Display device and electronic apparatus

Abstract

The invention provides a display device and electronic equipment. The display device provided by the invention comprises a display module and a panel supporting piece, the display module comprises a display panel layer, and the panel supporting piece is arranged on the back side of the display panel layer. The panel supporting piece comprises a support, at least two conducting layers and at least one separating layer, one separating layer is arranged between any two adjacent conducting layers, the support is arranged on the periphery of a layered structure formed by the conducting layers and the separating layers in a surrounding mode, and the layered structure forms a circuit board; the conducting layer, facing the display panel layer, of the panel supporting piece is a first conducting layer, and the first electric connecting part of the display panel layer is welded to the second electric connecting part of the first conducting layer.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and more particularly to a display device and an electronic device. Background Technology

[0002] Electronic devices typically consist of circuit boards (such as motherboards and sub-boards) and display modules. The display panel of the display module is electrically connected to the circuit board via a flexible printed circuit (FPC). Because flexible printed circuit boards are relatively weak, they are at risk of breakage when subjected to external forces such as drops or impacts on electronic devices. Summary of the Invention

[0003] This invention provides a display device and an electronic device to address the problem of breakage risk in flexible circuit boards in electronic devices.

[0004] To solve the above-mentioned technical problems, the present invention is implemented as follows: In a first aspect, embodiments of the present invention provide a display device.

[0005] The display device provided in this embodiment of the invention includes: a display module and a panel support; the display module includes a display panel layer, and the panel support is disposed on the back side of the display panel layer; the panel support includes: a bracket, at least two conductive layers and at least one partition layer, a partition layer is provided between any two adjacent conductive layers, the bracket surrounds the outer periphery of the layered structure formed by the conductive layers and the partition layer, and the layered structure forms a circuit board; the conductive layer of the panel support facing the display panel layer is a first conductive layer, and a first electrical connection portion of the display panel layer is welded to a second electrical connection portion of the first conductive layer.

[0006] In some embodiments, the support is connected to the layered structure and is also connected to the back side of the display panel layer.

[0007] In some embodiments, the support includes a first annular portion and a second annular portion connected together, the first annular portion surrounding the outer periphery of the layered structure, and the second annular portion disposed on the side of the layered structure opposite to the display panel layer.

[0008] In some embodiments, the second annular portion is used to connect to the frame of an electronic device configured with a display device.

[0009] In some embodiments, the display device further includes a switch disposed on a bracket and electrically connected to a conductive layer.

[0010] In some embodiments, the bracket is a metal bracket, the switch is fixedly connected to and electrically connected to the bracket, and the bracket is electrically connected to the conductive layer.

[0011] In some embodiments, the conductive layer of the panel support member facing away from the display panel layer is a second conductive layer; the display device further includes a chip, and a third electrical connection portion of the chip is soldered to a fourth electrical connection portion of the second conductive layer.

[0012] In some embodiments, the conductive layer of the panel support member facing away from the display panel layer is a second conductive layer; the display device further includes a battery, and a fifth electrical connection portion of the battery is welded to a sixth electrical connection portion of the second conductive layer.

[0013] Secondly, embodiments of the present invention provide an electronic device.

[0014] The electronic device provided in the embodiments of the present invention includes: a frame and any one of the display devices provided in the embodiments of the present invention.

[0015] In some embodiments, the layered structure forms the motherboard of an electronic device.

[0016] The above-described at least one technical solution adopted in the embodiments of the present invention can achieve the following beneficial effects: In embodiments of the present invention, the panel support member for supporting the display module includes at least two conductive layers, and the layered structure formed by the conductive layers and the separating layer can form a circuit board. Therefore, the circuit board formed by the layered structure can replace at least part of the functions of the original circuit board of the electronic device equipped with the display device. Furthermore, since the first electrical connection portion of the display panel layer is soldered to the first conductive layer of the panel support member, the flexible circuit board used to connect the display panel layer and the circuit board is eliminated compared to the prior art, thus solving the problem of the risk of breakage of the flexible circuit board in related technologies.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a partial schematic diagram of a display device provided in an embodiment of the present invention; Figure 2 A partial schematic diagram of an electronic device equipped with a display device provided in an embodiment of the present invention; Figure 3This is a partial schematic diagram of another electronic device equipped with a display device, provided as an embodiment of the present invention.

