Substrate processing chamber and flexible grounding device thereof

Abstract

A substrate processing chamber and a flexible grounding device thereof, the flexible grounding device comprising a plurality of flexible braided straps, a first end of the flexible braided strap being connected to a substrate support in the substrate processing chamber, a second end of the flexible braided strap being connected to a chamber body of the substrate processing chamber, and a plurality of belt materials in the flexible woven belt are mutually staggered and wound to form a woven structure. According to the invention, radio frequency grounding is realized by using the grounding strip with the braided structure, the braided structure enables the grounding strip to have a larger conductive area and improve the conductive efficiency, and the braided structure greatly improves the overall strength of the grounding strip, so that the grounding strip has a better anti-fatigue characteristic and is not easy to break, and the service life is prolonged; and the stability and reliability of the radio frequency loop are ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to a substrate processing chamber and its flexible grounding device. Background Technology

[0002] PECVD (Plasma Enhanced Chemical Vapor Deposition) is used to process large-area substrates, such as solar panels, display substrates, and semiconductor substrates. A substrate support is placed inside the vacuum reaction chamber of a PECVD system. The substrate to be processed is placed on the substrate support. A precursor gas is introduced through a gas distribution plate located at the top of the vacuum reaction chamber. Radio frequency (RF) power applied to the gas distribution plate excites the precursor gas, generating plasma between the gas distribution plate and the substrate on the substrate support. The active particles in the plasma react with the precursor gas to generate the desired thin film material, which is then deposited on the substrate.

[0003] The substrate support has a lifting function to realize the loading and unloading of the substrate. Before processing, the substrate support is lowered to the loading and unloading position. The substrate to be processed is conveyed into the vacuum reaction chamber through the substrate inlet and outlet on the vacuum reaction chamber and placed on the substrate support. Then the substrate support drives the substrate to be processed to rise to the processing position for deposition processing. After processing, the substrate support drives the processed substrate to fall back to the loading and unloading position and conveys the processed substrate out of the vacuum reaction chamber through the substrate inlet and outlet on the vacuum reaction chamber.

[0004] During processing, in order to shorten the RF grounding path and avoid negative impacts on the substrate deposition uniformity, a grounding strip made of conductive material is usually set around the periphery of the substrate support to realize the electrical connection between the substrate support and the bottom wall of the vacuum reaction chamber, so as to form an RF current return path.

[0005] As the substrate support is repeatedly raised and lowered, the grounding strip also repeatedly expands and contracts with the movement of the substrate support. Conventional grounding strips are usually thin and flexible aluminum strips. Long-term expansion and contraction can cause cracks or even breakage of the grounding strip, which will also cause changes in the distribution of radio frequency current on the substrate. Ultimately, this will cause the plasma processing results to drift, resulting in uneven substrate deposition. Moreover, once the grounding strip breaks, it can only be replaced during the chamber shutdown phase, which increases the equipment cost.

[0006] The statements herein provide only background information in relation to this invention and do not necessarily constitute prior art. Summary of the Invention

[0007] The purpose of this invention is to provide a substrate processing chamber and its flexible grounding device, which improves the overall strength and fatigue resistance of the grounding strip, extends the service life of the grounding strip, improves the conductivity of the grounding strip, and ensures the stability and reliability of the radio frequency grounding circuit.

[0008] To achieve the above objectives, the present invention provides a substrate processing chamber, comprising:

[0009] The chamber body includes a chamber floor plate and a chamber sidewall, and the chamber sidewall has a substrate transfer port;

[0010] A chamber cover, which is disposed on top of the side wall of the chamber;

[0011] A gas distribution plate is disposed below the chamber cover;

[0012] A radio frequency power source, which is connected to the gas distribution plate, applies radio frequency power to the gas distribution plate;

[0013] A substrate support is disposed within the main chamber to support the substrate and to drive the substrate to move up and down.

[0014] A flexible grounding device includes multiple flexible braided strips, each having a first end and a second end. The first end is connected to the substrate support, and the second end is connected to the chamber body. Each flexible braided strip comprises multiple strips, with each strip having its two ends connected to the first end and the second end, respectively. Each strip is integrally formed, and all the strips are interwoven to form a braided structure.

