Flexible circuit board die cutting production device and process thereof

Abstract

The present application relates to the technical field of circuit board processing and production, and in particular to a flexible circuit board die cutting production device and process, the production process comprising the following steps: S100. A first covering film is windowed by a round knife die cutting assembly; S200. A copper foil is drawn through a draw roller assembly; S300. The drawn copper foil is covered with a first protective film and a second protective film on both sides respectively and laminated, and after die cutting by the round knife die cutting assembly, the first protective film is removed and the waste is discharged through a waste discharge roller assembly; S400. The first covering film windowed in step S100 and the copper foil die cut in step S300 are cold-pressed and laminated so that the first covering film and the second protective film are respectively located on both sides of the copper foil and form a primary product; the present application reduces the use of chemicals in the production process, which is beneficial to environmental protection.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing and production, and particularly relates to a flexible circuit board die cutting production device and a process thereof. BACKGROUND

[0002] The flexible circuit board is a printed circuit board made of a flexible insulating substrate, and a circuit pattern is formed on the flexible substrate by etching copper foil to realize electrical connection and signal transmission between electronic components, and is widely used in consumer electronics, medical electronics, automotive electronics and other fields.

[0003] The etching method is a common method for manufacturing circuit patterns in flexible circuit boards, and mainly includes over-laminating, exposing, developing, etching, cleaning, gold plating and die cutting. The waste liquid produced by wet etching contains a large amount of heavy metal ions and chemical substances, and if not properly treated, it will cause serious pollution to the environment. Dry etching also produces some pollutants such as waste gas, which need to be effectively treated and discharged. With the continuous development of the industry, the flexible circuit board is gradually prepared by die cutting. The prior application with publication number CN114900965A discloses a FPC die cutting production method, which uses an impact type carbon dioxide picosecond laser drilling machine to drill holes and open windows in the insulating layer. For flexible circuit boards with high folding resistance and high signal transmission requirements, the thickness of the copper foil is relatively thin (4-100 μm), and the surface roughness requirement is relatively high. However, in the prior art, the surface of the copper foil is not treated before and after die cutting to reduce the surface roughness of the copper foil, resulting in a rough copper foil surface and increased signal transmission loss.

[0004] Referring to the prior art, a roller pressing device is disclosed in CN223045233U, which comprises a mounting frame, an upper roller and a lower roller. The upper roller and the lower roller have a gap for passing the pole piece. The two ends of the upper roller are connected with a first bearing seat, and the two first bearing seats are slidingly mounted on the mounting frame. The two ends of the lower roller are connected with a second bearing seat, and the two second bearing seats are mounted on the mounting frame. The upper roller and the lower roller are driven by a gear transmission mechanism. An ultrasonic transducer is arranged on the mounting frame. The output end of the ultrasonic transducer is connected with the first bearing seat. The ultrasonic transducer drives the first bearing seat to vibrate up and down. For example, the pole piece is pressed by the upper roller and the lower roller. Since the upper roller and the lower roller are in rolling contact, i.e., the upper roller and the lower roller always maintain continuous linear contact when they are rotated to any angle, an extrusion zone is formed. However, since the upper roller and the lower roller are driven by gear meshing, the gear meshing gap is prone to loosening or jumping under the action of high-frequency ultrasonic vibration. The stability of the gear transmission is disturbed, and the relative rotational speed between the two rollers may fluctuate, thereby affecting the stability of the synchronous clamping and conveying of the two rollers on the circuit board. The unstable clamping state may cause uneven stress on the circuit board during the covering process.

[0005] Therefore, the technical personnel in the field are committed to developing a flexible circuit board die cutting production device and process, which reduces the use of chemicals in the production process, is beneficial to environmental protection, and avoids loosening of the compression roller set caused by gear matching during the ultrasonic pressing of the circuit board. SUMMARY

[0006] The technical problem to be solved by the present application is to provide a flexible circuit board die cutting production device and process, which reduces the use of chemicals in the production process, is beneficial to environmental protection, and avoids loosening of the compression roller set caused by gear matching during the ultrasonic pressing of the circuit board.

