Imprint template preparation system and method, template and stepping nano-imprinting method

Abstract

The invention discloses an imprint template preparation system and method, a template and a stepping nano-imprint method, and belongs to the technical field of imprint template preparation. The imprint template preparation system comprises a projection structure which comprises a spatial light modulator and is used for generating a pattern to be projected; the imaging adjusting structure comprises an optical element group and is used for reducing the to-be-projected pattern, and the light incident plane of the imaging adjusting structure is located at the focusing plane of the projection structure; the template substrate is arranged on the workpiece table and is positioned at the focusing plane of the imaging adjusting structure; and the splicing control unit is used for controlling the projection structure and the imaging adjustment structure to synchronously perform horizontal position movement relative to the template substrate. According to the imprinting template preparation system and method based on the spatial light modulator, rapid and low-cost manufacturing of a large-breadth nano imprinting template can be achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of imprint template preparation, in particular to an imprint template preparation system and method based on a spatial light modulator, a template using the same, and a step-by-step nanoimprint method. BACKGROUND

[0002] As an important forming tool in the imprint process, the quartz template undertakes the main task of building a small line width pattern, in which a convex platform is obtained by etching. The existing nanoimprint template manufacturing mainly uses electron beam lithography (EBL) technology. The photoresist on the quartz template is bombarded by electron beam lithography technology, so that the photoresist carries the required pattern. Thereafter, a dry etching method is used to etch the quartz template, so as to carry the pattern on the photoresist to the quartz template, thereby realizing the manufacturing of a very small line width pattern template.

[0003] The electron beam lithography uses an electron beam to expose the template glue to make a plate, which can build a nanoimprint quartz template with a size of 5nm. Its essence is to use an electron beam to scan the photoresist on the quartz surface, degrade the evenly coated photoresist at a specific pattern position, and then use a dry etching method to etch the pattern into the quartz template, thereby realizing the construction of a specific pattern and line width. However, the electron beam lithography technology needs professional equipment to complete etching, and in addition, the quartz template is not conductive, and a metal layer needs to be arranged on the quartz template or the photoresist surface. Not only is the processing cost very high, but also the processing difficulty is extremely great. Moreover, since an electron is used for exposure, the equipment forming rate is very low, and the speed of completing a large area template is very slow, which cannot well realize the iteration needs of the experimental template.

[0004] Therefore, it is urgent to develop a new imprint template preparation method to solve the current defects and deficiencies. SUMMARY

[0005] The present application aims to at least partly solve one of the technical problems in the related art. To this end, the present application provides an imprint template preparation system and method based on a spatial light modulator.

[0006] To achieve the above-mentioned purpose, in a first aspect, the present application provides an imprint template preparation system based on a spatial light modulator, comprising: a projection structure comprising a spatial light modulator, configured to generate a to-be-projected pattern;

[0007] an imaging adjustment structure comprising an optical element group, configured to reduce the to-be-projected pattern, wherein an entrance plane of the imaging adjustment structure is located at a focal plane of the projection structure;

[0008] A template substrate is placed on the workpiece stage. The template substrate is located at the focal plane of the imaging adjustment structure. It can form a mask pattern corresponding to the pattern to be projected on the photosensitive compound layer coated on it by light adjusted by the imaging adjustment structure.

[0009] Preferably, it also includes a splicing control unit for controlling the projection structure and the imaging adjustment structure to move horizontally relative to the template substrate synchronously.

[0010] Preferably, the template substrate is a quartz template or a transparent polymer substrate.

[0011] Preferably, the projection structure employs a DLP optical engine; the optical element group includes a lens group composed of several concave lenses and / or convex lenses, with an image reduction ratio of 50-1000 times.

[0012] This spatial light modulator-based imprint template fabrication system, by utilizing the combination of an imaging adjustment structure and a workpiece stage, can prepare large-format, high-precision quartz templates in a short time for semiconductor nanoimprint template fabrication.

[0013] Secondly, this application provides a method for preparing an imprint template based on a spatial light modulator, comprising the following steps:

[0014] A photosensitive compound layer is formed on a template substrate;

[0015] The template substrate is placed in an imprint template fabrication system based on a spatial light modulator; wherein, the imprint template fabrication system based on a spatial light modulator includes a projection structure and an imaging adjustment structure; the projection structure includes a spatial light modulator for generating a pattern to be projected; the imaging adjustment structure includes an optical element group for reducing the size of the pattern to be projected;

[0016] The positions of the projection structure and the imaging adjustment structure are adjusted so that the incident plane of the imaging adjustment structure is located at the focal plane of the projection structure, and the template substrate is located at the focal plane of the imaging adjustment structure.