[0015] Any two strips are fixedly connected by welding material.

[0016] Each of the strips is covered with an insulating material layer.

[0017] The welding material is made of aluminum.

[0018] The insulating material layer is made of anodized aluminum.

[0019] The material of the strip is aluminum alloy, or stainless steel with nickel plating, or stainless steel with aluminum plating.

[0020] The substrate support is rectangular, and the first end of the flexible braided strip is connected to the lower surface of the substrate support. The number of flexible braided strips arranged along the long side of the substrate support is greater than or equal to 8, and the number of flexible braided strips arranged along the short side of the substrate support is greater than or equal to 4.

[0021] Optionally, the second end of the flexible braided strip is connected to the chamber floor.

[0022] Optionally, the second end of the flexible braided strip is connected to the sidewall of the chamber, and the position of the second end is lower than the substrate transmission port.

[0023] The substrate support has multiple lifting pins for lifting the substrate; the substrate processing chamber includes multiple baffles connected to the lower surface of the substrate support and located between the flexible braided belt and the lifting pins.

[0024] The distance between the bottom end of the baffle and the bottom plate of the chamber is greater than or equal to 5 mm.

[0025] The substrate support includes multiple support connectors, which connect the first end of the flexible braided strip to the substrate support; the chamber body includes multiple chamber connectors, which connect the second end of the flexible braided strip to the chamber body.

[0026] Optionally, the second end of the flexible braided tape is vertically offset from the first end of the flexible braided tape.

[0027] Optionally, the second end of the first flexible braided strip is connected to the first chamber connector, the first end of the first flexible braided strip and the first end of the second flexible braided strip are connected together to the first support connector, the second end of the second flexible braided strip and the second end of the third flexible braided strip are connected together to the second chamber connector, and so on, with all the flexible braided strips forming a cross double grid pattern.

[0028] The present invention also provides a flexible grounding device, comprising:

[0029] Multiple flexible braided tapes, each having a first end and a second end; each flexible braided tape comprises multiple strips, each strip having its two ends connected to the first end and the second end respectively, each strip being integrally formed, and all the strips being interwoven to form a braided structure.

[0030] Any two strips are fixedly connected by welding material.

[0031] Each of the strips is covered with an insulating material layer.

[0032] The welding material is made of aluminum.

[0033] The insulating material layer is made of anodized aluminum.

[0034] This invention uses a grounding strip with a braided structure to achieve radio frequency grounding. The braided structure gives the grounding strip a larger conductive area, improving conductivity. Furthermore, the braided structure greatly enhances the overall strength of the grounding strip, giving it better fatigue resistance, making it less prone to breakage, and extending its service life.

[0035] This invention secures the contact portions between any two strands of a flexible braided tape with a braided structure using welding material, ensuring the stability and non-deformation of the formed braided structure, guaranteeing electrical contact between each strand, improving conductivity, and ensuring the reliability of radio frequency grounding for each flexible braided tape.

[0036] This invention ensures electrical insulation between each strip by covering the surface of each strip in the flexible braided tape with an insulating material layer, thereby guaranteeing the reliability of the radio frequency grounding of each flexible braided tape. The insulating material layer also prevents the strip from being corroded by plasma within the cavity, improving safety, preventing electrical short circuits, reducing electromagnetic interference, enhancing equipment reliability, and protecting conductive materials from corrosion or wear. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the structure of a substrate processing chamber provided by the present invention.

[0038] Figure 2 This is a schematic diagram of the structure of a flexible woven tape in one embodiment of the present invention.

[0039] Figure 3 This is a schematic diagram of the structure of the flexible woven tape in another embodiment of the present invention.

[0040] Figure 4 This is a schematic diagram of the structure of the flexible woven tape in another embodiment of the present invention.

[0041] Figure 5 yes Figure 1 Top view of the middle substrate support and flexible braided strip.

[0042] Figure 6 This is a side view of the substrate support and flexible braided tape in one embodiment of the present invention.

