Driving method, driving system and display device

Abstract

The invention provides a driving method, a driving system and a display device. The driving method comprises the following steps: in a display period, controlling a display driving module to receive display data from a system-on-chip through a high-speed serial interface, and driving sub-pixels in a display panel to work by using the display data; and in the blanking period, the touch sensing module is controlled to receive original touch data from the display panel, and the touch data obtained after the original touch data is processed is sent to the system-on-chip through the high-speed serial interface. Specifically, the display data and the touch data are transmitted between the integrated chip and the system-on-chip through the high-speed serial interface by performing time division multiplexing on the high-speed serial interface in the display period and the blanking period, so that the number of system pins can be effectively reduced, and the cost of the connector can be reduced. In addition, the original touch data / touch data is transmitted by utilizing the blanking period, so that the interference on normal display can be avoided, and the system stability is improved.

Description

Technical Field

[0001] This application relates to the field of display, and in particular to a driving method, driving system and display device. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] In the traditional Touch and Display Driver Integration (TDDI) architecture of display panels, touch (TP) data is usually transmitted via I2C (Inter-Integrated Circuit Interface) or SPI (Serial Peripheral Interface), while display (Display) data is transmitted via MIPIDSI (Mobile Industry Processor Interface / Display Serial Interface). These two independent interfaces increase the number of system pins (usually requiring 4 to 6 pins for touch communication), thereby increasing the complexity of the circuit board (PCB) and the cost of connectors. Summary of the Invention

[0005] To address the aforementioned issues, this application provides a driving method, driving system, and display device that can reduce the number of pins in the TDDI architecture, thereby simplifying the complexity of the PCB and reducing the architecture cost.

[0006] To address the aforementioned problems, the first technical solution provided in this application is: to provide a driving method, comprising:

[0007] During the display period, the control display driver module receives display data from the system-on-a-chip through a high-speed serial interface and uses the display data to drive the sub-pixels in the display panel to work;

[0008] During the blanking period, the control touch sensing module receives raw touch data from the display panel and sends the processed touch data to the system-on-a-chip through the high-speed serial interface.

[0009] In one embodiment, in response to receiving a first mode switching signal from the system-on-a-chip, it is determined that the display panel has entered the display period, and the display driving module is controlled to receive display data from the system-on-a-chip through multiple communication channels in the high-speed serial interface, and to use the display data to drive the sub-pixels in the display panel to work.

[0010] In response to receiving a second mode switching signal from the system-on-a-chip, the system determines that the display panel has entered a blanking period, controls the touch sensing module to receive raw touch data from the display panel, and sends the processed touch data to the system-on-a-chip through a dedicated communication channel among the multiple communication channels.

[0011] The data transmission rate of the dedicated communication channel during the display period is higher than that during the blanking period.

[0012] In one embodiment, the step of controlling the touch sensing module to receive raw touch data from the display panel and sending the processed touch data to the system-on-a-chip through a dedicated communication channel among the multiple communication channels includes:

[0013] In response to receiving a control command frame from the system-on-a-chip, the touch sensing module is controlled to receive raw touch data from the display panel;

[0014] In response to the touch sensing module processing the original touch data to obtain the touch data, a data response frame is sent and the touch sensing module is controlled to send the touch data to the system-on-a-chip, so that the system-on-a-chip receives the returned touch data.

[0015] In one embodiment, it further includes:

[0016] In response to the fact that the bandwidth of the touch data is greater than the capacity of the blanking period, the touch data is dynamically adjusted.

[0017] In one embodiment, the step of dynamically adjusting the touch data includes:

[0018] Reduce touch sampling rate; or

[0019] The touch sensing module is controlled to enable a data compression algorithm.

[0020] In one embodiment, the step of dynamically adjusting the touch data includes:

[0021] Reduce touch sampling rate; and

[0022] In response to the fact that the bandwidth of the touch data after reducing the touch reporting rate is greater than the capacity of the blanking period, the touch sensing module is controlled to enable the data compression algorithm.

[0023] In one embodiment, the step of reducing the touch reporting rate includes:

[0024] The touch reporting rate is reduced to 60Hz-90Hz.

[0025] To address the aforementioned problems, the second technical solution provided in this application is: to provide a driving system, comprising:

[0026] System-on-a-chip (SoC);

[0027] An integrated chip is electrically connected to the system-on-a-chip via a high-speed serial interface; the integrated chip includes a display driver module, a touch sensing module, and a timing control module.

[0028] The timing control module is configured as follows:

[0029] During the display period, the display driver module is controlled to receive display data from the system-on-a-chip through the high-speed serial interface, and to use the display data to drive the sub-pixels in the display panel to work;

[0030] During the blanking period, the touch sensing module is controlled to receive raw touch data from the display panel, and the processed touch data is sent to the system-on-a-chip through the high-speed serial interface.

[0031] In one embodiment, the display driver module is configured with a first register, and the touch sensing module is configured with a second register;

[0032] The first register is used to store the display data;

[0033] The second register is used to process the received raw touch data to obtain touch data with a header identifier, and to store the touch data;

[0034] The system-on-a-chip obtains the touch data by recognizing the header identifier.

[0035] In one embodiment, the high-speed serial interface is MIPIDSI.

[0036] In one embodiment, the high-speed serial interface includes multiple communication channels, and the multiple communication channels include dedicated communication channels;

[0037] The timing controller is configured as follows:

[0038] The system receives a first mode switching signal from the system-on-a-chip, determines that the display panel has entered the display period, controls the display driver module to receive display data from the system-on-a-chip through multiple communication channels, and uses the display data to drive the sub-pixels in the display panel to work.

[0039] The system receives a second mode switching signal from the system-on-a-chip, determines that the display panel has entered the blanking period, controls the touch sensing module to receive raw touch data from the display panel, and sends the processed touch data to the system-on-a-chip through the dedicated communication channel.

[0040] The data transmission rate of the dedicated communication channel during the display period is higher than that during the blanking period.

[0041] In one embodiment, the dedicated communication channel includes a control command frame and a data response frame. The control command frame is used by the system-on-a-chip to send a sampling configuration instruction for the raw touch data to the integrated chip, and the data response frame is used by the integrated chip to return the touch data to the system-on-a-chip.

[0042] In one embodiment, the timing control module is further configured to dynamically adjust the touch data in response to the bandwidth of the touch data being greater than the capacity of the blanking period.

[0043] In one embodiment, dynamically adjusting the touch data includes:

[0044] Reduce touch sampling rate; or

[0045] The touch sensing module is controlled to enable a data compression algorithm.

[0046] In one embodiment, dynamically adjusting the touch data includes:

[0047] Reduce touch sampling rate; and

[0048] In response to the fact that the bandwidth of the touch data after reducing the touch reporting rate is greater than the capacity of the blanking period, the touch sensing module is controlled to enable the data compression algorithm.

[0049] In one embodiment, reducing the touch reporting rate includes:

[0050] The touch reporting rate is reduced to 60Hz-90Hz.

[0051] To address the aforementioned problems, the third technical solution provided in this application is: to provide a display device, comprising:

[0052] Display panel;

[0053] A driving system connected to the display panel, the driving system being used to execute the driving method described in any of the preceding claims; or, the driving system comprising the driving system described in any of the preceding claims.

