Wafer edge flattening positioning device

Abstract

The application discloses a wafer flat edge positioning device and relates to the technical field of wafer manufacturing. The wafer flat edge positioning device can support a wafer body and complete flat edge positioning operation through cooperation of multiple load bearing shaft sleeves matched with the wafer body and a bottom driving roller. In the adjusting process, the height of the bottom driving roller can be automatically adjusted through cooperation of a driving assembly, the wafer body can be processed at the same time, the wear of the wafer body can be reduced, the bottom driving roller is separated from the flat edge after the wafer body is positioned, compared with a traditional operation mode, the wafer body can be positioned on the flat edge at the same time, the wear of the flat edge after positioning is avoided, the operation efficiency is ensured, and the application range of the equipment is further improved.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing technology, specifically to a wafer flat edge positioning device. Background Technology

[0002] In the wafer manufacturing process, the setting of the flat edge is closely related to the determination of the crystal orientation. The flat edge of the wafer, also known as the positioning edge, is determined by cutting one or more flat edges on the ingot before the silicon wafer is diced. This helps to accurately fix the position and orientation of the wafer in subsequent manufacturing processes, ensuring manufacturing quality and improving production efficiency. The crystal orientation and positioning edge of the wafer are very important for ensuring device performance and processing accuracy. Referring to Chinese patent, publication number: "CN118763041A" "Wafer Flat Edge Positioning Device", this patent points out that in the prior art, a suction pen is generally used to position the flat edge of the wafer, which easily causes problems such as imprint contamination and edge chipping on the silicon wafer surface, and the efficiency is low. Some also use direct insertion and placement of wafers, which involves large movements and large fluctuations in force, resulting in low positioning accuracy and easily leading to quality problems such as edge chipping and scratches on the silicon wafer. However, this equipment still has the problem of increasing the wear on the wafer surface during operation, affecting the operation effect and the scope of application. In response, we propose a wafer flat edge positioning device to solve the above problems. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a wafer flat edge positioning device, which solves the problems mentioned in the background section.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solution: a wafer flat edge positioning device, including a base frame and a holding frame, the holding frame being located on top of the base frame, a plurality of wafer bodies being placed inside the holding frame, and limiting components being provided on both sides of the inside of the holding frame for limiting the placement of the plurality of wafer bodies;

[0005] The base frame is equipped with a drive assembly, which is used to drive multiple wafer bodies to rotate inside the rack, thereby enabling the adjustment of the flat edges of the wafer bodies.

[0006] The limiting assembly includes concave limiting frames and side limiting shafts. There are multiple concave limiting frames, which are respectively installed on both sides of the inside of the holding rack. Both ends of the concave limiting frames are fixedly sleeved with limiting shafts, and multiple spherical guides are rotatably connected to the side of the limiting shafts near the wafer body. There are multiple side limiting shafts, which are installed at the lower side of multiple wafer bodies to support the wafer bodies.

[0007] The drive assembly includes a bottom drive roller, a positioning outer shaft fixedly installed inside the base frame, a drive inner shaft rod rotatably connected inside the positioning outer shaft, a limit rod rotatably connected inside the bottom drive roller, telescopic sleeve rods connected between the two ends of the limit rod and the positioning outer shaft, multiple transmission shaft rods installed inside the base frame, and a transmission track connected between the bottom drive roller, the drive inner shaft rod, and the corresponding transmission shaft rods to drive the bottom drive roller to achieve the driving operation of the wafer body.

[0008] Preferably, the outer side of the side limiting shaft is rotatably sleeved with multiple load-bearing shaft sleeves, which are in contact with the corresponding wafer body side to support the wafer body. Support shafts are fixedly installed at both ends of the side limiting shaft, which pass through the holding rack and are slidably connected to it. A spring body is sleeved on the outer side of the support shaft.

[0009] Preferably, an adjusting rod is slidably installed inside the base frame, and locking bolts are sleeved at both ends of the adjusting rod to lock the adjusting rod to the base frame. Multiple connecting parts are fixedly installed on the outside of the adjusting rod, and end sleeves are rotatably sleeved at both ends of multiple transmission shafts. Support springs are connected between the end sleeves and the corresponding connecting parts.

