Chemical dosing device for a semiconductor cleaning apparatus

Abstract

This application relates to the field of semiconductor manufacturing technology and discloses a chemical quantitative supply device for semiconductor cleaning equipment, including a cleaning machine body, with a control panel fixedly connected to one side of the cleaning machine body. The invention drives a rotating rod to precisely displace a slider engaged with it along the inner wall of a quantitative tank, thereby compressing the internal space of the quantitative tank by a sealed piston, achieving precise adjustment of the tank space. Simultaneously, the chemical raw material required for synthesizing the cleaning solution is supplied to the quantitative tank through a first guide pipe. As the liquid level rises, the float rises under the buoyancy of the liquid and, through a series of transmissions, precisely contacts the inclined edge of the L-shaped connecting rod with the pressure sensing unit, thereby opening the second control valve. Under the action of pressure difference, the precisely proportioned liquid in the quantitative tank is smoothly injected into the mixing chamber through the second guide pipe, completing the efficient homogenization and mixing of different components.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a chemical metering device for semiconductor cleaning equipment. Background Technology

[0002] In semiconductor fabrication, cleaning is required after almost every process step, and wet cleaning is typically used. During wet cleaning, a cleaning solution needs to be supplied to the cleaning equipment. The cleaning solution, usually heated to a certain temperature by a heater before being supplied to the cleaning equipment, is typically released from a storage tank.

[0003] However, in existing technologies, liquid proportioning mostly relies on flow meters or peristaltic pumps. But in actual production, fluid pressure fluctuations (such as unstable compressed air or changes in pipeline bend resistance) can cause significant deviations in instantaneous flow rates, which directly affect the photoresist residue rate and etching uniformity during the cleaning process. Secondly, in open circulation systems, the cleaning fluid circulates to a certain extent inside the chamber. During circulation, different batches of cleaning fluid are highly likely to mix due to stagnation in dead water areas, which may lead to contamination of the components and uncontrollable side effects. Furthermore, when changing the formula, the pipeline needs to be flushed for a long time to effectively avoid residual contamination. This may result in excessive downtime of the equipment, which will significantly reduce production efficiency. Summary of the Invention

[0004] This application proposes a chemical quantitative supply device for semiconductor cleaning equipment, which has the advantage of precise proportioning and solves the problem of possible deviation in proportioning in the prior art.

[0005] To achieve the above objectives, this application adopts the following technical solution: a chemical quantitative supply device for semiconductor cleaning equipment, comprising a cleaning machine body, a control panel fixedly connected to one side of the cleaning machine body, an observation window provided on one side of the control panel, the observation window being movably fitted inside the cleaning machine body, an installation groove being provided inside the cleaning machine body, and a moving component being provided inside the installation groove;

[0006] A metering block is fixedly connected inside the main body of the cleaning machine, and an adjustment component is provided inside the metering block;

[0007] The bottom of the quantitative block is fixedly connected to a second guide tube, and a quantitative component is provided on one side of the second guide tube;

[0008] A mixing chamber is fixedly connected inside the main body of the cleaning machine, and a conveying component is installed inside the mixing chamber;

[0009] The main body of the cleaning machine is equipped with a circulation component.

[0010] Preferably, the movable component includes a support plate, with placement frames fixedly connected to both sides of the top of the support plate, and first guide rails fixedly connected to both sides of the support plate. The first guide rails are fixedly connected to the main body of the cleaning machine, and the support plate is slidably connected inside the first guide rails. Cleaning chambers are provided on both sides inside the main body of the cleaning machine, and a draining chamber is provided on one side of each cleaning chamber. Second guide rails are fixedly connected to both sides of the middle part of each cleaning chamber, and the second guide rails are fixedly connected to the main body of the cleaning machine. The second guide rails are perpendicular to the first guide rails.

[0011] Preferably, the adjusting assembly includes a metering groove, which is formed inside a metering block. A threaded rod is movably sleeved inside the metering block. One end of the threaded rod is fixedly connected to a rotating rod. A meshing block is threadedly connected to the outside of the threaded rod. A sealing piston is fixedly connected to the outside of the meshing block. The sealing piston is movably sleeved inside the metering groove.

[0012] Preferably, the metering component includes a fixing block, which is fixedly connected to one side of the main body of the cleaning machine. A first guide pipe is fixedly connected inside the fixing block. The first guide pipe is fixedly connected to the metering block and is connected to the metering tank so that liquids such as chemical solutions can be introduced into the interior of the metering tank through the first guide pipe.

