Shell assembly and folding electronic equipment

Abstract

The embodiment of the invention provides a shell assembly and folding electronic equipment, the folding electronic equipment comprises a rotating shaft mechanism, the shell assembly comprises two middle frames which are rotatably arranged on the two sides of the rotating shaft mechanism respectively, each middle frame comprises a middle frame body and an injection molding part, and a shaft area used for arranging the rotating shaft mechanism is defined by the edge of one side of the middle frame body. The middle frame body is provided with a glue pulling structure in the shaft area, the glue pulling structure comprises a glue pulling groove and a glue pulling cavity which are located on the same side of the middle frame body and communicated with each other, and the glue pulling cavity penetrates to the side, opposite to the glue pulling groove, of the middle frame body. The size of the glue pulling cavity on one side of the middle frame body facing the shaft cover of the rotating shaft mechanism is smaller than that on one side of the middle frame body far away from the shaft cover. The glue pulling groove and the glue pulling cavity are filled with the injection molding part, and the injection molding part is constructed to support the shaft cover. According to the shell assembly, the thickness of the middle frame in the shaft area is reduced, and meanwhile the requirement of the folding type electronic equipment for the glue pulling strength of the middle frame body and the injection molding part in the middle frame can be met.

Description

Housing assembly and foldable electronic device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on May 4, 2023, with application number 202310496782.1 and application name “Casing assembly and foldable electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to a housing assembly and a foldable electronic device. Background Art

[0003] As foldable electronic devices such as foldable screen mobile phones become more and more complex, the demand for thinner and lighter foldable electronic devices has become more prominent.

[0004] Taking foldable screen mobile phones as an example, foldable electronic devices are usually equipped with two middle frames and a hinge mechanism. The hinge mechanism is arranged between the two middle frames and connected to the two middle frames so that the configuration of the foldable electronic device can be changed by the relative rotation of the two middle frames. At present, the middle frame has an axis area for setting the hinge mechanism on the side facing the hinge mechanism. The middle frame usually has a middle frame body and an injection molded part integrally formed in the middle frame body in the axis area. The middle frame body is usually a metal structure in the axis area. The injection molded part is located on the side of the middle frame body facing the hinge mechanism to support the axis cover of the hinge mechanism, thereby preventing the middle frame from directly touching the axis cover when rotating relative to the axis cover and making abnormal noises. In order to meet the demand for thinning and reducing the thickness of the foldable electronic device, the thickness of the middle frame, especially the thickness of the axis area, is challenged.

[0005] How to achieve thinning of the middle frame in the axis area while ensuring the bonding strength between the middle frame body and the injection molded parts in the axis area has become a technical problem to be solved.

[0006] Summary of the Invention

[0007] The present application provides a shell assembly and a foldable electronic device, which can meet the requirements of the foldable electronic device for the glue strength and bonding strength between the middle frame body and the injection molded parts in the axis area while reducing the thickness of the middle frame in the axis area.

[0008] A first aspect of an embodiment of the present application provides a shell assembly, which is applied to a foldable electronic device. The foldable electronic device includes a hinge mechanism, and the shell assembly includes two middle frames rotatably arranged on both sides of the hinge mechanism, each middle frame including a middle frame body and an injection molded part. One side edge of the middle frame body defines an axis area for setting the hinge mechanism; the middle frame body has a glue structure in the axis area, and the glue structure includes a glue groove and a glue cavity located on the same side of the middle frame body and interconnected, and the glue cavity extends to the side of the middle frame body opposite to the glue groove; the size of the glue cavity on the side of the middle frame body facing the axis cover of the hinge mechanism is smaller than the size of the glue cavity on the side of the middle frame body away from the axis cover; the injection molded part is filled in the glue groove and the glue cavity, and is constructed to support the axis cover.

[0009] In the embodiment of the present application, the glue groove and glue cavity are interconnected within the glue structure, and the size of the glue cavity on the side of the middle frame body facing the shaft cover is smaller than the size of the glue cavity on the side of the middle frame body away from the shaft cover, so that when the injection molded part is filled into the glue groove and glue cavity, an injection molded structure that is compatible with the glue groove and glue cavity structure can be formed, so that the injection molded part can support the rotating shaft mechanism. By setting the glue cavity, the thickness of the middle frame in the shaft area can be used to hide at least part of the thickness of the injection molded part, so as to reduce the thickness of the middle frame in the shaft area, thereby achieving a thinner thickness of the middle frame in the shaft area, meeting the requirements of foldable electronic devices for new forms of lightness and thinness, and at the same time, it can also enhance the glue area and glue strength between the injection molded part and the middle frame body, so as to meet the requirements of foldable electronic devices for the bonding strength between the injection molded part and the middle frame body in the shaft area.

[0010] Furthermore, the cooperative connection between the injection molded part and the groove wall of the glue pulling groove and the cavity wall of the glue pulling cavity can also prevent the injection molded part from escaping from the middle frame body, thereby ensuring the structural stability of the middle frame.

[0011] In some optional embodiments, the injection molded part includes an interconnected injection molded body and a glue drawing portion. The injection molded body is filled in the glue drawing groove, and the glue drawing portion is filled in the glue drawing cavity. The injection molded body and the glue drawing portion are both configured to support the shaft cover. Such that, while the injection molded part supports the shaft cover, the thickness of the middle frame in the shaft area can be utilized to conceal at least a portion of the thickness of the glue drawing portion, thereby reducing the thickness of the middle frame in the shaft area. Furthermore, the cooperation between the glue drawing groove and the injection molded body, and vice versa, not only enhances the glue drawing area and glue drawing strength between the injection molded part and the middle frame body, but also prevents the injection molded part from escaping from the middle frame body in different directions.

[0012] In some optional embodiments, the middle frame body includes a middle plate and a frame, the frame is arranged around the peripheral edge of the middle plate away from the shaft cover, the edge of the middle plate facing the shaft cover is defined as the shaft area, and the glue groove is located at the edge of the middle plate on the side of the shaft area, so that the injection molded body can be formed on the side of the middle plate on the shaft area to ensure that the injection molded part is supported on the shaft cover.

[0013] In some optional embodiments, at least a portion of the adhesive groove is located on the middle plate within the shaft region, corresponding to the frame. The outer edge profile of the injection molded body is adapted to the structure of the adhesive groove. This utilizes the thickness of the frame to form the adhesive groove in the shaft region, thereby supporting the injection molded part on the shaft cover while also enhancing the structural strength of the middle frame.

[0014] In some optional embodiments, the outer edge shape of the glue portion is adapted to the structure of the glue cavity, so that the glue portion cooperates with the inner wall of the glue cavity to enhance the glue strength and bonding strength between the injection molded part and the middle frame body at the glue cavity, while also preventing the injection molded part from escaping from the middle frame body toward the side of the shaft cover.

[0015] In some optional embodiments, the glue pulling cavity includes a first limiting cavity and a connecting cavity that are interconnected. The first limiting cavity is located on the side of the glue pulling groove, the connecting cavity and the glue pulling groove are located on the same side of the middle frame body, and the connecting cavity passes through to the side of the middle frame body opposite to the glue pulling groove to connect between the first limiting cavity and the glue pulling groove, so that when the glue pulling cavity is connected to the glue pulling groove, the glue pulling cavity can pass through the connecting cavity to the side of the middle frame body opposite to the glue pulling groove, so that the injection molded part is filled in the glue pulling groove, the connecting cavity and the first limiting cavity.

[0016] In some optional embodiments, the first limiting cavity is a through hole on the middle frame body, and the radial dimension of the first limiting cavity adjacent to the shaft cover is smaller than the radial dimension of the first limiting cavity away from the shaft cover, so that a glue pulling cavity can be formed after the first limiting cavity is connected with the connecting cavity, to ensure that the dimension of the glue pulling cavity on the side of the middle frame body facing the shaft cover is smaller than the dimension of the glue pulling cavity on the side of the middle frame body away from the shaft cover, so that after the injection molded part is filled in the glue pulling cavity, the glue pulling area and glue pulling strength between the injection molded part and the middle frame body can be enhanced to prevent the injection molded part from falling out from the side of the middle frame body facing the shaft cover.

[0017] In some optional embodiments, the first limiting cavity is a trumpet hole whose radial size gradually decreases along its own axial direction, so as to ensure that the size of the glue pulling cavity on the side of the middle frame body facing the shaft cover is smaller than the size of the glue pulling cavity on the side of the middle frame body away from the shaft cover.

[0018] In some optional embodiments, the first limiting cavity is located on the side of the glue pulling groove toward the middle of the middle frame body, so that after the injection molded part is filled in the first limiting cavity, the thickness of the middle frame body in the axial area can be used to hide at least part of the thickness of the injection molded part, while ensuring that the injection molded part has sufficient thickness and glue pulling strength at the first limiting cavity, while achieving thinning of the middle frame in the axial area.

[0019] In some optional embodiments, the glue pulling structure further includes a second limiting cavity, which is connected to the side of the connecting cavity and is located on the same side of the middle frame body as the glue pulling groove; the radial dimension of the second limiting cavity adjacent to the shaft cover is larger than the radial dimension of the second limiting cavity away from the shaft cover, and the injection molded part is filled in the second limiting cavity, so that the injection molded part is connected with the cavity wall of the second limiting cavity through the cooperation, thereby enhancing the glue pulling strength between the injection molded part and the middle frame body, and further preventing the injection molded part from falling out from the side of the middle frame body away from the shaft cover.

[0020] In some optional embodiments, the second limiting cavity is a trumpet hole whose radial dimension gradually decreases along its own axial direction, so as to form a structure of the second limiting cavity that meets the requirements.

[0021] In some optional embodiments, the number of the first limiting cavities is at least two, at least two first limiting cavities are symmetrically distributed on both sides of the glue pulling groove, and the second limiting cavity is located between two adjacent first limiting cavities.

[0022] By limiting the number and placement of the first limiting cavities, the bonding strength and uniformity of the injection molded part and the middle frame can be enhanced. Furthermore, the space between the two first limiting cavities in the middle frame can be rationally utilized to achieve the placement of the second limiting cavity on the middle frame.