[0010] Preferably, a drive motor is fixedly installed inside the base frame, and a transmission belt is connected between the output end of the drive motor and the inner drive shaft, which is used to drive multiple bottom drive rollers through the cooperation of the inner drive shaft and the transmission belt.

[0011] Preferably, the mounting positions of the plurality of load-bearing bushings are respectively located directly below the plurality of concave limiting frames, for supporting and limiting the corresponding wafer body, and the load-bearing bushings on both sides and the side limiting shafts are kept symmetrical.

[0012] Preferably, the side limiting shaft is slidably connected to the serving rack through the cooperation of the two end support shafts, and the multiple support shafts are all installed obliquely on both sides of the inside of the serving rack.

[0013] Preferably, the holding rack has multiple adjustment slots and limiting slots on both sides, and each end of the multiple concave limiting frames is fixedly installed with an adjustment slide rod. The adjustment slide rod is slidably connected to the corresponding adjustment slot, and the end of the adjustment slide rod is sleeved with a positioning bolt for locking the position of the concave limiting frame.

[0014] Preferably, two limiting slide rods are fixedly installed at one end of the concave limiting frame near the adjusting slide rod, and the limiting slide rods are slidably connected inside the corresponding limiting groove.

[0015] Preferably, a cleaning frame is fixedly installed inside the base frame, a filter box is fixedly installed at the bottom of the base frame, and a negative pressure device that is in communication with each other is fixedly installed on the outside of the filter box. The negative pressure device and the cleaning frame are in communication with each other. The cleaning frame is used to collect and clean the tiny particles generated during the operation.

[0016] Preferably, the top surface of the cleaning rack is symmetrically provided with multiple cleaning slots.

[0017] This invention provides a wafer flat-edge positioning device. Compared with the prior art, it has the following advantages:

[0018] (1) The wafer flat edge positioning device, through the cooperation of multiple load-bearing bushings adapted to the wafer body and the bottom drive roller, can complete the support and flat edge positioning of the wafer body. During the adjustment process, the height of the bottom drive roller can be automatically adjusted through the cooperation of the drive components. It can be applied to the processing of different wafer bodies while reducing the wear on the wafer body. The bottom drive roller separates from the flat edge after the wafer body is positioned. Compared with the traditional operation method, it can achieve the flat edge positioning of the wafer body individually while avoiding continuous wear on the flat edge after positioning. It ensures the operation efficiency and further improves the applicability of the equipment.

[0019] (2) The wafer flat edge positioning device, through the setting of the concave limiting frame, can adjust the angle of the wafer body when limiting it by adjusting the sliding rod. On the one hand, it improves the applicability of the equipment. On the other hand, through the cooperation of the limiting bushing and the spherical guide, it can reduce the wear of the wafer body during the adjustment process and improve the protection effect of the wafer body. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 For the present invention Figure 1 Schematic diagram of cross-section structure;

[0022] Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A in the middle;

[0023] Figure 4 For the present invention Figure 2 Side view structural diagram;

[0024] Figure 5 This is a schematic diagram of the wafer body and concave retaining frame structure of the present invention;

[0025] Figure 6 This is a schematic diagram of the wafer body and driving component structure of the present invention;

[0026] Figure 7 For the present invention Figure 6 Enlarged structural diagram at point B;

[0027] Figure 8 For the present invention Figure 6 Side view structural diagram;

[0028] Figure 9 This is a schematic diagram of the positioning outer shaft and adjusting rod structure of the present invention;

[0029] Figure 10 This is a schematic diagram of the bottom drive roller and transmission shaft structure of the present invention.

