Fifthly, the present invention provides a method for preparing a piezoelectric micropump, comprising:

[0026] Based on the shape of each layer of the piezoelectric micropump, corresponding single-layer array structures are fabricated.

[0027] Each single-layer array structure was sequentially coated with a completely covering layer of insulating adhesive and then stacked to obtain the overall array structure of the piezoelectric micropump. Before stacking the diaphragm layer, conductive adhesive was filled into all the conductive grooves on the single-layer array structure corresponding to the already coated power supply structure. Then, the single-layer array structure corresponding to the diaphragm layer was stacked, creating an electrical connection between the power supply structure and the diaphragm layer.

[0028] The overall array structure of the piezoelectric micropump is divided to obtain multiple piezoelectric micropumps.

[0029] The present invention has the following beneficial effects.

[0030] This invention increases the outline length of the electrode contacts by arranging the concave structure, which extends the adhesive connecting line between the electrode contacts and the actuating element, reduces the risk of the adhesive being torn along the connecting line, thereby improving the connection strength between the electrode contacts and the actuating element and effectively preventing the contact from falling off due to the tearing of the adhesive droplet structure during vibration.

[0031] This invention reduces the overall area and mass of the contact body by setting a side concave structure and a middle concave structure on the outer edge of the contact body, thereby reducing the influence of the electrode contact on the natural frequency of the diaphragm layer and realizing the stable operation of the piezoelectric micropump under high-frequency vibration.

[0032] This invention reduces stress concentration and improves the fatigue strength and long-term reliability of the structural connection by setting a rounded transition structure at the connection between the contact point body and the conductive outer frame at both ends of the elastic cantilever plate.

[0033] This invention achieves automatic electrical isolation between the first electrode body and the second electrode body after segmentation by setting a dividing slot in each grid cell of a whole power supply structure array that intersects with the segmentation path. At the same time, a circular hole structure is opened at the end of the dividing slot connecting the segmentation path to avoid breakage due to stress concentration during the segmentation of the power supply structure array.

[0034] This invention achieves electrical connection by covering the conductive outer frame with an insulating layer and setting a conductive groove at the inner corner of the second electrode body. The conductive groove is filled with conductive adhesive that extends to the diaphragm layer. This avoids the situation where both independent electrode bodies in the conductive outer frame are connected to the diaphragm layer without using a regional adhesive coating process. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present invention.

[0036] Figure 2 This is a schematic diagram of the structure of Embodiment 2 of the present invention.

[0037] Figure 3 This is a schematic diagram of the structure of Embodiment 3 of the present invention.

[0038] Figure 4 This is a schematic diagram of the structure of Embodiment 4 of the present invention.

[0039] Figure 5 This is a schematic diagram of the structure of the partition groove in Embodiment 4 of the present invention (i.e.) Figure 4 (A magnified view of part A in the middle).

[0040] Figure 6 This is an explosion diagram of Embodiment 6 of the present invention.

[0041] Reference numerals: 1. Contact body; 2. Side concave structure; 3. Middle concave structure; 4. Rounded corner transition structure; 5. Side convex structure; 6. First electrode body; 7. Second electrode body; 7-1. Conductive groove; 8. Partition structure; 9. Beveled edge structure; 10. Elastic cantilever plate; 11. Electrode contact; 12. Main body; 12-1. Hollow structure; 12-1-1. Central through groove; 12-1-2. Separating through groove; 12-1-3. Circular hole structure; 13. Convex positioning part; 14. Dispersion 15. Heat input layer; 16. Flow channel layer; 17. Resonant layer; 18. Diaphragm layer; 19. Pad layer; 20. Power supply structure; 21. Separation layer; 21. First fixing layer; 21-1. First air supply hole; 21-2. First exhaust hole; 22. Elastic film layer; 22-1. Second air supply hole; 22-2. Annular reinforcement; 23. Second fixing layer; 23-1. Third air supply hole; 23-2. Second exhaust hole; 24. Output layer; 24-1. Output chamber; 24-2. Exhaust structure; 25. Control layer. Detailed Implementation

[0042] The present invention will be further described below with reference to the accompanying drawings.

[0043] Example 1

[0044] like Figure 1 As shown, a piezoelectric micropump electrode contact includes a contact body 1 and a recessed structure disposed on the outer edge of the contact body 1. The recessed structure includes side recessed structures 2 disposed on both sides of the contact body 1 and a central recessed structure 3 disposed on the outer end of the contact body 1.

