LED support and LED packaging structure

Abstract

The invention belongs to the technical field of chip packaging, and provides an LED support and an LED packaging structure, and the LED support comprises an electroplating sheet and a plastic package body. A metal connecting rib is arranged on the electroplating sheet; the plastic package body comprises a bottom layer and a plurality of side walls; the bottom layer is filled on the electroplating sheet and covers a part of the upper surface of the electroplating sheet, and metal connecting ribs which are not covered in the electroplating sheet form a die bonding pad and a bonding wire pad which are used for chip packaging; the side wall protrusions are arranged on the upper surface of the bottom layer, and light emitting gaps are reserved on the periphery of the upper surface of the bottom layer. Good binding force exists between the LED support and the adhesive layer, the reliability of the LED packaging structure can be improved, and the service life of the LED packaging structure can be prolonged.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of chip packaging, and particularly relates to an LED support and an LED packaging structure. BACKGROUND

[0002] The support structure of the LED packaging product with four-side light emission in the prior art is relatively simple, and generally adopts a planar plastic package body structure. During processing, plastic sealing material is filled on the electroplated sheet and covers part of the upper surface by using the injection molding mode, and the part of the electroplated sheet not covered forms a die-bonding pad and a wire-bonding pad, which are respectively used for fixing and electrically connecting the chip. However, such a support has a small contact area with the glue layer during subsequent packaging processing due to the flat surface, and the phenomenon of peeling of the glue layer from the support is prone to occur. SUMMARY

[0003] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide an LED support which has good bonding force with the glue layer and is beneficial to improve the reliability and service life of the LED packaging structure.

[0004] The technical scheme adopted by the present application to solve its technical problems is:

[0005] The side wall is provided with at least four side walls, which are respectively arranged around the bottom layer; the light-emitting gap is arranged between the two adjacent side walls; and the die-bonding pad is located in the middle of each side wall.

[0006] Preferably, the LED support is in a rectangular shape; and the sum of the widths of all the light-emitting gaps on each side edge of the upper surface of the bottom layer is less than or equal to half of the width of the LED support.

[0007] Preferably, the side wall is arranged at each corner of the bottom layer; or, the corner of the bottom layer is left empty to form the light-emitting gap.

[0008] In a preferred embodiment of the present application, the thickness of the bottom layer is in the range of 0.05mm-0.5mm; the thickness of the side wall is in the range of 0.05mm-1.0mm; and the area of the die-bonding pad is greater than or equal to the area of the chip to be packaged.

[0009] In a preferred embodiment of the present application, the side surface of the side wall is inclined to form a side surface slope with a large lower part and a small upper part; and the angle of the side surface slope is between 60°-90°.

[0010] In a preferred embodiment of the present application, a round corner is arranged at the corner of the side wall.

[0011] In a preferred scheme of the present application, the side wall comprises a plurality of wall bodies stacked one on another from bottom to top, forming a stepped side wall; the projection area of the upper wall body is smaller than that of the lower wall body, and the height of the upper wall body is less than or equal to that of the lower wall body.

[0012] In a preferred scheme of the present application, the plastic sealing body is fixed with the electroplated sheet by injection molding.

[0013] A second object of the present application is to provide an LED packaging structure comprising the above LED support.

[0014] An LED packaging structure comprises the above LED support, a chip, a light reflection layer, a light conversion layer, and a light blocking layer; the chip is fixed on the die bonding pad of the LED support, and the chip is connected with the wire bonding pad by a metal connecting line to form an electrical connection; the light reflection layer covers and fills in the light emission gap and part of the bottom layer, the height of the light reflection layer is lower than that of the side wall, and the upper surface of the light reflection layer is a plane or a curved surface; the light conversion layer covers the LED support, the chip, and the light reflection layer, and the side surface of the light conversion layer is flush with the LED support; the light blocking layer covers the light conversion layer, and the side surface of the light blocking layer is flush with the light conversion layer.

[0015] Compared with the prior art, the present application has the following advantages:

[0016] The plastic sealing body in the LED support of the present application comprises a bottom layer and a plurality of side walls, and the contact area between the side wall structure and the glue layer is increased, thereby enhancing the bonding force between the support and the glue layer, improving the reliability, and preventing the two from peeling apart. At the same time, the light emission gap is left between the side walls around the bottom layer, ensuring that the chip can emit light around after packaging, without affecting the performance of the LED module. Further, the side wall structure and position in the present application can be flexibly adjusted, so that in addition to enhancing the reliability between the LED support and the glue layer, the side wall can also be used to flexibly layout the light emission form around the LED module. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0018] Figure 1 The schematic diagram of the first embodiment of the LED support of the present application.

