High-speed communication gateway system and communication method

Abstract

The application belongs to the technical field of electric communication technology, and particularly relates to transmission, and especially relates to a high-speed communication gateway system and a communication method. The high-speed communication gateway system comprises: a communication layer arranged in a circuit board, which is electrically connected with a control module; a plurality of communication lines with equal length, width and thickness are arranged on the top surface and the bottom surface of the communication layer at equal intervals; the control module is configured to acquire the number of communication lines required for transmitting high-speed signals according to the total width of the communication lines, and transmit the high-speed signals after determining the signal transmission mode according to the number of required communication lines, so as to reduce the copper layer thickness of the communication lines and ensure the transmission effect of the high-speed signals.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electric communication technology, and particularly relates to transmission, and especially relates to a high-speed communication gateway system and a communication method. BACKGROUND

[0002] The high-frequency component of the high-speed signal will force the current to concentrate in a very thin layer on the surface of the PCB copper foil, resulting in an increase in the AC resistance of the communication line with the increase in frequency. For example, when the high-speed signal is 10 Gbps, the skin depth of the copper layer is only about 1 μm, and the thickness of the PCB copper foil is usually 17 μm, 35 μm, 70 μm, etc. Due to the skin effect, the thicker the copper layer of the communication line, the stronger the resistance loss of the high-speed signal in transmission, resulting in errors in the transmission of the high-speed signal.

[0003] Therefore, due to the existence of the skin effect, the resistance loss of the high-speed signal is stronger when the high-speed signal is transmitted in the communication line with a thicker copper layer, resulting in the technical problem of errors in the transmission of the high-speed signal. Therefore, a high-speed communication gateway system and a communication method need to be designed.

[0004] It should be noted that the above information disclosed in the background section of the present application is only used to understand the background of the present application, and therefore, the above description is not considered to constitute prior art information. SUMMARY

[0005] The embodiments of the present application at least provide a high-speed communication gateway system and a communication method

[0006] In a first aspect, the embodiments of the present application provide a high-speed communication gateway system, comprising:

[0007] A communication layer is arranged in the circuit board and electrically connected with the control module;

[0008] The top surface and the bottom surface of the communication layer are both provided with a plurality of communication lines with equal length, equal width and equal thickness at equal intervals;

[0009] The control module is configured to obtain the number of communication lines required for transmitting the high-speed signal according to the total width of the communication lines, and determine the signal transmission mode according to the number of communication lines required, and then transmit the high-speed signal.

[0010] In an optional embodiment, the data transmission rate of the high-speed signal ranges from 10 Gbps to 25 Gbps.

[0011] The thickness of the copper layer corresponding to the communication line is 9-17 μm.

[0012] In an optional embodiment, the method for the control module to obtain the number of communication lines required for transmitting the high-speed signal according to the total width of the communication lines comprises:

[0013] The number of communication lines required to transmit high-speed signals is

[0014] N 数量 =W 总宽度 / α;

[0015] Where, N 数量 The number of communication lines required to transmit high-speed signals; W 总宽度 α represents the total bandwidth of all communication lines; α is an empirical coefficient.

[0016] In an optional implementation, the control module is further configured to, after obtaining the number of communication lines required for transmitting high-speed signals, remove the decimal part and keep only the integer part after obtaining the number of communication lines, and use the integer part as the actual number of communication lines required for transmitting high-speed signals.

[0017] In one optional implementation, the method of transmitting high-speed signals after determining the signal transmission method based on the required number of communication lines includes:

[0018] The control module is configured to, after obtaining the actual number of communication lines, if the actual number of communication lines is less than or equal to half of the actual number of communication lines, use staggered communication lines for signal transmission, that is, in two adjacent columns of communication lines, one column uses the top communication line and the other column uses the bottom communication line, until the number of communication lines used meets the actual number of communication lines.

[0019] In one optional implementation, the method of transmitting high-speed signals after determining the signal transmission method based on the required number of communication lines includes:

[0020] The control module is configured to, after obtaining the actual number of communication lines, if the actual number of communication lines is greater than half of the actual number of communication lines, use the communication lines column by column, that is, use each column of communication lines column by column until the number of communication lines used meets the actual number of communication lines.

[0021] In one optional implementation, the control module is configured to transmit the high-speed signal through the communication line corresponding to the transmission method after determining the signal transmission line, and to transmit the data check code through a communication line during the transmission process.

[0022] The communication line for transmitting data verification codes is not in the communication line corresponding to the transmission method.

[0023] In one optional implementation, the control module is configured to, after determining the signal transmission line, divide the high-speed signal data packets corresponding to the high-speed signal according to the actual number of communication lines in the signal transmission line, and then transmit the divided sub-data packets through each of the adopted communication lines.