[0045] The contact body 1 is a rounded rectangular sheet structure. The side concave structure 2 is formed on two length sides of the contact body 1, so that the two side edges of the electrode contact form a concave contour. The middle concave structure 3 is formed on one width side of the contact body 1, so that the outer edge of the electrode contact forms a concave contour. The other width side of the contact body 1 is used to connect the main body 12 of the piezoelectric micropump's power supply structure through the elastic cantilever plate 10.

[0046] The inner end of the contact body 1 is provided with a rounded corner transition structure 4. The rounded corner transition structure 4 is used to connect the elastic cantilever plate 10, thereby reducing stress concentration and improving the connection strength between the electrode contact and the main body 12 of the power supply structure.

[0047] In this embodiment, two side recessed structures 2 are provided on each side of the contact body 1. In some other embodiments, the number of side recessed structures 2 on each side of the contact body 1 may be other than two, such as one, three, or four.

[0048] In some other embodiments, the contact body 1 has a side recessed structure 2 on only one side.

[0049] In this embodiment, the concave side structure 2 is arc-shaped, preferably semi-circular. In some other embodiments, the concave side structure 2 may take other shapes, such as elliptical or rectangular.

[0050] In this embodiment, the central concave structure 3 is a rectangle with rounded corners.

[0051] In some embodiments, the length by which the central concave structure 3 extends into the interior of the contact body 1 is 2 / 3 of the overall length of the contact body 1.

[0052] In some embodiments, the piezoelectric micropump electrode contacts do not have sharp points with abrupt changes in curvature at any position on their contours.

[0053] In some further preferred embodiments, the semi-circular diameter of the side concave structure 2 is 0.3~0.5mm, preferably 0.4mm; the width of the middle concave structure 3 is 0.3~0.5mm, preferably 0.4mm, to meet the minimum processing capability under the current laser processing without ablation, and to maximize the bonding contour length. As the electrode contact thickness continues to decrease, the adhesion force at the contact edge is used to ensure the adhesion force and reliability between the contact and the actuating element.

[0054] In some embodiments, the material of the piezoelectric micropump electrode contacts is a thin metal material that needs to have sufficient ductility, such as gold, aluminum, or copper.

[0055] In some embodiments, the thickness of the piezoelectric micropump electrode contact is 0.02~0.08mm, preferably 0.05mm.

[0056] In this embodiment, by setting a concave structure on the outer edge of the contact body 1, the area of ​​the contact body 1 is reduced, thereby decreasing the influence of the electrode contact on the natural frequency of the diaphragm layer, while also increasing the contour length of the electrode contact. The electrode contact is fixedly connected to the actuating element of the piezoelectric micropump via a dispensing process; the adhesive droplet structure formed by the dispensing process covers the electrode contact and adheres to the actuating element. Increasing the contour length of the electrode contact improves the connection strength between the electrode contact and the actuating element, preventing the electrode contact from tearing the adhesive droplet structure during vibration and separating from the actuating element.

[0057] Example 2

[0058] like Figure 2As shown, a piezoelectric micropump electrode contact is provided. The difference between this embodiment and embodiment 1 is that: in this embodiment, the side concave structure 2 is not provided, but the side convex structure 5 is used instead of the side concave structure 2, so that the two sides of the contact body 1 form an outward convex contour.

[0059] This embodiment can also increase the outline length of the electrode contacts and improve the connection strength between the electrode contacts and the actuating element, but it cannot reduce the area and mass of the electrode contacts.

[0060] Example 3

[0061] like Figure 3 As shown, a piezoelectric micropump power supply structure has a sheet-like structure, including a first electrode body 6, a second electrode body 7, an elastic cantilever plate 10, and electrode contacts 11. The electrode contacts 11 are those provided in Embodiment 1 or 2. The first electrode body 6 and the second electrode body 7 together form a ring-shaped conductive outer frame. The two ends of the first electrode body 6 and the two ends of the second electrode body 7 are respectively directly opposite each other and spaced apart by a partition structure 8, so that the first electrode body 6 and the second electrode body 7 are not directly electrically connected. The partition structure 8 can be an insulating solid structure or a gap.