[0023] In some optional embodiments, the first limiting cavity is located on the side of the middle frame body opposite to the glue pulling groove, and the radial dimension of the first limiting cavity is larger than the radial dimension of the connecting cavity, so that a glue pulling cavity can be formed after the first limiting cavity is connected to the connecting cavity, to ensure that the dimension of the glue pulling cavity on the side of the middle frame body facing the shaft cover is smaller than the dimension of the glue pulling cavity on the side of the middle frame body away from the shaft cover, so that after the injection molded part is filled in the glue pulling cavity, the glue pulling area and glue pulling strength between the injection molded part and the middle frame body can be enhanced to prevent the injection molded part from falling out of the side of the middle frame body facing the shaft cover.

[0024] In some optional embodiments, the first limiting cavity is a groove located on the side of the connecting cavity, the bottom of the groove is connected to the connecting cavity, and the notch of the groove faces the side away from the glue pulling groove, so that the glue pulling cavity and the glue pulling groove are connected while reducing the aperture size of the connecting cavity on the side of the middle frame body facing the back cover, which is beneficial to reducing the area of ​​the hole on the middle frame body.

[0025] In some optional embodiments, the connecting cavity is located on the side of the glue groove away from the edge of the middle frame body, and the first limiting cavity is located on the side of the connecting cavity away from the glue groove, so as to ensure that the injection molded part can support the shaft cover while making the injection molded part as far away as possible from the mating surface of the middle frame body that mates with the back cover on the side of the middle frame body facing the back cover of the foldable electronic device, which helps to prevent the injection molded part from being exposed to the outside of the foldable electronic device.

[0026] In some optional embodiments, the first limiting cavity and the communicating cavity are both located within the projection range of the back cover of the foldable electronic device on the middle frame body to prevent the injection molded parts from being exposed outside the foldable electronic device.

[0027] In some optional embodiments, the bottom of the groove and the bottom of the glue pulling groove are both planes on the middle frame body, so that the injection molded part can be in contact with the plane of the middle frame body at the bottom of the groove and the bottom of the glue pulling groove, thereby enhancing the glue pulling strength of the injection molded part from the middle frame body while enabling the injection molded part to be buckled on both sides of the middle frame body to prevent the injection molded part from falling out of the middle frame body.

[0028] In some optional embodiments, the bottom of the first limiting cavity further has a reinforcement groove, so that the structural strength of the middle frame at the first limiting cavity can be enhanced by fitting the injection molded part to the groove wall of the reinforcement groove without affecting the thickness of the middle frame at the first limiting cavity.

[0029] In some optional embodiments, there are at least two communicating cavities, and the at least two communicating cavities are symmetrically distributed on both sides of the glue drawing groove to enhance the glue drawing strength and uniformity of the bonding strength between the injection molded part and the middle frame body.

[0030] In some optional embodiments, the bottom of the glue pulling groove also has a second reinforcing protrusion, which is located between two adjacent connecting cavities and connected to the injection molded part, so as to enhance the bonding strength between the middle frame body and the injection molded part while also enhancing the structural strength of the middle frame at the second reinforcing protrusion.

[0031] In some optional embodiments, the bottom of the glue pulling groove is an inclined surface on the middle frame body that is inclined toward the edge of the frame side of the middle frame body, so as to utilize the thickness of the frame to further reduce the thickness of the injection molded part of the middle frame in the axis area.

[0032] In some optional embodiments, there are several rubber-pulling structures, which are arranged in the shaft area at intervals along the axial direction of the shaft cover, so that an injection molded part is formed in each rubber-pulling structure to enhance the supporting effect of the injection molded part on the shaft cover.

[0033] A second aspect of an embodiment of the present application provides a foldable electronic device, which includes a hinge mechanism and a shell assembly as described above. The hinge mechanism includes a shaft cover, which is located in the shaft area of ​​two middle frames in the shell assembly, and the two middle frames are rotatably arranged on both sides of the shaft cover.

[0034] The embodiment of the present application, through the arrangement of the shell assembly in the foldable electronic device, can not only cooperate with the hinge mechanism to realize the switching of the foldable electronic device between the flat state and the folded state, but also can realize the lightweight and thinning of the axis area of ​​the middle frame on one side of the foldable electronic device, so as to meet the design requirements of the new form of the foldable electronic device, and also meet the requirements of the foldable electronic device for the glue strength and bonding strength between the middle frame body and the injection molded parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] FIG1 is a schematic structural diagram of a foldable electronic device provided in an embodiment of the present application;

[0036] FIG2 is a schematic structural diagram of the foldable electronic device in FIG1 in a folded state;

[0037] FIG3 is a schematic structural diagram of the foldable electronic device in FIG1 in a flattened state;

[0038] FIG4 is a schematic structural diagram of another foldable electronic device provided in an embodiment of the present application;

[0039] FIG5 is a schematic structural diagram of another foldable electronic device in a folded state provided by an embodiment of the present application;

[0040] FIG6 is a first cross-sectional view of one of the injection molded parts of a middle frame provided in the related art at the shaft area;

[0041] FIG7 is a second cross-sectional view of a middle frame provided in the related art at one of the injection molded parts in the shaft area;

[0042] FIG8 is a schematic structural diagram of an injection molded part provided in the related art at a first viewing angle;

[0043] FIG9 is a schematic structural diagram of an injection molded part provided in the related art at a second viewing angle;

[0044] FIG10 is an exploded view of the middle frame on one side of the foldable electronic device provided in an embodiment of the present application;

[0045] FIG11 is a diagram illustrating the assembly effect of the middle frame on one side of the foldable electronic device according to an embodiment of the present application;

[0046] FIG12 is an exploded view of a middle frame provided by an embodiment of the present application on a glue-pulling structure in the shaft area;

[0047] FIG13 is an assembly diagram 1 of the injection molded part in FIG12 on the middle frame body;

[0048] FIG14 is a second assembly diagram of the injection molded part in FIG12 on the middle frame body;

[0049] FIG15 is a cross-sectional view of a middle frame in FIG13 at the injection molding part;

[0050] Figure 16 is a schematic diagram of the structure of the middle frame on the shaft cover side;

[0051] FIG17 is a schematic diagram of the structure of the middle frame on the rear cover side;

[0052] FIG18 is a first structural diagram of a middle frame body at a glue pulling structure provided by an embodiment of the present application;

[0053] FIG19 is a second structural diagram of a middle frame body at a glue pulling structure provided by an embodiment of the present application;

[0054] FIG20 is a third structural diagram of a middle frame body at a glue pulling structure provided in an embodiment of the present application;

[0055] FIG21 is a schematic structural diagram of the injection molded part in FIG12 at a first viewing angle;

[0056] FIG22 is a schematic structural diagram of the injection molded part in FIG12 at a second viewing angle;

[0057] FIG23 is a schematic structural diagram of the injection molded part in FIG12 from a third viewing angle;

[0058] FIG24 is a schematic structural diagram of the injection molded part in FIG12 at a fourth viewing angle;

[0059] FIG25 is an exploded view of another middle frame provided in an embodiment of the present application at a glue pulling structure;

[0060] FIG26 is an assembly diagram 1 of the injection molded part in FIG25 within the middle frame body;

[0061] FIG27 is a second assembly diagram of the injection molded part in FIG25 within the middle frame body;

[0062] FIG28 is a schematic structural diagram of the injection molded part in FIG25 at a first viewing angle;

[0063] FIG29 is a schematic structural diagram of the injection molded part in FIG25 at a second viewing angle;

[0064] FIG30 is a schematic structural diagram of the injection molded part in FIG25 from a second viewing angle;

[0065] FIG31 is a cross-sectional view of the middle frame in FIG16 at one of the injection molded parts;

[0066] FIG32 is an exploded view 1 of another middle frame at a glue pulling structure provided by an embodiment of the present application;

[0067] FIG33 is a second exploded view of another middle frame at a glue pulling structure provided by an embodiment of the present application;

[0068] FIG34 is a schematic structural diagram of the middle frame in FIG32 at an injection molded part;

[0069] FIG35 is a schematic structural diagram of the middle frame in FIG33 at an injection molded part;

[0070] FIG36 is a schematic structural diagram of the injection molded part in FIG33 from a first viewing angle;

[0071] FIG37 is a schematic structural diagram of the injection molded part in FIG33 from a second viewing angle;

[0072] FIG38 is a schematic structural diagram of the injection molded part in FIG33 from a third viewing angle;

[0073] FIG39 is a schematic structural diagram of the injection molded part in FIG33 from a fourth viewing angle;

[0074] FIG40 is an assembly view of the middle frame and the rear cover in FIG17 ;

[0075] FIG41 is a cross-sectional view of the middle frame in FIG40 at one of the injection molded parts;

[0076] FIG42 is a first cross-sectional view of the injection molded part after the rear cover is assembled to the middle frame in FIG34 ;

[0077] FIG43 is a second cross-sectional view of the injection molded part after the back cover is assembled to the middle frame in FIG34 ;

[0078] FIG44 is a first schematic diagram of another middle frame body at the adhesive structure provided in an embodiment of the present application;

[0079] FIG45 is a second structural diagram of another middle frame body at the adhesive structure provided in an embodiment of the present application;

[0080] FIG46 is a schematic structural diagram of another middle frame body at the glue pulling structure provided in an embodiment of the present application.

[0081] Explanation of reference numerals: 100 - foldable electronic device; 1 - middle frame; 11 - middle frame body; 111 - middle plate; 1111 - inclined surface; 112 - frame; 1121 - mating surface; 113 - axis area; 114 - adhesive structure; 1141 - adhesive groove; 1142 - second reinforcing protrusion; 1143 - adhesive cavity; 1144, 1147 - first limiting cavity; 1145, 1146 - communicating cavity; 1148 - reinforcing groove; 1149 - second limiting cavity; 115 - avoidance groove; 12 - injection molded part; 121 - injection molded body; 122 - adhesive portion; 1221, 1224 - first adhesive portion; 1222, 1223 - connecting portion; 1225 - first reinforcing protrusion; 123 - second adhesive portion; 124 - undercut portion; 2- hinge mechanism; 21- shaft cover; 3- back cover; 4- folding screen; 5- rigid display screen. DETAILED DESCRIPTION

[0082] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0083] An embodiment of the present application provides a foldable electronic device, which may include but is not limited to foldable fixed terminals or mobile terminals such as foldable screen mobile phones, tablet computers (i.e., pads), laptop computers, personal computers (PCs), ultra-mobile personal computers (UMPCs), smart wearable devices, etc.