[0020] Explanation of reference numerals in the attached figures: 1-Electronic devices; 100 - Display device; 110 - Display module; 111 - Display panel layer; 112 - Polarizing film; 113 - Optical adhesive layer; 114 - Cover plate; 120 - Panel support; 121 - Conductive layer; 121a - First conductive layer; 121b - Second conductive layer; 122 - Separator layer; 123 - Support; 1231 - First annular portion; 1232 - Second annular portion; 124 - Layered structure; 130 - Switch; 140 - Chip; 150 - Battery; 200 - Frame; 210 - Main body; 220 - Border; 300-button. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] Furthermore, although the terminology used in this invention is selected from commonly known and used terms, some terms mentioned in this specification may have been selected by the applicant in his or her judgment, and their detailed meanings are explained in the relevant sections of the description herein.

[0024] Furthermore, the invention should be understood not only through the actual terminology used, but also through the meaning implied by each term.

[0025] The technical solutions provided by the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0026] This invention provides a display device. (See reference...) Figures 1 to 3The display device 100 provided in this embodiment of the invention includes: a display module 110 and a panel support 120.

[0027] The display module 110 includes a display panel layer 111, and a panel support 120 is disposed on the back side of the display panel layer 111. The panel support 120 is used to support the display module 110 to improve the structural strength of the display module 110 and prevent the display module 110 from being damaged by impact force in the event of a drop of the electronic device 1 equipped with the display device 100.

[0028] The panel support 120 includes a bracket 123, at least two conductive layers 121, and at least one separator layer 122. A separator layer 122 is provided between any two adjacent conductive layers 121. The bracket 123 surrounds the outer periphery of the layered structure 124 formed by the conductive layers 121 and the separator layer 122. In this way, the conductive layers 121, the separator layer 122, and the bracket 123 can be connected as a whole through the bracket 123. The layered structure 124 forms a circuit board.

[0029] For example, the conductive layer 121 can be made of materials with good conductivity, such as copper or silver. This embodiment of the invention does not limit the material of the conductive layer 121, as long as the conductive layer 121 can meet the conductivity requirements. For example, the separating layer 122 can be made of a material with insulating properties and a certain buffering capacity. In this way, the separating layer 122 can not only prevent short circuits between adjacent conductive layers 121, but also act as a buffer and shock absorber, thereby preventing damage to the display module 110 from impact forces if the electronic device 1 equipped with the display device 100 is dropped.

[0030] Furthermore, the conductive layer 121 of the panel support 120 facing the display panel layer 111 is a first conductive layer 121a, and the first electrical connection portion of the display panel layer 111 is welded to the second electrical connection portion of the first conductive layer 121a.

[0031] In this manner, in embodiments of the present invention, the panel support 120 for supporting the display module 110 includes at least two conductive layers 121, and the layered structure 124 formed by the conductive layers 121 and the separating layer 122 can form a circuit board. Therefore, the circuit board formed by the layered structure 124 can replace at least part of the functions of the original circuit board of an electronic device equipped with a display device. Furthermore, since the first electrical connection portion of the display panel layer 111 is soldered to the first conductive layer 121a of the panel support 120, the flexible circuit board used to connect the display panel layer and the circuit board is eliminated compared to the prior art, thus solving the problem of the risk of breakage of the flexible circuit board in related technologies.

[0032] In some embodiments, the display module 110 includes a display panel layer 111, a polarizer 112, an optically clear adhesive (OCA) layer 113, and a cover plate 114. The display panel layer 111 is the core display layer of the display module 110. The display panel layer 111, polarizer 112, optically clear adhesive layer 113, and cover plate 114 are arranged sequentially. The light-emitting surface of the display panel layer 111 faces the cover plate 114, and the back side of the display panel layer 111 faces away from the cover plate 114.

[0033] In some embodiments, the display panel layer 111 and the first conductive layer 121a (the conductive layer 121 of the panel support 120 facing the display panel layer 111) of the panel support 120 are connected by wiring bonding, thereby making the display panel layer 111 and the conductive layer (121) of the panel support 120 electrically connected.

[0034] For example, the first electrical connection portion of the display panel layer 111 is a first pad, and the second electrical connection portion of the first conductive layer 121a of the panel support 120 is a second pad. The first pad and the second pad are soldered to achieve conductivity between the display panel layer 111 and the panel support 120.

[0035] It should be noted that the embodiments of the present invention do not restrict the specific electrical connection process between the display panel layer 111 and the first conductive layer 121a of the panel support member 120, as long as the display panel layer 111 and the first conductive layer 121a of the panel support member 120 can be connected.

