Substrate wet processing device and substrate processing equipment

Abstract

The invention discloses a substrate wet processing device and substrate processing equipment, and relates to the technical field of semiconductor equipment, the device comprises a processing tank used for storing a processing liquid and enabling a plurality of substrates to be subjected to wet processing in the processing tank, the plurality of substrates are configured to be arranged at intervals along a first direction, the processing tank comprises an inner tank and an outer tank, and the inner tank and the outer tank are communicated with each other. The rotating driving part comprises a rotating shaft and an impeller, the rotating shaft extends in the first direction and is used for making contact with the outer edge of a substrate, the impeller is arranged in the outer groove and connected with the rotating shaft, and the rotating driving part is configured in the mode that the treating fluid overflowing to the outer groove falls onto the impeller to drive the impeller to rotate; the impeller rotates to drive the rotating shaft to rotate so as to drive the substrate to rotate. According to the method, the in-plane uniformity of the substrate in the wet processing process can be effectively improved, the more uniform etching rate and etching depth can be obtained during wet etching, and the consistency of the surface cleanliness of the substrate can be improved during wet cleaning.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a substrate wet processing device and a substrate processing equipment. BACKGROUND

[0002] In the semiconductor manufacturing process, wet processing (including wet etching and wet cleaning) is a crucial step, mainly used for removing specific materials or contaminants on the surface of the substrate. Currently, tank wet processing is one of the commonly used methods. This method usually immerses multiple substrates in a processing tank (such as an etching tank or a cleaning tank) to process the substrates through the processing liquid (such as etching liquid or cleaning liquid) in the tank.

[0003] However, in actual operation, the processing liquid in the processing tank often has uneven distribution. For example, the concentration or temperature of the processing liquid in different areas of the upper and lower layers of the processing tank may differ. These differences can cause the processing rate of the substrates vertically placed in the processing tank to differ between the different positions corresponding to the upper and lower layers of the processing tank. For wet etching, this can cause abnormal etching uniformity in the substrate plane, thereby affecting product yield; for wet cleaning, this can cause uneven cleaning of the substrate surface, affecting the subsequent process, and even causing a decrease in device performance.

[0004] Taking wet etching as an example, the non-uniformity of the concentration and temperature of the etching liquid can directly affect the etching reaction rate. In areas with higher concentration or higher temperature, the etching reaction will be faster, and vice versa. This non-uniformity can cause differences in etching rate and etching depth in the substrate plane, resulting in unevenness on the substrate surface, affecting the subsequent process, and even causing a decrease in device performance.

[0005] Similarly, in the wet cleaning process, the non-uniformity of the concentration and temperature of the cleaning liquid can also affect the cleaning effect. This non-uniformity can cause inconsistencies in the cleanliness of the substrate surface, affecting the subsequent process, and even causing a decrease in device performance. SUMMARY

[0006] The technical problem to be solved by the present application is to overcome the problem of uneven distribution of processing liquid in different areas of the substrate wet processing device in the prior art, and to provide a substrate wet processing device and a substrate processing equipment.

[0007] The present application solves the above technical problems by the following technical solutions: A substrate wet processing device, comprising: a processing tank for storing processing liquid and allowing multiple substrates to undergo wet processing in the processing tank, wherein the multiple substrates are configured to be spaced apart along a first direction, the processing tank comprises an inner tank and an outer tank, the outer tank is arranged outside the inner tank, and the processing liquid in the inner tank can overflow to the outer tank; a rotating driving member, comprising a rotating shaft extending along the first direction and configured to contact the outer edge of the substrate, and an impeller disposed in the outer groove and connected to the rotating shaft, the rotating driving member being configured such that the processing liquid overflowing into the outer groove falls on the impeller to drive the impeller to rotate, and the rotation of the impeller drives the rotating shaft to rotate and in turn drives the substrate to rotate.

[0008] Preferably, the processing tank further comprises a flow guide plate disposed on the outer wall of the inner groove, the lower end of the flow guide plate being provided with a liquid outlet disposed above the impeller.