[0062] The elastic cantilever plate 10 is elongated. One end of the elastic cantilever plate 10 is connected to the inner edge of the first electrode body 6. The other end of the elastic cantilever plate 10 is connected to the electrode contact 11. The first electrode body 6, the elastic cantilever plate 10, and the electrode contact 11 are a single conductive sheet-like entity with an integrated structure.

[0063] The connection between the elastic cantilever plate 10 and the first electrode body 6, and the connection between the elastic cantilever plate 10 and the electrode contact 11, are provided with rounded corner transition structures 4, thereby reducing stress concentration, improving structural strength, and avoiding electrode copper breakage caused by vibration.

[0064] The conductive outer frame formed by the first electrode body 6 and the second electrode body 7 is rectangular. The first electrode body 6 occupies one corner of the rectangle; the second electrode body 7 occupies three corners of the rectangle.

[0065] The conductive outer frame has beveled structures 9 at each of its four corners to increase the structural strength of the four corners. Conductive grooves 7-1 are provided in the middle of the two beveled structures 9 located on the second electrode body 7.

[0066] Insulating adhesive is applied to both sides of the first electrode body 6 and the second electrode body 7. The conductive groove 7-1 is filled with conductive adhesive for electrical connection to the diaphragm layer.

[0067] The first electrode body 6 and the second electrode body 7 are respectively connected to the two poles of the power supply interface through independent conductive lead-out structures. The first electrode body 6 is connected to the side of the actuator away from the diaphragm layer through the elastic cantilever plate 10 and electrode contact 11. The second electrode body 7 is connected to the side of the actuator near the diaphragm layer through the side wall of the conductive groove 7-1, conductive adhesive, and the diaphragm layer. This enables power supply to the actuator.

[0068] Example 4

[0069] like Figure 4 As shown, a power supply structure array, in sheet form, is used to divide and form the piezoelectric micropump power supply structure provided in Embodiment 3.

[0070] The power supply structure array includes a main body 12 and an outwardly protruding positioning portion 13. The outwardly protruding positioning portion 13 is disposed around the periphery of the main body 12 and is used to constrain the circumferential position of the power supply structure array during processing.

[0071] The main body 12 has multiple hollow structures 12-1 arranged in a matrix. Each hollow structure 12-1 is located in a grid-like segmented path (corresponding to...). Figure 4 A grid cell is defined by the dashed lines in the diagram (i.e., ...). Figure 4 Within the rectangular area enclosed by the dashed lines.

[0072] Each grid cell with a hollow structure 12-1 has the same shape as the piezoelectric micropump power supply structure provided in Example 3.

[0073] like Figure 5 As shown, the hollow structure 12-1 includes a central through slot 12-1-1 and two dividing through slots 12-1-2. One end of each of the two dividing through slots 12-1-2 is connected to a different position on the central through slot 12-1-1; the other end of each of the two dividing through slots 12-1-2 extends to the dividing path. The two dividing through slots 12-1-2 correspond to the two partition structures 8 on the piezoelectric micropump power supply structure.

[0074] The dividing channel 12-1-2 has a circular hole structure 12-1-3 at its end opposite to the central channel 12-1-1. The diameter of the circular hole structure 12-1-3 is larger than the width of the dividing channel 12-1-2. The circular hole structure 12-1-3 intersects the dividing path. The circular hole structure 12-1-3 is used to prevent the end of the dividing channel 12-1-2 from breaking due to stress concentration during the power supply structure array dividing process.

[0075] Example 5

[0076] A method for preparing a piezoelectric micropump power supply structure is provided for preparing the piezoelectric micropump power supply structure provided in Example 3.

[0077] The preparation method includes:

[0078] Step 1: Laser cut the sheet material to produce the power supply structure array provided in Example 4.

[0079] Step 2: Stack and fix the power supply structure array with the corresponding sheet array structure of other device layers of the piezoelectric micropump.

[0080] Step 3: The stacked multi-layer array structure is laser-cut along the segmentation path to obtain the piezoelectric micropump power supply structure integrated in the piezoelectric micropump. At this time, the first electrode body 6 and the electrode body, which are not directly connected, are fixed in relative position through other device layers of the piezoelectric micropump.

[0081] Example 6

[0082] like Figure 6 As shown, a piezoelectric micropump includes a heat dissipation input layer 14, a flow channel layer 15, a resonant layer 16, a diaphragm layer 17, a power supply structure 19, a valve layer, and a control layer 25, which are stacked sequentially. The control layer 25 is used to supply power to the actuation element on the diaphragm layer 17 and to control the vibration parameters of the actuation element.