[0054] The beneficial effects of this application are that, unlike existing technologies, the driving method provided in this application includes: during the display period, controlling the display driving module to receive display data from the system-on-a-chip (SoC) through a high-speed serial interface, and using the display data to drive the sub-pixels in the display panel to work; during the blanking period, controlling the touch sensing module to receive raw touch data from the display panel, and sending the processed touch data to the SoC through the high-speed serial interface. Specifically, by time-division multiplexing the high-speed serial interface transmission during the display and blanking periods, both display data and touch data are transmitted between the integrated chip and the SoC through the high-speed serial interface, which can effectively reduce the number of system pins and lower connector costs. In addition, using the blanking period to transmit raw touch data / touch data can avoid interference with normal display and improve system stability. Attached Figure Description

[0055] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0056] Figure 1 This is a schematic diagram of the structure of a display panel according to one embodiment of this application;

[0057] Figure 2 yes Figure 1 A schematic diagram of a partial film layer cross-section structure in the BB direction of a local area of ​​one embodiment of a display panel;

[0058] Figure 3This is a cross-sectional schematic diagram of an array substrate according to one embodiment of this application;

[0059] Figure 4 This is a schematic diagram of a pixel circuit according to one embodiment of this application;

[0060] Figure 5 This is a schematic diagram of the structure of the isolation opening according to one embodiment of this application;

[0061] Figure 6 yes Figure 1 A schematic diagram of a partial film layer cross-section structure in the BB direction of a local area of ​​another embodiment of the display panel;

[0062] Figure 7 yes Figure 1 A schematic diagram of a partial film layer cross-section structure in the BB direction of a local area of ​​another embodiment of the display panel;

[0063] Figure 8 yes Figure 1 A schematic diagram of a partial film layer cross-section structure in the BB direction of a local area of ​​another embodiment of the display panel;

[0064] Figure 9 yes Figure 1 A schematic diagram of a partial film layer cross-section structure in the BB direction of a local area of ​​another embodiment of the display panel;

[0065] Figure 10 This is a schematic diagram of the light-emitting structure of the embodiment in this application;

[0066] Figure 11 yes Figure 1 A schematic diagram of a partial film layer cross-section structure in the BB direction of a local area of ​​another embodiment of the display panel;

[0067] Figure 12 yes Figure 1 A schematic diagram of a partial film layer cross-section structure in the BB direction of a local area of ​​another embodiment of the display panel;

[0068] Figure 13 This is a flowchart illustrating one embodiment of the method for manufacturing the display panel of this application;

[0069] Figure 14 This is a schematic diagram of the structure of a driving system according to one embodiment of the present application;

[0070] Figure 15 This is a schematic diagram of the drive system of another embodiment of this application;

[0071] Figure 16 This is a flowchart illustrating the driving method of one embodiment of this application;

[0072] Figure 17 yes Figure 16 A flowchart illustrating one implementation method of step S2 in the above steps;

[0073] Figure 18 This is a schematic diagram of the structure of a display device according to one embodiment of this application;

[0074] Figure 19 This is a schematic diagram of the structure of a display device according to another embodiment of this application;

[0075] Figure 20 This is a schematic diagram of the structure of a display device according to another embodiment of this application. Detailed Implementation

[0076] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0077] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0078] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0079] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction of the display panel.

[0080] For certain elements, terms like "above" or "overhead" are sometimes used when describing the position of an element in the Z direction, and "below" or "under" are used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "overhead," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0081] See Figure 1 , Figure 1 This is a schematic diagram of the structure of a display panel according to one embodiment of this application. The display panel 100 can be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. The display panel 100 includes a display area AA with display function and a non-display area NA.

[0082] The display area AA of the display panel 100 can be rectangular, square, circular, oval, or other shapes.

[0083] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. Each pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, a pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, in addition to sub-pixels SPX1, SPX2, and SPX3, a pixel PX also includes sub-pixels SPX that emit white or other colors of light.

[0084] A sub-pixel (SPX) includes a pixel circuit and a light-emitting device driven by the pixel circuit to emit light of the corresponding color. The first sub-pixel (SPX1) includes a first light-emitting device, the second sub-pixel (SPX2) includes a second light-emitting device, and the third sub-pixel (SPX3) includes a third light-emitting device. One pixel circuit drives at least one light-emitting device to emit light. For example, the display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is a display area set according to a corresponding sensor and has light-transmitting properties, while the normal display area is a display area not set according to a corresponding sensor. In the normal display area, one pixel circuit drives one light-emitting device to emit light, and in the light-transmitting display area, one pixel circuit drives one or more light-emitting devices to emit light.

[0085] In one implementation, see Figure 2 , Figure 2 yes Figure 1 This is a schematic diagram of a partial film layer cross-section structure in the BB direction of a partial area of ​​an embodiment of a display panel. The display panel 100 includes an array substrate 110, an isolation structure 120, and a plurality of light-emitting devices 130. Each light-emitting device 130 includes a first electrode 131, a light-emitting structure 132, and a second electrode 133 stacked in a direction away from the array substrate 110.

[0086] See Figure 3 , Figure 3 This is a cross-sectional schematic diagram of an array substrate according to one embodiment of this application. The array substrate 110 includes a pixel circuit layer and a planarization layer 19. The pixel circuit layer includes pixel circuits for driving the light-emitting device 130 to emit light. Figure 3 A transistor 18 in the pixel circuit is shown. A via is provided in the planarization layer 19, and the first electrode 131 is electrically connected to the transistor 18 in the pixel circuit layer through the via. Furthermore, the pixel circuit layer includes at least one insulating layer, which may include at least one of an inorganic layer and an organic layer. Additionally, the array substrate 110 includes scan lines providing the scan signal Scan and data lines providing the data signal Data to the pixel circuit.

[0087] See Figure 4 , Figure 4 This is a schematic diagram of a pixel circuit according to one embodiment of this application. The pixel circuit includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to a data line providing the data signal Data, the gate of the data transistor T2 is connected to a scan line providing the scan signal Scan, the drain of the data transistor T2 is connected to the gate of the driving transistor T1, the two ends of the storage capacitor C1 are respectively connected to the gate and the source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting device 130. Figure 4 This is one implementation of a pixel circuit; the pixel circuit described in this application is not limited to... Figure 4 The 2T1C pixel circuit shown can also be other pixel circuits, such as 7T1C, 8T1C pixel circuits, etc.

[0088] See Figure 2 and Figure 5 , Figure 5This is a schematic diagram of the isolation opening structure according to one embodiment of this application. The isolation structure 120 is located on one side of the array substrate 110 and encloses a plurality of isolation openings 12a. The plurality of isolation openings 12a include a plurality of first isolation openings 12a1, a plurality of second isolation openings 12a2, and a plurality of third isolation openings 12a3. A plurality of light-emitting devices 130 are located on one side of the array substrate 110, and the plurality of light-emitting devices 130 include a plurality of first light-emitting devices 130a, a plurality of second light-emitting devices 130b, and a plurality of third light-emitting devices 130c. The first light-emitting devices 130a are disposed corresponding to the first isolation openings 12a1, the second light-emitting devices 130b are disposed corresponding to the second isolation openings 12a2, and the third light-emitting devices 130c are disposed corresponding to the third isolation openings 12a3. In one embodiment, one light-emitting device 130 is correspondingly disposed with one isolation opening 12a. For example, a first light-emitting device 130a is correspondingly disposed with a first isolation opening 12a1, a second light-emitting device 130b is correspondingly disposed with a second isolation opening 12a2, and a third light-emitting device 130c is correspondingly disposed with a third isolation opening 12a3. At least a portion of the first light-emitting device 130a is disposed within the corresponding first isolation opening 12a1, at least a portion of the second light-emitting device 130b is disposed within the corresponding second isolation opening 12a2, and at least a portion of the third light-emitting device 130c is disposed within the corresponding third isolation opening 12a3. In another embodiment, multiple light-emitting devices 130 are correspondingly disposed with one isolation opening 12a. For example, multiple light-emitting devices with the same emission color are corresponding to one isolation opening 12a.

