Electronic component manufacturing apparatus

Abstract

The invention provides a manufacturing device of an electronic component, and the device can inhibit the wiring from being broken under the action of repeated load which acts along with the movement of a movable member. An electronic component manufacturing device is provided with a first member (110), a second member (120), an actuator (130), an operating mechanism (150), an input unit (160), and a wiring member (180). The second member is provided so as to be movable relative to the first member. The actuator (130) changes the relative position of the first member and the second member such that the distance between the first member and the second member changes. The operating mechanism (150) is provided to the first member. The input unit is provided to the second member and inputs power or an electric signal. The wiring member (180) is disposed between the first member and the second member and is formed in a coil spring shape. The electric power or the electric signal is supplied to the operating mechanism (150) via a wiring member (180).

Description

Technical Field

[0001] This invention relates to an apparatus for manufacturing electronic components. Background Technology

[0002] As prior art, Japanese Patent No. 4656602 (Patent Document 1) discloses a cutting device for a laminated billet. The cutting device for a laminated billet described in Patent Document 1 includes a stage, a cutter, a cooling unit, and a heating unit. The stage has a mounting surface that supports the laminated billet. The cutter is movable in the thickness direction of the laminated billet, cutting the laminated billet supported on the stage by moving in the thickness direction. The cooling unit comes into contact with the area of ​​the laminated billet cut by the cutter and cools the cut area. The heating unit heats the laminated billet to facilitate cutting.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 4656602 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] When movable components such as cutters operate at high speeds and are connected by wiring that links fixed and movable components, the moving movable components repeatedly load the wiring, which can lead to wire breakage.

[0008] The present invention was made in view of the above-mentioned problems, and its object is to provide an apparatus for manufacturing electronic components that can suppress wire breakage under repeated loads caused by the movement of movable members.

[0009] Solution for solving the problem

[0010] The manufacturing apparatus for an electronic component according to the present invention includes a first component, a second component, an actuator, an operating mechanism, an input unit, and a wiring component. The second component is configured to be movable relative to the first component. The actuator changes the relative position of the first and second components by changing the distance between them. The operating mechanism is provided on the first component. The input unit is provided on the second component and inputs power or an electrical signal. The wiring component is disposed between the first and second components and is formed in the shape of a helical spring. The operating mechanism is supplied with the power or the electrical signal via the wiring component.

[0011] The effects of the invention

[0012] According to the present invention, it is possible to suppress wire breakage under repeated loads caused by the movement of movable components. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view of an electronic component manufacturing apparatus according to an embodiment of the present invention.

[0014] Figure 2 Observe from the direction of the arrow on line II-II Figure 1 A cross-sectional view of an electronic component manufacturing apparatus.

[0015] Explanation of reference numerals in the attached figures

[0016] 10. Dielectric block; 100. Manufacturing apparatus for electronic components; 110. First component; 111. Guide shaft; 120. Second component; 121. Bearing; 130. Actuator; 131. Rod; 140. Cutting blade; 150. Holding part; 151. Electromagnetic retaining element; 160. Input part; 171. First sleeve; 172. Second sleeve; 173. First flanged pin; 174. 176. Protrusion; 175. Second flanged pin; 180. Wiring component; 181. 182. Wiring; 190. Stage; 191. Heating mechanism. Detailed Implementation

[0017] Hereinafter, an apparatus for manufacturing an electronic component according to an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description of the embodiment, the same or equivalent parts in the drawings will be labeled with the same reference numerals, and will not be described repeatedly. In the following description of the apparatus for manufacturing an electronic component, an apparatus for manufacturing multilayer ceramic capacitors will be described; however, the electronic component is not limited to multilayer ceramic capacitors, and any electronic component manufactured by a rotating mechanism may be used.

[0018] The manufacturing method of multilayer ceramic capacitors is described. In manufacturing multilayer ceramic capacitors, a ceramic dielectric slurry is first prepared. Specifically, ceramic dielectric powder, additive powder, binder resin, and solvent are dispersed and mixed to prepare the ceramic dielectric slurry. The ceramic dielectric powder is, for example, perovskite-structured dielectric particles such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder is, for example, composed of at least one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds, and Co compounds. As the binder resin, polyurethane resin, urea-formaldehyde resin, melamine resin, epoxy resin, vinyl acetate resin, acrylic resin, or water-based polymers such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) can be used. They can be used alone or in combination. The ceramic dielectric slurry can be either solvent-based or water-based. When the ceramic dielectric slurry is a water-based coating, it is prepared by mixing water-soluble binders and dispersants with water-soluble dielectric raw materials.