[0013] Preferably, the quantitative component includes multiple sets of floats, each set of floats being disposed on both sides of a threaded rod. A Y-shaped connecting rod is fixedly connected to the bottom of each float, and the Y-shaped connecting rod is movably sleeved with a quantitative block. An L-shaped connecting rod is fixedly connected to the bottom of the Y-shaped connecting rod, and a first connecting post is fixedly connected to the bottom of the L-shaped connecting rod. A hinge block is fixedly connected to the bottom of the first connecting post. One end of a second connecting post is fixedly connected to one side of the hinge block, and a third connecting post is hinged to the other end of the second connecting post. The bottom of the third connecting post is fixedly connected to one end of a spring, and the other end of the spring is fixedly connected to the main body of the washing machine. A flow-blocking plate is movably hinged inside the second guide tube, and one end of the third connecting post abuts against the bottom of the flow-blocking plate. The diameter of the flow-blocking plate is smaller than the diameter of the second guide tube, and a sealing soft rubber sleeve is fixedly sleeved on the outside of the flow-blocking plate.

[0014] Preferably, the quantitative component further includes a connecting block, which is fixedly connected to one side of the second guide tube. A pressure sensing block is fixedly connected to one side of the bottom of the connecting block. The width of the connecting block is equal to that of the L-shaped connecting rod. The connecting block and the L-shaped connecting rod are arranged on the same axis. The third connecting column is movably sleeved inside the second guide tube. A second control valve is fixedly connected inside both the second guide tube and the first guide tube. The second control valve inside the second guide tube is electrically connected to the pressure sensing block.

[0015] Preferably, the conveying assembly includes a partition plate, which is fixedly connected to the interior of the mixing chamber. A pump body is provided on one side of the partition plate and is fixedly connected to the mixing chamber. A third guide pipe is fixedly connected to the output ends on both sides of the top of the pump body. The third guide pipe connects the cleaning chamber and the mixing chamber to each other. A water suction pipe is fixedly connected to one side of the pump body.

[0016] Preferably, the circulation component includes a fourth guide pipe fixedly connected to one side of the mixing chamber. The fourth guide pipe is fixedly connected to the inside of the main body of the cleaning machine. The fourth guide pipe connects the mixing chamber and the first water outlet chamber, allowing water to flow from the mixing chamber to the inside of the first water outlet chamber through the fourth guide pipe. One set of the cleaning chamber and the draining chamber each have a guide groove at the bottom. A first control valve is fixedly connected inside the guide groove. The bottom of the other set of the cleaning chamber and the draining chamber is fixedly connected to a fifth guide pipe. The fifth guide pipe connects the other set of the cleaning chamber and the draining chamber to the second water outlet chamber.

[0017] Preferably, the width of the support plate is smaller than the width of the drain compartment. When the semiconductor wafer inside the placement frame is removed after cleaning, the residual liquid can flow better into the interior of the drain compartment for collection, thus avoiding unnecessary corrosion.

[0018] Preferably, the first and second water outlet chambers are symmetrically arranged, and the liquid can be better recovered and discharged through different flow channels.

[0019] The beneficial effects of this invention are as follows:

[0020] This invention utilizes a rotating rod to drive a meshing slider to precisely displace along the inner wall of a metering tank, thereby compressing the internal space of the metering tank via a sealing piston. This allows for precise adjustment of the tank's space. Simultaneously, the chemical raw material required for synthesizing the cleaning solution is supplied to the metering tank through a first guide pipe. As the liquid level rises, the float rises due to buoyancy, sequentially linking the Y-shaped and L-shaped connecting rods. When the liquid level reaches a preset scale line, the float reaches its highest point, causing the inclined edge of the L-shaped connecting rod to precisely contact the pressure sensing unit. This, in turn, controls the opening of the second control valve via the pressure sensing block. Under the pressure differential, the precisely proportioned liquid in the metering tank is smoothly injected into the mixing chamber through the second guide pipe, achieving efficient homogenization and mixing of different components. Furthermore, the metering setting avoids inaccurate flow ratios. This mechanical metering method is unaffected by fluid pressure fluctuations and is more stable than methods relying solely on flow meters or pumps.