[0084] 1 to 3 respectively illustrate schematic structural diagrams of a foldable electronic device 100 in different configurations.

[0085] 1 to 3 , the foldable electronic device 100 further includes a hinge mechanism 2 and two middle frames 1 , wherein the two middle frames 1 are rotatably connected to opposite sides of the hinge mechanism 2 so that the two middle frames 1 can rotate relative to each other around the hinge mechanism 2 to change the configuration of the foldable electronic device 100 .

[0086] For example, when the two middle frames 1 move toward each other relative to the hinge mechanism 2 in the direction indicated by the arrow in Figure 1, the foldable electronic device 100 can be in the folded state shown in Figure 2. As shown in Figure 2, when the foldable electronic device 100 is in the folded state, the two middle frames 1 are stacked on top of each other.

[0087] When the two middle frames 1 move away from each other in directions opposite to those indicated by the arrows in FIG. 1 , the foldable electronic device 100 can assume the flattened state shown in FIG. 3 . As shown in FIG. 3 , when the foldable electronic device 100 is in the flattened state, the two middle frames 1 cannot continue to rotate in directions opposite to those indicated by the arrows in FIG. 1 ; at this point, the two middle frames 1 are in the same plane. It should be noted that the connection between the two middle frames 1 and the hinge mechanism 2 can be found in the relevant descriptions of existing foldable electronic devices (such as foldable mobile phones) and will not be further elaborated here.

[0088] The foldable electronic device 100 may further include a back cover 3. In some embodiments, the back cover 3 may be placed on one of the middle frames 1 (as shown in FIG1 ). Alternatively, in other embodiments, the back cover 3 may be placed on both middle frames 1 at the same time. The position of the back cover 3 on the foldable electronic device 100 is not further limited in this application. The back cover 3 and at least one middle frame 1 may form a receiving cavity, which may house functional components of the foldable electronic device 100, such as a circuit board, battery, camera module, microphone, and speaker.

[0089] When the foldable electronic device 100 has a display function (for example, the foldable electronic device 100 is a foldable mobile phone), the foldable electronic device 100 may further include a display component (not shown in the figure), which may be electrically connected to the circuit board to enable the display of the display component and the user to operate the function on the display component.

[0090] The structure of the foldable electronic device 100 of the present application will be further described below using a foldable mobile phone as an example.

[0091] As shown in Figures 1 to 3, the display assembly may include a foldable screen 4, which may be a flexible display screen. The foldable screen 4 may cover the same side of the two midframes 1 and connect to the peripheral edges of the two midframes 1 to facilitate assembly of the foldable screen 4 on the foldable electronic device 100.

[0092] It should be noted that when the configuration of the foldable electronic device 100 changes, the shape of the foldable screen 4 also changes accordingly. For example, when the foldable electronic device 100 is in the folded state, the foldable screen 4 is also folded into the folded state, and when the foldable electronic device 100 is in the flat state, the foldable screen 4 is also unfolded into the flat state.

[0093] In some embodiments, both middle frames 1 can be folded toward the side where the folding screen 4 is located, so that the foldable electronic device 100 is in a folded state, and the folding screen 4 can be folded and located inside the foldable electronic device 100 (as shown in FIG2 ). In this case, the foldable electronic device 100 can be referred to as an inner folding screen electronic device.

[0094] FIG4 is a schematic structural diagram of another foldable electronic device 100 , and FIG5 is a schematic structural diagram of the foldable electronic device 100 in FIG4 in a folded state.

[0095] As shown in Figures 4 and 5, in some embodiments, both middle frames 1 can be moved toward a side away from the folding screen 4 to fold, so that the foldable electronic device 100 is in a folded state, and the folding screen 4 can still be in a folded state, but is completely exposed to the outside of the foldable electronic device 100. In this case, the foldable electronic device 100 can be called an external folding screen electronic device.

[0096] The structure of the foldable electronic device 100 of the present application will be further explained below by taking an inward-folding screen electronic device as an example.

[0097] When the foldable electronic device 100 is an inward-folding screen electronic device (such as an inward-folding screen mobile phone), in addition to the folding screen 4, the display component may also include a rigid display screen 5. The rigid display screen 5 and the back cover 3 may be respectively covered on a middle frame 1, and the rigid display screen 5 and the back cover 3 are located on the same side of the two middle frames 1.

[0098] As shown in Figure 5, the hinge mechanism 2 generally includes a shaft cover 21, a synchronous rotation component (not shown in the figure) and a door panel lifting component (not shown in the figure). The shaft cover 21 is a strip-shaped structure extending along the length direction of the foldable electronic device 100 (such as the Y direction mentioned above). The shaft cover 21 has a receiving groove (not shown in the figure) on the side facing the folding screen 4, and the synchronous rotation component and the door panel lifting component are assembled in the receiving groove. The shaft cover 21 is arranged between the two middle frames 1, and when the two rotate around the hinge mechanism 2, the position of the shaft cover 21 can remain relatively fixed, and the two middle frames 1 rotate relative to the shaft cover 21.

[0099] The width direction of the electronic device can be referred to as the X direction in FIG. 3 , and the thickness direction of the electronic device can be referred to as the Z direction in FIG. 3 .

[0100] FIG6 and FIG7 respectively illustrate cross-sectional views of the same middle frame 1a at an injection molded part 12 in the shaft area 113a from different perspectives in the related art.

[0101] As shown in Figures 6 and 7, both middle frames 1a have a shaft region 113a on the side facing the shaft mechanism 2 (not shown in the figures), where the shaft mechanism 2 (not shown in the figures) is installed. A shaft cover 21 (not shown in the figures) is provided on the shaft region 113a of the two middle frames 1a, and the shaft cover 21 is typically a metal cover. The middle frame 1a generally has a middle frame body 11a and an injection molded part 12a in the shaft region 113a. The middle frame body 11a can be understood as the other structures of the middle frame 1a excluding the injection molded part 12a in the shaft region 113a. The middle frame body 11a in the axis area 113a is usually a metal structure. The injection molded part 12a is integrally molded in the groove body (not marked in the figure) of the middle frame body 11a in the axis area 113a, and protrudes from the middle frame body 11a to support the axis cover 21, thereby preventing the metal structure from directly contacting the axis cover 21 and making abnormal noise when the middle frame 1a rotates relative to the axis cover 21, thereby improving the user experience of the foldable electronic device 100a.

[0102] FIG8 and FIG9 respectively illustrate schematic structural diagrams of the injection molded part 12a in FIG7 at different viewing angles.

[0103] Referring to Figures 8 and 9 in conjunction with Figure 7 , to ensure sufficient adhesive strength between the injection molded part 12a and the middle frame body 11a, an undercut 124 is formed on one side edge of the injection molded part 12a. The undercut 124 is an outwardly flared structure on the injection molded part 12a. Accordingly, the housing also includes a relief groove 115 that mates with the undercut 124, allowing the undercut 124 to fit within the relief groove 115. The cooperation between the undercut 124 and the relief groove 115 increases the adhesive strength between the injection molded part 12a and the middle frame body 11a.

[0104] As foldable electronic devices 100a, such as foldable mobile phones, become increasingly complex, the need to reduce the thickness and weight of the foldable electronic devices 100a becomes increasingly prominent.

[0105] Since the two middle frames 1a are distributed on both sides of the foldable electronic device 100a, the thickness of the middle frame 1a has a significant impact on the thickness of the foldable electronic device 100a on one side (single side). The direction of the thickness of the middle frame 1a can be referred to as the Z direction above.

[0106] As shown in FIG7 , in the prior art, the thickness of the foldable electronic device 100a is relatively thick on one side. For example, the thickness d1 of the injection molded part 12a in the axis region 113a of the middle frame 1a is generally 0.45mm. When the foldable electronic device 100a is mass-produced, the thickness d1 of the injection molded part 12a is generally greater than 0.3mm. The thickness d2 of the metal structure where the injection molded part 12 is embedded in the middle frame body 11a is generally 0.35mm. When the foldable electronic device 100a is mass-produced, the thickness d2 of the metal structure is generally greater than 0.30 or 0.33mm. This makes the thickness of the middle frame 1a where the injection molded part 12a is embedded in the axis region 113a generally greater than 0.6mm, so that the middle frame body 11a and the injection molded part 12a can be removed in the axis region 113a. This results in the existing middle frame 1a having a relatively thick thickness at the injection molded part 12a in the axis region 113a, making it difficult to meet the new thin and light form requirements of the foldable electronic device 100a.

[0107] In accordance with the requirements for a new thin and light form of the foldable electronic device 100a, the thickness of one side of the foldable electronic device 100a can be close to 5 mm, and the thickness of the middle frame 1a where the injection molded part 12a is provided in the axis area 113a needs to be controlled within 0.6 mm.

[0108] This poses a challenge to the thickness design of the middle frame 1a (especially the thickness of the axis region 113a). This is especially true when ensuring that the axis region 113a encompasses the middle frame body 11a and the injection molded component 12a. Furthermore, if the structural strength of the middle frame 1a is sacrificed by opening a hole in the middle frame body 11a to reduce its thickness, the existing undercut 124 design would be far from meeting the required bonding strength between the injection molded component 12a and the middle frame body 11a required by the foldable electronic device 100a.

[0109] Therefore, how to achieve the thinning of the middle frame 1a in the shaft area 113a while ensuring the bonding strength between the middle frame body 11a and the injection molded part 12a in the shaft area 113a has become a technical problem to be solved.