[0024] Secondly, this disclosure also provides a communication method using the above-described high-speed communication gateway system, comprising:

[0025] The control module obtains the number of communication lines required to transmit high-speed signals based on the total width of the communication lines, and then determines the signal transmission method based on the required number of communication lines before transmitting the high-speed signals.

[0026] In one optional implementation, the data transmission rate of the high-speed signal ranges from 10 to 25 Gbps;

[0027] The copper cladding thickness corresponding to the communication line is 9-17μm.

[0028] The beneficial effects of this invention are that the high-speed communication gateway system includes: a communication layer disposed in a circuit board, which is electrically connected to a control module; a plurality of communication lines of equal length, width and thickness are evenly spaced on the top and bottom surfaces of the communication layer; the control module is configured to obtain the number of communication lines required for transmitting high-speed signals based on the total width of the communication lines, and after determining the signal transmission method based on the required number of communication lines, transmit the high-speed signals, thereby reducing the copper layer thickness of the communication lines and ensuring the transmission effect of high-speed signals.

[0029] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and the drawings.

[0030] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0031] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of a communication layer structure provided in an embodiment of the present disclosure;

[0033] Figure 2 A schematic diagram of a communication layer provided in an embodiment of this disclosure;

[0034] Figure 3 A schematic diagram of a communication line using an alternating vertical arrangement is provided for an embodiment of this disclosure;

[0035] Figure 4 This is a schematic diagram of a communication line used sequentially, provided as an embodiment of the present disclosure.

[0036] In the picture:

[0037] 1. Communication layer, 2. Communication line. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0040] The high-frequency components of high-speed signals force the current to concentrate on a very thin layer on the surface of the PCB copper foil, causing the AC resistance of the communication line to increase with the frequency. For example, when the high-speed signal is 10Gbps, the skin depth of the copper foil is only about 1μm, while the thickness of the PCB copper foil is usually 17μm, 35μm, 70μm, etc. Due to the skin effect, the thicker the copper foil of the communication line, the stronger the resistance loss during the transmission of the high-speed signal, which leads to errors in the transmission of the high-speed signal.

[0041] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0042] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0043] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0044] like Figure 1 and Figure 2 As shown, at least one disclosed embodiment provides a high-speed communication gateway system, including: a communication layer 1 disposed in a circuit board, which is electrically connected to a control module; a plurality of communication lines 2 of equal length, width and thickness are evenly spaced on the top and bottom surfaces of the communication layer 1; the control module is configured to obtain the number of communication lines 2 required for transmitting high-speed signals based on the total width of the communication lines 2, i.e., the sum of the widths of each communication line 2, and to determine the signal transmission method based on the required number of communication lines 2 before transmitting the high-speed signals, thereby reducing the copper layer thickness of the communication lines 2 and ensuring the transmission effect of high-speed signals.

[0045] In one optional implementation, the data transmission rate of the high-speed signal ranges from 10 to 25 Gbps (Gigabits per second); the copper cladding thickness corresponding to the communication line 2 is 9 to 17 μm.

[0046] In this embodiment, communication layer 1 is a layer in a multilayer PCB board specifically used for routing communication lines 2, and communication lines 2 are arranged in parallel.

[0047] In this embodiment, the length, width, and thickness of the communication line 2 are the same as the length, width, and thickness of the corresponding copper cladding layer, and the width can be twice the width of a normal line, etc.

[0048] In this embodiment, the thickness of the communication line 2 is reduced, allowing an isolation layer to be set between the communication layer 1 and other layers of the circuit board, ensuring high-speed signal transmission.

[0049] In this embodiment, the skin effect is essentially this: the current of a high-frequency signal concentrates on the surface of the conductor (the skin depth decreases as the frequency increases), leading to a reduction in the effective conductive area of ​​the conductor, an increase in AC resistance, and ultimately additional losses (such as signal attenuation and heat generation). Splitting the original single signal line into multiple parallel communication lines 2 of equal length and width (with a total cross-sectional area equivalent to or larger than a single line) is equivalent to: increasing the total area of ​​the "effective conductive surface" (the surface of each communication line 2 can carry current); the skin effect of each communication line 2 is distributed, the overall AC resistance is reduced, thereby reducing losses in high-speed signal transmission.

[0050] For example, a single 10mil wide communication line 2 has a skin depth of about 2μm at 10Gbps, and its effective conductive area is only "width × skin depth". If it is split into two 5mil wide communication lines 2, the total effective surface area becomes 2 × (5mil × 2μm), which is comparable to the original single line. However, after the current is distributed, the loss will be smaller than that of a single communication line 2 (especially at higher frequencies).