[0009] Preferably, the inner groove comprises an overflow surface through which the processing liquid in the inner groove overflows into the outer groove, and the flow guide plate is disposed on the overflow surface.

[0010] Preferably, the size of the flow channel enclosed by the flow guide plate decreases downward along the vertical direction.

[0011] Preferably, two rotating driving members are respectively disposed at two side positions of the plurality of substrates, and the rotating directions of the two rotating driving members are the same.

[0012] Preferably, the processing tank further comprises a substrate supporting part disposed in the inner groove, the substrate supporting part being configured to support the plurality of substrates, and the substrate supporting part being configured to descend to disengage the substrate supporting part from the plurality of substrates when the rotating driving member drives the plurality of substrates to rotate.

[0013] Preferably, the rotating shaft comprises a first end penetrating through the inner groove and disposed in the outer groove, and the impeller is connected to the first end.

[0014] Preferably, the rotating shaft comprises a second end disposed in the inner groove, and the processing tank further comprises a limiting part disposed on the side of the inner groove facing the second end, and the second end is located in the limiting part.

[0015] Preferably, the processing tank further comprises: a processing liquid supply part configured to supply processing liquid to the inner groove; a circulation pipeline connected between the processing liquid supply part and the outer groove and configured to deliver the processing liquid in the outer groove to the processing liquid supply part; and a circulation pump disposed on the circulation pipeline; and / or a bubble generating part disposed below the plurality of substrates and configured to form bubbles in the processing liquid.

[0016] Preferably, a limiting scale is further included and disposed above the plurality of substrates for limiting the plurality of substrates.

[0017] A substrate wet processing apparatus includes: A processing tank for storing a processing liquid and allowing a plurality of substrates to be wet processed in the processing tank, wherein the plurality of substrates are configured to be spaced apart along a first direction; A rotating drive including a rotating shaft extending along the first direction for contacting an outer edge of the substrate and an impeller connected to the rotating shaft; A nozzle disposed in the processing tank and facing the impeller, the nozzle being configured to spray a fluid toward the impeller to drive the impeller to rotate the rotating shaft and thereby rotate the substrate.

[0018] Preferably, the processing tank includes an inner tank and an outer tank, the outer tank being disposed outside the inner tank, and the processing liquid in the inner tank being able to overflow to the outer tank; The impeller is disposed in the outer tank and connected to the rotating shaft; The nozzle is disposed in the outer tank.

[0019] Preferably, two rotating drives are respectively disposed at both sides of the plurality of substrates, and the two rotating drives have the same rotating direction.

[0020] Preferably, a substrate support is further included and disposed in the processing tank, the substrate support being configured to support the plurality of substrates, and the substrate support being configured to descend to disengage the substrate support from the substrate when the rotating drive rotates the substrate.

[0021] Preferably, the rotating shaft includes a second end disposed in the inner tank, and the processing tank further includes a limiting member disposed at a side of the inner tank facing the second end, the second end being in the limiting member, and the limiting member being configured to limit the second end from shaking.

[0022] Preferably, the processing tank further includes: A processing liquid supply configured to supply a processing liquid to the inner tank; A circulation line connected between the processing liquid supply and the outer tank and configured to deliver the processing liquid in the outer tank to the processing liquid supply; and A circulation pump disposed on the circulation line; and / or A bubble generator disposed below the plurality of substrates and configured to form bubbles in the processing liquid.

[0023] A substrate processing apparatus comprising a substrate wet processing device as described above, the substrate processing apparatus further comprising: a single substrate cleaning device for cleaning a single substrate; a drying device for drying a single substrate; a substrate transfer device for transferring a substrate between the substrate wet processing device and the single substrate cleaning device, and / or transferring a substrate in the single substrate cleaning device to the drying device.

