Preparation method of chip module shell based on pre-welding riveting and riveting equipment
By riveting the lower cover plate, upper cover plate, and body together to form a prefabricated part, the problem of displacement between the cover plate and the body during the friction welding process is solved, realizing efficient chip module housing production and improving product quality and production efficiency.
Patent Information
- Application Number
- CN202511618039.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-06
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2045-11-06
AI Technical Summary
In the friction welding process of chip module housing, the cover plate and the body are prone to relative displacement, which leads to welding defects. In addition, the mold cost is high, the yield rate is low, and the dimensional accuracy is difficult to control.
By using a pre-welding riveting method, the lower cover plate, upper cover plate, and body are riveted together to form a prefabricated part. Rigid support is provided by a support neutron, and the riveting point is located inside the weld bead, forming a mechanical interlock to ensure that the parts do not undergo relative displacement during friction welding with high energy input.
It improved the yield rate of chip module housings, reduced warping and deformation after welding, improved production efficiency and product consistency, and reduced scrap rate.
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Figure CN121104571A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of die casting processing, in particular to a preparation method of a chip module shell based on pre-welding riveting and a riveting device. BACKGROUND
[0002] As Figure 1 A flat aluminum die-cast cavity shell is shown. The shell can be a chip module shell 100, which has an open side 1001 on the height side, and the chip module is loaded and packaged from the open side. The chip module shell is a very critical but often overlooked component in electronic equipment. It is not only to provide physical protection, but also to ensure the integrity and reliability of the entire module function.
[0003] The shell is small in size, flat in shape, thin in wall, and high in precision requirement. Integrally forming a deep cavity and a complex structure shell will make the mold very complex, the core pulling mechanism difficult, resulting in extremely high mold cost and possibly low yield, not to mention the difficulty in controlling the dimensional accuracy.
[0004] Therefore, the shell is formed by combining the body and the cover plates. The body and the cover plates are both aluminum die castings. The body is a frame structure, and the cover plates are usually provided with heat dissipation protrusions such as fins, ribs or columns on both sides. The body and the cover plates are combined by friction welding.
[0005] Usually, in the friction welding process, the cover plate and the body are in clearance fit, and the cover plate and the body are pressed tightly by the pressing plate of the clamp. However, in the actual friction welding process, the cover plate and the body will still displace relative to each other, and when the welding size is small, the relative displacement between the cover plate and the body will cause major defects in the friction welding process. SUMMARY
[0006] In order to solve the problem of displacement prone to occur in the friction welding process during the preparation of the chip module shell, the present application provides a preparation method of a chip module shell based on pre-welding riveting and a riveting device, so as to improve the yield of the chip module shell.
[0007] The technical solution adopted by the present application to solve the above technical problems is: a preparation method of a chip module shell based on pre-welding riveting, the processing object comprising: a lower cover plate, a body and an upper cover plate; The body is a rectangular frame, and the front and back surfaces of the body are both provided with annular resting edges and annular convex surfaces surrounding the middle rectangular hollow; The edges of the lower cover plate and the upper cover plate are rested on the annular resting edges, and the outer edges and the annular convex surfaces of the body form a welding groove for friction welding; The processing steps comprise: Step one: placing the lower cover plate on the lower pressing plate of the riveting seat; Step two: insert the support neutron into the body; Step three: place the body with the support neutron above the lower cover plate; Step four: place the upper cover plate on the body; Step five: the neutron holding part laterally holds the support neutron; Step six: start the riveting press, the upper and lower pressing plates of the riveting press are closed in place, the riveting needles inside the upper and lower pressing plates are oppositely riveted to the two cover plates and the body, the riveting position is arranged inside the weld bead position, and the lower cover plate, the body and the upper cover plate are combined to form a shell preform; Step seven: remove the shell preform with the support neutron after riveting and remove the support neutron; Step eight: friction weld the shell preform around the weld bead; Step nine: surface machining is performed on the shell preform after friction welding, so that a chip module shell is prepared.