[0019] Figure 2 The schematic diagram of the first embodiment of the LED support of the present application.Figure 1 a lateral sectional view of the electroplated sheet.

[0020] Figure 3 a lateral sectional view of the electroplated sheet. Figure 1 a longitudinal sectional view of the electroplated sheet.

[0021] Figure 4 a lateral sectional view of the electroplated sheet. Figure 1 a perspective view of the upper and lower structures of the electroplated sheet.

[0022] Figure 5 a schematic view of a second embodiment of the LED support of the present application.

[0023] Figure 6 a schematic view of a second embodiment of the LED support of the present application.

[0024] Figure 7 a schematic view of a third embodiment of the LED support of the present application.

[0025] Figure 8 a schematic view of the LED package structure of the present application.

[0026] wherein:

[0027] 1 - plastic package, 2 - wire bonding pad, 3 - die bonding pad, 4 - side wall, 401 - first side wall, 402 - second side wall, 403 - third side wall, 404 - fourth side wall, 405 - fifth side wall, 406 - sixth side wall, 407 - second wall body, 408 - second wall body, 5 - light emitting gap, 501 - first gap, 502 - second gap, 6 - bottom layer, 7 - metal connecting line, 8 - chip, 9 - light reflecting layer, 10 - light converting layer, 11 - light blocking layer, 12 - metal connecting rib, 13 - electroplated sheet. DETAILED DESCRIPTION

[0028] In order to more clearly understand the above objectives, features and advantages of the present application, the following will give a further detailed description of the present application with the aid of accompanying drawings and specific embodiments. It should be noted that the embodiments and features of the embodiments in the present application can be combined with each other without conflict. In the following description, a large number of specific details are described in order to facilitate a full understanding of the present application. The described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work, fall within the scope of protection of the present application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0030] Embodiment 1

[0031] Referring to Figures 1-4 The embodiment discloses an LED support, which comprises a plated sheet 13 and a plastic package 1. The plated sheet 13 is provided with a metal connecting rib 12. The plastic package 1 comprises a bottom layer 6 and a plurality of side walls 4. The bottom layer 6 is filled on the plated sheet 13 and covers part of the upper surface of the plated sheet 13. The metal connecting rib 12 of the plated sheet 13 which is not covered forms a die-bonding pad 3 and a wire-bonding pad 2 for encapsulating a chip 8. The thickness of the bottom layer 6 ranges from 0.05 mm to 0.5 mm, and the thickness of the side walls 4 ranges from 0.05 mm to 1.0 mm. The plurality of side walls 4 are protrudingly arranged on the upper surface of the bottom layer 6 and are arranged around the four sides of the bottom layer 6 respectively. The light-emitting gap 5 is arranged between any two adjacent side walls 4, that is, the light-emitting gap 5 is left around the upper surface of the bottom layer 6, and the die-bonding pad 3 is located in the middle of each side wall 4, and the area of the die-bonding pad 3 is greater than or equal to the area of the chip to be encapsulated.

[0032] The LED support in the embodiment is in a rectangular shape. The sum of the widths of all the light-emitting gaps 5 on each side of the upper surface of the bottom layer 6 is less than or equal to half of the width of the LED support. Of course, the LED support in the embodiment can also be arranged in other shapes, such as a circular shape.

[0033] Further, the four corners of the bottom layer 6 in the embodiment are all provided with the side walls 4. In this way, after the chip 8 is encapsulated and fixed on the die-bonding pad 3, light can be emitted from the front side of the four sides, and the intensity of the light in the directions of 0° and 90° can be made uniform and the same by controlling the spacing between the four side walls 4.