[0024] The positive progress effect of the present application is that multiple substrates rotate in the processing tank, so that the relative positions of each point on the substrate in the processing liquid are constantly changing, reducing the problem of uneven processing rate caused by the processing liquid concentration, temperature difference of different heights or different areas of the processing tank. Therefore, the in-plane uniformity of the substrate during wet processing can be effectively improved, and more uniform etching rate and etching depth can be obtained during wet etching, and the consistency of the substrate surface cleanliness can be improved during wet cleaning. In addition, the centrifugal force generated by the rotation of the substrate can promote the by-products (such as bubbles, etching residues, etc.) generated during the processing to separate from the substrate surface. It is beneficial to improve the quality of substrate processing, thereby ensuring the smooth progress of subsequent processes and improving device performance and product yield. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 FIG. 1 is a structural schematic diagram of a substrate wet processing device according to an embodiment of the present application; Figure 2 FIG. 2 is a structural schematic diagram of an inner tank overflow surface of the substrate wet processing device according to the embodiment of the present application; Figure 3 FIG. 3 is another structural schematic diagram of the substrate wet processing device according to the embodiment of the present application; Figure 4 FIG. 4 is a structural schematic diagram of the inside of the processing tank of the substrate wet processing device according to the embodiment of the present application; Figure 5 FIG. 5 is a structural schematic diagram of a substrate wet processing device according to another embodiment of the present application; Figure 6 FIG. 6 is another structural schematic diagram of the substrate wet processing device according to the embodiment of the present application; Figure 7 FIG. 7 is a front view schematic diagram of the inner tank structure according to the embodiment of the present application; Figure 8 FIG. 8 is a structural schematic diagram of a substrate processing apparatus according to another embodiment of the present application. DETAILED DESCRIPTION

[0026] The present application will be further described below by way of examples, but the present application is not limited to the scope of the examples.

[0027] Example 1 AsFigure 1 and Figure 2 As shown in FIG. 1, the embodiment provides a substrate wet processing device, which includes a processing tank 100, a substrate supporting part 200, and a rotating driving part 300. The processing tank 100 is used to store processing liquid and to perform wet processing on a plurality of substrates 400 in the processing tank 100, wherein the plurality of substrates 400 are arranged at intervals along a first direction X, and the processing tank 100 includes an inner tank 110 and an outer tank 120, the outer tank 120 is arranged outside the inner tank 110, and the processing liquid in the inner tank 110 can overflow to the outer tank 120. The rotating driving part 300 includes a rotating shaft 310 and an impeller 320, the rotating shaft 310 extends along the first direction X, the rotating shaft 310 is used to contact the outer edge of the substrate 400, and the impeller 320 is arranged in the outer tank 120 and connected with the rotating shaft 310. The rotating driving part 300 is configured to drive the impeller 320 to rotate by allowing the processing liquid overflowing to the outer tank 120 to fall on the impeller 320, and the rotation of the impeller 320 drives the rotating shaft 310 to rotate to drive the substrate 400 to rotate.

[0028] The processing liquid overflowing to the outer tank 120 falls on the impeller 320, which can drive the impeller 320 and the rotating shaft 310 to rotate, and in turn drive the plurality of substrates 400 to rotate in the processing tank 100, so that the relative positions of each point on the substrate 400 in the processing liquid are constantly changed, and the problem of uneven processing rate caused by the difference in processing liquid concentration and temperature at different heights or different areas of the processing tank 100 is reduced. Thus, the in-plane uniformity of the substrate 400 during wet processing can be effectively improved, and more uniform etching rate and etching depth can be obtained during wet etching, and the consistency of the surface cleanliness of the substrate 400 can be improved during wet cleaning. In addition, the centrifugal force generated by the rotation of the substrate 400 can promote the by-products (such as bubbles, etching residues, etc.) generated during the processing to separate from the surface of the substrate 400. This is conducive to improving the quality of the processing of the substrate 400, thereby ensuring the smooth progress of the subsequent process and improving the device performance and product yield. The power source for the rotation of the impeller 320 comes from the kinetic energy of the processing liquid overflowing to the outer tank 120, and the rotation of the substrate 400 can be realized without additional power mechanism, which simplifies the driving structure, avoids the driving complexity caused by the introduction of additional driving parts (such as motors or air cylinders, etc.), and solves the problem of pollution of the processing liquid.