[0021] After the second control valve is opened, the flowing liquid impacts the baffle plate, driving it to rotate at the hinge point with the second guide tube. As the baffle plate rotates, its lower end presses down on the third connecting column, which in turn generates an upward reaction force on the second connecting column through mechanical linkage. This ingenious mechanical design creates a dynamic balance system. Even if the float loses buoyancy and descends due to the liquid level drop, the continuous impact force of the liquid flow on the baffle plate can still maintain the valve open state through the transmission chain of the third and second connecting columns, effectively preventing sudden shutdown caused by instantaneous liquid level fluctuations. This purely mechanical linkage mechanism not only avoids the defects of electronic sensors being easily interfered with by foam or impurities, but also realizes contactless switch control, significantly improving the operational stability and service life of the equipment, and ensuring that the cleaning liquid ratio remains accurate and stable at all times.

[0022] This invention involves introducing liquid into the mixing chamber through a first guide pipe for mixing. After mixing, the mixed cleaning solution is guided into the cleaning chamber through a pump and a third guide pipe to clean the semiconductor components. After cleaning, the control system opens the first control valve according to the control panel instructions, guiding the waste liquid into the dedicated collection frames of the first and second outlet chambers. The recovered liquid that meets the standards can be reinjected into the pretreatment unit to form a closed loop, significantly improving resource utilization. At the same time, when it is necessary to clean the inside of the cleaning machine body, clean water can be introduced into the cleaning machine body through the first guide pipe. Because of its unidirectional circulation system, the cleaning solution can avoid reciprocating flow in the supply system, thus completely avoiding the common problem of stagnant water in the system, avoiding secondary pollution caused by microbial growth, and ensuring long-term stable operation of the system. Attached Figure Description

[0023] The accompanying drawings, which form part of this specification, illustrate embodiments disclosed in this application and, together with the specification, serve to explain the principles of this application in a clear and understandable manner.

[0024] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein:

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the overall side structure of the present invention;

[0027] Figure 3 This is a schematic diagram of the internal structure of the main body of the cleaning machine of the present invention;

[0028] Figure 4 This is a cross-sectional view of the main body of the cleaning machine of the present invention;

[0029] Figure 5 For the present invention Figure 4Enlarged view of the structure at point A in the middle;

[0030] Figure 6 This is a schematic diagram of the structure of the quantitative block of the present invention;

[0031] Figure 7 This is a schematic diagram of the meshing block of the present invention;

[0032] Figure 8 This is a schematic diagram of the structure of the float of the present invention;

[0033] Figure 9 This is a schematic diagram of the internal structure of the second guide tube of the present invention;

[0034] Figure 10 This is a schematic diagram of the internal structure of the mixing chamber of the present invention.

[0035] The components include: 1. Cleaning machine body; 2. Control panel; 3. Observation window; 5. Mounting slot; 6. Support plate; 7. Placement frame; 8. First guide rail; 9. Second guide rail; 10. Cleaning chamber; 11. Drainage chamber; 12. Metering block; 13. Metering trough; 14. Threaded rod; 15. Rotating rod; 16. Engaging block; 17. Sealing piston; 18. Fixing block; 19. First guide pipe; 20. Second guide pipe; 21. Mixing chamber; 22. Float; 23. Y-shaped connecting rod; 4. L-shaped connecting rod; 25. First connecting column; 26. Hinge block; 27. Second connecting column; 28. Third connecting column; 29. ​​Spring; 30. Connecting block; 31. Pressure sensing block; 32. Divider plate; 33. Pump body; 34. Third guide pipe; 35. Suction pipe; 36. Fourth guide pipe; 37. First outlet chamber; 38. Guide channel; 39. First control valve; 40. Fifth guide pipe; 41. Second outlet chamber; 42. Baffle plate; 43. Second control valve. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0037] Please see Figure 1-10 This invention provides a chemical quantitative supply device for semiconductor cleaning equipment, including a cleaning machine body 1, a control panel 2 fixedly connected to one side of the cleaning machine body 1, an observation window 3 provided on one side of the control panel 2, the observation window 3 being movably fitted inside the cleaning machine body 1, an installation groove 5 being provided inside the cleaning machine body 1, and a moving component being provided inside the installation groove 5.

[0038] A metering block 12 is fixedly connected inside the main body 1 of the cleaning machine, and an adjustment component is provided inside the metering block 12;

[0039] The bottom of the metering block 12 is fixedly connected to a second guide tube 20, and a metering component is provided on one side of the second guide tube 20;

[0040] A mixing chamber 21 is fixedly connected inside the main body 1 of the cleaning machine, and a conveying component is installed inside the mixing chamber 21;

[0041] The main body 1 of the cleaning machine is equipped with a circulation component.

