Positioning device for wafer precision marking equipment

Abstract

The invention discloses a positioning device for wafer precision marking equipment, and relates to the technical field of wafer processing and production.The positioning device for the wafer precision marking equipment comprises a base frame, the top of the base frame is fixedly connected with a fixing frame, and a suction groove is formed in the fixing frame; a main body circular plate and a circular frame which are used for adjusting the position of a wafer are arranged in the base frame, a main body clamping rod and an abutting plate which are used for pushing the wafer to be located at the marking position are arranged in the fixing frame, and a first clamping block which provides power for the main body clamping rod is arranged in the fixing frame. The edge of the processed wafer is pressed down, so that the edge of the processed wafer which cannot be attached to the rubber suction cup due to warping is in contact with the rubber surface, at the moment, the gas in the rubber suction cup is sucked away by the gas suction mechanism through the suction groove, and all positions of the processed wafer are stably attached to the surfaces of all the rubber suction cups.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer processing, in particular to a positioning device for a wafer precision marking equipment. BACKGROUND

[0002] The wafer precision marking equipment is a high-precision processing equipment for semiconductor manufacturing, which is mainly used for permanent marking on the wafer surface, such as laser marking or mechanical carving, to mark product model, batch number, two-dimensional code and other key information, and its function is to realize accurate tracking and quality management of the wafer, ensure clear marking and non-damage to the wafer structure through high-resolution and non-contact marking technology, and meet the marking requirements of small size and complex patterns in the semiconductor industry, so as to improve the controllability of the production process, reduce the error rate, and support the whole-process tracking of subsequent packaging, testing and supply chain management.

[0003] The wafer is accurately positioned to the marking station through an automatic transmission system, and the alignment mark of the wafer is recognized by a visual positioning system to ensure the accuracy of the marking position, and then according to the preset marking content, the equipment marks the wafer surface by laser or mechanical etching, etc., and through the real-time feedback system to control the energy, focal length and speed in the process to avoid thermal damage or physical stress affecting the wafer performance, and after the marking is completed, the equipment performs secondary optical detection to verify the marking quality to ensure that the clarity and contrast meet the industry standards, and then the wafer is conveyed to the next process.

[0004] In the process of marking the wafer, negative pressure is often generated on the lower surface of the wafer through the suction port to fix the wafer at the processing position, and the wafer often has the problem of edge warping, which causes the suction port and the wafer surface to be unable to fit, resulting in air leakage and unable to generate negative pressure on the lower surface of the wafer, thereby reducing the wafer positioning effect and causing the wafer to slide during the marking process. SUMMARY

[0005] Technical problems solved In view of the deficiencies of the prior art, the application provides a positioning device for a wafer precision marking equipment, which solves the problem of poor wafer positioning effect in the background technology.

[0006] Technical scheme In order to achieve the above object, the present application is realized by the following technical scheme: A positioning device for wafer precision marking equipment, comprising a base frame, a fixed frame is fixedly connected to the top of the base frame, a suction slot is formed in the inside of the fixed frame, a main circular plate for adjusting the position of the wafer is arranged in the inside of the base frame, a plurality of circular frames are arranged in an annular array on the upper end of the main circular plate, a main clamping rod and a stop plate for pushing the wafer to the marking position are arranged in the inside of the fixed frame, a first clamping block and a round head sliding shaft for providing power to the main clamping rod according to the different positions of the wafer on the top of the fixed frame are arranged in the inside of the fixed frame, and a swing block and a lower pressing plate for pressing the top of the wafer to make the wafer more closely adhere to the surface of the suction cup are arranged in the inside of the fixed frame.

[0007] Preferably, a main groove is formed in the inside of the base frame, the main circular plate is slidably connected to the inside of the main groove, a plurality of jacking grooves are formed in an annular array in the inside of the fixed frame, the circular frames are slidably connected to the inside of the jacking grooves, an inner shaft is slidably connected to the inside of the circular frame, the inner shaft is fixedly connected to the main circular plate, a clamping groove is formed in the inside of one end of the circular frame, a clamping plate is slidably connected to the inside of the clamping groove, the clamping plate is fixedly connected to the inner shaft, a machining groove is formed in the upper surface of the fixed frame, a rubber suction cup is fixedly connected to the lower inner wall of the machining groove, the rubber suction cup is communicated with the suction slot, the circular frame extends to the inside of the machining groove, and a wafer for machining is placed on the upper surface of the circular frame.