[0008] The preferred technical solution adopted by the present application to solve the above technical problems is that the four corners of the lower cover plate, the body and the upper cover plate are all rounded, and the midpoint of the arc of the riveting point of the four corners has and only has the midpoint of the arc.
[0009] The preferred technical solution adopted by the present application to solve the above technical problems is that the riveting dotting depth range is 0.2±0.1mm.
[0010] The preferred technical solution adopted by the present application to solve the above technical problems is that the riveting dotting interval range is 7.0±0.2mm.
[0011] The preferred technical solution adopted by the present application to solve the above technical problems is a riveting equipment for a chip module shell based on pre-welding riveting, comprising a workbench provided with a sliding rail, a riveting seat, a lower pressing plate, a lifting seat, an upper pressing plate, a support neutron and a neutron holding assembly; The riveting seat is slidingly arranged on the sliding rail and enters or leaves the working area opposite to the lifting seat through horizontal sliding; The lower pressing plate is arranged above the riveting seat, and the upper pressing plate is arranged below the lifting seat and moves up and down to realize closing and opening of the lower pressing plate; The support neutron comprises a support body and an operating end, the support body is used for inserting into the body of the chip module shell to be riveted to support the upper cover plate and the lower cover plate, and the operating end is used for realizing insertion and removal of the support neutron; The neutron holding assembly comprises a first air cylinder and a neutron holding part, the first air cylinder drives the neutron holding part to approach and move away from the side exposed part of the support neutron inserted into the body to realize positioning of the support neutron.
[0012] The preferred technical scheme adopted by the present application to solve the above technical problems is that the upper surface of the lower pressing plate is provided with two positioning convex columns, an angle abutment and a lateral positioning abutment. The lower pressing plate comprises opposite first and second sides, and opposite third and fourth sides; The positioning convex column is located at the first side of the lower pressing plate; The angle abutment is located at the corner of the first side and the third side of the lower pressing plate, and has an inclined abutment surface facing the corner of the first side and the third side; The lateral positioning abutment is located at the fourth side of the lower pressing plate and close to the second side of the lower pressing plate, and has a normal abutment surface facing the third side of the lower pressing plate.
[0013] The preferred technical scheme adopted by the present application to solve the above technical problems is that the support neutron comprises a transverse connecting arm and a vertically extending support arm located at both ends of the transverse connecting arm, the operating end is a convex handle outside the connecting arm, and the neutron pressing part extrudes the outside of the connecting arm.
[0014] The preferred technical scheme adopted by the present application to solve the above technical problems is that a lateral positioning assembly matched with the lateral positioning abutment is further included; the lateral positioning assembly comprises a second air cylinder and a lateral extrusion part, and the lateral extrusion part is driven by the second air cylinder to approach or move away from the lateral positioning abutment to realize abutting positioning of the chip module shell to be riveted and pressed.
[0015] The preferred technical scheme adopted by the present application to solve the above technical problems is that an outer guiding and buffering assembly is arranged between the riveting seat and the lifting seat, and an inner guiding and buffering assembly is arranged between the upper pressing plate and the lower pressing plate. The outer guiding and buffering assembly comprises an annular positioning sleeve located below the lifting seat and a guiding column located on the riveting seat, and the guiding column is arranged on the riveting seat through a damping spring; The inner guiding and buffering assembly comprises a positioning column located below the upper pressing plate, a positioning hole located on the upper pressing plate, and an elastic telescopic column located in the positioning hole.
[0016] The preferred technical scheme adopted by the present application to solve the above technical problems is that the lower pressing plate comprises an outer base plate and an inner embedded body; a hollow part for the inner embedded body to extend into is arranged in the middle of the outer base plate; The upper surface of the inner embedded body and the upper surface of the outer base plate have a difference, forming a recessed part, and the recessed part is used for avoiding the protruding structure on the surface of the lower cover plate; The outer base plate is provided with a longitudinal notch on the side facing the neutron resisting assembly, and the inner insert is provided with a longitudinal groove matching the longitudinal notch, and the longitudinal notch and the longitudinal groove jointly form a channel that can enter the bottom of the chip module shell to be processed.