[0007] In a first aspect, the technical solution of the present application to solve the above technical problem is as follows:

[0008] A flexible circuit board die cutting production device comprises a support frame, a circular knife die cutting assembly arranged on the support frame, and an ultrasonic roller assembly. The ultrasonic roller assembly comprises a first extrusion roller and a second extrusion roller. The two ends of the first extrusion roller and the second extrusion roller are mounted on the support frame. The second extrusion roller is connected with a power assembly. The second extrusion roller is mounted with an ultrasonic assembly. One end of the second extrusion roller is connected with an incomplete gear. The axis of the second extrusion roller is eccentrically arranged with the rotation center of the incomplete gear, so that the outer periphery of the second extrusion roller has a protruding extrusion part for extruding the circuit board. The first extrusion roller is coaxially fixedly connected with a complete gear. The incomplete gear is in meshing cooperation with the complete gear. The tooth part of the incomplete gear is arranged to be staggered with the protruding extrusion part in the circumferential direction.

[0009] The beneficial effect of the above further scheme is that: the present scheme only intermittently engages with the complete gear when the tooth part of the incomplete gear exists, so that the second extrusion roller produces periodic approach and away movement relative to the first extrusion roller under the rotation of the driving source driving the second extrusion roller, and when approaching, the protruding extrusion part cooperates with the first extrusion roller to extrude the circuit board, and the complete gear is driven to rotate by the incomplete gear to drive the first extrusion roller to rotate circumferentially, so as to realize intermittent pressing and laminating of the circuit board, and intermittently conveying the circuit board. Most importantly, since the circuit board needs to be vibrated and pressed first and then rotated, and the tooth part of the incomplete gear is arranged to be staggered with the protruding extrusion part in the circumferential direction, so that when the protruding extrusion part is in the extrusion position opposite to the first extrusion roller, the tooth part of the incomplete gear is out of engagement with the complete gear, so that the ultrasonic assembly will not cause gear loosening or jumping due to vibration impact caused by gear cooperation of the roller set under the action of high-frequency ultrasonic vibration.

[0010] Further, the pressing switch is electrically connected with the input end of the controller of the ultrasonic assembly, and is used to send a working signal to the controller of the ultrasonic assembly to control the ultrasonic assembly to work after the contact of the pressing switch is closed, and send a stop signal to the controller of the ultrasonic assembly to control the ultrasonic assembly to stop working after the contact of the pressing switch is opened; the pressing switch is fixed on one side of the incomplete gear through the support, the shell of the pressing switch is connected with a spring, the free end of the spring is connected with a pressing plate, the triggering end of the pressing switch faces the pressing plate, and the pressing plate is used to touch the pressing switch; the pressing plate is arranged on the movement track of the incomplete gear and cooperates with the tooth part of the incomplete gear, and the tooth part of the incomplete gear is driven to rotate to contact the pressing plate to push the pressing plate to move and touch the pressing switch.

[0011] The beneficial effect of the above further scheme is that: since the protruding extrusion part of the second extrusion roller only extrudes the workpiece when it approaches the first extrusion roller, if the ultrasonic assembly continues to work, it will cause invalid work when the protruding extrusion part moves away from the first extrusion roller. The pressing switch in the present scheme is used to send a starting control signal to the controller of the ultrasonic assembly to control the ultrasonic assembly to work after the contact of the pressing switch is closed, and send a stop signal to the controller to control the ultrasonic assembly to stop working after the contact of the pressing switch is opened. The tooth part of the incomplete gear is driven to rotate to contact the pressing plate, so as to push the pressing plate to move and compress the spring, so that the pressing plate touches the pressing switch to make the ultrasonic assembly work, and at this time the protruding extrusion part is just rotated to contact the first extrusion roller, so as to vibrate and extrude the circuit board. After the tooth part of the incomplete gear completely moves away from the pressing plate, the spring drives the pressing plate to reset to the initial position, and at this time the protruding extrusion part is just rotated to move away from the first extrusion roller, so as to make the ultrasonic assembly stop working.

[0012] Furthermore, the ultrasonic component is installed inside the second extrusion roller, and the ultrasonic component is electrically connected to an electrode slip ring, which is installed at the end of the second extrusion roller. The electrode slip ring is also electrically connected to an ultrasonic controller, which is installed on the support frame.

[0013] The beneficial effects of adopting the above-mentioned further solution are: the electrode slip ring and the ultrasonic controller work together to ensure a stable energy supply when the ultrasonic component is working, improve the bonding strength between the cover film and the copper foil, and enhance the mechanical properties of the product.