[0042] The movable component includes a support plate 6, with placement frames 7 fixedly connected to both sides of the top of the support plate 6, and first guide rails 8 fixedly connected to both sides of the support plate 6. The first guide rails 8 are fixedly connected to the main body 1 of the cleaning machine, and the support plate 6 is slidably connected to the inside of the first guide rails 8. Cleaning chambers 10 are opened on both sides inside the main body 1 of the cleaning machine, and a draining chamber 11 is opened on one side of the cleaning chamber 10. Second guide rails 9 are fixedly connected to both sides of the middle part of the cleaning chamber 10. The second guide rails 9 are fixedly connected to the main body 1 of the cleaning machine, and the second guide rails 9 are perpendicular to the first guide rails 8.

[0043] The placement frame 7, in which semiconductor components have been placed, is moved into the cleaning chamber 10 via the first guide rail 8 and the second guide rail 9. It is then immersed in the prepared cleaning solution for cleaning. After cleaning, the support plate 6 returns to its original position via the first guide rail 8 and the second guide rail 9. At this time, the remaining cleaning solution falls into the drain chamber 11, thereby collecting the remaining cleaning solution.

[0044] The adjusting component includes a metering groove 13, which is opened inside the metering block 12. A threaded rod 14 is movably sleeved inside the metering block 12. A rotating rod 15 is fixedly connected to one end of the threaded rod 14. A meshing block 16 is threadedly connected to the outside of the threaded rod 14. A sealing piston 17 is fixedly connected to the outside of the meshing block 16. The sealing piston 17 is movably sleeved inside the metering groove 13.

[0045] By rotating the rotating rod 15, the meshing block 16 that meshes with it is driven to move precisely along the inner wall of the metering groove 13, thereby compressing the internal space of the metering groove 13 by the sealing piston 17, so as to achieve precise adjustment of the groove space of the metering groove 13.

[0046] The metering component includes a fixed block 18, which is fixedly connected to one side of the main body 1 of the cleaning machine. A first guide pipe 19 is fixedly connected inside the fixed block 18. The first guide pipe 19 is fixedly connected to the metering block 12 and is connected to the metering tank 13, allowing liquids such as chemical solutions to be introduced into the metering tank 13 through the first guide pipe 19. The metering component also includes multiple sets of floats 22, which are all located on both sides of a threaded rod 14. A Y-shaped connecting rod 23 is fixedly connected to the bottom of each float 22. The Y-shaped connecting rod 23 is movably sleeved with the metering block 12. An L-shaped connecting rod 24 is fixedly connected to the bottom of the Y-shaped connecting rod 23. A first connecting post 25 is fixedly connected to the bottom of the L-shaped connecting rod 24. A hinge block 26 is fixedly connected to the bottom of the first connecting post 25. One end of a second connecting post 27 is fixedly connected to one side of the hinge block 26, and a third connecting post 28 is hinged to the other end of the second connecting post 27. The bottom of the connecting column 28 is fixedly connected to one end of the spring 29, and the other end of the spring 29 is fixedly connected to the main body 1 of the cleaning machine. The second guide tube 20 is movably hinged with a baffle plate 42. One end of the third connecting column 28 abuts against the bottom of the baffle plate 42. The diameter of the baffle plate 42 is smaller than the diameter of the second guide tube 20. A sealing soft rubber sleeve is fixedly sleeved on the outside of the baffle plate 42. The metering component also includes a connecting block 30. The connecting block 30 is fixedly connected to one side of the second guide tube 20. A pressure sensing block 31 is fixedly connected to one side of the bottom of the connecting block 30. The width of the connecting block 30 is equal to that of the L-shaped connecting rod 24. The connecting block 30 and the L-shaped connecting rod 24 are set on the same axis. The third connecting column 28 is movably sleeved inside the second guide tube 20. The second control valve 43 is fixedly connected inside both the second guide tube 20 and the first guide tube 19. The second control valve 43 inside the second guide tube 20 is electrically connected to the pressure sensing block 31.