[0019] Next, a ceramic dielectric sheet is formed. Specifically, the ceramic dielectric slurry is formed into a sheet shape on a carrier film using a die coater, gravure coater, or micro-gravure coater, and then dried to form a ceramic dielectric sheet. From the viewpoint of miniaturization and high capacitance of multilayer ceramic capacitors, the thickness of the ceramic dielectric sheet is preferably 0.2 μm or more and 10 μm or less.

[0020] Next, a master sheet is formed. Specifically, a conductive paste is coated onto a ceramic dielectric sheet in a predetermined pattern to form a master sheet with a predetermined internal electrode pattern on the ceramic dielectric sheet. The conductive paste includes Ni powder, solvent, dispersant, and binder, and is prepared to a certain viscosity. Screen printing, inkjet printing, or gravure printing can be used as the coating method for the conductive paste. From the viewpoint of miniaturization and high capacitance of multilayer ceramic capacitors, the thickness of the internal electrode pattern is preferably 0.2 μm or more and 10 μm or less. In addition to the master sheet with the internal electrode pattern, a ceramic dielectric sheet without the internal electrode pattern is also prepared as the master sheet.

[0021] Next, multiple master sheets are stacked. Specifically, a predetermined number of master sheets consisting only of ceramic dielectric sheets without internal electrode patterns are stacked, for example, with a thickness of 0.5 μm or more and 5 μm or less. A predetermined number of master sheets with internal electrode patterns are then stacked on top of these. The number of master sheets with internal electrode patterns stacked is, for example, 5 or more and 2000 or less. Furthermore, a predetermined number of master sheets consisting only of ceramic dielectric sheets without internal electrode patterns are then stacked on top of these, with a thickness of, for example, 0.5 μm or more and 10 μm or less. Thus, a master sheet set is formed.

[0022] Next, a dielectric block is formed by pressing the master wafer assembly. Specifically, the master wafer assembly is pressed in the stacking direction by isostatic pressing or rigid pressing to form the dielectric block. At this time, ceramic dielectric sheets are pressed at a predetermined temperature to make them adhere tightly to each other. In addition, by placing a ceramic dielectric sheet of a certain thickness on the outermost layer in the stacking direction and pressing it, the dielectric sheet with the internal electrode pattern formed can be protected.

[0023] Next, the dielectric blocks are divided to form a chip. Here, the structure of an electronic component manufacturing apparatus according to one embodiment of the present invention will be described. Figure 1 This is a cross-sectional view of an electronic component manufacturing apparatus according to an embodiment of the present invention. Figure 2 Observe from the direction of the arrow on line II-II Figure 1 A cross-sectional view of an electronic component manufacturing apparatus.

[0024] like Figure 1 and Figure 2 As shown, an electronic component manufacturing apparatus 100 according to an embodiment of the present invention includes a first component 110, a second component 120, an actuator 130, an operating mechanism, an input section 160, and a wiring member 180. The second component 120 is configured to be movable relative to the first component 110. The actuator 130 changes the relative position of the first component 110 and the second component 120 by changing the distance between the first component 110 and the second component 120. The operating mechanism is provided on the first component 110. The input section 160 is provided on the second component 120 and inputs power or an electrical signal. The wiring member 180 is disposed between the first component 110 and the second component 120 and is formed in the shape of a helical spring. The operating mechanism is supplied with power or an electrical signal input from the input section 160 via the wiring member 180.

[0025] In this embodiment, the electronic component manufacturing apparatus 100 divides the dielectric block 10 into multiple chips in a matrix shape by die cutting. The dielectric block 10 is disposed on the stage 190.

[0026] The stage 190 is configured to hold the dielectric block 10 by vacuum attraction or electromagnetic adsorption. The stage 190 is configured to move in the X-axis and Y-axis directions and rotate in the XY plane. The stage 190 has a heating mechanism 191. By operating the heating mechanism 191, the component held on the stage 190 can be heated and softened. The temperature at which the dielectric block 10 is heated is preferably above the softening temperature of the binder contained in the ceramic dielectric sheet. The heating mechanism 191 is, for example, an electric heater.

[0027] In this embodiment, the first component 110 is a movable component, and the second component 120 is a fixed component. However, it is also possible that the second component 120 is a movable component and the first component 110 is a fixed component, or that both the first component 110 and the second component 120 are movable components. The second component 120 is a gate-shaped structure. An actuator 130 is provided on the second component 120. The actuator 130 has a rod 131 that can be driven in the vertical direction. The actuator 130 can be driven by piezoelectric drive, hydraulic drive, pneumatic drive, or electromagnetic drive, etc.