[0029] In some embodiments, as Figure 2As shown, the treatment tank 100 further comprises a flow guide plate 130, which is arranged on the outer wall of the inner tank 110. The lower end of the flow guide plate 130 is provided with a liquid outlet 131, which is arranged above the impeller 320. By arranging the flow guide plate 130 on the inner tank 110 and arranging the liquid outlet 131 at the lower end of the flow guide plate 130, the treatment liquid flowing down can be effectively guided to the upper side of the impeller 320, avoiding the energy loss caused by the disordered flow of the treatment liquid, so that the liquid flow impact on the impeller 320 is more concentrated and efficient, thereby improving the driving effect and rotation stability of the impeller 320, and ensuring that the substrate 400 can rotate more uniformly in the treatment tank 100.

[0030] In some embodiments, the inner tank 110 comprises an overflow surface 111, and the treatment liquid in the inner tank 110 flows over the overflow surface 111 to the outer tank 120. The flow guide plate 130 is arranged on the overflow surface 111. In some embodiments, the overflow surface 111 is a flat surface. Figure 2 As shown, the overflow surface 111 comprises an overflow portion 1111, which is specifically a groove structure, and the treatment liquid in the inner tank 110 flows over the overflow portion 1111 to the outer tank 120. In some embodiments, the overflow portion 1111 can also be a through-hole structure.

[0031] In some embodiments, as shown in the drawings, Figure 2 As shown, the size of the flow channel surrounded by the flow guide plate 130 decreases downward along the vertical direction. The size of the flow channel gradually decreases downward along the vertical direction, which can accelerate the treatment liquid flowing down, so that the liquid flow is more concentrated and has a higher flow rate when it is close to the impeller 320, thereby enhancing the impact force of the liquid flow on the impeller 320 and improving the driving force of the impeller 320.

[0032] In some embodiments, as shown in the drawings, Figure 2As shown, two rotating driving members 300 are arranged at both sides of the plurality of substrates 400, and the rotating directions of the two rotating driving members 300 are the same, wherein the rotating direction of the rotating driving member 300 is the rotating direction of the impeller 320 and the rotating shaft 310. By arranging two rotating driving members 300 at both sides of the lower part of the plurality of substrates 400 and making the rotating directions of the two rotating driving members 300 the same, the rotating driving force can be applied to the outer edges of the substrates 400 from both sides at the same time, thereby avoiding the uneven stress problem caused by a single driving member, so that the plurality of substrates 400 can maintain a stable rotating state, which is beneficial to further improve the in-plane uniformity of the substrates 400 in the wet treatment process and improve the overall treatment effect. Among them, the flow guide plate 130 is also provided with two, which are one-to-one corresponding to the impeller 320 of each rotating driving member 300. In order to make the rotating directions of the rotating driving members 300 the same, the liquid outlets 131 of the two flow guide plates 130 are located at the same side of the two impellers 320, and then the treatment liquid flowing out of the liquid outlet 131 can drive the two impellers 320 to rotate in the same direction. Specifically, the rotating driving member 300 is arranged at the lower part of the plurality of substrates 400. The position of the rotating driving member 300 is low, and the potential energy of the gravity overflow of the treatment liquid is large.

[0033] In some embodiments, the number of rotating driving members 300 is not limited to two, and one or more numbers can also be arranged.

[0034] In some embodiments, the substrate carrying part 200 is arranged in the inner groove 110, and the substrate carrying part 200 is used to carry the plurality of substrates 400.

[0035] In some embodiments, the rotating shaft 310 can be connected with the substrate carrying part 200 through a bearing to fix the rotating shaft 310.

[0036] In some embodiments, the substrate carrying part 200 is configured to lower the substrate carrying part 200 to separate the substrate carrying part 200 from the substrate 400 when the rotating driving member 300 drives the substrate 400 to rotate. Among them, the substrate carrying part 200 includes a plurality of clamping grooves, the substrate 400 is located in the clamping groove, and the lowering distance of the substrate carrying part 200 is controlled within the depth range of the clamping groove, so that when the substrate 400 shakes during rotation, the substrate carrying part 200 can limit the substrate 400. The substrate wet treatment device further comprises a lifting device, and the substrate carrying part 200 is connected with the lifting device, and the substrate carrying part 200 is driven to rise and fall through the lifting device.