[0008] Preferably, a first groove is formed in the inner wall of the end of the jacking groove away from the fixed frame, the first clamping block is slidably connected to the inside of the first groove, the first clamping block is fixedly connected to the circular frame, a second groove is formed in the inner wall of the first groove, a second clamping block is slidably connected to the inside of the second groove, a first spring is fixedly connected to the inside of the second groove, and the first spring is fixedly connected to the second clamping block.

[0009] Preferably, the inside of the fixed frame is annularly arrayed with a plurality of transverse sliding grooves in communication with the first groove, the main body clamping rod is slidably connected to the inside of the transverse sliding groove, the inside of the transverse sliding groove is fixedly connected with the fourth spring, the main body clamping rod is fixedly connected with the fourth spring, one side of the main body clamping rod is fixedly connected with the adjusting sliding plate, the inner wall of the transverse sliding groove is provided with a guide groove, the inside of the guide groove is slidably connected with a guide block, the guide block is fixedly connected with the adjusting sliding plate, the surface of the adjusting sliding plate is provided with a position adjusting sliding groove, the side of the circular frame is provided with an extension groove, the inside of the extension groove is slidably connected with an extension sliding rod, the extension sliding rod is fixedly connected with the inner shaft, the circular head sliding shaft is slidably connected to the inside of one end of the extension sliding rod, the inside of one end of the extension sliding rod is fixedly connected with the second spring, the second spring is fixedly connected with the extension sliding rod, the circular head sliding shaft extends to the inside of the position adjusting sliding groove, one end of the main body clamping rod is slidably connected with a first clamping rod, the first clamping rod is T-shaped, the abutting plate is fixedly connected to one end of the first clamping rod close to the processed wafer, the main body clamping rod and the abutting plate are fixedly connected with the third spring.

[0010] Preferably, the position adjusting sliding groove is divided into a positioning groove and a recovery groove, the depth of the positioning groove is greater than that of the recovery groove, the positioning groove is a bent groove, the positioning groove includes two staggered vertical grooves, the two vertical grooves in the positioning groove are communicated through an inclined groove, the recovery groove is a vertical groove, and the position adjusting sliding groove is in communication with the main body groove.

[0011] Preferably, the inside of the fixed frame is annularly arrayed with a plurality of third grooves, the inside of the third groove is slidably connected with a main body pulling rod, one side of the main body pulling rod away from the processed wafer is fixedly connected with a third clamping block, the inner wall of the third groove away from the processed wafer is provided with a power sliding groove, the inside of the power sliding groove is slidably connected with a power sliding shaft, one end of the power sliding shaft away from the processed wafer is provided with a fourth groove, the inside of the power sliding groove is fixedly connected with a sixth spring, the sixth spring is fixedly connected between the power sliding shaft, the inside of the fourth groove is slidably connected with a fourth clamping block, the side close to the main body pulling rod of the fourth clamping block is provided as an inclined surface, the inside of the fourth groove is fixedly connected with a fifth spring, the fourth clamping block is fixedly connected with the fifth spring, the inner wall of the third groove is fixedly connected with a recovery clamping block, and the top of the recovery clamping block is provided as an inclined surface close to the power sliding shaft.

[0012] Preferably, the fourth clamping block extends to the inside of the third groove, the fourth clamping block is located on the sliding path of the third clamping block, the recovery clamping block is located on the sliding path of the fourth clamping block, the thickness of the third clamping block and the recovery clamping block is not greater than half the thickness of the fourth clamping block, and the recovery clamping block is not located on the sliding path of the third clamping block.

[0013] Preferably, the surface of the fixed frame is provided with a plurality of swing grooves in an annular array, the swing grooves are communicated with the power sliding groove, the inside of the swing groove is fixedly connected with a fixed clamping shaft, one end of the swing block is rotatably connected to the end of the power sliding shaft away from the sixth spring, the surface of the swing block is provided with a pressing groove, the fixed clamping shaft penetrates and is inserted into the inside of the pressing groove, the pressing groove is divided into a vertical groove and an inclined groove, the end of the swing block away from the power sliding shaft is fixedly connected with a top block, the inside of the end of the top block close to the processing wafer is slidably connected with a second clamping rod, the pressing plate is fixedly connected to the surface of the end of the second clamping rod away from the top block, and the pressing plate and the top block are fixedly connected with a seventh spring.