[0083] In some embodiments, a padding layer 18 is provided between the diaphragm layer 17 and the power supply structure 19. In some further embodiments, a padding layer 18 may also be provided between the resonant layer 16 and the diaphragm layer 17.

[0084] In some embodiments, a partition layer 20 is provided between the power supply structure 19 and the valve layer. The partition layer 20 is used to separate the vibrating part of the piezoelectric micropump from the valve layer, thereby improving the working stability of the valve layer.

[0085] The power supply structure 19 adopts the piezoelectric micropump power supply structure 19 provided in Embodiment 3.

[0086] The diaphragm layer 17 is a sheet-like, integral structure, including an outer frame, elastic connection structures, and a central oscillator. The four sides of the central oscillator are connected to the inner periphery of the outer frame through multiple elastic connection structures. An actuation element is fixed to the side of the central oscillator of the diaphragm layer 17 facing away from the resonant layer 16. The actuation element is a ceramic piezoelectric sheet.

[0087] The diaphragm layer 17, and all layers between the diaphragm layer 17 and the power supply structure 19, have clearance grooves aligned with the conductive grooves 7-1 on the power supply structure 19. The clearance grooves and the conductive grooves 7-1 on the power supply structure 19 are filled with conductive adhesive. The sidewalls of the clearance grooves on the diaphragm layer 17 and the sidewalls of the conductive grooves 7-1 on the power supply structure 19 are electrically connected via conductive adhesive, thereby electrically connecting the second electrode body 7 of the power supply structure 19 to the side of the actuator element near the diaphragm layer 17. The electrode contacts 11 are fixed to the node positions of the actuator element via adhesive droplet structures, forming an electrical connection.

[0088] A pump chamber is formed between the diaphragm layer 17 and the valve layer.

[0089] In some embodiments, the control layer 25 includes a circuit for generating periodic electrical signals. The control layer 25 has two power supply interfaces; these interfaces are aligned with the first electrode body 6 and the second electrode body 7 on the power supply structure 19, respectively. Both the partition layer 20 and the valve layer have power supply through-holes aligned with the two power supply interfaces. Each power supply through-hole contains an elastic conductive element. The two ends of the elastic conductive element abut against the corresponding power supply interface on the control layer 25 and the electrode body on the power supply structure 19, respectively. The periodic electrical signals output from the control layer 25 are conducted through the two power supply interfaces and the two elastic conductive elements to the two electrode bodies of the power supply structure 19, and then through the two electrode bodies of the power supply structure 19 to the two sides of the actuating element.

[0090] The valve layer includes a first fixing layer 21, an elastic film layer 22, a second fixing layer 23, and an output layer 24, which are stacked sequentially along the direction away from the power supply structure 19. The outer contours of the first fixing layer 21, the elastic film layer 22, the second fixing layer 23, and the output layer 24 are rectangular structures with the same outer contour as the power supply structure 19.

[0091] The valve layer is provided with an air supply valve structure and an air release valve structure at intervals. The air supply valve structure is used to pump gas outward in one direction when the diaphragm layer 17 vibrates; the air release valve structure is used to discharge the airflow in the sphygmomanometer bladder when the diaphragm layer 17 stops working.

[0092] The air supply valve structure includes a first air supply hole 21-1 disposed on the first fixed layer 21, a second air supply hole 22-1 disposed on the elastic film layer 22, a third air supply hole 23-1 disposed on the second fixed layer 23, and an output chamber 24-1 disposed on the output layer 24. The diameter of the third air supply hole 23-1 is larger than the diameters of the first air supply hole 21-1 and the second air supply hole 22-1. The first air supply hole 21-1 and the second air supply hole 22-1 are both completely within the range of the third air supply hole 23-1. The center position of the second air supply hole 22-1 is aligned with the center position of the third air supply hole 23-1. The first air supply hole 21-1 and the second air supply hole 22-1 are offset. When the elastic film layer 22 abuts against the first air supply hole 21-1, the air supply valve structure is closed; when the elastic film layer 22 separates from the first air supply hole 21-1, the air supply valve structure is open.

[0093] In some embodiments, there are multiple first air supply holes 21-1, such as 2, 3, 4 or other numbers; each first air supply hole 21-1 is arranged around the second air supply hole 22-1, preferably in a circumferential arrangement along the second air supply hole 22-1.