[0017] The photosensitive compound layer coated on the template substrate is exposed using the projection pattern generated by the projection structure.

[0018] Preferably, the preparation method further includes: after the processing of the current corresponding area is completed, adjusting the position of the pattern projection system so that it moves to the next working position in a preset order, and performing the step of exposing the photosensitive compound layer coated on the template substrate (2) with the pattern to be projected generated by the projection structure (4) until a complete preset imprint pattern is formed on the template substrate.

[0019] Preferably, adjusting the position of the pattern projection system to move it to the next working position in a preset sequence includes:

[0020] An alignment mark is set at the corresponding area projected at the next working position, and the position of the pattern projection system is adjusted until the distance difference between the corresponding pattern projection and the alignment mark is less than a preset error value.

[0021] Preferably, the alignment mark is disposed at the four edges of the corresponding area, and the shape of the alignment mark matches the outline shape of the corresponding area.

[0022] Preferably, the step of projecting a corresponding pattern onto a template substrate coated with imprinting adhesive using a pattern projection system includes:

[0023] Receives a complete preset embossing pattern input from a computer;

[0024] Based on the scaling ratio of the optical element group, the complete preset embossed pattern is divided into several segmented patterns.

[0025] The step of adjusting the position of the pattern projection system to move it to the next working position in a preset order includes moving it to the working position corresponding to the next segmented pattern in a preset order.

[0026] Preferably, moving it to the working position corresponding to the next segmentation pattern in a preset order includes:

[0027] Calculate the geometric centers of several segmented patterns of the complete preset embossed pattern presented on the template substrate;

[0028] The geometric centers of the aforementioned segmented patterns are set as the adjustment centers for different working positions of the pattern projection system.

[0029] The pattern projection system is controlled to move horizontally relative to the template substrate until the center of the pattern projection system coincides with the working position adjustment center.

[0030] Calculate whether the distance difference between the corresponding pattern projection and the alignment mark is less than a preset error value. If yes, the working position adjustment is complete. If no, continue to adjust the position of the pattern projection system until the distance difference between the corresponding pattern projection and the alignment mark is less than the preset error value.

[0031] This method for preparing imprinted templates based on spatial light modulators can adjust the pattern forming precision to the nanometer level through the cooperation of projection structures and optical element groups, which can greatly improve the production efficiency and cost of nanoimprinted templates.

[0032] Thirdly, this application provides a nanoimprint template prepared based on the above-described imprint template preparation method. The total area of ​​the nanoimprint template is 10μm×8μm-200μm×160μm, and the forming accuracy is 20nm-400nm. Using this large-format, high-precision quartz template for nanoimprinting can significantly improve the imprinting efficiency.

[0033] Fourthly, this application provides a step-by-step nanoimprinting method using the above-described nanoimprint template, the nanoimprinting method comprising:

[0034] The wafer to be imprinted is transferred to the adhesive spraying station, where a patterned adhesive spraying process is performed on the imprinting area of ​​the wafer.

[0035] After the adhesive spraying is completed, the wafer enters the imprinting station. The imprinting head moves downward so that the nanoimprinting adhesive fills the pattern gaps on the nanoimprinting template made by the above scheme, so that the gap between the wafer to be imprinted and the nanoimprinting template reaches the required residual layer and is maintained.

[0036] Expose the nano-imprint adhesive to ultraviolet light for a certain period of time to cure it;

[0037] The imprint head is lifted, and the nanoimprint template is separated from the cured nanoimprint adhesive, so that the patterned cured nanoimprint adhesive is formed on the surface of the wafer to be imprinted.

[0038] The workpiece stage moves to the next station for imprinting, and the above steps are repeated until the pattern is imprinted and cured on the entire wafer surface.

[0039] The step-by-step nanoimprinting method using the large-format, high-precision quartz template described above can significantly improve imprinting efficiency.

[0040] Other features and advantages of this application will be set forth in the following description and will be apparent in part from the description, or may be realized by practice of this application. The purpose and other advantages of this application can be realized and obtained by means of the structures particularly pointed out in the written description, claims and drawings. Attached Figure Description

[0041] Figure 1 A schematic diagram of the imprint template fabrication system based on a spatial light modulator in this application, omitting the imaging adjustment structure;

[0042] Figure 2 This is a schematic diagram of the imprint template fabrication system based on a spatial light modulator according to this application;

[0043] Figure 3 This is a schematic flowchart of the imprint template preparation method based on a spatial light modulator according to this application;

[0044] Figure 4 This is a schematic diagram of the pattern segmentation and alignment marking steps in the imprint template preparation method based on spatial light modulator of this application;

[0045] Figure 5 This is a schematic diagram of the step-by-step nanoimprinting method based on optical element groups according to this application.