[0030] In the diagram: 1. Base frame; 2. Container rack; 201. Adjustment slot; 202. Limiting slot; 3. Wafer body; 4. Concave limiting frame; 401. Adjustment slide rod; 402. Limiting slide rod; 403. Positioning bolt; 5. Limiting bushing; 501. Spherical guide; 6. Side limiting shaft; 601. Load-bearing bushing; 7. Support shaft; 701. Spring body; 8. Positioning outer shaft; 801. Drive inner shaft; 9. Drive motor; 901. Transmission belt; 10. Transmission track; 11. Bottom drive roller; 111. Limiting rod; 112. Telescopic sleeve rod; 12. Adjusting rod; 121. Connecting piece; 122. Locking bolt; 13. Transmission shaft; 131. End bushing; 132. Support spring; 14. Cleaning rack; 141. Cleaning slot; 15. Filter box; 151. Negative pressure device. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Please see Figures 1-8 The present invention provides two technical solutions, specifically including the following embodiments:

[0033] Example 1:

[0034] In this embodiment of the invention, a wafer flat edge positioning device includes a base frame 1 and a holding rack 2. The holding rack 2 is located on top of the base frame 1. Multiple wafer bodies 3 are placed inside the holding rack 2. Limiting components are provided on both sides of the inside of the holding rack 2 for limiting the placement of the multiple wafer bodies 3.

[0035] In this embodiment of the invention, a drive assembly is installed inside the base frame 1. The drive assembly is used to drive multiple wafer bodies 3 to rotate inside the holding rack 2, thereby realizing the adjustment of the flat edge of the wafer body 3.

[0036] In this embodiment of the invention, the limiting component includes a concave limiting frame 4 and a side limiting shaft 6. There are multiple concave limiting frames 4, which are respectively installed on both sides of the inside of the holding rack 2. Both ends of the concave limiting frame 4 are fixedly sleeved with limiting shaft sleeves 5, and multiple spherical guides 501 are rotatably connected to the side of the limiting shaft sleeves 5 near the wafer body 3. There are multiple side limiting shafts 6, which are respectively installed below the side of multiple wafer bodies 3, and are used to support the wafer bodies 3.

[0037] In this embodiment of the invention, by setting the concave limiting frame 4, when the wafer body 3 is placed inside the holding rack 2, the two limiting bushings 5 ​​at the end of the concave limiting frame 4 can be located on both sides of the wafer body 3, thereby realizing the limiting operation of the wafer body 3. With the cooperation of the spherical guide 501, when the wafer body 3 is rotated and adjusted, the spherical guide 501 contacts the wafer body 3, thereby reducing the friction force on the wafer body 3 and improving the protection effect of the wafer body 3.

[0038] In this embodiment of the invention, the driving assembly includes a bottom driving roller 11, a positioning outer shaft 8 is fixedly installed inside the base frame 1, a driving inner shaft rod 801 is rotatably connected inside the positioning outer shaft 8, a limiting rod 111 is rotatably connected inside the bottom driving roller 11, a telescopic sleeve rod 112 is connected between the two ends of the limiting rod 111 and the positioning outer shaft 8, a plurality of transmission shaft rods 13 are installed inside the base frame 1, and a transmission track 10 is connected between the bottom driving roller 11, the driving inner shaft rod 801 and the corresponding transmission shaft rods 13 to drive the bottom driving roller 11 to run and realize the driving operation of the wafer body 3;

[0039] In this embodiment of the invention, a plurality of load-bearing bushings 601 are rotatably sleeved on the outer side of the side limiting shaft 6. The load-bearing bushings 601 are in contact with the corresponding side of the wafer body 3 and are used to support the wafer body 3. Support shafts 7 are fixedly installed at both ends of the side limiting shaft 6. The support shafts 7 pass through the holding rack 2 and are slidably connected to it. A spring body 701 is sleeved on the outer side of the support shaft 7.

[0040] In this embodiment of the invention, when the wafer body 3 is placed inside the holding rack 2, its bottom can contact the corresponding load-bearing bushing 601, so that the load-bearing bushing 601 and the side limiting rod 6 are subjected to force and slide along the installation direction of the support rod 7, thereby making it suitable for limiting wafer bodies 3 of different sizes.