[0089] In one example, the isolation structure 120 includes an isolation portion 121 and a blocking portion 122 stacked along a direction away from the array substrate 110 (i.e., the Z direction), with the width of the blocking portion 122 being greater than the width of the isolation portion 121. Consequently, the two ends of the blocking portion 122 protrude compared to the sides of the isolation portion 121, and this shape of the isolation structure 120 is also referred to as a cantilever shape. The isolation portion 121 and the blocking portion 122 are made of different materials, and the etching rate of the blocking portion 122 is lower than that of the isolation portion 121. The material of the isolation portion 121 includes a conductive material, specifically including at least one of aluminum (Al), aluminum alloys, and aluminum alloys including at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The blocking portion 122 can be a single-layer structure or a multi-layer structure. If the blocking portion 122 is a single-layer structure, the material of the blocking portion 122 can include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. (Reference) Figure 6When the blocking part 122 has a multi-layer structure, one layer of the blocking part 122 is made of at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy or molybdenum-niobium alloy, and the other layer of the blocking part 122 may be made of conductive oxide or inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0090] In some implementations, see Figure 6 as well as Figure 7 , Figure 6 yes Figure 1 A schematic diagram of a partial film layer cross-section structure in the BB direction of a local area of ​​another embodiment of the display panel; Figure 7 yes Figure 1 This is a schematic diagram of a partial film layer cross-section in the BB direction of a partial area of ​​another embodiment of the display panel. The isolation structure 120 may further include a base 123 located on the side of the isolation portion 121 near the array substrate 110. The base 123 protrudes relative to the isolation portion 121 in the direction toward the isolation opening 12a, and the orthographic projection of the isolation portion 121 on the array substrate 110 lies within the orthographic projection of the base 123 on the array substrate 110. The material of the base 123 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0091] In one embodiment, the display panel 100 may further include a pixel defining layer 17, and an isolation structure 120 is disposed on the pixel defining layer 17. The pixel defining layer 17 has pixel openings (not shown) communicating with isolation openings 12a. Specifically, the pixel defining layer 17 has a first pixel opening communicating with a first isolation opening 12a1, a second pixel opening communicating with a second isolation opening 12a2, and a third pixel opening communicating with a third isolation opening 12a3. The areas of the orthographic projections of the first, second, and third pixel openings on the array substrate 110 may be the same or different. The shapes of the orthographic projections of the pixel openings and the corresponding isolation openings 12a on the array substrate 110 may be the same or different. Generally, the area of ​​the orthographic projection of the isolation opening 12a on the array substrate 110 is larger than the area of ​​the orthographic projection of the pixel opening communicating with the isolation opening 12a on the array substrate 110. The orthographic projections of the pixel openings of the light-emitting device 130 on the array substrate 110 overlap with the orthographic projections of the isolation openings 12a on the array substrate 110. The pixel defining layer 17 is made of an inorganic material, such as an inorganic insulating material formed by using at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0092] In one implementation, see Figure 8 , Figure 8 yes Figure 1 This is a schematic diagram of a partial film layer cross-section in the BB direction of another embodiment of the display panel. The pixel defining layer 17 includes multiple sub-layers, including a first sub-layer 171 and a second sub-layer 172 sequentially stacked along the direction away from the array substrate 110, that is, the pixel defining layer 17 can adopt a double-layer design.

[0093] For example, the first sublayer 171 has better film-forming properties than the second sublayer 172. That is, under the same thickness conditions, the first sublayer 171 can better cover the stepped structure formed by the first electrode 131 than the second sublayer 172, without producing cracks. Conversely, to obtain the same stepped coverage effect, the thickness of the first sublayer 171 needs to be thinner than the thickness of the second sublayer 172. That is, the thickness requirement for the first sublayer 171 is relatively low, which is conducive to product thinning. In addition, the better film-forming properties are reflected in the better coverage of the formed film, which is denser and more conducive to the isolation of water vapor.

[0094] For example, the second sublayer 172 has better etching resistance than the first sublayer 171. Since the side of the pixel-defining layer 17 facing away from the array substrate 110 will be etched during the display panel manufacturing process, by selecting a material with stronger etching resistance as the second sublayer 172, the etching resistance of the pixel-defining layer 17 can be improved, and the reliability of the display panel can be further improved.

[0095] For example, the first sublayer 171 and the second sublayer 172 are made of different materials. For instance, the first sublayer 171 is made of silicon nitride, and the second sublayer 172 is made of silicon oxide.

[0096] For example, the thickness of the first sublayer 171 is greater than or equal to 1000 micrometers and less than or equal to 5000 micrometers. For example, the thickness of the first sublayer 171 is 1000 micrometers, 2000 micrometers, 3000 micrometers, 4000 micrometers, 5000 micrometers, etc.

[0097] For example, the thickness of the second sublayer 172 is greater than or equal to 500 micrometers and less than or equal to 3000 micrometers. For instance, the thickness of the second sublayer 172 is 500 micrometers, 1000 micrometers, 2000 micrometers, 3000 micrometers, etc.

[0098] In another embodiment, the isolation structure 120 is disposed within the recess of the pixel limiting layer 17. Alternatively, the pixel limiting layer 17 may not be provided in the display panel 100, and the isolation structure 120 may be disposed on one side of the array substrate 110, with the isolation structure 120 in contact with one side of the array substrate 110.

[0099] The first light-emitting device 130a, the second light-emitting device 130b, and the third light-emitting device 130c emit light of different colors. Each of the three devices includes a first electrode 131, a light-emitting structure 132, and a second electrode 133 stacked together. The first electrode 131 is disposed on the array substrate 110, and a pixel defining layer 17 covers the end of the first electrode 131. A pixel opening is provided on the pixel defining layer 17, through which the first electrode 131 is exposed. The light-emitting structure 132 of the first light-emitting device 130a, the second light-emitting device 130b, and the third light-emitting device 130c covers the sidewall of the pixel opening of the pixel defining layer 17 and the side of the pixel defining layer 17 facing away from the array substrate 110. Each light-emitting structure 132 is located within the pixel opening and is in contact with the first electrode 131.

[0100] The second electrodes 133 of the first light-emitting device 130a, the second light-emitting device 130b, and the third light-emitting device 130c respectively cover the corresponding light-emitting structure 132. The second electrodes 133 are electrically connected to the isolation structure 120. For example, the second electrodes 133 are connected to the isolation portion 121 of the isolation structure 120, and / or, the second electrodes 133 are connected to the base portion 123 of the isolation structure 120. Specifically, when the isolation structure 120 includes a three-layer structure of a blocking portion 122, an isolation portion 121, and a base portion 123, the second electrodes 133 can extend to the side surface of the base portion 123 facing away from the array substrate 110 to connect with the base portion 123. In this case, the second electrodes 133 may or may not be connected to the isolation portion 121, for example, in Figure 8 In this embodiment, the second electrode 133 is connected to the isolation portion 121, while... Figure 9 In the implementation method, Figure 9 yes Figure 1 A schematic diagram of a partial film layer cross-section in the BB direction of another embodiment of the display panel. The second electrode 133 is not connected to the isolation portion 121.