[0017] Compared with the prior art, the advantages of the present application are: taking the idea of riveting first and then welding, the three separated parts are accurately positioned and mechanically interlocked by riveting in the welding. This makes the parts not displace relative to each other due to thermal stress or equipment vibration when high energy input friction welding is carried out subsequently. The gap between the welds is fixed after riveting, providing stable and uniform process conditions for welding.
[0018] During the riveting process, the support neutron bears the riveting pressure, providing rigid support for the upper and lower cover plates and the body from the inside, solving the problem of easy collapse or deformation of the thin-walled shell when subjected to opposite riveting pressure. The neutron resisting assembly is the key guarantee, which eliminates the fitting gap between the support neutron and the internal cavity of the body by lateral jacking, so that it will not move under the impact of riveting, thereby ensuring the consistency of the depth and shape of each riveting point and the dimensional accuracy of the entire shell intermediate body.
[0019] The riveting points are located inside the weld, which is equivalent to setting multiple rigid constraint points near the heat source. These constraint points effectively suppress the tendency of base material shrinkage and deformation caused by local high temperature during welding. This rigid fixing strategy reduces the warping and deformation after welding. The riveting process is fast, which fixes the three parts into a whole in advance, facilitating the transfer and clamping between welding stations, reducing the alignment adjustment time before welding. At the same time, due to small deformation and low scrap rate, the overall production efficiency and product consistency are significantly improved. BRIEF DESCRIPTION OF DRAWINGS
[0020] The present application will be further described in detail below in conjunction with the drawings and preferred embodiments, but those skilled in the art will appreciate that the drawings are only drawn for the purpose of explaining the preferred embodiments and therefore should not be considered as limiting the scope of the present application. In addition, unless specifically indicated, the drawings only schematically represent the composition or structure of the described objects and can contain exaggerated displays, and the drawings are not necessarily drawn to scale.
[0021] Figure 1 is a schematic view of a chip module shell; Figure 2 is an exploded view of a chip module shell; Figure 3 is a schematic view of a riveting device for a chip module shell based on pre-welding riveting Figure 1 ; Figure 4Schematic diagram of riveting equipment for chip module shell based on pre-welding riveting Figure 2 ; Figure 5 Schematic diagram of riveting equipment for chip module shell based on pre-welding riveting Figure 3 ; Figure 6 Schematic diagram of riveting equipment for chip module shell based on pre-welding riveting Figure 4 ; Figure 7 Schematic diagram of support neutron; Figure 8 Schematic diagram of support neutron and chip module shell cooperation; Figure 9 Schematic diagram of lower pressing plate in riveting equipment; Figure 10 Exploded view of lower pressing plate in riveting equipment.
[0022] Reference signs: Chip module shell 100; opening 1001; lower cover plate 1; body 2; upper cover plate 3; rectangular hollow 4; annular resting edge 5; annular convex surface 6; workbench 8 of slide rail 7; riveting seat 9; lower pressing plate 10; lifting seat 11; upper pressing plate 12; support neutron 13; neutron abutting assembly 14; riveting needle 15; support body 131; operating end 132; connecting arm 31; support arm 32; through hole 310; outer base plate 101; inner embedded body 102; recessed part 17; longitudinal slot 18; longitudinal groove 19; positioning convex column 20; corner abutment 21; lateral positioning abutment 22; oblique abutment surface 211; forward abutment surface 221; lateral positioning assembly 23; second air cylinder 231; lateral extrusion 232; annular positioning sleeve 24; guide column 25 on riveting seat 9; positioning column 26; positioning hole 27. DETAILED DESCRIPTION
[0023] The preferred embodiments of the present application will be described in detail below with reference to the attached drawings. Those skilled in the art will appreciate that the description is merely descriptive, exemplary, and should not be interpreted as limiting the scope of protection of the present application.
[0024] It should be noted that similar reference numerals represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it will not be further defined and explained in subsequent drawings.