[0036] In some embodiments, the traces of the display panel layer 111 are connected to the metal traces of the first conductive layer 121a of the panel support member 120 by bonding to achieve conductivity. The panel support member 120 is designed as a multi-layer metal composite frame structure, similar to a circuit board, and can realize multi-layer traces. Adjacent conductive layers 121 are isolated by a separator layer 122 made of polymer material. The separator layer 122 has partial holes filled with metal, which allows adjacent conductive layers 121 to conduct through the metal filled in the holes. It should be noted that the number of conductive layers 121 and separator layers 122 of the panel support member 120 can be flexibly set according to actual needs. The embodiments of the present invention do not limit the number of conductive layers 121 and separator layers 122.

[0037] In some embodiments, the bracket 123 is connected to the layered structure 124, and the bracket 123 is also connected to the back side of the display panel layer 111. Exemplarily, the bracket 123 can be welded to the outer periphery of the layered structure 124; alternatively, the bracket 123 can be bonded to the outer periphery of the layered structure 124 using adhesive or double-sided adhesive. The bracket 123 can be connected to the back side of the display panel layer 111 using adhesive or double-sided adhesive. Furthermore, exemplarily, the layered structure 124 can also be connected to the back side of the display panel layer 111 using adhesive or double-sided adhesive. Of course, in some embodiments, adhesive or double-sided adhesive may not be provided between the layered structure 124 and the back side of the display panel layer 111. The layered structure 124 can be indirectly connected to the back side of the display panel layer 111 via the bracket 123.

[0038] In other words, in some embodiments, the conductive layer 121 and the separating layer 122 form a layered structure 124. The layered structure 124 forms a circuit board. The description of the layered structure 124 forming a circuit board herein refers to the layered structure 124 having functions similar to those of a conventional circuit board, and the layered structure 124 can be electrically connected to various components. Embodiments of the present invention do not limit the appearance and structure of the layered structure 124 to be completely identical to that of a conventional rigid circuit board.

[0039] Furthermore, the panel support 120 includes a layered structure 124 and a bracket 123. The bracket 123 surrounds the outer periphery of the layered structure 124, allowing the bracket 123 and the layered structure 124 to be connected as a single unit. The bracket 123 also provides protection for the edges of the layered structure 124 formed by the conductive layer 121 and the separating layer 122. Additionally, the bracket 123 surrounds the outer periphery of the layered structure 124 and is connected to the back side of the display panel layer 111. Thus, the connection between the panel support 120 and the display panel layer 111 is strengthened by connecting the bracket 123 to the display panel layer 111.

[0040] In some embodiments, the support 123 includes a first annular portion 1231 and a second annular portion 1232 connected to each other. The first annular portion 1231 surrounds the outer periphery of the layered structure 124. Exemplarily, the first annular portion 1231 may be fixedly connected to the outer periphery of the layered structure 124. For example, the first annular portion 1231 may be welded or bonded to the outer periphery of the layered structure 124. The second annular portion 1232 is disposed on the side of the layered structure 124 facing away from the display panel layer 111. In this way, the first annular portion 1231 can surround the outer periphery of the layered structure 124 to avoid damage to the outer periphery of the layered structure 124; and the second annular portion 1232 can be disposed on the side of the layered structure 124 facing away from the display panel layer 111 to avoid damage to the edge region of the side of the layered structure 124 facing away from the display panel layer 111.

[0041] In some embodiments, the second annular portion 1232 is used to connect to the frame 200 of the electronic device 1 on which the display device 100 is disposed. For example, when the electronic device 1 is a mobile phone, the frame 200 can be the mobile phone mid-frame. In this way, since the display panel layer 111 of the display module 110 is connected to the bracket 123, and the bracket 123 is connected to the frame 200 of the electronic device 1, the layered structure 124 formed by the conductive layer 121 and the separating layer 122 can be avoided from being directly connected to the frame 200, which would prevent the layered structure 124 formed by the conductive layer 121 and the separating layer 122 from being accidentally peeled off and damaged.

[0042] Exemplarily, the frame 200 includes a main body portion 210 and a border portion 220 connected to each other. The main body portion 210 is opposite to the display module 110. For example, the main body portion 210 is specifically opposite to the edge portion of the display module 110. The border portion 220 surrounds the outer periphery of the display module 110. For example, an adhesive layer is provided on the side of the second annular portion 1232 facing away from the display module 110, and the second annular portion 1232 is connected to the main body portion 210 via the adhesive layer. For example, the adhesive layer is a foam adhesive layer.