[0037] By configuring the substrate carrier 200 to descend when the rotating driving member 300 drives the substrate 400 to rotate, the substrate carrier 200 is separated from the substrate 400, which can avoid the friction resistance or local jamming phenomenon of the substrate 400 in the rotating process due to the continuous contact between the substrate carrier 200 and the substrate 400, thereby ensuring the smoothness and stability of the rotation of the substrate 400. In addition, the contact point between the traditional substrate carrier 200 and the substrate 400 is fixed, and the processing liquid cannot cover the contact point area, which is easy to form a mark in the contact point area of the substrate 400. In the embodiment, by changing the static contact between the substrate 400 and the substrate carrier 200 to dynamic contact between the substrate 400 and the rotating shaft 310, the position of the contact point on the substrate 400 will change with the rotation of the substrate 400. Each contact point is only blocked for a short time, so there will be no obvious mark on the substrate 400.

[0038] In some embodiments, the rotating shaft 310 includes a first end 311, the first end 311 passes through the inner groove 110 and is arranged in the outer groove 120, and the impeller 320 is connected with the first end 311. Specifically, the first end 311 passes through the overflow surface 111 of the inner groove 110.

[0039] In some embodiments, as shown in Figure 3 The rotating shaft 310 also includes a second end 312, which is arranged in the inner groove 110. The processing tank 100 also includes a limiting piece 140 arranged on one side of the inner groove 110 towards the second end 312, and the second end 312 is in the limiting piece 140, which is used to limit the shaking of the second end 312. By arranging the limiting piece 140 on one side of the inner groove 110 towards the second end 312 of the rotating shaft 310, and making the second end 312 in the limiting piece 140, the shaking of the second end 312 in the rotating process can be effectively limited, and the rotation instability or uneven contact with the outer edge of the substrate 400 caused by the deviation of the rotating shaft 310 can be avoided. Wherein, the limiting piece 140 is specifically a limiting groove surrounding the second end 312, and there is a certain gap between the second end 312 and the limiting piece 140. In the normal rotating state, the second end 312 does not contact the limiting piece 140, and only in the case of abnormal shaking, the second end 312 contacts the limiting piece 140, thereby playing a limiting role.

[0040] In some embodiments, the material of the rotating shaft 310 can be quartz or PTFE (polytetrafluoroethylene). The surface roughness of the area where the rotating shaft 310 contacts the substrate 400 is greater than the surface roughness of the first end 311 and / or the second end 312. Specifically, this can be achieved by surface sandblasting the area where the rotating shaft 310 contacts the substrate 400. This increases the friction between the rotating shaft 310 and the substrate 400, making it easier to rotate the substrate 400. The lower surface roughness of the first end 311 and / or the second end 312 helps reduce friction with the inner groove.

[0041] In some embodiments, such as Figure 3 As shown, a bearing 700 is provided between the first end 311 of the rotating shaft 310 and the overflow surface 111 to reduce the friction between the first end 311 and the overflow surface 111, and to improve the rotational stability of the rotating shaft 310. The bearing 700 can be made of corrosion-resistant materials such as ceramic or PTFE.

[0042] In some embodiments, such as Figure 4 As shown, the substrate wet processing apparatus also includes a processing liquid supply unit 510, a circulation pipeline 520, and a circulation pump 530. The processing liquid supply unit 510 supplies processing liquid to the processing tank 100. The circulation pipeline 520 connects the processing liquid supply unit 510 and the outer tank 120, and is used to transport the processing liquid in the outer tank 120 to the processing liquid supply unit 510. The circulation pump 530 is installed on the circulation pipeline 520. By providing the processing liquid supply unit 510 below the substrate support 200, and combining it with the circulation pipeline 520 and the circulation pump 530, the processing liquid in the outer tank 120 can be recycled. This not only ensures a continuous supply and flow of the processing liquid in the processing tank 100, but also improves the utilization rate of the processing liquid and reduces operating costs. Furthermore, the circulation effect makes the concentration and temperature of the processing liquid in the processing tank 100 more uniform. The processing liquid supply unit 510 is located below the substrate support 200.