[0025] In the description of this invention, it should be noted that the terms "upper," "lower," "front," "rear," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the die-cast parts of this invention are in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Similarly, "first" and "second" are only for ease of understanding and have no other directional meaning, and should not be considered as limitations on this invention.
[0026] This embodiment provides a method for manufacturing a chip module housing 100 based on pre-soldering riveting and a riveting device for the chip module housing based on pre-soldering riveting. The object processed is the chip module housing 100, such as... Figures 1-2 As shown, the chip module housing 100 includes: a lower cover plate 1, a body 2, and an upper cover plate 3.
[0027] Among them, such as Figure 2 As shown, the body 2 is a rectangular frame, with annular resting edges 5 and annular convex surfaces 6 surrounding the central rectangular cutout 4 on both its front and back sides. The edges of the lower cover plate 1 and the upper cover plate 3 rest on the annular resting edges 5, and a weld bead for friction welding is formed between the outer edges and the annular convex surfaces 6 of the body 2.
[0028] This embodiment innovatively employs a riveting pre-fixing process before welding, riveting the cover plate and the body 2 together using a riveting machine to prevent displacement during friction welding and thus prevent defects.
[0029] like Figures 3-6 As shown, a riveting device for a chip module housing based on pre-welding riveting includes a worktable 8 with a slide rail 7, a riveting seat 9, a lower pressure plate 10, a lifting seat 11, an upper pressure plate 12, a supporting neutron 13, and a neutron abutment assembly 14.
[0030] like Figures 3-6 As shown, the movable riveting base 9 is slidably mounted on the slide rail 7, and slides horizontally into or out of the working area opposite to the lifting base 11. The lower pressure plate 10 is positioned above the riveting base 9, and the upper pressure plate 12 is positioned below the lifting base 11, and can move up and down to achieve opening and closing with the lower pressure plate 10. The upper pressure plate 12 and the lower pressure plate 10 face each other, and integrate rivet pins 15 inside; when closed, they rivet the workpiece to be processed.
[0031] like Figure 2 , 3As shown in Figure 4, when the riveting seat 9 slides out of the working area, the robot or operator can place the lower cover plate 1, the body 2, and the upper cover plate 3 to be processed onto the lower pressure plate 10, and insert the support neutron 13 into the body 2. Then, after the riveting seat 9 slides into the working area to complete the riveting, the riveting seat 9 slides out of the working area again, which facilitates loading and unloading and improves the degree of automation.
[0032] like Figures 7-8 As shown, the support neutron 13 includes a support body 131 and an operating end 132. The support body 131 is used to insert into the body 2 of the chip module housing to be riveted to support the upper and lower cover plates. The operating end 132 is used to realize the insertion and removal of the support neutron 13.
[0033] And such Figure 4 As shown, the neutron holding assembly 14 includes a first cylinder 141 and a neutron pressing member 142. The first cylinder 141 drives the neutron pressing member 142 to approach and move away from the exposed side of the supporting neutron 13 inserted into the body 2. Before riveting, it presses the supporting neutron 13 from the side to prevent it from shifting during the riveting process, so as to position the supporting neutron 13.
[0034] Based on this equipment, the processing steps of a method for fabricating a chip module housing based on pre-soldering riveting include: Step 1: Place the lower cover plate 1 on the lower pressure plate 10 of the rivet seat 9.
[0035] Step 2: Insert the support neutron 13 into the body 2.
[0036] Step 3: Place the main body 2 with the supporting neutron 13 on top of the lower cover plate 1.
[0037] Step 4: Place the top cover plate 3 on the main body 2.
[0038] Step 5: Neutron holding member 142 laterally supports neutron 13.
[0039] Step Six: Start the riveting machine. The upper pressure plate 12 and lower pressure plate 10 of the riveting machine are closed in place. The rivet pins inside the upper pressure plate 12 and lower pressure plate 10 act simultaneously against the upper and lower cover plates and the body 2, riveting them together on the inner side around the weld bead position. This step firmly combines the three into a single prefabricated shell component.
[0040] Step 7: Remove the prefabricated shell component with support neutron 13 after riveting, and remove support neutron 13.