[0101] The first electrode 131 can be an anode, and the second electrode 133 can be a cathode. The first electrode 131 of each light-emitting device 130 can be connected to the pixel circuit through a via, so that the pixel circuit drives the light-emitting device 130 to emit light.

[0102] The first electrode 131 may include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, using silver, a metallic material with excellent light reflectivity. Each conductive oxide layer can be formed, for example, from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 133 is formed, for example, from a metallic material such as an alloy of magnesium and silver (MgAg).

[0103] See Figure 10 , Figure 10 This is a schematic diagram of the light-emitting structure according to an embodiment of this application. The light-emitting structure 132 of at least one of the first light-emitting device 130a, the second light-emitting device 130b, and the third light-emitting device 130c includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the array substrate 110 (i.e., the Z direction). The light-emitting structure 132 may include one light-emitting material layer EML, or a stacked light-emitting structure including multiple light-emitting material layers EML.

[0104] In order for the light-emitting structure 132 to emit light, a pixel voltage is provided to the first electrode 131 and a common voltage is provided to the second electrode 133, forming a potential difference between the first electrode 131 and the second electrode 133, causing the light-emitting structure 132 disposed between the first electrode 131 and the second electrode 133 to emit light. In one embodiment, if a potential difference is formed between the first electrode 131 and the second electrode 133 of the first light-emitting device 130a, the light-emitting material layer EML of the light-emitting structure 132 emits blue light; if a potential difference is formed between the first electrode 131 and the second electrode 133 of the second light-emitting device 130b, the light-emitting material layer EML of the light-emitting structure 132 emits green light; and if a potential difference is formed between the first electrode 131 and the second electrode 133 of the third light-emitting device 130c, the light-emitting material layer EML of the light-emitting structure 132 emits red light.

[0105] In this configuration, the pixel voltage of the first electrode 131 is provided by the pixel circuit, and the common voltage of the second electrode 133 is provided by the isolation structure 120. Specifically, the second electrode 133 is electrically connected to the isolation structure 120, and the common voltage is supplied to the second electrode 133 by providing the isolation structure 120. That is, the isolation structure 120 has the function of supplying a common voltage to the second electrode 133.

[0106] See Figure 11 , Figure 11 yes Figure 1 This is a partial cross-sectional view of the film layer structure in the BB direction of another embodiment of the display panel. The display panel 100 also includes an encapsulation layer, which includes a first encapsulation sublayer. The first encapsulation sublayer includes a plurality of encapsulation portions 14. The encapsulation portions 14 are located on the side of the second electrode 133 facing away from the array substrate 110, and extend through the sidewall of the isolation structure 120 to the side of the isolation structure 120 facing away from the array substrate 110. The plurality of encapsulation portions 14 include a plurality of first encapsulation portions 14a corresponding to a plurality of first light-emitting devices 130a, a plurality of second encapsulation portions 14b corresponding to a plurality of second light-emitting devices 130b, and a plurality of third encapsulation portions 14c corresponding to a plurality of third light-emitting devices 130c. The first encapsulation portions 14a are disposed on the side of the corresponding first light-emitting device 130a facing away from the array substrate 110, the second encapsulation portions 14b are disposed on the side of the corresponding second light-emitting device 130b facing away from the array substrate 110, and the third encapsulation portions 14c are disposed on the side of the corresponding third light-emitting device 130c facing away from the array substrate 110.

[0107] In one embodiment, see Figure 11 The encapsulation portion 14 includes a first segment 141 and a second segment 142 that are connected to each other. The first segment 141 is located inside the isolation opening 12a and is disposed on the side of the light-emitting device 130 away from the array substrate 110. The second segment 142 is located on the side of the isolation structure 120 facing the isolation opening 12a. The surface of the first segment 141 away from the array substrate 110 and the surface of the second segment 142 away from the isolation structure 120 are at least partially connected to each other to enclose and form a gap space 140.

[0108] In another embodiment, see Figure 9 The surface of the first segment 141 facing away from the array substrate 110 and the surface of the second segment 142 facing away from the isolation structure 120 may not be connected.

[0109] See Figure 12 , Figure 12 yes Figure 1This is a schematic diagram of a partial cross-sectional structure of the film layer in the BB direction of another embodiment of the display panel. The display panel 100 also includes a second encapsulation sub-layer 15 and a third encapsulation sub-layer 16. The second encapsulation sub-layer 15 covers the isolation structure 120 and the encapsulation portion 14, and the third encapsulation sub-layer 16 covers the second encapsulation sub-layer 15. Both the first encapsulation sub-layer and the third encapsulation sub-layer 16 are inorganic materials, and the materials of the first encapsulation sub-layer and the third encapsulation sub-layer 16 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation sub-layer 15 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. The second encapsulation sub-layer 15 and the third encapsulation sub-layer 16 are continuously disposed at least over the entire display area AA, with a portion of them also disposed in the bezel area NA.

[0110] The display panel 10 may also include at least one film layer such as a touch layer, a polarizer, a color filter substrate, and a protective cover. This film layer may also be bonded to the display panel via an adhesive layer such as OCA (Optical Clear Adhesive).

[0111] The manufacturing method of the display panel 100 according to the embodiments of this application will be described below.

[0112] See Figure 13 The manufacturing method of the display panel 100 includes:

[0113] Step S11: Provide an array substrate 110.

[0114] Step S12: An isolation structure 120 is formed on one side of the array substrate 110. The isolation structure 120 is provided with a plurality of isolation openings 12a, including a plurality of first isolation openings 12a1, a plurality of second isolation openings 12a2 and a plurality of third isolation openings 12a3.

[0115] Step S13: Fabricate the film layer of the first light-emitting device 130a, which includes the light-emitting structure layer and the second electrode layer of the first light-emitting device 130a.

[0116] Step S14: Fabricate the first encapsulation sublayer of the first light-emitting device 130a. Since the film layer and the first encapsulation sublayer of the first light-emitting device 130a are both fabricated as a single layer, the positions of the multiple first isolation openings 12a1, the multiple second isolation openings 12a2, and the multiple third isolation openings 12a3 all have the film layer and the first encapsulation sublayer of the first light-emitting device 130a.

[0117] Step S15: Etch away the film layer and the first encapsulation layer of the first light-emitting device 130a at the locations of the multiple second isolation openings 12a2 and the multiple third isolation openings 12a3, thereby forming the light-emitting structure 132 and the second electrode 133 of the first light-emitting device 130a, as well as the first encapsulation portion 14a of the first light-emitting device 130a, only at the locations of the multiple first isolation openings 12a1.

[0118] Based on the above steps S13 to S15, the light-emitting structure 132 and the second electrode 133 of the second light-emitting device 130b and the second encapsulation part 14b of the second light-emitting device 130b are respectively provided at the positions of the multiple second isolation openings 12a2, and the light-emitting structure 132 and the second electrode 133 of the third light-emitting device 130c and the third encapsulation part 14c of the third light-emitting device 130c are respectively provided at the positions of the multiple third isolation openings 12a3.

[0119] Step S16: A touch layer is formed on the side of the encapsulation layer facing away from the array substrate 110. Optionally, the touch layer can be disposed within the encapsulation layer or on the side of the encapsulation layer facing away from the array substrate 110. The touch layer transmits touch signals to the driving system of the display panel based on user operations, so that the driving system performs corresponding operations.

[0120] See Figure 14 , Figure 14 This is a schematic diagram of the drive system of one embodiment of the present application.