[0043] In some embodiments, the substrate wet processing apparatus further includes a bubble generation unit 540 disposed below the substrate support portion 200 for forming bubbles in the processing liquid. By providing the bubble generation unit 540 below the substrate support portion 200 and forming bubbles in the processing liquid, liquid flow and convection can be promoted, improving the exchange efficiency of the processing liquid on the surface of the substrate 400, thereby enhancing the etching or cleaning effect and further improving product yield.

[0044] In some embodiments, the substrate wet processing apparatus further includes a limiting caliper disposed above multiple substrates to limit the multiple substrates and prevent large displacement of the substrates during rotation.

[0045] Example 2 The embodiment is basically the same as the scheme in Embodiment 1, and the difference is the driving mode of the impeller 320. In the embodiment, as shown in Figure 5 The substrate wet processing device includes a processing tank 100, a substrate support 200, a rotary driving member 300, and a spray head 600. The processing tank 100 is used to store a processing liquid and to perform wet processing on a plurality of substrates 400 in the processing tank 100, wherein the plurality of substrates 400 are arranged at intervals along a first direction X. The rotary driving member 300 includes a rotary shaft 310 and an impeller 320. The rotary shaft 310 extends along the first direction X and is used to contact the outer edges of the substrates 400. The impeller 320 is connected to the rotary shaft 310. The spray head 600 is arranged in the processing tank 100 and faces the impeller 320. The spray head 600 is configured to spray fluid (such as gas flow and / or liquid flow) toward the impeller 320 to drive the impeller 320 to rotate the rotary shaft 310 and thus rotate the substrates 400. The rotary shaft 310 can be connected to the processing tank 100 through a bearing to fix the rotary shaft 310.

[0046] By arranging the spray head 600 as a power source in the processing tank 100 and facing the spray head 600 toward the impeller 320, the gas flow and / or liquid flow sprayed by the spray head 600 directly impact the impeller 320, thereby driving the impeller 320 to rotate and rotate the rotary shaft 310, and thus rotating the plurality of substrates 400. This method can use the kinetic energy of the sprayed fluid to rotate the substrates 400, without the need for additional complex mechanical driving structures, simplifying the device structure and avoiding potential mechanical contamination sources and maintenance complexity.

[0047] In some embodiments, as shown in Figure 6 and Figure 7 The processing tank 100 includes an inner tank 110 and an outer tank 120. The outer tank 120 is arranged outside the inner tank 110, and the processing liquid in the inner tank 110 can overflow to the outer tank 120. The impeller 320 is arranged in the outer tank 120 and is connected to the rotary shaft 310. The spray head 600 is arranged in the outer tank 120. By using the inner tank 110 and the outer tank 120 structure in the processing tank 100, and making the processing liquid in the inner tank 110 overflow to the outer tank 120, extending the first end 311 of the rotary shaft 310 to the outer tank 120 and connecting it to the impeller 320, and arranging the spray head 600 in the outer tank 120, the gas flow and / or liquid flow sprayed by the spray head 600 can directly impact the impeller 320 in the outer tank 120, thereby driving the rotary shaft 310. This structural design avoids the interference of arranging the spray head 600 directly in the inner tank 110 on the processing liquid flow field of the substrates 400.

[0048] Specifically, the rotary shaft 310 includes a first end 311 that passes through the inner tank 110 and is arranged in the outer tank 120, and the impeller 320 is connected to the first end 311.

[0049] In some embodiments, a bearing is provided between the first end 311 of the rotating shaft 310 and the inner groove 110 to reduce the friction between the first end 311 and the inner groove 110 and to improve the rotational stability of the rotating shaft 310. The bearing may be made of corrosion-resistant materials such as ceramic or PTFE.