[0014] Furthermore, the power assembly includes a power motor mounted on a base plate, and the output end of the power motor is sequentially connected to a first reducer and a connecting shaft, the end of which is connected to the second extrusion roller.

[0015] The beneficial effect of adopting the above-mentioned further solution is that the power motor drives the second extrusion roller through the reducer and the connecting shaft, and then drives the first extrusion roller through the cooperation of the incomplete gear and the complete gear, ensuring that the two rollers have extremely high speed synchronization.

[0016] Secondly, the technical solution of the present invention to solve the above-mentioned technical problems is as follows:

[0017] A flexible circuit board die-cutting production process, comprising the application of the flexible circuit board die-cutting production apparatus as described above, including the following steps:

[0018] S100. The first cover film is opened through a window hole by a circular die-cutting assembly;

[0019] S200. Copper foil is drawn using a drawing roller assembly;

[0020] S300. Cover both sides of the drawn copper foil with a first protective film and a second protective film respectively and laminate them. After being die-cut by a circular die-cutting assembly, the first protective film is removed and the waste is discharged by a waste discharge roller assembly.

[0021] S400. The first cover film with the window opening in step S100 and the copper foil that has been die-cut in step S300 are cold-pressed together so that the first cover film and the second protective film are located on both sides of the copper foil and form a primary product.

[0022] S500. Remove the second protective film from the primary product in step S400 and coat it with a second cover film so that the first cover film and the second cover film are placed on both sides of the copper foil to form a secondary product;

[0023] S600. The secondary product in step S500 is first extruded and laminated into a finished circuit board by an ultrasonic roller assembly, and then the outer shape of the second layer of cover film is cut by a circular die-cutting assembly.

[0024] The beneficial effects of adopting the above scheme are as follows: the copper foil is first drawn by the drawing roller assembly to improve its ductility. After the copper foil is cut by a circular knife and covered with a film on both sides, it is then laminated by an ultrasonic roller assembly. The ultrasonic high-frequency vibration drives the roller to vibrate at high frequency. Under the cooperation of static pressure, the surface of the copper foil is subjected to high-frequency impact and extrusion, which causes the surface metal to produce plastic flow. This flattens the unevenness and cut edges of the copper foil generated during the roller cutting process. This not only further reduces the tensile stress on the surface of the copper foil, but also makes the surface of the copper foil have a high degree of flatness, improves the signal transmission efficiency, and reduces the use of chemicals in the production process, which is beneficial to environmental protection.

[0025] Furthermore, step S200 specifically includes the following steps:

[0026] S210. The copper foil is cleaned with anhydrous ethanol or acetone after drawing.

[0027] S220. Drain the cleaned copper foil.

[0028] The beneficial effects of adopting the above-mentioned further solution are: cleaning with anhydrous ethanol or acetone can effectively remove tiny debris and prevent the copper foil from oxidizing during processing, thereby reducing surface roughness while ensuring the purity and conductivity of the copper foil.

[0029] Furthermore, in step S600, when the ultrasonic roller assembly extrudes the copper foil and the cover film, the ultrasonic frequency is 20KHz to 4020KHz, and the static pressure of the roller is 100kgf / cm² to 400kgf / cm².

[0030] The beneficial effects of adopting the above-mentioned further solution are: the ultrasonic roller assembly can not only improve the flatness of the copper foil by extruding the copper foil and the cover film, but also make the copper foil and the cover film adhere tightly.

[0031] Furthermore, in step S200, the first and second protective films are made of polyethylene film or polyethylene terephthalate film.

[0032] The first and second covering films in steps S100 and S500 are polyimide covering films or polyester covering films.

[0033] The beneficial effects of adopting the above-mentioned further solutions are: PET (polyethylene terephthalate) or PE (polyethylene) protective film has excellent flexibility and isolation properties, and can effectively protect the surface of ultra-thin polished copper foil from scratches during the processing.

[0034] Polyimide (PI) or polyester (PET) cover films offer excellent insulation, heat resistance, and mechanical strength, ensuring the reliability and durability of the final product.

[0035] Furthermore, in step S500, before the second covering film is applied, the surface of the copper foil is subjected to plasma treatment. The plasma power is 500W to 1000W, the treatment time is 5s to 15s, and the treatment gas is a mixture of oxygen and nitrogen with a volume ratio of 1:3 to 1:5.