[0121] This application provides a driving system 200 for driving a display panel. The type of display panel driven by the driving system 200 includes, but is not limited to, the display panel 100 of any of the above embodiments. Specifically, the driving system 200 includes a system-on-a-chip 210 and an integrated chip 220.

[0122] The System-on-Chip (SoC) 210 is the core control unit within the display device. It integrates a processor, display control module, interface circuits, and other functional components, and is responsible for coordinating key tasks such as display / touch data processing, timing control, and peripheral interaction. Specifically, the SoC 210 acts as the "brain and nerve center" of the display device. Through its highly integrated design, it achieves efficient collaboration between display, computing, and peripheral interaction, and is a core support for the miniaturization and high performance of modern display devices.

[0123] Among them, integrated chip 220 is a touch and display driver integrated chip (or TDDI), which integrates the traditional touch chip (Touch IC) and display driver chip (DDIC) into a single chip, realizing an integrated design of display and touch functions. Specifically, integrated chip 220 integrates the touch chip and display driver chip together, reducing PCB area and pin count, and lowering BOM (Bill of Materials) costs. In addition, the integrated design shortens the signal transmission path, reducing external electromagnetic interference (EMI), and avoids redundant circuits, reducing overall power consumption.

[0124] In this embodiment, the integrated chip 220 is electrically connected to the system-on-a-chip 210 via a high-speed serial interface. The integrated chip 220 includes a display driver module 221, a touch sensing module 222, and a timing control module 230.

[0125] The timing control module 230 is configured to: during the display period, control the display driving module 221 to receive display data from the system-on-a-chip 210 through a high-speed serial interface, and use the display data to drive the sub-pixels in the display panel to work; during the blanking period, control the touch sensing module 222 to receive the raw touch data from the display panel, and send the touch data obtained after processing the raw touch data to the system-on-a-chip 210.

[0126] Specifically, in this embodiment, by time-division multiplexing the high-speed serial interface transmission during the display period and the blanking period, both display data and touch data are transmitted between the integrated chip 220 and the system-on-a-chip 210 via the high-speed serial interface, which can effectively reduce the number of system pins and lower connector costs. Furthermore, utilizing the blanking period to transmit raw touch data / touch data can avoid interference with normal display and improve system stability.

[0127] High-speed serial interfaces include, but are not limited to, display serial interface (MIPIDSI), embedded display port (eDP), and flat panel display link (FPD-LINK).

[0128] For ease of description, the high-speed serial interface in the embodiments of this application takes MIPIDSI as an example.

[0129] In existing technologies, MIPIDSI is designed for "efficient transmission of display data." However, the low bandwidth and non-real-time nature of touch data (e.g., coordinate data volume is only tens of bytes per transmission, reporting rate 100-200Hz) make it more suitable for transmission via dedicated interfaces such as I2C and SPI to avoid bandwidth waste caused by using MIPIDSI. Furthermore, MIPIDSI's data packets (e.g., long data packets, short data packets) are specifically designed for transmitting display-related data such as pixel values ​​and synchronization signals; touch data (e.g., coordinates, gesture commands) cannot be directly adapted to its protocol framework.

[0130] See Figure 15 , Figure 15 This is a schematic diagram of the drive system of another embodiment of this application.

[0131] To address the issue of MIPIDSI's difficulty in transmitting touch data, in one embodiment, the display driver module 221 is equipped with a first register 22101, and the touch sensing module 222 is equipped with a second register 22201. The first register 22101 stores display data; the second register 22201 processes the received raw touch data to obtain touch data with a header identifier, and stores the touch data; the system-on-a-chip 210 obtains the touch data by recognizing the header identifier.

[0132] Specifically, the first register 22101 ensures the stability of the display data through an independent storage area, and the second register 22201 encapsulates the raw touch data received from the display panel and adds a header identifier (e.g., 0x2A) to indicate that the data stored in the second register 22201 is the touch data after processing the raw touch data. The system-on-a-chip 210 extracts the touch data from the storage area of ​​the second register 22201 by parsing the feature code in the header identifier.

[0133] Understandably, by adopting a register mapping scheme, bidirectional data exchange can be achieved on a unidirectional MIPIDSI link, enabling MIPIDSI to support bidirectional communication functions and meet the bidirectional interaction requirements of touch data.

[0134] In one embodiment, the high-speed serial interface includes multiple communication channels, including dedicated communication channels. Specifically, the physical link layer of MIPIDSI consists of 1-4 data channels and 1 clock channel. The clock channel is unidirectional, transmitted from the host (e.g., system-on-a-chip 210) to the slave (e.g., integrated chip 220). Among the data channels, channels 1 to 3 are high-speed unidirectional data channels, transmitted only from the host to the slave, with a single-channel transmission speed reaching Gbps. Channel 0 is special; in high-speed (HS) mode, it is a unidirectional high-speed data channel, and in low-power (LP) mode, it can function as a bidirectional data channel with a maximum speed of around 10 Mbps. Therefore, this application utilizes channels 0 to 4 in MIPIDSI as multiple communication channels, and leverages the bidirectional nature of channel 0 in MIPIDSI as a dedicated communication channel to achieve bidirectional communication of touch data.

[0135] The timing controller 23 is configured to: receive a first mode switching signal from the system-on-a-chip 210, determine that the display panel has entered the display period, control the display driver module 221 to receive display data from the system-on-a-chip 210 through multiple communication channels, and use the display data to drive the sub-pixels in the display panel to work; receive a second mode switching signal from the system-on-a-chip 210, determine that the display panel has entered the blanking period, control the touch sensing module 222 to receive the raw touch data from the display panel, and send the processed touch data to the system-on-a-chip 210 through a dedicated communication channel.

[0136] The first mode switching signal is the signal for switching from LP mode to HS mode. For example, when the display panel enters the display period, the system-on-a-chip 210 sends a specific level sequence, such as LP11→LP01→LP00, through multiple communication channels and clock channels of the high-speed serial interface. After receiving the sequence, the timing controller 23 will switch to HS mode to prepare to receive high-speed display data.

[0137] The second mode switching signal is the signal for switching from HS mode to LP mode. For example, when the display data transmission is completed and the display panel enters the blanking period, the system-on-chip 210 sends an EoT (End of Transmission) signal and then enters the LP11 state. After receiving the corresponding signal, the timing controller 23 will also switch back to LP mode, preparing to send touch data to the system-on-chip 210.

[0138] Understandably, the data transmission rate of a dedicated communication channel during the display period is higher than that during the blanking period.

[0139] In one embodiment, the dedicated communication channel includes a control command frame and a data response frame. The control command frame is used by the system-on-chip 210 to send a sampling configuration instruction for the raw touch data to the integrated chip 220, and the data response frame is used by the integrated chip 220 to return touch data to the system-on-chip 210.

[0140] Specifically, the high-speed serial interface enables bidirectional transmission of touch data through a dedicated communication channel. This channel includes control command frames and data response frames. The control command frame sends touch sampling configuration instructions from the system-on-chip 210 to the integrated chip 220, causing the integrated chip 220 to collect raw touch data from the display panel. The data response frame returns touch data with a packet header identifier from the integrated chip 220 to the system-on-chip 210, enabling the system-on-chip 210 to perform corresponding operations based on the returned touch data. By time-division multiplexing the MIPIDSI interface in the dedicated communication channel of the high-speed serial interface, touch data is transmitted during the blanking period, avoiding conflicts with display data. Furthermore, bidirectional communication is achieved through a custom data packet format, and the interaction between control commands and data responses is realized through register mapping and protocol extensions.