[0050] In some embodiments, two rotary drive members 300 are respectively disposed on both sides of the plurality of substrates 400, and the two rotary drive members 300 rotate in the same direction. Specifically, the rotary drive members 300 are disposed at the lower part of the plurality of substrates 400.

[0051] In some embodiments, a substrate carrier 200 is further included, disposed in the processing groove 100, for carrying a plurality of substrates 400. The substrate carrier 200 is configured such that when the rotation drive 300 drives the substrates 400 to rotate, the substrate carrier 200 descends to disengage from the substrates 400.

[0052] In some embodiments, the rotating shaft 310 includes a second end 312 disposed within the inner groove 110. The processing groove 100 also includes a limiting member disposed on the side of the inner groove 110 facing the second end 312. The second end 312 is located within the limiting member, and the limiting member is used to limit the swaying of the second end 312.

[0053] In some embodiments, refer to the appendix of embodiment 1 Figure 4 The substrate wet processing apparatus also includes a processing liquid supply unit 510, a circulation pipeline 520, and a circulation pump 530. The processing liquid supply unit 510 supplies processing liquid to the inner tank 110. The circulation pipeline 520 connects the processing liquid supply unit 510 and the outer tank 120, and is used to transport the processing liquid in the outer tank 120 to the processing liquid supply unit 510. The circulation pump 530 is installed on the circulation pipeline 520. The processing liquid supply unit 510 is located below the substrate support portion 200. In some embodiments, the substrate wet processing apparatus further includes a bubble generating unit 540 disposed below the substrate support unit 200 for generating bubbles in the processing liquid.

[0054] Example 3 like Figure 8As shown, the present embodiment provides a substrate processing apparatus, which includes the substrate wet processing device 810 as above, and further includes a single substrate cleaning device 820, a drying device 830, and a substrate transfer device 840. The single substrate cleaning device 820 is used to clean a single substrate. The drying device 830 is used to dry the single substrate. The substrate transfer device 840 is used to transfer the substrate between the substrate wet processing device 810 and the single substrate cleaning device 820, and / or to transfer the substrate in the single substrate cleaning device 820 to the drying device 830.

[0055] The drying device 830 includes, but is not limited to, a supercritical drying device, an isopropyl alcohol (IPA) drying device, an ultra thermodry (UTD) drying device, and a surface modification treatment (SMT) drying device.

[0056] Although the specific embodiments of the present application are described above, those skilled in the art should understand that this is only an example. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present application, and these changes and modifications all fall within the protection scope of the present application.

Claims

1. A substrate wet processing apparatus, characterized in that, include: A processing tank for storing processing liquid and performing wet processing on multiple substrates, wherein the multiple substrates are configured to be spaced apart along a first direction, the processing tank includes an inner tank and an outer tank, the outer tank being disposed outside the inner tank, and the processing liquid in the inner tank being able to overflow into the outer tank; A rotary drive includes a rotary shaft and an impeller. The rotary shaft extends along a first direction and is used to contact the outer edge of the substrate. The impeller is disposed in the outer groove and connected to the rotary shaft. The rotary drive is configured such that treatment liquid overflowing into the outer groove falls onto the impeller to drive the impeller to rotate, and the rotation of the impeller drives the rotary shaft to rotate, thereby driving the substrate to rotate.

2. The substrate wet processing apparatus as described in claim 1, characterized in that, The treatment tank also includes a guide plate, which is disposed on the outer wall of the inner tank. The lower end of the guide plate is provided with a liquid outlet, which is located above the impeller.

3. The substrate wet processing apparatus as described in claim 2, characterized in that, The inner tank includes an overflow surface, through which the treatment liquid in the inner tank overflows into the outer tank, and the guide plate is disposed on the overflow surface.

4. The substrate wet processing apparatus as described in claim 2, characterized in that, The size of the flow channel enclosed by the guide plate decreases downward in the vertical direction.

5. The substrate wet processing apparatus as described in claim 1, characterized in that, The two rotating drive members are respectively disposed on both sides of the plurality of substrates, and the two rotating drive members rotate in the same direction.