[0094] The third air supply port 23-1 communicates with the output chamber 24-1. One or more output ports are located at the center of the control layer 25. These output ports communicate with the output chamber 24-1.

[0095] The vent valve structure includes a first vent 21-2 disposed on the first fixed layer 21, an annular reinforcing portion 22-2 disposed on the elastic film layer 22, a second vent 23-2 disposed on the second fixed layer 23, and a vent structure 24-2 disposed on the output layer 24. The first vent 21-2, the annular reinforcing portion 22-2, and the second vent 23-2 are arranged and aligned sequentially. The vent structure 24-2 extends from the inner wall of the output chamber 24-1 to a position aligned with the central region of the second vent 23-2.

[0096] The exhaust structure 24-2 has an exhaust channel. The inlet of the exhaust channel is located on the side of the exhaust structure 24-2 facing the elastic film layer 22 and is aligned with the center point of the second exhaust hole 23-2. A reinforcing plate is provided on the side of the exhaust structure 24-2 facing the elastic film layer 22. The top surface of the reinforcing plate is higher than the top surface of the output layer 24. A through hole aligned with the inlet of the exhaust channel is provided on the reinforcing plate. When the elastic film layer 22 abuts against the reinforcing plate, the venting valve structure is closed; when the elastic film layer 22 separates from the reinforcing plate, the venting valve structure is open.

[0097] The diameter of the second exhaust hole 23-2 is larger than the diameter of the reinforcing sheet, so that when the elastic film layer 22 bulges in the area of ​​the second exhaust hole 23-2, the gas in the output chamber 24-1 can enter the inlet of the exhaust channel through the location of the second exhaust hole 23-2.

[0098] The first vent 21-2 and the second vent 23-2 have the same diameter, providing space for the elastic film layer 22 to deform elastically. The outer diameter of the annular reinforcing portion 22-2 is smaller than the diameter of the second vent 23-2. The inner diameter of the annular reinforcing portion 22-2 is larger than the inlet diameter of the exhaust channel. The annular reinforcing portion 22-2 adopts a segmented surrounding structure, including multiple reinforcing units arranged at intervals along the annular direction.

[0099] In some embodiments, the reinforcing unit is fan-shaped. Each reinforcing unit is evenly distributed circumferentially along the axis of the second vent 23-2. The annular reinforcing portion 22-2 enhances the elastic modulus of the elastic film layer 22 at the vent valve structure, thus allowing the vent to open during venting without producing abnormal noise. This shape and material are the optimal results obtained from multiple experiments. In some further embodiments, the number of reinforcing units is eight.

[0100] The working principle of this embodiment is as follows:

[0101] In the initial state, the pressure on both sides of the air supply valve structure (i.e., the pump chamber and the output chamber) is equal, the elastic film layer 22 is in a flat and undeformed state, and both the air supply valve structure and the air release valve structure are in a closed state.

[0102] A piezoelectric micropump is required to supply air to the blood pressure monitor. The control layer 25 applies an alternating current signal to the first electrode body 6 and the second electrode body 7 of the power supply structure 19 to drive the actuator to reciprocate.

[0103] When the actuating element drives the diaphragm layer 17 to vibrate towards the valve layer, the pump chamber pressure is greater than the output chamber pressure. When the elastic film layer 22 is pushed and deformed at the air supply valve structure, the air supply valve structure opens (specifically, the position of the second air supply hole 22-1 on the elastic film layer 22 protrudes towards the third air supply hole 23-1 under the action of pressure difference). The vent valve structure remains closed, and the airflow enters the output chamber from the pump chamber and is output to the air bag of the sphygmomanometer.

[0104] When the actuator drives the diaphragm layer 17 to vibrate away from the valve layer, the elastic film layer 22, under the pressure difference at the air supply valve structure, tightly adheres to the first fixing layer 21, causing the air supply valve structure to shut off (specifically, the elastic film layer 22 blocks each of the first air supply holes 21-1), preventing gas backflow. External airflow passes sequentially through the heat dissipation input layer 14, the flow channel layer 15, the resonant layer 16, and the diaphragm layer 17 before entering the pump chamber. At this time, the vent valve structure remains in the shut-off state.