[0041] Step 8: Perform friction welding on the precast shell components around the weld bead.
[0042] Step 9: Perform surface machining on the prefabricated housing after friction welding to obtain the final dimensions and surface finish, thereby preparing the chip module housing.
[0043] In this rivet-welding method, the three separated parts are accurately positioned and mechanically interlocked by riveting before welding. This makes the parts not displaceable due to thermal stress or equipment vibration during the subsequent high-energy input friction welding. The rivet gap is fixed after riveting, providing stable and uniform process conditions for welding.
[0044] During the riveting process, the lower cover plate 1 is placed on the lower pressing plate 10 of the riveting equipment. A specially designed support neutron 13 is inserted into the internal cavity of the body 2. Then the body 2 assembly with the support neutron 13 is placed on the lower cover plate 1. Finally, the upper cover plate 3 is covered. The support neutron 13 bears the riveting force during the riveting process, and at this time, the support neutron 13 provides rigid support for the upper and lower cover plates and the body 2 from the inside. The support neutron 13 solves the problem of easy collapse or deformation of the thin-walled shell under the riveting force. The neutron resistance assembly 14 is the key guarantee, which eliminates the gap between the support neutron 13 and the internal cavity of the body 2 by lateral support, so that it will not move under the impact of riveting, thereby ensuring the consistency of the depth and shape of each rivet point and the dimensional accuracy of the entire shell intermediate body.
[0045] The rivet points are located inside the weld, which is equivalent to setting multiple rigid constraint points near the heat source. These constraint points effectively suppress the tendency of base material shrinkage and deformation caused by local high temperature during welding. This rigid fixation strategy reduces the warping and deformation after welding. The riveting process is fast, which pre-fixes the three parts into a whole, facilitating the transfer and clamping between welding stations, and reducing the alignment adjustment time before welding. At the same time, due to small deformation and low scrap rate, the overall production efficiency and product consistency are significantly improved.
[0046] As shown in Figures 1-2 The four corners of the lower cover plate 1, the body 2 and the upper cover plate 3 are all rounded, and preferably in this embodiment, a plurality of rivet points are not provided on each rounded corner, but only one rivet point is provided at the midpoint of the arc that can best balance the stress of the rounded corner. It should be understood that the rounded corner of the rectangular shell is the area where stress deformation is most likely to concentrate. If multiple or improperly positioned rivet points are provided on the rounded corner, new stress concentration sources may be introduced. Precise positioning of the rivet point at the midpoint of the arc is equivalent to applying a constraint on the symmetry axis of the rounded corner, which can most effectively balance the stress from the two adjacent straight edges, allowing the constraint force to be evenly transmitted, thereby maximizing the inhibition of torsional deformation of the rounded corner during welding. This one-point centering strategy achieves optimal rounded corner stability control with the least number of rivet points.
[0047] Preferably, the riveting dot depth range is 0.2±0.1mm. If the depth is too shallow, the mechanical bite formed by riveting is insufficient to effectively fix the parts under the strong impact and thermal stress of subsequent welding, which may lead to riveting failure. If the depth is too deep, it may cause excessive deformation of the material, produce micro-cracks, or excessively thin the upper and lower cover plates, weakening their structural strength, and even produce a protrusion on the back of the riveting point, affecting the flatness of the inner cavity of the shell, and possibly interfering with the installation of internal chips. A depth range of 0.2mm±0.1mm can produce sufficient plastic deformation to achieve a secure connection while ensuring that the part body 2 is not damaged.
[0048] The riveting point spacing is a key parameter that determines the uniformity of the constraint effect. If the spacing is too large, a weak constraint area will be formed between the two riveting points, and the area is prone to warping or fluctuation during welding, which can damage the straightness of the weld. If the spacing is too small, it is over-constrained, which not only reduces production efficiency, but also causes local material hardening and increases the risk of welding deformation due to heat input superposition. In this embodiment, preferably, the riveting dot spacing range is 7.0±0.2mm. This can form a continuous and uniform constraint field on the inside of the entire weld, ensuring that the stability of each point on the welding path is highly consistent.