[0028] The first component 110 is positioned above the stage 190. A pair of guide shafts 111 extending in the vertical direction are provided at both ends of the upper surface of the first component 110. The pair of guide shafts 111 pass through bearings 121 provided in the second component 120. Thus, the first component 110 is connected to the second component 120 in a manner that allows it to move in the vertical direction.

[0029] The lower end of the rod 131 is connected to the center of the upper surface of the first component 110. By driving the actuator 130, the first component 110 can descend or rise away from the stage 190. The vertical movement of the first component 110 is within the telescopic range of the wiring component 180.

[0030] A gripping part 150 serving as an operating mechanism is provided on the lower surface of the first component 110. The gripping part 150 has a plurality of electromagnetic holding members 151, which can grip the cutting blade 140 by operating the plurality of electromagnetic holding members 151.

[0031] In this embodiment, the cutting blade 140 is double-edged, but it is not limited to this; the cutting blade 140 may also be single-edged, clamshell-edged, or stepped-edged, etc. The cutting blade 140 is made of a superhard alloy. The cutting blade 140 is made of a combined metal with tungsten carbide and cobalt as the main components.

[0032] The first component 110 is driven by the actuator 130 to move periodically in the vertical direction (Z-axis direction), and the dielectric block 10 moves together with the stage 190 in the X-axis or Y-axis direction, thereby enabling the cutting blade 140 to cut the dielectric block 10. The frequency of the vertical movement of the first component 110 is, for example, 10 Hz or more and 100 Hz or less. In this case, the distance between the first component 110 and the second component 120 in the Z-axis direction changes periodically.

[0033] The cutting position of the dielectric block 10 can also be determined by image analysis. In this case, the electronic component manufacturing apparatus 100 is equipped with a camera capable of capturing images of the dielectric block 10. By analyzing the images obtained by capturing images of the dielectric block 10 with the camera, the position of the dielectric block 10 or the position of the internal electrode pattern can be determined, and the cutting position of the dielectric block 10 can be determined based on this position.

[0034] Two resin-made first sleeves 171 are fixed to the first component 110. The first sleeves 171 have a cylindrical shape. A conductive first flanged pin 173 is embedded in the first sleeve 171. A cylindrical protrusion 174 is formed on the side of the first flanged pin 173 opposite to the side where the pin is located.

[0035] Two resin-made second sleeves 172 are fixed to the second component 120. The second sleeves 172 have a cylindrical shape. A conductive second flanged pin 175 is embedded in the second sleeve 172. A cylindrical protrusion 176 is formed on the side of the second flanged pin 175 opposite to the side where the pin is located.

[0036] The wiring member 180 has closed-end shapes at both ends. One end of the wiring member 180 abuts against the first flange pin 173 with the protrusion 174 inserted therein. The other end of the wiring member 180 abuts against the second flange pin 175 with the protrusion 176 inserted therein. That is, the wiring member 180 is clamped between the first sleeve 171 and the second sleeve 172.

[0037] The wiring member 180 is electrically connected to the input section 160 via the second flanged pin 175 and the wiring 181. The wiring member 180 is electrically connected to the electromagnetic retainer 151 via the first flanged pin 173 and the wiring 182. Thus, power input from the input section 160 is supplied to the electromagnetic retainer 151 via the wiring member 180, and the electromagnetic retainer 151 is driven by the supplied power. Alternatively, an electrical signal input from the input section 160 to turn the electromagnetic retainer 151 on / off may also be supplied to the electromagnetic retainer 151 via the wiring member 180.

[0038] Because the wiring member 180 is formed in the shape of a helical spring, it can expand and contract in response to the movement of the first member 110, while the wiring 181 and wiring 182 remain stationary. Furthermore, the wiring member 180 can mitigate the impact load applied due to the movement of the first member 110. Therefore, it is possible to suppress repeated loading of the wiring 181 and wiring 182 as the first member 110 moves, and to prevent breakage of the wiring 181 and wiring 182.

[0039] The wiring component 180 is made of piano wire. Piano wire has a high modulus of elasticity and fatigue strength. Therefore, even if the wiring component 180 is repeatedly compressed and stretched as the first component 110 moves, and the wiring component 180 is subjected to repeated loads, the wiring component 180 can be prevented from breaking.