[0014] Beneficial effects The positioning device for the wafer precision marking equipment has the following beneficial effects: 1. When the circular frame slides downward, the second clamping block limits the first clamping block, so that the circular frame is limited and cannot continue to slide. The main clamping rod is driven by the sliding plate to move towards the processing wafer. During the movement of the main clamping rod towards the processing wafer, the four direction abutting plates move towards each other, so that the processing wafer is ensured to be located at the center of the processing groove, thereby improving the precision of subsequent processing.

[0015] 2. When the processed wafer positioned is located on the upper surface of the rubber suction cup, the second clamping rod changes from the state of being away from the processing position of the processing wafer to being located directly above the edge of the processing wafer. The pressing plate located directly above the edge of the processing wafer slides vertically downward along the vertical groove of the pressing groove under the driving of the swing block, and then presses the edge of the processing wafer, so that the edge of the processing wafer which cannot be attached to the rubber suction cup due to warping is in contact with the rubber surface. At this time, the gas in the rubber suction cup is sucked away through the suction slot by the suction mechanism, so that the processing wafer is stably attached to the surface of each rubber suction cup.

[0016] 3. The processing wafer is centrally positioned during the swing of the swing block, and is immediately pressed after the positioning is completed. The positioning device has the core advantages of fast response, high-precision positioning and stable processing integration, and eliminates the risk of re-deviation of the processing wafer due to reset deviation in operation and external vibration during the lifting process after the positioning is completed. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present application; Figure 2 It is a schematic diagram of the internal structure of the base frame of the present application; Figure 3 It is a schematic diagram of the internal structure of the fixed frame of the present application; Figure 4It is the inside structure schematic view of the transverse sliding groove of the present application; Figure 5 It is the structure schematic view of the base frame front view of the present application; Figure 6 It is the inside structure schematic view of the No. 3 groove of the present application; Figure 7 It is the connection structure schematic view of the swing block of the present application.

[0018] The figure marks represent respectively: 1, base frame; 11, fixed frame; 12, suction slot; 2, main body groove; 21, main body round plate; 22, jacking groove; 23, inner shaft; 24, circular frame; 25, clamping slot; 26, clamping plate; 27, processing groove; 28, rubber suction disc; 29, processed wafer; 3, No. 1 groove; 31, No. 1 clamping block; 32, No. 2 groove; 33, No. 1 spring; 34, No. 2 clamping block; 4, transverse sliding groove; 41, main body clamping rod; 42, adjusting sliding plate; 43, adjusting sliding groove; 44, extension groove; 45, extension sliding rod; 46, round head sliding shaft; 47, No. 2 spring; 48, No. 1 clamping rod; 49, No. 3 spring; 410, abutting plate; 411, No. 4 spring; 412, guide groove; 413, guide block; 5, No. 3 groove; 51, main body pull rod; 52, No. 3 clamping block; 53, power sliding groove; 54, power sliding shaft; 55, No. 4 groove; 56, No. 4 clamping block; 57, No. 5 spring; 58, No. 6 spring; 59, recovery clamping block; 6, swing groove; 61, fixed clamping shaft; 62, swing block; 63, pressing groove; 64, top block; 65, No. 2 clamping rod; 66, No. 7 spring; 67, pressing plate. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0020] REFERENCE Figures 1 to 7, a positioning device for a wafer precision marking equipment according to a preferred embodiment of the application will be described in detail below, including a base frame 1, a fixed frame 11 is fixedly connected to the top of the base frame 1, a suction slot 12 is formed in the inside of the fixed frame 11, a main circular plate 21 for adjusting the position of the wafer is arranged in the inside of the base frame 1, a plurality of circular frames 24 are arranged in an annular array at the upper end of the main circular plate 21, a main clamping rod 41 and a position stop plate 410 for pushing the wafer to the marking position are arranged in the inside of the fixed frame 11, a No. 1 clamping block 31 and a round head sliding shaft 46 for providing power to the main clamping rod 41 according to the different positions of the wafer on the top of the fixed frame 11 are arranged in the inside of the fixed frame 11, and a swing block 62 and a lower pressing plate 67 for pressing the top of the wafer to make the wafer more closely adhere to the surface of the suction cup are arranged in the inside of the fixed frame 11.

