High-stability resistance paste and preparation method thereof

By combining modified aluminum nitride with nano-zirconia, the adhesion strength and thermal expansion suppression of the resistance paste are enhanced, solving the problem of unstable resistance value after multiple sinterings and realizing the preparation of highly stable resistance paste.

CN121122800BActive Publication Date: 2026-05-26长春长光启辰科技有限公司
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Patent Information

Application Number
CN202511668963.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-11-14
Publication Date
2026-05-26
Estimated Expiration
2045-11-14

AI Technical Summary

Technical Problem

Existing resistance pastes exhibit significant resistance variations after multiple sinterings due to thermal expansion coefficient mismatch. Furthermore, the contact between aluminum nitride and the glass binder phase may generate low-melting-point lead aluminate, reducing the stability of the resistance paste.

Method used

Modified aluminum nitride is used, which involves coating aluminum nitride powder with alumina and modifying it with an aminosilane coupling agent. Combined with nano-zirconia and tin dioxide, it enhances the adhesion strength with the glass bonding phase and suppresses thermal expansion fluctuations, thus avoiding interface peeling and resistivity drift.

Benefits of technology

It improves the stability of the resistance paste, suppresses the change in resistance value after multiple sinterings, enhances the stability of the conductor phase, and avoids instability problems caused by thermal expansion coefficient mismatch and lead oxide contact.

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Abstract

The application discloses a high-stability resistance paste and a preparation method thereof, and relates to the technical field of resistance paste, and comprises the following raw materials in parts by weight: 65-75 parts of a conductive phase, 30-35 parts of an organic carrier, 15-20 parts of a glass bonding phase and 2.5-3.5 parts of modified aluminum nitride. The modified aluminum nitride used in the application enhances the bonding strength of the glass bonding phase, avoids the decrease of the stability of the resistance paste conductor phase, and improves the resistance value stability of the resistance paste after multiple sintering.
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