[0051] In this embodiment, for common scenarios of 10-25Gbps high-speed signals and communication line 2 with a total width of 5000-15000mil, the width range of 5000-15000mil covers more than 90% of the PCB communication layer 1 design.

[0052] In one optional implementation, the method by which the control module is configured to obtain the number of communication lines 2 required for transmitting high-speed signals based on the total width of the communication lines 2 includes: the number of communication lines 2 required for transmitting high-speed signals being...

[0053] N 数量 =W 总宽度 / α;

[0054] Where, N 数量 The number of communication lines required to transmit high-speed signals; W 总宽度 α is the total width of all communication lines 2, in mils; α is an empirical coefficient, in mils, which can be obtained based on the historical arrangement of communication lines 2 on communication layer 1.

[0055] In an optional implementation, the control module is further configured to, after obtaining the number of communication lines 2 required for transmitting the high-speed signal, remove the decimal part and retain only the integer part as the actual number of communication lines 2 required for transmitting the high-speed signal if the number of communication lines 2 has a decimal value. An excessive number of communication lines 2 will increase the risk of coupling (crosstalk) between lines; that is, the more communication lines 2 there are, the greater the risk. Therefore, discarding the decimal point avoids increasing the number of communication lines 2.

[0056] In this embodiment, the empirical coefficient α can be, but is not limited to, 150 mil; when W 总宽度 When W = 10000mil: 10000 / 150≈66.6, then take 66 lines; 总宽度 When the value is 5000mil: 5000 / 150≈33.3, then take 33 lines.

[0057] like Figure 3 As shown, in one optional embodiment, the method of transmitting high-speed signals after determining the signal transmission method based on the required number of communication lines 2 includes:

[0058] The control module is configured to, after obtaining the actual number of communication lines 2, if the actual number of communication lines 2 is less than or equal to half of the actual number of communication lines 2, use staggered communication lines 2, that is, in two adjacent columns of communication lines 2, one column uses the top communication line 2 and the other column uses the bottom communication line 2, until the number of communication lines 2 used meets the actual number of communication lines 2.

[0059] In this embodiment, the communication lines 2 on the top and bottom surfaces of the communication layer 1 in the same vertical direction are arranged as a single column.

[0060] In this embodiment, as Figure 3 As shown, if communication layer 1 has 6 columns of communication lines 2, and the actual number of communication lines 2 is 6, the signal transmission lines adopt an alternating vertical arrangement of communication lines 2. That is, high-speed signal transmission is achieved through the communication lines 2 corresponding to the top surface of the first column, the bottom surface of the second column, the top surface of the third column, the bottom surface of the fourth column, the top surface of the fifth column, and the bottom surface of the sixth column. Figure 3 The shaded area corresponds to communication line 2; this can reduce interference between adjacent communication lines 2 when transmitting high-speed signals.

[0061] like Figure 4 As shown, in an optional embodiment, the method of transmitting high-speed signals after determining the signal transmission method according to the required number of communication lines 2 includes: the control module is configured to, after obtaining the actual number of communication lines 2, if the actual number of communication lines 2 is greater than half of the number of communication lines 2, use the communication lines 2 column by column, that is, use each column of communication lines 2 column by column. After both the top and bottom communication lines 2 in a column of communication lines 2 are used, the communication lines 2 in the next column of communication lines 2 are used, until the number of communication lines 2 used meets the actual number of communication lines 2.

[0062] In this embodiment, as Figure 4As shown, if communication layer 1 has 6 columns of communication lines 2, and the actual number of communication lines 2 is 9, the signal transmission lines are used column by column for high-speed signal transmission. That is, high-speed signal transmission is achieved through the communication lines 2 corresponding to the top surface of the first column, the bottom surface of the first column, the top surface of the second column, the bottom surface of the second column, the top surface of the third column, the bottom surface of the third column, the top surface of the fourth column, the bottom surface of the fourth column, and the top surface of the fifth column. Figure 4 The shaded area corresponds to communication line 2.

[0063] In this embodiment, all communication lines 2 are used simultaneously when transmitting high-speed signals.

[0064] In one optional implementation, the control module is configured to transmit the high-speed signal through the communication line 2 corresponding to the transmission mode after determining the signal transmission line, and to transmit the data verification code through a communication line 2 during the transmission process; the communication line 2 for transmitting the data verification code is not among the communication lines 2 corresponding to the transmission mode.

[0065] In this embodiment, the data check code may, but is not limited to, using Cyclic Redundancy Check (CRC).