[0141] During transmission, touch data may be corrupted due to electromagnetic interference (such as screen backlighting or external electric fields) or signal attenuation (such as coordinate shifts or data loss). The data response frame also includes a checksum field. After receiving the checksum field, the system-on-a-chip (SoC) 210 recalculates the checksum value and compares it with the field. If they match, the touch data is deemed complete and valid, and the corresponding touch operation is executed. If they do not match, the touch data transmission is deemed faulty, and the SoC 220 can be requested to retransmit the data, or the erroneous touch data can be ignored to avoid executing incorrect operations. This mechanism ensures the reliability of the touch data.

[0142] Specifically, a dedicated communication channel within the high-speed serial interface enables bidirectional communication and time-division multiplexing, allowing touch data and display data to share the same interface, reducing the number of system pins and lowering hardware costs. The division of labor between control command frames and data response frames enables dynamic configuration of touch parameters and accurate data feedback, ensuring the real-time performance and reliability of touch operations. The setting of verification fields effectively detects transmission errors, preventing touch misoperations caused by data loss or interference, thereby improving overall system stability and user experience.

[0143] In one embodiment, the timing control module 230 is configured to dynamically adjust the touch data in response to the bandwidth of the touch data being greater than the capacity of the blanking period.

[0144] Specifically, when the timing control module 230 detects that the bandwidth of the touch data exceeds the blanking period capacity during the touch data transmission process, it can effectively avoid the transmission interruption problem caused by data overflow during the blanking period by dynamically adjusting the transmission parameters of the touch data, ensuring that the touch data is reliably transmitted within the limited bandwidth. This enables the system to achieve stable transmission of touch data while maintaining display quality, reducing the risk of data delay or packet loss.

[0145] In one embodiment, the timing control module 230 dynamically adjusts the touch data, including reducing the touch reporting rate.

[0146] Specifically, during the data transmission process between touch and display, if the amount of touch data exceeds the preset capacity, the sampling frequency of the touch data can be adjusted. For example, the original sampling frequency of 120Hz can be reduced to 60Hz; or the original sampling frequency of 120Hz can be reduced to 70Hz; or the original sampling frequency of 120Hz can be reduced to 80Hz; or the original sampling frequency of 120Hz can be reduced to 90Hz, etc., to ensure that the touch data is transmitted within a limited time.

[0147] Of course, the sampling frequency should not be adjusted too much, and should be kept at least above 60Hz to avoid problems such as noticeable touch lag and increased probability of misoperation. For example, when users perform rapid swipes (such as page turning on a mobile phone or game operation) or precise clicks, a low reporting rate will cause the device to "not keep up" with the speed of finger movement; or, when clicking rapidly (such as double-tap to zoom in), the device may miss some click signals and misjudge them as "single clicks"; in competitive games (such as fighting games and parkour games), the response delay of button or swipe operations may directly affect the timing of the operation.

[0148] In another embodiment, the timing control module 230 dynamically adjusts the touch data, including controlling the touch sensing module 222 to enable a data compression algorithm.

[0149] The specific implementation of the data compression algorithm can employ existing technologies, which will not be elaborated here. For example, differential compression or quantization processing can be used to reduce data volume.

[0150] In another embodiment, the timing control module 230 dynamically adjusts the touch data, including: reducing the touch reporting rate; and in response to the fact that the bandwidth of the touch data after reducing the touch reporting rate is greater than the capacity of the blanking period, controlling the touch sensing module 222 to enable the data compression algorithm.

[0151] Specifically, if the original 120Hz sampling frequency is reduced to at least 60Hz, and the bandwidth of the touch data is still greater than the capacity of the blanking period, the timing control module 230 can further control the touch sensing module 222 to use a data compression algorithm to compress the touch data after reducing the touch reporting rate, so as to ensure that the touch data is transmitted within the blanking period.

[0152] When touch data transmission during the blanking period is detected to consume more bandwidth than the capacity threshold, the first step is to reduce the touch reporting rate to decrease the amount of data. For example, the sampling frequency may be reduced from 120Hz to a minimum of 60Hz. If the risk of bandwidth overflow still exists after this adjustment, the touch sensing module 222 is controlled to activate a data compression algorithm to compress the touch data, ensuring that the touch data is transmitted within the blanking period. This layered processing mechanism ensures reliable transmission of touch data within the limited bandwidth of the blanking period.

[0153] Specifically, by dynamically adjusting the transmission parameters of touch data, the resource contention between touch data transmission and display data transmission within the limited blanking period is effectively resolved, ensuring the real-time nature and integrity of touch information. The strategy of reducing the reporting rate directly reduces the amount of data, avoiding transmission congestion caused by data overflow, while maintaining the basic response speed of touch operations. The application of data compression algorithms optimizes data volume without significantly reducing touch accuracy, allowing more touch information to be accommodated within the transmission bandwidth of the blanking period.

[0154] Specifically, in the driving system 200 provided in this application, the transmission of display data and touch data between the system-on-a-chip 210 and the integrated chip 220 is realized by time-division multiplexing the same high-speed serial interface during the display period and the blanking period. This can effectively reduce the number of system pins and reduce connector costs, thereby simplifying the PCB layout and reducing the overall system complexity.

[0155] By employing a custom data packet format (packet header identifier) ​​and protocol extensions (dedicated communication channel), bidirectional data exchange can be achieved on a unidirectional DSI link, overcoming the physical limitations of the MIPIDSI interface. Furthermore, a data error detection mechanism implemented through a verification field ensures the reliability of touch data transmission, thereby improving the accuracy of touch operations.

[0156] Data compression algorithms and dynamic reporting rate adjustment mechanisms can ensure that the amount of touch data adapts to the capacity limit during the blanking period, thereby improving resource utilization efficiency.

[0157] See Figure 16 , Figure 16 This is a flowchart illustrating the driving method of one implementation method of this application.

[0158] This application also provides a driving method, including:

[0159] S1: During the display period, the control display driver module 221 receives display data from the system-on-a-chip 210 through a high-speed serial interface and uses the display data to drive the sub-pixels in the display panel to work.

[0160] S2: During the blanking period, the control touch sensing module 222 receives the raw touch data from the display panel and sends the processed touch data to the system-on-a-chip 210 through the high-speed serial interface.

[0161] Specifically, this driving method can be applied to the driving system of a display device, wherein the driving system includes, but is not limited to, the driving system 200 provided in any of the above embodiments. The driving system 200 includes a system-on-a-chip (SoC) 210 and an integrated chip 220. Taking the above driving system as an example, during the display period, the timing control module 230 controls the display driving module 221 to receive display data from the SoC 210 through a high-speed serial interface, and uses the display data to drive the sub-pixels in the display panel to work; and during the blanking period, the timing control module 230 controls the touch sensing module 222 to receive raw touch data from the display panel, and sends the processed touch data to the SoC 210.

[0162] Specifically, in the driving method provided in this application, by time-division multiplexing the high-speed serial interface transmission during the display period and the blanking period, both display data and touch data are transmitted between the integrated chip 220 and the system-on-a-chip 210 through the high-speed serial interface, which can effectively reduce the number of system pins and lower connector costs. In addition, using the blanking period to transmit the original touch data / touch data can avoid interference with normal display and improve system stability.

[0163] In one embodiment, step S1 specifically includes: in response to receiving a first mode switching signal from the system-on-a-chip 210, determining that the display panel has entered the display period, controlling the display driver module 221 to receive display data from the system-on-a-chip 210 through multiple communication channels in the high-speed serial interface, and using the display data to drive the sub-pixels in the display panel to work.