[0049] In this embodiment, the support neutron 13 plays a key role, so the design of its own structure also becomes a key factor affecting the effect. Preferably, as shown in Figure 7 the support neutron 13 includes a transverse connecting arm 31 and a vertically extending support arm 32 located at both ends of the transverse connecting arm 31, the operating end 132 is a lug on the outside of the connecting arm 31, and the neutron holding member 142 is in extrusion with the outside of the connecting arm 31.
[0050] In general, the inner cavity of the chip module shell is a cavity with the same width as the lateral opening, so as to facilitate the installation of the same width chip. Therefore, in this embodiment, the support arm 32 is arranged on both sides to maximize the support and have a certain width adjustment freedom, avoiding the support neutron 13 from being inserted into the body 2. The connecting arm 31 not only ensures the overall rigidity, but also supports one side of the shell during riveting.
[0051] The lug-type operating end 132 is convenient for the robot or operator to grab and achieve quick insertion and removal. The width of the operating end 132 is less than the width of the connecting arm 31, so the outside of the connecting arm 31 has a surface for the neutron holding member 142 to abut, ensuring uniform and stable holding force.
[0052] Preferably, the device has a pair of neutron abutting assemblies 14 symmetrically arranged on both sides of the lug-type operating end 132, thereby maintaining force balance.
[0053] Further preferably, as shown in Figure 7As shown, the convex handle type operating end 132 is provided with a through hole 310, which facilitates the force exertion of a tool or the installation of a tooling, thereby further facilitating the pick-and-place of the support neutron 13.
[0054] As shown in Figure 3 , 9 , the lower pressing plate 10 comprises an outer base plate 101 and an inner insert 102. The outer base plate 101 is provided with a hollow portion in the middle for the extension of the inner insert 102. The upper surface of the inner insert 102 and the upper surface of the outer base plate 101 have a difference, forming a recessed portion 17. The recessed portion 17 is specially used to avoid the protruding structure that may exist on the back of the lower cover plate 1, ensuring that the lower cover plate 1 can be flatly attached to the positioning surface, without affecting the positioning accuracy.
[0055] As shown in Figures 9-10 , the outer base plate 101 is provided with a longitudinal notch 18 on the side facing the neutron resisting assembly 14, and the inner insert 102 is provided with a longitudinal groove 19 matching the longitudinal notch 18. The longitudinal notch 18 and the longitudinal groove 19 jointly form a channel that can enter the bottom of the chip module shell to be processed, realizing the lossless separation of the workpiece and the equipment, and solving the problem of difficult pick-up caused by structural interference.
[0056] As shown in Figure 3 , the upper surface of the lower pressing plate 10 is provided with two positioning convex columns 20, an angle abutment 21 and a lateral positioning abutment 22. The lower pressing plate 10 comprises opposite first and second sides, and opposite third and fourth sides. The positioning convex columns 20 are located on the first side of the lower pressing plate 10. The angle abutment 21 is located at the corner of the first side and the third side of the lower pressing plate 10, and has an inclined abutment surface 211 facing the corner of the first side and the third side. The lateral positioning abutment 22 is located on the fourth side of the lower pressing plate 10 and close to the second side of the lower pressing plate 10, and has a normal abutment surface 221 facing the third side of the lower pressing plate 10.
[0057] In this embodiment, the lower cover plate 1 is preliminarily positioned by the recessed portion 17, and the two positioning convex columns 20 are high enough to limit the body 2 in one direction of freedom. Then, one corner of the body 2 contacts the inclined abutment surface 211 of the angle abutment 21, and in combination with the limiting action of the positioning convex columns 20, the angle abutment 21 limits the body 2 in another direction of freedom.