6. The substrate wet processing apparatus as described in claim 1, characterized in that, It also includes a substrate support portion disposed in the inner groove. The substrate support portion is used to support the plurality of substrates. The substrate support portion is configured such that when the rotation drive member drives the substrate to rotate, the substrate support portion descends to disengage from the substrate.

7. The substrate wet processing apparatus as described in claim 1, characterized in that, The rotating shaft includes a first end, which passes through the inner groove and is disposed in the outer groove, and the impeller is connected to the first end.

8. The substrate wet processing apparatus as described in claim 1, characterized in that, The rotating shaft includes a second end, which is disposed within the inner groove. The processing groove also includes a limiting member, which is disposed on the side of the inner groove facing the second end, and the second end is located within the limiting member.

9. The substrate wet processing apparatus as described in claim 1, characterized in that, Also includes: A treatment fluid supply unit is used to supply treatment fluid to the inner tank; A circulation pipeline is connected between the treatment liquid supply unit and the outer tank, for transporting the treatment liquid in the outer tank to the treatment liquid supply unit; as well as A circulation pump is installed on the circulation pipeline; and / or A bubble generating section is disposed below the plurality of substrates and is used to generate bubbles in the processing liquid.

10. The substrate wet processing apparatus as described in claim 1, characterized in that, It also includes a limiting caliper, which is set above the plurality of substrates to limit the plurality of substrates.

11. A substrate wet processing apparatus, characterized in that, include: A processing tank for storing a processing liquid and performing wet processing on a plurality of substrates, wherein the plurality of substrates are configured to be spaced apart along a first direction; A rotary drive includes a rotary shaft and an impeller, the rotary shaft extending along the first direction and used to contact the outer edge of the substrate, the impeller being connected to the rotary shaft; A nozzle is disposed within the processing tank and faces the impeller. The nozzle is configured to spray fluid toward the impeller to drive the impeller to rotate the rotating shaft, thereby causing the substrate to rotate.

12. The substrate wet processing apparatus as described in claim 11, characterized in that, The treatment tank includes an inner tank and an outer tank, the outer tank being disposed outside the inner tank, and the treatment liquid in the inner tank being able to overflow into the outer tank; The impeller is disposed in the outer groove and is connected to the rotating shaft; The nozzle is disposed inside the outer groove.

13. The substrate wet processing apparatus as described in claim 11 or 12, characterized in that, The two rotating drive members are respectively disposed on both sides of the plurality of substrates, and the two rotating drive members rotate in the same direction.

14. The substrate wet processing apparatus as described in claim 11 or 12, characterized in that, It also includes a substrate carrier portion disposed in the processing groove. The substrate carrier portion is used to carry the plurality of substrates. The substrate carrier portion is configured such that when the rotation drive member drives the substrate to rotate, the substrate carrier portion descends to detach from the substrate.

15. The substrate wet processing apparatus as described in claim 12, characterized in that, The rotating shaft includes a second end, which is disposed within the inner groove. The processing groove also includes a limiting member, which is disposed on the side of the inner groove facing the second end. The second end is located within the limiting member, and the limiting member is used to limit the shaking of the second end.

16. The substrate wet processing apparatus as described in claim 12, characterized in that, Also includes: A treatment fluid supply unit is used to supply treatment fluid to the inner tank; A circulation pipeline is connected between the treatment liquid supply unit and the outer tank, for transporting the treatment liquid in the outer tank to the treatment liquid supply unit; as well as A circulation pump is installed on the circulation pipeline; and / or A bubble generating section is disposed below the plurality of substrates and is used to generate bubbles in the processing liquid.

17. A substrate processing apparatus, characterized in that, The substrate wet processing apparatus as described in any one of claims 1-16, further comprising: Single-wafer cleaning unit, used for cleaning a single substrate; Drying equipment for drying individual substrates; A substrate transfer device is used to transfer a substrate between the substrate wet processing device and the single-wafer cleaning device, and / or to transfer a substrate in the single-wafer cleaning device to the drying device.

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