[0036] The beneficial effects of adopting the above-mentioned further solutions are: plasma treatment can effectively activate and clean the copper foil surface, and significantly improve the adhesion strength and bonding force between the copper foil and the cover film;

[0037] By using a mixture of oxygen and nitrogen and processing it under certain power and time conditions, the interface characteristics can be optimized without damaging the precision circuits, reducing the risk of delamination during subsequent use. Attached Figure Description

[0038] Figure 1 This is a flowchart of the flexible circuit board die-cutting production process according to Embodiment 3 of the present invention;

[0039] Figure 2 This is a schematic diagram of the flexible circuit board die-cutting production device according to Embodiment 1 of the present invention. Figure 1 ;

[0040] Figure 3 This is a schematic diagram of the flexible circuit board die-cutting production device according to Embodiment 1 of the present invention. Figure 2 ;

[0041] Figure 4 This is a schematic diagram of the slider and slide rail structure according to Embodiment 1 of the present invention;

[0042] Figure 5 This is a schematic diagram of the structure of the incomplete gear and the complete gear in Embodiment 2 of the present invention;

[0043] Figure 6 This is a schematic diagram of the structure of the first extrusion roller and the second extrusion roller in Embodiment 2 of the present invention;

[0044] Figure 7 This is a schematic diagram of the structure of the push switch and the incomplete gear in Embodiment 2 of the present invention.

[0045] The attached diagram lists the components represented by each number as follows:

[0046] 1. First extrusion roller; 2. Second extrusion roller; 201. Protruding extrusion section; 3. Rolling support; 4. Support frame; 5. Ultrasonic assembly; 6. Electrode slip ring; 7. Ultrasonic controller; 8. Power motor; 9. Base plate; 10. First reducer; 11. Connecting shaft; 12. Drive gear; 13. Driven gear; 14. Adjustment servo motor; 15. Second reducer; 16. Intermediate shaft; 17. Shaft deflector; 18. Rotating lead screw; 19. Slider; 20. Slide rail; 21. Incomplete gear; 22. Complete gear; 23. Press switch; 231. Spring; 24. Pressure plate. Detailed Implementation

[0047] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0048] In the description of this invention, it should be understood that the terms "center," "length," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "inner," "outer," "circumferential," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the system or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0049] In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0051] Example 1:

[0052] like Figure 2 , Figure 3 and Figure 4As shown, this invention provides a flexible circuit board die-cutting production device, including a support frame 4 and a circular die-cutting assembly and an ultrasonic roller assembly mounted on the support frame 4. The circular die-cutting assembly is located at the front end of the ultrasonic roller assembly. After the circuit board is cut by the circular die-cutting assembly, it is then transported manually or by conveyor belt to the ultrasonic roller assembly for vibration pressing. The circular die-cutting assembly is prior art, and can be found in the circuit board circular die-cutting device in existing patent document CN116867173A. The ultrasonic roller assembly includes a first extrusion roller 1 and a second extrusion roller 2. Both ends of the first extrusion roller 1 and the second extrusion roller 2 are mounted on the support frame 4 through rolling supports 3. The rolling supports 3 are equipped with high-precision ball bearings to reduce the resistance when the first extrusion roller 1 and the second extrusion roller 2 rotate, ensuring that the first extrusion roller 1 and the second extrusion roller 2 can maintain stable coaxiality during long-term high-speed operation, avoiding roller misalignment due to bushing wear, and thus ensuring the uniformity of extrusion and bonding of the circuit board. The first extrusion roller 1 is connected to a power assembly at one end, the second extrusion roller 2 is equipped with an adjustment assembly, and the second extrusion roller 2 is equipped with an ultrasonic component 5.

[0053] like Figure 2 and Figure 3 As shown in the embodiment, the ultrasonic component 5 is built into the second extrusion roller 2, allowing ultrasonic vibration energy to be directly transmitted to the surface of the second extrusion roller 2. The ultrasonic component 5 is electrically connected to an electrode slip ring 6, which is installed at the end of the second extrusion roller 2. Through the sliding contact between the conductive ring inside the electrode slip ring 6 and the brush, continuous and stable power transmission is achieved while the second extrusion roller 2 is rotating, avoiding the entanglement or breakage of traditional wire connections caused by the rotation of the second extrusion roller 2. The electrode slip ring 6 is also electrically connected to an ultrasonic controller 7, which is mounted on the support frame 4. The ultrasonic controller 7 sets and adjusts the ultrasonic frequency (20kHz to 4020kHz) and output power, monitors the working status of the ultrasonic component 5 in real time, and ensures that the vibration parameters are precisely matched with the process requirements, thereby guaranteeing the consistency of the lamination quality.