[0021] As Figure 2 With Figure 3 In the inside of the base frame 1, a main slot 2 is formed, the main circular plate 21 is slidingly connected in the inside of the main slot 2, a motorized telescopic rod is fixedly connected in the inside of the main slot 2, the main circular plate 21 is fixedly connected with the output shaft of the motorized telescopic rod, a plurality of jacking grooves 22 are formed in an annular array in the inside of the fixed frame 11, the circular frame 24 is slidingly connected in the inside of the jacking groove 22, the inner shaft 23 is slidingly connected in the inside of the circular frame 24, the inner shaft 23 is fixedly connected with the main circular plate 21, the end of the circular frame 24 is formed with a clamping groove 25 in the inside, the clamping groove 25 is slidingly connected with a clamping plate 26 in the inside, the clamping plate 26 is fixedly connected with the inner shaft 23, a machining groove 27 is formed on the upper surface of the fixed frame 11, a rubber suction cup 28 is fixedly connected to the inner wall below the machining groove 27, the rubber suction cup 28 is communicated with the suction slot 12, the circular frame 24 extends to the inside of the machining groove 27, and a machining wafer 29 is placed on the upper surface of the circular frame 24, when the machining wafer 29 is placed on the upper surface of the circular frame 24 by the mechanical claw and the surface of the machining wafer 29 needs to be marked, the output shaft of the motorized telescopic rod drives the main circular plate 21 to slide downward, thereby driving the inner shaft 23 to slide downward, the circular frame 24 loses the support of the inner shaft 23 and slides downward under the action of its own gravity and the pressure of the machining wafer 29, thereby driving the machining wafer 29 to slide downward until it is closely adhered to the surface of the rubber suction cup 28.

[0022] As Figure 3 With Figure 4In the middle, the inner wall of the jacking groove 22 away from the fixed frame 11 one end is provided with a slot 3, a card block 31 is slidably connected to the inside of the slot 3, the card block 31 is fixedly connected with the circular frame 24, the inner wall of the slot 3 is provided with a second slot 32, the second slot 32 is slidably connected with a second card block 34, the inside of the second slot 32 is fixedly connected with a spring 33, the spring 33 is fixedly connected with the second card block 34, when the circular frame 24 slides downward, the card block 31 is driven to slide downward, the card block 31 contacts with the second card block 34, and then the second card block 34 gives the card block 31 a limit, so as to limit the circular frame 24, so that the circular frame 24 cannot continue to slide.

[0023] The inside of the fixed frame 11 is provided with a plurality of transverse sliding grooves 4 in a ring array, each transverse sliding groove 4 is communicated with an adjacent No. 1 groove 3, a main clamping rod 41 is slidingly connected in the inside of the transverse sliding groove 4, a No. 4 spring 411 is fixedly connected in the inside of the transverse sliding groove 4, the main clamping rod 41 is fixedly connected with the No. 4 spring 411, an adjusting sliding plate 42 is fixedly connected on one side of the main clamping rod 41, a guide groove 412 is formed in the inner wall of the transverse sliding groove 4, a guide block 413 is slidingly connected in the inside of the guide groove 412, the guide block 413 is fixedly connected with the adjusting sliding plate 42, a positioning sliding groove 43 is formed in the surface of the adjusting sliding plate 42, the positioning sliding groove 43 is divided into a positioning groove and a recovery groove, the depth of the positioning groove is greater than that of the recovery groove, the positioning groove is a bent groove, the positioning groove comprises two staggered vertical grooves which are communicated through an inclined groove, the recovery groove is a vertical groove, the positioning sliding groove 43 is communicated with the main groove 2, that is, the lower ends of the positioning groove and the recovery groove are both in an open shape, the bottoms of the positioning groove and the recovery groove are both communicated with the main groove 2, an extension groove 44 is formed in the side surface of the circular frame 24, an extension sliding rod 45 is slidingly connected in the inside of the extension groove 44, the extension sliding rod 45 is fixedly connected with the inner shaft 23, a round head sliding shaft 46 is slidingly connected in the inside of one end of the extension sliding rod 45, a No. 2 spring 47 is fixedly connected in the inside of one end of the extension sliding rod 45, the No. 2 spring 47 is fixedly connected with the extension sliding rod 45, the round head sliding shaft 46 is slidingly connected with the extension sliding rod 45, the depth of the arc-shaped part of the round head sliding shaft 46 is less than that of the positioning groove of the positioning sliding groove 43, the round head sliding shaft 46 extends into the inside of the positioning sliding groove 43, the circular frame 24 cannot slide downward with the inner shaft 23, the processing wafer 29 stays above the fixed frame 11 under the support of the circular frame 24, the inner shaft 23 continuously slides downward, drives the round head sliding shaft 46 to slide downward through the extension sliding rod 45, and then gives a pushing force to the inner wall of the positioning groove of the positioning sliding groove 43, and then drives the main clamping rod 41 to move towards the processing wafer 29 through the adjusting sliding plate 42, one end of the main clamping rod 41 is slidingly connected with a No. 1 clamping rod 48, the No. 1 clamping rod 48 is T-shaped, a locating plate 410 is fixedly connected with the No. 1 clamping rod 48 at the end close to the processing wafer 29, a No. 3 spring 49 is fixedly connected between the main clamping rod 41 and the locating plate 410, the No. 3 spring 49 is sleeved on the No. 1 clamping rod 48, in the process of the main clamping rod 41 moving towards the processing wafer 29, the four locating plates 410 move towards each other, thereby ensuring that the processing wafer 29 is located at the center of the processing groove 27, and in order to avoid that the locating plate 410 excessively presses the processing wafer 29 and damages it, when the processing wafer 29 is located at the center of the processing groove 27, the main clamping rod 41 continues to move towards the processing wafer 29, the processing wafer 29 gives a limit to the surface of the locating plate 410, the main clamping rod 41 slides along the surface of the No. 1 clamping rod 48, the No. 3 spring 49 plays a buffering role, thereby avoiding excessive pressing of the processing wafer 29, and with the continuous sliding of the inner shaft 23, the round head sliding shaft 46 is driven by the inner shaft 23 to move out of the inside of the positioning sliding groove 43,And the card position plate 26 is in contact with the inner wall below the card slot 25 under the driving of the inner shaft 23, the inner shaft 23 continuously slides down to drive the circular frame 24 to move downward synchronously, the circular frame 24 drives the first clamping block 31 to move downward, the first clamping block 31 gives the second clamping block 34 a pushing force, the second clamping block 34 is retracted to the inside of the second slot 32, the circular frame 24 loses the limit of the second clamping block 34 and continues to slide downward, and at this time, the processing wafer 29 stays on the upper surface of the rubber suction cup 28.

