Integrated busbar and processing method thereof

Abstract

The invention relates to the technical field of integrated busbars, and discloses an integrated busbar and a processing method thereof. The integrated busbar comprises a bottom UV film, a busbar, an upper UV film, a PCB (printed circuit board) and a plurality of tinned copper wires, the bottom layer UV film and the upper layer UV film respectively clamp and wrap the peripheral sides of a plurality of tinned copper wires, each tinned copper wire is provided with a plurality of conductive wires extending out of a coverage area of the upper layer UV film, and one end of each tinned copper wire is connected with the PCB cluster board; the busbars are fixed on the bottom layer UV film, the busbars are located on the two sides of the upper layer UV film and the tinned copper wire respectively, and the electric leads are connected with the corresponding busbars respectively. According to the integrated busbar, the structure of the existing integrated busbar is simplified, and compared with a traditional complex busbar production process, the production process is simpler, and the production efficiency is high. And due to structure simplification and material optimization (such as use of a UV film and the like), the production cost can be reduced to a certain extent, and the market competitiveness of the product is improved.

Description

Technical Field

[0001] This application relates to the technical field of integrated busbars, and in particular to an integrated busbar and its processing method. Background Technology

[0002] With the rapid development of the new energy market, the demand for power and energy storage batteries is showing a continuous upward trend. In the process of researching and developing battery-related technologies such as integrated busbars, it was found that existing integrated busbars fall into several types, including vacuum-formed integrated busbars, injection-molded integrated busbars, and hot-pressed integrated busbars. These structures are relatively thick and heavy, requiring a lot of space.

[0003] However, existing technologies also have some problems. For example, due to the complexity of the process, defective products are prone to occur during production, which not only increases production costs but also prolongs the production cycle. In addition, the existing FPC production process is relatively complex, resulting in low production efficiency and high costs.

[0004] To address these issues, researchers need to improve existing integrated busbar structures and optimize their processing methods to effectively increase production efficiency and reduce production costs. Summary of the Invention

[0005] The technical problem to be solved by this application is to improve the existing integrated busbar structure and optimize its processing method, thereby effectively improving production efficiency and reducing production costs.

[0006] In a first aspect, to address the aforementioned problems, this application provides an integrated busbar, comprising a bottom UV film, a busbar, an upper UV film, a PCB cluster, and a plurality of tin-plated copper wires; in the radial direction of the upper UV film, the width of the upper UV film is smaller than the width of the bottom UV film; the plurality of tin-plated copper wires are all wrapped between the bottom UV film and the upper UV film, one end of each tin-plated copper wire is signal-connected to the PCB cluster; the other end of each tin-plated copper wire has a conductive wire bent radially along the upper UV film, and the conductive wire is signal-connected to the busbar; the busbar is fixed to the bottom UV film.

[0007] Preferably, the bottom UV film has a bottom UV adhesive layer on one side for fixing the top UV film, and the top UV film has an upper UV adhesive layer on one side for fixing the bottom UV film.

[0008] Preferably, the busbar includes multiple aluminum busbars, which are arranged on both sides of the upper UV film and the tinned copper wire, and each of the conductive wires is connected to one of the aluminum busbars.

[0009] Preferably, the bottom UV film has several through holes, and each aluminum busbar is fixed at one of the through holes.

[0010] Preferably, the integrated busbar also includes a temperature sensor, which is fixed on the bottom UV film, and the busbar has a clearance groove in which the temperature sensor is located.

[0011] Preferably, the temperature sensor is an NTC thermistor temperature sensor.

[0012] Secondly, this application provides a method for processing an integrated busbar, used to manufacture the integrated busbar described in the first aspect above, the method comprising:

[0013] S1. The tin-plated copper wire is fixed on the bottom UV film by an automatic wiring machine. The wiring machine can automatically feed and cut the wire according to the design line and arrange the tin-plated copper wire into multiple conductive lines.

[0014] S2. Place the temperature sensor and busbar at the corresponding window positions punched out by the bottom UV film, and pre-fix them by bonding with the UV adhesive layer on the bottom UV film.

[0015] S3. Cover and fix the upper UV film onto the tin-plated copper wire, and extend multiple conductive lines out of the coverage area of ​​the upper UV film.

[0016] S4. The temperature sensor, busbar, and tinned copper wire are cold-pressed and fixed to the bottom UV film through a cold pressing process.

[0017] S5. The bottom UV film and the top UV film are cured by UV light irradiation, so that the temperature sensor, busbar and tinned copper wire are completely fixed.

[0018] S6. Each conductive wire is ultrasonically welded and fixed to the aluminum busbar.

[0019] S7. Solder the temperature sensor to the tinned copper wire to fix it in place;

[0020] S8. The tin-plated copper wire is fixedly connected to the PCB board through a through-hole pulse soldering process.