[0110] In view of this, an embodiment of the present application provides a shell assembly, which can be applied to a foldable electronic device 100. By setting a glue structure 114 and an injection molded part 12 in the axis area 113 of the middle frame 1 in the shell assembly, while achieving thinning of the middle frame 1 in the axis area 113, it is beneficial to meet the bonding strength of the middle frame body 11 and the injection molded part 12 in the axis area 113.

[0111] The structure of the housing assembly of the present application is further described below with reference to the accompanying drawings and embodiments.

[0112] FIG10 illustrates an exploded view of the middle frame 1 on one side of the foldable electronic device 100 , and FIG11 illustrates an assembly rendering of the middle frame 1 on one side of the foldable electronic device 100 .

[0113] As described above, foldable electronic device 100 includes a hinge mechanism 2. As shown in Figures 10 and 11 , the housing assembly includes two middle frames 1 rotatably disposed on either side of hinge mechanism 2. Only one middle frame 1 is illustrated in the figures to simplify the structure of the housing assembly. Rotation of the two middle frames 1 relative to hinge mechanism 2 changes the configuration of the housing assembly, allowing the housing assembly to transition between a folded state and a flattened state along with foldable electronic device 100.

[0114] Each middle frame 1 includes a middle frame body 11. A side edge of the middle frame body 11 defines a hinge region 113 for mounting the hinge mechanism 2. This allows the hinge mechanism 2 to be mounted on the hinge regions 113 of both middle frames 1, achieving a rotational connection between the two middle frames 1 and the hinge mechanism 2. The back cover 3 of the foldable electronic device 100 can be mounted on the side of the middle frame 1 facing away from the hinge mechanism 2. The assembled middle frame 1, back cover 3, and hinge mechanism 2 are shown in Figure 11.

[0115] The shaft regions 113 of the two middle frames 1 are each provided with a contoured structure in the area corresponding to the shaft cover 21 that matches the outer edge contour of the shaft cover 21. For example, if the outer edge contour of the shaft region 113 corresponding to the shaft cover 21 is arc-shaped, the surfaces of the two middle frames 1 in the shaft region 113 are also arc-shaped to match the outer edge contour of the shaft cover 21.

[0116] FIG12 illustrates a decomposed structure of a middle frame 1 on a glue structure 114 in the shaft area 113 from a side perspective of the shaft cover 21 .

[0117] As shown in FIG. 12 , the middle frame body 11 has a glue structure 114 in the shaft area 113 . The glue structure 114 includes a glue groove 1141 and a glue cavity 1143 located on the same side of the middle frame body 11 and interconnected. The glue cavity 1143 extends to the side of the middle frame body 11 opposite to the glue groove 1141 .

[0118] The size of the adhesive cavity 1143 on the side of the middle frame body 11 facing the shaft cover 21 is smaller than the size of the adhesive cavity 1143 on the side of the middle frame body 11 away from the shaft cover 21. The size of the adhesive cavity 1143 on the middle frame body 11 may include the size of the opening of the adhesive cavity 1143 on the middle frame body 11 (e.g., the length and width of the opening). The middle frame 1 also includes an injection molded part 12, which fills the adhesive groove 1141 and the adhesive cavity 1143 and is configured to support the shaft cover 21.

[0119] It should be noted that, similar to the middle frame body 11a in the related art, the middle frame body 11 in this application can also be understood as the remaining structure within the middle frame 1 except for the injection molded part 12 supporting the shaft cover 21. The middle frame body 11 can be a metal middle frame, or it can be a middle frame structure formed by metal and plastic injection molding. In this application, the structure and material of the middle frame body 11 are not further limited.

[0120] The middle frame body 11 is generally made of metal in the axis area 113. It is supported on the axis cover 21 by the injection molded part 12. This can prevent the part of the middle frame body 11 in the axis area 113 from directly touching the axis cover 21 and making abnormal noise when rotating relative to the axis cover 21, thereby improving the user experience of the foldable electronic device 100.

[0121] Since the glue pulling groove 1141 and the glue pulling cavity 1143 are connected to each other, and the size of the glue pulling cavity 1143 on the side of the middle frame body 11 facing the shaft cover 21 is smaller than the size of the glue pulling cavity 1143 on the side of the middle frame body 11 away from the shaft cover 21, after the injection molding process, the injection molded part 12 can be filled in the glue pulling groove 1141 and the glue pulling cavity 1143, and form an injection molding structure that is compatible with (the same as or similar to) the structure of the glue pulling groove 1141 and the glue pulling cavity 1143.

[0122] In this way, due to the presence of the glue cavity 1143, the injection molded part 12 can share the thickness of the middle frame body 11 in the axis area 113 with the middle frame body 11 after being filled in the glue cavity 1143. The thickness of the middle frame body 11 in the axis area 113 can be used to hide at least part of the thickness of the injection molded part 12, thereby reducing the thickness of the middle frame 1 in the axis area 113, thereby achieving thinning of the middle frame 1 in the axis area 113, and meeting the requirements of the foldable electronic device 100 for the new form of lightness and thinness and the strength of the middle frame 1.

[0123] Moreover, after the injection molded part 12 is filled in the glue cavity 1143 , it can also ensure that the partial structure of the injection molded part 12 in the glue cavity 1143 has sufficient thickness to meet the glue strength requirements of the middle frame 1 for the injection molded part 12 and the middle frame body 11 .

[0124] At the same time, based on the glue pulling groove 1141, through the setting of the glue pulling cavity 1143, compared with the structure of the above-mentioned existing injection molding part 12a, it can not only increase the glue pulling area of ​​the middle frame body 11 and the injection molding part 12 in the X direction and Y direction of the foldable electronic device 100, but also enhance the glue pulling strength and bonding strength of the injection molding part 12 and the middle frame body 11, so as to meet the requirements of the foldable electronic device 100 for the glue pulling strength and bonding strength of the injection molding part 12 and the middle frame body 11 in the axial area 113 of the middle frame 1.

[0125] In addition, the molded part 12 is connected to the wall of the glue groove 1141 so that the molded part 12 can be fastened to the middle frame body 11, thereby preventing the molded part 12 from escaping from the middle frame body 11 toward the side away from the shaft cover 21 (the side toward the rear cover 3). The molded part 12 is connected to the wall of the glue cavity 1143 so that the molded part 12 can also be prevented from escaping from the middle frame body 11 toward the shaft cover 21. Therefore, the provision of the glue groove 1141 and the glue cavity 1143 in this application can ensure that the molded part 12 is stably disposed in the middle frame body 11, thereby ensuring the structural stability of the middle frame 1.

[0126] Figure 13 illustrates an assembly diagram of the injection molded part 12 in Figure 12 on the side of the middle frame body 11 facing the shaft cover 21, and Figure 14 illustrates an assembly diagram of the injection molded part 12 in Figure 12 on the side of the middle frame body 11 facing the battery cover, so as to understand the assembly effect of the injection molded part 12 in the glue pulling structure 114.

[0127] Referring to FIG. 12 in conjunction with FIG. 13 or FIG. 14 , the injection molded part 12 includes an interconnected injection molded body 121 and a rubber portion 122. The injection molded body 121 is filled in the rubber portion 1141, and the rubber portion 122 is filled in the rubber portion 1143. The injection molded body 121 and the rubber portion 122 are both configured to support the shaft cover 21, thereby enabling the injection molded part 12 to support the shaft cover 21. During the rotation of the middle frame 1 relative to the shaft cover 21, the injection molded body 121 and the rubber portion 122 may support the shaft cover 21 individually or simultaneously, without further limitation herein.

[0128] 12 and in combination with FIG13 , the injection molding body 121 is connected to the glue groove 1141 so that the injection molding body 121 is engaged with the middle frame body 11 in the glue groove 1141 to prevent the injection molding part 12 from falling out from the side of the middle frame body 11 away from the shaft cover 21 .

[0129] The outer edge contour of the injection molding body 121 is adapted to the structure of the glue pulling groove 1141 (not marked in the figure), that is, the outer edge contour of the injection molding body 121 is consistent with the structure of the glue pulling groove 1141.

[0130] Referring to FIG. 12 and FIG. 14 , since the adhesive portion 122 is filled within the adhesive cavity 1143, the outer edge shape of the adhesive portion 122 matches the structure of the adhesive cavity 1143 (not shown in the figure), resulting in a larger dimension of the adhesive portion 122 on the side facing the shaft cover 21 than on the side away from the shaft cover 21. This interaction between the adhesive portion 122 and the wall of the adhesive cavity 1143 confines the molded part 12 within the middle frame body 11, preventing the molded part 12 from escaping from the middle frame body 11 on the side facing the shaft cover 21.

[0131] Therefore, the present application can confine the injection molded part 12 in the middle frame body 11 from different directions, thereby enhancing the structural stability of the middle frame 1 .

[0132] FIG. 15 shows a cross-sectional view of the middle frame 1 at the injection molded part 12 in FIG. 13 .

[0133] As shown in Figure 15, on this basis, through the provision of the glue cavity 1143, after the glue portion 122 is filled in the glue cavity 1143, the thickness of the middle frame body 11 in the axis area 113 can be shared with the middle frame body 11, so as to utilize the thickness of the middle frame body 11 in the axis area 113 to hide at least part of the thickness of the glue portion 122, so as to reduce the thickness of the middle frame 1 in the axis area 113, thereby achieving the thinning of the middle frame 1 in the axis area 113 while meeting the structural strength requirements of the foldable electronic device 100 for the middle frame 1.

[0134] It should be noted that, in this application, by setting up the adhesive structure 114 and the injection molded part 12, the thickness of the middle frame 1 in the axis area 113 can be made within 0.6 mm, so as to meet the lightweight and thin requirements of the new form of the foldable electronic device 100.

[0135] The injection molded part 12 can be a plastic structure integrally injection molded within the adhesive structure 114. The material of the plastic structure can include, but is not limited to, resin or other injection-molded non-metallic materials. The resin can include, but is not limited to, polyoxymethylene resin or a resin material that can be applied to the shaft area 113. In this application, the material of the injection molded part 12 is not further limited. Accordingly, during the process of injection molding the injection molded part 12 on the middle frame body 11, the injection molded body 121 and the adhesive portion 122 are also injected and formed within the adhesive structure 114.