[0105] After the blood pressure monitor completes the blood pressure measurement, the control layer 25 stops outputting electrical signals, and the actuator stops vibrating. The pressure inside the blood pressure monitor's bladder causes the pressure in the output chamber 24-1 to be greater than the pressure in the pump chamber. The air supply valve structure is shut off under the action of the pressure difference. At the same time, the larger air pressure in the output chamber 24-1 relative to the pump chamber pushes a portion of the elastic diaphragm layer 22 at the second exhaust port 23-2 to protrude towards the first exhaust port 21-2 on the first fixed layer 21. This opens the exhaust flow channel inlet of the exhaust structure 24-2, and the gas inside the blood pressure monitor's bladder is output outward through the output chamber 24-1 and the exhaust flow channel, thus deflating the blood pressure monitor's bladder.

Claims

1. A piezoelectric micropump power supply structure, comprising a first electrode body (6), a second electrode body (7), an elastic cantilever plate (10), and electrode contacts (11); characterized in that: The electrode contact (11) includes a contact body (1) and a contour extension structure; the contour extension structure includes an inward concave structure and / or an outward convex structure disposed on one or both sides of the contact body (1); the first electrode body (6) and the second electrode body (7) are spaced apart by a partition structure (8) and enclosed to form a conductive outer frame; the partition structure (8) is a gap; one end of the elastic cantilever plate (10) is connected to the inner edge of the first electrode body (6); the other end of the elastic cantilever plate (10) is connected to the electrode contact (11); the connection between the elastic cantilever plate (10) and the contact body (1) and the first electrode body (6) is provided with a rounded corner structure; One or more conductive grooves (7-1) are provided on the inner contour of the second electrode body (7); insulating glue is applied to both sides of the first electrode body (6) and the second electrode body (7); conductive glue is filled in the conductive groove (7-1); the inner surface of the conductive groove (7-1) is connected to the diaphragm layer of the piezoelectric micropump through conductive glue. The electrode contacts are contacts that supply power to the side of the actuating element away from the diaphragm layer in the piezoelectric micropump; the electrode contacts of the piezoelectric micropump and the side of the actuating element away from the diaphragm layer are fixed together by a droplet structure covering the electrode contacts.

2. The piezoelectric micropump power supply structure according to claim 1, characterized in that: The contact body (1) has a rounded rectangular sheet structure.

3. The piezoelectric micropump power supply structure according to claim 2, characterized in that: The contour extension structure set on one or both sides of the contact body (1) is a side concave structure (2); the side concave structure (2) is an arc shape with a diameter of 0.4mm to 0.6mm.

4. The piezoelectric micropump power supply structure according to claim 2, characterized in that: The contour extension structure also includes a central concave structure (3) disposed on one of the width sides of the contact body (1); the length of the central concave structure (3) extending into the contact body (1) is greater than or equal to 2 / 3 of the overall length of the contact body (1).

5. The piezoelectric micropump power supply structure according to claim 1, characterized in that: The conductive outer frame is rectangular; each of the four corners of the inner contour of the conductive outer frame is provided with a beveled structure (9); the conductive groove (7-1) is provided on the beveled structure (9) of the second electrode body (7).

6. A power supply structure array, comprising a main body (12); the main body (12) is provided with a plurality of hollow structures (12-1) arranged in a matrix; each hollow structure (12-1) is located within a grid cell divided by a grid-like segmentation path; the hollow structure (12-1) includes a central through slot (12-1-1) and two dividing through slots (12-1-2); one end of each of the two dividing through slots (12-1-2) is connected to a different position at the central through slot (12-1-1); the other end of each of the two dividing through slots (12-1-2) extends to the segmentation path; characterized in that: Each grid cell with a hollow structure (12-1) has the same shape as the piezoelectric micropump power supply structure described in claim 1; The power supply structure array also includes an outwardly protruding positioning portion (13); one or more of the outwardly protruding positioning portions (13) are connected to the edge of the main body portion (12); the end of the dividing channel (12-1-2) away from the central channel (12-1-1) is provided with a circular hole structure (12-1-3); the diameter of the circular hole structure (12-1-3) is greater than the width of the dividing channel (12-1-2); the circular hole structure (12-1-3) intersects with the dividing path.