[0058] Further, as shown in Figures 3-6As shown, the device also includes a lateral positioning assembly 23 that cooperates with the lateral positioning support 22. The lateral positioning assembly 23 includes a second cylinder 231 and a lateral pressing member 232. The second cylinder 231 drives the lateral pressing member 232 to move closer to and further away from the lateral positioning support 22 to achieve abutment positioning of the chip module housing to be riveted. By applying a thrust to the lateral positioning support 22 on the opposite side, the workpiece is pressed tightly against the corner support 21, thereby eliminating the translational degree of freedom in this direction, and simultaneously eliminating the rotational degree of freedom. Combined with the structural constraints imposed by the neutron support assembly 14, the entire workpiece's degree of freedom is restricted during the riveting process, resulting in stronger support tolerance and more reliable positioning.
[0059] In this embodiment, the lateral positioning component 23 and the neutron holding component 14 are driven by cylinders to automatically perform positioning and clamping actions after the workpiece is placed, ensuring that the force and position of each positioning are completely consistent, avoiding the randomness of manual placement, greatly improving the consistency of production cycle and positioning accuracy, and is a key link in realizing automated production.
[0060] like Figures 3-6 As shown, preferably, an outer guide buffer assembly is provided between the rivet seat 9 and the lifting seat 11, and an inner guide buffer assembly is provided between the upper pressure plate 12 and the lower pressure plate 10.
[0061] The outer guide buffer assembly includes an annular positioning sleeve 24 located below the lifting seat 11 and a guide post 25 located on the riveting seat 9. The guide post 25 is mounted on the riveting seat 9 by a damping spring. The inner guide buffer assembly includes a positioning post 26 located below the upper pressure plate 12, a positioning hole 27 located on the upper pressure plate 12, and an elastic telescopic post located in the positioning hole.
[0062] The outer guide assembly begins contact and guidance in the initial stage of the pressure plate closure. Its damping spring absorbs the enormous closing impact force, preventing damage to the equipment from hard collisions, while ensuring macroscopic alignment of the upper and lower die bases during large strokes. The inner guide assembly functions in the final stage before the rivet pins contact the workpiece, providing fine guidance to ensure precise alignment of the upper and lower rivet pins. The elastic telescopic column within it acts as a final buffer and compensation, accommodating minute thickness tolerances of the parts and preventing rivet pin wear, breakage, or abnormal workpiece indentation caused by misalignment or over-alignment. These two systems together ensure a smooth, precise, and reliable riveting process.
[0063] This article uses specific examples to describe the preparation method and riveting equipment of a chip module housing based on pre-soldering riveting provided by the present invention. The above description of the embodiments is only for the purpose of helping to understand the present invention and its core ideas. It should be noted that for those skilled in the art, several improvements and modifications can be made to the present invention without departing from the principle of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.
Claims
1. A method for preparing a chip module housing based on pre-welding riveting, characterized in that: the processing object comprises a lower cover plate, a body and an upper cover plate; the body is a rectangular frame, and the two square surfaces are provided with a ring-shaped resting along and a ring-shaped convex surface around the middle rectangular frame; the edges of the lower cover plate and the upper cover plate are rested on the ring-shaped resting along, and the outer edge and the ring-shaped convex surface of the body form a weld for friction welding; the processing steps comprise: Step 1: placing the lower cover plate on the lower pressing plate of the riveting seat; Step 2: inserting the support nucleus into the body; Step 3: placing the body with the support nucleus above the lower cover plate; Step 4: placing the upper cover plate on the body; Step 5: laterally supporting the support nucleus with the nucleus pressing member; Step 6: starting the riveting machine, and closing the upper pressing plate and the lower pressing plate in place, the riveting needle inside the upper pressing plate and the lower pressing plate rivets the two cover plates and the body from both sides, the riveting position is arranged inside the weld position, and the lower cover plate, the body and the upper cover plate are combined to form a housing preform; Step 7: taking down the housing preform with the support nucleus after riveting, and removing the support nucleus; Step 8: friction welding the housing preform around the weld; Step 9: surface machining the housing preform after friction welding, thereby preparing a chip module housing. 