[0046] In the picture:

[0047] 1. Workpiece stage; 2. Template substrate;

[0048] 3. Imaging adjustment structure; 4. Projection structure;

[0049] 5. Projected pattern one; 6. Upper surface of the template substrate;

[0050] 7. Divide the pattern; 8. Align the markers. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0052] In order to improve the production efficiency of large-format nanoimprint templates and reduce the preparation cost, the inventors have conducted in-depth research on nanoimprint plate making technology and proposed an imprint template preparation system and method based on a spatial light modulator.

[0053] Specifically, the design concept of the solution proposed in this application is as follows:

[0054] like Figure 1 As shown, an imprint template fabrication system based on a spatial light modulator includes:

[0055] The projection structure 4 includes a spatial light modulator for generating a pattern to be projected; in this embodiment, the projection structure 4 employs a DLP optical engine.

[0056] A template substrate 2 is disposed on the workpiece stage 1. The template substrate 2 is located at the focusing plane of the imaging adjustment structure 3 and can form a corresponding mask pattern on the photosensitive compound layer coated thereon by the light emitted by the imaging adjustment structure 3.

[0057] The above structure enables the projection of the pattern onto the template substrate 2. However, since the mirror size of the spatial light modulator (DMD chip) is fixed, the final projection pixel accuracy is determined by the imaging system. For example, the highest-precision DLP currently available uses a 3240*2160 resolution DMD chip and a 1:1 imaging system, with a final projection accuracy of approximately 20μm and a projection area of ​​approximately 1cm*0.8cm. The final imaging result is as follows.Figure 1 The right-middle figure shows a scaled schematic diagram of the projection pattern 5 formed on the upper surface 6 of the template substrate. It can be seen that the final imaging situation cannot meet the forming requirements of the entire quartz template.

[0058] Therefore, this application employs a unique imaging reflection system called a spatial light modulator. Although it can modulate the input light according to the pattern input by the computer to obtain reflected light with the desired image projected onto the focusing plane, the pattern projection accuracy cannot meet the needs of existing semiconductor-related products without adding an imaging adjustment structure 3 to reduce the size of the pattern to be projected.

[0059] Therefore, this solution adds an imaging adjustment structure 3 between the projection structure 4 and the template substrate 2 to reduce the size of the pattern to be projected, so that the pattern projection accuracy can meet the needs of existing semiconductor-related products.

[0060] Specifically, such as Figure 2 As shown, the first embodiment of this application provides an imprint template fabrication system based on a spatial light modulator, comprising:

[0061] The projection structure 4 includes a spatial light modulator for generating a pattern to be projected; in this embodiment, the projection structure 4 employs a DLP optical engine.

[0062] The imaging adjustment structure 3 includes an optical element group for reducing the size of the pattern to be projected, wherein the incident plane of the imaging adjustment structure 3 is located at the focusing plane of the projection structure 4;

[0063] A template substrate 2 is disposed on the workpiece stage 1, located at the focusing plane of the imaging adjustment structure 3. The template substrate 2 allows light emitted from the imaging adjustment structure 3 to form a corresponding mask pattern on a photosensitive compound layer coated thereon. In this embodiment, the template substrate 2 is a quartz template; however, other transparent polymer substrates, such as PMMA, can be selected according to actual needs.

[0064] DLP technology is a mature manufacturing method used in the field of additive manufacturing. This embodiment utilizes a DLP optical engine combined with a spatial light modulator (DMD) to achieve pattern forming precision down to the nanometer level. The DMD chip has a unique imaging reflection system that modulates the input light according to a preset imprint pattern input from a computer, obtaining reflected light with the desired image projected onto a focusing plane. Ultraviolet light of the corresponding wavelength is modulated and then irradiates the material in the corresponding area, causing it to solidify, thereby obtaining the desired pattern. In this scheme, the incident light plane of the imaging adjustment structure 3 is placed at the focusing plane of the DLP optical engine, while the upper plane of the quartz template is placed at the focusing plane of the imaging adjustment structure 3. This further reduces the size of the pattern projected by the DLP optical engine, resulting in a smaller projected pattern.