[0021] Preferably, it also includes: step S9, welding performance testing: using AVI automatic visual inspection to detect the ultrasonic solder joints of the tinned copper wire and the bus.

[0022] Preferably, the method further includes: step S10, functional performance testing; energizing the integrated busbar and testing its conductivity and insulation withstand voltage performance.

[0023] Preferably, the cold pressing parameters in step S4 are: temperature 10-30℃, pressing time 2-3 min, and pressure 0.3-0.5 MPa.

[0024] Compared with the prior art, this application includes at least one of the following beneficial technical effects:

[0025] Current flows in from the busbar and enters the tinned copper wire through the connection between the bottom UV film and the tinned copper wire. As the core conductive component, the tinned copper wire transmits current from the busbar to the PCB board. At the same time, the tinned copper wire has multiple conductive lines extending out of the upper UV film coverage area. These conductive lines distribute the current to different circuit branches, thereby achieving efficient transmission and distribution of electrical energy.

[0026] Compared to existing integrated busbar structures, this integrated busbar is thinner and lighter. Its combination of a bottom UV film, tinned copper wires, busbars, an upper UV film, and a PCB cluster allows it to better adapt to space-constrained environments. For example, in the battery packs of electric vehicles, the compact battery arrangement makes space extremely valuable; this thin busbar effectively utilizes limited space, increasing the integration of the battery pack. Tinned copper wires have excellent conductivity, reducing energy loss during current transmission and improving power transmission efficiency. Simultaneously, the design of multiple conductive lines allows for multi-branch current distribution, meeting the power needs of different circuit components and ensuring the stable operation of the entire system. This integrated busbar simplifies existing integrated busbar structures; compared to traditional complex busbar manufacturing processes, its production process is simpler and more efficient. Furthermore, due to structural simplification and material optimization (such as the use of UV film), production costs can be reduced to some extent, improving the product's market competitiveness. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the overall structure of the integrated busbar in Embodiment 1 of this application.

[0029] Figure 2 This is an exploded view of the integrated busbar in Embodiment 1 of this application.

[0030] Figure 3 This is a process flow diagram of the processing method for the integrated busbar in Embodiment 2 of this application.

[0031] Explanation of reference numerals in the attached diagram: 1. Bottom UV film; 11. Through hole; 2. Tinned copper wire; 21. Conductive wire; 3. Busbar; 31. Aluminum busbar; 32. Clearance groove; 4. Top UV film; 5. PCB board; 6. Temperature sensor. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0034] It should also be understood that the terminology used in this application specification is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this application specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0035] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0036] Example 1

[0037] Please refer to Figure 1 and Figure 2 Embodiment 1 of this application provides an integrated busbar that simplifies the existing integrated busbar structure. This integrated busbar is thinner and lighter, making it more suitable for scenarios with limited space. The integrated busbar includes a bottom UV film 1, a busbar 3, an upper UV film 4, a PCB board 5, and several tin-plated copper wires 2.

[0038] Specifically, in the radial direction of the upper UV film 4, the width of the upper UV film 4 is smaller than the width of the lower UV film 1. Several tin-plated copper wires 2 are wrapped between the lower UV film 1 and the upper UV film 4, with one end of each tin-plated copper wire 2 connected to the PCB board 5 for signal connection. The other end of each tin-plated copper wire 2 has a conductive line 21 bent radially along the upper UV film 4, and this conductive line 21 is connected to the busbar 3 for signal connection. The busbar 3 is fixed to the lower UV film 1.

[0039] The main function of this integrated busbar is to transmit and distribute current. Current flows in from busbar 3 and enters the tinned copper wire 2 through the connection between the bottom UV film 1 and the tinned copper wire 2. The tinned copper wire 2, as the core conductive component, transmits current from busbar 3 to the PCB cluster 5. Simultaneously, the other end of the tinned copper wire 2 has conductive lines 21 that are radially bent along the upper UV film 4. These conductive lines 21 distribute the current to different circuit branches, thereby achieving efficient transmission and distribution of electrical energy. Furthermore, the PCB cluster 5 can receive and send control signals. For example, in a battery management system, the PCB cluster 5 receives signals such as temperature and voltage from the battery through the conductive lines 21, and can also send control signals to the battery, such as charging or discharging control signals, thereby achieving monitoring and management of the entire battery system.

[0040] The bottom UV film 1 and the top UV film 4 respectively clamp and fix the tin-plated copper wire 2. In terms of insulation, the UV film has good insulation properties, which can effectively prevent current leakage and ensure the safe transmission of current within the tin-plated copper wire 2. In terms of structural fixation, the UV film plays the role of fixing the tin-plated copper wire 2, keeping it in a stable position inside the device, and avoiding short circuits or poor contact caused by wire displacement due to vibration or other external forces. Here, by using a new UV film pressing process to replace the traditional hot-pressing insulating film, blister bracket, and injection-molded bracket integrated busbar assembly process, and by using tin-plated copper wire for wiring, replacing the existing numerous processes such as FPC etching, SMT, and laser welding, the integrated busbar structure is simpler, reducing assembly steps and the number of parts, thus having advantages such as improved production efficiency and cost savings.