[0164] Step S2 specifically includes: in response to receiving the second mode switching signal from the system-on-a-chip 210, determining that the display panel has entered the blanking period, controlling the touch sensing module 222 to receive the raw touch data from the display panel, and sending the touch data obtained after processing the raw touch data to the system-on-a-chip 210 through a dedicated communication channel among multiple communication channels.

[0165] The first mode switching signal is the signal for switching from LP mode to HS mode. For example, when the display panel enters the display period, the system-on-a-chip 210 sends a specific level sequence, such as LP11→LP01→LP00, through multiple communication channels and clock channels of the high-speed serial interface. After receiving the sequence, the timing controller 23 will switch to HS mode to prepare to receive high-speed display data.

[0166] The second mode switching signal is the signal for switching from HS mode to LP mode. For example, when the display data transmission is completed and the display panel enters the blanking period, the system-on-chip 210 sends an EoT (End of Transmission) signal and then enters the LP11 state. After receiving the corresponding signal, the timing controller 23 will also switch back to LP mode, preparing to send touch data to the system-on-chip 210.

[0167] In HS mode, the transmission rate of the dedicated communication channel can reach Gbps; in LP mode, the maximum transmission rate of the dedicated communication channel is approximately 10Mbps. Therefore, the data transmission rate of the dedicated communication channel during the display period is higher than that during the blanking period, to ensure high-speed transmission of display data during the display period.

[0168] See Figure 17 , Figure 17 yes Figure 16 A flowchart illustrating one implementation of step S2. In one embodiment, the step of controlling the touch sensing module 222 to receive raw touch data from the display panel and sending the processed touch data to the system-on-a-chip 210 via a dedicated communication channel among multiple communication channels includes:

[0169] Step S21: In response to receiving a control command frame from the system-on-a-chip 210, control the touch sensing module 222 to receive raw touch data from the display panel.

[0170] Step S22: In response to the touch sensing module 222 processing the original touch data to obtain touch data, a data response frame is sent and the touch sensing module 222 is controlled to send the touch data to the system-on-a-chip 210 so that the system-on-a-chip 210 receives the returned touch data.

[0171] Specifically, the control command frame sends a touch sampling configuration instruction from the system-on-chip 210 to the integrated chip 220, causing the integrated chip 220 to collect raw touch data from the display panel. The data response frame returns touch data with a header identifier from the integrated chip 220 to the system-on-chip 210, thereby enabling the system-on-chip 210 to perform corresponding operations based on the returned touch data.

[0172] In one embodiment, the touch data obtained after processing the original touch data is sent to the system-on-a-chip 210. Specifically, this includes: processing the received original touch data using the second register 22201 in the touch sensing module 222 to obtain touch data with a header identifier, storing the touch data, and returning a data response frame and the touch data with a header identifier to the system-on-a-chip 210 during the blanking period.

[0173] Specifically, the second register 22201 can encapsulate the raw touch data received from the display panel and add a header identifier to indicate that the data stored in the second register 22201 is touch data after processing the raw touch data. The system-on-a-chip 210 can determine and extract the touch data in the second register 22201 by parsing the feature code in the header identifier.

[0174] Understandably, by adopting a register mapping scheme, bidirectional data exchange can be achieved on a unidirectional MIPIDSI link, enabling MIPIDSI to support bidirectional communication functions and meet the bidirectional interaction requirements of touch data.

[0175] In one embodiment, the touch data obtained after processing the original touch data is sent to the system-on-a-chip 210. The data response frame also includes a verification field. After receiving the verification field, the system-on-a-chip 210 will recalculate the verification value and compare it with the field. If they match, the touch data is determined to be complete and valid, and the corresponding touch operation is executed. If they do not match, the touch data transmission is determined to be erroneous. The system-on-a-chip 220 can be requested to retransmit the data, or the erroneous touch data can be ignored to avoid executing erroneous operations.

[0176] Specifically, the driving method provided in this application time-multiplexes the MIPIDSI interface through a dedicated communication channel in the high-speed serial interface, transmitting touch data during the blanking period. This avoids conflicts with display data, allowing touch data and display data to share the same interface, reducing the number of system pins and lowering hardware costs. Furthermore, bidirectional communication is achieved through a custom data packet format, and the interaction between control commands and data responses is realized through register mapping and protocol extensions. The setting of the verification field effectively detects transmission errors, preventing touch misoperations caused by data loss or interference, thereby improving the overall system stability and user experience.

[0177] In one embodiment, step S2 further includes: dynamically adjusting the touch data in response to the bandwidth of the touch data being greater than the capacity of the blanking period.

[0178] Specifically, when the timing control module 230 detects that the bandwidth of the touch data exceeds the blanking period capacity during the touch data transmission process, it can effectively avoid the transmission interruption problem caused by data overflow during the blanking period by dynamically adjusting the transmission parameters of the touch data, ensuring that the touch data is reliably transmitted within the limited bandwidth. This enables the system to achieve stable transmission of touch data while maintaining display quality, reducing the risk of data delay or packet loss.

[0179] In one embodiment, the step of dynamically adjusting the touch data includes: reducing the touch reporting rate.

[0180] Specifically, during the data transmission process between touch and display, if the amount of touch data exceeds the preset capacity, the sampling frequency of the touch data can be adjusted. For example, the original sampling frequency of 120Hz can be reduced to 60Hz; or the original sampling frequency of 120Hz can be reduced to 70Hz; or the original sampling frequency of 120Hz can be reduced to 80Hz; or the original sampling frequency of 120Hz can be reduced to 90Hz, etc., to ensure that the touch data is transmitted within a limited time.

[0181] It's important to note that the sampling frequency should not be adjusted too drastically; it should be kept at least above 60Hz to avoid noticeable touch lag and increased probability of misoperation. For example, when users perform rapid swipes (such as page turning on a phone or game operations) or precise clicks, a low reporting rate will cause the device to "not keep up" with the finger movement speed. Or, during rapid clicks (such as double-tap to zoom in), the device may miss some click signals and misjudge them as "single clicks." In competitive games (such as fighting games and parkour games), the response delay of button or swipe operations can directly affect the timing of operations.

[0182] In another embodiment, the step of dynamically adjusting the touch data includes: controlling the touch sensing module 222 to enable a data compression algorithm.

[0183] For example, specific implementations of data compression algorithms can employ differential compression or quantization to reduce data volume.

[0184] In another embodiment, the step of dynamically adjusting the touch data includes: reducing the touch reporting rate; and controlling the touch sensing module 222 to enable a data compression algorithm in response to the fact that the bandwidth of the touch data after reducing the touch reporting rate is greater than the capacity of the blanking period.

[0185] Specifically, if the bandwidth of the touch data obtained after reducing the sampling frequency is still greater than the capacity of the blanking period, the timing control module 230 can further control the touch sensing module 222 to use a data compression algorithm to compress the touch data after reducing the touch reporting rate, so as to ensure that the touch data is transmitted within the blanking period.

[0186] Specifically, by dynamically adjusting the transmission parameters of touch data, the resource contention between touch data transmission and display data transmission within the limited blanking period is effectively resolved, ensuring the real-time nature and integrity of touch information. The strategy of reducing the reporting rate directly reduces the amount of data, avoiding transmission congestion caused by data overflow, while maintaining the basic response speed of touch operations. The application of data compression algorithms optimizes data volume without significantly reducing touch accuracy, allowing more touch information to be accommodated within the transmission bandwidth of the blanking period.