[0034] For example, as shown in Figure 1 six side walls 4, i.e., a first side wall 401, a second side wall 402, a third side wall 403, a fourth side wall 404, a fifth side wall 405 and a sixth side wall 406, can be arranged on the upper surface of the bottom layer 6. The distribution of the six side walls can be seen from Figure 1The first side wall 401, the third side wall 403, the fourth side wall 404 and the sixth side wall 406 are located at the four corners. The second side wall 402 and the fifth side wall 405 are located at two opposite sides, so that two opposite sides form two light-emitting gaps 5, which are referred to as first gaps 501. There is one light-emitting gap 5 between the third side wall 403 and the fourth side wall 404 and between the first side wall 401 and the sixth side wall 406, which is referred to as a second gap 502. At this time, in order to have the same light-emitting intensity, the sum of the widths of all the first gaps 501 can be equal to the sum of the widths of all the second gaps 502. In addition, the widths of all the first gaps 501 can be set to be equal, and the widths of all the second gaps 502 can be set to be equal, so as to ensure uniform light emission in the same direction. Of course, in order to obtain different side light-emitting effects, the number and width of the side walls 4 in different directions and the number and width of the light-emitting gaps 5 formed can be flexibly adjusted.

[0035] Further, the corners of all the side walls 4 in the embodiment are rounded. The radii of the corners of the first side wall 401, the third side wall 403, the fourth side wall 404 and the sixth side wall 406 can be set to be the same, and the radii of the corners of the second side wall 402 and the fifth side wall 405 can be set to be the same.

[0036] Referring to Figures 2-3 The side surfaces of all the side walls 4 in the embodiment are inclined to form side surface slopes that are large at the bottom and small at the top. The angle of the side surface slopes can be selected to be between 60° and 90°. The height of the side wall 4 in the embodiment is greater than 0.1 mm, and the side surface of the side wall 4 has high reflectivity, so as to obtain better reflected light-emitting effects.

[0037] The plastic package 1 in the embodiment is fixed to the electroplated sheet 13 by injection molding. That is, the bottom layer 6 and the side walls 4 of the plastic package 1 in the embodiment can be an integral structure, which can be formed by injection molding.

[0038] Embodiment 2

[0039] Referring to Figures 5-6The difference between this embodiment and Embodiment 1 is that in this embodiment, the four corners of the bottom layer 6 are left empty to form light-emitting gaps 5. That is, there are no sidewalls 4 at the four corners of the bottom layer 6 in this embodiment, and the sidewalls 4 on each side of the upper surface of the bottom layer 6 are the same, and the number and width of the light-emitting gaps 5 are also the same. Specifically, this embodiment has two sidewalls 4 on each side. The path of the light emitted by the LED chip 8 is farther in the 45° direction than in the 0° or 90° direction, and the light intensity at the 45° angle is relatively weaker. By setting sidewalls 4 in the 0° and 90° directions to block the light, it is beneficial to make the light intensity of the LED device the same at 0°, 90° and 45° angles, and the light distribution can be effectively controlled after the LED module is made. Of course, the number of sidewalls 4 on each side of the upper surface of the bottom layer 6 can also be flexibly adjusted, and is not limited to the implementation of setting two sidewalls 4 in this embodiment. Figure 5 As shown, two sidewalls 4 are provided on each side. Figure 6 As shown, there are two sidewalls 4 on two opposite sides and one sidewall 4 on the other two opposite sides.

[0040] Example 3

[0041] See Figure 7 The difference between this embodiment and Embodiment 1 is that the sidewall 4 in this embodiment includes several walls, which are stacked sequentially from bottom to top to form a stepped sidewall 4; the projected area of ​​the upper wall is smaller than that of the lower wall, and the height of the upper wall is less than or equal to that of the lower wall. In this embodiment, the number of walls in the stepped sidewall 4 can be two, three, or more. By forming the stepped sidewall 4, the contact area between the adhesive layer and the support can be further increased, better preventing the adhesive layer from peeling off. Specifically, referring to the figure, the sidewall 4 in this embodiment includes a first wall 407 and a second wall 408.