[0041] Compared to traditional vacuum-formed integrated busbars with vacuum-formed supports and injection-molded integrated busbars with injection-molded supports, the UV insulating film has a thinner and lighter structure, making it better suited for space-constrained environments. For example, inside electric vehicle battery packs, the compact battery arrangement makes space extremely valuable; this thin busbar effectively utilizes limited space, increasing the integration of the battery pack. The tin-plated copper wire 2 has excellent conductivity, reducing energy loss during current transmission and improving power transmission efficiency. Simultaneously, the design of the conductive wire 21 allows for multi-branch current distribution, meeting the power needs of different circuit components and ensuring the stable operation of the entire system. This integrated busbar simplifies existing integrated busbar structures; compared to traditional complex busbar manufacturing processes, its production process is simpler and more efficient. Furthermore, due to structural simplification and material optimization (such as the use of UV film), production costs can be reduced to some extent, enhancing the product's market competitiveness.

[0042] In this embodiment, the bottom UV film 1 and the top UV film 4 are single-sided insulating cold-pressed UV adhesive films in the prior art, such as the patent document with publication number CN119875557A. Therefore, the specific components of the bottom UV film 1 and the top UV film 4 will not be described in detail. During the production process, this UV adhesive film is tightly bonded to the tin-plated copper wire 2 and other components through a cold pressing process.

[0043] In battery systems, the single-sided insulating UV film plays a crucial role in insulation and protection, preventing current leakage and short circuits. Its insulating layer effectively blocks the flow of current between different conductive components, ensuring that electrical energy is transmitted along a predetermined path. Meanwhile, the other side of the UV film can work in conjunction with other structural components or insulating materials within the battery pack to form a complete electrical insulation system.

[0044] In one specific embodiment, the bottom UV film 1 has a bottom UV adhesive layer on one side for fixing the top UV film 4, and the top UV film 4 has an upper UV adhesive layer on one side fixed to the bottom UV film 1.

[0045] The bottom and top UV adhesive layers are fixed to the busbar 3 and tinned copper wire 2 by UV light irradiation and room temperature, eliminating the need for traditional hot-pressing equipment. Compared to structures without UV adhesive layers, this integrated busbar will not experience loosening or delamination between layers during long-term use. For example, during the frequent bumpy driving of an electric vehicle, the busbar can still remain stable, and the internal wire connections will not loosen or the insulation layer will detach due to vibration, thereby improving the service life and reliability of the busbar.

[0046] In addition, UV adhesive possesses excellent insulation properties. In high-voltage, high-current battery systems or other electrical equipment, good insulation is crucial for ensuring safe operation. This enhanced insulation allows equipment to operate under safer conditions, reducing malfunctions and safety accidents caused by insulation problems, such as electric shock and fire. Even in special circumstances, such as minor damage to the UV film or slight displacement of the tinned copper wire 2, the UV adhesive layer can still provide a certain degree of insulation, preventing current leakage or short circuits between different conductive components.

[0047] In one specific embodiment, the busbar 3 includes multiple aluminum busbars 31. The aluminum busbars 31 are arranged on both sides of the upper UV film 4 and the tin-plated copper wire 2, and the conductive wires 21 of the tin-plated copper wire 2 bent radially along the upper UV film 4 are respectively connected to one aluminum busbar 31.

[0048] When current enters the aluminum busbar 31 of busbar 3 from an external power source or battery, the current is collected by the aluminum busbar 31 and then transmitted to the tin-plated copper wire 2 via the connected conductive wire 21. The tin-plated copper wire 2 then distributes the current to different circuit components, such as the PCB board 5, to realize the function of power transmission and distribution. The arrangement of the aluminum busbar 31 and the relative positions of the upper UV film 4 and the tin-plated copper wire 2 allow the entire busbar 3 structure to adapt to certain mechanical and thermal stresses. During equipment operation, such as temperature changes or vibrations, it can still maintain a good connection state and ensure stable current transmission.

[0049] Aluminum is a metallic material with excellent electrical conductivity and low resistivity. Using a busbar 3 composed of multiple aluminum busbars 31 effectively reduces energy loss during current collection and transmission. Since the busbar 3 comprises multiple aluminum busbars 31, and each conductive line 21 is connected to one aluminum busbar 31, this design provides excellent scalability for the integrated busbar. If it is necessary to increase the current transmission capacity or change the current distribution method, this can be achieved by increasing or decreasing the number of aluminum busbars 31 and adjusting the connection method of the conductive lines 21. At the same time, this flexible design facilitates application in electrical equipment of different specifications and layouts, adapting to various complex spatial and electrical connection requirements.