[0054] like Figure 2 and Figure 3As shown, in one embodiment, the power assembly includes a power motor 8, which can be a servo motor or a stepper motor. The power motor 8 is mounted on a base plate 9. The output end of the power motor 8 is sequentially connected to a first reducer 10 and a connecting shaft 11. The first reducer 10 converts the high speed of the power motor 8 into the low speed required by the roller, while increasing the output torque to meet the torque requirements of the roller during extrusion lamination and prevents the roller from jamming due to insufficient torque. The end of the connecting shaft 11 is connected to the first extrusion roller 1. A drive gear 12 is connected to the end of the first extrusion roller 1 and the side opposite to the connecting shaft 11. The drive gear 12 meshes with a driven gear 13, which is mounted at the end of the second extrusion roller 2. The drive gear 12 and the driven gear 13 can be deep-tooth helical gears. The gear ratio of the drive gear 12 to the driven gear 13 is set to 1:1. By using precision gear meshing transmission, the first extrusion roller 1 and the second extrusion roller 2 obtain the same speed, preventing scratches or wrinkles on the circuit board surface due to the speed difference between the first extrusion roller 1 and the second extrusion roller 2.

[0055] like Figure 2 , Figure 3 and Figure 4 As shown, in this embodiment, the adjustment component includes an adjustment servo motor 14. The output end of the adjustment servo motor 14 is sequentially connected to a second reducer 15, an intermediate shaft 16, and an axis deflector 17. A lead screw bearing (not shown in the figure) is installed at the output end of the axis deflector 17. A rotating lead screw 18 that cooperates with the lead screw bearing is sleeved inside the lead screw bearing. The adjustment servo motor 14 sequentially drives the second reducer 15, the intermediate shaft 16, and the axis deflector 17 to rotate. The rotational motion output by the axis deflector 17 is converted into linear motion of the rotating lead screw 18. Through the threaded engagement between the rotating lead screw 18 and the lead screw bearing, precise displacement control is achieved. The end of the rotating lead screw 18 is connected to the rolling support 3 at the end of the second extrusion roller 2. A slider 19 is also installed on the rolling support 3 at the end of the second extrusion roller 2, and a slide rail 20 that cooperates with the slider 19 is also installed on the support frame 4. The slider 19 and the slide rail 20 can adopt a high-precision linear guide structure. Through the constraint of the slide rail 20, the rolling support 3 can only move along the axial direction of the slide rail 20, ensuring that the two ends of the second extrusion roller 2 remain parallel to the first extrusion roller 1 during the adjustment process, and avoiding uneven local extrusion pressure caused by the tilt of the second extrusion roller 2, which would affect the bonding effect.

[0056] Example 2:

[0057] The difference between this embodiment and Embodiment 1 is that, in Embodiment 1, ultrasonic components 5 are used to generate ultrasonic vibrations in the first extrusion roller 1 and the second extrusion roller 2, thereby improving the uniformity of circuit board extrusion lamination. However, since the first extrusion roller 1 and the second extrusion roller 2 are driven by the meshing of the drive gear 12 and the driven gear 13, under the action of high-frequency ultrasonic vibration, the gear meshing gap is prone to loosening or jumping due to vibration impact. This not only interferes with the smoothness of gear transmission but may also cause fluctuations in the relative speed between the two rollers, thus affecting the stability of their synchronous clamping and conveying of the circuit board. This unstable clamping state may cause uneven force on the circuit board during lamination. Therefore, this embodiment further improves the first extrusion roller 1 and the second extrusion roller 2 based on Embodiment 1 to solve the above problems.