[0043] Furthermore, by way of example, the electronic device 1 also includes a back cover. The back cover and the display module 110 are respectively disposed on both sides of the frame 200, and the back cover, the display module 110, and the frame 220 of the frame 200 form a receiving cavity. Various components of the electronic device 1 are disposed within the receiving cavity. For example, components such as the battery of the electronic device 1 are disposed within the receiving cavity.

[0044] In some embodiments, the display device 100 further includes a switch 130. The switch 130 is disposed on a bracket 123 and electrically connected to a conductive layer 121. Exemplarily, the bracket 123 is a metal bracket. For example, the bracket 123 is a sheet metal part. The switch 130 is fixedly connected to and electrically connected to the bracket 123, and the bracket 123 is electrically connected to the conductive layer 121. Thus, by electrically connecting the switch 130 to the conductive layer 121 via the bracket 123, the flexible circuit board required for the switch 130 can be eliminated, solving the problem in related technologies where the flexible circuit board electrically connected to the switch is easily damaged.

[0045] For example, the switch 130 is soldered to a metal bracket using surface mount technology (SMT) process, and the metal bracket is soldered to the side of the layered structure 124 formed by the conductive layer 121 and the separator layer 122, thereby making the switch 130 electrically connected to the panel support 120.

[0046] Furthermore, the button 300 passes through the frame 200. For example, the frame 200 has a through hole in its edge portion 220, and the button 300 passes through the through hole. One end of the button 300 abuts against the switch 130. Thus, the switch 130 can be triggered by pressing the button 300. In addition, the metal bracket can be connected to the frame 200 through conductive foam to achieve a grounding effect.

[0047] For example, when electronic device 1 is a mobile phone, switch 130 is a side button switch. For instance, the switch can be a mobile phone power switch or a volume control switch. For example, switch 130 can be a dome switch or a pressure-sensitive switch. This embodiment of the invention does not limit the specific type of switch 130; those skilled in the art can flexibly select various types of switches according to their needs when implementing the solutions provided in this embodiment.

[0048] In other embodiments, the support may not be a metal support. For example, the support may be a plastic support. When the support is a plastic support, wires can be formed on the plastic support using laser-direct-structuring (LDS) technology. One end of the wire is connected to the switch 130, and the other end is electrically connected to the conductive layer 121, thus also allowing the switch 130 to be electrically connected to the conductive layer 121.

[0049] In some embodiments, the conductive layer 121 of the panel support 120 opposite to the display panel layer 111 is a second conductive layer 121b. The display device 100 also includes a chip 140, the third electrical connection portion of which is soldered to the fourth electrical connection portion of the second conductive layer 121b. Exemplarily, electronic components such as the central processing unit (CPU) of the electronic device 1 are integrated into a modular chip, and the chip 140 can be this modular chip. The modular chip is soldered to the conductive layer 121 of the panel support 120 opposite to the display panel layer 111 using surface mount technology. Furthermore, a protective structure such as a metal shield and electromagnetic compatibility (EMC) related structures can be provided outside the modular chip. Of course, the chip 140 can also be a conventional central processing unit (CPU).

[0050] For example, the third electrical connection portion of the chip 140 is a third pad or solder pad, and the fourth electrical connection portion of the second conductive layer 121b is a fourth pad. The third pad or solder pad is soldered to the fourth pad. In this way, by soldering the chip 140 to the panel support 120, the compactness of the display device 100 can be improved.

[0051] In some embodiments, the conductive layer 121 of the panel support 120 opposite to the display panel layer 111 is a second conductive layer 121b. The display device 100 also includes a battery 150, and a fifth electrical connection portion of the battery 150 is welded to a sixth electrical connection portion of the second conductive layer 121b.

[0052] For example, the metal wires of the battery cell of the battery 150 are electrically connected to the conductive layer 121 of the panel support 120, which is opposite to the display panel layer 111, by gold wire bonding. The non-welded parts of the battery 150 are bonded and fixed to the panel support 120 by double-sided adhesive to improve the connection between the battery 150 and the panel support 120. For example, the non-welded parts of the battery 150 are bonded and fixed to the side of the layered structure 124 opposite to the display module 110 by double-sided adhesive.