[0050] Furthermore, the bottom UV film 1 has several through holes 11, and each aluminum busbar 31 is fixed at the through hole 11.

[0051] The through-holes 11 in the bottom UV film 1 provide precise positioning for the installation of the aluminum busbars 31. Each aluminum busbar 31 is fixed at one of the through-holes 11, typically through mechanical connections (such as bolts, welding, etc.) and adhesives. Mechanical connections provide stable physical support, ensuring that the aluminum busbars 31 do not shift within the integrated busbar. Simultaneously, the contact between the aluminum busbar 31 and the bottom UV film 1 at the through-holes 11 provides a stable electrical connection point for current transmission (e.g., connecting battery tabs). Current can be further conducted through the contact area between the aluminum busbar 31 and the bottom UV film 1 to other conductive components such as the tinned copper wire 2, enabling current transmission between different parts within the busbar.

[0052] In one specific embodiment, the integrated busbar further includes a temperature sensor 6. The temperature sensor 6 is fixed to the upper surface of the underlying UV film 1, and the busbar 3 has a clearance groove 32, within which the temperature sensor 6 is located. In this embodiment, each aluminum busbar 31 has two clearance grooves 32 on the side closest to the tin-plated copper wire 2; two temperature sensors 6 are provided, each located within one of the two clearance grooves 32. In other embodiments, the number of temperature sensors 6 can be set according to actual needs, and they are respectively disposed within the clearance grooves 32 of the aluminum busbar 31.

[0053] Furthermore, the temperature sensor 6 is an NTC thermistor temperature sensor. This integrated busbar uses an NTC thermistor temperature sensor 6, which operates based on the negative temperature coefficient (NTC) characteristic. When the integrated busbar generates heat during operation, causing the ambient temperature to rise, the resistance value of the NTC thermistor will decrease accordingly.

[0054] Specifically, the temperature sensor 6 is fixed to the bottom UV film 1 and located within the clearance groove 32 of the busbar 3. This arrangement allows the temperature sensor 6 to be close to the critical heat-generating area (near the aluminum busbar 31 and the tin-plated copper wire 2). When the temperature changes, the NTC thermistor can quickly sense the change and convert its resistance value into an electrical signal. The temperature sensor 6 transmits the detected temperature signal (resistance change signal) to the control system, which processes and analyzes these signals, performing operations such as filtering and amplification to improve the accuracy and reliability of the signals. Then, the control system determines whether the integrated busbar is operating normally based on a preset temperature threshold. If the temperature exceeds the normal range, the control system will take corresponding measures, such as issuing an alarm, adjusting the current, or activating the cooling system, to ensure the safe operation of the integrated busbar and its system.

[0055] The flexible configuration of the number of temperature sensors 6 allows the integrated busbar to adapt to different application scenarios and accuracy requirements. For example, in applications requiring high temperature monitoring accuracy, the number of temperature sensors 6 can be increased to achieve more comprehensive temperature monitoring; while in general applications, the number can be appropriately reduced to lower costs. Furthermore, the temperature sensors 6 are each housed within the clearance slots 32 of the aluminum busbar 31, a design that facilitates subsequent replacement or upgrades of the temperature sensors 6, enhancing the system's maintainability and scalability.

[0056] Example 2

[0057] Please refer to Figure 3 Embodiment 2 of this application provides a processing method for an integrated busbar. This processing method is used for the integrated busbar in Embodiment 1. This processing method can improve the problems of multiple processes and low efficiency of hot-pressing integrated busbars in traditional busbar processing methods. It has advantages such as improving production efficiency, reducing the number of parts in the integrated busbar, and reducing costs. Specifically, the processing method includes steps S1-S10.

[0058] Step S1: The tin-plated copper wire is fixed on the bottom UV film by an automatic wiring machine. The wiring machine can automatically feed and cut the wire according to the design line and arrange the tin-plated copper wire into multiple conductive lines.

[0059] Using automated wiring machines to fix tinned copper wires significantly improves the speed and accuracy of wiring. Compared to traditional manual or semi-automatic wiring methods, automated wiring machines can quickly lay out tinned copper wires according to a predetermined design. They can complete multiple steps such as wire feeding, cutting, and wiring in a short time, reducing delays and errors that may occur with manual operation and lowering labor costs. For example, in the mass production of integrated busbars, automated wiring machines can complete the wiring of a complex line in minutes, while manual work might take tens of minutes or even longer.