[0041] In this embodiment of the invention, the transmission shaft 13 is used to adjust the height of the bottom drive roller 11, so that the bottom drive roller 11 can be adapted to drive operations for wafer bodies 3 of different sizes.

[0042] In this embodiment of the invention, when the transmission shaft 13 moves toward the side closer to the bottom drive roller 11, the bottom drive roller 11 can move upward through the cooperation of the telescopic sleeve 112 and the transmission track 10. When the transmission shaft 13 moves away from the side away from the bottom drive roller 11, the bottom drive roller 11 can move downward through the cooperation of the telescopic sleeve 112 and the transmission track 10, thereby realizing the height adjustment of the transmission shaft 13.

[0043] In this embodiment of the invention, a spring is installed inside the telescopic sleeve 112, which is used to support the bottom drive roller 11 through the cooperation of the limiting rod 111.

[0044] In this embodiment of the invention, when the bottom drive roller 11 is adjusting its position, after the wafer body 3 is placed inside the holding rack 2, the height of the bottom drive roller 11 is adjusted by the transmission shaft rod 13 so that the outer surface of the bottom drive roller 11 is kept at a distance from the flat edge of the wafer body 3. This ensures the accuracy of the subsequent position adjustment of the wafer body 3 and avoids wear on the flat edge of the wafer body 3 caused by the operation of the bottom drive roller 11 after the position adjustment of the wafer body 3 is completed.

[0045] In this embodiment of the invention, an adjusting rod 12 is slidably installed inside the base frame 1. Both ends of the adjusting rod 12 are fitted with locking bolts 122 for locking the adjusting rod 12 to the base frame 1. Multiple connecting pieces 121 are fixedly installed on the outside of the adjusting rod 12. Both ends of multiple transmission shafts 13 are rotatably fitted with end bushings 131. A support spring 132 is connected between the end bushings 131 and the corresponding connecting pieces 121.

[0046] In this embodiment of the invention, when adjusting the position of the transmission shaft 13, the adjusting rod 12 can be loosened by locking bolt 122, and then the position of the adjusting rod 12 can be adjusted so that the transmission shaft 13 can complete the position adjustment through the corresponding connecting piece 121 and the support spring 132;

[0047] In this embodiment of the invention, the support spring 132 is used to enable the bottom drive roller 11 to automatically adjust its height during operation, thereby reducing wear on the wafer body 3. The working process is as follows: when the wafer body 3 is placed inside the holding rack 2, the outer edge of the wafer body 3 contacts the top of the bottom drive roller 11. At this time, the bottom drive roller 11 is compressed by the limit rod 111, which compresses the telescopic sleeve rod 112. At this time, through the cooperation of the transmission track 10, the transmission shaft rod 13 moves towards the side closer to the support spring 132. When the wafer body 3 rotates to the flat edge position and contacts the bottom drive roller 11, the bottom drive roller 11 can move upward by the reduced pressure and the cooperation of the telescopic sleeve rod 112. At this time, through the cooperation of the transmission track 10, the transmission shaft rod 13 can move away from the support spring 132 until the bottom drive roller 11 separates from the flat edge of the wafer body 3, completing the position adjustment. At this time, the bottom drive roller 11 reaches the initial position.

[0048] In this embodiment of the invention, a drive motor 9 is fixedly installed inside the base frame 1. A transmission belt 901 is connected between the output end of the drive motor 9 and the drive inner shaft 801, which is used to drive multiple bottom drive rollers 11 to run through the cooperation of the drive inner shaft 801 and the transmission track 10.

[0049] In this embodiment of the invention, specifically, the drive motor 9 is an existing device used to drive the inner shaft 801 to run through the cooperation of the transmission belt 901;

[0050] In this embodiment of the invention, the mounting positions of the multiple load-bearing bushings 601 are respectively located directly below the multiple concave limiting frames 4, which are used to support and limit the corresponding wafer body 3, and the load-bearing bushings 601 on both sides and the side limiting shafts 6 are kept symmetrical.

[0051] In this embodiment of the invention, the installation positions of the load-bearing bushing 601 and the concave limiting bracket 4 correspond to each other, which is used to ensure the placement stability of the wafer body 3 and the subsequent adjustment stability.