[0024] As Figure 6 With Figure 7 The inner part of the fixed frame 11 is annularly arranged with a plurality of third slots 5, the third slots 5 are slidably connected with main body pull rods 51, the main body pull rods 51 are fixedly connected with third clamping blocks 52 on one side, the inner walls of the third slots 5 are provided with power sliding grooves 53, the power sliding grooves 53 are slidably connected with power sliding shafts 54, the power sliding shafts 54 are provided with fourth slots 55 away from the processing wafers 29, the power sliding grooves 53 are fixedly connected with sixth springs 58, the sixth springs 58 are fixedly connected between the power sliding shafts 54, the fourth slots 55 are slidably connected with fourth clamping blocks 56, the fourth clamping blocks 56 are provided as inclined surfaces on the side close to the main body pull rods 51, the fourth slots 55 are fixedly connected with fifth springs 57, the fourth clamping blocks 56 are fixedly connected with the fifth springs 57, the inner walls of the third slots 5 are fixedly connected with recovery clamping blocks 59, the recovery clamping blocks 59 are provided as inclined surfaces on the side close to the power sliding shafts 54 on the top, the fourth clamping blocks 56 extend to the inside of the third slots 5, the fourth clamping blocks 56 are located on the sliding path of the third clamping blocks 52, the recovery clamping blocks 59 are located on the sliding path of the fourth clamping blocks 56, the thicknesses of the third clamping blocks 52 and the recovery clamping blocks 59 are both not greater than half the thickness of the fourth clamping blocks 56, and the recovery clamping blocks 59 are not located on the sliding path of the third clamping blocks 52, when the main body circular plate 21 drives the processing wafers 29 to slide downward through the circular frame 24, the main body circular plate 21 drives the third clamping blocks 52 to slide downward through the main body pull rods 51, and when the processing wafers 29 stay above the fixed frame 11 for positioning under the support of the circular frame 24, the third clamping blocks 52 are in contact with the fourth clamping blocks 56, thereby driving the main body pull rods 51 to slide downward synchronously.