[0136] The injection molded body 121 and the rubber portion 122 facing the shaft cover 21 may protrude from the surface of the middle frame body 11 , so that the injection molded part 12 is supported on the shaft cover 21 while preventing the middle frame body 11 from contacting the shaft cover 21 .

[0137] There are several adhesive structures 114, and several adhesive structures 114 can be arranged in the shaft area 113 of the middle frame 1 at intervals along the axial direction of the shaft cover 21 (as shown in Figure 10). The axial direction of the shaft cover 21 can refer to the Z direction above. For example, the number of adhesive structures 114 can be four, five, six, seven or eight. In the present application, there is no further limitation on the number of adhesive structures 114 on the middle frame body 11, so that an injection molded part 12 is formed in each adhesive structure 114 (not marked in the figure) to enhance the support effect of the injection molded part 12 on the shaft cover 21. The assembly structure of the injection molded part 12 on the opposite sides of the middle frame body 11 can be seen in Figures 16 and 17. Figure 16 shows the structure of the injection molded part 12 on the side of the middle frame body facing the shaft cover 21, and Figure 17 shows a structure of the injection molded part 12 on the side of the middle frame body facing the back cover 3.

[0138] As shown in Figure 16 , the middle frame body 11 includes a middle plate 111 and a frame 112. The frame 112 surrounds the edge of the middle plate 111 away from the shaft cover 21. The edge of the middle plate 111 facing the shaft cover 21 defines a shaft area 113, allowing the hinge mechanism 2 to be assembled with the edge of the middle plate 111 and rotatably connect the two middle frames 1. Furthermore, by surrounding the edge of the middle plate 111, the frame 112 and the middle plate 111 can form a cavity for accommodating components such as batteries, circuit boards, and camera modules.

[0139] It should be noted that to facilitate assembly of the folding screen 4 on the middle frame 1, the frame 112, except for the portion corresponding to the axis region 113, can extend to the side of the middle plate 111 facing the axis cover 21, so that the folding screen 4 can be fixed to the frame 112. Furthermore, since there is no extension of the frame 112 (no frame 112) on the side of the middle plate 111 facing the axis cover 21 corresponding to the axis cover 21, the formation of the axis region 113 and the arrangement of the hinge mechanism 2 on the middle frame 1 will not be affected.

[0140] FIG. 18 shows a first structural diagram of the middle frame 1 at the adhesive structure 114 .

[0141] As shown in Figure 18, the glue pulling groove 1141 is located at the edge of the middle plate 111 on the side of the shaft area 113, so that the injection molding body 121 can be formed on the side of the middle plate 111 on the side of the shaft area 113 to ensure that the injection molding part 12 is supported on the shaft cover 21.

[0142] The position of the middle frame body 11 in the axis region 113 corresponding to the border 112 has a greater thickness than other positions of the middle frame body 11 in the axis region 113 .

[0143] 18 in conjunction with FIG15 , at least a portion of the glue groove 1141 is located at a position of the middle plate 111 corresponding to the frame 112 within the shaft region 113 , thereby shortening the distance between the injection molded part 12 and the edge of the middle frame body 11 . This allows the injection molded part 12 to be supported on the shaft cover 21 while also preventing a large area of ​​thin walls on the middle plate 111 caused by the opening of the glue groove 1141 , which would affect the structural strength of the middle frame 1 at the glue groove 1141 .

[0144] It should be noted that the thinning of the thickness of the middle frame 1 in the axis area 113 of the present application mainly refers to the thinning of the thickness of the axis area 113 of the middle frame 1 in the area that does not correspond to the border 112, so as to avoid the middle frame 1 being too thick in this area, and after cooperating with the back cover 3, affecting the thickness of the foldable electronic device 100 at the middle frame 1 on one side.

[0145] The following further describes some possible structures of the glue pulling structure 114 and the injection molded part 12 in conjunction with specific embodiments.

[0146] Example 1

[0147] FIG19 shows a schematic structural diagram of the side of the middle frame 1 facing the shaft cover 21 at the adhesive structure 114 , and FIG20 shows a schematic structural diagram of the side of the middle frame body 11 facing the back cover 3 at the adhesive structure 114 .

[0148] 19 and 20 , the adhesive drawing cavity 1143 may include a first limiting cavity 1144 and a connecting cavity 1145 that communicate with each other. The first limiting cavity 1144 is located to the side of the adhesive drawing groove 1141, and the connecting cavity 1145 and the adhesive drawing groove 1141 are located on the same side of the middle frame body 11. The connecting cavity 1145 extends to the side of the middle frame body 11 opposite the adhesive drawing groove 1141, thereby communicating between the first limiting cavity 1144 and the adhesive drawing groove 1141. This allows the adhesive drawing cavity 1143 to communicate with the adhesive drawing groove 1141 while also extending through the connecting cavity 1145 to the side of the middle frame body 11 opposite the adhesive drawing groove 1141. During the injection molding process, the injection material can be filled into the adhesive drawing groove 1141, the connecting cavity 1145, and the first limiting cavity 1144, thereby filling the adhesive drawing structure with the injection molded part 12.

[0149] After the injection molded part 12 is filled in the glue pulling cavity 1143, the thickness of the middle frame 1 in the axis area 113 can be used to hide at least part of the thickness of the injection molded part 12 in the connecting cavity 1145 and the first limiting cavity 1144, so as to reduce the thickness of the middle frame 1 in the axis area 113, thereby achieving thinning of the middle frame 1 in the axis area 113, and meeting the requirements of the foldable electronic device 100 for the new form of lightness and thinness and the strength of the middle frame 1.

[0150] The connecting cavity 1145 is partially formed at the bottom of the adhesive drawing groove 1141 and communicates with the adhesive drawing groove 1141. The connecting cavity 1145 is a through-hole on the middle frame body 11 that extends through opposite sides of the middle frame body 11. The through-hole has the same radial dimensions along the thickness direction of the middle frame 1. This allows the connecting cavity 1145 to connect the first limiting cavity 1144 and the adhesive drawing groove 1141, while simplifying the adhesive drawing structure 114, facilitating the processing of the middle frame body 11, and reducing the processing cost of the middle frame 1. The opening shape of the connecting cavity 1145 may include, but is not limited to, an oblong, rectangular, or other shapes. In this application, the shape of the connecting cavity 1145 is not further limited.

[0151] In this embodiment, the first limiting cavity 1144 can be a through hole on the middle frame body 11, and the radial dimension of the first limiting cavity 1144 at the end adjacent to the shaft cover 21 is smaller than the radial dimension of the first limiting cavity 1144 at the end away from the shaft cover 21, so that when the first limiting cavity 1144 is connected to the connecting cavity 1145, a glue pulling cavity 1143 can be formed with the connecting cavity 1145, and the structural dimension of the glue pulling cavity 1143 on the side of the middle frame body 11 facing the shaft cover 21 is smaller than the structural dimension of the glue pulling cavity 1143 on the side of the middle frame body 11 away from the shaft cover 21, so that after the injection molded part 12 is filled in the first limiting cavity 1144, it can cooperate with the cavity wall of the first limiting cavity 1144 to prevent the injection molded part 12 from escaping from the side of the middle frame body 11 facing the shaft cover 21.

[0152] At the same time, compared with the setting of glue holes with equal apertures along the thickness direction of the middle frame 1, the cooperation between the first glue portion 1221 and the first limiting cavity 1144 can also increase the glue area of ​​the injection molded part 12 and the middle frame body 11 in the X and Y directions of the foldable electronic device 100, thereby enhancing the glue strength of the injection molded part 12 and the middle frame body 11 at the glue cavity 1143.

[0153] The structure of the middle frame 1 of this embodiment is further described below by taking the example that the radial dimension of the end of the first limiting cavity 1144 adjacent to the shaft cover 21 is smaller than the radial dimension of the end of the first limiting cavity 1144 away from the shaft cover 21 .

[0154] The first limiting cavity 1144 can be a horn hole with a radial dimension that gradually decreases along its own axial direction (as shown in FIG21 ). The axial direction of the first limiting cavity 1144 can be referred to as the Z direction above. The first limiting cavity 1144 has a larger radial end located on the side of the middle frame body 11 facing the rear cover 3, while the first limiting cavity 1144 has a smaller radial end located on the side of the middle frame body 11 facing the shaft cover 21. This prevents the injection molded part 12 from dislodging from the side of the middle frame body 11 facing the shaft cover 21 after it is mated and connected to the first limiting cavity 1144, thereby enhancing the bonding strength between the injection molded part 12 and the middle frame body 11 at the bonding cavity 1143.

[0155] In some embodiments, the first limiting cavity 1144 may also have other structures, for example, the first limiting cavity 1144 may be a stepped hole (stepped hole) or other through hole that meets the requirements. In this application, the structure of the first limiting cavity 1144 is not further limited.

[0156] The structure of the shell assembly of the present application is further described below by taking the speaker hole setting of the first limiting cavity 1144 as an example.

[0157] The number of the first limiting cavities 1144 is at least two (for example, two, four, etc.), and two first limiting cavities 1144 are shown in FIG21 . At least two first limiting cavities 1144 are symmetrically distributed on both sides of the glue pulling groove 1141. Correspondingly, the number of the first glue pulling portions 1221 is also at least two, and they correspond one to one with the first limiting cavities 1144. In this way, through the distribution of the first limiting cavities 1144 on the middle frame body 11, not only can the glue pulling strength and uniformity of the bonding strength between the injection molded part 12 and the middle frame body 11 be enhanced, but also the injection molded part 12 can be better limited by at least two first limiting cavities 1144 to ensure that the injection molded part 12 can be stably arranged in the glue pulling structure 114.