[0058] Please see Figure 5 and Figure 6 In this embodiment, a power assembly is connected to the end of the second extrusion roller 2. The drive source is the same as that in Embodiment 1, and will not be described in detail. An incomplete gear 21 is connected to one end of the second extrusion roller 2. The axis of the second extrusion roller 2 is eccentrically set with respect to the rotation center of the incomplete gear 21, so that the rotation center of the incomplete gear 21 does not coincide with the rotation center of the second extrusion roller 2. This makes the second extrusion roller 2 form a convex roller structure, and thus the outer periphery of the second extrusion roller 2 has a protruding extrusion portion 201 for extruding the circuit board. The first extrusion roller 1 is coaxially fixedly connected to a complete gear 22. The incomplete gear 21 and the complete gear 22 mesh in the same plane perpendicular to the axes of the first extrusion roller 1 and the second extrusion roller 2. The incomplete gear 21 meshes with the complete gear 22 intermittently only when the teeth of the incomplete gear 21 are present. Thus, when the second extrusion roller 2 is driven to rotate by the drive source, the second extrusion roller 2 moves periodically closer to and further away from the first extrusion roller 1. When it moves closer, it cooperates with the first extrusion roller 1 through the protruding extrusion part 201 to extrude the circuit board. The incomplete gear 21 drives the complete gear 22 to rotate, thereby driving the first extrusion roller 1 to rotate circumferentially, realizing intermittent pressure bonding of the circuit board and intermittent transmission of the circuit board. It should be noted that, since the circuit board needs to be vibrated and pressed before rotation, the teeth of the incomplete gear 21 need to be offset from the protruding extrusion part 201 in the circumferential direction. This ensures that when the protruding extrusion part 201 is in the extrusion position opposite to the first extrusion roller 1, the teeth of the incomplete gear 21 disengage from the meshing state with the complete gear 22 (e.g., Figure 5 (As shown).

[0059] Please continue reading. Figure 5 and Figure 6Since the protruding extrusion part 201 of the second extrusion roller 2 only extrudes the workpiece when it is close to the first extrusion roller 1, and the extrusion area is relatively small, the corresponding conveying distance of the workpiece should also be relatively short. Therefore, in this embodiment, the incomplete gear 21 has three teeth (the included angle between the centers of the teeth is 15°), and the complete gear 22 has several teeth. When the incomplete gear 21 rotates one revolution, the complete gear 22 rotates exactly 15°, driving the circuit board to move a distance of 2cm.

[0060] Please see Figure 7 Since the protruding extrusion part 201 of the second extrusion roller 2 only extrudes the workpiece when it is close to the first extrusion roller 1, if the ultrasonic component 5 continues to work, it will become ineffective when the protruding extrusion part 201 moves away from the first extrusion roller 1. This embodiment also includes a push switch 23, which is a normally open limit switch. The push switch 23 is electrically connected to the controller input terminal of the ultrasonic component 5. After its contacts are closed, it sends a working control signal to the controller of the ultrasonic component 5, thereby controlling the ultrasonic component 5 to work. After the contacts of the push switch 23 are opened, it sends a stop signal to the controller to control the ultrasonic component 5 to stop working. The push switch 23 is fixed to one side of the incomplete gear 21 by a bracket (not shown). The outer shell of the push switch 23 is connected to a spring 231. The free end of the spring 231 is connected to a pressure plate 24. The trigger end of the push switch 23 faces the pressure plate 24. The pressure plate 24 is used to touch the push switch 23. The pressure plate 24 is located on the movement trajectory of the incomplete gear 21 and cooperates with the teeth of the incomplete gear 21. The teeth of the incomplete gear 21 rotate to contact the pressure plate 24, thereby pushing the pressure plate 24 to move and compressing the spring 231, so that the pressure plate 24 abuts against the push switch 23, causing the ultrasonic component 5 to work. At this time, the protruding extrusion part 201 just rotates to contact the first extrusion roller 1, thereby vibrating and extruding the circuit board. After the teeth of the incomplete gear 21 are completely away from the pressure plate 24, the spring 231 drives the pressure plate 24 to return to the initial position. At this time, the protruding extrusion part 201 rotates away from the first extrusion roller 1, thereby stopping the ultrasonic component 5 from working.

[0061] Example 3:

[0062] like Figure 1 As shown, the present invention also provides a flexible circuit board die-cutting production process, using the flexible circuit board die-cutting apparatus described above, including the following steps:

[0063] S100. The first cover film is opened through the window hole of the circular die-cutting assembly. The die roller with a specific window hole shape in the circular die-cutting assembly applies stable pressure to the surface of the continuously conveyed first cover film. The rolling cooperation between the die roller and the bottom roller achieves precise cutting, so that the first cover film forms a window structure that corresponds to and matches the conductive area of ​​the copper foil. This reserves space for the electrical connection between the copper foil and external components during subsequent lamination. The rotation speed of the die roller is synchronized with the conveying speed of the first cover film to ensure the positional accuracy and dimensional consistency of the window hole, and avoid window offset or incomplete cutting due to speed mismatch.