[0060] The automated wiring machine precisely controls the direction and length of the tinned copper wires according to the designed circuit. It can arrange the tinned copper wires into multiple conductive lines, with each line's position and length being highly accurate. This precise wiring method ensures stable electrical performance of the integrated busbars, avoiding problems such as short circuits and poor contact caused by inaccurate wiring. During mass production, the automated wiring machine guarantees a high degree of consistency in the wiring method and quality of each integrated busbar, improving product quality stability.

[0061] Step S2: Place the temperature sensor and busbar at the corresponding window positions punched out by the bottom UV film, and pre-fix them by bonding with the UV adhesive layer on the bottom UV film.

[0062] Pre-fixing using a UV adhesive layer on the UV underlayer film is a quick and convenient method. The UV adhesive cures rapidly under UV light, temporarily securing the temperature sensor and busbar to the corresponding window positions on the underlayer UV film. Compared to traditional mechanical fixing or manual positioning and bonding methods, this pre-fixing method significantly reduces assembly time. For example, on automated production lines, UV adhesive pre-fixing can be completed in seconds, while traditional mechanical fixing may require more complex operations and more time to ensure accurate component installation.

[0063] The underlying UV film is pre-cut with corresponding window positions, providing precise mounting positioning for the temperature sensor and busbar. This ensures that the temperature sensor and busbar are in the correct position during subsequent processing steps, avoiding rework or scrap due to positional deviations. The automated pre-fixing process ensures that each component is installed in the predetermined design position, improving the efficiency and accuracy of the entire assembly process.

[0064] Pre-fixation ensures the temperature sensor and busbar remain stable on the underlying UV film, preventing displacement or skewing during subsequent processing and handling. The pre-fixation of the UV adhesive layer also provides a foundation for the subsequent curing process. Furthermore, the accuracy and stability of pre-fixation reduce material waste caused by assembly errors or component damage, thereby lowering overall production costs.

[0065] Step S3: Cover and fix the upper UV film onto the tin-plated copper wire, and extend multiple conductive lines out of the coverage area of ​​the upper UV film.

[0066] The upper UV film covers the tin-plated copper wire, providing excellent insulation protection. The UV film has superior insulation properties, effectively preventing the tin-plated copper wire from contacting external conductive materials and reducing the risk of short circuits. For example, inside complex electrical equipment, the upper UV film can isolate the tin-plated copper wire from other live components or conductive media, ensuring that current is transmitted along a predetermined path. Simultaneously, the upper UV film protects the tin-plated copper wire from physical damage such as friction and impact. During the installation and use of integrated busbars, the tin-plated copper wire may be subjected to physical forces from other components or the external environment; the upper UV film acts as a buffer and protector, extending the service life of the tin-plated copper wire.

[0067] By covering and fixing the upper UV film onto the tin-plated copper wire, the position of the tin-plated copper wire can be further stabilized. Combined with the fixing effect of the lower UV film, this keeps the tin-plated copper wire stable between the upper and lower UV films, preventing displacement or movement during subsequent processing or use. This stable structure helps ensure the layout accuracy of the conductive lines and guarantees the reliability of current transmission. Extending multiple conductive lines beyond the coverage area of ​​the upper UV film allows for effective management and guidance of the conductive lines. This design ensures that the conductive lines extend along a predetermined path, facilitating connection with subsequent circuit components (such as PCBs), while avoiding tangling or interference between conductive lines, improving the neatness and standardization of the entire integrated busbar wiring.

[0068] Step S4: The temperature sensor, busbar, and tinned copper wire are cold-pressed and fixed to the bottom UV film through a cold pressing process.

[0069] The cold-pressing process applies pressure to ensure a tight bond between the temperature sensor, busbar, tinned copper wire, and the underlying UV film. This physical pressure effectively eliminates air between the components and the underlying UV film, creating a secure contact. Simultaneously, the UV adhesive layer on the underlying UV film further enhances the bonding effect. The cold-pressed components exhibit significantly improved mechanical stability, better resisting mechanical stresses such as vibration and impact, ensuring no displacement or loosening occurs during subsequent processing and use.

[0070] Cold pressing is a relatively efficient fixing method. Compared to traditional hot pressing or other complex fixing processes, it can fix temperature sensors, busbars, and tinned copper wires in a shorter time. Unlike hot pressing, cold pressing does not require heating and cooling processes and can be performed directly at room temperature, thus significantly shortening the production cycle. Furthermore, cold pressing does not require additional heating equipment or large amounts of energy to raise the temperature, greatly reducing energy consumption compared to hot pressing. Over long-term production, this energy saving effect can significantly reduce production costs.

[0071] Therefore, cold pressing can be easily integrated into automated production lines to achieve continuous production. Its simple and rapid operation, eliminating the need for complex preheating or curing processes, makes the production process smoother, reduces downtime, and improves efficiency.