[0047] By rotating the rotating rod 15, the slider engaged with it is driven to move precisely along the inner wall of the metering tank 13, thereby compressing the internal space of the metering tank 13 by the sealing piston 17, so as to achieve precise adjustment of the tank space of the metering tank 13. At the same time, the chemical raw material required for the synthetic cleaning liquid is supplied to the metering tank 13 through the first guide pipe 19. As the liquid level rises, the float 22 rises continuously under the action of liquid buoyancy. During the rise, the Y-shaped connecting rod 23 and the L-shaped connecting rod 24 move synchronously in sequence. When the liquid level reaches the preset scale line, the float 22 rises to the highest point, so that the inclined edge of the L-shaped connecting rod 24 makes precise contact with the pressure sensing unit. Thus, the pressure sensing block 31 controls the second control valve 43 to open. Under the action of pressure difference, the precisely proportioned liquid in the metering tank 13 is smoothly injected into the mixing chamber 21 through the second guide pipe 20 to complete the efficient homogenization and mixing of different components. At the same time, the quantitative setting can avoid the inaccuracy of the flow ratio. This mechanical metering method is not affected by fluid pressure fluctuations and is more stable than the method of simply relying on flow meters or pumps.

[0048] The conveying assembly includes a partition plate 32, which is fixedly connected to the inside of the mixing chamber 21. A pump body 33 is provided on one side of the partition plate 32 and is fixedly connected to the mixing chamber 21. A third guide pipe 34 is fixedly connected to the output ends on both sides of the top of the pump body 33. The third guide pipe 34 connects the cleaning chamber 10 and the mixing chamber 21. A water suction pipe 35 is fixedly connected to one side of the pump body 33.

[0049] The pump body 33 is activated to introduce the mixed cleaning solution into the first water outlet chamber 37 through the suction pipe 35 and the third guide pipe 34 to complete the preparation work. At this time, the placement frame 7, on which the semiconductor components have been placed, is moved into the cleaning chamber 10 through the first guide rail 8 and the second guide rail 9. It is then immersed in the prepared cleaning solution for cleaning. After cleaning, the support plate 6 returns to its position through the first guide rail 8 and the second guide rail 9. At this time, the remaining cleaning solution will fall into the drain chamber 11 for collection.

[0050] The circulation component includes a fourth guide pipe 36 fixedly connected to one side of the mixing chamber 21. The fourth guide pipe 36 is fixedly connected to the inside of the main body 1 of the cleaning machine. The fourth guide pipe 36 connects the mixing chamber 21 and the first water outlet chamber 37 to each other, so that water can flow from the mixing chamber 21 to the inside of the first water outlet chamber 37 through the fourth guide pipe 36. The bottom of one set of cleaning chambers 10 and draining chambers 11 is provided with a guide groove 38. The inside of the guide groove 38 is fixedly connected to a first control valve 39. The bottom of another set of cleaning chambers 10 and draining chambers 11 is fixedly connected to a fifth guide pipe 40. The fifth guide pipe 40 connects the other set of cleaning chambers 10 and draining chambers 11 to the second water outlet chamber 41.

[0051] This invention introduces liquid into the mixing chamber 21 through the first guide pipe 19 for mixing. After mixing, the mixed cleaning liquid is guided into the cleaning chamber 10 through the pump body 33 and the third guide pipe 34 to complete the cleaning of semiconductor components. After cleaning, the control system opens the first control valve 39 according to the instructions of the control panel 2, guiding the waste liquid to flow into the dedicated collection frame of the first outlet chamber 37 and the second outlet chamber 41 in an orderly manner. The recovered liquid that meets the standards can be reinjected into the pretreatment unit to form a closed loop, which significantly improves the resource utilization rate. At the same time, when it is necessary to clean the inside of the cleaning machine body 1, clean water can be introduced into the cleaning machine body 1 through the first guide pipe 19. Since its one-way circulation system can avoid the cleaning liquid from flowing back and forth in the supply system, it can completely avoid the common problem of dead water stagnation in the system, avoid secondary pollution caused by microbial growth, and ensure the long-term stable operation of the system.

[0052] The width of the support plate 6 is smaller than the width of the drain bin 11. When the semiconductor wafer inside the placement frame 7 is removed after cleaning, the residual liquid can flow better into the interior of the drain bin 11 for collection, thus avoiding unnecessary corrosion.

[0053] The first water outlet chamber 37 and the second water outlet chamber 41 are symmetrically arranged, and the liquid can be better recovered and discharged through different guide channels.