[0064] S200. The copper foil is drawn using a drawing roller assembly, specifically including the following steps:

[0065] S210. After the copper foil is drawn, it is cleaned with anhydrous ethanol or acetone. Taking advantage of the strong volatility of anhydrous ethanol and acetone and their good solubility for oil and impurities, the oil, metal debris and other contaminants generated during the drawing process are dissolved by spraying or soaking. The residual solvent is then removed by hot air drying or natural draining to ensure that the contaminants are completely removed and to avoid the residual solvent from having an adverse effect on the lamination process.

[0066] S220. Drain the cleaned copper foil.

[0067] S300. Cover both sides of the polished copper foil with a first protective film and a second protective film respectively, and then laminate them together. The first and second protective films are made of polyethylene film or polyethylene terephthalate film. After being die-cut by a circular die-cutting assembly, the first protective film is removed and the waste is discharged by a waste discharge roller assembly. The copper foil is cut by the die roller to form a preset circuit shape. When the first protective film is torn off, the waste is peeled off from the circuit board along with the first protective film.

[0068] S400. The first cover film with the window opening in step S100 and the copper foil that has been die-cut in step S300 are cold-pressed together so that the first cover film and the second protective film are respectively located on both sides of the copper foil to form a primary product. Under the action of cold pressing, the first cover film and the copper foil form a stable bond. At the same time, the second protective film continues to protect the other side of the copper foil, avoiding damage to the copper foil during the lamination process and ensuring the structural stability of the primary product.

[0069] S500. Remove the second protective film from the primary product in step S400 and laminate the second cover film so that the first cover film and the second cover film are placed on both sides of the copper foil to form a secondary product. The first cover film and the second cover film are polyimide cover film or polyester cover film. The first cover film and the second cover film together form double protection for the copper foil, ensuring that the secondary product has good electrical performance and structural strength.

[0070] Alternatively, before applying the second cover film, the copper foil surface can be subjected to plasma treatment. The plasma power is 500W to 1000W, the treatment time is 5s to 15s, and the treatment gas is a mixture of oxygen and nitrogen in a volume ratio of 1:3 to 1:5. High-energy plasma particles bombard the copper foil surface, removing trace amounts of oil, oxide layers, and adsorbed impurities. Simultaneously, active groups are formed on the copper foil surface, increasing surface roughness and surface energy. By controlling the plasma power, treatment time, and gas ratio, the adhesion between the copper foil surface and the second cover film can be enhanced without damaging the precision circuitry of the copper foil, preventing delamination during subsequent use and further improving the reliability of the secondary product.

[0071] S600. The secondary product from step S500 is first extruded and laminated into a finished circuit board using an ultrasonic roller assembly, and then the outer shape of the second cover film is cut using a circular die-cutting assembly. During the extrusion of the copper foil and cover film by the ultrasonic roller assembly, the ultrasonic frequency is 20kHz to 4020kHz, and the static pressure of the roller is 100kgf / cm² to 400kgf / cm². While applying static pressure, the ultrasonic roller assembly generates high-frequency mechanical vibration, causing the roller to make high-frequency contact with the surface of the secondary product. This causes violent movement of molecules at the interface between the copper foil and the cover film, eliminating interfacial gaps. Simultaneously, the unevenness and protrusions at the cut edges caused by die-cutting on the copper foil surface undergo plastic flow under vibration and pressure, achieving smoothing. Utilizing the synergistic effect of the energy transfer of ultrasonic vibration and static pressure, not only is the adhesion between the copper foil and the cover film tighter, improving the interfacial bonding strength, but the surface tensile stress of the copper foil is further reduced, improving surface flatness, thereby improving the signal transmission efficiency and overall performance of the finished circuit board.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0073] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A flexible circuit board die-cutting production apparatus, comprising a support frame and a circular die-cutting assembly and an ultrasonic roller assembly mounted on the support frame, wherein the ultrasonic roller assembly includes a first extrusion roller and a second extrusion roller, both ends of the first extrusion roller and the second extrusion roller are mounted on the support frame, the second extrusion roller is connected to a power assembly, and an ultrasonic component is mounted on the second extrusion roller, characterized in that: One end of the second extrusion roller is connected with an incomplete gear, the axis of the second extrusion roller is arranged eccentrically with the rotation center of the incomplete gear, so that the outer periphery of the second extrusion roller has a convex extrusion part for extruding the circuit board; the first extrusion roller is coaxially fixedly connected with a complete gear, the incomplete gear is engaged with the complete gear, and the tooth part of the incomplete gear is arranged eccentrically in the circumferential direction with the convex extrusion part.