[0072] In this embodiment, the cold pressing parameters are: temperature 10-30℃, pressing time 2-3 min, and pressure 0.3-0.5 MPa. Preferably, the pressure is 0.4 MPa.

[0073] Temperature conditions are controlled between 10-30℃. This temperature range is the normal operating temperature range for most materials (such as UV films, tinned copper wires, busbars, and temperature sensors) near room temperature, during which the physical and chemical properties of the materials are relatively stable. For example, at 10-30℃, the flexibility, viscosity, and mechanical properties of UV films remain in good condition. They will not become too stiff due to excessively low temperatures, nor will they soften or deform due to excessively high temperatures, which is conducive to the smooth progress of the cold pressing process.

[0074] The pressure is 0.4 MPa, which is a moderate pressure. For integrated busbar components, this pressure ensures sufficient pressure contact between components without causing excessive compression damage to the materials. During the cold pressing process, 0.4 MPa pressure allows the temperature sensor, busbar, tinned copper wire, and underlying UV film to adhere tightly without causing plastic deformation or damage to the internal structure of the components. For example, for metal components such as the aluminum busbar and tinned copper wire of the busbar, good contact can be achieved at 0.4 MPa pressure without metal deformation or damage due to excessive pressure.

[0075] The pressing time is set to 2-3 minutes, providing ample time for the cold pressing process. Within this timeframe, the components can fully contact and adapt to each other under pressure, eliminating air between components and maximizing the contact area at the bonding points. For example, during the 2-3 minute pressing process, the temperature sensor and manifold can fully adhere to the underlying UV film, ensuring stable positioning and good adhesion during subsequent curing and use.

[0076] Here, temperature, pressing time, and pressure work together to achieve optimal cold-pressing fixation. At temperatures between 10-30℃, the material is in a stable state; a pressure of 0.4MPa provides moderate force; and a pressing time of 2-3 minutes ensures that components such as temperature sensors, busbars, and tinned copper wires are firmly fixed to the underlying UV film. This coordinated approach ensures that the integrated busbar after cold pressing achieves high quality standards in terms of mechanical strength, electrical connectivity, and stability.

[0077] Step S5: The bottom UV film and the top UV film are cured by UV light to completely fix the temperature sensor, busbar, tinned copper wire and other components.

[0078] UV light irradiation cures the bottom and top UV films, causing a photochemical reaction that cross-links and cures both the UV adhesive layer and the UV film itself. This curing process not only strengthens the bottom and top UV films themselves but also enhances the adhesion between components such as temperature sensors, busbars, and tinned copper wires and the UV film. The cured UV film acts like a robust "protective shell," tightly encasing and securing these components, ensuring they do not shift or loosen during subsequent use.

[0079] UV curing is a rapid curing method, typically completing the curing process in just tens of seconds to a few minutes. This allows for rapid progress in the entire production process, making it particularly suitable for large-scale mass production. Furthermore, the UV curing process allows for precise control of parameters such as light intensity and irradiation time, ensuring highly consistent curing results for each integrated busbar, thereby improving the overall quality of the product.

[0080] Furthermore, UV-cured UV films exhibit superior insulation properties. The cured UV film has a denser structure, better preventing current leakage and increasing the insulation resistance of the integrated busbar, which is crucial for ensuring its safe operation under high voltage and high current conditions. Moreover, the cured UV film is more resistant to environmental factors such as temperature, humidity, and chemicals. It maintains stable performance over a wide temperature range, preventing component loosening or performance degradation due to temperature changes; it also resists the corrosive effects of moisture and chemicals, extending the service life of the integrated busbar.

[0081] Step S6: Ultrasonically weld each conductive wire to the aluminum busbar for fixation.

[0082] Ultrasonic welding is a highly efficient welding technology that utilizes high-frequency vibration energy to cause the metal atoms between the conductive wire and the aluminum busbar to diffuse and bond, forming a strong weld joint. This welding method ensures extremely high reliability of the electrical connection between the conductive wire and the aluminum busbar during long-term use, preventing loosening or detachment due to external factors such as vibration and temperature changes. Ultrasonic welding enables direct metal-to-metal connections, offering higher connection strength and stability compared to other connection methods (such as simple mechanical connections or adhesive bonding). This stability is crucial for ensuring the normal operation of integrated busbars under various complex working conditions, especially in applications with extremely high reliability requirements, such as electric vehicles and industrial equipment.

[0083] Ultrasonic welding effectively reduces the contact resistance between the conductive wire and the aluminum busbar, ensuring minimal energy loss during current transmission. Low contact resistance improves power transmission efficiency and reduces energy waste and safety hazards caused by resistance heating. Ultrasonic welding guarantees highly consistent conductivity at each weld point. In mass production, this consistency ensures stable electrical performance for every product, reduces performance fluctuations due to variations in weld quality, and improves product quality control.