[0054] Working principle:

[0055] During operation, rotating the rotating rod 15 drives the meshing block 16, which meshes with it, to precisely move along the inner wall of the metering tank 13. This compresses the internal space of the metering tank 13 by the sealing piston 17, thereby achieving precise adjustment of the tank space. Simultaneously, the chemical raw material required for the synthetic cleaning solution is supplied to the metering tank 13 through the first guide pipe 19. As the liquid level rises, the float 22 rises continuously under the buoyancy of the liquid. During the rise, the Y-shaped connecting rod 23 and the L-shaped connecting rod 24 move synchronously in sequence. When the liquid level reaches the preset scale line, the float 22 rises to the highest point, causing the inclined edge of the L-shaped connecting rod 24 to precisely contact the pressure sensing block 31. The pressure sensing block 31 then controls the second control valve 43 to open. Under the action of pressure difference, the precisely proportioned liquid in the metering tank 13 is smoothly injected into the mixing chamber 21 through the second guide pipe 20, completing the efficient homogenization and mixing of different components. At the same time, the metering setting can avoid inaccurate flow ratio. This mechanical metering method is unaffected by fluid pressure fluctuations and is more stable than methods that rely solely on flow meters or pumps. Simultaneously, when the second control valve 43 opens, the flowing liquid impacts the baffle plate 42, driving its hinge point with the second guide pipe 20 to rotate. As the baffle plate 42 rotates, its lower end simultaneously presses down on the third connecting column 28, which in turn generates an upward reaction force on the second connecting column 27 through mechanical linkage. This ingenious mechanical design constructs a dynamic balance system. Even when the float 22 loses buoyancy and descends due to liquid level drop, the continuous liquid flow impact force borne by the baffle plate 42 can still maintain the valve's open state through the transmission chain of the third connecting column 28 and the second connecting column 27, effectively preventing sudden shut-off caused by instantaneous liquid level fluctuations. This purely mechanical linkage mechanism not only avoids the defects of electronic sensors being susceptible to foam or impurities but also achieves contactless switch control, significantly improving the equipment's operational stability and service life, ensuring that the cleaning fluid ratio remains accurate and stable at all times.

[0056] After mixing, the pump body 33 is activated to introduce the mixed cleaning solution into the first water outlet chamber 37 through the suction pipe 35 and the third guide pipe 34 to complete the preparation work. At this time, the placement frame 7, on which the semiconductor components have been placed, is moved into the cleaning chamber 10 through the first guide rail 8 and the second guide rail 9. It is then immersed in the prepared cleaning solution for cleaning. After cleaning, the support plate 6 returns to its position through the first guide rail 8 and the second guide rail 9. At this time, the remaining cleaning solution will fall into the drain chamber 11 to collect the remaining cleaning solution. The work is then completed.