[0052] In this embodiment of the invention, the side limiting shaft 6 is slidably connected to the holding rack 2 through the cooperation of the two end support shafts 7, and the multiple support shafts 7 are all installed obliquely on both sides of the inside of the holding rack 2;

[0053] In this embodiment of the invention, bolts are connected to the outer sides of multiple support shafts 7. The bolts are existing components and are not shown in the figure. The bolts are used to limit the sliding distance of the support shafts 7 inside the holding rack 2, and thus limit the maximum descent distance of the wafer body 3 according to different sizes of wafer bodies 3, so as to avoid affecting the operation of the subsequent bottom drive roller 11.

[0054] In this embodiment of the invention, multiple adjustment slots 201 and limiting slots 202 are respectively provided on both sides of the holding rack 2. Adjustment slide rods 401 are fixedly installed at the ends of multiple concave limiting frames 4. The adjustment slide rods 401 are slidably connected to the corresponding adjustment slots 201. The ends of the adjustment slide rods 401 are sleeved with positioning bolts 403 for locking the position of the concave limiting frames 4. The concave limiting frames 4 can adjust the angle when limiting different wafer bodies 3 through the cooperation of the adjustment slide rods 401. On the one hand, it improves the applicability of the equipment. On the other hand, through the cooperation of the limiting bushings 5 ​​and the spherical guides 501, it can reduce the wear of the wafer body 3 during the adjustment process and improve the protection effect of the wafer body 3.

[0055] In this embodiment of the invention, multiple load-bearing bushings 601 adapted to the wafer body 3 and the bottom drive roller 11 can complete the support and flat edge positioning of the wafer body 3. During the adjustment process, the height of the bottom drive roller 11 can be automatically adjusted through the cooperation of the drive components. This can be applied to the processing of different wafer bodies 3 while reducing friction on the wafer body 3. After the wafer body 3 is positioned, the bottom drive roller 11 separates from the flat edge. Compared with the traditional operation method, the flat edge positioning of the wafer body 3 can be completed independently, avoiding continuous wear on the flat edge after positioning. This ensures work efficiency and further improves the applicability of the equipment.

[0056] Two limiting slide rods 402 are fixedly installed at one end of the concave limiting bracket 4 near the adjusting slide rod 401. The limiting slide rods 402 are slidably connected inside the corresponding limiting groove 202.

[0057] Example 2: Based on Example 1, a cleaning frame 14 is fixedly installed inside the base frame 1, a filter box 15 is fixedly installed at the bottom of the base frame 1, and a negative pressure device 151 that is interconnected is fixedly installed on the outside of the filter box 15. The negative pressure device 151 and the cleaning frame 14 are interconnected. The cleaning frame 14 is used to collect and clean the tiny particles generated during the operation.

[0058] In this embodiment of the invention, the top surface of the cleaning rack 14 is symmetrically provided with a plurality of cleaning slots 141;

[0059] By setting up the cleaning rack 14, the negative pressure device 151 can be turned on when the equipment is running, and the tiny particles and impurities generated during the operation can be extracted through the cleaning slot 141 and then collected through the filter box 15, which ensures the effect of subsequent operations and improves the ease of equipment maintenance.

[0060] In this embodiment of the invention, the filter box 15 is equipped with a filter cotton core, which will not be described in detail here.

[0061] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0062] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the present invention should still fall within the scope of the present invention.