[0084] By ultrasonically welding each conductive wire to the aluminum busbar, a robust connection between the conductive wire and the aluminum busbar is achieved, ensuring the stability and reliability of the electrical connection. This also significantly reduces the amount of wiring harness used. Ultrasonic welding directly fuses the aluminum busbar to the connection point (such as battery tabs or terminals), eliminating the need for intermediate wiring harnesses and achieving a "cableless" connection. This design reduces the number of parts, simplifies the overall structure, and reduces the complexity and potential failure points caused by excessive wiring harnesses, further enhancing the simplicity and reliability of the integrated busbar.

[0085] Step S7: Solder the temperature sensor to the tin-plated copper wire to fix it in place.

[0086] Soldering is a reliable electrical connection method. By soldering a temperature sensor to tinned copper wire, the temperature signal (electrical signal) generated by the temperature sensor can be stably transmitted to the subsequent control system. Soldering can form a good electrical contact, reduce contact resistance, and reduce signal loss and interference during transmission.

[0087] Meanwhile, soldered connections offer superior durability. In the operating environment of integrated busbars, factors such as temperature variations and vibrations may occur. Soldered connections can resist these factors to a certain extent, maintaining the long-term effectiveness of the electrical connection. Compared to simple plug-in connections or other temporary connection methods, soldered connections are less prone to loosening or poor contact, thus ensuring that the temperature sensor transmits signals stably throughout its entire lifespan.

[0088] Soldering not only provides electrical connections but also offers a degree of mechanical fixation for the temperature sensor. Soldering the temperature sensor to the tinned copper wire prevents displacement or movement during operation. In subsequent use of the integrated busbar, if the temperature sensor malfunctions or needs replacement, the soldered connection allows maintenance personnel to quickly and easily replace it. Maintenance can be completed simply by properly treating the solder joints (such as heating to remove the old sensor and soldering the new one), reducing repair time and costs.

[0089] Step S8: Fix the tin-plated copper wire to the PCB board using a through-hole pulse soldering process.

[0090] Through-hole pulse soldering enables a stable and low-impedance electrical connection between tinned copper wires and the PCB board, allowing current to be efficiently and stably transferred from the tinned copper wires to the PCB board and then to subsequent circuit components, ensuring the normal operation of the entire circuit system. This process offers fast soldering speed and concentrated energy, providing sufficient heat in a short time to melt the solder and wet the pads and leads, forming a strong solder joint. This effectively avoids problems such as cold solder joints and false solder joints, thus significantly improving the reliability of the electrical connection between the tinned copper wires and the PCB board, and enhancing the stability of the entire circuit.

[0091] Through-hole pulse soldering not only achieves electrical connection but also provides mechanical support for the tinned copper wires, firmly fixing them to the PCB board. This helps prevent displacement or loosening of the tinned copper wires under external forces or vibration, ensuring connection stability. Furthermore, through-hole pulse soldering can adapt to tinned copper wires of different diameters and PCB board thicknesses, allowing for process parameter adjustments to meet specific connection requirements and achieve flexible and reliable mechanical fixation.

[0092] Through-hole pulse soldering offers high soldering speed, enabling the completion of large-scale soldering tasks in a short time, significantly improving production efficiency. Compared to traditional manual soldering methods, through-hole pulse soldering saves substantial time and labor costs, making it particularly suitable for large-scale production. This process is easily automated and can be integrated with automated production lines and equipment to further enhance production efficiency and quality stability. By programming and controlling soldering parameters, consistent quality across each solder joint can be ensured, reducing errors from manual operation.

[0093] Step S9, Welding performance test: The ultrasonic solder joints of the tinned copper wire and busbar are automatically inspected by AVI vision.

[0094] AVI (Automated Vision Inspection) can quickly and accurately identify surface defects in solder joints, such as their shape, size, location, and integrity. This helps ensure that each solder joint meets predetermined quality standards, thereby improving overall product quality. AVI systems typically record inspection results, providing detailed traceability data for the production process. This is extremely useful for quality control and problem tracking, especially when analyzing production issues or conducting quality certification. Automated vision inspection can detect welding defects early in the production process, allowing manufacturers to adjust process parameters or perform rework in a timely manner, thereby reducing production costs and increasing production efficiency.

[0095] Step S10: Functional performance test; Power on the integrated busbar and test its electrical performance, such as continuity and insulation withstand voltage.

[0096] Continuity testing ensures that current flows normally and continuously through all conductive paths of the integrated busbar. By conducting power-on tests, problems such as open circuits in wires and poor contact at connection points can be detected in a timely manner, thus guaranteeing that the integrated busbar can reliably transmit current in actual use and fulfill its basic function as a current transmission medium. It can also verify whether the conductive lines are correctly connected to the corresponding aluminum busbars and PCB components as required by the design. If there are wiring errors or wires connected to incorrect endpoints, abnormal current paths or short circuits can be detected during power-on testing, ensuring that the integrated busbar's function meets design expectations.