[0057] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A semiconductor cleaning apparatus chemical dosing device comprising a cleaning machine main body (1), characterized by, A control panel (2) is fixedly connected to one side of the main body (1) of the cleaning machine. An observation window (3) is provided on one side of the control panel (2). The observation window (3) is movably fitted inside the main body (1) of the cleaning machine. An installation groove (5) is provided inside the main body (1) of the cleaning machine. A moving component is provided inside the installation groove (5). A metering block (12) is fixedly connected inside the main body (1) of the cleaning machine, and an adjustment component is provided inside the metering block (12); The bottom of the quantitative block (12) is fixedly connected to a second guide tube (20), and a quantitative component is provided on one side of the second guide tube (20); The main body (1) of the cleaning machine is fixedly connected to a mixing chamber (21), and a conveying assembly is provided inside the mixing chamber (21); The main body (1) of the cleaning machine is equipped with a circulation component; The moving component includes a support plate (6), with placement frames (7) fixedly connected to both sides of the top of the support plate (6), and first guide rails (8) fixedly connected to both sides of the support plate (6). The first guide rails (8) are fixedly connected to the main body of the cleaning machine (1). The support plate (6) is slidably connected to the inside of the first guide rails (8). Cleaning chambers (10) are opened on both sides inside the main body of the cleaning machine (1). A draining chamber (11) is opened on one side of the cleaning chamber (10). Second guide rails (9) are fixedly connected to both sides of the middle part of the cleaning chamber (10). The second guide rails (9) are fixedly connected to the main body of the cleaning machine (1). The second guide rails (9) are perpendicular to the first guide rails (8). The adjustment assembly includes a metering groove (13), which is located inside a metering block (12). A threaded rod (14) is movably sleeved inside the metering block (12). A rotating rod (15) is fixedly connected to one end of the threaded rod (14). A meshing block (16) is threadedly connected to the outside of the threaded rod (14). A sealing piston (17) is fixedly connected to the outside of the meshing block (16). The sealing piston (17) is movably sleeved inside the metering groove (13). The metering component includes a fixing block (18), which is fixedly connected to one side of the main body (1) of the cleaning machine. A first guide pipe (19) is fixedly connected inside the fixing block (18). The first guide pipe (19) is fixedly connected to the metering block (12). The first guide pipe (19) is connected to the metering tank (13) so that liquids such as chemical solutions can be introduced into the interior of the metering tank (13) through the first guide pipe (19). The metering component includes multiple sets of floats (22), each set of floats (22) being disposed on both sides of the threaded rod (14). A Y-shaped connecting rod (23) is fixedly connected to the bottom of each float (22), and the Y-shaped connecting rod (23) is movably sleeved with the metering block (12). An L-shaped connecting rod (24) is fixedly connected to the bottom of the Y-shaped connecting rod (23), and a first connecting post (25) is fixedly connected to the bottom of the L-shaped connecting rod (24). A hinge block (26) is fixedly connected to the bottom of the first connecting post (25), and a second connecting post (26) is fixedly connected to one side of the hinge block (26). One end of the column (27) is hinged to the other end of the second connecting column (27) and a third connecting column (28). The bottom of the third connecting column (28) is fixedly connected to one end of the spring (29). The other end of the spring (29) is fixedly connected to the main body (1) of the cleaning machine. A baffle plate (42) is movably hinged inside the second guide tube (20). One end of the third connecting column (28) abuts against the bottom of the baffle plate (42). The diameter of the baffle plate (42) is smaller than the diameter of the second guide tube (20). A sealing soft rubber sleeve is fixedly sleeved on the outside of the baffle plate (42). The quantitative component also includes a connecting block (30), which is fixedly connected to one side of the second guide tube (20). A pressure sensing block (31) is fixedly connected to one side of the bottom of the connecting block (30). The width of the connecting block (30) is equal to that of the L-shaped connecting rod (24). The connecting block (30) and the L-shaped connecting rod (24) are arranged on the same axis. The third connecting column (28) is movably sleeved inside the second guide tube (20). A second control valve (43) is fixedly connected inside both the second guide tube (20) and the first guide tube (19). The second control valve (43) inside the second guide tube (20) is electrically connected to the pressure sensing block (31).

2. The chemical dosing device for a semiconductor cleaning apparatus according to claim 1, wherein The conveying assembly includes a partition plate (32), which is fixedly connected to the interior of the mixing chamber (21). A pump body (33) is provided on one side of the partition plate (32), which is fixedly connected to the mixing chamber (21). A third guide pipe (34) is fixedly connected to the output ends on both sides of the top of the pump body (33). The third guide pipe (34) connects the cleaning chamber (10) and the mixing chamber (21) to each other. A suction pipe (35) is fixedly connected to one side of the pump body (33).

3. The chemical dosing device for a semiconductor cleaning apparatus according to claim 2, wherein The circulation component includes a fourth guide pipe (36) fixedly connected to one side of the mixing chamber (21). The fourth guide pipe (36) is fixedly connected to the inside of the main body (1) of the cleaning machine. The fourth guide pipe (36) connects the mixing chamber (21) and the first outlet chamber (37) so that water can flow from the mixing chamber (21) to the inside of the first outlet chamber (37) through the fourth guide pipe (36). The bottom of one set of cleaning chambers (10) and draining chambers (11) is provided with a guide groove (38). The inside of the guide groove (38) is fixedly connected to a first control valve (39). The bottom of another set of cleaning chambers (10) and draining chambers (11) is fixedly connected to a fifth guide pipe (40). The fifth guide pipe (40) connects the other set of cleaning chambers (10) and draining chambers (11) to the second outlet chamber (41).

4. The chemical dosing device for a semiconductor cleaning apparatus according to claim 3, wherein The width of the support plate (6) is smaller than the groove width of the drain chamber (11). When the semiconductor wafer inside the placement frame (7) is removed after cleaning, the residual liquid can flow into the interior of the drain chamber (11) to collect it and avoid unnecessary corrosion.

5. A chemical metering device for semiconductor cleaning equipment according to claim 4, characterized in that, The first water outlet chamber (37) and the second water outlet chamber (41) are symmetrically arranged. Through different flow channels, the liquid can be better recycled and discharged.

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