[0158] The first limiting cavity 1144 is located on one side of the glue drawing groove 1141 toward the middle of the middle frame body 11. After the injection molded part 12 is filled in the first limiting cavity 1144, the thickness of the middle frame body 11 in the axial region 113 can be used to hide at least part of the thickness of the injection molded part 12. While ensuring that the injection molded part 12 has sufficient thickness and glue drawing strength in the first limiting cavity 1144, the middle frame 1 is thinned in the axial region 113.

[0159] 21 to 24 respectively illustrate schematic structural diagrams of the injection molded part 12 in FIG. 12 at different viewing angles, so as to better understand the structure of the injection molded part 12 in the middle frame 1 .

[0160] 21 to 24 , the glue portion 122 of this embodiment may include a first glue portion 1221 and a connecting portion 1222. The connecting portion 1222 is connected between the injection molding body 121 and the first glue portion 1221 and is filled in the connecting cavity 1145. This allows the injection molding body 121 to be connected to the first glue portion 1221 while at the same time being able to utilize the thickness of the middle frame 1 in the axis area 113 to hide at least part of the thickness of the connecting portion 1222.

[0161] The first adhesive portion 1221 is filled within the first limiting cavity 1144, utilizing the thickness of the middle frame 1 in the shaft region 113 to conceal at least part of the thickness of the connecting portion 1222 while also forming a structure that is compatible with the structure of the first limiting cavity 1144. In other words, the radial dimension of the first adhesive portion 1221 on the side facing the shaft cover 21 is smaller than its radial dimension on the side facing the back cover 3, so that the first adhesive portion 1221 can be embedded in the first limiting cavity 1144 and cooperatively connected with the cavity wall of the first limiting cavity 1144, thereby enhancing the adhesive strength and bonding strength between the injection molded part 12 and the middle frame body 11 while preventing the injection molded part 12 from falling out of the side of the middle frame body 11 facing the back cover 3.

[0162] To further enhance the adhesive strength between the injection molded part 12 and the middle frame body 11, in some embodiments, the adhesive structure 114 may further include a second limiting cavity 1149 (as shown in FIG. 20 ). The second limiting cavity 1149 is connected to the side of the connecting cavity 1145 and is located on the same side of the middle frame body 11 as the adhesive groove 1141. The radial dimension of the second limiting cavity 1149 at the end adjacent to the shaft cover 21 can be larger than the radial dimension of the second limiting cavity 1149 at the end distal from the shaft cover 21. The injection molded part 12 is filled in the second limiting cavity 1149 to further increase the adhesive area between the injection molded part 12 and the middle frame body 11 in the X and Y directions of the foldable electronic device 100, thereby enhancing the adhesive strength between the injection molded part 12 and the middle frame body 11. Moreover, after the injection molded part 12 is filled in the second limiting cavity 1149, a structure compatible with the structure of the second limiting cavity 1149 can be formed, so that the injection molded part 12 can be further prevented from escaping from the side of the middle frame body 11 toward the back cover 3 through the cooperation between the injection molded part 12 and the cavity wall of the second limiting cavity 1149.

[0163] Compared with the arrangement of through holes with equal apertures along the thickness direction of the middle frame 1, the cooperation between the injection molded part 12 and the second limiting cavity 1149 can also increase the glue pulling area between the injection molded part 12 and the middle frame body 11 in the X and Y directions of the foldable electronic device 100, thereby enhancing the glue pulling strength between the injection molded part 12 and the middle frame body 11.

[0164] In some embodiments, the second limiting cavity 1149 can be a horn hole with a radial dimension that gradually decreases along its own axial direction. The axial direction of the second limiting cavity 1149 can refer to the Z direction above. Alternatively, similar to the first limiting cavity 1144, the second limiting cavity 1149 can also be a stepped hole (step hole) or other through hole that meets the requirements. In this application, the structure of the second limiting cavity 1149 is not further limited.

[0165] 23 and 24 , in some embodiments, the injection molded part 12 may further include a second adhesive portion 123 , which is connected to the side of the connecting portion 1222 and filled in the second limiting cavity 1149 , so that the adhesive area and adhesive strength between the middle frame body 11 and the injection molded part 12 are further increased through the cooperation and connection between the second adhesive portion 123 and the second limiting cavity 1149 .

[0166] The structure of the second adhesive portion 123 is compatible with the structure of the second limiting cavity 1149. In other words, the structural dimensions of the second adhesive portion 123 on the end adjacent to the shaft cover 21 can be larger than the structural dimensions of the second adhesive portion 123 on the end distal from the shaft cover 21. This mating connection between the second adhesive portion 123 and the wall of the second limiting cavity 1149 prevents the injection molded part 12 from escaping from the side of the middle frame body 11 distal from the shaft cover 21.

[0167] The structure of the shell assembly of the present application is further explained below by taking the speaker hole setting of the second limiting cavity 1149 as an example.

[0168] The second limiting cavity 1149 is located between two adjacent first limiting cavities 1144 (as shown in FIG. 20 ), so as to reasonably utilize the space between the two first limiting cavities 1144 of the middle frame body 11 and realize the setting of the second limiting cavity 1149 on the middle frame body 11 .

[0169] In some embodiments, the second limiting cavity 1149 is a blind hole on the side of the middle frame body 11 on the shaft region 113 (as shown in FIG. 21 ), which facilitates the formation of the second adhesive portion 123 while reducing the number of openings on the middle frame body 11. Alternatively, in some embodiments, the second limiting cavity 1149 is a through hole on the side of the middle frame body 11 on the shaft region 113, which can further diversify the structures of the adhesive structure 114 and the injection molded part 12.

[0170] FIG25 illustrates a decomposition diagram of another middle frame 1 at a glue pulling structure 114 , FIG26 illustrates an assembly diagram 1 of the injection molded part 12 in FIG25 within the middle frame body 11 , and FIG27 illustrates an assembly diagram 2 of the injection molded part 12 in FIG25 within the middle frame body 11 .

[0171] It should be noted that the shape of the adhesive structure 114 and the shape of the injection molded part 12 are not limited to the structures illustrated in Figures 19 and 21. In some embodiments, based on the above description, the adhesive structure 114 and the injection molded part 12 can also be derived into various modified structures. For example, the structure of the adhesive structure 114 and the injection molded part 12 can be as shown in Figure 25. Correspondingly, the assembly effect of the injection molded part 12 on the middle frame body 11 can be shown in Figures 26 and 27.

[0172] It should be noted that the adhesive structure 114 in Figure 25 also includes a first limiting cavity 1144, a connecting cavity 1145, and an adhesive groove 1141. The structure and location of each component within the adhesive structure 114 can be found in the relevant description of the aforementioned part of Example 1. Similarly, the injection molded part 12 also includes an injection molded body 121, a connecting portion 1222, a first adhesive portion 1221, and a second adhesive portion 123. Specifically, the structure of the injection molded part 12 can be found in the structures of Figures 28 to 30 and will not be further described here.

[0173] FIG31 illustrates a cross-sectional view of the middle frame 1 in FIG16 at one of the injection molded parts 12 , so as to further describe the thickness of the middle frame 1 in the shaft area 113 by taking the middle frame 1 in FIG16 as an example.

[0174] As shown in Figure 31, the minimum thickness of the shaft area 113 of the middle frame 1 can be less than 0.6mm. Due to the setting of the connecting cavity 1145 and the first limiting cavity 1144, the thickness of the shaft area 113 of the middle frame 1 is the smallest at the connecting cavity 1145. The thickness d3 at the connecting cavity 1145 can be greater than or equal to 0.33mm and less than 0.6mm. For example, the thickness d3 can be 0.35mm, 0.45mm, 0.50mm or 0.52mm, etc. Compared with the middle frame 1 in the related art (the minimum thickness of the shaft area 113 is more than 0.6mm), this embodiment can achieve thinning of the middle frame 1 in the shaft area 113 by setting the glue pulling cavity 1143.

[0175] Example 2

[0176] The middle frame 1 of this embodiment differs from that of the first embodiment in that the structure of the glue drawing cavity 1143 is different. The following further describes the differences between the middle frame 1 of this embodiment and that of the first embodiment with reference to the accompanying drawings.

[0177] FIG32 and FIG33 respectively illustrate exploded views of another middle frame 1 at a glue pulling structure 114 at different viewing angles.

[0178] As shown in Figures 32 and 33, the glue pulling cavity 1143 of this embodiment also includes a connecting cavity 1146 and a first limiting cavity 1147. Similar to Example 1, part of the connecting cavity 1146 is opened at the bottom of the glue pulling groove 1141 and is connected to the glue pulling groove 1141.

[0179] As shown in FIG32 and FIG33 , in some embodiments, the communication cavity 1146 can be a through hole in the middle frame body 11, and the radial dimensions of the communication cavity 1146 along the thickness direction of the middle frame 1 are all equal, so as to pass through opposite sides of the middle frame body 11. The thickness direction of the middle frame 1 can be referred to as the Z direction above.

[0180] The adhesive drawing cavity 1143 may further include a first limiting cavity 1147, which is located on a side of the middle frame body 11 opposite the adhesive drawing groove 1141. In other words, the first limiting cavity 1147 and the adhesive drawing groove 1141 are located on opposite sides of the middle frame body 11. The radial dimension of the first limiting cavity 1147 is greater than the radial dimension of the connecting cavity 1146. This ensures that the adhesive drawing cavity 1143 is formed when the first limiting cavity 1147 and the connecting cavity 1146 are connected. This ensures that the dimension of the adhesive drawing cavity 1143 on the side of the middle frame body 11 facing the shaft cover 21 is smaller than the dimension of the adhesive drawing cavity 1143 on the side of the middle frame body 11 away from the shaft cover 21. This ensures that, after the injection molded part 12 is filled in the adhesive drawing cavity 1143, the adhesive drawing area and adhesive strength between the injection molded part 12 and the middle frame body 11 are enhanced, thereby preventing the injection molded part 12 from escaping from the side of the middle frame body 11 facing the shaft cover 21.