[0025] The surface of the fixed frame 11 is provided with a plurality of swing grooves 6 in an annular array, the swing grooves 6 are communicated with the power sliding groove 53, the inside of the swing groove 6 is fixedly connected with a fixed clamping shaft 61, one end of a swing block 62 is rotatably connected to the power sliding shaft 54 away from the one end of the sixth spring 58, the surface of the swing block 62 is provided with a pressing groove 63, the fixed clamping shaft 61 penetrates and is inserted into the inside of the pressing groove 63, the pressing groove 63 is slidably connected with the fixed clamping shaft 61, the pressing groove 63 is divided into a vertical groove and an inclined groove, the end of the swing block 62 away from the power sliding shaft 54 is fixedly connected with a top block 64, the inside of the end of the top block 64 close to the processing wafer 29 is slidably connected with a second clamping rod 65, a pressing plate 67 is fixedly connected to the surface of the end of the second clamping rod 65 away from the top block 64, a seventh spring 66 is fixedly connected between the pressing plate 67 and the top block 64, the one end of the swing block 62 is given a downward pulling force by the downward sliding of the main pull rod 51, and under the limitation of the fixed clamping shaft 61, the swing block 62 gradually swings to the processing wafer 29 along the inner wall of the inclined groove of the pressing groove 63, thereby the second clamping rod 65 in the inclined state is adjusted, until the fixed clamping shaft 61 is located in the vertical groove of the pressing groove 63, and at this time, the second clamping rod 65 changes from the state of being away from the processing position of the processing wafer 29 to being located directly above the edge of the processing wafer 29, and the circular frame 24 loses the limitation of the second clamping block 34 and continues to slide downward, when the processing wafer 29 positioned is stopped on the upper surface of the rubber suction cup 28, the pressing plate 67 located directly above the edge of the processing wafer 29 slides vertically downward along the vertical groove of the pressing groove 63 under the drive of the swing block 62, thereby pressing the edge of the processing wafer 29, so that the edge of the processing wafer 29 which cannot be attached to the rubber suction cup 28 due to warping is in contact with the rubber surface, at this time, the gas in the rubber suction cup 28 is sucked away through the suction force groove 12 by the suction mechanism, so that the processing wafer 29 is stably attached to the surface of each rubber suction cup 28.

[0026] The following is the whole working process and working principle of the above embodiment: the inside of the main groove 2 is fixedly connected with an electric telescopic rod, the main circular plate 21 is fixedly connected with the output shaft of the electric telescopic rod, when the processing wafer 29 is placed on the upper surface of the circular frame 24 by the mechanical claw, and the surface of the processing wafer 29 needs to be marked, the output shaft of the electric telescopic rod drives the main circular plate 21 to slide downward, thereby driving the inner shaft 23 to slide downward, the circular frame 24 loses the support of the inner shaft 23 and slides downward under the action of its own gravity and the pressure of the processing wafer 29, thereby driving the processing wafer 29 to slide downward until it is attached to the surface of the rubber suction cup 28.

[0027] When the circular frame 24 slides downward, the first clamping block 31 slides downward, the first clamping block 31 contacts the second clamping block 34, and the second clamping block 34 limits the first clamping block 31, thereby limiting the circular frame 24, so that the circular frame 24 cannot continue to slide, and the circular frame 24 cannot slide downward with the inner shaft 23. The wafer 29 stays above the fixed frame 11 under the support of the circular frame 24, and the inner shaft 23 continues to slide downward, the circular head sliding shaft 46 slides downward through the extension sliding rod 45, and the main clamping rod 41 is brought closer to the wafer 29 through the positioning groove 43. When the main clamping rod 41 is brought closer to the wafer 29, the four direction abutting plates 410 are brought closer, thereby ensuring that the wafer 29 is located at the center of the processing groove 27. In order to avoid excessive extrusion of the wafer 29 by the abutting plates 410, when the wafer 29 is located at the center of the processing groove 27, the main clamping rod 41 continues to be brought closer to the wafer 29, and the wafer 29 limits the surface of the abutting plate 410. The main clamping rod 41 slides along the surface of the first clamping rod 48, and the third spring 49 is arranged to play a buffering role, thereby avoiding excessive extrusion of the wafer 29. As the inner shaft 23 continues to slide downward, the circular head sliding shaft 46 is driven by the inner shaft 23 to disengage from the inside of the positioning sliding groove 43, and the abutting plate 26 is driven by the inner shaft 23 to contact the lower inner wall of the abutting groove 25. The inner shaft 23 continues to slide downward to drive the circular frame 24 to move downward synchronously, the circular frame 24 drives the first clamping block 31 to move downward, and the first clamping block 31 gives the second clamping block 34 a pushing force, so that the second clamping block 34 is retracted into the second groove 32. The circular frame 24 loses the limitation of the second clamping block 34 and continues to slide downward, and at this time the wafer 29 stays on the upper surface of the rubber suction cup 28.