[0066] In one optional implementation, the control module is configured to, after determining the signal transmission line, divide the high-speed signal data packets corresponding to the high-speed signal according to the actual number of communication lines 2 in the signal transmission line, and then transmit the divided sub-data packets through each of the adopted communication lines 2.

[0067] At least one other disclosed embodiment also provides a communication method using the above-described high-speed communication gateway system, comprising: a control module obtaining the number of communication lines 2 required for transmitting high-speed signals based on the total width of the communication lines 2, and determining the signal transmission method based on the required number of communication lines 2 before transmitting the high-speed signals.

[0068] In one optional implementation, the data transmission rate of the high-speed signal ranges from 10 to 25 Gbps; the copper cladding thickness of the communication line 2 is 9 to 17 μm.

[0069] In summary, this high-speed communication gateway system includes: a communication layer 1 disposed in a circuit board, which is electrically connected to a control module; a plurality of communication lines 2 of equal length, width and thickness are evenly spaced on the top and bottom surfaces of the communication layer 1; the control module is configured to obtain the number of communication lines 2 required for transmitting high-speed signals based on the total width of the communication lines 2, and determine the signal transmission method based on the required number of communication lines 2 before transmitting the high-speed signals, thereby reducing the copper layer thickness of the communication lines 2 and ensuring the transmission effect of high-speed signals.

[0070] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0071] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as a second element, component, region, layer, or segment.

[0072] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0073] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0074] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A high-speed communication gateway system, characterized in that, include: The communication layer (1) is located in the circuit board and is electrically connected to the control module; The communication layer (1) has several communication lines (2) of equal length, width and thickness at equal intervals on its top and bottom surfaces. The control module is configured to obtain the number of communication lines (2) required for transmitting high-speed signals based on the total width of the communication lines (2), and then transmit the high-speed signals after determining the signal transmission method based on the required number of communication lines (2). The method by which the control module is configured to obtain the number of communication lines (2) required for transmitting high-speed signals based on the total width of the communication lines (2) includes: The number of communication lines (2) required to transmit high-speed signals is N 数量 =W 总宽度 / a; Where, N 数量 The number of communication lines (2) required to transmit high-speed signals; W 总宽度 The total width of all communication lines (2); α is an empirical coefficient; The control module is also configured to, after obtaining the number of communication lines (2) required for transmitting high-speed signals, if the number of communication lines (2) has a decimal value, remove the decimal value and keep only the integer value, and use the integer value as the actual number of communication lines (2) required for transmitting high-speed signals. The method of transmitting high-speed signals after determining the signal transmission method based on the required number of communication lines (2) includes: The control module is configured to, after obtaining the actual number of communication lines (2), if the actual number of communication lines (2) is less than or equal to half of the number of communication lines (2), then the signal transmission line adopts an alternating communication line (2), that is, in two adjacent columns of communication lines (2), one column adopts the communication line (2) on the top surface and the other column adopts the communication line (2) on the bottom surface, until the number of communication lines (2) adopted meets the actual number of communication lines (2); The control module is configured to, after obtaining the actual number of communication lines (2), if the actual number of communication lines (2) is greater than half of the number of communication lines (2), then the signal transmission line is the communication line (2) used column by column, that is, each column of communication lines (2) is used column by column until the number of communication lines (2) used meets the actual number of communication lines (2).

2. The high-speed communication gateway system as described in claim 1, characterized in that: The data transmission rate range of the high-speed signal is 10-25Gbps; The copper cladding thickness of the communication line (2) is 9-17 μm.

3. The high-speed communication gateway system as described in claim 1, characterized in that: The control module is configured to transmit the high-speed signal through the communication line (2) corresponding to the transmission method after determining the signal transmission line, and to transmit the data verification code through a communication line (2) during the transmission process. The communication line (2) for transmitting data verification codes is not in the communication line (2) used in the corresponding transmission method.

4. The high-speed communication gateway system as described in claim 1, characterized in that: The control module is configured to, after determining the signal transmission line, divide the high-speed signal data packet corresponding to the high-speed signal according to the number of actual communication lines (2) in the signal transmission line, and then transmit the divided sub-data packets through each of the adopted communication lines (2).

5. A communication method using the high-speed communication gateway system as described in claim 1, characterized in that, include: The control module obtains the number of communication lines (2) required to transmit high-speed signals based on the total width of the communication lines (2), and then determines the signal transmission method based on the required number of communication lines (2) before transmitting the high-speed signals.

6. The communication method as described in claim 5, characterized in that: The data transmission rate range of the high-speed signal is 10-25Gbps; The copper cladding thickness of the communication line (2) is 9-17 μm.

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