[0181] The first limiting cavity 1147 is a groove located to the side of the connecting cavity 1146. The bottom of the groove is connected to the connecting cavity 1146, and the notch of the groove faces away from the adhesive groove 1141. In other words, the first limiting cavity 1147 is located on the side of the middle frame body 11 away from the shaft cover 21. The connecting cavity 1146 is connected to the adhesive groove 1141, so that after the injection molding process, the injection material can be filled into the adhesive groove 1141, the connecting cavity 1146, and the first limiting cavity 1147. The adhesive structure 114 is filled with the injection molded part 12, which increases the adhesive bonding area between the injection molded part 12 and the middle frame body 11 in the X and Y directions of the foldable electronic device 100, and enhances the adhesive bonding strength and bonding strength between the injection molded part 12 and the middle frame body 11.

[0182] After the injection molded part 12 is filled in the glue pulling cavity 1143, the thickness of the middle frame 1 in the axis area 113 can be used to hide at least part of the thickness of the injection molded part 12 in the connecting cavity 1145, so as to reduce the thickness of the middle frame 1 in the axis area 113, thereby achieving thinning of the middle frame 1 in the axis area 113, and meeting the requirements of the foldable electronic device 100 for the new form of lightness and thinness and the strength of the middle frame 1.

[0183] Furthermore, because the first limiting cavity 1147 is located on the side of the middle frame body 11 away from the shaft cover 21, the structural dimensions of the formed adhesive drawing cavity 1143 meet the requirements described above. In other words, the structural dimensions of the adhesive drawing cavity 1143 on the side of the middle frame body 11 facing the shaft cover 21 are smaller than those on the side of the middle frame body 11 away from the shaft cover 21. This allows the injection molded part 12, once filled into the first limiting cavity 1147, to mate with the cavity walls of the first limiting cavity 1144 and engage with the side of the middle frame body 11 facing the rear cover 3, preventing the injection molded part 12 from escaping from the side of the middle frame body 11 facing the shaft cover 21.

[0184] In this embodiment, the provision of the groove of the first limiting cavity 1147 can reduce the radial dimension of the communicating cavity 1146 on the side of the middle frame body 11 facing the rear cover 3, thereby reducing the area of ​​the hole in the middle frame body 11 and enhancing the structural strength of the middle frame 1.

[0185] The bottom of the groove and the bottom of the glue groove 1141 are both flat surfaces on the middle frame body 11, so that the injection molded part 12 can be in contact with the plane of the middle frame body 11 at the bottom of the groove and the bottom of the glue groove 1141, thereby enhancing the glue strength between the injection molded part 12 and the middle frame body 11 and enabling the injection molded part 12 to be buckled on both sides of the middle frame body 11 to prevent the injection molded part 12 from falling out of the middle frame body 11.

[0186] The bottom of the first limiting cavity 1147 further has a reinforcing groove 1148 (see FIG. 32 ). This allows the reinforcing groove 1148 to increase the adhesive bonding area of ​​the middle frame body 11 to the injection molded part 12 without affecting the thickness of the middle frame 1 at the first limiting cavity 1147 . Furthermore, the structural strength of the middle frame 1 at the first limiting cavity 1147 is further enhanced by the mating connection between the injection molded part 12 and the groove wall of the reinforcing groove 1148 .

[0187] There are at least two (e.g., two, four, etc.) communicating cavities 1146 , and FIG32 illustrates two communicating cavities 1146 . The at least two communicating cavities 1146 are symmetrically distributed on either side of the adhesive groove 1141 . The distribution of the communicating cavities 1146 and the connecting portions 1223 on the middle frame body 11 not only enhances the adhesive strength and uniformity of the bonding strength between the injection molded part 12 and the middle frame body 11 , but also provides a better position-limiting effect for the injection molded part 12 via the at least two communicating cavities 1146 , ensuring that the injection molded part 12 can be stably disposed within the adhesive structure 114 .

[0188] The bottom of the glue pulling groove 1141 also has a second reinforcing protrusion 1142, which is located between two adjacent connecting cavities 1146 and connected to the injection molded part 12 (as shown in Figure 33). This is so as not to affect the formation of the injection molded part 12 in the glue pulling structure 114 and the support of the injection molded part 12 on the shaft cover 21. At the same time, the second reinforcing protrusion 1142 can not only further increase the glue pulling area of ​​the middle frame body 11 for the injection molded part 12, thereby enhancing the bonding strength between the middle frame body 11 and the injection molded part 12, but also enhance the structural strength of the middle frame 1 at the second reinforcing protrusion 1142.

[0189] FIG34 is a schematic structural diagram of the middle frame 1 in FIG32 at an injection molded part 12 , and FIG35 is a schematic structural diagram of the middle frame 1 in FIG33 at an injection molded part 12 .

[0190] As shown in Figures 32 to 35, the glue portion 122 also includes a connecting portion 1223 filled in the connecting cavity 1146, and a first glue portion 1224 filled in the first limiting cavity. In this embodiment, the first glue portion 1224 is still indirectly connected to the injection molded body 121 through the connecting portion 1223. The first glue portion 1221 is engaged with the middle frame body 11 in the first limiting cavity to prevent the injection molded part 12 from escaping from the side of the middle frame body toward the shaft cover 21. Similar to Example 1, the connecting portion 1222 can use the thickness of the middle frame body 11 at the connecting cavity 1146 to hide at least part of its own thickness, thereby reducing the thickness of the middle frame 1 at the injection molded part 12 in the shaft area 113.

[0191] 36 to 39 illustrate schematic structural diagrams of the injection molded part 12 in FIG. 33 at different viewing angles.

[0192] As shown in Figures 36 to 39, the thickness of the connecting portion 1223 can be greater than the thickness of the injection molded body 121. This allows the connecting portion 1223 to connect the injection molded body 121 and the first adhesive portion 1224, while allowing the first adhesive portion 1224 and the injection molded body 121 to be located on opposite sides of the middle frame 1 and the middle frame body 11. This appropriately increases the thickness and structural strength of the middle frame 1 at the adhesive groove 1141 and the first limiting cavity 1147, thereby enhancing the adhesive strength between the injection molded part 12 and the middle frame body 11. The thickness of the connecting portion 1223 and the thickness of the injection molded body 121 are in the same direction, which can be referred to as the Z direction above.

[0193] When the adhesive structure 114 includes a reinforcement groove 1148, the first adhesive portion 1224 has a first reinforcement protrusion 1225 (see FIG33 ) on the side facing the injection molded body 121. The first reinforcement protrusion 1225 is formed within the reinforcement groove 1148. The assembly effect of the injection molded part 12 on the middle frame body 11 can be seen in FIG34 and FIG35 , and will not be further described here.

[0194] FIG40 illustrates an assembly view of the middle frame 1 and the back cover 3 in FIG17 , and FIG41 is a cross-sectional view of the middle frame 1 in FIG40 at one of the injection molded parts 12 .

[0195] 40 and 41 , the back cover 3 can be assembled on the side of the middle frame 1 opposite the shaft cover 21 and engage with the sidewalls of the frame 112 of the middle frame 1 to achieve assembly of the back cover 3 on the middle frame 1. The sidewalls of the frame 112 form a mating surface 1121 between the middle frame body 11 and the back cover 3.

[0196] As shown in Figure 41, due to factors such as material tolerances of the back cover 3 and assembly tolerances on the middle frame 1, a large gap may exist between the back cover 3 and the mating surface 1121. Since the injection molded part 12 is generally a plastic structure with a certain color, when the gap between the back cover 3 and the mating surface 1121 is large, the position of the injection molded part 12 corresponding to the gap will be exposed on the outside of the foldable electronic device 100, affecting the user experience of the foldable electronic device 100.

[0197] To this end, Figures 42 and 43 respectively illustrate cross-sectional views of the injection molded part 12 after the back cover 3 is assembled on the middle frame 1 in Figure 34 from different perspectives. As shown in Figures 42 and 43, the connecting cavity 1146 can be located on the side of the glue groove 1141 away from the edge of the middle frame body 11, and the first limiting cavity 1147 can be located on the side of the connecting cavity 1146 away from the glue groove 1141, so as to ensure that the injection molded part 12 can support the shaft cover 21 while making the injection molded part 12 as far away as possible from the mating surface 1121 on the middle frame body 11 that cooperates with the back cover 3 on the side of the middle frame body 11 facing the back cover 3, so as to achieve the effect of the injection molded part 12 being retracted toward the middle part (middle area) of the middle frame body 11 (the injection molded part 12 is retracted), which is beneficial to prevent the injection molded part 12 from being exposed to the outside of the foldable electronic device 100 from the side of the back cover 3, thereby improving the user experience of the foldable electronic device 100.

[0198] Moreover, by arranging the first limiting cavity 1147 to be located on the side of the communicating cavity 1146 away from the edge of the middle frame body 11, the first limiting cavity 1147 and the glue pulling groove 1141 can be distributed on both sides of the communicating cavity 1146. This not only prevents the first limiting cavity 1147 and the glue pulling groove 1141 from affecting the structural strength of the middle frame body 11 when they are opened on the same side of the communicating cavity 1146, but also facilitates the processing of the middle frame body 11.

[0199] It should be noted that the first limiting cavity 1147 and the communicating cavity 1146 are located within the projection range of the back cover 3 on the middle plate 111 (e.g., the projection range along the Z direction) to prevent the injection molded part 12 from being exposed to the outside of the foldable electronic device 100 through the gap between the back cover 3 and the mating surface 1121. In this application, only the middle frame body 11 is visible when viewed from the gap between the back cover 3 and the mating surface 1121.

[0200] It should be noted that in this application, there is no further limitation on the distance between the injection molded part 12 and the mating surface 1121, as long as the connection portion 1223 is not exposed outside the foldable electronic device 100. For example, the distance between the injection molded part 12 and the mating surface 1121 can be less than or equal to 0.3 mm.