[0053] By adopting the above solution, the display module 110, panel support 120, switch 130, chip 140, and battery 150 can be integrated into a single unit to form a display device 100. Furthermore, the layered structure 124 of the panel support 120 forms a circuit board-like structure, replacing the motherboard and sub-board of electronic devices in related technologies. This eliminates the need for flexible circuit boards that connect the display module 110, switch 130, and battery 150 to the motherboard or sub-board of the electronic device separately, greatly improving the integration of the display device 100.

[0054] Furthermore, in related technologies, the display module 110 is connected to a flexible circuit board on the back of the display module 110 via a bent chip onpanel (COP), which in turn connects the flexible circuit board to the circuit board of the electronic device. This results in a relatively large black border area on the display module 110. However, in the solution provided by this embodiment, the display panel layer 111 is directly soldered to the first conductive layer 121a of the panel support 120. This eliminates the need for a bent chip onpanel, thereby reducing the size of the black border and increasing the screen-to-body ratio of the electronic device 1 equipped with the display device 100.

[0055] In some embodiments, the exposed surfaces of the display device 100 may be covered with insulating material or coated with insulating varnish. This can prevent the display device 100 from leaking electricity due to accidents.

[0056] This invention provides an electronic device. Exemplarily, the electronic device may be a mobile phone, smartwatch, tablet computer, or laptop computer, etc., and will not be listed here. References Figures 1 to 3The electronic device 1 provided in this embodiment of the invention includes a frame 200 and any of the display devices 100 provided in this embodiment of the invention. The display device 100 is connected to the frame 200. For example, when the electronic device 1 is a mobile phone, the frame 200 is the mobile phone's mid-frame.

[0057] In some embodiments, the layered structure 124 of the panel support 120 forms the motherboard of the electronic device 1. In this way, the motherboard of the electronic device 1 can be replaced by the layered structure 124 forming the motherboard of the electronic device 1, or the motherboard and sub-board of the electronic device in the related art, thereby greatly improving the integration of the display device 100 of the electronic device 1.

[0058] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0059] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the embodiments of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A display device, characterized in that, The display device comprises: a display module (110) and a panel support (120); the display module (110) comprises a display panel layer (111), and the panel support (120) is arranged on the back side of the display panel layer (111); the panel support (120) comprises a bracket (123), at least two conductive layers (121) and at least one separation layer (122), any two adjacent conductive layers (121) are provided with one separation layer (122), the bracket (123) is arranged on the outer periphery of a layered structure (124) formed by the conductive layers (121) and the separation layers (122), and the layered structure (124) forms a circuit board; a conductive layer (121) of the panel support (120) facing the display panel layer (111) is a first conductive layer (121a), and a first electrical connection part of the display panel layer (111) is welded with a second electrical connection part of the first conductive layer (121a).

2. The display device according to claim 1, wherein The bracket (123) is connected with the layered structure (124), and the bracket (123) is also connected with the back side of the display panel layer (111).

3. The display device according to claim 1, wherein The bracket (123) comprises a first annular part (1231) and a second annular part (1232) connected with each other, the first annular part (1231) is arranged on the outer periphery of the layered structure (124), and the second annular part (1232) is arranged on the side of the layered structure (124) away from the display panel layer (111).

4. The display device according to claim 3, wherein The second annular part (1232) is used for being connected with a frame (200) of an electronic device in which the display device is arranged.

5. The display device according to claim 1, wherein The display device further comprises a switch (130), the switch (130) is arranged on the bracket (123), and the switch (130) is electrically connected with the conductive layer (121).

6. The display device according to claim 5, wherein The bracket (123) is a metal bracket, the switch (130) is fixedly and electrically connected with the bracket (123), and the bracket (123) is electrically connected with the conductive layer (121).

7. The display device according to claim 1, wherein A conductive layer (121) of the panel support (120) away from the display panel layer (111) is a second conductive layer (121b); The display device further comprises a chip (140), a third electrical connection part of the chip (140) is welded with a fourth electrical connection part of the second conductive layer (121b).

8. The display device according to claim 1, wherein A conductive layer (121) of the panel support (120) away from the display panel layer (111) is a second conductive layer (121b); The display device further comprises a battery (150), a fifth electrical connection part of the battery (150) is welded with a sixth electrical connection part of the second conductive layer (121b).

9. An electronic device, comprising: The display device comprises: a frame (200) and the display device according to any one of claims 1 to 8.

10. The electronic device of claim 9, wherein, The layered structure (124) forms a mainboard of the electronic device.

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