[0043] Figure 7 This is a side view of the substrate support and flexible braided tape in another embodiment of the present invention.

[0044] Figure 8 This is a side view of the substrate support and flexible braided tape in another embodiment of the present invention.

[0045] Figure 9 This is a schematic diagram of the baffle structure in one embodiment of the present invention.

[0046] Figure 10 This is a schematic diagram of the baffle structure in another embodiment of the present invention. Detailed Implementation

[0047] The following is based on Figures 1-10 The preferred embodiments of the present invention will be described in detail below.

[0048] like Figure 1 As shown, this invention provides a substrate processing chamber for use in a plasma-enhanced chemical vapor deposition (PECVD) apparatus. The chamber comprises a chamber body 1 and a chamber cover 2. The chamber body 1 has a chamber bottom plate 11 and a chamber sidewall 12. The chamber cover 2 is disposed on top of the chamber sidewall 12. The chamber body 1 and the chamber cover 2 together form a processing space. A substrate transfer port 13 is provided on the chamber sidewall 12 for transferring substrates. A gas distribution plate 3 is disposed below the chamber cover 2, and the gas distribution plate 3 is connected to an external gas source (not shown in the figure). The gas distribution plate 3 delivers the reaction gas from the gas source into the processing space formed by the chamber body 1 and the chamber cover 2. A substrate support 4 is disposed inside the chamber body 1, and a substrate 5 to be processed is placed on the substrate support 4. The substrate support 4 has a lifting function, which can move the substrate 5 up and down. The gas distribution plate 3 serves as the upper electrode assembly, and the substrate support 4 serves as the lower electrode assembly. The gas distribution plate 3 is connected to an RF power source (not shown in the figure). The RF power source applies RF power to the gas distribution plate 3, generating an RF electric field between the upper electrode assembly and the lower electrode assembly, thereby dissociating the reactive gas into plasma. The active particles in the plasma react with the reactive gas to generate the desired thin film material, which is then deposited on the substrate 5 to be processed.

[0049] like Figure 1 As shown, the flexible grounding device includes multiple flexible braided strips 6, each having a first end 61 and a second end 62. The first end 61 is connected to the substrate support 4, and the second end 62 is connected to the chamber body 1, thereby achieving an electrical connection between the substrate support 4 and the chamber body 1, forming a radio frequency current return path, thereby eliminating any voltage drop across the substrate support 4 and avoiding affecting the deposition uniformity on the substrate 5.

[0050] like Figures 2-4 As shown, the flexible braided tape 6 comprises multiple strips 63, with each strip 63 connected to the first end 61 and the second end 62 at both ends. Each strip 63 is integrally formed, ensuring that each strip 63 between the first end 61 and the second end 62 forms a continuous and complete conductive path, thus improving the reliability of the flexible braided tape 6 as a radio frequency conductive circuit. The strips 63 are made of conductive materials, such as aluminum alloy, nickel-plated stainless steel, or aluminum-plated stainless steel. These materials possess excellent radio frequency conduction properties, thereby improving radio frequency conduction efficiency.

[0051] like Figures 2-4As shown, all the strips 63 are interwoven to form a braided structure. This braided structure greatly improves the overall strength of the flexible braided strip 6, giving it better fatigue resistance, making it less prone to breakage, and extending its service life. Figure 2 As shown, in one embodiment of the present invention, the strips 63 are interlaced and wound together to form a plain weave structure, as illustrated below. Figure 3 As shown, in another embodiment of the present invention, the strips 63 are interlaced and wound together to form a twill weave structure, as illustrated. Figure 4 As shown, in the third embodiment of the present invention, a herringbone weave is used to intertwine the strips 63 to form a herringbone weave structure. Alternatively, other weaving methods can be used to give the flexible braided strip 6 a braided structure. As long as each strip 63 between the first end 61 and the second end 62 remains continuous during the weaving process, each strip 63 can form a continuous and complete conductive path. While ensuring the reliability of the radio frequency conductive circuit, the braided structure enhances the overall strength of the flexible braided strip 6, giving it better fatigue resistance, reducing breakage, and extending its service life.