2. The flexible circuit board die-cut production apparatus according to claim 1, characterized by: Further comprising a press switch, the press switch is electrically connected with the controller input end of the ultrasonic assembly, for sending a working signal to the controller of the ultrasonic assembly after the press switch contact is closed, controlling the ultrasonic assembly to work, and sending a stop signal to the controller of the ultrasonic assembly after the press switch contact is opened, controlling the ultrasonic assembly to stop working; the press switch is fixed on one side of the incomplete gear through a support, the shell of the press switch is connected with a spring, the free end of the spring is connected with a pressing plate, the triggering end of the press switch faces the pressing plate, the pressing plate is used for touching the press switch, the pressing plate is arranged on the movement track of the incomplete gear, and is matched with the tooth part of the incomplete gear, the tooth part of the incomplete gear is rotated to contact the pressing plate, and the pressing plate is pushed to move to touch the press switch.

3. The flexible circuit board die-cut production apparatus according to claim 1, characterized by: The ultrasonic assembly is installed in the second extrusion roller, and the ultrasonic assembly is electrically connected with an electrode slip ring, the electrode slip ring is installed at the end of the second extrusion roller, and the electrode slip ring is further electrically connected with an ultrasonic controller, and the ultrasonic controller is installed on the support frame.

4. The flexible circuit board die-cut production apparatus according to claim 1, characterized by: The power assembly comprises a power motor, the power motor is installed on the bottom plate, and the output end of the power motor is sequentially connected with a first speed reducer and a connecting shaft, and the end of the connecting shaft is connected with the second extrusion roller.

5. A flexible circuit board die cutting production process comprising the use of a flexible circuit board die cutting production device according to any one of claims 1 to 4, characterized in that, The method comprises the following steps: S100. The first cover film is windowed by the round knife die cutting assembly; S200. The copper foil is drawn by the drawing roller assembly; S300. The drawn copper foil is covered with the first protective film and the second protective film respectively, and then is die cut by the round knife die cutting assembly, and then is removed from the first protective film and the waste material by the waste removal roller assembly; S400. The first cover film windowed in step S100 and the copper foil die cut in step S300 are cold-pressed to make the first cover film and the second protective film respectively located on both sides of the copper foil and form a primary product; S500. The second protective film of the primary product in step S400 is removed and a second cover film is overlaid to make the first cover film and the second cover film respectively located on both sides of the copper foil and form a secondary product; S600. The secondary product in step S500 is first extruded and overlaid into a circuit board product by the ultrasonic roller assembly, and then the second cover film is cut by the round knife die cutting assembly.

6. The flexible circuit board die-cut production process of claim 5, wherein, S200 specifically comprises the following steps: S210. The drawn copper foil is cleaned by anhydrous ethanol or acetone; S220. The cleaned copper foil is drained.

7. The flexible circuit board die-cut production process of claim 5, wherein: In step S600, when the ultrasonic roller assembly extrudes the copper foil and the cover film, the ultrasonic frequency is 20KHz to 4020KHz, and the roller pressure static pressure is 100kgf / cm² to 400kgf / cm².

8. The flexible circuit board die-cut production process of claim 5, wherein: The first protective film and the second protective film in step S200 are polyethylene films or polyethylene terephthalate films; The first cover film and the second cover film in step S100 and step S500 are polyimide cover films or polyester cover films.

9. The flexible circuit board die-cut production process of claim 5, wherein: In step S500, before the second layer of cover film is laminated, the surface of the copper foil is subjected to plasma treatment, the plasma power is 500W to 1000W, the treatment time is 5s to 15s, the treatment gas is a mixed gas of oxygen and nitrogen, and the volume ratio is 1:3 to 1:5.

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