7. A piezoelectric micropump, comprising a heat dissipation input layer (14), a flow channel layer (15), a resonant layer (16), a diaphragm layer (17), a power supply structure (19), and a valve layer stacked sequentially; characterized in that: The power supply structure (19) adopts the piezoelectric micropump power supply structure as described in claim 5; the power supply structure (19) and the opposite side of the diaphragm layer (17) are bonded together by insulating adhesive that completely covers the side of the power supply structure (19); the conductive groove on the inner contour of the second electrode body (7) is filled with conductive adhesive; the conductive adhesive is bonded and connected to the inner surface of the conductive groove and the diaphragm layer (17); the diaphragm layer (17) is provided with an actuating element; the electrode contacts (11) of the piezoelectric micropump power supply structure are bonded to the side of the diaphragm layer (17) with the actuating element facing away by the adhesive droplet structure.

8. A piezoelectric micropump according to claim 7, characterized in that: The valve layer includes a first fixing layer (21), an elastic film layer (22), a second fixing layer (23), and an output layer (24) stacked sequentially along the direction away from the power supply structure (19); the outer contours of the first fixing layer (21), the elastic film layer (22), the second fixing layer (23), and the output layer (24) are all rectangular; the valve layer is provided with an air supply valve structure; the air supply valve structure includes a first air supply hole (21-1) on the first fixing layer (21), a second air supply hole (22-1) on the elastic film layer (22), and a third air supply hole (23-1) on the second fixing layer (23); the first air supply hole (21-1) and the second air supply hole (22-1) are both completely within the range of the third air supply hole (23-1); the first air supply hole (21-1) and the second air supply hole (22-1) are offset; the output layer (24) is provided with an output chamber (24-1) that communicates with the third air supply hole (23-1).

9. A piezoelectric micropump according to claim 8, characterized in that: The valve layer is provided with a vent valve structure; the vent valve structure includes a first vent hole (21-2) on the first fixed layer (21), an annular reinforcement (22-2) on the elastic film layer (22), and a second vent hole (23-2) on the second fixed layer (23), and an exhaust structure (24-2) in the output chamber (24-1); the first vent hole (21-2), the annular reinforcement (22-2), and the second vent hole (23-2) are arranged and aligned in sequence; the annular reinforcement (22-2) has a segmented surrounding structure; the exhaust structure (24-2) extends from the inner wall of the output chamber (24-1) to a position aligned with the central area of ​​the second vent hole (23-2); the exhaust structure (24-2) is provided with an exhaust flow channel; the inlet of the exhaust flow channel is aligned with the second vent hole (23-2).

10. A piezoelectric micropump according to claim 9, characterized in that: The outlet of the exhaust channel is located at the side edge of the output layer (24); the exhaust structure (24-2) has a reinforcing sheet on the side facing the elastic film layer (22); the top surface of the reinforcing sheet is higher than the top surface of the output layer (24); the diameter of the second exhaust hole (23-2) is larger than the diameter of the reinforcing sheet.

11. A piezoelectric micropump according to claim 7, characterized in that: A padding layer (18) is provided between the diaphragm layer (17) and the power supply structure (19); the padding layer (18) is provided with a relief groove aligned with the conductive groove; the conductive adhesive passes through the relief groove.

12. A piezoelectric micropump according to claim 7, characterized in that: The piezoelectric micropump also includes a control layer disposed on the side of the valve layer away from the power supply structure (19); the control layer (25) is provided with a circuit for driving the actuation element to vibrate, and two power supply interfaces; the two power supply interfaces are respectively aligned with the first electrode body (6) and the second electrode body (7) on the power supply structure (19); each layer structure between the control layer and the power supply structure (19) is provided with a power supply through hole aligned with the two power supply interfaces; the power supply through hole contains an elastic conductive element; the two power supply interfaces are electrically connected to the first electrode body (6) and the second electrode body (7) respectively through the elastic conductive element.

13. The method for preparing a piezoelectric micropump as described in claim 7, characterized in that, include: Based on the shape of each layer of the piezoelectric micropump, corresponding single-layer array structures are fabricated. Each single-layer array structure is coated with a completely covering insulating adhesive and stacked in sequence to obtain the overall array structure of the piezoelectric micropump; before stacking the diaphragm layer (17), conductive adhesive is filled into all the conductive grooves (7-1) on the single-layer array structure corresponding to the power supply structure that has been coated with insulating adhesive; then the single-layer array structure corresponding to the diaphragm layer (17) is stacked to form an electrical connection between the power supply structure and the diaphragm layer (17); The overall array structure of the piezoelectric micropump is divided to obtain multiple piezoelectric micropumps.

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