[0028] When the main body circular plate 21 drives the wafer 29 to slide downward through the circular frame 24, the main body circular plate 21 drives the third clamping block 52 to slide downward through the main body clamping rod 51, and when the wafer 29 is positioned above the fixed frame 11 under the support of the circular frame 24, the third clamping block 52 contacts the fourth clamping block 56, thereby driving the main body clamping rod 51 to slide downward synchronously. The main body pull rod 51 slides downward to give the swing block 62 one end a downward pull, and under the restriction of the fixed clamping shaft 61, the swing block 62 gradually swings along the inner wall of the inclined groove of the pressing groove 63 to the processing wafer 29, thereby rectifying the second clamping rod 65 in the inclined state, until the fixed clamping shaft 61 is located in the vertical groove of the pressing groove 63, and at this time the second clamping rod 65 changes from the state of being away from the processing wafer 29 to being located directly above the edge of the processing wafer 29, and the circular frame 24 loses the limit of the second clamping block 34 and continues to slide downward, when the processing wafer 29 positioned in the completed positioning stays on the upper surface of the rubber suction cup 28, the pressing plate 67 located directly above the edge of the processing wafer 29 slides vertically downward along the vertical groove of the pressing groove 63 under the drive of the swing block 62, thereby pressing the edge of the processing wafer 29, so that the edge of the processing wafer 29 which cannot be attached to the rubber suction cup 28 due to warping is in contact with the rubber surface, at this time the suction mechanism removes the gas in the rubber suction cup 28 through the suction slot 12, so that the processing wafer 29 is stably attached to the surface of each rubber suction cup 28.

[0029] Although embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, replacements and variations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of the present application being defined by the appended claims and their equivalents.

Claims

1. A positioning device for a precision wafer marking machine, comprising a base frame (1), wherein a fixing frame (11) is fixedly connected to the top of the base frame (1), and a suction groove (12) is provided inside the fixing frame (11), characterized in that: The base frame (1) is provided with a main circular plate (21) for adjusting the position of the wafer. The upper end of the main circular plate (21) is provided with a plurality of circular frames (24) arranged in a ring array. The fixed frame (11) is provided with a main clamping rod (41) and a stop plate (410) for pushing the wafer to the marking position. The fixed frame (11) is provided with a first clamping block (31) and a round-headed sliding shaft (46) for providing power to the main clamping rod (41) according to the different positions of the wafer at the top of the fixed frame (11). The fixed frame (11) is provided with a swing block (62) and a lower pressure plate (67) for pressing the top of the wafer to make the wafer fit more closely to the surface of the suction cup.

2. The positioning device for a precision wafer marking equipment according to claim 1, characterized in that: The base frame (1) has a main body groove (2) inside, and the main body circular plate (21) is slidably connected to the inside of the main body groove (2). The fixed frame (11) has multiple lifting grooves (22) arranged in a ring array inside, and the circular frame (24) is slidably connected to the inside of the lifting grooves (22). The inner shaft (23) is slidably connected inside the circular frame (24), and the inner shaft (23) is fixedly connected to the main body circular plate (21). One end of the circular frame (24) has a locking groove (2). 5) A slotting plate (26) is slidably connected inside the slotting groove (25). The slotting plate (26) is fixedly connected to the inner shaft (23). A processing groove (27) is opened on the upper surface of the fixed frame (11). A rubber suction cup (28) is fixedly connected to the lower inner wall of the processing groove (27). The rubber suction cup (28) is connected to the suction groove (12). The circular frame (24) extends into the processing groove (27). A processing wafer (29) is placed on the upper surface of the circular frame (24).

3. The positioning device for a precision wafer marking equipment according to claim 2, characterized in that: The inner wall of the lifting groove (22) away from the fixed frame (11) has a first groove (3). The first locking block (31) is slidably connected to the inside of the first groove (3). The first locking block (31) is fixedly connected to the circular frame (24). The inner wall of the first groove (3) has a second groove (32). The second locking block (34) is slidably connected to the inside of the second groove (32). The first spring (33) is fixedly connected to the inside of the second groove (32). The first spring (33) is fixedly connected to the second locking block (34).