[0201] Continuing to refer to Figure 43, the minimum thickness of the shaft area 113 of the middle frame 1 of this embodiment can be less than 0.6mm. The minimum thickness d4 of the shaft area 113 of the middle frame 1 of this embodiment at the injection molded part 12 can be greater than or equal to 0.33mm and less than 0.6mm. For example, the minimum thickness d4 can be 0.35mm, 0.41mm, 0.42mm or 0.52mm, etc. When the minimum thickness d4 of the middle frame 1 is 0.41mm, the thickness of the middle frame body 11 of the middle frame 1 at this position can be 0.19mm, and the thickness of the injection molded part 12 can be 0.22mm. Compared with the middle frame 1 in the related art (the minimum thickness of the shaft area 113 is 0.6mm or more), this embodiment can also achieve the thinning of the thickness of the middle frame 1 in the shaft area 113 by setting the glue cavity 1143.

[0202] It should be noted that the shape of the middle frame body 11 at the glue structure 114 in this embodiment 2 is not limited to what is shown in Figures 32 and 33. The glue structure 114 in this embodiment 2 can also be derived into many deformed structures. The glue cavity 1143 of the deformed structure includes a connecting cavity 1146 and a first limiting cavity 1147.

[0203] The following is an example of a possible adhesive structure 114 on the middle frame body 11.

[0204] Figures 44 and 45 respectively illustrate another structural schematic diagram of the middle frame body 11 at the adhesive structure 114 at different viewing angles. As shown in Figures 44 and 45 , in this example, the structural dimensions of the first limiting cavity 1147 are smaller than those of the first limiting cavity 1147 in Figure 32 , and the second reinforcing protrusion 1142 is provided at the bottom of the first limiting cavity 1147 . This enhances the adhesive strength between the middle frame body 11 and the injection molded part 12 while reducing the opening area of ​​the adhesive cavity 1143 on the side of the middle frame body 11 facing the rear cover 3 .

[0205] It should be noted that since the injection molded part 12 is formed integrally in the glue structure 114 by injection molding, when the glue structure 114 changes, the structure of the injection molded part 12 also changes accordingly. After injection molding, the outer structure of the injection molded part 12 matches (is the same as) the structure formed by the inner wall of the glue structure 114. Therefore, the structure of the injection molded part 12 that matches Figures 44 and 45 will not be further elaborated here. For details, please refer to the description of the relevant structure of the injection molded part 12 in Example 2.

[0206] FIG. 46 is a schematic structural diagram of another middle frame body 11 at the adhesive structure 114 .

[0207] As shown in FIG. 46 , in some embodiments, the bottom of the glue pulling groove 1141 of the middle frame body 11 can also be an inclined surface 1111 on the middle frame body 11 that is inclined toward the edge of the frame 112 of the middle frame body 11, so as to utilize the thickness of the frame 112 to further reduce the thickness of the middle frame 1 at the injection molded part 12 in the axis area 113, thereby achieving the lightness and thinness of the middle frame 1 at the injection molded part 12 in the axis area 113.

[0208] In addition to the above-mentioned hinge mechanism 2, the foldable electronic device 100 of the present application may also include any of the above-mentioned shell assemblies. As described above, the shaft cover 21 of the hinge mechanism 2 can be located in the shaft area 113 of the two middle frames 1 in the shell assembly, and the two middle frames 1 are rotatably arranged on both sides of the shaft cover 21.

[0209] The housing assembly of the present application can replace the two existing middle frames 1a in the foldable electronic device 100 and be assembled in the foldable electronic device 100 to facilitate the assembly of the hinge mechanism 2 between the two middle frames 1, thereby enabling the foldable electronic device 100 to switch between the flattened state and the folded state. Furthermore, due to the provision of the housing assembly, the shaft region 113 of the middle frame 1 on one side of the foldable electronic device 100 can be made thinner and lighter, thereby meeting the design requirements of the new form factor of the foldable electronic device 100 while also meeting the requirements of the foldable electronic device 100 for the adhesive strength and bonding strength between the middle frame body 11 and the injection molded part 12.

[0210] It should be noted that the structures of the housing assembly and the rotating shaft mechanism 2 can be found in the relevant description above and will not be further elaborated here.

[0211] As described above, the foldable electronic device 100 also includes a back cover 3 and a folding screen 4. The assembly positions of the back cover 3 and the folding screen 4 on the middle frame 1 can be found in the relevant description above and will not be further elaborated here.

[0212] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0213] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. A housing assembly, applied to a foldable electronic device, wherein the foldable electronic device comprises a hinge mechanism, characterized in that: The housing assembly comprises two middle frames rotatably disposed on both sides of the rotating shaft mechanism, each of the middle frames comprises a middle frame body and an injection molded part, and a side edge of the middle frame body defines an axis area for arranging the rotating shaft mechanism; The middle frame body has a glue pulling structure in the shaft area, and the glue pulling structure includes a glue pulling groove and a glue pulling cavity which are located on the same side of the middle frame body and are interconnected, and the glue pulling cavity passes through to the side of the middle frame body opposite to the glue pulling groove; the size of the glue pulling cavity on the side of the middle frame body facing the shaft cover of the rotating shaft mechanism is smaller than the size of the glue pulling cavity on the side of the middle frame body away from the shaft cover; the injection molded part is filled in the glue pulling groove and the glue pulling cavity, and is constructed to support the shaft cover.

2. The housing assembly according to claim 1, characterized in that: The injection molded part includes an injection molded body and a glue pulling part which are connected to each other. The injection molded body is filled in the glue pulling groove, the shaft cover, and the glue pulling part is filled in the glue pulling cavity. The injection molded body and the glue pulling part are both constructed to support the shaft cover.

3. The housing assembly according to claim 2, characterized in that: The middle frame body includes a middle plate and a frame, the frame is arranged around the peripheral edge of the middle plate away from the shaft cover, the edge of the middle plate on one side facing the shaft cover defines the shaft area, and the glue pulling groove is located at the edge of the middle plate on the side of the shaft area.

4. The housing assembly according to claim 3, characterized in that: At least a portion of the glue pulling groove is located at a position of the middle plate in the shaft area corresponding to the frame, and an outer edge contour of the injection molding body is adapted to the structure of the glue pulling groove.

5. The housing assembly according to claim 2, characterized in that: The outer edge shape of the glue pulling portion is adapted to the structure of the glue pulling cavity.

6. The housing assembly according to any one of claims 1 to 5, characterized in that: The glue pulling cavity includes a first limiting cavity and a connecting cavity which are interconnected, the first limiting cavity is located on the side of the glue pulling groove, the connecting cavity and the glue pulling groove are located on the same side of the middle frame body, and the connecting cavity passes through to the side of the middle frame body opposite to the glue pulling groove to connect between the first limiting cavity and the glue pulling groove.

7. The housing assembly according to claim 6, characterized in that: The first limiting cavity is a through hole on the middle frame body, and the radial dimension of the first limiting cavity adjacent to the shaft cover is smaller than the radial dimension of the first limiting cavity away from the shaft cover, or the radial dimension of the first limiting cavity is smaller than the radial dimension of the connecting cavity.

8. The housing assembly according to claim 7, characterized in that: The first limiting cavity is a horn hole whose radial dimension gradually decreases along its own axial direction.

9. The housing assembly according to claim 7, characterized in that: The first limiting cavity is located on one side of the glue pulling groove toward the middle of the middle frame body.

10. The housing assembly according to any one of claims 7 to 9, characterized in that: The glue pulling structure further includes a second limiting cavity, the second limiting cavity is connected to the side of the connecting cavity, and is located on the same side of the middle frame body as the glue pulling groove; The radial dimension of the second limiting cavity at one end adjacent to the shaft cover is larger than the radial dimension of the second limiting cavity at one end away from the shaft cover; the injection molded part is filled in the second limiting cavity.

11. The housing assembly according to claim 10, characterized in that: The second limiting cavity is a horn hole whose radial dimension gradually decreases along its own axial direction.

12. The housing assembly according to claim 11, characterized in that The number of the first limiting cavities is at least two, at least two of the first limiting cavities are symmetrically distributed on both sides of the glue pulling groove, and the second limiting cavity is located between two adjacent first limiting cavities.

13. The housing assembly according to claim 6, characterized in that The first limiting cavity is located on a side of the middle frame body opposite to the glue pulling groove, and a radial dimension of the first limiting cavity is greater than a radial dimension of the connecting cavity.

14. The housing assembly according to claim 13, characterized in that: The first limiting cavity is a groove located on the side of the connecting cavity, the groove bottom of the groove is connected with the connecting cavity, and the notch of the groove faces the side away from the glue drawing groove.

15. The housing assembly according to claim 14, characterized in that: The communication cavity is located at a side of the glue pulling groove away from the edge of the middle frame body, and the first limiting cavity is located at a side of the communication cavity away from the glue pulling groove.

16. The housing assembly according to claim 15, characterized in that The first limiting cavity and the connecting cavity are both located within the projection range of the back cover of the foldable electronic device on the middle frame body.

17. The housing assembly according to claim 14, characterized in that The groove bottom of the groove and the groove bottom of the glue drawing groove are both planes on the middle frame body.

18. The housing assembly according to claim 17, characterized in that The groove bottom of the groove also has a reinforcement groove.

19. The housing assembly according to any one of claims 13 to 18, characterized in that: There are at least two communicating cavities, and at least two communicating cavities are symmetrically distributed on both sides of the glue drawing groove.

20. The housing assembly according to claim 19, wherein: The bottom of the glue drawing groove also has a second reinforcement protrusion, and the second reinforcement protrusion is located between two adjacent connecting cavities and is connected to the injection molded part.

21. The housing assembly according to any one of claims 1 to 20, characterized in that: The bottom of the glue pulling groove is an inclined surface on the middle frame body that is inclined toward an edge of one side of the frame of the middle frame body.

22. The housing assembly according to any one of claims 1 to 20, characterized in that: The number of the rubber pulling structures is several, and the several rubber pulling structures are arranged in the shaft area at intervals along the axial direction of the shaft cover.

23. A foldable electronic device, characterized in that: It comprises a rotating shaft mechanism and a shell assembly as described in any one of claims 1-22, wherein the rotating shaft mechanism comprises a shaft cover, the shaft cover is located in the shaft area of ​​two middle frames in the shell assembly, and the two middle frames are rotatably arranged on both sides of the shaft cover.

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