[0052] To ensure the reliability of the RF return path provided by the flexible braided tape, in one embodiment of the present invention, the portions of any two strips 63 of the flexible braided tape 6 that come into contact with each other are fixedly connected by a solder (not shown in the figure). The solder is a material with a melting point higher than that of the operating environment (process temperature inside the cavity) and good conductivity, such as aluminum. By fixing the strips 63 in the braided structure by welding, the formed braided structure can be ensured to be stable and not deformed, ensuring electrical contact between each strip 63, improving conductivity efficiency, and ensuring the reliability of the RF grounding of each flexible braided tape.

[0053] In another embodiment of the invention, the surface of each of the strips 63 is covered with an insulating material layer, such as anodized aluminum, to ensure electrical insulation between each strip 63 and guarantee the reliability of the radio frequency grounding of each flexible braided strip. The insulating material layer also prevents the strips 63 from being corroded by plasma in the cavity, improving safety, preventing electrical short circuits, reducing electromagnetic interference, improving equipment reliability, and protecting conductive materials from corrosion or wear.

[0054] like Figure 1As shown, the first end 61 of the flexible braided tape 6 is connected to the lower surface of the substrate support 4, and the first end 61 is close to the edge of the substrate support 4 to shorten the distance between the first end 61 and the chamber body 1, thereby shortening the length of the flexible braided tape 6 to save costs. Typically, the second end 62 of the flexible braided tape 6 is connected to the chamber bottom plate 11 to achieve an electrical connection between the substrate support 4 and the chamber body 1, forming an RF current return path. Alternatively, the second end 62 of the flexible braided tape 6 can be connected to the chamber sidewall 12. It is necessary to ensure that the position of the second end 62 is lower than the substrate transmission port 13 located on the chamber sidewall 12 to avoid obstructing the transmission of the substrate 5 through the substrate transmission port 13. Connecting the second end 62 to the chamber sidewall 12 can further shorten the length of the flexible braided tape 6, and because the height of the grounding point is increased, the path of the RF conductive loop is also shortened. In some other embodiments, the first end 61 of the flexible braided tape 6 can also be connected to the side of the substrate support 4.

[0055] The substrate 5 to be processed is typically large in size and rectangular, such as a display substrate, and the area of ​​the substrate 5 to be processed is typically greater than 1m². 2 Correspondingly, the substrate support 4 is also rectangular, and its size is designed to be relatively large, exceeding the size of the substrate 5 to be processed. This is to improve the uniformity of the radio frequency distribution. Figure 5 As shown, a plurality of flexible braided strips 6 are provided on the edge of the substrate support 4. The number of flexible braided strips 6 arranged along the long side of the substrate support 4 is greater than or equal to 8, and the number of flexible braided strips 6 arranged along the short side of the substrate support 4 is greater than or equal to 4.

[0056] Furthermore, such as Figure 6 As shown, for ease of installation and disassembly, the first end 61 of the flexible braided strip 6 is connected to the substrate support 4 via a support connector 42, and the second end 62 of the flexible braided strip 6 is connected to the chamber body 1 via a chamber connector 14. The support connector 42 and the chamber connector 14 connected to the same flexible braided strip 6 are basically aligned in the vertical direction. At this time, the length of the flexible braided strip 6 can be shorter to save costs.

[0057] like Figure 7 As shown, in another embodiment, the connection method of the flexible braided tape 6 is as follows: Figure 6Based on the above, adjustments are made: the first support connector 42-1 and the first chamber connector 14-1 are vertically aligned with each other; the second support connector 42-2 and the second chamber connector 14-2 are vertically aligned with each other; the third support connector 42-3 and the third chamber connector 14-3 are vertically aligned with each other; the fourth support connector 42-4 and the fourth chamber connector 14-4 are vertically aligned with each other, and so on. The first end of the first flexible braided tape 6-1 is connected to the first support connector 42-1, and the second end of the first flexible braided tape 6-1 is connected to the second chamber connector 14-2. Similarly, the second flexible braided tape 6-2 and the third flexible braided tape 6-3, as well as other flexible braided tapes, are connected in the same manner. This connection method causes the second end of the flexible braided tape to be vertically offset relative to the first end, which can keep the bent portion of the flexible braided tape 6 away from the parasitic plasma located under the substrate support 4, reduce the portion of the flexible braided tape 6 exposed to the parasitic plasma, and extend the service life of the flexible braided tape 6.