[0042] Example 4

[0043] See Figure 8The embodiment discloses an LED packaging structure comprising the LED support of any one of the above-mentioned embodiments 1-3. The LED packaging structure further comprises a chip 8, a light reflection layer 9, a light conversion layer 10, and a light blocking layer 11. The chip 8 is fixed on the die-bonding pad 3 of the LED support. The chip 8 of the embodiment can be a positive chip 8 or a vertical chip 8. The chip 8 is connected with the wire-bonding pad 2 through the metal connecting wire 7 to form an electrical connection. The light reflection layer 9 can be obtained by the dispensing method, covering and filling on the light-emitting gap 5 and part of the bottom layer 6. The height of the light reflection layer 9 is lower than the height of the sidewall 4. The light reflection layer 9 of the embodiment can be selected from a thermosetting resin material with a reflective material, and the reflectivity of the light reflection layer 9 is higher than the reflectivity of the sidewall 4, the bottom layer 6, and the electroplated sheet 13. The light conversion layer 10 can cover the LED support, the chip 8, and the light reflection layer 9 by the molding method. The side surface of the light conversion layer 10 is flush with the LED support. The light conversion layer 10 of the embodiment can be selected from a thermosetting resin material with a fluorescent powder material, and the thickness of the light conversion layer 10 is greater than the LED support. The light blocking layer 11 can cover the light conversion layer 10 by the molding method. The side surface of the light blocking layer 11 is flush with the light conversion layer 10. The light blocking layer 11 of the embodiment can be selected from a thermosetting resin material with a reflective material. The thickness of the light blocking layer 11 is less than the light conversion layer 10 and greater than the LED support.

[0044] Further, the upper surface of the light reflection layer 9 is a plane or a curved surface. As shown in the figure, the upper surface of the light reflection layer 9 of the embodiment is provided as a curved surface structure. Figure 8

[0045] The above-mentioned is only the preferred embodiment of the present application, and does not limit the present application in any form. Any modification, equivalent change, and modification of the above-mentioned embodiment according to the technical essence of the present application, without departing from the technical solution content of the present application, still belongs to the scope of the technical solution of the present application.​

Claims

1. An LED holder, characterized by, The LED support includes a plated sheet and a plastic encapsulation body; the plated sheet is provided with metal connecting ribs; the plastic encapsulation body includes a bottom layer and a plurality of side walls; the bottom layer is filled on the plated sheet and covers part of the upper surface of the plated sheet, and the metal connecting ribs not covered in the plated sheet form die-bonding pads and wire-bonding pads for chip packaging; a plurality of the side walls are protrudingly arranged on the upper surface of the bottom layer, and the upper surface of the bottom layer is provided with light-emitting gaps around.

2. The LED support of claim 1, wherein, The side walls are at least four in number and are arranged around the bottom layer; the light-emitting gaps are arranged between every two adjacent side walls; and the die-bonding pads are located in the middle of each side wall.

3. The LED support of claim 2, wherein, The LED support is in a rectangular shape; the sum of the widths of all the light-emitting gaps on each side of the upper surface of the bottom layer is less than or equal to half of the width of the LED support.

4. The LED support of claim 3, wherein, The side walls are arranged at the four corners of the bottom layer; or, the four corners of the bottom layer are left empty to form the light-emitting gaps.

5. The LED support of claim 1, wherein, The thickness of the bottom layer ranges from 0.05 mm to 0.5 mm; the thickness of the side walls ranges from 0.05 mm to 1.0 mm; and the area of the die-bonding pads is greater than or equal to the area of the chip to be packaged.

6. The LED support of any of claims 1-5, wherein, The side surface of the side wall is inclined to form a side surface slope that is large at the bottom and small at the top; and the angle of the side surface slope is between 60° and 90°.

7. The LED support of any of claims 1-5, wherein The corner of the side wall is provided with a round corner.

8. The LED support of any of claims 1-5, wherein, The side wall includes a plurality of wall bodies, and the wall bodies are stacked in a stepped manner from bottom to top; the projection area of the upper wall body is smaller than that of the lower wall body, and the height of the upper wall body is less than or equal to that of the lower wall body.

9. The LED support of any of claims 1-5, wherein, The plastic encapsulation body is fixed with the plated sheet by injection molding.

10. An LED package structure, characterized in that, The LED support, chip, light-reflecting layer, light-converting layer, and light-blocking layer according to any one of claims 1-8 are included; the chip is fixed on the die-bonding pads of the LED support, and the chip is connected with the wire-bonding pads through metal connecting lines to form an electrical connection; the light-reflecting layer is filled in the light-emitting gaps and part of the bottom layer, the height of the light-reflecting layer is lower than that of the side wall, and the upper surface of the light-reflecting layer is a plane or a curved surface; the light-converting layer covers the LED support, the chip, and the light-reflecting layer, and the side surface of the light-converting layer is flush with the LED support; and the light-blocking layer covers the light-converting layer, and the side surface of the light-blocking layer is flush with the light-converting layer.

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