2.The method for preparing a chip module housing based on pre-welding riveting according to claim 1, characterized in that: the four corners of the lower cover plate, the body and the upper cover plate are all round corners, and the riveting points of the four corners have and only have the midpoints of the arcs. 3.The method for preparing a chip module housing based on pre-welding riveting according to claim 1, characterized in that: the riveting dotting depth range is 0.2±0.1mm. 4.The method for preparing a chip module housing based on pre-welding riveting according to claim 1, characterized in that: the riveting dotting interval range is 7.0±0.2mm. 5.A riveting equipment for a chip module housing based on pre-welding riveting, characterized in that: it comprises a workbench provided with a slide rail, a riveting seat, a lower pressing plate, a lifting seat, an upper pressing plate, a support nucleus and a nucleus resisting assembly; the riveting seat is slidably arranged on the slide rail and enters or leaves the working area opposite to the lifting seat by horizontal sliding; the lower pressing plate is arranged above the riveting seat, and the upper pressing plate is arranged below the lifting seat and moves up and down to realize closing and opening with the lower pressing plate; the support nucleus comprises a support body and an operating end, the support body is used for inserting into the body of the chip module housing to be riveted to support the upper cover plate and the lower cover plate, and the operating end is used for realizing insertion and removal of the support nucleus; the nucleus resisting assembly comprises a first air cylinder and a nucleus pressing member, and the first air cylinder drives the nucleus pressing member to approach or move away from the side exposed part of the support nucleus inserted into the body to realize positioning of the support nucleus. 6.The riveting equipment for a chip module housing based on pre-welding riveting according to claim 5, characterized in that: the upper surface of the lower pressing plate is provided with two positioning convex columns, an angle abutment and a lateral positioning abutment. The lower pressing plate comprises opposite first and second sides, and opposite third and fourth sides; The positioning protrusion is located on the first side of the lower pressing plate; The corner abutment is located at the corner of the first and third sides of the lower pressing plate, and has an oblique abutment surface facing the corner of the first and third sides; The lateral positioning abutment is located on the fourth side of the lower pressing plate and close to the second side of the lower pressing plate, and has a normal abutment surface facing the third side of the lower pressing plate.
7. The riveting device for the chip module shell based on pre-welding riveting according to claim 5, characterized in that: The support sub comprises a transverse connecting arm and vertical extension support arms located at both ends of the transverse connecting arm, the operating end is a protruding handle outside the connecting arm, and the sub-pressing member extrudes the outside of the connecting arm.
8. The riveting device for the chip module shell based on pre-welding riveting according to claim 6, characterized in that: The lateral positioning assembly matched with the lateral positioning abutment is further included; the lateral positioning assembly comprises a second air cylinder and a lateral extruding member, and the lateral extruding member is driven by the second air cylinder to approach and move away from the lateral positioning abutment to realize abutting positioning of the chip module shell to be riveted.
9. The riveting device for the chip module shell based on pre-welding riveting according to claim 5, characterized in that: The outer guiding and buffering assembly is arranged between the riveting seat and the lifting seat, and the inner guiding and buffering assembly is arranged between the upper pressing plate and the lower pressing plate; The outer guiding and buffering assembly comprises a ring-shaped positioning sleeve located below the lifting seat and a guiding column located on the riveting seat, and the guiding column is arranged on the riveting seat through a damping spring; The inner guiding and buffering assembly comprises a positioning column located below the upper pressing plate, a positioning hole located on the upper pressing plate, and an elastic telescopic column located in the positioning hole.
10. The riveting device for the chip module shell based on pre-welding riveting according to claim 5, characterized in that: The lower pressing plate comprises an outer base plate and an inner embedded body; the middle of the outer base plate is provided with a hollow part for the inner embedded body to extend into; The upper surface of the inner embedded body and the upper surface of the outer base plate have a difference to form a recessed part, and the recessed part is used for avoiding the protruding structure on the surface of the lower cover plate; The outer base plate is provided with a longitudinal notch on the side facing the sub-pressing assembly, the inner embedded body is provided with a longitudinal groove matched with the longitudinal notch, and the longitudinal notch and the longitudinal groove jointly form a channel that can enter the bottom of the chip module shell to be processed.
Citation Information
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