[0058] like Figure 8 As shown, in another embodiment of the present invention, combined with Figure 6 and Figure 7 The connection method involves connecting the second end of the first flexible braided tape 6-1 to the first chamber connector 14-1, connecting the first end of the first flexible braided tape 6-1 and the first end of the second flexible braided tape 6-2 together to the first support connector 42-1, connecting the second end of the second flexible braided tape 6-2 and the second end of the third flexible braided tape 6-3 together to the second chamber connector 14-2, and so on, with all the flexible braided tapes forming a cross-double grid pattern. This cross-double connection method significantly reduces the impedance of the RF conductive path formed by the flexible braided tape, improves the RF grounding efficiency of the flexible braided tape, reduces the potential difference between the substrate support 4 and the chamber body 1, thereby eliminating or reducing arc discharge between the substrate support 4 and the chamber body 1, and reducing the harmful effects of the potential difference. The cross-double connection method also reduces the generation of parasitic plasma, extending the service life of the flexible braided tape and other components within the chamber.

[0059] like Figure 9As shown, the substrate support 4 has multiple lifting pins 41. After processing the substrate 5, the substrate support 4 descends to a first position, which is lower than the substrate transfer port 13. The lifting pins 41 rise to lift the substrate 5, and the transfer robot transfers the substrate 5 out of the substrate processing chamber through the substrate transfer port 13. A new unprocessed substrate 5 is then transferred into the substrate processing chamber, placed on the lifting pins 41. The lifting pins 41 then descend, allowing the new substrate 5 to be smoothly placed on the substrate support 4. The substrate support 4 then rises to a second position, which is higher than the substrate transfer port 13, to begin processing the substrate. During the lifting and lowering process of the substrate support 4, the flexible braided belt 6 moves. The flexible braided belt 6 may swing and sway during this movement. The swinging flexible braided belt 6 may strike the lifting pins 41, causing damage to the lifting pins 41 and the flexible braided belt 6, and even leading to problems such as substrate 5 breakage. In this embodiment, multiple baffles 7 are provided. The baffles 7 are connected to the lower surface of the substrate support 4 and are located between the flexible braided strip 6 and the lifting pin 41. The baffles 7 need to be long enough to protect the lifting pin 41 from being touched by the flexible braided strip 6. However, the length of the baffles 7 cannot be too long. When the substrate support 4 descends to the first position, it is necessary to ensure that the distance between the bottom end of the baffle 7 and the chamber floor plate 11 is greater than or equal to 5mm to prevent contact with the chamber floor plate 11 and to maintain a safe distance to avoid interference. The baffles 7 achieve physical isolation between the flexible braided strip 6 and the lifting pin 41, protecting the lifting pin 41, preventing the flexible braided strip 6 from striking the lifting pin 41, avoiding damage to the lifting pin 41, and preventing damage to the substrate 5. In another embodiment, as... Figure 10 As shown, the first end 61 of the flexible braided belt 6 can also be directly connected to the bottom end of the baffle 7, which can also protect the lifting pin 41, while further shortening the length of the flexible braided belt 6, reducing the probability of the flexible braided belt 6 swinging and swaying, and saving costs.

[0060] This invention uses a grounding strip with a braided structure to achieve radio frequency grounding. The braided structure gives the grounding strip a larger conductive area, improving conductivity. Furthermore, the braided structure greatly enhances the overall strength of the grounding strip, giving it better fatigue resistance, making it less prone to breakage, and extending its service life.

[0061] It should be noted that, in the embodiments of the present invention, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the embodiments. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0062] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0063] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0064] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0065] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0066] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if [described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [described condition or event] is detected," or "in response to detection of [described condition or event]."