[0187] Specifically, in the driving method provided in this application, the transmission of display data and touch data between the system-on-a-chip 210 and the integrated chip 220 is realized by time-division multiplexing the same high-speed serial interface during the display period and the blanking period. This can effectively reduce the number of system pins and reduce connector costs, thereby simplifying the PCB layout and reducing the overall system complexity.

[0188] Furthermore, by employing a custom data packet format (header identifier) ​​and protocol extensions (dedicated communication channel), bidirectional data exchange can be achieved on a unidirectional DSI link, overcoming the physical limitations of the MIPIDSI interface. Additionally, a data error detection mechanism implemented through a verification field ensures the reliability of touch data transmission, thereby improving the accuracy of touch operations.

[0189] Moreover, the data compression algorithm and dynamic reporting rate adjustment mechanism can ensure that the amount of touch data adapts to the capacity limit of the blanking period, thereby improving resource utilization efficiency.

[0190] See Figure 18 and Figure 19 , Figure 18 This is a schematic diagram of the structure of a display device according to one embodiment of this application; Figure 19 This is a schematic diagram of the structure of a display device according to another embodiment of this application.

[0191] This application also provides a display device 1000, including the display panel 100 provided in any of the above embodiments and the driving system 200 provided in any of the above embodiments.

[0192] The display panel 100 is electrically connected to the driving system 200. For example, the display panel 100 is electrically connected to the integrated chip 220 via a high-speed serial interface, and the transmission of display data and touch data (including raw touch data, touch sampling commands, etc.) between the display panel and the integrated chip 220 is achieved through the high-speed serial interface (such as MIPIDSI). Alternatively, the display panel 100 is electrically connected to the integrated chip 220 via a high-speed serial interface and I2C / SPI, and the transmission of display data is achieved through the high-speed serial interface and the transmission of touch data is achieved through I2C / SPI.

[0193] See also some possible implementations. Figure 20 , Figure 20 This is a schematic diagram of a display device according to another embodiment of this application. The display device 1000 includes the display panel 100 and the driving system 200 provided in any of the above embodiments. The display device 1000 may include devices with image processing capabilities, such as mobile phones, desktop computers, laptops, tablet computers, in-vehicle displays, wearable devices, etc. Because the display device 1000 includes the display panel 100 of this application, the reliability of the display device 1000 is higher.

[0194] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A driving method characterized by comprising: The method comprises the following steps: In the display period, the display driving module is controlled to receive display data from the system chip through the high-speed serial interface, and to drive the sub-pixels in the display panel using the display data; In the blanking period, the touch sensing module is controlled to receive original touch data from the display panel, and to send the touch data obtained by processing the original touch data to the system chip through the high-speed serial interface.

2. The driving method according to claim 1, wherein in response to receiving a first mode switching signal sent by the system chip, it is determined that the display panel enters the display period, and the display driving module is controlled to receive display data from the system chip through multiple communication channels in the high-speed serial interface, and to drive the sub-pixels in the display panel using the display data; in response to receiving a second mode switching signal sent by the system chip, it is determined that the display panel enters the blanking period, and the touch sensing module is controlled to receive original touch data from the display panel, and to send the touch data obtained by processing the original touch data to the system chip through a dedicated communication channel in the multiple communication channels; wherein the data transmission rate of the dedicated communication channel in the display period is higher than the data transmission rate of the dedicated communication channel in the blanking period.

3. The driving method according to claim 2, wherein The step of controlling the touch sensing module to receive original touch data from the display panel, and to send the touch data obtained by processing the original touch data to the system chip through a dedicated communication channel in the multiple communication channels, comprises: in response to receiving a control command frame sent by the system chip, the touch sensing module is controlled to receive original touch data from the display panel; in response to the touch sensing module obtaining the touch data by processing the original touch data, a data response frame is sent and the touch sensing module is controlled to send the touch data to the system chip, so that the system chip receives the returned touch data.

4. The driving method according to claim 1, wherein Further comprising: in response to the bandwidth of the touch data being greater than the capacity of the blanking period, dynamically adjusting the touch data.

5. The driving method according to claim 4, wherein The step of dynamically adjusting the touch data comprises: reducing the touch reporting rate; or controlling the touch sensing module to enable a data compression algorithm.

6. The driving method according to claim 4, wherein The step of dynamically adjusting the touch data comprises: reducing the touch reporting rate; and in response to the bandwidth of the touch data after reducing the touch reporting rate being greater than the capacity of the blanking period, controlling the touch sensing module to enable a data compression algorithm.

7. The driving method according to claim 5 or 6, wherein The step of reducing the touch reporting rate comprises: reducing the touch reporting rate to 60-90 Hz.

8. A drive system characterized by, The method comprises the following steps: a system chip; an integrated chip electrically connected to the system chip through a high-speed serial interface; the integrated chip comprises a display driving module, a touch sensing module, and a timing control module; wherein the timing control module is configured to: During the display period, the display driver module is controlled to receive display data from the system-on-a-chip through the high-speed serial interface, and to use the display data to drive the sub-pixels in the display panel to work. During the blanking period, the touch sensing module is controlled to receive raw touch data from the display panel, and the processed touch data is sent to the system-on-a-chip through the high-speed serial interface.

9. The drive system of claim 8, wherein, The display driver module is equipped with a first register, and the touch sensing module is equipped with a second register; The first register is used to store the display data; The second register is used to process the received raw touch data to obtain touch data with a header identifier, and to store the touch data; The system-on-a-chip obtains the touch data by recognizing the header identifier.

10. The drive system of claim 8, wherein, The high-speed serial interface is MIPIDSI.

11. Drive system according to any of claims 8-10, characterized in that The high-speed serial interface includes multiple communication channels, and the multiple communication channels include dedicated communication channels; The timing controller is configured as follows: The system receives a first mode switching signal from the system-on-a-chip, determines that the display panel has entered the display period, controls the display driver module to receive display data from the system-on-a-chip through multiple communication channels, and uses the display data to drive the sub-pixels in the display panel to work. The system receives a second mode switching signal from the system-on-a-chip, determines that the display panel has entered the blanking period, controls the touch sensing module to receive raw touch data from the display panel, and sends the processed touch data to the system-on-a-chip through the dedicated communication channel. The data transmission rate of the dedicated communication channel during the display period is higher than that during the blanking period.

12. The drive system of claim 11, wherein, The dedicated communication channel includes control command frames and data response frames. The control command frames are used by the system-on-a-chip to send sampling configuration instructions for the original touch data to the integrated chip, and the data response frames are used by the integrated chip to return the touch data to the system-on-a-chip.

13. The drive system according to claim 8, characterized in that, The timing control module is further configured to dynamically adjust the touch data in response to the bandwidth of the touch data being greater than the capacity of the blanking period.

14. The drive system of claim 13, wherein, The dynamic adjustment of the touch data includes: Reduce touch sampling rate; or The touch sensing module is controlled to enable a data compression algorithm.

15. The drive system of claim 13, wherein, The dynamic adjustment of the touch data includes: Reduce touch sampling rate; and In response to the fact that the bandwidth of the touch data after reducing the touch reporting rate is greater than the capacity of the blanking period, the touch sensing module is controlled to enable the data compression algorithm.

16. Drive system according to claim 14 or 15, characterized in that The reduction of touch signal reporting rate includes: The touch reporting rate is reduced to 60Hz-90Hz.

17. A display device comprising: include: Display panel; A driving system connected to the display panel, the driving system being used to execute the driving method according to any one of claims 1-7; Alternatively, the drive system may include the drive system described in any one of claims 8-16.

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