[0065] This method eliminates the traditional complex electronic exposure process and does not require the placement of a metal layer on the quartz template surface, greatly improving the preparation efficiency of the imprint template. In addition, it does not require complex processes, thus saving costs significantly compared to electronic exposure.

[0066] If the imaging adjustment structure 3 uses an optical element group with a 1:100 scaling factor, the original 1cm*0.8cm area becomes 100μm*80μm, with a forming accuracy of 200nm. This nanoscale precision allows it to be used to create templates for semiconductor devices with less stringent precision requirements. It's worth noting that the scaling factor of the imaging adjustment structure 3 is achieved through the combination of optical elements. Based on the corresponding optical design, a 1:1000 scaling factor is theoretically achievable, resulting in a total area of ​​10μm*8μm and a forming accuracy of 20nm, thus enabling the fabrication of high-precision semiconductor device templates. By utilizing the imaging adjustment structure 3 and the workpiece stage 1, large-format, high-precision quartz templates can be prepared in a short time for semiconductor nanoimprint template fabrication.

[0067] However, it should be noted that as the molding precision improves, another problem with this method is that the proportional reduction of the molding area cannot meet the molding requirements of the entire quartz template. Therefore, this application provides a second embodiment, which uses the workpiece stage 1 of a nanoimprint or photolithography system to expand the pattern area. Unlike the first embodiment, the second embodiment also includes a splicing control unit for controlling the projection structure 4 and the imaging adjustment structure 3 to move horizontally relative to the template substrate 2 synchronously.

[0068] The third embodiment provided in this application, such as Figure 3 The diagram shown is a flowchart illustrating a method for preparing an imprint template based on a spatial light modulator.

[0069] A method for preparing an imprint template based on a spatial light modulator includes:

[0070] S10. A photosensitive compound layer is formed on the template substrate 2;

[0071] S11. The template substrate 2 is placed in an imprint template fabrication system based on a spatial light modulator; wherein, the imprint template fabrication system based on a spatial light modulator includes a projection structure 4 and an imaging adjustment structure 3; the projection structure 4 includes a spatial light modulator for generating a pattern to be projected; the imaging adjustment structure 3 includes an optical element group for reducing the size of the pattern to be projected.

[0072] S12. Adjust the positions of the projection structure 4 and the imaging adjustment structure 3 so that the incident plane of the imaging adjustment structure 3 is located at the focal plane of the projection structure 4, and the template substrate 2 is located at the focal plane of the imaging adjustment structure 3.

[0073] S13. The photosensitive compound layer coated on the template substrate 2 is exposed using the projection pattern generated by the projection structure 4.

[0074] S14. After the processing of the current corresponding area is completed, the position of the pattern projection system is adjusted so that it moves to the next working position in a preset order, and the step of exposing the photosensitive compound layer coated on the template substrate 2 with the pattern to be projected generated by the projection structure 4 is executed until a complete preset imprint pattern is formed on the template substrate 2.

[0075] Specifically, adjusting the position of the pattern projection system to move it to the next working position according to a preset sequence includes:

[0076] S130. Set an alignment mark at the corresponding area projected at the next working position, and adjust the position of the pattern projection system until the distance difference between the corresponding pattern projection and the alignment mark is less than a preset error value.

[0077] like Figure 4 As shown, specifically, in this embodiment, the process of projecting a corresponding pattern onto the template substrate 2 coated with imprinting adhesive using a pattern projection system includes:

[0078] S120, Receive a complete preset embossing pattern input from a computer;

[0079] S121. Based on the scaling ratio of the optical element group, the complete preset embossed pattern is divided into several segmented patterns 7.

[0080] The adjustment of the position of the pattern projection system to move it to the next working position in a preset order includes moving it to the working position corresponding to the next segmented pattern 7 in a preset order.

[0081] Furthermore, the aforementioned process of moving it to the working position corresponding to the next segmentation pattern 7 in a preset order includes:

[0082] S1300, Calculate the geometric center of a plurality of segmented patterns 7 of the complete preset embossed pattern presented on the template substrate 2;

[0083] S1301. Set the geometric center of the plurality of segmented patterns 7 as the adjustment center of different working positions of the pattern projection system.

[0084] S1302. Control the pattern projection system to move horizontally relative to the template substrate 2 until the center of the pattern projection system coincides with the working position adjustment center;

[0085] S1303. Calculate whether the distance difference between the corresponding pattern projection and the alignment mark is less than the preset error value. If yes, the working position adjustment is complete. If no, continue to adjust the position of the pattern projection system until the distance difference between the corresponding pattern projection and the alignment mark is less than the preset error value.