[0067] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present invention. After reading the above content, various modifications and substitutions to the present invention will be obvious to those skilled in the art. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A substrate processing chamber, characterized in that, Include: The chamber body includes a chamber floor plate and a chamber sidewall, and the chamber sidewall has a substrate transfer port; A chamber cover, which is disposed on top of the side wall of the chamber; A gas distribution plate is disposed below the chamber cover; A radio frequency power source, which is connected to the gas distribution plate, applies radio frequency power to the gas distribution plate; A substrate support is disposed within the main chamber to support the substrate and to drive the substrate to move up and down. A flexible grounding device includes multiple flexible braided strips, each having a first end and a second end. The first end is connected to the substrate support, and the second end is connected to the chamber body. Each flexible braided strip comprises multiple strips, with each strip having its two ends connected to the first end and the second end, respectively. Each strip is integrally formed, and all the strips are interwoven to form a braided structure.

2. The substrate processing chamber as described in claim 1, characterized in that, Any two strips are fixedly connected by welding material.

3. The substrate processing chamber as described in claim 1, characterized in that, Each of the strips is covered with an insulating material layer.

4. The substrate processing chamber as described in claim 2 or 3, characterized in that, The welding material is made of aluminum.

5. The substrate processing chamber as described in claim 4, characterized in that, The insulating material layer is made of anodized aluminum.

6. The substrate processing chamber as described in claim 5, characterized in that, The material of the strip is aluminum alloy, or stainless steel with nickel plating, or stainless steel with aluminum plating.

7. The substrate processing chamber as described in claim 1, characterized in that, The substrate support is rectangular, and the first end of the flexible braided strip is connected to the lower surface or side surface of the substrate support. The number of flexible braided strips arranged along the long side of the substrate support is greater than or equal to 8, and the number of flexible braided strips arranged along the short side of the substrate support is greater than or equal to 4.

8. The substrate processing chamber as described in claim 7, characterized in that, The second end of the flexible braided strip is connected to the chamber floor plate.

9. The substrate processing chamber as described in claim 7, characterized in that, The second end of the flexible braided strip is connected to the side wall of the chamber, and the position of the second end is lower than the transmission port of the substrate.

10. The substrate processing chamber as claimed in claim 1, characterized in that, The substrate support has multiple lifting pins for lifting the substrate; the substrate processing chamber includes multiple baffles connected to the lower surface of the substrate support and located between the flexible braided belt and the lifting pins.

11. The substrate processing chamber as claimed in claim 10, characterized in that, The distance between the bottom end of the baffle and the bottom plate of the chamber is greater than or equal to 5 mm.

12. The substrate processing chamber as claimed in claim 1, characterized in that, The substrate support includes multiple support connectors, which connect the first end of the flexible braided strip to the substrate support; the chamber body includes multiple chamber connectors, which connect the second end of the flexible braided strip to the chamber body.

13. The substrate processing chamber as described in claim 12, characterized in that, The second end of the flexible braided tape is vertically offset from the first end of the flexible braided tape.

14. The substrate processing chamber as described in claim 12, characterized in that, The second end of the first flexible braided strip is connected to the first chamber connector. The first end of the first flexible braided strip and the first end of the second flexible braided strip are connected together to the first support connector. The second end of the second flexible braided strip and the second end of the third flexible braided strip are connected together to the second chamber connector, and so on. All the flexible braided strips form a cross double grid pattern.

15. A flexible grounding device, characterized in that, Include: Multiple flexible braided tapes, each having a first end and a second end; each flexible braided tape comprises multiple strips, each strip having its two ends connected to the first end and the second end respectively, each strip being integrally formed, and all the strips being interwoven to form a braided structure.

16. The flexible grounding device as described in claim 15, characterized in that, Any two strips are fixedly connected by welding material.

17. The flexible grounding device as described in claim 15, characterized in that, Each of the strips is covered with an insulating material layer.

18. The flexible grounding device as described in claim 16 or 17, characterized in that, The welding material is made of aluminum.

19. The flexible grounding device as described in claim 18, characterized in that, The insulating material layer is made of anodized aluminum.

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