[0097] Insulation withstand voltage testing verifies whether the insulation performance of the integrated busbar meets the standards. During energization testing, a certain voltage is applied to test whether the insulating material (such as a UV film) can effectively prevent current leakage. Poor insulation performance may lead to leakage between adjacent conductive parts, which not only affects the performance of the integrated busbar but may also cause serious safety accidents such as electric shock or fire. It also determines the reliability of the integrated busbar under high voltage conditions, which is crucial for ensuring the safe operation of the integrated busbar in complex and variable electrical environments.

[0098] Therefore, the implementation principle of the integrated busbar processing method in Embodiment 2 of this application is as follows: This integrated busbar processing method significantly improves production efficiency and reduces cumbersome procedures and labor costs through automated operations (such as automatic wiring and AVI detection) and optimized process steps (such as cold pressing and UV curing). Simultaneously, rigorous quality inspection steps ensure the electrical performance and connection reliability of the product, effectively improving product quality and stability. Furthermore, this method reduces the number of parts in the integrated busbar, lowering material and inventory costs. Overall, this processing method not only improves production efficiency and product quality but also reduces production costs, enhances the product's market competitiveness, and possesses significant economic and technological advantages. It is suitable for large-scale production and can meet the new energy market's demand for efficient, reliable, and low-cost battery components.

[0099] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An integrated busbar, characterized in that: Includes a bottom UV film, busbar, top UV film, PCB board, and several tin-plated copper wires; In the radial direction of the upper UV film, the width of the upper UV film is smaller than the width of the lower UV film; Several of the tin-plated copper wires are wrapped between the bottom UV film and the top UV film, and one end of the tin-plated copper wire is connected to the PCB board signal. The other end of the tin-plated copper wire has a conductive wire that is bent radially along the upper UV film, and the conductive wire is connected to the busbar signal. The busbar is fixed to the bottom UV film.

2. An integrated busbar according to claim 1, characterized in that, The bottom UV film is provided with a bottom UV adhesive layer on one side for fixing the top UV film, and the top UV film is provided with an upper UV adhesive layer on one side for fixing the bottom UV film.

3. An integrated busbar according to claim 1, characterized in that, The busbar includes multiple aluminum busbars, which are arranged on both sides of the upper UV film and the tinned copper wire, and each of the conductive wires is connected to one of the aluminum busbars.

4. An integrated busbar according to claim 3, characterized in that, The bottom UV film has several through holes, and each aluminum busbar is fixed at one of the through holes.

5. An integrated busbar according to claim 1, characterized in that, The integrated busbar also includes a temperature sensor, which is fixed to the upper surface of the bottom UV film, and the busbar has a clearance groove in which the temperature sensor is located.

6. An integrated busbar according to claim 5, characterized in that, The temperature sensor is an NTC thermistor temperature sensor.

7. A method for processing an integrated busbar, characterized in that, The processing method for manufacturing an integrated busbar according to any one of claims 1-6 includes: S1. The tin-plated copper wire is fixed on the bottom UV film by an automatic wiring machine. The wiring machine can automatically feed and cut the wire according to the design line and arrange the tin-plated copper wire into multiple conductive lines. S2. Place the temperature sensor and busbar at the corresponding window positions punched out by the bottom UV film, and pre-fix them by bonding with the UV adhesive layer on the bottom UV film. S3. Cover and fix the upper UV film onto the tin-plated copper wire, and extend multiple conductive lines out of the coverage area of ​​the upper UV film. S4. The temperature sensor, busbar, and tinned copper wire are cold-pressed and fixed to the bottom UV film through a cold pressing process. S5. The bottom UV film and the top UV film are cured by UV light irradiation, so that the temperature sensor, busbar and tinned copper wire are completely fixed. S6. Each conductive wire is ultrasonically welded and fixed to the aluminum busbar. S7. Solder the temperature sensor to the tinned copper wire to fix it in place; S8. The tin-plated copper wire is fixedly connected to the PCB board through a through-hole pulse soldering process.

8. The processing method for an integrated busbar according to claim 7, characterized in that, It also includes: Step S9, welding performance testing: using AVI automatic visual inspection to detect ultrasonic solder joints of tinned copper wires and busbars.

9. The processing method for an integrated busbar according to claim 7, characterized in that, It also includes: step S10, functional performance testing; energizing the integrated busbar and testing its conductivity and insulation withstand voltage performance.

10. The processing method of an integrated busbar according to claim 7, characterized in that, The cold pressing parameters in step S4 are: temperature 10-30℃, pressing time 2-3 min, and pressure 0.3-0.5 MPa.

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