Claims

1. A wafer flat-edge positioning device, comprising a base frame (1) and a holding rack (2), characterized in that: The rack (2) is located on top of the base frame (1). Multiple wafer bodies (3) are placed inside the rack (2). Limiting components are provided on both sides of the rack (2) to limit the placement of the multiple wafer bodies (3). The base frame (1) is equipped with a drive assembly, which is used to drive multiple wafer bodies (3) to rotate inside the holding rack (2) to achieve the adjustment of the flat edge of the wafer body (3); The limiting assembly includes a concave limiting frame (4) and a side limiting shaft (6). There are multiple concave limiting frames (4) and they are installed on both sides of the inside of the holding rack (2). Both ends of the concave limiting frame (4) are fixedly sleeved with limiting bushings (5). The side of the limiting bushings (5) near the wafer body (3) is rotatably connected with multiple spherical guides (501). There are multiple side limiting shafts (6) and they are installed at the lower side of multiple wafer bodies (3) to support the wafer body (3). The drive assembly includes a bottom drive roller (11), a positioning outer shaft (8) is fixedly installed inside the base frame (1), a drive inner shaft rod (801) is rotatably connected inside the positioning outer shaft (8), a limit rod (111) is rotatably connected inside the bottom drive roller (11), a telescopic sleeve rod (112) is connected between the two ends of the limit rod (111) and the positioning outer shaft (8), a plurality of transmission shaft rods (13) are installed inside the base frame (1), and a transmission track (10) is connected between the bottom drive roller (11), the drive inner shaft rod (801) and the corresponding transmission shaft rod (13) to drive the bottom drive roller (11) to run and realize the drive operation of the wafer body (3); Multiple load-bearing bushings (601) are rotatably sleeved on the outer side of the side limiting shaft (6). The load-bearing bushings (601) are in contact with the side of the corresponding wafer body (3) to support the wafer body (3). Support shafts (7) are fixedly installed at both ends of the side limiting shaft (6). The support shafts (7) pass through the container (2) and are slidably connected to it. A spring body (701) is sleeved on the outer side of the support shaft (7). An adjusting rod (12) is slidably installed inside the base frame (1). Both ends of the adjusting rod (12) are fitted with locking bolts (122) to lock the adjusting rod (12) to the base frame (1). Multiple connecting pieces (121) are fixedly installed on the outside of the adjusting rod (12). Both ends of multiple transmission shafts (13) are rotatably fitted with end bushings (131). A support spring (132) is connected between the end bushings (131) and the corresponding connecting pieces (121). The holding rack (2) has multiple adjustment slots (201) and limiting slots (202) on both sides. The ends of the multiple concave limiting frames (4) are fixedly installed with adjustment slide rods (401). The adjustment slide rods (401) are slidably connected to the corresponding adjustment slots (201). The ends of the adjustment slide rods (401) are sleeved with positioning bolts (403) to lock the position of the concave limiting frames (4). Two limiting slide rods (402) are fixedly installed at one end of the concave limiting frame (4) near the adjusting slide rod (401), and the limiting slide rods (402) are slidably connected inside the corresponding limiting slot (202).

2. The wafer flat edge positioning device according to claim 1, characterized in that: The base frame (1) is fixedly installed with a drive motor (9). The output end of the drive motor (9) is connected to the drive inner shaft (801) by a transmission belt (901), which is used to drive multiple bottom drive rollers (11) through the cooperation of the drive inner shaft (801) and the transmission track (10).

3. The wafer flat edge positioning device according to claim 1, characterized in that: The mounting positions of the multiple load-bearing bushings (601) are located directly below the multiple concave limiting frames (4) to support and limit the corresponding wafer body (3). The load-bearing bushings (601) on both sides and the side limiting shafts (6) are kept symmetrical.

4. The wafer flat edge positioning device according to claim 3, characterized in that: The side limiting shaft (6) is slidably connected to the serving rack (2) through the cooperation of the two end support shafts (7), and the multiple support shafts (7) are all installed at an angle on both sides inside the serving rack (2).

5. A wafer flat-edge positioning device according to claim 1, characterized in that: A cleaning rack (14) is fixedly installed inside the base frame (1). A filter box (15) is fixedly installed at the bottom of the base frame (1). A negative pressure device (151) is fixedly installed on the outside of the filter box (15). The negative pressure device (151) and the cleaning rack (14) are interconnected. The cleaning rack (14) is used to collect and clean the tiny particles generated during operation.

6. The wafer flat edge positioning device according to claim 5, characterized in that: The top surface of the cleaning rack (14) is symmetrically provided with multiple cleaning slots (141).

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