4. The positioning device for a precision wafer marking equipment according to claim 3, characterized in that: The fixed frame (11) has multiple transverse sliding grooves (4) arranged in a circular array inside. The transverse sliding grooves (4) are connected to the first groove (3). The main body clamp (41) is slidably connected inside the transverse sliding groove (4). A fourth spring (411) is fixedly connected inside the transverse sliding groove (4). The main body clamp (41) is fixedly connected to the fourth spring (411). An adjusting slide plate (42) is fixedly connected to one side of the main body clamp (41). A guide groove (412) is opened on the inner wall of the transverse sliding groove (4). A guide block (413) is slidably connected inside the guide groove (412). The guide block (413) is fixedly connected to the adjusting slide plate (42). An adjustment groove (43) is opened on the surface of the adjusting slide plate (42). An extension groove is opened on the side of the circular frame (24). 44), an extension slide rod (45) is slidably connected inside the extension groove (44), the extension slide rod (45) is fixedly connected to the inner shaft (23), the round-headed slide shaft (46) is slidably connected inside one end of the extension slide rod (45), a second spring (47) is fixedly connected inside one end of the extension slide rod (45), the second spring (47) is fixedly connected to the extension slide rod (45), the round-headed slide shaft (46) extends to the interior of the adjustment slide groove (43), a first positioning rod (48) is slidably connected inside one end of the main body clamping rod (41), the first positioning rod (48) is T-shaped, the abutment plate (410) is fixedly connected to the end of the first positioning rod (48) near the processing wafer (29), and a third spring (49) is fixedly connected between the main body clamping rod (41) and the abutment plate (410).

5. The positioning device for a precision wafer marking equipment according to claim 4, characterized in that: The adjustment groove (43) is divided into a positioning groove and a restoration groove. The depth of the positioning groove (43) is greater than the depth of the restoration groove. The positioning groove (43) is a bent groove. The positioning groove (43) includes two staggered vertical grooves. The two vertical grooves in the positioning groove (43) are connected by an inclined groove. The restoration groove (43) is a vertical groove. The adjustment groove (43) is connected to the main groove (2).

6. The positioning device for a precision wafer marking equipment according to claim 2, characterized in that: The fixed frame (11) has multiple slots (5) arranged in a ring array inside. A main pull rod (51) is slidably connected inside the slot (5). A third locking block (52) is fixedly connected to the side of the main pull rod (51) away from the processed wafer (29). A power slide groove (53) is formed on the inner wall of the side of the slot (5) away from the processed wafer (29). A power slide shaft (54) is slidably connected inside the power slide groove (53). A fourth slot (55) is formed at the end of the power slide shaft (54) away from the processed wafer (29). The interior of the power slide groove (53) is... A No. 6 spring (58) is fixedly connected to the power slide shaft (54). A No. 4 locking block (56) is slidably connected inside the No. 4 slot (55). The No. 4 locking block (56) is set as an inclined surface on the side near the main pull rod (51). A No. 5 spring (57) is fixedly connected inside the No. 4 slot (55). The No. 4 locking block (56) is fixedly connected to the No. 5 spring (57). A recovery locking block (59) is fixedly connected to the inner wall of the No. 3 slot (5). The top of the recovery locking block (59) is set as an inclined surface on the side near the power slide shaft (54).

7. The positioning device for a precision wafer marking equipment according to claim 6, characterized in that: The fourth card block (56) extends into the interior of the third slot (5). The fourth card block (56) is located on the sliding path of the third card block (52). The restoration card block (59) is located on the sliding path of the fourth card block (56). The thickness of the third card block (52) and the restoration card block (59) is not greater than half the thickness of the fourth card block (56). The restoration card block (59) is not located on the sliding path of the third card block (52).

8. The positioning device for a precision wafer marking equipment according to claim 6, characterized in that: The surface of the fixed frame (11) is provided with a plurality of swing grooves (6) arranged in a ring array. The swing grooves (6) are connected to the power slide (53). A fixed retaining pin (61) is fixedly connected inside the swing groove (6). One end of the swing block (62) is rotatably connected to the end of the power slide (54) away from the No. 6 spring (58). The surface of the swing block (62) is provided with a pressing groove (63). The fixed retaining pin (61) is inserted through the pressing groove (63). The lower pressure groove (63) is divided into a vertical groove and an inclined groove. The swing block (62) is fixedly connected to a top block (64) at the end away from the power sliding shaft (54). The top block (64) is slidably connected to a second positioning rod (65) at the end near the processed wafer (29). The lower pressure plate (67) is fixedly connected to the surface of the second positioning rod (65) away from the top block (64). A seventh spring (66) is fixedly connected between the lower pressure plate (67) and the top block (64).

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