[0086] This method for preparing imprinted templates based on spatial light modulators can adjust the pattern forming precision to the nanometer level through the cooperation of projection structure 4 and optical element group, which can greatly improve the production efficiency and cost of nanoimprinted templates.

[0087] like Figure 4 As shown, in this embodiment, preferably, the alignment mark is disposed at the four edges of the corresponding area, and the shape of the alignment mark matches the contour shape of the corresponding area.

[0088] The fourth embodiment provided in this application discloses a nanoimprint template prepared based on the above-described imprint template preparation method. The total area of ​​the nanoimprint template is 10μm×8μm-200μm×160μm, and the forming accuracy is 20-400nm. In this embodiment, the design size of the nanoimprint template is 33mm*26mm, while the forming area of ​​the original forming DLP equipment is 10mm*8mm, and its forming accuracy is 20μm. Various optical elements can be used here, such as a microscope lens with an observation field of view of 10mm*8mm, formed by multiple lens combinations, with magnifications of 50, 100, 400, and 1000x. The original objective lens is used as the eyepiece, and the eyepiece is used as the objective lens for reverse reduction. The DLP image is placed at the objective lens position and output from the eyepiece side, thus forming new patterns with total areas of 200μm*160μm, 100μm*80μm, 25μm*20μm, and 10μm*8μm at the eyepiece imaging distance, respectively. The forming accuracy reaches 400nm, 200nm, 50nm, and 20nm, respectively. This photomask is used to continuously expose and form the template adhesive in multiple areas, dividing the area to be cured into multiple sub-regions based on the imaging range, such as... Figure 4 As shown, by utilizing the alignment system and workpiece stage of the nanoimprint system itself, along with alignment marks designed near the imaging range, high-precision, large-area forming of the entire image is achieved through multiple stitching operations. Combined with the precise positioning of the displacement stage, a template of the required size is created. Using the large-format, high-precision quartz template in this embodiment for nanoimprinting can significantly improve imprinting efficiency.

[0089] The fifth embodiment provided in this application is a step-by-step nanoimprinting method using the above-described nanoimprint template. Figure 5 This is a schematic flowchart of the step-by-step nanoimprinting method based on optical element groups according to this application, as shown below. Figure 5 As shown, the nanoimprinting method includes:

[0090] S20. Transfer the wafer to be imprinted to the glue spraying station and perform a patterned glue spraying process on the imprinting area of ​​the wafer.

[0091] S21. After the adhesive spraying is completed, the wafer enters the imprinting station. The imprinting head moves downward so that the nanoimprinting adhesive fills the pattern gaps on the nanoimprinting template made by the above scheme, so that the gap between the wafer to be imprinted and the nanoimprinting template reaches the required residual layer and is maintained.

[0092] S22. Expose the nano-imprint adhesive to ultraviolet light for a certain period of time to cure it;

[0093] S23. The imprint head is lifted, and the nanoimprint template is separated from the cured nanoimprint adhesive, so that the patterned cured nanoimprint adhesive is formed on the surface of the wafer to be imprinted.

[0094] S24. Workpiece stage 1 moves to the next station for imprinting. Repeat the above steps until the pattern imprinting and curing are achieved on the entire wafer surface.

[0095] The step-by-step nanoimprinting method using the large-format, high-precision quartz template described above can significantly improve imprinting efficiency.

[0096] In the above embodiments of this application, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0097] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present application should be included within the scope of protection of the present application.

Claims

1. A system for preparing an imprint template based on a spatial light modulator, characterized in that, include: The projection structure (4) includes a spatial light modulator for generating a pattern to be projected; An imaging adjustment structure (3) includes an optical element group for reducing the size of the pattern to be projected, wherein the incident plane of the imaging adjustment structure (3) is located at the focusing plane of the projection structure (4); A template substrate (2) is set on the workpiece stage (1). The template substrate (2) is located at the focal plane of the imaging adjustment structure (3). It can form a mask pattern corresponding to the pattern to be projected on the photosensitive compound layer coated on it by the light adjusted by the imaging adjustment structure (3).

2. The embossing template preparation system according to claim 1, characterized in that, It also includes a splicing control unit for controlling the projection structure (4) and the imaging adjustment structure (3) to move horizontally relative to the template substrate (2) synchronously.

3. The embossing template preparation system according to claim 1, characterized in that, The template substrate (2) is a quartz template or a transparent polymer substrate.