[0040] In this embodiment, by clamping the wiring member 180 between the first sleeve 171 and the second sleeve 172, short circuits between the first member 110 and the wiring member 180, as well as between the second member 120 and the wiring member 180, can be suppressed. Furthermore, the first sleeve 171 and the second sleeve 172 can mitigate the impact load applied to the wiring member 180. As a result, repeated loading on the wiring 181 and the wiring 182 can be further suppressed.

[0041] Furthermore, by having the wiring member 180 with the protrusion 174 of the first flanged pin 173 inserted at one end and the protrusion 176 of the second flanged pin 175 inserted at the other end abutting against the first flanged pin 173 and the second flanged pin 175 respectively, the wiring member 180 can be stably maintained.

[0042] Furthermore, by connecting the pin of the first flanged pin 173 to the wiring 182 and the pin of the second flanged pin 175 to the wiring 181, the wiring 181 and wiring 182 can be easily connected to the wiring member 180 respectively.

[0043] Furthermore, the connection methods of wiring 181 and wiring 182 to wiring member 180 are not limited to the methods described above.

[0044] As described above, by repeatedly cutting with a cutting blade 140 in the electronic component manufacturing apparatus 100, the dielectric block 10 is monolithically divided into multiple chips.

[0045] Next, the chip is baked. Specifically, the chip is heated, thereby baking the dielectric and conductive materials contained within the chip to form a laminate. The baking temperature is appropriately set corresponding to the dielectric and conductive materials. Alternatively, the laminate can be tumbled.

[0046] Next, an external electrode is formed. For example, Ni and Sn are sequentially plated onto the laminate to form a plating layer, thereby forming an external electrode on the outer surface of the laminate.

[0047] Through the above series of processes, it is possible to manufacture multilayer ceramic capacitors.

[0048] (Postscript)

[0049] Those skilled in the art will understand that the above exemplary embodiments are specific examples of the following technical solutions.

[0050] <1>

[0051] An apparatus for manufacturing electronic components, wherein,

[0052] The manufacturing apparatus for this electronic component includes:

[0053] Component 1;

[0054] The second component is configured to be movable relative to the first component;

[0055] An actuator that changes the relative position of the first component and the second component in such a way that the distance between the first component and the second component changes;

[0056] An operating mechanism is disposed on the first component;

[0057] An input unit, disposed on the second component, is used to input power or electrical signals; and

[0058] A wiring component, disposed between the first component and the second component, is formed in the shape of a helical spring.

[0059] The operating mechanism is supplied with the power or the electrical signal via the wiring component.

[0060] <2>

[0061] according to <1> The aforementioned electronic component manufacturing apparatus, wherein,

[0062] A resin-made first sleeve is fixed to the first component.

[0063] A second sleeve made of resin is fixed to the second component.

[0064] The wiring component is clamped between the first sleeve and the second sleeve.

[0065] <3>

[0066] according to <1> or <2> The aforementioned electronic component manufacturing apparatus, wherein,

[0067] The distance between the first component and the second component changes periodically.

[0068] <4>

[0069] according to <1> ~ <3> The manufacturing apparatus for the electronic component as described in any one of the following statements, wherein,

[0070] The wiring components are made of piano wire.

[0071] In the above description of the embodiments, the combinable structures can also be combined with each other. The manufacturing apparatus for electronic components is not limited to the structure described above, as long as it has a helical spring-shaped wiring member that can supply power or electrical signals to the operating mechanism involved in the manufacturing of electronic components.

[0072] It should be considered that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the invention is defined not by the foregoing description but by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

Claims

1. An apparatus for manufacturing electronic components, wherein, The manufacturing apparatus for this electronic component includes: Component 1; The second component is configured to be movable relative to the first component; An actuator that changes the relative position of the first component and the second component in such a way that the distance between the first component and the second component changes; An operating mechanism is disposed on the first component; An input unit, which is provided on the second component, inputs power or electrical signals; as well as A wiring component, disposed between the first component and the second component, is formed in the shape of a helical spring. The operating mechanism is supplied with the power or the electrical signal via the wiring component.

2. The electronic component manufacturing apparatus according to claim 1, wherein, A resin-made first sleeve is fixed to the first component. A second sleeve made of resin is fixed to the second component. The wiring component is clamped between the first sleeve and the second sleeve.

3. The manufacturing apparatus for electronic components according to claim 1 or 2, wherein, The distance between the first component and the second component changes periodically.

4. The manufacturing apparatus for an electronic component according to any one of claims 1 to 3, wherein, The wiring components are made of piano wire.

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