4. The embossing template preparation system according to any one of claims 1-3, characterized in that, The projection structure (4) adopts a DLP optical engine; the optical element group includes a lens group composed of several concave lenses and / or convex lenses, and the image reduction ratio is 50-1000 times.

5. A method for preparing an imprint template based on a spatial light modulator, characterized in that, Includes the following steps: A photosensitive compound layer is formed on the template substrate (2); The template substrate (2) is placed in an imprint template fabrication system based on a spatial light modulator; wherein the imprint template fabrication system based on a spatial light modulator includes a projection structure (4) and an imaging adjustment structure (3); the projection structure (4) includes a spatial light modulator for generating a pattern to be projected; the imaging adjustment structure (3) includes an optical element group for reducing the size of the pattern to be projected. The positions of the projection structure (4) and the imaging adjustment structure (3) are adjusted so that the incident plane of the imaging adjustment structure (3) is located at the focal plane of the projection structure (4), and the template substrate (2) is located at the focal plane of the imaging adjustment structure (3); The photosensitive compound layer coated on the template substrate (2) is exposed using the projection structure (4) to generate the projection pattern.

6. The method for preparing an embossing template according to claim 5, characterized in that, The preparation method further includes: After the processing of the current corresponding area is completed, the position of the pattern projection system is adjusted so that it moves to the next working position in a preset order, and the step of exposing the photosensitive compound layer coated on the template substrate (2) with the pattern to be projected generated by the projection structure (4) is performed until a complete preset imprint pattern is formed on the template substrate (2).

7. The method for preparing an embossing template according to claim 6, characterized in that, The adjustment of the position of the pattern projection system to move it to the next working position in a preset sequence includes: An alignment mark is set at the corresponding area projected at the next working position, and the position of the pattern projection system is adjusted until the distance difference between the corresponding pattern projection and the alignment mark is less than a preset error value.

8. The method for preparing an embossing template according to claim 7, characterized in that, The alignment mark is located at the four edges of the corresponding area, and the shape of the alignment mark matches the outline shape of the corresponding area.

9. The method for preparing an embossing template according to claim 6, characterized in that, The process of projecting a corresponding pattern onto the template substrate (2) coated with imprinting adhesive using a pattern projection system includes: Receives a complete preset embossing pattern input from a computer; Based on the scaling ratio of the optical element group, the complete preset embossed pattern is divided into several segmented patterns (7); The adjustment of the position of the pattern projection system to move it to the next working position in a preset order includes moving it to the working position corresponding to the next segmented pattern (7) in a preset order.

10. The method for preparing an embossing template according to claim 9, characterized in that, The step of moving the device to the working position corresponding to the next segmentation pattern (7) in a preset order includes: Calculate the geometric center of several segmented patterns (7) of the complete preset embossed pattern presented on the template substrate (2); The geometric center of the plurality of segmented patterns (7) is set as the adjustment center of different working positions of the pattern projection system; Control the pattern projection system to move horizontally relative to the template substrate (2) until the center of the pattern projection system coincides with the working position adjustment center; Calculate whether the distance difference between the corresponding pattern projection and the alignment mark is less than the preset error value. If yes, the working position adjustment is complete. If no, continue to adjust the position of the pattern projection system until the distance difference between the corresponding pattern projection and the alignment mark is less than the preset error value.

11. A nanoimprint template prepared according to any one of the imprint template preparation methods based on a spatial light modulator as described in any one of claims 5-10, characterized in that, The total area of ​​the nanoimprint template is 10μm×8μm-200μm×160μm, and the forming accuracy is 20-400nm.

12. A step-by-step nanoimprinting method, characterized in that, Includes the following steps: The wafer to be imprinted is transferred to the adhesive spraying station, where a patterned adhesive spraying process is performed on the imprinting area of ​​the wafer. After the adhesive spraying is completed, the wafer enters the imprinting station, and the imprinting head moves downward so that the nanoimprinting adhesive fills the pattern gaps in the nanoimprinting template as described in claim 11, so that the gap between the wafer to be imprinted and the nanoimprinting template reaches the required residual layer and is maintained. Expose the nano-imprint adhesive to ultraviolet light for a certain period of time to cure it; The imprint head is lifted, and the nanoimprint template is separated from the cured nanoimprint adhesive, so that the patterned cured nanoimprint adhesive is formed on the surface of the wafer to be imprinted. The workpiece stage (1) is moved to the next station for imprinting. The above steps are repeated until the pattern imprinting and curing are achieved on the entire wafer surface.

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